RENESAS RX200, RX23W User Manual

All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.renesas.com).

Cover

Bluetooth Low Energy Protocol Stack Basic Package

User’s Manual

Rev.1.03 Mar 2021

RENESAS MCU RX Family / RX200 Series / RX23W Group

User’ s Manual

www.renesas.com

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

4. You shall be responsible for determining what licenses are required from any third parties, and obtaining such licenses for the lawful import, export, manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required.

5. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home

electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key

financial terminal systems; safety control equipment; etc. Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but not limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESAS ELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USING RENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE, HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLA IMS ANY AND ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENT PERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITH RESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.

8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

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14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled

subsidiaries.

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(Rev.5.0-1 October 2020)

Corporate Headquarters

Contact information

TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan

www.renesas.com

For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit:

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Trademarks

Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation.

The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Renesas Electronics Corporation is under license. All trademarks and registered trademarks are the property of their respective owners.

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD) A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps

must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of

register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level at which resetting is specified.

3. Input of signal during power-off state Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O

pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are

generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible.

5. Clock signals After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program

execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.)

and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7. Prohibition of access to reserved addresses Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these

addresses as the correct operation of the LSI is not guaranteed.

8. Differences between products Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.

The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

How to Use This Manual

1. Purpose and Target Readers

This manual is designed to provide the user with an understanding of the usages and the provided functions of the Bluetooth® Low Energy protocol stack. It is intended for users designing applications incorporating the software. A basic knowledge of MCUs and software development environment and Bluetooth® Low Energy is necessary in order to use this manual.

The manual comprises an overview of the product; how to install, how to build and the usage of the provided functions.

Particular attention should be paid to the precautionary notes when using the manual. These notes occur within the body of the text and at the end of each section.

The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the text of the manual for details.

The following documents apply to the RX23W Group. Make sure to refer to the latest versions of these documents. The newest versions of the documents listed may be obtained from the Renesas Electronics Web site.

Document Type

Description

Document Title

Document No.

Data Sheet

Hardware overview and electrical characteristics

RX23W Group Datasheet

R01DS0342EJ

User’s manual for Hardware

Hardware specifications (pin assignments, memory maps, peripheral specifications, electrical characteristics, and timing charts) and descriptions of operation

RX23W Group User’s Manual: Hardware

R01UH0823EJ

User’s manual for Software

Detailed descriptions of the CPU and instruction set

RX Family RXv2 Instruction Set Architecture User’s Manual: Software

R01US0071EJ

User’s manual for

Middleware

Overview of the product, how to install, how to build and usage of the provided function

Bluetooth Low Energy Protocol Stack Basic Package User's Manual

This User’s

manual

Application Note

Notes on Printed Circuit Board Patterns

RX Family Hardware Design Guide

R01AN1411EJ

RX23W Group Tuning procedure of Bluetooth dedicated clock frequency

R01AN4762EJ

Examples of applications and sample programs

RX23W Group BLE Module Firmware Integration Technology

R01AN4860EJ

RX23W Group Bluetooth Low Energy Profile Developer’s Guide

R01AN4553EJ

RX23W Group Bluetooth Low Energy Application Developer’s Guide

R01AN5504EJ Renesas Technical Update

Product specifications, updates on documents, etc.

—

2. List of Abbreviations and Acronyms

Abbreviation

Full Form

API

Application Programming Interface

ATT

Attribute Protocol

Bluetooth Device

BD_ADDR

Bluetooth Device Address

BLE

Bluetooth Low Energy

BSP

Board Support Package

BTTS

Bluetooth Test Tool Suite

CLI

Command Line Interface

CMT

Compare Match Timer

CSRK

Connection Signature Resolving Key

DFU

Device Firmware Update

ECDH

Elliptic curve Diffie–Hellman key exchange

EDIV

Encrypted Diversifier

FIT

Firmware Integration Technology

GAP

Generic Access Profile

GATT

Generic Attribute Profile

HCI

Host Controller Interface

L2CAP

Logical Link Control and Adaptation Protocol

IRK

Identity Resolving Key

Low Energy

Link Layer

LTK

Long Term Key

MCU

Micro Controller Unit

MITM

Man-in-the-middle

OOB

Out of Band

Operating System

OTA

Over The Air

PHY

Physical layer

Quick and Effective tool solution

Radio Frequency

RFP

Renesas Flash Programmer

RPA

Resolvable Private Address

RSK

Renesas Starter Kit

RSSI

Received Signal Strength Indication

RSSK

Renesas Solution Starter Kit

Abbreviation

Full Form

Smart Configurator

SCI

Serial Communication Interface

Security Manager

SMP

Security Manager Protocol

STK

Short Term Key

Target Board

Temporary Key

UART

Universal Asynchronous Receiver Transmitter

USB

Universal Serial Bus

UUID

Universal Unique Identifier

Vendor Specific

WDT

Watchdog Timer

1. Overview ............................................................................................................................ 1

1.1 Features ..................................................................................................................................................... 1

1.2 Specifications ............................................................................................................................................. 2

2. Installation ......................................................................................................................... 3

2.1 Package Contents ...................................................................................................................................... 3

2.2 Project Configuration ................................................................................................................................. 5

2.3 Build Environment ...................................................................................................................................... 6

2.4 Install .......................................................................................................................................................... 7

2.4.1 BLE FIT Module ............................................................................................................................... 7

2.4.2 Demo projects .................................................................................................................................. 7

3. Software Structure ............................................................................................................. 8

3.1 BLE Protocol Stack .................................................................................................................................... 9

3.1.1 BLE Protocol Stack structure ........................................................................................................... 9

3.1.2 BLE Protocol Stack library ............................................................................................................. 12

3.2 app_lib...................................................................................................................................................... 15

3.2.1 Abstraction API............................................................................................................................... 15

3.2.2 Software Timer ............................................................................................................................... 15

3.2.3 Security Data Management ............................................................................................................ 15

3.2.4 Profile Common.............................................................................................................................. 16

3.2.5 Logger ............................................................................................................................................ 16

3.2.6 Command line ................................................................................................................................ 16

3.2.7 LED and Switch Control ................................................................................................................. 16

3.2.8 BLE Task Control ........................................................................................................................... 16

4. Software Setting .............................................................................................................. 17

4.1 Configuration options ............................................................................................................................... 17

4.2 Sections ................................................................................................................................................... 25

4.2.1 Linker settings for application project ............................................................................................. 26

4.3 Bluetooth Device Address........................................................................................................................ 29

4.4 Bluetooth Device Name ........................................................................................................................... 29

4.4.1 Inform by Advertising packet .......................................................................................................... 29

4.4.2 Inform by Device Name Characteristic .......................................................................................... 31

5. Original Features ............................................................................................................. 32

5.1 Command Line Interface.......................................................................................................................... 32

5.1.1 GAP command ............................................................................................................................... 34

5.1.2 Vendor Specific (VS) command ..................................................................................................... 47

5.1.3 SYS command ............................................................................................................................... 52

5.1.4 BLE command ................................................................................................................................ 53

5.2 Security Data Management ..................................................................................................................... 54

5.2.1 Security data management information ......................................................................................... 55

5.2.2 Local device security data .............................................................................................................. 56

5.2.3 Remote device security data .......................................................................................................... 58

5.3 RF communication timing notification ...................................................................................................... 60

5.3.1 Connection event notification timing .............................................................................................. 61

5.3.2 Advertising event notification timing ............................................................................................... 62

5.3.3 Scan / Initiator event notification timing ......................................................................................... 62

5.3.4 RF sleep mode event notification timing ........................................................................................ 63

5.3.5 RF communication timing notification specifications ..................................................................... 64

5.4 Device-specific Data Management .......................................................................................................... 65

5.4.1 Specifying Device-specific data location block .............................................................................. 65

5.4.2 Device-specific data format ............................................................................................................ 66

5.4.3 Writing to user area (ROM) ............................................................................................................ 66

5.4.4 Writing to data area (E2 DataFlash) .............................................................................................. 67

5.4.5 RX23W flash memory protection function ...................................................................................... 69

5.4.6 BD address adoption flow .............................................................................................................. 70

6. HCI Mode ........................................................................................................................ 71

6.1 Software Structure ................................................................................................................................... 71

6.2 Demo Project ........................................................................................................................................... 72

6.2.1 Change device type of project ........................................................................................................ 74

6.3 UART Driver ............................................................................................................................................. 78

6.3.1 Configuration Options of UART Driver ........................................................................................... 78

7. Appendix .......................................................................................................................... 80

7.1 Firmware writing procedure for Target Board for RX23W (retaining device-specific data) ..................... 80

R01UW0205EJ0103 Rev.1.03 Page 1 of 85 Mar.30.2021

1. Overview

1.1 Features

The Bluetooth® Low Energy Protocol Stack Basic Package includes the BLE FIT module for RX23W group compliant with Bluetooth Core Specification version 5.0 and fundamental software for developing Bluetooth Low Energy application.

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1.2 Specifications

Table 1.1 shows the specifications of the software provided by the Bluetooth Low Energy Protocol Stack Basic Package.

Table 1.1. Specifications

Item

Description

BLE FIT module

The BLE FIT module for RX23W group provides the following BLE features by R_BLE API. <Feature of Bluetooth 5.0>

• LE 2M PHY

• LE Coded PHY

• LE Advertising Extensions

• LE Channel Selection Algorithm #2

• High Duty Cycle Non-Connectable Advertising

• LE Secure Connections

• Link Layer Privacy

• LE Data Packet Length Extension

• Link Layer Extended Scanner Filter Policies

• LE L2CAP Connection Oriented Channel Support

• Low Duty Cycle Directed Advertising

• 32-bit UUID Support in LE

• LE Link Layer Topology

• LE Ping

The following features for BLE Application are provided. [app_lib]

• Abstraction API

• Software Timer

• Security Data Management

• Profile Common

• Logger

• Command line

• LED and Switch Control

• BLE Task Control

[BLE Protocol Stack]

• RF communication timing notification

• Device-specific Data Management

Demo projects

The following projects are provided as sample applications for BLE initial operation check.

• Custom profile GATT server application

• Custom profile GATT client application

• HCI mode

Utility

The following tools (Windows applications) are provided for HCI mode.

• Public BD address writing tool for HCI mode (BDAddrWriter)

• Operation tool for calibration for HCI mode (CLVALTune)

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2. Installation

2.1 Package Contents

The Bluetooth Low Energy Protocol Stack Basic Package is available from the Renesas RX23W FIT module Web page (https://www.renesas.com/products/software-tools/software-os-middleware-driver/software-

package/fit-rx23w.html) or “RX23W Group BLE Module Firmware Integration Technology Application Note” on

e2studio Smart Browser. If you want to download only the BLE FIT module, see “2.4 Install”.

Figure 2.1. e2studio Smart Browser

Bluetooth Low Energy Protocol Stack Basic Package User's Manual 2. Installation

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Table 2.1 shows the contents of the Bluetooth Low Energy Protocol Stack Basic Package.

Table 2.1. Contents of the Bluetooth Low Energy Protocol Stack Basic Package

r01an4860xxXXXX-rx23w-ble-fit.zip

XXXX: Revision number

FITDemos\

Sample application folder

ble_demo_rsskrx23w_profile_client.zip

GATT client project for RSSK RX23W

ble_demo_rsskrx23w_profile_server.zip

GATT server project for RSSK RX23W

ble_demo_rsskrx23w_uart_hci.zip

HCI mode project for RSSK RX23W

ble_demo_tbrx23w_FreeRTOS_multi_services.zip

FreeRTOS GATT server project for Target Board for RX23W

ble_demo_tbrx23w_profile_client.zip

GATT client project for Target Board for RX23W

ble_demo_tbrx23w_profile_server.zip

GATT server project for Target Board for RX23W

ble_demo_tbrx23w_uart_hci.zip

HCI mode project for Target Board for RX23W

ble_demo_tbrx23wmodule_profile_client.zip

GATT client project for Target Board for RX23W module

ble_demo_tbrx23wmodule_profile_server.zip

GATT server project for Target Board for RX23W module

ble_demo_tbrx23wmodule_uart_hci.zip

HCI mode project for Target Board for RX23W module

ROM_Files\

Mot files

ble_demo_rsskrx23w_profile_client.mot

GATT client project mot file for RSSK RX23W

ble_demo_rsskrx23w_profile_server.mot

GATT server project mot file for RSSK RX23W

ble_demo_rsskrx23w_uart_hci.mot

HCI mode project mot file for RSSK RX23W

ble_demo_tbrx23w_FreeRTOS_multi_services.mot

FreeRTOS GATT server project mot file for Target Board for RX23W

ble_demo_tbrx23w_profile_client.mot

GATT client project mot file for Target Board for RX23W

ble_demo_tbrx23w_profile_server.mot

GATT server project mot file for Target Board for RX23W

ble_demo_tbrx23w_uart_hci.mot

HCI mode project mot file for Target Board for RX23W

ble_demo_tbrx23wmodule_profile_client.mot

GATT client project mot file for Target Board for RX23W module

ble_demo_tbrx23wmodule_profile_server.mot

GATT server project mot file for Target Board for RX23W module

ble_demo_tbrx23wmodule_uart_hci.mot

HCI mode project mot file for Target Board for RX23W module

FITModules\

FIT module folder

r_ble_rx23w_vX.XX.xml

BLE FIT module xml file

r_ble_rx23w_vX.XX.zip

BLE FIT module body package

r_ble_rx23w_vX.XX_extend.mdf

BLE FIT module mdf file

utilities\

Utility folder

BDAddrWriter.zip

Public BD address writing tool for HCI mode

CLVALTune.zip

Operation tool for calibration for HCI mode

r01an4860ejXXXX-rx23w-ble.pdf

BLE FIT Module Application Note (English)

r01an4860jjXXXX-rx23w-ble.pdf

BLE FIT Module Application Note (Japanese)

r_ble_api_spec.chm

R_BLE API document (English)

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2.2 Project Configuration

A BLE Application template project consists of Smart Configurator generation codes extracted from the BLE FIT module, the BLE QE Utility module and the QE for BLE and other FIT modules. Table 2.2 shows the project configuration.

