Renesas RE Series, RE01 Series, RE0 Series, RE01 1500KB User Manual

All information contained in these materials, including products and pr o duct specifications, r epres en ts

Corporation website

(http://www.renesas.com).

RE01 Group

al

Rev. 1.00 Jun 2019

32

R

32

User's Manual

Evaluation Kit RE01 1500KB User’s Manu

E Family / RE0 Series

information on the prod uct at the time of publication and is su bject t o cha nge by Renesas Electronics
Corporation without notice. Please review the latest information published by Renesas Electronics
Corporation through various means, including the Renesas Electronics

Corporate Headquarters

Contact information

Trademarks

Notice

1. Descriptions of circuits, s oftware and other related in formatio n in this document are provided only to il lustrate t he opera tion of s emiconduc tor produ cts and
application exampl es . You are fully respon si ble for the incorporation or any other use of t he c i rcui t s, s oft w ar e, a nd information in the des ig n of your product or
system. Renesas Electro nics discl aim s any a nd all liability for a ny l osses a nd damag es i ncurr ed by you or t hird p arties arisin g f rom t he us e of t hese circuits,
software, or information.

2. Renesas Electronics hereby expressly disclaims any w ar ranties against and liability for infringement or any other claims involving patents, copyrights, or other
intellectual prop erty rights of third p arties, by or arising fr om the use of Rene sas Electronics pro ducts or technical i nformation descri bed in this document,
including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express , implied or otherwise, i s granted hereby under an y patents, copyrights o r other intellectual propert y rights of Renesas El ectronics or
others.

4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electro nic s dis cl aim s any and all
liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electronic s prod ucts are cl assified accordi ng to the f ollowin g two qu ality gra des: “Sta ndard” a nd “Hig h Qualit y”. The int ended ap plications for each
Renesas Electronics product depends on the prod uct’s qu ali ty gra de , as indicated below.
"Standard": Computers; office e quipment; comm unications eq uipment; test a nd measurement equi pment; audio and visual equipment; home electro nic

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communic ation equipment; key finan ci al

Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems tha t may pose a direct threat to human life
or bodily injury (artificial life supp ort devices or syst ems; surgical implant ations; etc.), or m ay cause serious pro perty damage (space s ystem; undersea
repeaters; nucl ear power cont rol systems; aircraf t control syst ems; key pla nt systems; mili tary equipment; etc.). Renes as Electroni cs disclaim s any and a ll
liability for any damag es or l osses i ncurred by you or any third p arties arising from t he use of any Renesas Elect ronic s p roduct t hat is inconsis tent wi th any
Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Ren esas Electronics products, ref er to the latest product information (data sheets, user’s manuals, application no tes, “General Notes for
Handling and Usi ng Semi conducto r De vices” in the reliabili ty handbook, e tc.), and ens ure that usage conditi ons are within th e ranges specif ied by R enesa s
Electronics with re spect to maximum ratin gs, operating power sup ply voltage range, h eat dissipation characteri stics, installation, etc . Renesas Electronics
disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas El ectronics products, semiconductor products have specific
characteristics, such as the occurr ence of failure at a certain rate and m alfunctions under c ertain use conditions . Unless design ated as a high reliability
product or a produ ct for harsh environm ents in a R en esas Electronics d ata s hee t or ot her Re nesas Elec tronics do cum ent, R enes as Elec troni cs pr oduct s a re
not subject to radi ation resistance des ign. You are responsible for implementi ng safety measures to gu ard against the possibilit y of bodily injury, injury or
damage caused by fire, and/or danger to the public in the eve nt of a failure or malfunct ion of Renesas Electronics products, such as safety design for
hardware and software, including but not limited to redunda ncy, fire control and m alfuncti on preven tion, appr opriate t reatment f or agin g degrada tion or a ny
other appropriate m easures . Becaus e the eval uation of m icrocom puter softw are alo ne is very di fficult an d impracti cal, you are r esponsi ble for eval uating th e
safety of the final products or systems m anuf act u red by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsibl e for carefully and sufficiently investi gating applicable l aws and regulations that regulate th e inclusion or use of
controlled subst ances, inc luding without limitat ion, the E U RoHS D irective, and us ing Renes as Elect ronics p roducts in compliance with all these appl icable
laws and regulatio ns. Renesa s Electro nics disclaims any and all l iability f or damage s or losses occurring as a result of your n oncomplia nce with applica ble
laws and regulations.

