Renesas RL78/G1D User Manual

Download

Bluetooth

Manual

Rev.1.22 Mar 2018

Renesas MCU

Target Device

RL78/G1D

All information contained in these materials, including products and product specifications,

Electronics Corp. without notice. Please review the latest information published by

Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.

Low Energy Protocol Stack

User’s

represents information on the product at the time of publication and is subject to change by Renesas

website (http : //www.renesas.com).

Notice

on of

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operati semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and i nformation i n the desi gn of your produc t or syste m. Renesa s Electr onics discla ims any and al l liabilit y for any loss es and damages incurred by you or third parti es arising from the use of these circuits, software, or infor ma tion.

2. Renesas Elec tronics hereby expressly disclai ms any warranties against and liabi lity for infringeme nt or any other claims involving patents, copyrights, or other intellectual prop erty rights of third part ies, by or arising from the use of Renesas Electronics pr oducts or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, expr ess, impli ed or otherwi se, is gra nted hereb y under an y patents , copyright s or other intell ectual prop erty rights of Renesas Electronics or others.

4. You shall not alter , modify, copy, or revers e engineer any Renes as Electr onics product , whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electroni cs products are cla ssified accordi ng to the following two qua lity grades: “Sta ndard” and “High Quali ty”. The intended applications for each Renesas Electronics product depends on the product’s quality grade, a s indicated below. “Standard”: Computers; office equipment; communications equipment; test and measurement equi pment; audio and visual equipment;

home electronic appliances; machine tools; personal electronic eq uipment; industria l robots; etc.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication

equipment; key financial terminal systems; safety control equipment; etc. Unless expressl y designated a s a high reli abilit y product or a product for ha rsh environ ments in a Renes as Elec tronics data sheet or ot her Renesas Electr onic s docum ent, Ren esa s El ectr onic s pr oduc ts a re not i ntended or a uthor i z ed for us e in produc t s or systems tha t may pose a direct threat to huma n life or bodily injury (ar tificial life supp ort devices or systems; s urgical implantations ; etc.), or may cause ser ious property damage (s pace system; unders ea repeaters ; nuclear power cont rol systems; a ircraft control systems; key pla nt systems; milit ary equipment; etc. ). Renesa s El ectroni cs dis claims a ny and al l liab ilit y for any damages or los ses i ncurred b y you or any thi rd parties arising from the use of any Renes as Electronics product that is inconsistent with any Renesa s Electronics data sheet, us er’s manual or other Renesas Electronics document.

6. When using Renesas Elect roni cs product s, r efer to t he lates t product informa tion ( data sheet s, user ’s manu als, applica tion not es, “Genera l Notes for Handling a nd Using Semic onductor Devices ” in the relia bility handbook, etc.), and ens ure that usage c onditions are w ithin the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characterist ics, insta llation, etc. Renesa s Electr onics dis claims any and a ll liabi lity for any ma lfunct ions, fa ilure or acc ident aris ing out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesa s Electroni cs endeavors to imp rove the qual ity and relia bility of Renes as Electroni cs products, semiconductor products have specific cha racteristics, such as the occurrenc e of failure at a certain rate and malf unctions under certain use conditi ons. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesa s Elect ronics produc ts are not s ubject t o radiation res istance des ign. You are r esponsib le for implement ing safety measures to gua rd aga ins t the pos sibi lity of b odil y injur y, injur y or da mage c aus ed by fir e, a nd/or d anger t o the p ublic in the e vent of a failure or malf unction of Renesas Elec tronics pr oducts, s uch as safety design for ha rdware a nd software, including b ut not limited t o redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the e valuat ion of mic roc omputer s oft ware a lone is very dif fi cult and imp ract ical, you are res pons ibl e for eval uat ing the s afet y of the final products or systems manufactured by you.

8. Please contact a Renesas El ectronics sa les office f or details as to environmenta l matters such as the en vironmental compatibility of each Renesas Elec tronic s produc t. Y ou are r esp onsibl e for c aref ully and s uff icient ly inves ti gati ng appl icab le laws and r egulat ions that regula te the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compl iance with all these applicab le laws and regul ations. Renesa s Electr onics disclai ms any and all liab ility for damages or losses occurring as a result of your noncompliance wit h applicable laws and regulations.

9. Renesas Electr oni cs pr oduc ts and t echnol ogi es s ha ll not be us ed f or or incorp or ated i nt o any pr oduc ts or s ystems whos e manuf act ur e, us e, or sale is pr ohibited under a ny applica ble domestic or foreign laws or regulati ons. You shall comply with an y applicabl e export contr ol laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the respons ibility of the buyer or distributor of Renesas Electronics products, or any other party who distr ibutes, disposes of, or otherwise sell s or tr ansf er s the p r oduct to a thi rd pa r ty, t o noti f y such t hir d p ar ty in a dvanc e of the c ont ent s a nd condi t ions s et f orth i n t his document.

11. This document sha ll not be repri nted, rep roduced or dup licated i n any form, in whole or in part, wit hout prior wr itten consent of Renesa s Electronics.

12. Please contact a Renesas Electronics sales of fice if you have any q uestions regarding the information contained in t his document or Renesas Electronics products.

(Note 1) “Renesas Elect ronics” as used in t his document m eans Renesas Electronics Corporation a nd also incl udes its direc tly or indirect ly

controlled subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(Rev.4.0-1 November 2017)

General Preca ut ions in the Handl ing of Microprocessing Unit a nd Microcontrol l e r Unit Products

The following usage notes are applicab le to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Handling of Unused Pins Handle unused pins in accordance with the directions given under Handling of Unused Pins in the

manual.  The input pins of CMOS products are generally in the high-impedance state. In operation with an

unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible. Unused pins should be handled as described under Handling of Unused Pins in the manual.

2. Processing at Power-on The state of the produc t is undef in ed at the moment when power is supplied.  The states of internal circuits in the LSI are indeterminate and the states of register settings and

pins are undefined at the moment when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the moment when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified.

3. Prohibition of Access to Reserved Addresses Access to reserved addresses is prohibited.  The reserved addresses are provided for the possible future expansion of functions. Do not access

these addresses; the correct operation of LSI is not guaranteed if they are accessed.

4. Clock Signals After applying a reset, only release the reset line after the operating clock signal has become stable.

When switching the clock signal during program execution, wait until the target clock signal has stabilized.

 When the clock signal is generated with an external resonator (or from an external oscillator)

during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover, when switching to a clock signal produced with an external resonator (or by an external oscillator) while program execution is in progress, wait until the target clock signal is stable.

5. Differences between Products Before changing from one product to another, i.e. to a product with a different part number, confirm

that the change will not lead to problems.  The characteristics of Microprocessing unit or Microcontroller unit products in the same group but

having a different part number may differ in terms of the internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-evaluation test for the given product.

How to Use This Manual

1. Purpose and Target Readers

This manual describes setup method, organization, and features of the Bluetooth Low Energy protocol stack (BLE

software), which is used to develop Bluetooth applications that incorporate the Renesas Bluetooth low energy

microcontroller RL78/G1D. It is intended for users designing application systems incorporating this software. A basic

knowledge of microcontrollers and Bluetooth low energy is necessary in order to use this manual.