Table 2.2. BLE Application template project configuration

[project name]\

Project directory

src\ smc_gen\

A set of source codes generated by Smart Configurator

Config_BLE_PROFILE\

A set of source codes generated by QE for BLE

app_main.c

Framework for user application and profile

gatt_db.c

GATT database

gatt_db.h

r_ble_[profile name]s.c

Profile API

r_ble_[profile name]s.h

r_ble_[profile name]c.c

r_ble_[profile name]c.h

r_ble_rx23w\

BLE FIT module

lib\

BLE Protocol Stack library

ref\

Configuration reference

src\

app_lib\

BLE application auxiliary features

abs\

Abstraction API

board\

LED and Switch Control

cli\

Command line (Input/Output to terminal software)

cmd\

Command line (Command implementation)

discovery\

Profile Common (discovery)

logger\

Logger

profile_cmn\

Profile Common

rtos\

BLE Tack Control

sec_data\

Security Data Management

timer\

Software Timer

platform\

Platform dependent codes

driver\

Data Flash driver for the BLE FIT module

r_ble_pf_config_private.h

BLE configuration control

r_ble_pf_configs.c

r_ble_pf_functions.c

RF driver platform dependent

r_ble_pf_lowpower.c

MCU low power consumption program

r_ble_rx23w_if.h

BLE interface definition file

FIT modules other than the BLE FIT module

[project].c

Application template

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2.3 Build Environment

Table 2.3 shows the hardware requirements for building and debugging a BLE Application.

Table 2.3. Hardware requirements

Hardware

Description

Host PC

Windows 10 PC with USB interface.

RX23W Board

Target Board for RX23W [RTK5RX23W0C00000BJ] Target Board for RX23W module [RTK5RX23W0C01000BJ] RSSK RX23W [RTK5523W8AC00001BJ]

On-chip debugging emulators

E2 emulator Lite [RTE0T0002LKCE00000R] or E1 emulator [R0E000010KCE00]

When using the RSSK, either emulator is required. The Target Board has an on-board debugger equivalent to the E2 emulator Lite, so

there is no need to prepare an emulator.

USB cables

Used to connect to the emulator and RX23W board.

E2 or E1 emulator: 1 USB A-miniB cable Target Board: 2 USB A-microB cable RSSK: 1 USB A-microB cable

Table 2.4 shows the software requirements for building and debugging a BLE Application.

Table 2.4. Software requirements

Software

Version

Description

CC-RX environment

e² studio

v7.8.0 (32bit) 2021_01 (64bit)

Integrated development environment (IDE) for Renesas devices.

CC-RX compiler

v2.08.00

C/C++ Compiler for RX Family. (download from e2 studio installer)

Renesas Flash Programmer

v3.06.00

Tool for programming the on-chip flash memory of Renesas microcontrollers.

IAR environment

IAR Embedded Workbench for Renesas RX

v4.14.1

Integrated development environment (IDE) for Renesas devices made by IAR Systems.

Note: Supported by BLE FIT module v1.10 or later.

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2.4 Install

2.4.1 BLE FIT Module

This module must be added to each project in which it is used. Renesas recommends using “Smart Configurator” described in (1) or (3).

(1) Adding the FIT module to your project using “Smart Configurator” in e2 studio.

By using the “Smart Configurator” in e

studio, the FIT module is automatically added to your project.

Refer to “Renesas e

studio Smart Configurator User Guide (R20AN0451)” for details.

(2) Adding the FIT module to your project using “FIT Configurator” in e2 studio

By using the “FIT Configurator” in e

studio, the FIT module is automatically added to your project. Refer

to “Adding Firmware Integration Technology Modules to Projects (R01AN1723)” for details.

(3) Adding the FIT module to your project using “Smart Configurator” on CS+

By using the “Smart Configurator Standalone version” in CS+, the FIT module is automatically added to your project. Refer to “Renesas e

studio Smart Configurator User Guide (R20AN0451)” for details.

(4) Adding the FIT module to your project in CS+

In CS+, please manually add the FIT module to your project. Refer to “Adding Firmware Integration Technology Modules to CS+ Projects (R01AN1826)” for details.

2.4.2 Demo projects

2.4.2.1 e2 studio Project

Import the demo project zip file under the FITDemos folder to the lowest possible hierarchy. (e.g. C:\RenesasBLE ) If the folder hierarchy is deep, intermediate files cannot be output when building with e2 studio, and the build may fail.

Also, select a location that does not contain blank character, multi-byte characters, and ampersand character

“&” in the decompression destination path.

Refer to “BLE Module Firmware Integration Technology Application Note (R01AN4860)” for details on

importing the demo project zip file to the e2 studio workspace. Note: If the demo project import location is not appropriate, the e2 studio build may fail.

2.4.2.2 IAR Embedded Workbench for Renesas RX Project

Unzip the demo project zip file under the “FITDemos” folder and double-click the eww file. Build the project by [Project]→[Rebuild All] on IAR Embedded Workbench for Renesas RX. After successful build, download the firmware to the board by selecting [Project]→[Download and Debug].

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3. Software Structure

Figure 3.1 shows the BLE Application software structure.

Figure 3.1. BLE Application software structure

The BLE Application consists of BLE Protocol Stack and app_lib provided by the BLE FIT module and skeleton programs and BLE Profile generated by QE for BLE.

By calling the R_BLE API function provided by the BLE Protocol Stack, the BLE Application can use the BLE function.

The app_lib provides auxiliary features that can be used by the BLE Application. The BLE communication can be easily used by using “Abstraction API” that abstracts R_BLE API included in app_lib.

QE for BLE, a solution toolkit that runs on e2 studio, generates skeleton programs for application and profile development using BLE Protocol Stack and Abstraction API.

Renesas recommends BLE application development using QE for BLE. For details about how to design a profile with QE for BLE, see “RX23W Group Bluetooth Low Energy Profile

Developer's Guide (R01AN4553)”. For details about how to develop BLE Application, see “RX23W Group Bluetooth Low Energy Application Developer's Guide (R01AN5504)”.

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3.1 BLE Protocol Stack

3.1.1 BLE Protocol Stack structure

Figure 3.2 shows the BLE Protocol Stack structure.

BLE Protocol Stack

Host Stack

R_BLE API

L2CAP

Link Layer

GAP

L2CAP

Vendor Specific

MCU Low Power Consumption

Common

HCI

ATTSMP

HCI

Scheduler

Vendor Specific

GAP GATT

GATT Client

GATT Server

GATT Common

BLE (H/W)

BLE Application Layer

Vendor Specific

Figure 3.2. BLE Protocol Stack structure

BLE Protocol Stack consists of R_BLE API, Host Stack, Link Layer, and Scheduler.

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• R_BLE API

The R_BLE API provides the APIs shown in Table 3.1 to provide BLE functions for BLE applications. Refer to “R_BLE API document (r_ble_api_spec.chm)” for detailed specifications of each API.

Table 3.1. R_BLE API overview

R_BLE_API

Protocol/Profile

Description

Common API

⎯

API for control BLE Open / Close and scheduler processing. Main features

• Open/Close the BLE protocol stack.

• Execute the BLE task.

• Add an event in the BLE protocol stack internal queue.

GAP API

GAP SMP

API for supports procedures defined in GAP and SMP. Main features

• GAP Advertising, Scan, Connection, Security

• SMP Pairing

GATT Server API

ATT GATT

API for GATT Server that publishes service-related attributes and data sets (GATT Database).

Main features

• Access to GATT Database

• Notification / Indication

GATT Client API

ATT GATT

API for GATT Client that makes requests to GATT Server. Main features

• Service/Characteristic Discovery

• Characteristic Read/Write

GATT Common API

ATT GATT

API for functions used in common with GATT Server/Client. L2CAP API

L2CAP

API for data transfer on channels that perform credit-based flow control.

Vendor Specific API

⎯

API that provides Renesas original extended features. Main features

• Enhanced Direct Test Mode

• Set/Get BD Address

MCU Low Power Consumption API

⎯

API for reducing MCU power consumption.

The supported API differs depending on the type of BLE Protocol Stack. See Table 3.4 for the APIs supported by each library.

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• Host Stack

Host Stack provides the protocol and profile functions specified by Bluetooth SIG. The data received from the R_BLE API is sent to the Link Layer according to the procedures specified in each protocol and profile, and the data received from the Link Layer is notified as an R_BLE API event or data.

• Link Layer

The Link Layer controls the BLE hardware implemented in the MCU and provides BLE functions such as Advertising, Scan, Connection, and Data Communication to the Host Stack via HCI (Host Controller Interface). BLE commands and transmission data are sent from Host Stack to Link Layer. BLE command results and data received from remote devices are sent from Link Layer to Host Stack.

• Scheduler

Scheduler processes the task according to the message queue sent to the task of each layer of BLE Protocol Stack by R_BLE_Execute() of Common API. Figure 3.3 shows the basic sequence chart of BLE Protocol Stack.

R_BLE API Scheduler Host Stack Link Layer(LL) BLE H/WApplication

Call R_BLE API

return R_BLE API

Send Message to

Host Stack

Call R_BLE_Execute()

return R_BLE_Execute()

Execute Task

return

Send Message to LL

Execute Task

return

Access BLE H/W

Send Message to Host Stack

BLE Interrupt

Execute Task

return

callback

R_BLE event callback

return

Send Message to LL

Call R_BLE_Execute()

return R_BLE_Execute()

Execute Task

return

Access BLE H/W

Send Message to Host Stack

Execute Task

return

callback

return

R_BLE event callback

return

Function Call

Send Message

return

BLE Interrupt

Access BLE H/W

Software HardwareSource Code Library

BLE Protcol Stack

Figure 3.3. Basic sequence chart of BLE Protocol Stack

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3.1.2 BLE Protocol Stack library

The BLE FIT module provides the following three types of BLE Protocol Stack as a static library according to the supported BLE features. By selecting the type according to the feature used in the BLE Application, it is possible to reduce the ROM/RAM code size of the program.

Refer to “BLE Module Firmware Integration Technology (R01AN4860) 2.10 Code Size” for the code size of each type.

Table 3.2. BLE Protocol Stack library

Library Type

Library File Name

Description

All features

lib_ble_ps_ccrx_a.lib

All features supported by BLE Protocol Stack can be used.

Balance

lib_ble_ps_ccrx_b.lib

LE Advertising Extensions with large ROM/RAM size usage is disabled. However, LE 2M PHY and LE Coded PHY can be changed after connection.

Compact

lib_ble_ps_ccrx_c.lib

Dedicated to BLE slave operation, it can be used in applications that do not require master operation, such as sensor devices.

Table 3.3 shows the BLE features supported by each type of BLE Protocol Stack.

Table 3.3. Features supported by each type of BLE Protocol Stack

BLE Features

Library Type

All features

Balance

Compact

LE 2M PHY

Yes

LE Coded PHY

Yes

LE Advertising Extensions

Yes

LE Channel Selection Algorithm #2

Yes

High Duty Cycle Non-Connectable Advertising

Yes

LE Secure Connections

Yes

Link Layer privacy

Yes

Link Layer Extended Scanner Filter policies

Yes

LE Data Packet Length Extension

Yes

LE L2CAP Connection Oriented Channel Support

Yes

Low Duty Cycle Directed Advertising

Yes

LE Link Layer Topology

Yes

LE Ping

Yes

GAP Role

Central

Peripheral

Observer

Broadcaster

Central

Peripheral

Observer

Broadcaster

Peripheral

Broadcaster

GATT Role

Sever Client

32-bit UUID Support in LE

Yes

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• LE 2M PHY

Supports BLE communication with 2Msym/s PHY.

• LE Coded PHY

Supports BLE communication with Coded PHY. Communication over a long range than 1M PHY and 2M PHY is possible.

• LE Advertising Extensions

An extension of Advertising. The features are as follows. ⎯ Up to 4 independent advertising can be executed simultaneously.

(Use the configuration option BLE_CFG_RF_ADV_SET_MAX to set the number of Advertising executed simultaneously.)

⎯ Expansion of Advertising Data / Scan Response Data size up to 1650 bytes.

(Set the maximum size (bytes) with the configuration option BLE_CFG_RF_ADV_DATA_MAX.)

⎯ Periodic Advertising is possible.

• LE Channel Selection Algorithm # 2

This feature selects a channel using the algorithm for selecting a hopping channel added in Version 5.0.

• High Duty Cycle Non-Connectable Advertising

This feature supports non-connectable advertising with a minimum interval of 20 msec.

• LE Secure Connections

Elliptic curve Diffie-Hellman key agreement method (ECDH) supports passive eavesdropping pairing.

• Link Layer privacy

This feature avoids tracking from other BLE devices by changing the BD Address periodically.

• LE Data Packet Length Extension

This feature expands the BLE data communication packet size. It can be expanded to 251 bytes.

• LE L2CAP Connection Oriented Channel Support

This feature supports communication using the L2CAP credit based flow control channel.

• Low Duty Cycle Directed Advertising

This feature supports low duty cycle advertising for reconnection with known devices.

• LE Link Layer Topology

This feature supports both Master and Slave roles and can operate as Master when connected to a remote device and as Slave when connected to another remote device.

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• LE Ping

After connection encryption, this feature checks whether connection is maintained by a packet transmission request including MIC field.

• GAP Role

GAP Role supports the following.

⎯ Central: A device that sends a connection request to a peripheral device. ⎯ Peripheral: A device that accepts connection requests from Central and establishes a connection. ⎯ Observer: A device that scans Advertising. ⎯ Broadcaster: A device that sends Advertising.

• GATT Role

GATT Role supports the following.

⎯ Server: A device that prepares Characteristic provided by service in GATT Database and responds to requests

from Client.

⎯ Client: A device that makes request for services provided by Server.

• 32-bit UUID Support in LE

Supports GATT 32-bit UUID.

Table 3.4 shows R_BLE API support for each BLE Protocol Stack library.