9. Renesas Electro nics products and technologies shall not be used for or incorporate d into any products or sys tems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated
and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the responsibility of the buye r or distributor of R enesas Electronics products, or a ny other party who distributes, di sposes of, or otherwise sells or
transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written cons ent of Renesas Electronics.

12. Please contact a Renes as Electronic s sales office if you have any questi ons regarding the inform ation cont ained in this documen t or Renesas Electronic s
products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

subsidiaries.

appliances; machine tools; personal electronic equipment; industrial robots; etc.

terminal systems; safety control equip m ent; etc.

(Rev.4.0-1 November 2017)

TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan

www.renesas.com

Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and regis t er ed tra dem arks
are the property of their respective owners.

For further inform ation on a prod uct, techn ology, the most up-to-date
version of a document, or your nearest sales office, please visit:

www.renesas.com/contact/

.

© 2019 Renesas Electronics Corporation. All rights reserved.

General Precautions in the Handling of Microproc essing Unit and Microcontroller Unit
Products

The following usage n otes are appli cable to all Microp rocessing uni t and Microcontroll er unit product s from Renesas . For detailed usage notes on the pro ducts
covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when ex posed to a CMOS devi ce, can cause dest ruction of t he gate oxi de and ultim ately d egrade t he device operati on. Steps must
be taken to stop the g eneration of stat ic electricity as much a s possible, and quickly dissipate it w hen it occurs. En vironmental control must be adequate.
When it is dry, a humidifi er sh ould be used. This is rec ommende d to av oid u sing ins ulators that c an easi ly buil d up static el ectricity. Semicon ductor devices
must be stored and transported in a n a nt i-stat ic container, static shielding b ag or c ond uc tive material. All test and measurem en t to ol s i n cluding work bench e s
and floors must be gr ound ed. Th e operat or mus t also be g roun ded us ing a wri st stra p. Sem icond uct or devic es m ust not b e touch ed wit h bare hands. Simila r
precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on
The state of the product is undefined at th e ti m e when power is supplied. The states of internal circuits in the LSI are indetermin ate a nd the states of r egister
settings and pins ar e u ndef ine d a t the time when pow er is supplied. In a fi ni sh ed p ro duc t whe re t he res et signal is applied t o t he e xt e rn al re set pin, the states
of pins are not gua rante ed fr om the time w hen pow er is suppl ied unti l the rese t process is com pleted. In a simil ar way, the states o f pins in a pr oduct that i s
reset by an on-chip pow er-on reset f unction are not gu arantee d from the tim e when power is s upplied until the power reach es the level at whi ch resetti ng is
specified.

3. Input of signal during power-off state
Do not input si gnals or an I/O pull-up power supply while the device is powere d of f. T h e c urr en t i nj ec ti on that results f rom in put of such a si gnal or I/O pull-up
power supply m ay c a use m al f unc ti on a nd th e abnormal cur rent th at passes i n the device at this time may cause d eg r ada ti on of internal elements. Follow t he
guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins
Handle unused pi ns i n acco rdanc e wit h the dir ections gi ven under han dling of un used pins i n th e man ual. T he in put pins of C MOS p roduc ts a re g enerall y i n
the high-impedanc e state. In operation with an un used pin in the open-circuit state, extra electromagnetic nois e is induced in the vici nity of the LSI, an
associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible.