1. Overview

This manual describes the API (Application Program Interface) of the basic features of the Bluetooth Low Energy

protocol stack (BLE software), which is used to develop Bluetooth applications that incorporate Renesas Bluetooth low

energy microcontroller RL78/G1D.

For details about the BLE software APIs, see Bluetooth Low Energy Protocol Stack API Reference Manual.

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2. Applicability

The descriptions in this manual apply to Bluetooth Low Energy protocol stack Version 1.21 or later.

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3. Restrictions

This section describes the restrictions that apply to BLE software.

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4. Installing BLE Software

4.1 Components Included

The compressed package of the BLE software includes the followings:

• Documents

- Bluetooth Low Energy Protocol Stack User's Manual (this document)

- Bluetooth Low Energy Protocol Stack API Reference Manual

- Bluetooth Low Energy Protocol Stack Sample Program Application Note

- rBLE command specifications

• Project files used for creating the executable file

- Executable file

- BLE software library

- Sample source code

- Source code that configures parameters

studio project file

- e

- CS+ for CC project file

- CS+ for CA,CX project file

- IAR Embedded Workbench workspace file

• Sample applications for computer

- Executable file

- Source code

- Microsoft Visual Studio Express 2015 project file

• HCI packet monitor application for computer

- Executable file

- INI file

4.2 BLE software build environment

The environment in which BLE software was built is shown below.

• Hardware environment

- Host

• PC/AT™-compatible computer

• Processor : At least 1.6 GHz

• Main memory : At least 1 GB

• Display : 1024 x 768 or higher resolution and 65,536 colors

• Interface : USB 2.0 (E1 and USB-serial conversion cable)

• Tools used

• Renesas on-chip debugging emulator E1

• Software environment

• Windows 7 or later

• Microsoft Visual Studio Express 2015 for Desktop

R01UW0095EJ0122 Rev.1.22 Page 4 of 162 Mar. 30, 2018

4. Installing BLE Software

• Microsoft .NET Framework 4 + language pack

• Renesas CS+ for CC V4.00.00/ RL78 Compiler CC-RL V1.03.00

or e² studio 4.3.1.001/RL78 Family C Compiler Package V1 (without IDE) V1.03.00

or Renesas CS+ for CA, CX V3.02.00/Renesas CA78K0R V1.72

or IAR Embedded Workbench for Renesas RL78 V2.20.1

• Renesas Flash Programmer V3

(available from https://www.renesas.com/software-tool/renesas-flash-programmer-programming-gui)

For details about the environment in which to run the sample application for computers, see Bluetooth Low Energy

Protocol Stack Sample Program Application Note.

4.3 Installation Procedure

Copy the decompressed contents of the package to any folder in your computer.

Note: If using the e

To build the BLE software, the EEPROM Emulation Library and Code Flash Library are needed. Libraries for testing are

contained in the BLE software package in advance. But when you start to develop a product, it is necessary to download the

newest libraries corresponding to your development environment from Renesas website and copy to the following folder.

The EEPROM Emulation Library and Code Flash Library are provided by Renesas Electronics Corporation. Regarding

how to install the libraries, refer to 4.4.2 (7) and 4.4.2 (8).

 EEPROM Emulation Library and Data Flash Access Library

- CS+ for CC/e

\Renesas\BLE_Software_Ver_X_XX\RL78_G1D\Project_Source\renesas\src\driver\dataflash\cc_rl

- CS+ for CA,CX

\Renesas\BLE_Software_Ver_X_XX\RL78_G1D\Project_Source\renesas\src\driver\dataflash\cs

- IAR V2.20.1

\Renesas\BLE_Software_Ver_X_XX\RL78_G1D\Project_Source\renesas\src\driver\dataflash\iar_v2

 Code Flash Library

- CS+ for CC/e

\Renesas\BLE_Software_Ver_X_XX\RL78_G1D\Project_Source\renesas\src\driver\codeflash\cc_rl

- CS+ for CA,CX

\Renesas\BLE_Software_Ver_X_XX\RL78_G1D\Project_Source\renesas\src\driver\codeflash\cs

- IAR V2.20.1

\Renesas\BLE_Software_Ver_X_XX\RL78_G1D\Project_Source\renesas\src\driver\codeflash\iar_v2

Note that the following versions of the library are included in the BLE software package:

 EEPROM Emulation Library and Data Flash Access Library

studio, you cannot use multi-byte characters or blank in the BLE software installation folder path.

studio (CC-RL)

- for all compilers

"EEPROM Emulation Library Pack02 Package Ver.2.00(for CA78K0R/CC-RL Compiler) for RL78 Family"

 Code Flash Library

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4. Installing BLE Software

- for all compilers

" Flash Self Programming Library Type01 Package Ver.3.00 for the RL78 Family [for the CA78K0R/CC-RL

Compiler]"

R01UW0095EJ0122 Rev.1.22 Page 6 of 162 Mar. 30, 2018

Folder name

Name of the executable file

Content

\ca78k0r

Folder for CS+ for CA,CX

\Embedded

Folder for Embedded configuration

Proximity / Find Me / Alert Notification Profile

over GATT / Scan Parameters

Profile

Speed and Cadence / Cycling Power Profile

Cadence Profile

Glucose / Phone Alert Status / Time Profile

Sample program.

Custom Profile

\Modem

Folder for Modem configuration

Proximity / Find Me / Alert Notification Profile

4. Installing BLE Software

4.4 Folder Organization

The detail of file and folder after installation is shown below.

4.4.1 \Renesas\BLE_Software_Ver_X_XX\Manual\

This folder includes the manuals. Please read them before using the product.

4.4.2 \Renesas\BLE_Software_Ver_X_XX\RL78_G1D

(1) \ROM_File\

This folder contains the executable files (hex files) of the BLE software programs that run on the RL78/G1D. Write these

programs to the RL78/G1D on-chip flash memory.

For how to write to the on-chip flash memory, see the Renesas Flash Programmer flash memory programming software

User's Manual.

Also, if you have already written the BD address into on-chip data flash memory, change the operation mode of the RFP

software configuration information list to "block (code flash)". If you don't, the written BD address might be erased.

The contents of the executable file that is stored in this folder are shown in Table 4-1 . See a section 6 Creating

Executable Files about Sample Custom profile. See Bluetooth Low Energy Protocol Stack Application Note: Sample

Program about how to create an executable file.