Table 3.4. R_BLE API support for BLE Protocol Stack library

R_BLE_API

Library Type

All features

Balance

Compact

Common API

Yes

GAP API

Yes

C.1

GATT Common API

Yes

GATT Server API

Yes

GATT Client API

Yes

L2CAP API

Yes

Vendor Specific API

Yes

MCU Low Power Consumption API

Yes

C.1: Support for each GAP API varies depending on the type of BLE Protocol Stack library.

Refer to “R_BLE API document (r_ble_api_spec.chm)” for details.

The BLE Protocol Stack type is determined by the BLE_CFG_LIB_TYPE definition value in the configuration file (r_ble_rx23w_config.h). Determine which type is used by BLE_CFG_LIB_TYPE at the time of build, rename lib_ble_ps_ccrx_x.lib (x: a or b or c) to lib_ble_ps_ccrx.lib and link.

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3.2 app_lib

Figure 3.4 shows the app_lib structure. Details of each are explained in “5 Original Features”.

Figure 3.4. app_lib structure

The functions provided by app_lib are described below.

3.2.1 Abstraction API

Abstraction API is an API that makes it easy to use frequently used functions in BLE Protocol Stack. Refer to “R_BLE API document (r_ble_api_spec.chm)” for detailed specifications of Abstraction API.

3.2.2 Software Timer

The software timer uses Compare Match Timer (CMT). When using this function, add CMT FIT module to the application. The CMT channel to be used is dynamically

allocated by FIT. Refer to “RX23W Group Bluetooth Low Energy Application Developer’s Guide (R01AN5504)

4.1 Software Timer” for details.

3.2.3 Security Data Management

Provides an interface for automatically saving bonding information to Data Flash when pairing is successful. When using this feature, set BLE_CFG_EN_SEC_DATA to “1” from the BLE FIT module component settings.

About the use of security data management, see “RX23W Group Bluetooth Low Energy Application Developer’s Guide (R01AN5504) 4.4 Security Data Management”. About data configuration of security data management, see “5.2 Security Data Management ”.

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3.2.4 Profile Common

The Profile Common is common functions to BLE Profile. It is called from the profile source code generated by QE for BLE.

3.2.5 Logger

Outputs a log message. The output level is set by the configuration option BLE_CFG_LOG_LEVEL. Refer to “RX23W Group Bluetooth Low Energy Application Developer’s Guide (R01AN5504) 4.3 Logger” for details.

3.2.6 Command line

The command line feature uses the BLE functions via a command input from serial. It uses Serial Communication Interface (SCI). Command types are standard commands provided by the BLE FIT module and user commands created by user. For details of standard commands and user commands, see the documents in Table 3.5.

Table 3.5.Command line reference documents

Command

Reference

Standard Specification

“5.1 Command Line Interface”

Usage

“RX23W Group Bluetooth Low Energy Application Developer’s Guide (R01AN5504)

4.2.1 How to use the standard command”

User

Creation Method

“RX23W Group Bluetooth Low Energy Application Developer’s Guide (R01AN5504)

4.2.2 How to create a user command”

3.2.7 LED and Switch Control

The LED and Switch Control feature controls LEDs and switches on board. About setting the BLE FIT and the

IRQ FIT configuration options to use this feature, see “RX23W Group BLE Module Firmware Integration

Technology (R01AN4860) 4.5.4 LED and Switch Control”. About how to use this feature, see “RX23W Group Bluetooth Low Energy Application Developer’s Guide (R01AN5504) 4.5 Board and LED switch”.

3.2.8 BLE Task Control

The BLE Task Control feature is enabled if a project including the BLE FIT module has “FreeRTOS” as RTOS. Another task wakes the BLE task up by this feature. About how to use it, see “RX23W Group BLE Module Firmware Integration Technology (R01AN4860) 6.4 Wake up BLE task from another task”.

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4. Software Setting

User can configure the BLE Application according to the purpose with the BLE FIT module.

4.1 Configuration options

Table 4.1 shows configuration options of the BLE FIT module. Configuration option settings are determined by the macro definition in r_ble_rx23w_config.h. When using Smart Configurator, configuration options can be set on the software component setting screen. The setting value is automatically reflected in r_ble_rx23w_config.h when adding a module.

Table 4.1. List of configuration options (1/8)

Configuration Options

Description

BLE_CFG_LIB_TYPE Default : "0"

Type of the BLE Protocol Stack. Select one of the followings.

0: All features 1: Balance 2: Compact

Refer to “3.1.2 BLE Protocol Stack” for details.

BLE_CFG_RF_DBG_PUB_ADDR Default : "{0xFF,0xFF,0xFF,0x50,0x90,0x74}"

Initial Public Address. If the public addresses in the Code Flash and the Data Flash are all 0x00 or 0xFF, the device adopts this public address. If all 0x00 or 0xFF is set, the device uses ‘74:90:50:FF:FF:FF’ as public address.

BLE_CFG_RF_DBG_RAND_ADDR Default : “{0xFF,0xFF,0xFF,0xFF,0xFF,0xFF}"

Initial Static Address. If the static addresses in the Code Flash and the Data Flash are all 0x00 or 0xFF, the device adopts this static address. If all 0x00 or 0xFF is set, the device uses the value generated with the device specific value the static address.

BLE_CFG_RF_CONN_MAX Default : "7"

Maximum number of simultaneous connections. Range : 1 to 7

BLE_CFG_RF_CONN_DATA_MAX Default : "251"

Maximum packet data length (bytes). Range : 27 to 251

BLE_CFG_RF_ADV_DATA_MAX Default : "1650"

Maximum advertising data length (bytes). Range : 31 to 1650

The maximum advertising data length of the BLE Protocol Stack libraries other than "All features" is fixed to 31bytes.

BLE_CFG_RF_ADV_SET_MAX Default : "4"

Maximum number of the advertising set. Range : 1 to 4

The number of the advertising set of the BLE Protocol Stack libraries other than "All features" is fixed to one.

BLE_CFG_RF_SYNC_SET_MAX Default : "2"

Maximum number of periodic sync set. Range : 1 to 2

If the BLE Protocol Stack library is other than "All features", this option is not used.

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Table 4.1. List of configuration options (2/8)

Configuration Options

Description

BLE_CFG_EVENT_NOTIFY_CONN_START Default : "0"

Enable or disable start interrupt notification of a connection complete event.

0: Disable 1: Enable

Because the start notification is triggered by the interrupt, it occurs after the actual RF event.

BLE_CFG_EVENT_NOTIFY_CONN_CLOSE Default : "0"

Enable or disable end interrupt notification of a connection complete event.

0: Disable 1: Enable

If the connection is terminated by a command, the notification doesn't occur.

BLE_CFG_EVENT_NOTIFY_ADV_START Default : "0"

Enable or disable the advertising event start interrupt notification.

0: Disable 1: Enable

The notification occurs at the following timings.

• Start Primary Advertising channel.

• Start Secondary Advertising Channel

• Start Periodic Advertising. (When the Extended Advertising is

enabled.)

Because the start notification is triggered by the interrupt, it occurs after the actual RF event.

BLE_CFG_EVENT_NOTIFY_ADV_CLOSE Default : "0"

Enable or disable the advertising event complete interrupt notification.

0: Disable 1: Enable

The notification occurs at the following timings.

• Complete Primary Advertising channel.

• Complete Secondary Advertising Channel

• Complete Periodic Advertising.(When the Extended Advertising is

enabled.)

If the advertising is terminated by a command, the notification doesn't occur.

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Table 4.1. List of configuration options (3/8)

Configuration Options

Description

BLE_CFG_EVENT_NOTIFY_SCAN_START Default : "0"

Enable or disable the scan start interrupt notification.

0: Disable 1: Enable

If the scan interval is equal to the scan window, this notification doesn't occur.

Because the start notification is triggered by the interrupt, it occurs after the actual RF event.

BLE_CFG_EVENT_NOTIFY_SCAN_CLOSE Default : "0"

Enable or disable the scan complete interrupt notification

0: Disable 1: Enable

If the scan interval is equal to the scan window, this notification doesn't occur.

If the scan is terminated by a command, the notification doesn't occur.

BLE_CFG_EVENT_NOTIFY_INIT_START Default : "0"

Enable or disable the notification that the scan start interrupt has occurred in sending a connection request.

0: Disable 1: Enable

If the scan interval is equal to the scan window, this notification doesn't occur.

Because the start notification is triggered by the interrupt, it occurs after the actual RF event.

BLE_CFG_EVENT_NOTIFY_INIT_CLOSE Default : "0"

Enable or disable the notification that the scan complete interrupt has occurred in sending a connection request.

0: Disable 1: Enable

If the scan interval is equal to the scan window, this notification doesn't occur.

If the connection request is terminated by a command, the notification doesn't occur.

BLE_CFG_EVENT_NOTIFY_DS_START Default : "0"

Enable or disable the RF_DEEP_SLEEP start notification.

0: Disable 1: Enable

BLE_CFG_EVENT_NOTIFY_DS_WAKEUP Default : "0"

Enable or disable the RF_DEEP_SLEEP wakeup notification.

0: Disable 1: Enable

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Table 4.1. List of configuration options (4/8)

Configuration Options

Description

BLE_CFG_RF_CLVAL Default : "6"

Adjustment value of the 32MHz crystal oscillator for RF part. Set this option according to the board environment. Range : 0 to 15

Refer to"RX23W Group Tuning procedure of Bluetooth dedicated clock frequency(R01AN4762)" for details.

If you select R5F523W8CxLN or R5F523W8DxLN, set “7”.

BLE_CFG_RF_DDC_EN Default : "0"

Enable or disable the DC-DC on the RF.

0: Disable 1: Enable

If you use Target Board, set “0”.

BLE_CFG_RF_EXT32K_EN Default : "0"

Slow clock source to the RF.

0: RF_LOCO 1: External 32.768kHz

If this option is set to 1, the sub clock is required to be enabled in the Smart Configurator clock configuration.

BLE_CFG_RF_MCU_CLKOUT_PORT Default : "0"

Port of the MCU CLKOUT.

0: PE3 1: PE4

If BLE_CFG_RF_EXT32K_EN option is 0, this option is ignored.

BLE_CFG_RF_MCU_CLKOUT_FREQ Default : "0"

Output frequency from the MCU CLKOUT.

0: MCU CLKOUT frequency 32.768kHz 1: MCU CLKOUT frequency 16.384kHz

If BLE_CFG_RF_EXT32K_EN option is 0, this option is ignored.

BLE_CFG_RF_SCA Default : "250"

Sleep Clock Accuracy(SCA) for the RF slow clock. Range : 0 to 500

If BLE_CFG_RF_EXT32K_EN option is 0, the SCA is fixed to more than 250 [ppm] and this option is ignored.

BLE_CFG_RF_MAX_TX_POW Default : "1"

Maximum transmit power configuration.

0: max +0dBm 1: max +4dBm

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Table 4.1. List of configuration options (5/8)

Configuration Options

Description

BLE_CFG_RF_DEF_TX_POW Default : "0"

Default transmit power level. Range : 0 to 2 This option depends on BLE_CFG_RF_MAX_TX_POW option.

If the BLE_CFG_RF_MAX_TX_POW option is 0 (0dBm), BLE_CFG_RF_DEF_TX_POW is as follows.

0 (High) : 0 dBm 1 (Mid) : 0 dBm 2 (Low) : -18 dBm

If the BLE_CFG_RF_MAX_TX_POW option is 1 (+4dBm), BLE_CFG_RF_DEF_TX_POW is as follows.

0 (High) : +4 dBm 1 (Mid) : 0 dBm 2 (Low) : -20 dBm

BLE_CFG_RF_CLKOUT_EN Default : "0"

CLKOUT_RF output. Select one of the followings.

0: No output 5: 4MHz output 6: 2MHz output 7: 1MHz output

BLE_CFG_RF_DEEP_SLEEP_EN Default : "1"

Enable or disable the RF Deep Sleep.

0: Disable 1: Enable

BLE_CFG_MCU_MAIN_CLK_KHZ Default : "4000"

MCU main clock frequency (kHz). This option needs to be configured according to the board environment. If the HOCO is used, this option is ignored. If the Main Clock is used, set a value within the range between 1000

and 20000. If the PLL Circuit is used, set a value within the range between 4000

and 12500. Set the clock frequency configured in the Smart Configurator clock

configuration.

BLE_CFG_DEV_DATA_CF_BLOCK Default : "16"

The Code Flash(ROM) block stored the device specific data. Range : -1 to 255

If this option is set to “-1”, the device specific data in the Code Flash is not used.

The blocks from "0" to "15" are the Start-Up Program Protection block. If the Start-Up Program Protection is used, don’t use the blocks from "0" to "15".

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Table 4.1. List of configuration options (6/8)

Configuration Options

Description

BLE_CFG_DEV_DATA_DF_BLOCK Default : "-1"

The E2 Data Flash block stored the device specific data. Range : -1 to 7

If this option is set to “-1”, the device specific data in the E2 DataFlash is not used.

Specify a block number different from the block number specified by BLE_CFG_SECD_DATA_DF_BLOCK.

BLE_CFG_GATT_MTU_SIZE Default : "247"

The MTU size (bytes) for the GATT communication. Range : 23 to 247

BLE_CFG_NUM_BOND Default : "7"

Maximum number of the bonding information stored in the Data Flash. Range : 1 to 7

BLE_CFG_EN_SEC_DATA Default : "0"

Enable or disable the security data management. The bonding information is stored in the Data Flash block specified by

BLE_CFG_SECD_DATA_DF_BLOCK by this option.

0: Disable 1: Enable

If this option is enabled, add the Data Flash FIT module.

BLE_CFG_SECD_DATA_DF_BLOCK Default : "0"

The Data Flash block for the security data management to store the bonding information.

Range : 0 to 7

Specify a block number different from the block number specified by BLE_CFG_DEV_DATA_DF_BLOCK.

BLE_CFG_CMD_LINE_EN Default : "0"

Enable or disable the command line function.

0: Disable 1: Enable

If this option is enabled, add the SCI FIT module.