5. Clock signals
After applying a r eset, only release the rese t line after the o per at in g cl ock signal becomes stable. W h en s witching the clock signal during p ro gram execution,
wait until the tar get clock signal is st abilized. When the cl ock signal is gene rated with an external resonator or from an external oscilla tor during a reset,
ensure that the r eset line is only rele ased aft er full stabilizati on of th e clock si gnal. Additi onally, when switchi ng to a clo ck sign al produced with an e xternal
resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin
Waveform distortion due t o input noi se or a reflec ted w ave m ay caus e malfu nct ion. If the i npu t of the CM OS devi ce st ays in the area betwee n V
V

(Min.) due t o nois e, for exampl e, the device may malfunc ti on. Take care to prevent chatteri n g noise from enteri ng t he de vic e wh en the input lev el i s fi xe d,

IH

and also in the transition period when the input level passes thr oug h the ar ea between V

7. Prohibition of access to reserved addresses
Access to reserved a dd ress es i s p ro hi bi te d. T h e r eserved addresse s a re p ro vi ded f or pos s ible future expan si on of f unc ti ons . Do not access these ad dress es
as the correct operation of the LSI is not guaranteed.

8. Differences between products
Before changing f rom one product to another, for ex ample to a product wit h a different part number, confi rm that the change will not lead to problems . The
characteristics of a m ic ro pr oces s in g unit or microcontrolle r uni t products in the same group but having a different part number might differ in terms of i nternal
memory capacity, layout patter n, and o ther fact ors , whic h can affect the range s of elec trical char acteri stic s, such as char act eristic values, opera ting ma rgi ns,
immunity to noise, a nd am ount of radi ated nois e. Whe n cha nging t o a product with a different part num ber, implement a syst em-evalu ation t est for th e give n
product.

(Max.) and VIH (Min.).

IL

(Max.) and

IL

The Evaluation Kit is not guaranteed to be error free, and the entire risk as to the results and performance of the

Disclaimer

By using this Evaluation Kit, the user accepts the following terms:

Evaluation Kit is assumed by the User. T he Evaluation Kit is provided by Renesas on an “as is” basis without
warranty of any kind whether express or implied, including but not limited to the implied warranties of satisfactory
quality, fitness for a particular purpose, title and non-infringement o f intellectual property rights with regard to the
Evaluation Kit. Renesas expressly disclaims all such warranties. Renesas or its affiliates shall in no event be liable
for any loss of profit, loss of data, loss of contract, loss of business, damage t o reputation or goodwill, any economic
loss, any reprogramming or recall costs (whether the foregoing losses are direct or indirect) nor shall Renesas or its
affiliates be liable for any other direct or indirect special, incidental or consequential damages arising out of or in
relation to the use of this Evaluation Kit, even if Renesas or its affiliates have been advised of the possibility of such
damages.

Precautions

The following precautions should be observed when oper ati ng any Evalu ati on Kit product:

This Evaluation Kit is only intended for use in a laboratory environment under ambient temperature and humidity
conditions. A safe separation distance should be used between this and any sensitive equipment. Its use outside the
laboratory, classroom, study area or similar such area invalidates conformity with the protection requirements of the
Electromagnetic Compatibility Directive and could lead to prosecution.

The product generates, uses, and can radiate radio frequency energy and may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If this
equipment causes harmful interference to radio or television reception, which can be determined by turning the
equipment off or on, you are e ncour aged to try to correct the interference by one or more of the following measures;

• ensure attached cables do not lie across the equipm ent

• reorient the receiving antenna

• increase the distance between the equipment and the receiver

• connect the equipment into an outlet on a circuit different from that which the receiver is connected

• power down the equipment when not in use

• consult the dealer or an experienced radio/TV technician for help NOTE: It is recommended that wherever

possible shielded interface cables are used.

The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that the
following measures be undertaken;

• The user is advised that mobile phones should not be used within 10m of the product when in use.

• The user is advised to take ESD precautions when handling the equipment.

The Evaluation Kit does not represent an ideal r eference design for an end product and does not fulfil the regulatory
standards for an end product.

