Renesas RE01 User Manual
16
Rev.1.02 2021.4
R
32
RE01 Group
)
ual
User's Manual
Evaluation Kit RE01 256KB (EK-RE01 256KB
User’s Man
E Family／RE0 Series
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corporation without notice. Please review the latest information published by
Renesas Electronics Corporation through various means, including the Renesas Electronics
Corporation website (http://www.renesas.com).
Notice
Corporate Headquarters
Contact information
Trademarks
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your
product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of
these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or
other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this
document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
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and all liability for any losses or dam ages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for
each Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to
human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system;
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any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is
inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
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hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but not
limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESAS
ELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USING
RENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE,
HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLAIMS ANY AND
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RESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO THE
IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.
8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by
Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such
specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific
characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products
are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury,
injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety
design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are
responsible for evaluating the safety of the final products or systems manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these
applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance
with applicable law s and regulations.
11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations
promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
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transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
13. This document shall not be reprinted, reproduced or duplicated in any form, i n whole or in part, without prior written consent of Renesas Electronics.
14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
financial terminal systems; safety control equipment; etc.
(Rev.5.0-1 October 2020)
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered trademarks
are the property of their respective owners.
For further information on a product, technology, the most up-to-date
version of a document, or your nearest sales office, please visit:
www.renesas.com/contact/.
General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devi ces must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be
touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level
at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.
5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switchi ng the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced
with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V
and V
(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level
IH
is fixed, and also in the transition period when the input level passes through the area between V
7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct operation of the LSI is not guaranteed.
8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of
internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-
evaluation test for the given product.
(Max.) and VIH (Min.).
IL
(Max.)
IL
Disclaimer
The Evaluation Kit is not guaranteed to be error free, and the entire risk as to the results and performance of the
By using this Evaluation Kit, the user accepts the following terms:
Evaluation Kit is assumed by the User. The Evaluation Kit is provided by Renesas on an “as is” basis without
warranty of any kind whether express or implied, including but not limited to the implied warranties of satisfactory
quality, fitness for a particular purpose, title and non-infringement of intellectual property rights with regard to the
Evaluation Kit. Renesas expressly disclaims all such warranties. Renesas or its affiliates shall in no event be liable
for any loss of profit, loss of data, loss of contract, loss of business, damage to reputation or goodwill, any economic
loss, any reprogramming or recall costs (whether the foregoing losses are direct or indirect) nor shall Renesas or its
affiliates be liable for any other direct or indirect special, incidental or consequential damages arising out of or in
relation to the use of this Evaluation Kit, even if Renesas or its affiliates have been advised of the possibility of such
damages.
Precautions
The following precautions should be observed when operating any Evaluation Kit product:
This Evaluation Kit is only intended for use in a laboratory environment under ambient temperature and humidity
conditions. A safe separation distance should be used between this and any sensitive equipment. Its use outside the
laboratory, classroom, study area or similar such area invalidates conformity with the protection requirements of the
Electromagnetic Compatibility Directive and could lead to prosecution.
The product generates, uses, and can radiate radio frequency energy and may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If this
equipment causes harmful interference to radio or television reception, which can be determined by turning the
equipment off or on, you are encouraged to try to correct the interference by one or more of the following measures;
• ensure attached cables do not lie across the equipment
• reorient the receiving antenna
• increase the distance between the equipment and the receiver
• connect the equipment into an outlet on a circuit different from that which the receiver is connected
• power down the equipment when not in use
• consult the dealer or an experienced radio/TV technician for help NOTE: It is recommended that wherever
possible shielded interface cables are used.
The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that
the following measures be undertaken;
• The user is advised that mobile phones should not be used within 10m of the product when in use.
• The user is advised to take ESD precautions when handling the equipment.
The Evaluation Kit does not represent an ideal reference design for an end product and does not fulfil the regulatory
standards for an end product.
How to Use This Manual
Document Type
Description
Document Title
Document No.
f the
Evaluation Kit hardware.
User’s Manual
(This manual)
p
and run the first sample.
schematics of the
Evaluation Kit Main Board.
main board schematics
il circuit schematics of the
MIP-LCD Expansion Board.
schematics
User’s Manual: Hardware RE01
1.Objective and Target Users
This manual is designed to provide the user with an understanding of the Evaluation Kit Evaluation Board
hardware functionality, and electrical characteristics. It is intended for users designing sample code on the
Evaluation Kit Evaluation Board platform, using the many different incorporated peripheral devices.
The manual comprises of an overview of the capabilities of the Evaluation Kit product, but does not intend to
be a guide to embedded programming or hardware design.
Particular attention should be paid to the precautionary notes when using the manual. These notes occur within the body
of the text, at the end of each section, and in the Usage Notes section.
The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the text of
the manual for details.
The following documents apply to Evaluation Kit for RE01 256KB. Make sure to refer to the latest versions of
these documents. The newest versions of the documents listed may be obtained from the Renesas
Electronics Web site.