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Table 4.1. List of configuration options (7/8)

Configuration Options

Description

BLE_CFG_CMD_LINE_CH Default : "1"

SCI Channel for the command line function. Set one of the following values:

1: SCI1 5: SCI5 8: SCI8 12: SCI12 (BGA 85pin only)

Enable the SCI channel for the command line in the SCI FIT module configuration.

If the BLE_CFG_CMD_LINE_EN is 0, this option is ignored. The SCI used in the HCI mode must be set in "6.3.1 Configuration

Options of UART Driver" instead of this macro.

BLE_CFG_BOARD_LED_SW_EN Default : "0"

Enable or disable support the board LED & Switch control.

0: Disable 1: Enable

If the option is enabled, add the IRQ FIT module and the GPIO FIT module.

BLE_CFG_BOARD_TYPE Default : "0"

Board type. Range : 0 to 3

0 : Customer board 1 : Target Board 2 : RSSK 3: Evaluation board

BLE_CFG_LOG_LEVEL Default : "3"

Log level. Range : 0 to 3

0 : disable 1 : Error 2 : Error & Warning 3 : Error & Warning & Debug

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Table 4.1. List of configuration options (8/8)

Configuration Options

Description

BLE_CFG_ABS_API_EN Default : “1”

Set enable/disable of the Abstraction API.

0: Disable 1: Enable

BLE_CFG_SOFT_TIMER_EN Default : “1”

Set enable/disable of the software timer provided by app_lib.

0: Disable 1: Enable

To use the Abstraction API, enable this option.

BLE_CFG_MCU_LPC_EN Default : “1”

Set enable/disable the low power consumption function of the MCU.

0: Disable 1: Enable

BLE_CFG_HCI_MODE_EN Default : “0”

Set startup in HCI mode.

0: Startup in normal mode 1: Startup in HCI mode

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4.2 Sections

The BLE Protocol Stack library provides a mechanism for Device Firmware Update (DFU) by Over The Air (OTA) using BLE communication. In order to specify the section allocation of the BLE Protocol Stack library, the section name different from the standard section name shown in Table 4.2 is added to the code of the BLE Protocol Stack library ("BLE_" is added to the beginning of the standard section name) Specified name).

Table 4.2. Section name of BLE Protocol Stack library

Name

BLE Protocol Stack Section Name

Program area

BLE_P

Constant area

BLE_C

BLE_C_2

BLE_C_1

Initialized data area (ROM)

BLE_D

BLE_D_2

BLE_D_1

Initialized data area (RAM)

BLE_R

BLE_R_2

BLE_R_1

Uninitialized data area

BLE_B

BLE_B_2

BLE_B_1

switch statement branch table area

BLE_W

BLE_W_2

BLE_W_1

Literal area

BLE_L

The section name of the BLE Protocol Stack library must be set as described in “4.2.1 Linker settings for application project”.

Since the BLE section is initialized by the R_BLE_Open() API that performs BLE initialization, there is no need to change the program code in the DTBL/BTBL table.

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4.2.1 Linker settings for application project

Add the section name of the BLE Protocol Stack library shown in Table 4.2 in the application section allocation settings. In CC-RX compiler, the wildcard character “*” can be specified for the section name.

The section layout of the e2 studio project is set in [Section] of [Linker].

Figure 4.1. e2 studio project section layout

Table 4.3 shows the section allocation settings when OTA is not used. Wildcards are used so that the section specification is not complicated.

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Table 4.3. Section layout of BLE library section (when OTA is not used)

Address

Section Name

0x00000004 (RAM)

B_1

R_1

B_2

R_2 B R

BLE_B*

BLE_R*

0xFFF80000 (ROM)

PResetPRG

C_1

C_2 C C$*

W* L PIntPRG

BLE_C*

BLE_D*

BLE_W*

BLE_L

BLE_P

0xFFFFFF80

EXCEPTVECT

0xFFFFFFFC

RESETVECT

Also, add the BLE Protocol Stack library section in Table 4.2 to the section that mapped from ROM to RAM. This setting does not allow the use of wildcards. You only need to add sections that have assignments.

In e2 studio, set [Linker] → [Section] → [Symbol file] → [ROM to RAM mapped section].

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Figure 4.2. Setting “ROM to RAM mapped section” in e2 studio project

Add the BLE_D/BLE_R section of the BLE library as shown below.

D=R D_1=R_1 D_2=R_2

BLE_D=BLE_R BLE_D_1=BLE_R_1 BLE_D_2=BLE_R_2

Note: If there is no assignment to the corresponding section, a link error will occur. The “BLE_D_8” section is not used in

the BLE Protocol Stack library.

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4.3 Bluetooth Device Address

Refer to "5.4 Device-specific Data Management" for Bluetooth Device Address used in BLE Protocol Stack.

4.4 Bluetooth Device Name

The following settings are required for Bluetooth Device Name depending on the inform method.

4.4.1 Inform by Advertising packet

Using the API shown in Table 4.4, it is possible to start advertising including the Bluetooth Device Name in Advertising Data or Scan Response Data, and to inform Bluetooth Device Name to the Scanner device.

Table 4.4. API to set Advertising Data

R_BLE_API

Parameter structure

Member name for setting

Advertising Data or

Scan Response Data

R_BLE_GAP_SetAdvSresData()

st_ble_gap_adv_data_t

p_data

R_BLE_ABS_StartLegacyAdv()

st_ble_abs_legacy_adv_param_t p_adv_data

p_sres_data

R_BLE_ABS_StartExtAdv()

st_ble_abs_ext_adv_param_t

p_adv_data

R_BLE_ABS_StartNonConnAdv()

st_ble_abs_non_conn_adv_param_t

p_adv_data

Set the data in the format shown in Figure 4.3 to Advertising Data or Scan Response Data.

LSB MSB

Length AD Type Device Name

Figure 4.3. Bluetooth Device Name format in Advertising packet

Table 4.5 describes the fields in the Bluetooth device name format.

Table 4.5. Bluetooth Device Name field

Field

Description

Length

The total number of bytes for “Device Name” and “AD Type”.

AD Type *1 (Advertising Data Type)

Indicates the type to be inform in the “Device Name” field.

0x08: «Shortened Local Name» 0x09: «Complete Local Name»

Device Name

Bluetooth Device Name string.

*1: For other AD types, refer to Bluetooth SIG, “Assigned numbers and GAP”.

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Figure 4.4 shows an example of setting Bluetooth Device Name using R_BLE_GAP_SetAdvSresData() API.

Figure 4.4. Setting example Bluetooth Device Name using R_BLE_GAP_SetAdvSresData()

/* Advertising Data */

static uint8_t gs_adv_data[] =

{ /* Some code is omitted */ /* Complete Local Name */ 11, /* Length */ 0x09, /* AD Type */ 'B', 'L', 'E', '-', 'S', 'E', 'R', 'V', 'E', 'R', /* Device Name */ /* Some code is omitted */ };

/* Advertising Parameters */

static st_ble_gap_adv_data_t gs_adv_param =

{ /* Some code is omitted */ .p_data = gs_adv_data, /* Some code is omitted */ };

/* GAP callback function */

static void ble_app_gapcb(uint16_t type, ble_status_t result,

st_ble_evt_data_t *p_data) { switch (type) { /* Some code is omitted */ case BLE_GAP_EVENT_ADV_PARAM_SET_COMP : { R_BLE_GAP_SetAdvSresData (&gs_adv_param); } break; /* Some code is omitted */ }

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4.4.2 Inform by Device Name Characteristic

By setting the Device Name Characteristic of GAP Service, it is possible to respond to the Bluetooth Device Name when receiving a Device Name Characteristic read request from GATT Client.

Device Name Characteristic can be set from QE for BLE. For details on QE for BLE settings, refer to “RX23W

Group Bluetooth Low Energy Profile Developer’s Guide (R01AN4553) 3.3 Configuration of characteristic”.

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5. Original Features

This section describes Renesas original features provided by the BLE FIT module. In addition to the features provided by “3.2 app_lib”, there are features provided by BLE Protocol Stack. Table

5.1 shows the original features provided by the BLE Protocol Stack.

Table 5.1.Original features provided by BLE Protocol Stack

Features

Description

RF communication timing notification

The RF communication timing notification function notifies the user application layer of the timing before and after BLE RF communication is performed with a callback.

Refer to “5.3 RF communication timing notification” for details.

Device-specific Data Management

Bluetooth Device Address used by BLE Protocol Stack can be written as device-specific data in the user area (ROM) or data area (E2 DataFlash) of flash memory.

Refer to “5.4 Device-specific Data Management” for details.

5.1 Command Line Interface

Command Line Interface (CLI) provides a function to execute BLE control commands through a terminal emulator that supports VT100 emulation. Terminal emulators that support VT100 emulation can be used with Tera Term application. The debug console provided by e2 studio does not support VT100 emulation.

The features provided by Command Line Interface are shown in Table 5.2.

Table 5.2. Command Line Interface Features

Features

Description

Prompt display

"$" is displayed as a prompt to indicate that the command can be executed.

Specifying the editing position with the left and right arrow keys

With the left and right arrow keys, you can specify the position to edit the characters in the command line.

Edit characters with backspace and delete keys

Use the BS and DEL keys to delete characters in the command line.

Command help

Enter "help" after a command and execute it, help message shown at each command.

Support hierarchical command system with subcommands

Provides a hierarchical command system. Support multiple command sets

Multiple command sets can be registered.

Abort command execution

Press “Ctrl + C” or “Ctrl + D” keys to aborts the current command.

Command completion

Press TAB key to complete command input.

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When using Command Line Interface features, set the BLE_CFG_CMD_LINE_EN configuration option to “1”. Also, specify the SCI channel in the BLE_CFG_CMD_LINE_CH configuration option.

Set the following items in the terminal emulator of the computer connected to the board.

Table 5.3. Terminal emulator settings

Items

Settings

New-line (Receive)

New-line (Transmit)

Terminal Mode

VT100

Baud rate

115200

Data

8bit

Parity

none

Stop bits

1bit

Flow Control

none

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BLE control command provided by BLE FIT module using the command line interface features are shown in the following sections.

5.1.1 GAP command

(1) Advertising command

adv command

Format :

gap adv [adv_type] [operation] (addr_type) (-wl)

Start, stop, or remove advertising.

Parameters :

[adv_type]

Select one of the followings as the type of advertising.

legacy : legacy advertising

ext : extended advertising

non-conn : non-connectable advertising

periodic : periodic advertising

[operation] Start or stop advertising.

start : start advertising

stop : stop advertising.

remove : remove advertising set specified by adv_type.

(addr_type)

Specify the address type of advertising.

When this parameter is omitted, static address is selected.

pub : Public Address

rnd : Static Address

rpa_pub : If registering an identity address by gap priv set command or application, RPA is used. In cases other than the above, it will be a public address.

rpa_rnd : If registering an identity address by gap priv set command or application, RPA is used. In cases other than the above, it will be a static address.

(-wl) Specify this parameter when using white list.

If white list is not used, this parameter is can be omitted.

Example :

gap adv legacy start

Start legacy advertising. The local device address is a static address.

gap adv legacy start pub

Start legacy advertising. The local device address is a public address.

gap adv ext stop

Stop extended advertising.

Other parameters related to Advertising that cannot be set from this command are set in the Advertising parameter variables of gs_legacy_adv_param, gs_ext_adv_param, gs_non_conn_adv_param, and gs_periodic_adv_param in app_lib\cmd\r_ble_cmd_abs.c. Changing these variables will change the setting of Advertising parameters. As for details of parameters, refer to Modules >> Application Library >> Abstraction API >> Structures >> st_ble_abs_legacy_adv_param_t, st_ble_abs_ext_adv_param_t, st_ble_abs_non_conn_adv_param_t, and st_ble_abs_perd_adv_param_t in API document (r_ble_api_spec.chm).

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(2) Scan command

scan command

Format :

gap scan (operation) (filter_ad_type) (filter_data) (addr_type) (-wl)

Start scan. It is not necessary to specify (operation) when starting scan.

When scan stops, input [ctrl] + [c].

Parameters :

(operation)

Specify operation for scan

stop : stop scan.

(filter_ad_type)

The AD type for filtering. Refer to Bluetooth SIG, "Assigned numbers and GAP" for the definition of the AD type. If the filter is not used, this parameter can be omitted.

(filter_data)

The data for filtering. Specify the data for the filter_ad_type. If the filter is not used, this parameter can be omitted. If the filter_ad_type is not used, this parameter is ignored.

(addr_type)

Specify the address type of scan request.

When this parameter is omitted, static address is selected.

pub : Public Address

rnd : Static Address

rpa_pub : If registering an identity address by gap priv set command or application, RPA is used. In cases other than the above, it will be a public address.

rpa_rnd : If registering an identity address by gap priv set command or application, RPA is used. In cases other than the above, it will be a static address.

(-wl)

Specify this parameter when using white list.

If white list is not used, this parameter is can be omitted.

Example :

gap scan

Start scan.

gap scan 2 0x01,0x29

Search the advertising report which of the AD Type : Incomplete List of 16-bit Service Class UUIDs(0x02) and the service UUID : 0x2901.

Other parameters related to Scan that cannot be set from this command are set in the scan parameter variables of gs_phy_param_1m and gs_scan_param in app_lib\cmd\r_ble_cmd_abs.c. Changing these variables will change the scan parameter settings. As for details of parameters, refer to Modules >> Application Library >> Abstraction API >> Structures >> st_ble_abs_scan_param_t and st_ble_abs_scan_phy_param_t in API document (r_ble_api_spec.chm).

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(3) Connection command

conn command

Format :

gap conn [addr] [addr_type] (own_addr_type) (dummy_irk) (-wl)

Send a connection request. In case of stopping connection request, input [ctrl] + [c].

Parameters :

[addr]

Remote device address.

[addr_type]

Specify the followings as remote device address type.

pub : Public Address

rnd : Random Address

(own_addr_type)

Specify the address type of connection request.

When this parameter is omitted, static address is selected.

pub : Public Address

rnd : Static Address

rpa_pub : If registering an identity address by gap priv set command or application, RPA is used. In cases other than the above, it will be a public address.

rpa_rnd : If registering an identity address by gap priv set command or application, RPA is used. In cases other than the above, it will be a static address.