The revision history summarizes the locations of revisions and additions. It does not lis t a ll re vis ion s. Refer to the text of

Document Type

Description

Document Title

Document No.

Quick Start Guide

Provides simple inst ructions setup the

Evaluation Kit for RE01 1500KB

R20UT4562EJ

Schematics

Full detail circuit schemati cs of the

Evaluation Kit for RE01 1500KB

R20UT4564EJ

Hardware Manual

Provides technical details of the RE01

RE01 Group Products with 1.5-Mbyte

R01UH0796EJ

How to Use This Manual

1. Purpose and Target Readers

This manual is designe d to provide the user with an understanding of the Evaluation Kit Evaluation Board
hardware functionality, and electrical characteristics. It is intended for users designing sample code on the
Evaluation Kit Evaluation Board platform, using the many different incorporated peripheral devices.

The man ual compris es of an ov erview of the capab ilities of the Ev aluation Kit product, but does not intend to
be a guide to embedded programming or hardware design.

Particular attention should be paid to the precautionary notes when using the manual. These notes occur within the body
of the text, at the end of each section, and in the Usage Notes section.

the manual for details.

The following documents a pply to Evaluation Kit for RE01 1500KB. Make sure to refer to th e latest versions of
these documents. The newest versions of the documents listed may be obtained from the Renesas
Electronics Web site.

User’s Manual Describes the technical details of the

Evaluation Kit hardware.

Evaluation Kit for E01 1500KB and run
the first sample.

Schematics Full detail circuit schematics of the

Evaluation Kit Main Board.

Evaluation Kit MIP-LCD Expansion
Board.

device.

Evaluation Kit for RE01 1500KB
User’s Manual

Quick Start Guide

Evaluation Kit for RE01 1500KB
main board schematics

MIP-LCD Expansion board schematics

Flash Memory User’s Manual:
Hardware

R20UT4379EJ
(This manual)

R20UT4563EJ

Abbreviation

Full Form

ADC

Analog-to-Digital Converter

bps

bits per second

CPU

Central Processing Unit

CRC

Cyclic Redundancy Check

DAC

Digital-to-Analog Converter

DIP

Dual In-line Package

DMA

Direct Memory Access

DMAC

Direct Memory Access Controller

DNF

Do Not Fit

E2

Renesas On-chip Debugging Emulator

EEPROM

Electronically Erasable Programmable Read Only Memory

EH

Energy Harvesting

EHC

Energy Harvesting Control Circuit

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

GPT

General PWM Timer

IRQ

Interrupt Request

LDO

Low Dropout

LED

Light Emitting Diode

MIP-LCD

Memory In Pixel - Liquid Crystal Display

n/a (NA)

Not Applicable

n/c (NC)

Not Connected

NMI

Non-maskable Interrupt

OTG

On The Go

PC

Personal Computer

PDC

Parallel Data Capture Unit

PLL

Phase Locked Loop

This is a Digilent Pmod™ Compatible connector. Pmod™ is registered to Digilent Inc.
Digilent-Pmod_Interface_Specification

POE

Port Output Enable

PWM

Pulse Width Modulation

RAM

Random Access Memory

ROM

Read Only Memory

RTC

Real Time Clock

SCI

Serial Communications Interface

SFR

Special Function Registers

SPI

Serial Peripheral Interface

TFT

Thin Film Transistor

TPU

Timer Pulse Unit

UART

Universal Asynchronous Receiver/Transmitter

USB

Universal Serial Bus

WDT

Watchdog Timer

2. List of Abbreviations and Acronyms

I2C (IIC) Philips™ Inter-Integrated Circuit Connection Bus
I-jet IAR System JTAG Emulator
J-Link OB SEGGER On-board debug probe

Pmod™

All trademarks and registered trademarks are the property of their respective owners.