Table 4-1 Overview of the executable file

RL78_G1D_CE(PXP,FMP,ANP).hex Executable file that corresponds to the

RL78_G1D_CE(HOGP,ScPP).hex Executable file that corresponds to the HID

RL78_G1D_CE(HTP,BLP,HRP).hex Executable file that corresponds to the Health

Thermometer / Blood Pressure / Heart Rate

RL78_G1D_CE(CSCP,CPP).hex Executable file that corresponds to the Cycling

RL78_G1D_CE(LNP,RSCP).hex Executable file that corresponds to the

Location and Navigation / Running Speed and

RL78_G1D_CE(GLP,PASP,TIP).hex Executable file that corresponds to the

RL78_G1D_CE(SCP).hex Executable file that corresponds to the Simple

RL78_G1D_CE(SIMPLE_SAMPLE).hex Executable file that corresponds to the Sample

RL78_G1D_CM(PXP,FMP,ANP).hex Executable file that corresponds to the

R01UW0095EJ0122 Rev.1.22 Page 7 of 162 Mar. 30, 2018

Folder name

Name of the executable file

Content

over GATT / Scan Parameters

Profile

Speed and Cadence / Cycling Power Profile

Cadence Profile

Glucose / Phone Alert Status / Time Profile

Custom Profile

UART Direct Test Mode

\ccrl

Folder for CC-RL

\Embedded

Folder for Embedded configuration

Proximity / Find Me / Alert Notification Profile

over GATT / Scan Parameters

Profile

Speed and Cadence / Cycling Power Profile

Cadence Profile

Glucose / Phone Alert Status / Time Profile

Custom Profile

\Modem

Folder for Modem configuration

Proximity / Find Me / Alert Notification Profile

over GATT / Scan Parameters

Profile

Speed and Cadence / Cycling Power Profile

4. Installing BLE Software

RL78_G1D_CM(HOGP,ScPP).hex Executable file that corresponds to the HID

RL78_G1D_CM(HTP,BLP,HRP).hex Executable file that corresponds to the Health

Thermometer / Blood Pressure / Heart Rate

RL78_G1D_CM(CSCP,CPP).hex Executable file that corresponds to the Cycling

RL78_G1D_CM(LNP,RSCP).hex Executable file that corresponds to the

Location and Navigation / Running Speed and

RL78_G1D_CM(GLP,PASP,TIP).hex Executable file that corresponds to the

RL78_G1D_CM(SCP).hex Executable file that corresponds to the Sample

RL78_G1D_CM(DTM_2WIRE).hex Executable file that corresponds to 2-Wire

RL78_G1D_CE(PXP,FMP,ANP).hex Executable file that corresponds to the

RL78_G1D_CE(HOGP,ScPP).hex Executable file that corresponds to the HID

RL78_G1D_CE(HTP,BLP,HRP).hex Executable file that corresponds to the Health

Thermometer / Blood Pressure / Heart Rate

RL78_G1D_CE(CSCP,CPP).hex Executable file that corresponds to the Cycling

RL78_G1D_CE(LNP,RSCP).hex Executable file that corresponds to the

Location and Navigation / Running Speed and

RL78_G1D_CE(GLP,PASP,TIP).hex Executable file that corresponds to the

RL78_G1D_CE(SCP).hex Executable file that corresponds to the Sample

RL78_G1D_CCE(SIMPLE_SAMPLE).hex Executable file that corresponds to the Sample

RL78_G1D_CM(PXP,FMP,ANP).hex Executable file that corresponds to the

RL78_G1D_CM(HOGP,ScPP).hex Executable file that corresponds to the HID

RL78_G1D_CM(HTP,BLP,HRP).hex Executable file that corresponds to the Health

RL78_G1D_CM(CSCP,CPP).hex Executable file that corresponds to the Cycling

R01UW0095EJ0122 Rev.1.22 Page 8 of 162 Mar. 30, 2018

Thermometer / Blood Pressure / Heart Rate

Folder name

Name of the executable file

Content

Cadence Profile

Glucose / Phone Alert Status / Time Profile

Custom Profile

\iar_v2

Folder for IAR Embedded Workbench V2

\Embedded

Folder for Embedded configuration

Proximity / Find Me / Alert Notification Profile

over GATT / Scan Parameters

Profile

Speed and Cadence / Cycling Power Profile

Cadence Profile

Glucose / Phone Alert Status / Time Profile

Custom Profile

\Modem

Folder for Modem configuration

Proximity / Find Me / Alert Notification Profile

over GATT / Scan Parameters

Profile

Speed and Cadence / Cycling Power Profile

Cadence Profile

Glucose / Phone Alert Status / Time Profile

Custom Profile

4. Installing BLE Software

RL78_G1D_CM(LNP,RSCP).hex Executable file that corresponds to the

Location and Navigation / Running Speed and

RL78_G1D_CM(GLP,PASP,TIP).hex Executable file that corresponds to the

RL78_G1D_CM(SCP).hex Executable file that corresponds to the Sample

RL78_G1D_IE(PXP,FMP,ANP).hex Executable file that corresponds to the

RL78_G1D_IE(HOGP,ScPP).hex Executable file that corresponds to the HID

RL78_G1D_IE(HTP,BLP,HRP).hex Executable file that corresponds to the Health

Thermometer / Blood Pressure / Heart Rate

RL78_G1D_IE(CSCP,CPP).hex Executable file that corresponds to the Cycling

RL78_G1D_IE(LNP,RSCP).hex Executable file that corresponds to the

Location and Navigation / Running Speed and

RL78_G1D_IE(GLP,PASP,TIP).hex Executable file that corresponds to the

RL78_G1D_IE(SCP).hex Executable file that corresponds to the Sample

RL78_G1D_IE(SIMPLE_SAMPLE).hex Executable file that corresponds to the Sample

RL78_G1D_IM(PXP,FMP,HTP,BLP).hex Executable file that corresponds to the

RL78_G1D_IM(HOGP,ScPP).hex Executable file that corresponds to the HID

RL78_G1D_IM(HTP,BLP,HRP).hex Executable file that corresponds to the Health

Thermometer / Blood Pressure / Heart Rate

RL78_G1D_IM(CSCP,CPP).hex Executable file that corresponds to the Cycling

RL78_G1D_IM(LNP,RSCP).hex Executable file that corresponds to the

RL78_G1D_IM(GLP,PASP,TIP).hex Executable file that corresponds to the

RL78_G1D_IM(SCP).hex Executable file that corresponds to the Sample

The setting for building each executable file in this folder is shown as follows. Regarding the setting of profiles, refer to

the subsection 6.1.11.1 "Profile Enable / Disable Setting" in this document.

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Location and Navigation / Running Speed and

profiles in prf_sel.h

PRF_SEL_PXPM

(1)(0)

PRF_SEL_PXPR

(1)(0)

PRF_SEL_FMPL

(1)(0)

PRF_SEL_FMPT

(1)(0)

PRF_SEL_HGHD

(0)(1)

PRF_SEL_HGBH

(0)(1)

PRF_SEL_HGRH

(0)(1)

PRF_SEL_SPPC

(0)(1)

PRF_SEL_SPPS

(0)(1)

PRF_SEL_ANPC

(1)(0)

PRF_SEL_ANPS

(1)(0)

profiles in prf_sel.h

PRF_SEL_PXPM

(1)(0)

PRF_SEL_PXPR

(1)(0)

PRF_SEL_FMPL

(1)(0)

PRF_SEL_FMPT

(1)(0)

PRF_SEL_HTPC

(0)(1)

PRF_SEL_HTPT

(0)(1)

PRF_SEL_BLPC

(0)(1)

PRF_SEL_BLPS

(0)(1)

PRF_SEL_HRPC

(0)(1)

PRF_SEL_HRPS

(0)(1)

PRF_SEL_ANPC

(1)(0)

4. Installing BLE Software

 Build setting for RL78_G1D_xx(PXP,FMP,ANP).hex

Project files to build this executable file are included in the following folder. There is no change from default setting.