(dummy_irk)

Select whether to use the IRK of the dummy of the remote device to be registered in the Resolving List when RPA is specified in own_addr_type.

dummy_irk : use the IRK of the dummy of the remote device

(-wl)

Specify this parameter when using white list.

If white list is not used, this parameter is can be omitted.

Example :

gap conn 74:90:50:00:95:a8 pub

Send a connection request to the remote device whose public address is 74:90:50:00:95:a8.

gap priv set net

gap conn d8:19:e3:30:92:21 pub

Send a connection request to the remote device whose random address is d8:19:e3:30:92:21.

Local devices use RPA. The IRK for the remote device use dummy IRK.

Note: If the local device uses RPA, it is necessary to execute the "gap priv" command in advance.

Other parameters related to Connection that cannot be set from this command are set in the connection parameter variables of gs_conn_phy_1m and gs_conn_param in app_lib\cmd\r_ble_cmd_abs.c. Changing these variables will change the connection parameter settings. As for details of parameters, refer to Modules >> Application Library >> Abstraction API >> Structures >> st_ble_abs_conn_phy_param_t and st_ble_abs_conn_param_t in API document (r_ble_api_spec.chm).

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(4) Disconnection command

disconn command

Format :

gap disconn [conn_hdl]

Disconnect the connection.

Parameters :

[conn_hdl] Connection handle of which the connection is disconnected.

Example :

gap disconn 0x0020

Disconnect the connection with connection handle 0x0020.

(5) Device command

device command

Format :

gap device

Display the addresses of the connected devices.

Parameters :

None

Example :

gap device

Display the addresses of the connected devices.

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(6) Privacy command

priv command

Format :

gap priv [operation] {params, ...}

gap priv set (IRK) [priv_mode] gap priv remove [addr] [addr_type] gap priv get lrpa ([addr] [addr_type]) gap priv off

Operate the local device's privacy.

Parameters :

[operation]

Select one of the followings as the operation of privacy.

set : Register the IRK of the local device in the resolving list and turn on the address generation function. It is used when the local device uses RPA in the advertising command and connection command.

remove : Delete the remote device registered in the resolving list.

get : Get the local device RPA for sending to remote device.

off : Turn off the address generation function.

{params, …}

[operation] : set

(IRK) : The local device's IRK which is registered in the resolving list. If this parameter is omitted, the IRK is generated with the random generation function.

[priv_mode] : Privacy mode and the address type of local device. Select one of the followings.

net : network privacy mode. Static address is used as identity address.

dev : device privacy mode. Static address is used as identity address.

net_pub : network privacy mode. Public address is used as identity address.

dev_pub : device privacy mode. Public address is used as identity address.

net_rnd : network privacy mode. Static address is used as identity address.

dev_rnd : device privacy mode. Static address is used as identity address.

[operation] : remove

[addr] : Specify the address (6 bytes) of the remote device registered in the Resolving list.

[addr_type] : Specify the address type of the remote device registered in the Resolving list.

[operation] : get

lrpa : Get the local device RPA for advertising.

[addr] : Specify the address (6 bytes) of the remote device registered in the Resolving list.

[addr_type] : Specify the address type of the remote device registered in the Resolving list.

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Example :

gap priv set 0001020304050600708090a0b0c0d0e0f dev

Register IRK : 0x0f0e0d0c0b0a09080706050403020100 and set the privacy mode to "device privacy mode". Static address is used as identity address.

gap priv set net

IRK is generated by the random number generation . The privacy mode is set to "network privacy mode". Static address is used as identity address.

gap priv set net_pub

IRK is generated by the random number generation . The privacy mode is set to "network privacy mode". Public address is used as identity address.

gap priv remove 12:34:56:78:9a:bc pub

Delete the 12:34:56:78:9a:bc (public) remote device registered in the resolving list.

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(7) Connection config command

conn_cfg command

Format :

gap conn_cfg [operation] {params, ...}

Connection configuration command.

Parameters :

[operation]

Type of connection configuration. Select one of the followings.

update : Connection parameter update.

phy : Set PHY.

def_phy : Set default phy.

data_len : Set data packet length or data transmit time.

{params, ...}

[operation] : update

Parameter1 : Connection handle.

Parameter2 : Connection interval. Time(ms) = Parameter2 x 1.25. Valid range is 0x0006-0x0C80.

Parameter3 : Slave latency. Valid range is 0x0000-0x01F3.

Parameter4 : Supervision timeout. Time(ms) = Parameter4 x 10. Valid range is 0x000A-0x0C80.

Input Parameter2-4 to meet the following condition. Parameter4 x 10 >= (1 + Parameter3) x Parameter2 x 1.25

[operation] : phy

Parameter1 : Connection handle

Parameter2 : Transmitter PHY. Parameter2 is set to a bitwise OR of the following values. bit0 : 1M PHY bit1 : 2M PHY bit2 : Coded PHY

Parameter3 : Receiver PHY. Parameter3 is set to a bitwise OR of the following values. bit0 : 1M PHY bit1 : 2M PHY bit2 : Coded PHY

Parameter4 : Coding scheme of Coded PHY. Select one of the following. 0x00 : The controller's preferred value. 0x01 : S=2 Coding scheme. 0x02 : S=8 Coding scheme.

[operation] : def_phy

Parameter1 : Transmitter PHY preferences which a remote device may change. Parameter1 is set to a bitwise OR of the following values. bit0 : 1M PHY bit1 : 2M PHY bit2 : Coded PHY

Parameter2 : Receiver PHY preferences which a remote device may change. Parameter2 is set to a bitwise OR of the following values. bit0 : 1M PHY bit1 : 2M PHY bit2 : Coded PHY

[operation] : data_len

Parameter1 : Connection handle

Parameter2 : Maximum transmit packet data length (in bytes). Valid range is 0x001B-0x00FB.

Parameter3 : Maximum transmit time (us). Valid range is 0x0148-0x4290.

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Example :

gap conn_cfg update 0x0026 0x0100 0 0x0100

Change the connection parameters of the connection handle : 0x0026 to the following values. connection interval : 0x0100

slave latency : 0 supervision timeout : 0x0100

gap conn_cfg phy 0x0026 2 2 0

Change the PHY of the connection (connection handle : 0x0026) Transmitter PHY : 2M Receiver PHY : 2M

gap conn_cfg def_phy 7 7

Accept the following change request. Transmitter PHY : 1M, 2M and Coded PHY. Receiver PHY : 1M, 2M and Coded PHY.

gap conn_cfg data_len 0x0026 0x00FB 0x4290

Change the following transmit packet length or transmit time Max transmit packet length : 251 bytes Max transmit time : 0x4290 us

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(8) White List command

wl command

Format :

gap wl [operation] {params, ...}

White List operation command.

Parameters :

[operation] White List operation. Select one of the followings.

reg : Register a device specified with the {params, ...} on the White List.

del : Delete the device specified with the {params, ...} on the White List.

clear : Clear the White List.

{params, ...}

[operation] : reg

Parameter1 : Address of a device to be registered on the White List.

Parameter2 : Address type of a device to be registered on the White List.

pub : Public Address

rnd : Random Address

[operation] : del

Parameter1 : Address of a device to be deleted on the White List.

Parameter2 : Address type of a device to be deleted on the White List.

pub : Public Address

rnd : Random Address

[operation] : clear

Not used.

Example :

gap wl reg 74:90:50:00:95:a8 pub

gap wl del 74:90:50:00:95:a8 pub

Delete the device whose public address is 74:90:50:00:95:a8 on the White List.

gap wl clear

Clear the White List.

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(9) Authentication command

auth command

Format :

gap auth [operation] {params, ...}

Pairing or encryption command.

Parameters :

[operation]

Security operation.

start : Start pairing or encryption.

passkey : Input 6-digit number(decimal) to be required in passkey entry pairing.

numcmp : Return the result of a numeric comparison.

del : Delete the pairing keys.

{params,...}

[operation] : start

Parameter1 : Connection handle identifying the connection which local device starts pairing or encryption.

[operation] : passkey

Parameter1 : 6 digit passkey (decimal)

[operation] : numcmp

Parameter1 : Result of a numeric comparison.("yes" or "no")

Return "yes" if both devices display same number, otherwise "no".

[operation] : del

Parameter1 : Type of key to be deleted.

local : keys which local device distributes.

remote : keys distributed from the remote devices.

all : the above two types of keys.

Parameter2: Type of the remote device key deletion.

addr : Delete the keys specified by the Parameter3, 4.

all : Delete all the keys distributed from remote devices.

not_conn : Delete the keys of the unconnected remote devices.

Parameter3 : Address of the remote device whose keys to be deleted.

Parameter4 : Address type of the remote device whose keys to be deleted.

pub : Public Address

rnd : Random Address

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Example :

gap auth start 0x0026

Start pairing or encryption with the connection (connection handle : 0x0026).

gap auth passkey 123456

Input "123456" as a passkey.

gap auth numcmp yes

Return "yes" as a result of numeric comparison.

gap auth del remote all

Delete all the keys distributed from the remote devices.

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(10) Synchronization command

sync command

Format :

gap sync [operation] {params...}

Create or Terminate a periodic sync.

Parameters :

[operation]

Periodic sync operation.

create : Create a periodic sync with the device whose address is specified by the {params...}. Scanning runs until a periodic sync is established.

In case of stopping creating periodic sync, input [ctrl] + [c].

term : Terminate the periodic sync whose sync_hdl is specified by the {params...}.

{params,...}

[operation] : create

Parameter1 : Address of the advertiser.

Parameter2 : Address type of the advertiser.

[operation] : term

Parameter1 : Sync handle identifying the periodic sync to be terminated.

If no parameters are given, all the established periodic syncs are terminated.

Example :

gap sync create 74:90:50:00:95:a8 pub

Establish a periodic sync with the advertiser whose public address is 74:90:50:00:95:a8.

gap sync term 0x01

Terminate the periodic sync (sync handle : 0x01).

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(11) Version command

ver command

Format :

gap ver

Get the following BLE Protocol Stack version information.

- Link Layer

- HCI

- Host Stack

- Manufacturer ID

- BLE FIT module

- library type

Parameters :

None

Example :

gap ver

Get the version information.

Result sample :

Link Layer / HCI Version

HCI version : 0x09 *1

HCI revision : 0x000b

Link Layer version : 0x09 *1

Link Layer subversion : 0x1908

Manufacturer ID : 0x0036

Host stack Version

major version : 0x0d

minor version : 0x19

subminor version : 0x08

BLE FIT module Version

major | minor version : 0x00010000 *2

lib type : 0x00000001 *3

*1 : The version number defined by Bluetooth SIG (https://www.bluetooth.com/specifications/assigned-numbers).

The version number 0x09 shows Bluetooth 5.0 . *2 : The upper 2 bytes shows the major version and the lower 2 bytes shows the minor version. *3 : 0: All features, 1: Balance, 2: Compact

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5.1.2 Vendor Specific (VS) command

(1) Tx Power command

txp command

Format :

vs txp [operation] [conn_hdl] {params,...}

Set / Get the transmit power.

Parameters :

[operation] Transmit power operation.

set : Set the transmit power.

get : Get the transmit power.

[conn_hdl]

Connection handle identifying the connection whose transmit power to be set or retrieved.

Inputting 0xFFFF sets / gets the transmit power in the non-connected state.

{params,...}

[operation] : set Parameter1 : Tx power level to be set.

0 : High 1 : Middle 2 : Low

[operation] : get Not used.

Example :

vs txp set 0xFFFF 0

Set the non-connected state transmit power to the High level.

vs txp get 0x0026

Get the transmit power of the connection (connection handle : 0x0026).

(2) Coded Scheme command

scheme command

Format :

vs scheme [type]

Set the coding scheme of the Coded PHY.

Parameters :

[type]

Coding scheme for Primary advertising PHY, Secondary advertising PHY, request for connection establishment. This parameter is set to a bitwise OR of the following values.

By default, S=8 coding scheme is enabled.

bit0 : Coding scheme for Primary Advertising PHY(0:S=8/1:S=2).

bit1 : Coding scheme for Secondary Advertising PHY(0:S=8/1:S=2).

bit2 : Coding scheme for Connection(0:S=8/1:S=2).

Example :

vs scheme 7

Set coding scheme for Primacy Advertising, for Secondary Advertising, and for Connection to S=2.

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(3) Extended Direct Test Mode(DTM) command

test command

Format :

vs test [operation] {params, ...}

DTM test command.

Parameters :

[operation]

DTM test operation. Select one of the followings.

tx : Start DTM transmitter test.

Set "channel", "length", "payload", "phy", "tx_power", "option" and "number of packet" to {params, ..,}.

rx : Start DTM receiver test.

Set "channel" and "phy" to {params, ...}.

end : Terminate DTM test.

No parameter.

{params, ...}

[operation] : tx

Parameter1 : Channel used in Tx test.

Valid range is 0 to 39. Frequency range is 2402 MHz to 2480 MHz.

Parameter2 : Length(in bytes) of the packet used in Tx Test.

Valid range is 0 to 255.

Parameter3 : Packet Payload.

Valid range is 0x00-0x07.

If the Parameter6 is set to "non-modulation", this parameter is ignored.

Payload type: 0x00 : PRBS9 sequence '11111111100000111101..'. 0x01 : Repeated '11110000' 0x02 : Repeated '10101010' 0x03 : PRBS15 sequence 0x04 : Repeated '11111111' 0x05 : Repeated '00000000' 0x06 : Repeated '00001111' 0x07 : Repeated '01010101'

Parameter4 : Transmitter PHY used in test. Select one of the following. If the Parameter6 is set to "non-modulation", this parameter is ignored. If the Parameter6 is configured to "modulation" and "continuous transmission", 0x03 : Coded PHY (S=8) and 0x04 : Coded PHY (S=2) are not supported.