Table of Contents

1. Overview ............................................................................................................................ 9

1.1 Purpose ...................................................................................................................................................... 9

1.2 Board specification ................................................................................................................................... 10

2. Power Supply .................................................................................................................. 12

2.1 Requirements ........................................................................................................................................... 12

3. Board Layout ................................................................................................................... 13

3.1 Component Layout ................................................................................................................................... 13

3.2 Board Dimensions .................................................................................................................................... 14

3.3 Component Placement ............................................................................................................................ 16

4. Connectivity ..................................................................................................................... 19

4.1 Internal Board Connections ..................................................................................................................... 19

4.2 Debugger Connections ............................................................................................................................ 20

5. User Circuitry ................................................................................................................... 21

5.1 Reset Circuit ............................................................................................................................................ 21

5.2 Clock Circuit ............................................................................................................................................. 21

5.3 Switches ................................................................................................................................................... 21

5.4 LEDs ........................................................................................................................................................ 21

5.5 Potentiometer ........................................................................................................................................... 22

5.6 Pmod™ .................................................................................................................................................... 23

5.7 MIP-LCD Expansion Board Interface ....................................................................................................... 24

5.8 USB Serial Conversion ............................................................................................................................ 24

5.9 Memory In Pixel Liquid Crystal Display (MLCD) ...................................................................................... 25

5.10 Serial Peripheral Interface (SPI) .............................................................................................................. 25

5.11 Quad Serial Peripheral Interface (QSPI) ................................................................................................. 25

5.12 Universal Serial Bus (USB) ...................................................................................................................... 26

5.13 Arduino UNO interface ............................................................................................................................. 27

5.14 Sensor board interface ............................................................................................................................. 28

5.15 Energy Harvesting Circuit ........................................................................................................................ 29

5.16 Current Measurement Circuit ................................................................................................................... 30

6. Configuration ................................................................................................................... 31

6.1 Modifying the Evaluation Kit..................................................................................................................... 31

6.2 Operating Modes ..................................................................................................................................... 31

6.3 Emulators Configuration .......................................................................................................................... 32

6.4 Power Supply Configuration .................................................................................................................... 33

6.5 Clock Configuration .................................................................................................................................. 35

6.6 Analog Power & ADC Configuration ........................................................................................................ 35

6.7 General IO & LED Configuration ............................................................................................................. 37

6.8 IRQ & Switch Configuration ..................................................................................................................... 37

6.9 PMOD1 (MIP-LCD Expansion Board) Configuration ............................................................................... 38

6.10 PMOD2 Configuration .............................................................................................................................. 38

6.11 QSPI Configuration .................................................................................................................................. 40

6.12 USB Serial Configuration ......................................................................................................................... 41

6.13 MLCD Configuration ................................................................................................................................ 42

6.14 Sensor Board Configuration..................................................................................................................... 42

6.15 USB Configuration ................................................................................................................................... 43

6.16 Arduino UNO Configuration ..................................................................................................................... 44

6.17 Energy Harvesting Configuration ............................................................................................................. 46

6.18 Current Measurement Configuration ....................................................................................................... 48

7. Headers ........................................................................................................................... 49

7.1 RE01 Headers ......................................................................................................................................... 49

8. Code Development .......................................................................................................... 53

8.1 Overview .................................................................................................................................................. 53

8.2 Mode Support .......................................................................................................................................... 53

8.3 Address Space ......................................................................................................................................... 53

9. Additional Information ...................................................................................................... 54

Evaluation Kit RE01 1500KB R20UT4379EJ0100

Rev. 1.00

Jun 26, 2019

1. Overview

1.1 Purpose

This Evaluation Kit is an evaluation tool for Renesas RE01 device. This manual d esc ribes the technical detai ls
of the Evaluation Kit hardware.