User’s Manual Describes the technical details o
Quick Start Guide Provides simple instructions setu
the Evaluation Kit for RE01 256KB
Schematics Full detail circuit
Schematics Full deta
Hardware Manual Provides technical details of the
RE01 device.
Evaluation Kit RE01 256KB
Evaluation Kit RE01 256KB
Quick Start Guide
Evaluation Kit RE01 256KB
MIP-LCD expansion board
RE01 Group Products with
256-Kbyte Flash Memory
R20UT4801EJ
R20UT4808EJ
R20UT4802EJ
R20UT4564EJ
R01UH0894JJ
List of Abbreviations and Acronyms
Abbreviation
Full Form
BLE
Bluetooth Low Energy
DNF
Do Not Fit
E2
Renesas On-chip Debugging Emulator
EH
Energy Harvesting
EHC
Energy Harvesting Control Circuit
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
IRQ
Interrupt Request
LDO
Low Dropout
LED
Light Emitting Diode
MIP-LCD
Memory In Pixel - Liquid Crystal Display
MLCD
Memory In Pixel - Liquid Crystal Display
PC
Personal Computer
RAM
Random Access Memory
RFP
Renesas Flash Programmer
SCI
Serial Communications Interface
SPI
Serial Peripheral Interface
USB
Universal Serial Bus
All trademarks and registered trademarks are the property of their respective owners.
2.
FPC Flexible Printed Circuits
I-jetTM IAR System® JTAG Emulator
J-LinkTM SEGGER debug probe
J-LinkTM OB SEGGER On-board debug probe
n/c (NC) Not Connected
Pmod™
This is a Digilent Pmod™ Compatible connector. Pmod™ is registered to Digilent Inc.
Digilent-Pmod_Interface_Specification
Table of Contents
1. Overview ........................................................................................................................................................... 9
1.1 Purpose ...................................................................................................................................................... 9
1.2 Kit Contents ............................................................................................................................................... 9
1.3 Board Specifications ................................................................................................................................ 10
1.4 Board Exterior .......................................................................................................................................... 12
2. Board Layout .................................................................................................................................................. 14
2.1 Component Layout ................................................................................................................................... 14
2.2 Board Dimensions .................................................................................................................................... 15
2.3 Component Placement ............................................................................................................................ 17
2.4 Board Initial Settings ................................................................................................................................ 20
3. Internal Board Connections ............................................................................................................................ 21
4. Power Supply .................................................................................................................................................. 24
4.1 Power Supply System .............................................................................................................................. 24
4.2 Power Supply Source .............................................................................................................................. 25
4.3 External Power Supply ............................................................................................................................. 26
5. Operation/Start-up Mode ................................................................................................................................ 32
5.1 Normal Operation ..................................................................................................................................... 32
5.2 EHC Operation ......................................................................................................................................... 33
5.3 RE01 Start-up Mode ................................................................................................................................ 42
6. Debug ............................................................................................................................................................. 43
6.1 J-LinkTM OB .............................................................................................................................................. 43
6.2 I-jetTM, J-LinkTM ......................................................................................................................................... 46
6.3 E2 ............................................................................................................................................................. 49
6.4 Flash Programmer -Renesas Flash Programmer- .................................................................................. 52
6.5 Flash Programmer -SEGGER J-Flash Lite- ............................................................................................. 57
6.6 Emulator connection in EHC mode .......................................................................................................... 58
7. Current Measurement Circuit ......................................................................................................................... 60
7.1 Current measurement when using the on-board regulator 3.3V ............................................................. 60
7.2 Current measurement when not using on-board regulator 3.3V ............................................................. 62
7.3 Current measurement during EHC operation .......................................................................................... 63
8. User Circuitry .................................................................................................................................................. 66
8.1 Reset Circuit ............................................................................................................................................ 66
8.2 Clock Circuit ............................................................................................................................................. 67
8.3 Switches ................................................................................................................................................... 68
8.4 LED .......................................................................................................................................................... 69
8.5 Pmod™ Interface ..................................................................................................................................... 70
8.6 USB Serial Conversion ............................................................................................................................ 75
8.7 MLCD (Memory In Pixel Liquid Crystal Display) Interface ....................................................................... 77
8.8 Flash Memory .......................................................................................................................................... 78
8.9 Arduino UNO Interface ............................................................................................................................. 79
8.10 External DC/DC Circuit ............................................................................................................................ 82
9. Headers .......................................................................................................................................................... 84
9.1 RE01 Headers ......................................................................................................................................... 84
10. Code Development ....................................................................................................................................... 88
10.1 Overview .................................................................................................................................................. 88
10.2 Mode Support .......................................................................................................................................... 88
10.3 Address Space ......................................................................................................................................... 88
11. Additional Information ................................................................................................................................... 89
No
Kit Contents
1
Main board
Part No.: RTK70E0118C00001BJ
2
MIP-LCD Expansion board
Part No.: RTK70E015DB00000BJ
3
Solar panel
Part No.: AM-1815CA (Panasonic)
4
USB cable
Type-A male to micro-B male
5
IC clip
Red, Black
Evaluation Kit RE01 256KB R20UT4801EJ0102
Rev.1.02
Apr 16, 2021
1. Overview
1.1 Purpose
This Evaluation Kit is an evaluation tool for Renesas RE01 device. This manual describes the technical
details of the Evaluation Kit hardware.