0x01 : 1M PHY 0x02 : 2M PHY 0x03 : Coded PHY (S=8) 0x04 : Coded PHY (S=2)

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Parameters :

{params, ...}

Parameter5 : Tx Power Level used in DTM Tx Test. Select one of the following. 0x00 : High 0x01 : Middle 0x02 : Low

Parameter6 : The test option configuration. This parameter is set to a bitwise OR of the following bits. bit0 : 0:modulation, 1:non-modulation bit1 : 0:packet transmission, 1:continuous transmission

Parameter7 : The number of packets to be sent. Valid range is 0x0000-0xFFFF. If the Parameter6 is configured to "continuous transmission", this parameter is ignored. If this parameter is set to 0x0000, the packets are continuously transmitted until test end command is issued.

[operation] : rx

Parameter1 : Channel used in the test. Valid range is 0 to 39. Frequency range is 2402 MHz to 2480 MHz.

Parameter2 : Receiver PHY used in the test. Select one of the following. 0x01 : 1M PHY

0x02 : 2M PHY 0x03 : Coded PHY

The coding scheme (S=8/S=2) doesn't need to be specified in the receiver test.

[operation] : end

Not used.

Example :

vs test tx 39 251 1 3 1 0 1

Start DTM transmitter test. CH : 39ch

Packet length : 251 bytes payload : Repeated '11110000' sequence phy : Coded PHY(S=8) tx_power : Middle option : modulation packet transmission num_of_packet : 1

vs test rx 39 2

Start DTM receiver test.

CH : 39ch

phy : 2M PHY

vs test end

Terminate DTM test.

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(4) BD Address command

addr command

Format :

vs addr [operation] [area] {params...}

Set/Get the address of the local device.

Parameters :

[operation]

Address operation. Select one of the followings.

set : Set an address to the local device. Set address type and address to {params...} . If [area] is "df", the address is enabled after reset.

get : Get the address of the local device. Set the address type to {params...}.

[area]

The area where the address is stored.

curr : The temporary area storing the address.

df : The area storing the address in the Data Flash.

{params...}

[operation] : set

Parameter1 : Address type

pub : Public Address

rnd : Random Address

Parameter2 : Address

[operation] : get

Parameter1 : Address type

pub : Public Address

rnd : Random Address

Example :

vs addr set df pub 78:90:50:00:95:a8

Set the public address : 78:90:50:00:95:a8 to the Data Flash.

vs addr get curr pub

Get the current public address.

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(5) Random Number generation command

rand command

Format :

vs rand [rand_size]

Generate a random number.

Parameters :

[rand_size]

Specify the size of the random number to be generated.

Range: 4 to 16 [bytes].

Example :

vs rand 16

Generate a 16 bytes random number.

(6) Scan Channel command

scan_ch_map command

Format :

vs scan_ch_map [operation] {params,...}

Set/Get the scan channel map.

Parameter :

[operation]

Scan Channel operation. Select one of the followings.

set : Set the channel map specified by {params,...} as scan channel. get : Get the current scan channel map.

{params,...}

[operation] : set

Parameter 1 : The channel map to be set. It is a bitwise OR of the following values.

bit 0 : 37 ch bit 1 : 38 ch bit 2 : 39 ch other than the above : reserved

[operation] : get

“Get” operation does not use parameter.

Example :

vs scan_ch_map set 7

Set 37, 38, 39ch as scan channel.

vs scan_ch_map get

Get the current scan channel map.

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5.1.3 SYS command

(1) MCU Software Standby command

stby command

Format :

sys stby [operation]

Control the software standby mode.

Parameters :

[operation]

Software standby operation. Select one of the followings.

on : Enter the software standby mode.

off : Come back from the software standby mode.

get : Get the current software standby status.

Example :

sys stby on

Enter the software standby mode.

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5.1.4 BLE command

(1) BLE protocol stack Reset command

stby command

Format :

ble reset

Reset the BLE protocol stack.

Parameters :

None

Example :

ble reset

(2) BLE protocol stack Close command

stby command

Format :

ble close

Terminate the BLE protocol stack. To restart the BLE protocol stack, execute “ble reset” command.

Parameters :

None

Example :

ble close

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5.2 Security Data Management

The security data management feature manages the following data in the E2 DataFlash(hereafter data flash) area.

• Local device key to distribute during pairing

• Key and information obtained from the remote device during pairing

The local device key and remote device key stored in the data flash can be reconfigured in the BLE Protocol Stack using the security data management API.

The Abstraction API uses the security data management API to manage security data for local and remote devices.

The security data management feature is set using the configuration options shown in Table 5.4.

Table 5.4. Security data management configuration options

Configuration Options

Description

BLE_CFG_EN_SEC_DATA Default : "1"

Enable or disable the security data management. The bonding information is stored in the Data Flash block specified by

"BLE_CFG_SECD_DATA_DF_BLOCK" by this option.

0: Disable 1: Enable

If this option is enabled, add the Data Flash FIT module.

BLE_CFG_SECD_DATA_DF_BLOCK Default : "0"

The Data Flash block for the security data management to store the bonding information.

Range : 0 to 7

Specify a block number different from the block number specified by BLE_CFG_DEV_DATA_DF_BLOCK.

BLE_CFG_NUM_BOND Default : "7"

Maximum number of the bonding information stored in the Data Flash. Range : 1 to 7

The security data management feature manages security data management information, local device security data, and remote device security data. The memory map in the data flash is as shown in Figure 5.1.

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Local device security data

(40 bytes)

Remote device security data 1

(88 byte)

●

Maximum number of BLE_CFG_NUM_BOND specified data

Security data management

information

(8 bytes)

Block0

Block1

Block2

Block3

Block4

Block5

Block6

Block7

data area 1block = 1KB

E2 DataFlash

Read address

0010 0000h

0010 1FFFh

BLE_CFG_DF_BLOCK_SEC_DATA = 0 Use Block0 for security data management

Remote device

security data 2

(88 byte)

Figure 5.1. Memory map of security data in data flash

Each data information is described below.

5.2.1 Security data management information

This area stores information related to security data. The structure and structure elements of security data management information are shown in Figure 5.2 and Table 5.5. This data is handled internally by the security data management feature and does not need to be updated by the user application.

magic_num(32 bits)

31 28 24 20 16 12 8 4 0

bond_cnt(8 bits)padding(24 bits)

Figure 5.2. Security data management information structure

Table 5.5. Security management information structure elements

Type

Element Name

size

[bytes]

Description

uint32_t

magic_num

Magic number of security data. Check whether security data is written. Fixed to 0x12345678. 0xFFFFFFFF when not written.

uint8_t

bond_cnd

Number of bonding information stored.

uint8_t

padding[3]

Padding

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5.2.2 Local device security data

The security data structure and structure elements of the local device are shown in Figure 5.3 and Table 5.6.

31 28 24 20 16 12 8 4 0

padding

Local IRK(128 bits)

Local CSRK(128 bits)

Local Identity Address(56 bits)

Figure 5.3. Local device security data structure

Table 5.6. Local device security data structure elements

Element Name

size

[bytes]

Description

Local Identity Resolving Key (IRK)

IRK distributed to remote devices during pairing. Resolvable Private Address (RPA) is used when generating

by Privacy feature.

Local Connection Signature Resolving Key (CSRK)

CSRK distributed to remote devices during pairing. Used when sending with signed data.

Local Identity Address

The local device that informs the remote device during pairing Identity Address.

Padding

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The following describes security data settings for local devices.

• IRK and CSRK generate and set a 16-byte random number.

• To set BLE Protocol Stack, use R_BLE_GAP_SetLocIdInfo() (IRK, Identity Address) and R_BLE_GAP_SetLocCsrk()

(CSRK).

• Write to the data flash using R_BLE_SECD_WriteLocInfo().

• Read from the data flash using R_BLE_SECD_ReadLocInfo().

• Delete from the data flash using R_BLE_SECD_DelLocInfo().

By using security data management API, the generated security data can be written to data flash. It is possible to reconfigure to BLE Protocol Stack after reboot device. Figure 5.4 shows an example of local device security data setting processing that is performed when the BLE Protocol Stack is started.

Start

Is there local device

security data

on data flash?

Read security data of

local device from data flash

Set Local IRK, CSRK,

Identity Address to

BLE Protocol Stack

Start

Generate Local IRK,

CSRK

Write local device security

data to data flash

Yes

Figure 5.4. Example of setting local device security data

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5.2.3 Remote device security data

The structure and structural elements of the remote device security data are shown in Figure 5.5 and Table

5.7.

31 28 24 20 16 12 8 4 0

remote key address(32 bits)

Remote LTK(128 bits)

Remote EDIV and Rand(80 bits)

Remote Address(56 bits)

padding(8 bits)

ekey_size(8 bits) bonding(8 bits) pair_mode(8 bits) security(8 bits)

keys(8 bits)padding(24 bits)

Remote CSRK(128 bits)

Remote Identity Address(56 bits)

padding(24 bits)

Remote IRK(128 bits)

Figure 5.5. Remote device security data structure

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Table 5.7. Remote device security data structure elements

Element Name

size

[bytes]

Description

Remote Address

BD address used by remote device during pairing.

security

Security level of the pairing performed.

0x01: Perform pairing with Unauthenticated pairing. 0x02: Perform pairing with Authenticated pairing

pair_mode

Type of pairing performed.

0x01: Perform pairing with Legacy Pairing. 0x02: Perform pairing with Secure Connections.

bonding

Bonding policy of remote device.

0x00: Indicates that remote device does not bonding performed. 0x01: Indicates that remote device is bonding performed.

ekey_size

Size of LTK.

remote key address

Start address of the data flash to store the remote device key (Remote LTK to Remote CSRK).

keys

Type of key distributed by remote device.

Remote LTK

LTK distributed by remote device. Used for connection encryption.

Remote EDIV and Rand

EDIV and Random number distributed by the remote device. Used for connection encryption.

Remote IRK

IRK distributed by remote device. Used for address resolution when the remote device uses the privacy feature.

Remote Identity Address

Identity address of remote device. Used for address resolution when remote device uses the privacy feature.

Remote CSRK

CSRK distributed by remote device. Used when receiving signed data.

The following describes security data settings for remote devices.

• The remote device security data is received during pairing.

• security, pair_mode, bonding, and ekey_size in Table 5.7 are written to data flash by

R_BLE_SECD_WriteRemKeys() at the BLE_GAP_EVENT_PAIRING_COMP event. Other data is written to the data flash with R_BLE_SECD_WriteRemKeys() at the BLE_GAP_EVENT_PEER_KEY_INFO event.

• R_BLE_SECD_Init() reads the remote device security data from data flash and calls R_BLE_GAP_SetBondInfo() to set remote device security data in the BLE Protocol Stack.

• Delete from the data flash using R_BLE_SECD_DelRemKeys().

• If number of data written to data flash exceeds number specified by BLE_CFG_NUM_BOND macro, oldest security

data entry is overwritten.

By using security data management API, the received remote device security data can be written to data flash. It is possible to reconfigure to BLE Protocol Stack after reboot device.

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5.3 RF communication timing notification

The RF communication timing notification function notifies the user application layer of the timing before and after BLE RF communication is performed with a callback. Callback notification before and after transition to RF sleep mode can also be performed.

For the RF communication timing notification feature, you can select the BLE RF event type to be executed and whether to enable or disable the timing notification at before and after BLE RF event.

Note: This function performs a callback within the BLE Protocol Stack software task processing. Therefore,

callback notification is delayed from the actual RF communication timing. In addition, the delay time may not be constant depending on the operating frequency of the MCU, the interrupts of other peripheral functions, and the processing contents of the user application.

Table 5.8 shows the event types that can be notified.

Table 5.8. RF communication timing notification event type

Event Types

Description

Connection event start / event close

Callback notification at start or close of the Connection event. <Configuration options>

• BLE_CFG_EVENT_NOTIFY_CONN_START

• BLE_CFG_EVENT_NOTIFY_CONN_CLOSE

Advertising event start / event close

Callback notification at start or close of the Advertising event. <Configuration options>

• BLE_CFG_EVENT_NOTIFY_ADV_START

• BLE_CFG_EVENT_NOTIFY_ADV_CLOSE

Scan event start / event close

Callback notification at start or close of the Scan event. If Scan Interval is the same value as Scan Window, callback notification is not

performed. <Configuration options>

• BLE_CFG_EVENT_NOTIFY_SCAN_START

• BLE_CFG_EVENT_NOTIFY_SCAN_CLOSE

Initiator event start / event close

Callback notification at start or close of the Initiator event. If Scan Interval is the same value as Scan Window, callback notification is not

performed. <Configuration options>

• BLE_CFG_EVENT_NOTIFY_INIT_START

• BLE_CFG_EVENT_NOTIFY_INIT_CLOSE

RF sleep mode start / wakeup

Callback notification at start or wakeup of the RF sleep mode. <Configuration options>

• BLE_CFG_EVENT_NOTIFY_DS_START

• BLE_CFG_EVENT_NOTIFY_DS_WAKEUP

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5.3.1 Connection event notification timing

The Connection event notification is callback at the RF communication timing for each Connection Interval. Figure 5.6 shows the connection event notification timing.

Tx Rx Tx Rx

Connection Interval

Connection Event

Start

Connection Event

Master

Rx Tx Rx Tx

Connection Interval

Slave

Connection Event

Start

Connection Event

Start

Connection Event

Start

Connection Event

Figure 5.6. Connection event notification timing

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5.3.2 Advertising event notification timing

The Advertising event notification is callback at the RF communication timing for each Advertising Interval. Figure 5.7 shows the advertising event notification timing.

Tx Rx

Advertising Interval

Tx Rx Tx Rx

37ch 38ch 39ch

Tx Rx Tx Rx Tx Rx

37ch 38ch 39ch

Advertising Event

Start

Advertising Event

Start

Figure 5.7. Advertising event notification timing

5.3.3 Scan / Initiator event notification timing

The Scan / Initiator event notification is callback at the RF communication timing for each Scan Interval. Figure 5.8 shows the Scan / Initiator event notification timing. Note: If Scan Interval is the same value as Scan Window, callback notification is not performed.