R20UT4379EJ0100 Rev. 1.00 Page 9 of 58
Jun 26, 2019

Evaluation Kit RE01 1500KB 1. Overview

Item

Specification

Part No : R7F0E015D2CFB

Package : 144-pin LFQFP

On-Chip Memory : ROM 1.5MB, RAM 256KB

On-Board Memory

SPI Serial Flash: 64Mbit

RE01 Main: 32MHz

RE01 Sub: 32.768kHz

RX621(SEGGER J-Link OB) Main: 12MHz

DC Power Jack : 5 V Input

Power Supply IC : 5V Input, 3.3V Output

Power Supply IC: 2.6V Input, 3.3V Output(For peripheral circuit power when EH function enable)

I-jet / J-Link / E2 20-pin box header

USB Connector for J-Link OB

Mode Configuration : 1-pole x 2

For Normal / EH Switch : 3-pole x 2

Reset Switch x 1

User Switch x 3

Potentiometer (for ADC)

Single-turn, 10kΩ

5V Power indicator: green x 1

USB Function: USB-MicroB

USB Host: USB-TypeA

MLCD

FPC: 0.3mm pitch,19-pin x 1

Connector: USB-MicroB

Driver: USB Interface IC (Part Number FT230XQ)

Interface *1

PMOD1 *2: Angle type, 12-pin Connector

Solar Panel Interface

2.54mm pitch: 2-pin x 1

2.54mm pitch: 10-pin x 1 (J6),8-pin x 2 (J10, J18),6-pin x 1 (J19)

RE01 Header *4

2.54mm pitch: 36-pin x 4 (J7, J8, J9, J21)

1.2 Board specification

Board specification was shown in Table 1-1,Table 1-2 below.

Table 1-1: Board Specification

Target Device

Input Clock

Power Supply

Debug Interface*1

Slide Switch

Push Switch

LED

USB

USB to Serial Converter Interface

MIP-LCD Expansion Board

Pmod™

External Battery Interface
Sensor Board Interface

Arduino UNO Interface

*1

: Use each debugger exclusively. When using J-Link OB, do not connect other emulators.

*2

: PMOD1 is used both on MIP-LCD Expansion Board and PmodTM.

*3

: The external battery is not included to a product.

*4

: The connector is not included to a product.

User: green x 1, orange x 1, red x 1

2.54mm pitch: 12 pin x 1(PMOD1)

PMOD2 : Angle type, 12-pin Connector

3

3.5mm pitch: 2-pin x 1 *

2.54mm pitch: 8-pin x 1 *

4

R20UT4379EJ0100 Rev. 1.00 Page 10 of 58
Jun 26, 2019

Evaluation Kit RE01 1500KB 1. Overview

Item

Specification

Part No: TN0181ANVNANN-AN00*1 (KYOCERA)

Size: 1.81 inch

Resolution: 200dpi (256(H) x 256(V))

Main Board Interface

2.54mm pitch: 12-pin x 1(PMOD1)

Table 1-2: MIP-LCD Expansion Board Specification

MIP-LCD

*1

: Please contact KYOCERA.

R20UT4379EJ0100 Rev. 1.00 Page 11 of 58
Jun 26, 2019

Evaluation Kit RE01 1500KB 2. Power Supply

Emulator

Supply voltage

Supply current

I-jet

5V

Maximum 420mA

J-Link OB

5V

Maximum 500mA

J-Link

5V

Maximum 300mA

Connector

Supply voltage

J13*1

Setting

J22

Setting

J23

Setting

Supply Source

Board_5V

Board_3V3

LP_PRODUCT_3V3

UC_VCC

All

Pin1-2

-*2

PWR / J-link OB
MIPI_5V

5.0V

3.3V

3.3V

3.3V

Pin2-3

shorted

Pin1-2

shorted

VCC_MCU

-*3

-*3

3.3V

3.3V Pin2-3
shorted

RE-BATTERY_VCC

-*3

-*3

3.3V

3.3V

Shorted

Pin1-2

shorted

-*2

VBUS

5.0V

3.3V

3.3V

3.3V

Pin2-3

Pin1-2

shorted

VCC_MCU

-*2

-*2

3.3V

3.3V

Pin2-3

shorted

RE-BATTERY_VCC

-*3

-*3

3.3V

3.3V

2. Power Supply

2.1 Requirements

This Evaluation Kit was supplied with power supply from emulator. The detail was shown in Table 2-1. When
the Evaluation Kit is connected to another system then that system should supply power to the Evaluation Kit.
This board has an optional center positive supply connector using a barrel power jack.