Project folder: \Project_Source\renesas\tools\project\

 Build setting for RL78_G1D_xx(HOGP,ScPP).hex

Project files to build this executable file are included in the following folder.

Project folder: \Project_Source\renesas\tools\project\

To enable HOGP and ScPP, the following macro setting change is needed.

Configuration file: Project_Source\renesas\src\arch\rl78\prf_sel.h

Table 4-2 Profile setting for RL78_G1D_xx(HOGP,ScPP).hex

Setting Macros for selecting

Changes

 Build setting for RL78_G1D_xx(HTP,BLP,HRP).hex

Project files to build this executable file are included in the following folder.

Project folder: \Project_Source\renesas\tools\project\

To enable HTP,BLP and HRP, the following macro setting change is needed.

Configuration file: Project_Source\renesas\src\arch\rl78\prf_sel.h

Table 4-3 Profile setting for RL78_G1D_xx(HTP,BLP,HRP).hex

Setting Macros for selecting

Changes

R01UW0095EJ0122 Rev.1.22 Page 10 of 162 Mar. 30, 2018

PRF_SEL_ANPS

(1)(0)

profiles in prf_sel.h

PRF_SEL_PXPM

(1)(0)

PRF_SEL_PXPR

(1)(0)

PRF_SEL_FMPL

(1)(0)

PRF_SEL_FMPT

(1)(0)

PRF_SEL_CSCC

(0)(1)

PRF_SEL_CSCS

(0)(1)

PRF_SEL_CPPC

(0)(1)

PRF_SEL_CPPS

(0)(1)

PRF_SEL_ANPC

(1)(0)

PRF_SEL_ANPS

(1)(0)

profiles in prf_sel.h

PRF_SEL_PXPM

(1)(0)

PRF_SEL_PXPR

(1)(0)

PRF_SEL_FMPL

(1)(0)

PRF_SEL_FMPT

(1)(0)

PRF_SEL_ANPC

(1)(0)

PRF_SEL_ANPS

(1)(0)

PRF_SEL_LNPS

(0)(1)

PRF_SEL_LNPC

(0)(1)

PRF_SEL_RSCC

(0)(1)

PRF_SEL_RSCS

(0)(1)

4. Installing BLE Software

 Build setting for RL78_G1D_xx(CSCP,CPP).hex

Project files to build this executable file are included in the following folder.

Project folder: \Project_Source\renesas\tools\project\

To enable CSCP and CPP, the following macro setting change is needed.

Configuration file: Project_Source\renesas\src\arch\rl78\prf_sel.h

Table 4-4 Profile setting for RL78_G1D_xx(CSCP,CPP).hex

Setting Macros for selecting

Changes

 Build setting for RL78_G1D_xx(LNP,RSCP).hex

Project files to build this executable file are included in the following folder.

Project folder: \Project_Source\renesas\tools\project\

To enable LNP and RSCP, the following macro setting change is needed.

Configuration file: Project_Source\renesas\src\arch\rl78\prf_sel.h

Table 4-5 Profile setting for RL78_G1D_xx(LNP,RSCP).hex

Setting Macros for selecting

Changes

 Build setting for RL78_G1D_xx(GLP,PASP,TIP).hex

Project files to build this executable file are included in the following folder.

Project folder: \Project_Source\renesas\tools\project\

R01UW0095EJ0122 Rev.1.22 Page 11 of 162 Mar. 30, 2018

profiles in prf_sel.h

PRF_SEL_PXPM

(1)(0)

PRF_SEL_PXPR

(1)(0)

PRF_SEL_FMPL

(1)(0)

PRF_SEL_FMPT

(1)(0)

PRF_SEL_GLPC

(0)(1)

PRF_SEL_GLPS

(0)(1)

PRF_SEL_TIPC

(0)(1)

PRF_SEL_TIPS

(0)(1)

PRF_SEL_ANPC

(1)(0)

PRF_SEL_ANPS

(1)(0)

PRF_SEL_PASC

(0)(1)

PRF_SEL_PASS

(0)(1)

Compile Option

Changes

Preprocessor Macro Definition

noUSE_SAMPLE_PROFILE  USE_SAMPLE_PROFILE

rwble_config.h

__DTM2WIRE_UART_USE__

(0)(1)

4. Installing BLE Software

To enable GLP,PASP and TIP, the following setting change is needed.

Configuration file: Project_Source\renesas\src\arch\rl78\prf_sel.h

Table 4-6 Profile setting for RL78_G1D_xx(GLP,PASP,TIP).hex

Setting Macros for selecting

Changes

 Build setting for RL78_G1D_xx(SCP).hex

Project files to build this executable file are included in the following folder.

Project folder: \Project_Source\renesas\tools\project\

To enable Custom Profile, the following compile option setting change is needed.

Table 4-7 Profile setting for RL78_G1D_xx(SCP).hex

 Build setting for RL78_G1D_xx(SIMPLE_SAMPLE).hex

Project files to this build executable file are included in the following folder. There is no need to change source code or

project setting.

Project Folder: \Project_Source\renesas\tools\project_simple\

Regarding the the simple sample program, refer to chapter 6 "Usage of Simple Sample Program" in Bluetooth low

energy Protocol Stack Sample Program Application Note (R01AN1375).

 Build setting for RL78_G1D_CM(DTM_2WIRE).hex

Project files to build this executable file are included in the following folder.

Project folder: \Project_Source\renesas\tools\project\

To enable Direct Test Mode by 2-wire UART, the following macro setting change is needed.

Configuration file: Project_Source\bleip\src\rwble\rwble_config.h

Table 4-8 DTM setting for RL78_G1D_CM(DTM_2WIRE).hex

Setting Macro for enabling DTM in

R01UW0095EJ0122 Rev.1.22 Page 12 of 162 Mar. 30, 2018

Changes

4. Installing BLE Software

Regarding the Direct Test Mode sample program, refer to section 7.7 "Sample Program for the Direct Test Mode with RF

Tester" in Bluetooth low energy Protocol Stack Sample Program Application Note (R01AN1375).

(2) \Project_Source\

This folder contains the BLE software library and sample source code required for building the executable files (hex

files) of the software programs that run on the RL78/G1D.

(3) \Project_Source\renesas\tools\project\

This folder contains the project/workspace files for each development environment which are required for building the

executable files (hex files) of the software programs that run on the RL78/G1D. In addition, projects/workspaces in the

Embedded configuration and Modem configuration for each development environment are contained. Build the program

by using these project/workspace files in your development environment to generate executable files.

For how to build the program, see 6.2.

(4) \Project_Source\renesas\tools\project_devices\

This folder contains the project/workspace files for each development environment which are required for building the

executable files (hex files) for the R5F11AGG(128KB) and R5F11AGH(192KB). In addition, projects/workspaces in the

Embedded configuration and Modem configuration for each development environment are contained. Build the program

by using these project/workspace files in your development environment to generate executable files.

(5) \Project_Source\renesas\tools\project_simple\

This folder contains the project/workspace files for each development environment which are required for building the

executable files (hex files) of the simple sample program which shows how to use the BLE software. Build the program by

using these project/workspace files in your development environment to generate executable files.

