
Datasheet
RJK6006DPP-A0
600V - 5A - MOS FET
High Speed Power Switching
Features
Low on-resistance
R
= 1.4 typ. (at ID = 2.5 A, VGS = 10 V, Ta = 25 C)
DS(on)
Low leakage current
High speed switching
Quality grade: Standard
Outline
RENESAS Package code:
(Package name:
TO-220FPA)
1
2
3
PRSS0003AP-A
R07DS1432EJ0100
Rev.1.00
Mar.10.2021
D
1. Gate
G
S
2. Drain
3. Source
Absolute Maximum Ratings
(Ta = 25 C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current IDR 5 A
Body-drain diode reverse drain peak current I
Avalanche current I
Avalanche energy E
Channel dissipation Pch
Channel temperature Tch 150 C
Storage temperature Tstg –55 to +150 C
Note: Continuous heavy condition (e.g. high temperature/voltage/current or high variation of temperature) may affect a
reliability even if it is within the absolute maximum ratings. Please consider derating condition for appropriate
reliability in reference Renesas Semiconductor Reliability Handbook (Recommendation for Handling and Usage
of
Semiconductor Devices) and individual reliability data
Notes: 1. PW 10 s, duty cycle 1 %
2. Value at Tc = 25 C
3. STch = 25 C, Tch 150 C
4. Limited by maximum safe operation area
DR (pulse)
600 V
DSS
30 V
GSS
Notes4
5 A
D
Notes1
D (pulse)
AP
AR
15 A
Notes1
15 A
Notes3
5 A
Notes3
1.36 mJ
Notes2
29 W
.
R07DS1432EJ0100 Rev.1.00 Page 1 of 6
Mar.10.2021

RJK6006DPP-A0
Thermal Resistance Characteristics
(Ta = 25 C)
Item Symbol Max. Value
Channel to case thermal impedance ch-c 4.31 CW
Notes: 5. Designed target value on Renesas measurement condition. (Not tested)
Notes5
Unit
Electrical Characteristics
(Ta = 25 C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown voltage V
Zero gate voltage drain current I
Gate to source leak current I
Gate to source cutoff voltage V
Static drain to source on state
resistance
Input capacitance Ciss — 600 — pF VDS = 25 V
Output capacitance Coss — 70 — pF
Reverse transfer capacitance Crss — 10 — pF
Turn-on delay time t
Rise time tr — 17 — ns
Turn-off delay time t
Fall time tf — 10 — ns
Total gate charge Qg — 19 — nC VDD = 480 V
Gate to source charge Qgs — 3.4 — nC
Gate to drain charge Qgd — 9.2 — nC
Body-drain diode forward voltage VDF — 0.9 1.5 V IF = 5 A, VGS = 0
Body-drain diode reverse recovery time trr — 250 — ns IF = 5 A, VGS = 0
Notes: 6. Pulse test
600 — — V ID = 10 mA, VGS = 0
(BR)DSS
— — 1 A VDS = 600 V, VGS = 0
DSS
— — 0.1 A VGS = 30 V, VDS = 0
GSS
3.0 — 4.5 V VDS = 10 V, ID = 1 mA
GS(off)
R
— 1.4 1.6 ID = 2.5 A, VGS = 10 V
DS(on)
V
= 0
GS
f = 1 MHz
— 25 — ns ID = 2.5 A
d(on)
V
= 10 V
GS
R
= 80
— 60 — ns
d(off)
L
Rg = 10
V
= 10 V
GS
I
= 5 A
D
di
dt = 100 As
F
Notes6
Notes6
R07DS1432EJ0100 Rev.1.00 Page 2 of 6
Mar.10.2021