Scan Interval

37ch

38ch

39ch

Scan Interval

Scan Window Scan Window Scan Window

Scan Interval

Scan Event

Start

Scan Event

Start

Scan Event

Start

Scan Event

Figure 5.8. Scan / Initiator event notification timing

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5.3.4 RF sleep mode event notification timing

When BLE_CFG_RF_DEEP_SLEEP_EN macro is set to 1 (Enable) and the time until the next RF event is longer than a certain time, the RF sleep mode transition is performed in the scheduler of the BLE Protocol Stack.

The RF sleep mode event notification is callback when there is an RF sleep mode state transition between each RF events.

Figure 5.9 shows the RF sleep mode event notification timing during Advertising execution.

Tx Rx

Advertising Interval

Tx Rx Tx Rx

37ch 38ch 39ch

Tx Rx Tx Rx Tx Rx

37ch 38ch 39ch

Advertising Event

Start

Advertising Event

RF Sleep Mode

Wakeup

RF Sleep Mode

Start

RF Sleep Mode

Wakeup

RF Sleep Mode

Start

Advertising Event

Start

Figure 5.9. RF sleep mode event notification timing during Advertising

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5.3.5 RF communication timing notification specifications

RF communication timing notification is enable/disable using the configuration options shown in Table 5.8. For an overview of each option, see “4.1 Configuration options”.

The timing notification callback function is registered in r_ble_pf_functions.c. Add processing within each callback function as necessary.

Note: When processing with a large cycle is added, the throughput performance may be affected.

Table 5.9 outlines the RF communication timing notification callback function.

Table 5.9. RF communication timing notification callback functions

Callback functions

Description

void r_ble_rf_notify_event_start(uint32_t param)

Notification callback function for each RF event start.

Parameter: uint32_t param

[31:16] Event type (see Table 5.10) [15: 0] Event identification code (see Table 5.11)

void r_ble_rf_notify_event_close(uint32_t param)

Notification callback function for each RF event close.

Parameter: uint32_t param

[31:16] Event type (see Table 5.10) [15: 0] Event identification code (see Table 5.11)

void r_ble_rf_notify_deep_sleep(uint32_t param)

Notification callback function for RF sleep mode start/wakeup event.

Parameter: uint32_t param

0x1: RF sleep mode wakeup (return from RF sleep mode) 0x0: RF sleep mode start (transition to RF sleep mode)

Table 5.10. RF communication event type definition macros

Event Type

Macro Name

Defined Value

Connection event

BLE_EVENT_TYPE_CONN

0x0000

Advertising event

BLE_EVENT_TYPE_ADV

0x0001

Scan event

BLE_EVENT_TYPE_SCAN

0x0002

Initiator event

BLE_EVENT_TYPE_INITIATOR

0x0003

Table 5.11. RF communication event identification code

Event Type

Identification code

Connection event

Set the executed connection handle (conn_hdl).

Advertising event

Set the executed advertising handle (adv_hdl).

Scan event

Set 0x0000

Initiating event

Set 0x0000

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5.4 Device-specific Data Management

Bluetooth Device Address (hereinafter referred to as BD address) used by BLE Protocol Stack can be written as device-specific data in the user area (ROM) or data area (E2 DataFlash) of flash memory. This allows user to set different BD address for multiple RX23W devices using the same firmware.

Device-specific data is placed in a different area from the firmware program area. If the device-specific data is not deleted when rewriting the firmware, the same BD address can be used continuously. If the devicespecific data is deleted, determine the BD address according to “5.4.6 BD address adoption flow”.

5.4.1 Specifying Device-specific data location block

The block number of the user area (ROM) and data area (E2 data flash) where device-specific data is located can be specified with the BLE_CFG_DEV_DATA_CF_BLOCK and BLE_CFG_DEV_DATA_DF_BLOCK configuration options in r_ble_rx23w_config.h.

The block number of user area is block 0 at end of address (0xFFFFF800) and block 255 at beginning of address (0xFFF80000). The block number of data area is block 0 at beginning of address (0x00100000) and block 7 at end of address (0x00101C00).

Figure 5.10 shows the block configuration of RX23W.

Block 255

user area(ROM)

1Block = 2KB

0xFFF80000

Block 191

: :

0xFFFA0000

Block 0

0xFFFFF800

: :

Block 0

Block 7

: : :

0x00100000

0x00101C00

data area

(E2 DataFlash)

1Block = 1KB

Block 15

0xFFFF8000

Start-Up Program Protection area

Figure 5.10. RX23W flash memory block configuration

When placing device-specific data in user area, it is necessary to specify blocks that are not used in program code. In addition, it is necessary to write device-specific data to the top address in specified user area block.

When using RX23W Start-Up Program Protection function, do not place device-specific data in blocks 0 to 15 of user area.

When placing device-specific data in data area, device-specific data is written to top address in specified data area block. Do not write other data to the block where device-specific data is placed.

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5.4.2 Device-specific data format

Table 5.12 shows the device-specific data format.

Table 5.12. device-specific data format

Offset

Size[bytes]

Type

Description

0 4 uint32_t

Data length after magic number (fixed to 0x00000010)

4 4 uint32_t

Magic number (fixed 0x12345678)

8 6 uint8_t [6]

Public BD address

14 6 uint8_t [6]

Random BD address

Each data must be written in little endian. For example, if BD address is “01:02:03:04:05:06”, write to the flash memory in the order of 0x06,0x05,0x04,0x03,0x02,0x01.

Figure 5.11 shows an example of device-specific data flash memory layout.

0x0000 0x10

+1 +2 +3 +4 +5 +6 +7

0x00 0x00 0x00 0x78 0x56 0x34 0x12

0x06 0x05 0x04 0x03 0x02 0x01 0xD6 0xD5

0xD4 0xD3 0xD2 0xD1 ... ... ... ...

0x0008

0x0010

offset

Data Length

Magic Number

Public BD Address

Random BD Address

0x00000010

0x12345678

01:02:03:04:05:06

D1:D2:D3:D4:D5:D6

Figure 5.11. Device-specific data flash memory layout

5.4.3 Writing to user area (ROM)

To write device-specific data to user area (ROM), use Renesas Flash Programmer (RFP) unique code function to write to user area at the same time as firmware program data.

Figure 5.12 shows an overview of writing device-specific data using RFP.

0xFFFF8000 (Block 255)

BLE firmware

(mot file)

Device-specific

Data

(ruc file)

0xFFFFF800 (Block 0)

User area (ROM)

BLE firmware

program

0xFFFF7800 (Block 16)Device-specific Data

Write program file

Write unique code

Figure 5.12. Writing device-specific data using RFP

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Figure 5.13 shows an example of setting device-specific data for RFP Unique Code (ruc) file.

format hex

area user flash

address 0xFFFF7800

size 20

index data

000001 1000000078563412060504030201D6D5D4D3D2D1

000002 10000000785634120C0B0A090807E6E5E4E3E2E1

Figure 5.13. Setting device-specific data for RFP Unique Code

5.4.4 Writing to data area (E2 DataFlash)

Use the R_BLE API R_BLE_VS_SetBdAddr() to write device-specific data to data area. For HCI mode firmware, write using the Public BD address writing tool (BDAddrWriter). When device-specific data is written to the data area, BD address written by reboot once RX23W is adopt.

5.4.4.1 Write to data area using R_BLE API

Write to the data area using R_BLE_VS_SetBdAddr().

Refer to “R_BLE API document (r_ble_api_spec.chm)” for details of API. In the demo project, BD address can be written from the command line using the “BD Address command”.

Index

ROM address of the block specified by

BLE_CFG_DEV_DATA_CF_BLOCK

Data

Length

(Fixed)

Magic

Number

(Fixed)

Public

BD address

(Unique)

Random

BD address

(Unique)

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5.4.4.2 Write to data area using BDAddrWriter tool

User can write Public BD address to data area by using Public BD address writing tool (BDAddrWriter) for the RX23W device with HCI mode firmware.

Note: BDAddrWriter does not support Random BD address writing. The procedure for writing Public BD address using BDAddrWriter tool is shown below.

1. Select COM port connected to RX23W.

2. Set UART baud rate. If it is not in the list, input value manually.

3. Input Public BD address you want to write in text box. Input 12 digits (6 bytes) of hexadecimal character string (0-9, a-f, A-Z) to need. Discards non-hexadecimal character strings when writing.

4. Click [Write] button.

5. If writing is successful, the message box “Success !!” is displayed. Public BD address written by reboot RX23W device once is adopt.

Figure 5.14. BD address writing procedure

(1)

(2)

(3)

(4)

(5)

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5.4.5 RX23W flash memory protection function

RX23W has a flash memory protection function. Flash memory protection prevents the flash memory from being read or rewritten by the third party. For details of flash memory protection function, refer to “RX23W Group User's Manual: Hardware (R01UH0823) 50.9 Flash Memory Protection”.

When using serial programmer such as RFP to write new firmware without erasing device-specific data, it is necessary to enable boot mode ID code protection of RX23W so that block selection for flash memory erasing can be performed.

To enable boot mode ID code protection, set 0x45 or 0x52 to ID code protection control code, and set any ID code 1 to 15.

Note: When setting the control code to 0x52, if the ID codes 1 to 15 are forgotten, the firmware cannot be rewritten by the

serial programmer.

The ID code protection control code and ID code settings can be changed from [ID code 1] to [ID code 4] by selecting [r_bsp] from [Components] tab of Smart Configurator.

Figure 5.15. BSP configuration option setting screen

ID code protection is written to ID code protection area (address 0xFFFFFFA0) in user area when writing firmware. However, when debug connection from the e2 studio using E2 or E1 emulator, even if ID code protection is set in firmware, ALL 0xFF is set in the ID code protection area and ID code protection is disabled.

When ID code protection is disabled, all blocks in the user area and data area are erased once when writing firmware with RFP.

Therefore, when performing debug connection in integrated development environment, remember BD address written in the user area or data area, rewrite device-specific data again after flash memory is erased.

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5.4.6 BD address adoption flow

BLE Protocol Stack adopts initial value of BD address in following priority order in R_BLE_Open() API. (1) Data area (E2 data flash) specified block

(2) User area (ROM) specified block (3) Firmware initial value (BLE_CFG_RF_DBG_PUB_ADDR or BLE_CFG_RF_DBG_RAND_ADDR)

For Random BD address, if BD addresses for all areas are not specified, static address is generated from Unique ID of MCU. Generated static address can be get with the R_BLE_VS_GetBdAddr() API.

Note: The generated static address is a fixed value that does not change when the MCU power off or reset. Note: A static address consists of random numbers. The possibility of duplicate values with other devices is not zero.

Even after BD address is adopts, the BD address can be changed again with R_BLE_VS_SetBdAddr() API. Figure 5.16 shows BD address adoption flow of BLE Protocol Stack.

Data area BD address is

not ALL0x00 or 0xFF

Start

Data area block

specification enabled

Match magic number

in data area

Adopt BD address

of data area

User area block

specification enabled

Match magic number

in user area

User area BD address is

not ALL0x00 or 0xFF

Yes

Adopt BD address

of user area

Adopt BD address

of BLE_CFG_RF_DBG_XXX_ADDR

BLE_CFG_RF_DBG_XXX_ADDR

is not ALL0x00 or 0xFF

Adopt 74:90:50:FF:FF:FF

Yes

Public

BD address

Generate static address

from MCU unique ID

(Fixed value of MCU)

Yes

Figure 5.16. BD address adoption flow of BLE Protocol Stack

Since BLE Protocol Stack does not check format of BD address written in each area (1)-(3), when setting static address, set value that matches the format shown in Figure 5.17.

Figure 5.17. Static address format

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6. HCI Mode

HCI (Host Controller Interface) mode is firmware for RF characteristics evaluation or BTTS (Bluetooth Test Tool Suite: R01AN4554). BLE communication can be performed by sending HCI commands from the host device connected to the serial interface such as a PC to the RX23W microcomputer. HCI event corresponding to BLE communication is sent from RX23W to the host device.

HCI mode conforms to Bluetooth Core Spec ver5.0.

HCI mode RX23W board

Serial Interface

HCI command

HCI event

Figure 6.1. HCI mode evaluation board and PC connection

6.1 Software Structure

Figure 6.2 shows the HCI mode software structure. User applications cannot be implemented in HCI mode.

BLE Protocol Stack(HCI mode)

Link Layer

HCI

Scheduler

HCI Transport

Host Device

(e.g. Windows PC, RF Tester)

UART

UART Driver

Figure 6.2. HCI mode software structure

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6.2 Demo Project

The demo project for HCI mode is included in FITDemos folder of Bluetooth Low Energy Protocol Stack Basic Package. This project can also be used as base project for HCI mode firmware.

Table 6.1 shows sample project in HCI mode.

Table 6.1. Demo project for HCI mode

File Name

Description

ble_demo_rsskrx23w_uart_hci.zip

HCI mode project for RSSK (RX23W 85 pin BGA)

ble_demo_tbrx23w_uart_hci.zip

HCI mode project for Target Board for RX23W (RX23W 56-pin QFN)

ble_demo_tbrx23wmodule_uart_hci.zip

HCI mode project for Target Board for RX23W module (RX23W module 83-pin LGA)

Table 6.2 shows the file contents of demo project for HCI mode.