For details about the simple sample program, see Sample Program Application Note (R01AN1375).

(6) \Project_Source\renesas\src\

This folder contains the files for configuring the parameters that can be changed by the user (source code). Change the

parameter settings as required before building the program.

For details about the configurable parameters and how to change the settings, see 6.1.

(7) \Project_Source\renesas\src\driver\dataflash\cc_rl\ or \cs\ or \iar_v2\

This folder is for containing the EEPROM Emulation Library and Data Flash Access Library to access Data Flash

memory. The libraries for testing are contained in advance. But when you start to develop a product, it is necessary to copy

the newest library corresponding to your development environment to this folder.

The EEPROM Emulation Library and Data Flash Access Library are downloaded from Renesas website. For reference,

shows how to obtain a tested version by the BLE software from Renesas website. In addition, operating procedures might

be changed without a notice by the renewals of the website.

Open the Renesas website (https://www.renesas.com/). Select [DESIGN & SUPPORT]  [DEVELOPMENT TOOLS]

 [Data Flash Libraries].

R01UW0095EJ0122 Rev.1.22 Page 13 of 162 Mar. 30, 2018

4. Installing BLE Software

Get the following file and execute files for unzip the EEPROM Emulation Library and Data Flash Access Library.

• EEPROM Emulation Library Pack02 Package Ver.2.00(for CA78K0R/CC-RL Compiler) for RL78 Family.

Note: For the library for IAR, select "America/Europe/Middle East/Africa" when you run the installer. The Library

version select "IAR compiler version 2.10.

The files to be copied are shown below.

CS+ for CC or e

studio (CC-RL) version:

• eel.h

• eel.lib

• eel_types.h

• fdl.h

• fdl.lib

• fdl_types.h

CS+ for CA, CX version:

• eel.h

• eel.lib

• eel_types.h

• fdl.h

• fdl.lib

• fdl_types.h

IAR Embedded Workbench V2 version:

• eel.h

• eel.a

• eel_types.h

• fdl.h

• fdl.a

• fdl_types.h

(8) \Project_Source\renesas\src\driver\codeflash\cc_rl\ or cs\ or \iar_v2\

This folder is for containing the Code Flash Library to write to Code Flash memory. The library for testing is contained

in advance. But when you start to develop a product, it is necessary to copy the newest Code Flash Library corresponding to

your development environment to this folder.

The Code Flash Library is downloaded from Renesas website. For reference, shows how to obtain a tested version by the

BLE software from Renesas website. In addition, operating procedures might be changed without a notice by the renewals

of the website.

Open the Renesas website (https://www.renesas.com/). Select [DESIGN & SUPPORT]  [DEVELOPMENT TOOLS]

 [Code Flash Libraries].

Get the following file and execute file for unzip the Code Flash Library.

• Flash Self Programming Library Type01 Package Ver.3.00 for the RL78 Family [for the CA78K0R/CC-RL

Note: For the library for IAR, select "America/Europe/Middle East/Africa" when you run the installer. The Library

version select "IAR compiler version 2.10.

R01UW0095EJ0122 Rev.1.22 Page 14 of 162 Mar. 30, 2018

Compiler]

4. Installing BLE Software

The files to be copied are shown below.

CS+ for CC or e

studio (CC-RL) version

• fsl.h

• fsl.lib

• fsl_types.h

CS+ for CA, CX version

• fsl.h

• fsl.lib

• fsl_types.h

IAR Embedded Workbench V2 version

• fsl.h

• fsl.a

• fsl_types.h

4.4.3 \Renesas\BLE_Software_Ver_X_XX\BLE_Sample\

This folder contains the executable files of the BLE software sample program that runs on a computer when BLE

software is used in the Modem configuration. About the detail of the sample program, see Bluetooth Low Energy Protocol

Stack Application Note: Sample Program.

R01UW0095EJ0122 Rev.1.22 Page 15 of 162 Mar. 30, 2018

5. BLE Software Configuration

BLE software refers to the set of software that includes BLE stacks compliant with the Bluetooth Low Energy protocol

(Bluetooth v4.2). The following section describes the BLE software configuration in detail.

5.1 Configuration

Figure 5-1 shows the BLE software configuration.

BLE software runs in a configuration in which the application is mounted on the RL78/G1D (hereafter referred to as the

Embedded configuration) and in a configuration in which the application is mounted on another MCU (hereafter referred to

as the Modem configuration). BLE software provides APIs which can use the same application in both configurations.

Figure 5-1 BLE Software Configuration

BLE software in the Modem configuration runs on two chips, the APP MCU and the BLE MCU (RL78/G1D). BLE

software is configured of an rBLE_Host block that runs on the APP MCU (

on the BLE MCU (

The software to be prepared by the user (

R01UW0095EJ0122 Rev.1.22 Page 16 of 162 Mar. 30, 2018

blocks in the figure).

blocks in the figure) consists of the APP MCU’s application block, serial

block in the figure), and software that runs

Block Name

Description

Application

Software the user needs to prepare

Operating system the user needs to prepare

rBLE APIs from the application.

Note: The user needs to prepare this driver.

protocol.

stack services via rBLE_Core.

the profile layer to the RF driver).

Controller stack : LL and HCI

Kernel Extension)

other modules and manages the entire BLE MCU.

5. BLE Software Configuration

communication driver block, and OS block. However, if there is no OS in the APP MCU, software for the OS block does

not have to be prepared because the rBLE_Host block does not use resources of the OS.

The application that runs on the APP MCU executes communication between the BLE MCU and BLE services via

rBLE_Host. The APP MCU and BLE MCU are physically connected via UART or CSI or IIC, and communication is

executed using RSCIP (Renesas Serial Communication Interface Protocol) under the control of rBLE_Host.

BLE software in the Embedded configuration runs on only a single chip, the BLE MCU (RL78/G1D). The software to be

prepared by the user is only the application block and it should be implemented on the BLE MCU.

Table 5-1 gives an overview of the software blocks.

Table 5-1 Overview of Software Blocks

rBLE_Host Builds command packets for MDM_APPL and analyzes

event packets from MDM_APPL, enabling the issuance of

Serial Communication driver

(APP MCU)

Serial Communication driver

(BLE MCU)

MDM APPL Analyzes command packets from rBLE_Host and builds

rBLE_Core Provides an interface with the upstream modules for

Profile layer Main BLE stack

Host stack

Controller stack

RWKE (Renesas Wireless

Performs communication with the BLE MCU through

UART or CSI or IIC. RSCIP is used as the communication

protocol.

Performs communication with the APP MCU through

UART or CSI or IIC. RSCIP is used as the communication

event packets for rBLE_Host, enabling the use of BLE

using the services of the main BLE stack (the part from

Profiles : FMP, PXP, HTP, BLP, HOGP, ScPP, HRP,

CSCP, CPP, GLP, TIP, RSCP, ANP, PASP and LNP

Host stack : SM, L2CAP, GAP, and GATT

Provides the basic functionality used commonly with the

R01UW0095EJ0122 Rev.1.22 Page 17 of 162 Mar. 30, 2018

FMP

GAP

PXP

HTP

BLP

HOGP

ScPP

GATT

ATT

rBLE API

ANP

LNP

HRP

CSCP

CPP

GLP

TIP

RSCP

PASP

Layer

Description

Supported Features

Privacy feature

above.

encryption, and data signing

means of alerts.

be sent to the user.