Table 2-1: Emulator Power Supply Requirements

*

: Do not supply power to the Evaluation Kit from the E2 emulator or E2 emulator Lit e . Connect an external

power supply when using the E2 emulator or E2 emulator Lite.

This Evaluation Kit support 5V input voltage and specific setting was not needed. Details of the external power
supply requirements for t he Evaluation Kit, and con figuration were sh own in Table 2-2 and Table 2-3 below.
The default Evaluation Kit power configuration was shown in bold, blue text.

Table 2-2: PWR connector Requirements

PWR Input 5VDC

Table 2-3: Main Power Supply Requirements

Open

shorted

shorted

USB_5V / I-jet

*1

: The jumper is not included in the product.

*2

: Don’t care.

*3

: Set jumper J22 2-3 shorted when using EHC. Besides, external pow er sup ply is not assumed when using EHC.

The main power supply connected to PWR1 should supply a minimum of 5W to ensure full functionality.

R20UT4379EJ0100 Rev. 1.00 Page 12 of 58
Jun 26, 2019

Evaluation Kit RE01 1500KB 3. Board Layout

PMOD2

USB
Func

FT232XQ

USB to Serial Port

J19J10

PMOD1

J7

FLASH MEMORY

J9

J18J6

Solar P anel

Interface

J21

USB

Func

RX621

(100pin

LQFP)

J8

MIP-LCD Connector

RE01 Headers

DC PWR I N

(5V)

User Switches

PMOD

Connector

Power LED
5V_PWR(GREEN)

Reset

Switch

Potentiometer

USB
Host

USB

Function

LED 2

LED 1

LED 0

User LEDs

Arduino UNO Interface

SW1 SW2 SW3

MIP-LCD

Expansion Board

Interface

Sensor Board

Interface

Emul ator connector

USB

Function(FT232XQ)

J-LINK OB

USB Function

(RX621)

External-Battery

Interface

Slide Switch

Solder S ide Component

Super Capacitor

RES

RE01 1500KB

(144pinLQFP)

MODE
Switch

CN1

PMOD1

MIP-LCD Panel

Main Board

Interface

FPC Connector

3. Board Layout

3.1 Component Layout

Figure 3-1, Figure 3-2 below show component layout of Evaluation Kit.

Figure 3-1: Main Board Layout

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Jun 26, 2019

Figure 3-2: MIP-LCD Expansion Board Layout

Evaluation Kit RE01 1500KB 3. Board Layout

4.0mm phai

12.0mm phai

PWR

PMOD2

USB
Func

J19J10

PMOD1

Sensor

J7

J9

J18J6

Emulator

J21

USB

Func

RX621

(100pin

LQFP)

J8

SW5

SW6

SCAP

RE01 1500KB

(144pin LQFP)

SW4

SW7

USB_1

USB_2

CN3

7mm

7mm

5.9mm

15.24mm

17.20mm

34.98mm

35.40mm

39.044mm

78.58m

125.00m

54.16mm

70.94mm
80mm

121.74mm

129.36mm

142.06mm

170.00mm

3.2 Board Dimensions

Figure 3-3, Figure 3-4 below show the board dimensions and connector positions. All the through-hole

connectors are on a common 2.54mm pitch grid for easy interfacing.