Table 6.2. Demo project for HCI mode file contents

ble_demo_XXrx23w(module)_uart_hci.zip

XX: rssk or tb

.cproject

e2 studio project file

.project

e2 studio project file

ble_demo_section_rom384kb.esi

Section information file for ROM384KB

ble_demo_section_rom512kb.esi

Section information file for ROM512KB

ble_demo_XXrx23w_uart_hci.launch

Debug information file

ble_demo_XXrx23w_uart_hci.scfg

Smart configurator setting file

ble_demo_XXrx23w_profile_client.ewd

IAR debugger configuration file

ble_demo_XXrx23w_profile_client.ewp

IAR project file

ble_demo_XXrx23w_profile_client.eww

IAR workspace file

lnkr5f523w7.icf

IAR R5F23W7xxxx linker configuration file

lnkr5f523w8.icf

IAR R5F23W8xxxx linker configuration file

src\

app_main.c

HCI mode main code

smc_gen\

Code generation folder (contents omitted)

uart_hci\

UART driver folder

r_ble_dtc.c

DTC control driver source file

r_ble_dtc.h

DTC control driver header file

r_ble_uart_hci.c

SCI control driver source file

r_ble_uart_hci.h

SCI control driver header file

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In HCI mode, following files and folders of BLE FIT module need to be excluded from build targets. When creating HCI mode by new project, set following files and folders to be excluded from build targets.

src\smc_gen\r_ble_rx23w\src\platform\r_ble_pf_lowpower.c src\smc_gen\r_ble_rx23w\src\app_lib

Note: Exclude entire folder from build

⚫ e2studio As shown in Figure 6.3, right-click relevant file or folder on e2 studio, select [Properties], check ON [Exclude

resource from build], and click [Apply and Close] button.

Figure 6.3. excluded from build targets of e2 studio

⚫ IAR Embedded Workbench for Renesas RX As shown in Figure 6.4, right-click relevant file or folder on IAR Embedded Workbench for Renesas RX, select

[Options], check ON [Exclude from build], and click [OK] button.

Figure 6.4. excluded from build targets of IAR Embedded Workbench for Renesas RX

In HCI mode, data flash FIT module (r_flash_rx v4.10 or later) is used as an optional function.

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6.2.1 Change device type of project

In the demo project, RX23W 512KB device (R5F523W8xxxx) is selected. This section explains how to change ble_demo_rsskrx23w_uart_hci.zip (R5F523W8AxBL) to BGA384KB

device (R5F523W7AxBL).

1. Select [Project]→[Change Device] from the menu.

2. Select new RX23W device (85pin R5F523W7AxBL in this example) to be changed and click [Next] button.

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3. Click [Next] button

4. Confirm that all items are checked and click [Finish] button.

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5. Click [Generate Code] button in Smart Configurator. Code generation for the modified device is performed.

6. Select [Project] → [Properties] from the menu, open [C/C++ Build] → [Settings] → [Tool Settings] → [Linker] → [Input], change library file name as bellow.

Note: This change is required every time [Generate Code] from Smart Configurator.

Change before: "${workspace_loc:/${ProjName}/src/smc_gen/r_ble_rx23w/lib/lib_ble_ps_ccrx.lib}" Change after: "${workspace_loc:/${ProjName}/src/smc_gen/r_ble_rx23w/lib/lib_ble_ps_hci_ccrx.lib}"

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7. Click [Linker] → [Section] → […] button, and click [Import] button,

select “ble_demo_section_rom384kb.esi” file, click [Open] button. Note: For 512KB devices, select the “ble_demo_section_rom512kb.esi” file.

8. Set SCI channel and port number of board environment to be used. Refer to “6.3.1 Configuration Options of UART Driver” for setting details.

9. Build the project. If build error occurs, review each setting.

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6.3 UART Driver

In HCI mode, UART (Universal Asynchronous Receiver/Transmitter) communication is performed using RX23W Serial Communication Interface (SCIg, SCIh) and Data Transfer Controller (DTCa) peripheral functions.

In HCI mode, dedicated UART driver is prepared and UART driver APIs are used from BLE Protocol Stack. Table 6.3 shows the UART driver file contents in HCI mode.

Table 6.3. UART driver file contents

File Name

Description

r_ble_dtc.c

DTC control driver source file

r_ble_dtc.h

DTC control driver header file

r_ble_uart_hci.c

SCI control driver source file

r_ble_uart_hci.h

SCI control driver header file *1

*1: When changing the SCI channel, this file need to edit.

6.3.1 Configuration Options of UART Driver

UART driver can change SCI channel, UART baud rate, etc. by each configuration options in the “r_ble_uart_hci.h” file. Edit this file directly to change configuration options.

For each configuration options, setting location branches depending on the value of BLE_CFG_BOARD_TYPE macro in “r_ble_rx23w_config.h” file.

When setting in customer board environment, set “0” to BLE_CFG_BOARD_TYPE macro. Table 6.4 outlines UART driver configuration.

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Table 6.4. UART driver configuration (when BLE_CFG_BOARD_TYPE is 0)

No.

Macro Name

Default

Description

SCI_CHANNEL

Set SCI channel number.

1: SCI1 5: SCI5 8: SCI8 12: SCI12

SCI_INTR_PRIORITY

Sets SCI interrupt priority level.

Range: 1 (low priority) to 15 (high priority)

SCI_CTS_RTS_EN

Sets SCI CTS/RTS function.

0: CTS/RTS disable 1: RTS enable 2: CTS enable

SCI_RXD_PIN_X SCI_RXD_PIN_Y

3 0

Set port number used at SCI RXD. Example:

P30: X=3, Y=0 PC6: X=C, Y=6

SCI_TXD_PIN_X SCI_TXD_PIN_Y

2 6

Set port number used at SCI TXD. Example:

P26: X=2, Y=6 PC7: X=C, Y=7

SCI_CTS_RTS_PIN_X SCI_CTS_RTS_PIN_Y

3 1

When SCI_CTS_RTS_EN is 1, set port number used at SCI CTS/RTS.

Example:

P31: X=3, Y=1 PC4: X=C, Y=4

DBG_CALC_BAUDRATE

Enable

When this macro is enabled, the register setting value corresponding to UART baudrate is automatically calculated.

When this macro is disabled, SCI Bit Rate Register (BRR) and Modulation Duty Register (MDDR) must be set manually.

DBG_BAUDRATE_SWIT CH

Enable

When this macro is enabled, the input status of the port specified by SCI_BR_SW_PIN_X and SCI_BR_SW_PIN_Y is checked when UART driver is initialized, and the baudrate is switched according to the input level.

Input level low: Select D_UART_BR_SWITCH Input level high: Select D_UART_BR

D_UART_BR

115200

Sets the initial baudrate when DBG_CALC_BAUDRATE macro is enabled.

D_UART_BR_SWITCH

2000000

Sets the baudrate for switching when DBG_CALC_BAUDRATE and DBG_BAUDRATE_SWITCH macros are enabled.

SCI_BR_SW_PIN_X SCI_BR_SW_PIN_Y

1 4

Sets the port number to check the input level when the DBG_CALC_BAUDRATE and DBG_BAUDRATE_SWITCH macros are enabled.

Example:

P14, X=1, Y=4

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7. Appendix

7.1 Firmware writing procedure for Target Board for RX23W (retaining device-

specific data)

This section describes how to write firmware program files (mot files, etc.) created by building to the RX23W device using Renesas Flash Programmer (hereinafter referred to as RFP).

Note: Use RFP v3.06.00 or later. The following shows the procedure for writing firmware while retaining device-specific data by RFP for Target

Board for RX23W (hereinafter referred to as TB). In order to retain device-specific data, it is prerequisite that firmware with ID code protection enabled is already written.

1. Switch ESW1-2 dip-switch on the TB to “ON” side and connect Windows PC and ECN1 connector with USB A-microB cable.

2. Start RFP and select [File] → [New Project].

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3. In [Create New Project] window, make following settings and click [Connect] button.

• Microcontroller: RX200

• Project Name: Input any project name

• Project Folder: Select any folder

• Communication Tool: Select “E2 emulator Lite”, Interface: Select “FINE”

• Power: Select “None” (Selected by default)

4. If firmware with valid ID protection code is written, user will be prompted to input ID Code in [Set ID Code] window. In that case, input ID code that has been written and click [OK] button. Example here, ID code “45FFFFFFFFFFFFFFFFFFFFFFFFFFFFFF” is input. If the user has changed ID code, input an appropriate value.

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5. If the connection is successful, “Operation completed.” is displayed.

6. Click [Browse] button → Select program file (e.g. mot file) → Click [Open] button.

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7. In [Block Settings] tab, set the following so that the device-specific data already written is not erased.

• User area (ROM): Turn OFF [Erase] and [P.V] check box for the block specified in

BLE_CFG_DEV_DATA_CF_BLOCK (Block 16 in the example)

Note: When this check box is turned OFF, unique code writing to specified block cannot be performed. If user want to

write a unique code to the specified block, change these check box to ON.

• Data area (E2 DataFlash): Turn OFF [Erase] and [P.V] check box for all Data Flash blocks.

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8. In [Operation Settings] tab, select “Erase Selected Blocks” in [Erase Options] combo box. (Selected by default)

9. Click [Start] button in [Operation] tab to start writing the firmware.

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10. When the firmware has been successful written, “Operation completed.” and “OK” are displayed.

Note: If "[W0000009]: ID code is disabled." is displayed in the message area when writing, all blocks in the flash

memory will be erased once and device-specific data will also be deleted. In this case, it is necessary to write device-specific data again.

C - 1

Revision History

Bluetooth Low Energy Protocol Stack Basic Package User's Manual

Rev.

Date

Description

Page

Summary

1.00

Oct.31.2019

⎯

First Edition issued

1.01

Jan.27.2020

Added “ROM_Files” to Table 2.1.

Added “IAR environment” to Table 2.3 .

Added “2.3.2.2 IAR Embedded Workbench for Renesas RX demo project”.

15-22

Updated Table 4.1 configuration options with changes in the BLE FIT module v1.10.

Added “5.1.1.4 BLE command”.

Added files for IAR Embedded Workbench for Renesas RX to table 6.2 .

Added “exclusion from build” on IAR Embedded Workbench for Renesas RX.

107

Added “7.2 Connection Parameter Update Response”.

1.02

Sep.30.2020

Added how to get the package to “2.1 Package Contents”.

Added “2.2 Project Configuration”.

Modified “IAR environment” description in “Table 2.3”.

Added "3.2.7 LED and Switch Control" and "3.2.8 BLE Task Control”

Added “(6) Scan Channel command” to 5.1.2 Vendor Specific (VS) command.

Corrected the parameter value error in the “Notification callback function for RF sleep mode start/wakeup event” in Table 5.17.

Added note about Random BD address to be generated.

Moved the followings to “RX23W Group Bluetooth Low Energy Application Developer’s Guide (R01AN5504)”.

4.3 Board LED and Push-Switch setting

4.4 MCU Low Power setting

5.1.2 Command creation procedure

5.2 Logger

5.3 Software Timer

7.2 Connection Parameter Update Response

C - 2

Rev.

Date

Description

Page

Summary

1.03

2021.3.30

—

- Support RX23W module (R5F523W8CxLN, R5F523W8DxLN).

- Add the FITDemos for RX23W module to Table 2.1.

- Add Target Board for RX23W module to Table 2.3 .

- Add e2studio 2021_01 to Table 2.4 .

- Add BLE_CFG_RF_CLVAL value when selecting RX23W module.

- Add BLE_CFG_RF_DDC_EN value when using Target Board.

- Add (addr_type) and (-wl) to Advertising command.

- Removed API parameter description and changed to reference to API documentation.

- Add (addr_type) and (-wl) to Scan command.

- Removed API parameter description and changed to reference to API documentation.

- Add (own_addr_type), (dummy_irk) and (-wl) to Connection command.

- Removed API parameter description and changed to reference to API documentation.

- Add “remove”, “get” and “off” to Privacy command.

- Add the HCI mode project for Target Board for RX23W module to Table

6.1.

Colophon

Bluetooth Low Energy Protocol Stack Basic Package User's Manual

Publication Date: Rev.1.03 Mar.30.2021

Published by: Renesas Electronics Corporation

Back cover

Bluetooth Low Energy Protocol Stack Basic Package

R01UW0205EJ0103

RENESAS RX200, RX23W User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Cover

Notice

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products

How to Use This Manual

Contents

1. Overview

1.1 Features

1.2 Specifications

Bluetooth Low Energy Protocol Stack Basic Package User's Manual 2. Installation

2.1 Package Contents

2.2 Project Configuration

2.3 Build Environment

2.4 Install

2.4.1 BLE FIT Module

2.4.2 Demo projects

2.4.2.1 e2 studio Project

2.4.2.2 IAR Embedded Workbench for Renesas RX Project

Bluetooth Low Energy Protocol Stack Basic Package User's Manual 3. Software Structure

3.1 BLE Protocol Stack

3.1.1 BLE Protocol Stack structure

3.1.2 BLE Protocol Stack library

3.2 app_lib

3.2.1 Abstraction API

3.2.2 Software Timer

3.2.3 Security Data Management

3.2.4 Profile Common

3.2.5 Logger

3.2.6 Command line

3.2.7 LED and Switch Control

3.2.8 BLE Task Control

Bluetooth Low Energy Protocol Stack Basic Package User's Manual 4. Software Setting

4.1 Configuration options

4.2 Sections

4.2.1 Linker settings for application project

4.3 Bluetooth Device Address

4.4 Bluetooth Device Name

4.4.1 Inform by Advertising packet

4.4.2 Inform by Device Name Characteristic

Bluetooth Low Energy Protocol Stack Basic Package User's Manual 5. Original Features

5.1 Command Line Interface

5.1.1 GAP command

(1) Advertising command

(2) Scan command

(3) Connection command

(4) Disconnection command

(5) Device command

(6) Privacy command

(7) Connection config command

(8) White List command

(9) Authentication command

(10) Synchronization command

(11) Version command

5.1.2 Vendor Specific (VS) command

(1) Tx Power command

(2) Coded Scheme command

(3) Extended Direct Test Mode(DTM) command

(4) BD Address command

(5) Random Number generation command

(6) Scan Channel command

5.1.3 SYS command

(1) MCU Software Standby command

5.1.4 BLE command

(1) BLE protocol stack Reset command

(2) BLE protocol stack Close command

5.2 Security Data Management

5.2.1 Security data management information

5.2.2 Local device security data

5.2.3 Remote device security data

5.3 RF communication timing notification

5.3.1 Connection event notification timing

5.3.2 Advertising event notification timing

5.3.3 Scan / Initiator event notification timing

5.3.4 RF sleep mode event notification timing

5.3.5 RF communication timing notification specifications

5.4 Device-specific Data Management

5.4.1 Specifying Device-specific data location block