5. BLE Software Configuration

5.2 rBLE API

The BLE software provides an API (rBLE API) that allows the application to use the services of the BLE stack on the

BLE MCU from the application.

The Bluetooth layers that can be accessed by the APIs provided by the rBLE API are shown in the figure below.

Figure 5-2 rBLE API and BLE Stack

The features supported by the various layers are listed in Table 5-2. For details about the various features, see 7

Description of Features.

Table 5-2 Bluetooth Features Supported by the rBLE API

GAP

(Generic Access

Profile)

(Security Manager)

Executes access procedures

according to the link

management and security

requirements for processes

such as device discovery and

peer device connection and

disconnection.

Executes pairing between two

devices, communication

encryption, and data signing to

ensure security. Also executes

information exchange between

devices as needed for the

• Four GAP roles

(Central, Peripheral, Broadcaster, and Observer)

• Broadcast and Scan

• Discovery, Connection, and Bonding modes, and

procedures

• Security mode

• Connection and disconnection of a link

• Changing the connection parameters

• Random and static addresses

•

• Pairing procedure

• Pairing algorithms

(Passkey Entry, Just Works, OOB)

• Pairing and key generation

• Key distribution

• Security implemented by authentication,

FMP

(Find Me Profile)

PXP

(Proximity Profile)

R01UW0095EJ0122 Rev.1.22 Page 18 of 162 Mar. 30, 2018

Allows searching for peer

devices within the

communication range by

Defines the behavior when a

device moves away from a peer

device so that the connection is

dropped or the path loss

increases above a preset level,

causing an immediate alert to

• Immediate Alert service

• Link Loss service

• Immediate Alert service

• Tx Power service

Layer

Description

Supported Features

Profile)

blood pressure sensor.

link.

reconnection latency.

sensor.

Cadence sensor (CSC sensor).

(CP sensor).

sensor.

from a server.

Reference Time Update service

Cadence Sensor (RSC Sensor)

Profile)

server.

5. BLE Software Configuration

HTP

(Health

Thermometer

BLP

(Blood Pressure

Profile)

HOGP

(HID over GATT

Profile)

ScPP

(Scan Parameters

Profile)

HRP

(Heart Rate Profile)

Used to enable a data

collection device to obtain data

from a thermometer sensor.

Used to enable a device to

obtain blood pressure

measurement data from a

Allows data communication

between an HID device and

HID host by adapting USB HID

to the operation on the BLE

Used to provide devices with

information to assist them in

managing their connection idle

timeout and advertising

parameters to optimize power

consumption and/or

Used to enable a device to

obtain data from a heart rate

• Health Thermometer service

• Device Information service

• Blood Pressure service

• Device Information service

• HID service

• Device Information service

• Battery service

• Scan Parameters service

• Heart Rate service

• Device Information service

CSCP

(Cycling Speed and

Cadence Profile)

CPP

(Cycling Power

Profile)

GLP

(Glucose Profile)

TIP

(Time Profile)

RSCP

(Running Speed and

Cadence Profile)

ANP

(Alert Notification

Used to enable a data

collection device to obtain data

from a Cycling Speed and

Used to enable a data

collection device to obtain data

from a Cycling Power sensor

Used to enable a device to

glucose measurement and

other data from a glucose

Used to obtain the date and

time, and related information

Used to enable a data

collection device to obtain data

from a Running Speed and

Used to enable a client to

obtain alert notification from a

• Cycling Speed and Cadence service

• Device Information service

• Cycling Power service

• Device Information service

• Battery service

• Glucose service

• Device Information service

• Current Time service

• Next DST Change service

•

• Running Speed and Cadence service

• Device Information service

• Alert Notification service

R01UW0095EJ0122 Rev.1.22 Page 19 of 162 Mar. 30, 2018

Layer

Description

Supported Features

phone from a server.

Navigation Profile)

Navigation sensor (LN sensor).

Battery service

Configuration

Modem

Embedded

Data Flash Memory

Used

Used to store the BD address.

circuit Note (3)

resonator.

Channel 7

Not Used

Used by CSI or IIC Driver ( Unit0 Channel7)

Note (4)

P30(input)

P30: Used by WAKEUP Driver for UART or CSI

UART1

CSI21

CSI21 : Note (2)

Accumulator

(CS+ for CA,CX and IAR Embedded Workbench and

5. BLE Software Configuration

PASP

(Phone Alert Status

Profile)

LNP

(Location and

Used to enable a client to

obtain the information of Alert

Status and Ringer Setting of a

Used to enable a Collector to

interact with a Location and

• Phone Alert Status service

• Location and Navigation service

• Device Information service

•

The rBLE API includes an interface for Direct Test Mode for performing RF evaluation of the BLE MCU, allowing

transmission testing and reception testing.

5.3 RL78/G1D Hardware Resources used by the BLE Software

The BLE software uses the following RL78/G1D hardware resources. Therefor user program cannot use these hardware

resources.

Table 5-3 Hardware Resources used by BLE Software

H/W Resources

Purpose / Usage

12-bit Interval Timer Used Used Used by Peak current consumption notification function, or

Used by monitoring for RF slow clock for internal oscillation

Real-time clock Used Used Used by Peak current consumption notification function, or

Used by monitoring for RF slow clock for internal oscillation

Real-time clock Used Used Used by Peak current consumption notification function, or

Used by monitoring for RF slow clock for internal oscillation

Timer Array Unit Channel 1 Channel 1 Used by plf_init() function when using external 32.768kHz

Clock Output/Buzzer

Output

Port Function P23(output)

Serial Interface

(Serial Array Unit)

PCLBUZ0 PCLBUZ0 Used for clock output to RF transceiver

(When not using RF slow clock for internal oscillation circuit.)

Not Used P23: Used by CSI or IIC Driver (SDIR or REQ signal)

UART0

CSI00

CSI20

Not Used Used by UART Driver

CSI00 or CSI20: Note (1)

Serial Interface IICA IICA0 Not Used Used by IIC Driver

Multiplier,

Divider/Multiply

R01UW0095EJ0122 Rev.1.22 Page 20 of 162 Mar. 30, 2018

Used Used Used by the C Compiler

Set the compiler option to use this hardware

e2 studio/CS+ for CC)

DMA2, DMA3

DMA2, DMA3 : Note (2)

INTP3

INTP3 : Note (1), used for WAKEUP signal

INTSREm

Note (3)

5. BLE Software Configuration

DMA Controller DMA0, DMA1

Interrupt External Pin INTRF

DMA INTDMA0

INTDMA1

INTDMA2

INTDMA3

Serial Array

Unit

Serial

Interface IICA

12-bit Interval

Timer

Note (1): This hardware resource is used for communication interface between APP-MCU and BLE-MCU

through UART0, UART1 or CSI00, CSI20 (in modem configuration)

Note (2): This hardware resource is used for communication interface between MCU and RF Transceiver

Note (3): User application can use the 12-bit interval timer and real-time clock when not using the Peak current

consumption notification function and RF slow clock for internal oscillation circuit.