Figure 3-3: Main Board Dimensions

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Evaluation Kit RE01 1500KB 3. Board Layout

CN

1

PMOD

1

MIP

-LCD Panel

55.0mm

82.0mm

4.0

mm phai

12.0mm phai

Figure 3-4: MIP-LCD Expansion Board Dimensions

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Evaluation Kit RE01 1500KB 3. Board Layout

PMOD

2

Sensor1

USB_1

USB_2

SW8

SW9

T20 T21

BT2

GND2

R1

USB1

D1 D2

D3

L1

R3

R4

R6

R7

R8

R5

CN2

R17 R23

GND1

PMOD1

R12
R14
R20

R19

U6

C3

C4

C9

R13
R18
R24

R2

T8

C5

C6

R11

J3

J2

R15

R16

R25

R21

D5 D6

L3

R26

R27

D4

R10

R9

T19

T18

C7

C8

SW5

SW6

C1

C2

J23

J1

U7

R29

X3

R41
R44

R173

R49
C14

GND3

C10

C11

R37

R39

R42

R45

R47

R51

R55

R59

C12

C13

R35

T7

T6

R294

T17

BT1

R61

C19

J-Link_

10pin_Needle

T1

R48

R52

R53

R54

C16

C15

R58

J4

J5

T9

T10

R33
R36
R40

R43
R46
R50
R56
R60
R62
R68
R73
R76
R80
R84

R63

R92

R96
R100
R105
R109

R111
R114
R117
R121
R124

R67
R72
R75
R79
R83
R87
R91
R95

R108
R110
R113
R116
R120
R123

C22

U1

C17

C21

R69

C18

C20

X1

R66
R74

R103

R99

R104

X2

C25

C23

C28

R127

C31

R112
R115
R119

C32 C33 C34

C37 C38

J14

CN3

R64 R65
R70 R71
R77 R78

R81 R82
R85 R86
R89 R90
R93 R94
R97 R98

R88

R101 R102
R106 R107

L12

L4

C26

C24

T5

USB2

C29

C30

R125

R118
R122

L5
L6

J13

C27

R128
R129

J7

J8

T16

T15

J17

R126

C35

C36

C39

J15

T14

T13

J16

T12

T11

J12

J9

T3

J10

J19

J6 J18

PWR1

D7

C40

C41

L7

R159

T2

T4

J20

R158

C42

C43

L8

L9

U4

U5

C47

C48

U11

C67

R135

R136

R137

R138

R139

R140

R141

R142

R143

R144

R145

R146

R147

R148

R149

R150

R151

R152

R153

R154

R155

R156

R157

POWLED1

R161

GND6

C44

U2

J22

L11

C50

SW1

SW2

SW3

C45

U3

L10

C46

U10

C66

J21

R164

R165

R166

LED0

R170

LED1

R171

LED2

R172

C49

R162

RES

R167

SW4

SW7

GND5

R168

R169

C51

C52

RV1

C64

GND4

3.3 Component Placement

Figure 3-5, Figure 3-6, Figure 3-7 below show placement of individual components of Evaluation Kit .

Component types and values are shown on the board schematics.

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Jun 26, 2019

Figure 3-5: Main Board Top-Side Component Placement

Evaluation Kit RE01 1500KB 3. Board Layout

R182

R181

R180

R179

R178

R177

R176

R175

R174

R287

R288

C56

C55

U8

R185

R183

C57

C54

C53

C58

C59

R57

SW10

R186
R187
R184
R191
R194
R198
R202
R205
R208
R211

R215
R217

C63

C65

U9

J7

R213
R216

R218
R219

R224
R227
R230
R233
R236
R240
R242
R243
R245
R247
R249
R250
R251

J8

R188

R189
R192
R195
R199
R203
R206
R209
R212
R214

R235
R232
R220
R222

R226
R229

C60

R293

C61
C62

R239

R238

R225
R228

R231

R234
R237
R241

J9

R190
R193
R197

R290
R289
R292
R291

R207

R210

R201

R204

R281

R280

R277

R276

R275

R274

R273

R272

R271

R270

R269

R268

R267

R266

R265

R264

R263

R262

R261

R260

R259

R258

R257

R256

R255

R254

R253

R252

R283

R282

J21

R284

R286

R285

Figure 3-6: Main Board Bottom-Side Component Placement

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Evaluation Kit RE01 1500KB 3. Board Layout

CN1

PMOD1

Figure 3-7: MIP-LCD Expansion Board Top-Side Component Placement

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Jun 26, 2019