RJK6006DPP-A0
Main Characteristics
Maximum Safe Operation Area
100
10
(A)
D
1
Tc = 25C
1 shot
Notes7
Operation in this
area is limited by
R
DS(on)
0.1
Drain Current I
0.01
0.001
0.1 1 10 100 1000
P
W
1
0
s
=
1
00
s
(A)
D
Drain Current I
Typical Output Characteristics
10
Ta = 25C
Pulse Test
8
0
1
6
4
2
0
048121620
V
6
V
7
V
6
V
.
5
V
8
.
5
4
V
.
5
.
5
2
V
V
5
V
=
8
.
4
V
G
S
Drain to Source Voltage V
DS
Typical Transfer Characteristics
10
VDS = 10 V
Pulse Test
8
(A)
D
6
4
Drain Current I
2
0
02 46810
Gate to Source Voltage V
Tc = 25C
25C
75C
GS
Static Drain to Source on State Resistance
vs. Temperature (Typical)
5
()
VGS= 10 V
Pulse Test
DS(on)
4
ID = 5 A
3
2
1 A
2.5 A
(V)
(V)
Drain to Source Voltage VDS (V)
Static Drain to Source on State Resistance
vs. Drain Current (Typical)
10
()
DS(on)
R
Drain to Source on State Resistance
VGS = 10 V
Ta = 25C
Pulse Test
1
0.1
110010
Drain Current ID (A)
Body-Drain Diode Reverse
Recovery Time (Typical)
1000
(ns)
rr
100
1
0
R
Static Drain to Source on State Resistance
-25 0 5025 75 100 125 150
Case Temperature Tc (C)
Reverse Recovery Time t
10
110100
Reverse Drain Current IDR (A)
di / dt = 100 A / s
V
= 0, Ta = 25C
GS
Notes: 7. Designed target value on Renesas measurement condition. (Not tested)
Renesas recommends that operating conditions are designed according to a document “Power MOS FET・
IGBT Attention of Handling Semiconductor Devices”.
R07DS1432EJ0100 Rev.1.00 Page 3 of 6
Mar.10.2021

RJK6006DPP-A0
Typical Capacitance vs.
Drain to Source Voltage (Typical)
10000
VGS= 0
f = 1 MHz
Ta = 25C
1000
100
10
Capacitance C (pF)
1
0200100 300
Drain to Source Voltage VDS (V)
Ciss
Coss
Crss
Dynamic Input Characteristics (Typical)
800
(V)
Drain to Source Voltage V
ID = 5 A
Ta = 25 C
DS
600 12
V
DS
400 8
200 4
0
VDD = 480 V
300 V
100 V
816243240
V
GS
VDD = 480 V
300 V
100 V
Gate Charge Qg (nC)
16
0
(V)
GS
Gate to Source Voltage V
Gate to Source Cutoff Voltage
vs. Case Temperature (Typical)
5
4
3
ID= 10 mA
1 mA
2
1
0
-25 0 25 50 75 100 125 150
VDS = 10 V
0.1 mA
Case Temperature Tc (C)
(A)
DR
Reverse Drain Current I
Reverse Drain Current vs.
Source to Drain Voltage (Typical)
16
VGS= 0
Ta = 25 C
Pulse Test
12
8
4
0
0.4 0.8 1.2 1.6 2.0
0
Source to Drain Voltage VSD (V)
(V)
GS(off)
Gate to Source Cutoff Voltage V
R07DS1432EJ0100 Rev.1.00 Page 4 of 6
Mar.10.2021

RJK6006DPP-A0
Normalized Transient Thermal Impedance vs. Pulse Widt
10
s (t)
D = 1
1
0.5
0.2
0.1
0.1
0.05
0
0
0.01
1
Normalized Transient Thermal Impedance
0.001
10 100
2
0
.
e
1
0
.
s
l
u
p
t
o
h
s
1 m 10 m 100 m 1 10 100
ch – c(t) = s (t) • ch – c
ch – c = 4.31C/W, Tc = 25C
P
DM
PW
T
Pulse Width PW (s)
Tc = 25C
Notes8
PW
D =
T
Switching Time Test Circuit Waveform
R
L
V
DD
= 200 V
Vout
Monitor
Vin
Vout
t
d(on)
10%
10%
90%
t
r
Vin Monitor
D.U.T.
10
Vin
10 V
Notes: 8. Designed target value on Renesas measurement condition. (Not tested)
t
d(off)
90%
90%
10%
t
f
R07DS1432EJ0100 Rev.1.00 Page 5 of 6
Mar.10.2021

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