Note (4): User application can use the Clock Output/Buzzer Output when using RF slow clock for internal oscillation circuit.

INTCSImn

INTSTm

INTSRm

INTIICA0 Not Used INTIICA0: Used by IIC Driver

INTIT INTIT Used by Peak current consumption notification function, or

INTRF

INTDMA2

INTDMA3

Not Used INTCSImn : Note (1), for CSI (mn=00, 20)

DMA0, DMA1 : Note (1)

INTRF : Note (2)

INTDMA0, INTDMA1 : Note (1)

INTDAM2, INTDMA3 : Note (2)

INTSTm, INTSRm, INTSREm : Note (1), for UART

(m=0, 1)

Used by monitoring for RF slow clock for internal oscillation

circuit.

5.4 Serial Communication in Modem Configuration

APP-MCU and BLE-MCU communicates through serial interface (UART or CSI or IIC), using the RSCIP (Renesas

Serial Communication Interface Protocol) as the protocol.

The RSCIP is based on the SLIP (Serial Line Internet Protocol) defined in RFC 1055, and is extended. The RSCIP

ensures the reliability of data communication using error recovery capabilities by retransmission.

The RSCIP driver, which is a part of rBLE_Host, performs protocol processing and control of the serial driver. The

RSCIP driver provides packet based communication.

Refer to the Application Note: rBLE Command Specification for more details.

Serial communication provides communication through UART or CSI or IIC interface, and the following connection

methods are available.

In addition, there is a connection method that cannot be selected in CSI20.

R01UW0095EJ0122 Rev.1.22 Page 21 of 162 Mar. 30, 2018

Serial Interface

Connection method

Possible channel

2-wire

UART0, UART1 (*1)

3-wire

UART0, UART1

2-wire with branch

UART0, UART1

4-wire

CSI00

5-wire

CSI00, CSI20

IIC

3-wire

IICA0

Setting

Setting value

(3-wire, 2-wire with branch) 4,800bps ~ 250kbps

Data length

8bit

Parity

None

Stop bit

1bit

Flow control

None

Setting

Setting value

half-duplex, synchronous clock, master clock supply

BLE MCU : slave

Data Length

8bit

Setting

Setting value

half-duplex, synchronous clock, master clock supply

BLE MCU : slave

5. BLE Software Configuration

Table 5-4 Connection methods for serial communication

UART

CSI

(*1) UART1 does not support the SNOOZE mode.

UART communication operates in the following settings.

Table 5-5 Settings of UART

Baud rate (2-wire) 4,800bps ~ 250kbps (*1)

(*1) If you select the 2-wire connection method and set the baud rate greater than 4,800 bps, the Sleep function is disabled.

The Sleep function is always enabled in other connection method. The Sleep function realizes the low current

consumption of BLE MCU.

CSI communication operates in the following settings.

Table 5-6 Setting of CSI

Communication peer-to-peer, master-slave

Role APP MCU : master

Baud rate 4800bps ~ 250kbps (4-wire, 5-wire)

Data clock phase RL78/G1D phase mode type 1

IIC communication operates in the following settings.

Table 5-7 Setting of IIC

Communication IIC bus mode

Role APP MCU : master

R01UW0095EJ0122 Rev.1.22 Page 22 of 162 Mar. 30, 2018

Setting

Setting value

Data Length

8bit

BLE MCU Pin Name

Direction

Function

TxDq (q=0,1)

BLE -> APP

Serial Output Data Signal

RxDq (q=0,1)

APP -> BLE

serial input data signal

RxDq

TxDq

RxD

TxD

5. BLE Software Configuration

Transfer clock 100kbps ~ 400kbps

Communication

format

IIC Bus Serial Data Transfer format

Note

* The serial communication driver on the APP MCU needs to be prepared by customer.

* With the requirements of the serial communication driver, refer to the Bluetooth Low Energy Protocol Stack Application

Note: Sample Program.

5.4.1 UART 2-wire Connection

In this connection method, the APP MCU and the BLE MCU communicate using two signal lines (TxD and RxD).

If the baud rate greater than 4,800 bps is used, the Sleep function to reduce power consumption is disabled.

There is no handshake operation.

APP MCU BLE MCU

Figure 5-3 UART 2-wire connection method

- In the timing chart described from now on, the terminal name of the BLE MCU side is described.

(1) Transmit Operation of APP MCU

This section shows the transmission sequence including rBLE_Host and serial communication driver function calls.

[At the start of transmission]

When the rBLE_Host calls the transmit function, the serial communication driver starts the transmission operation of

the RSCIP packet.

[At the end of transmission]

R01UW0095EJ0122 Rev.1.22 Page 23 of 162 Mar. 30, 2018

rBLE Host

Serial

Tx Func.

Tx Comp Func.

Packet

rBLE Host

Serial

Rx Func.

Rx Comp Func.

Packet(1/2)

Packet(2/2)

Rx Comp Func.

Rx Func.

5. BLE Software Configuration

The serial communications driver notifies rBLE_Host the transmission completion by calling the transmission

completion notification function when the RSCIP packet transmission is completed.

BLE MCU APP MCU

Figure 5-4 Transmit Sequence (APP MCU)

(2) APP MCU Receive Operation

The reception sequence including rBLE_Host and serial communications driver's function calls is shown. When one

RSCIP packet is received, rBLE_Host calls the reception function two or more times because the RSCIP packet is

variable-length.

[When beginning to receive it] RBLE_Host calls the reception function. As a result, the serial communications driver

begins the reception operation of the RSCIP packet, and waits for the data reception.

[When the reception ends the packet on the way] The serial communications driver notifies rBLE_Host the reception

completion by calling the reception completion notification function after the reception ends. RBLE_Host calls the

reception function again, and the serial communications driver restarts the reception.

[When the reception of the entire packet ends] The serial communications driver notifies rBLE_Host the reception

completion by calling the reception completion notification function after the reception ends. RBLE_Host calls the

reception function again, and waits for the following RSCIP packet reception.

BLE MCU APP MCU

Rx Func

Figure 5-5 Receive Sequence (APP MCU)

5.4.2 UART 3-wire Connection

In this connected method, APP MCU and BLE MCU communicate by using control signal line WAKEUP to make BLE

MCU get up when APP MCU in addition to TxD that is the data signal line of UART as shown in the following and RxD

R01UW0095EJ0122 Rev.1.22 Page 24 of 162 Mar. 30, 2018

BLE MCU Pin Name

Direction

Function

APP MCU

BLE MCU

and it returns it to an inactive level.

RxDm

TxDm

[T1] 1st byte

Last byte

[T4]

WAKEUP

ACK(0x88)

[T2]

[T3]

5. BLE Software Configuration

transmits data.

When transmitting from APP MCU, it is necessary to do handshaking though the full duplex transmission is possible.

This is operation necessary to confirm BLE MCU completes the preparation for the reception. Moreover, please observe by

the time-out to do a reliable communication at handshaking, and execute handshaking again when you generate the

time-out.

APP MCU BLE MCU

RxD TxD

WAKEUP

TxDm RxDm

WAKEUP

Figure 5-6 UART 3-wire connection

TxDm (m=0,1) BLE MCU->

RxDm (m=0,1) APP MCU->

WAKEUP(P30/INTP3)

- Low Active

APP MCU->

BLE MCU

Serial Output Data Signal

Serial Input Data Signal

External Trigger Input Signal for Wakeup

APP MCU is set at an active level at the transmission request.

ACK byte (0x88) reception or data reception from BLE MCU is waited for,

- In the timing chart described from now on, the terminal name of the BLE MCU side is described.

(1) Transmit Operation (APP MCU)

The handshaking procedure when APP MCU transmits the RSCIP packet to BLE MCU is following T3.

T1: APP MCU makes the WAKEUP signal an active level for the transmission request.

T2: APP MCU detects ACK byte (0x88) from BLE MCU or the RSCIP packet by one byte.

T3: APP MCU makes the WAKEUP signal an inactive level.

T4: APP MCU transmits the RSCIP packet.

R01UW0095EJ0122 Rev.1.22 Page 25 of 162 Mar. 30, 2018

Figure 5-7 Transmit timing chart (APP MCU)

RxDm

TxDm

[T2] 1st byte

last byte

[T4]

WAKEUP

N byte

[T1]

last byte

1st byte

[T3]

5. BLE Software Configuration

Figure 5-8 Transmit timing chart (APP MCU) (while BLE MCU transmitting）

After the transmission request, the serial communications driver begins the time-out watch. When the time-out is

generated, the serial communications driver is T1 that returns the WAKEUP signal to an inactive level for the

re-transmission demand once, and makes to an active level again. The recommended value at the timeout period is assumed

to be 5msec.

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RxDm

TxDm

[T1] 1st byte

last byte

[T4]

WAKEUP

ACK(0x88)

[T2]

[T1]

[T3]

[T2] ACK or Data

rBLE Host

Serial

Tx Func

Tx Comp Func

[T1]WAKEUP Signal (Active)

[T3] WAKEUP Signal (Inactive)

[T4] Packet

5. BLE Software Configuration

Figure 5-9 Transmit timing chart (APP MCU) (timeout occurs）

The transmission sequence including rBLE_Host and serial communications driver's function calls is shown.

[When beginning to transmit]: The serial communications driver is T1 according to the call of rBLE_Host of the

transmission function that begins the transmission operation of the RSCIP packet, and makes the WAKEUP signal an

active level for the transmission request.

[When the transmission ends]: The serial communications driver notifies rBLE_Host the transmission completion by

calling the transmission completion notification function when RSCIP packet transmission T1- T4 is completed.

BLE MCU APP MCU

Figure 5-10 Transmit Sequence (APP MCU)

(2) Receive Operation (APP MCU)

The reception sequence including rBLE_Host and serial communications driver's function calls is shown. When one

RSCIP packet is received, rBLE_Host calls the reception function two or more times because the RSCIP packet is

variable-length.

[When beginning to receive it] RBLE_Host calls the reception function. As a result, the serial communications driver

begins the reception operation of the RSCIP packet, and waits for the data reception.

[When the reception ends the packet on the way] The serial communications driver notifies rBLE_Host the reception

completion by calling the reception completion notification function after the reception ends. RBLE_Host calls the

reception function again, and the serial communications driver restarts the reception.

[When the reception of the entire packet ends] The serial communications driver notifies rBLE_Host the reception

completion by calling the reception completion notification function after the reception ends. RBLE_Host calls the

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rBLE Host

Serial

Rx Func

Rx Comp Func

Packet (1/2)

Rx Func

Packet (2/2)

Rx Func

5. BLE Software Configuration

reception function again, and waits for the following RSCIP packet reception.

BLE MCU APP MCU

Rx Comp Func

Figure 5-11 Receive Sequence (APP MCU)

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BLE MCU Pin Name

Direction

Function

APP MCU

BLE MCU

and it returns it to an inactive level.

RxDm

TxDm

1st byte

last byte

[T3]

ACK(0x88)

[T2]

REQ(0xC0)

[T1]

5. BLE Software Configuration

5.4.3 UART 2-wire with Branch Connection

TxD of APP MCU diverges, is connected with WAKEUP of BLE MCU so that APP MCU and BLE MCU may make

BLE MCU get up when APP MCU in addition to TxD that is the data signal line of UART as shown in the following and

RxD transmits data in this connected method, and it communicates.

When transmitting from APP MCU, it is necessary to do handshaking though the full duplex transmission is possible.

This is operation necessary to confirm BLE MCU completes the preparation for the reception. Moreover, please observe by

the time-out to do a reliable communication at handshaking, and execute handshaking again when you generate the

time-out.

APP MCU BLE MCU

RxD TxD

TxDm RxDm

WAKEUP

Figure 5-12 UART 2-wire with branch connection

TxDm (m=0,1) BLE MCU->

RxDm (m=0,1) APP MCU->

WAKEUP(P30/INTP3)

- Low Active

APP MCU->

BLE MCU

Serial Output Data Signal

Serial Input Data Signal

External Trigger Input Signal for Wakeup

APP MCU is set at an active level at the transmission request.

ACK byte (0x88) reception or data reception from BLE MCU is waited for,

- In the timing chart described from now on, the terminal name of the BLE MCU side is described.

(1) Transmit Operation (APP MCU)

The handshaking procedure when APP MCU transmits the RSCIP packet to BLE MCU is following T3.

T1: APP MCU transmits REQ byte (0xC0) for the transmission request.

T2: APP MCU detects ACK byte (0x88) from BLE MCU or the RSCIP packet by one byte.

T3: APP MCU transmits the RSCIP packet.

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Figure 5-13 Transmit timing chart (APP MCU)

RxDm

TxDm

1st byte

last byte

[T3]

N byte

[T1]

last byte

1st byte

REQ(0xC0)

[T2]

RxDm

TxDm

1st byte

last byte

[T1]

ACK(0x88)

1st byte

[T1]

1st byte

[T2]

[T2] ACK

rBLE Host

Serial

Tx Func

Tx Comp Func

[T1] REQ

[T3] Packet

5. BLE Software Configuration

Figure 5-14 Transmit timing chart (APP MCU) (While BLE MCU transmitting)

After the transmission request, the serial communications driver begins the time-out watch. When the time-out is

generated, the serial communications driver is T1 that transmits the REQ byte for the re-transmission demand. The

recommended value at the timeout period is assumed to be 5msec.

[T3]

Figure 5-15 Transmit timing chart (APP MCU) (Timeout occurs)

The transmission sequence including rBLE_Host and serial communications driver's function calls is shown.

[When beginning to transmit]: The serial communications driver is T1 according to the call of rBLE_Host of the

transmission function that begins the transmission operation of the RSCIP packet, and transmits the REQ byte for the

transmission request.

[When the transmission ends]: The serial communications driver notifies rBLE_Host the transmission completion by

calling the transmission completion notification function when RSCIP packet transmission T1- T3 is completed.

BLE MCU APP MCU

Figure 5-16 Transmit Sequence (APP MCU)

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