1.2 Kit Contents
Kit contents included in the Evaluation Kit are shown in Table 1-1.
Table 1-1: Kit Contents
R20UT4801EJ0102 Rev.1.02 Page 9 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 1.Overview
Item
Specifications
Part No.: R7F0E01182CFP
Package: 100-pin LFQFP
On-chip memory: ROM 256KB, RAM 128KB
On-Board Memory
SPI Serial Flash: 64Mbit
RE01 Main: 32MHz
RE01 Sub: 32.768kHz
Debugger: 5V Input
Power Supply IC: 5V Input, 3.3V Output
Power Supply IC: 2.6V Input, 3.3V Output (For peripheral circuit power supply when
using energy harvesting function)
Power Supply IC: 2.6V or 3.3V Input, 1.25V Output (external DC/DC)
Power Supply IC: 2.6V or 3.3V Input, 0.85V Output (external DC/DC)
I-jetTM / J-Link
TM
/ E2 20-pin box header
USB Connector for J-LinkTM OB
Operation Mode Configuration: double-pole, double-throw x 4
Start-up Mode Configuration: single-pole, double-throw x 2
Internal LDO Configuration: double-pole, single-throw x 2
Reset Switch x 1
User Switch x 2
Discharge Switch x 2
Power Indicator: (Green) x 1
For users: (Orange) x 1, (Red) x 1
J-LinkTM OB Power Indicator: (Green) x 1
FPC Connector: 0.3mm pitch,19 pin x 1
MIP-LCD*5: TN0104ANVAANN-GN00(KYOCERA)
Connector: USB-MicroB
Driver: USB Interface IC (Part No. FT230XQ)
MIP-LCD Expansion Board
Interface
Pmod™
PMOD1 *2: Angle type、12-pin connector
External Battery Interface
3.5mm pitch: 2 pin x 1*3
Solar Panel Interface
2.54mm pitch: 2 pin x 1
Arduino UNO Interface
2.54mm pitch: 10 pin x 1 (J6),8 pin x 2 (J10, J18),6 pin x 1 (J19)
RE01 Header*4
2.54mm pitch: 50 pin x 2 (J7, J8, J9, J21)
1.3 Board Specifications
Board specifications are shown in Table 1-2
Table 1-2: Board Specifications
Target Device
Input Clock
Power Supply
、Table 1-3.
Debug Interface*
Slide Switch
Push Switch
1
LED
MLCD
USB Serial Converter Interface
*2
*1
: Use each debugger exclusively. When using J-Link OB, do not connect to other emulators. When using
2.54mm pitch: 12 pin x 1(PMOD1)
another emulator, do not connect to J-Link OB.
*2
: PMOD1 is used both for MIP-LCD Expansion Board and PmodTM.
*3
: The external battery is not included in this product.
*4
: The connector is not included in this product.
*5
: The MIP-LCD is not included in this product.
R20UT4801EJ0102 Rev.1.02 Page 10 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 1.Overview
Item
Specification
Part No.: TN0181ANVNANN-AN00*1 (KYOCERA)
Size: 1.81 inch
Resolution: 200dpi (256(H) x 256(V))
Main Board Interface
2.54mm pitch: 12 pin x 1(PMOD1)
Table 1-3: MIP-LCD Expansion Board Specification
MIP-LCD
*1
: Please contact KYOCERA.
R20UT4801EJ0102 Rev.1.02 Page 11 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 1.Overview
1.4 Board Exterior
The exterior of Evaluation Kit RE01 256KB is shown in this chapter. Figure 1-1 and Figure 1-2 show the
exterior of the main board. Figure 1-3 and Figure 1-4 show the exterior of MIP-LCD expansion board.
Figure 1-1: Main Board (Top)
Figure 1-2: Main Board (Bottom)
R20UT4801EJ0102 Rev.1.02 Page 12 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 1.Overview
Figure 1-3: MIP-LCD Expansion Board (Top)
Figure 1-4: MIP-LCD Expansion Board (Bottom)
R20UT4801EJ0102 Rev.1.02 Page 13 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 2.Board Layout
MIP-LCD Panel
FPC Connect or
PMOD1
Main Board
Interf ace
2. Board Layout
2.1 Component Layout
The component layout of Evaluation Kit are shown in Figure 2-1 and Figure 2-2.
Figure 2-1: Main Board Layout
Figure 2-2: MIP-LCD Expansion Board Layout
R20UT4801EJ0102 Rev.1.02 Page 14 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 2.Board Layout
2.2 Board Dimensions
Figure 2-3 and Figure 2-4 below show the board dimensions and connector positions. All the through-hole
connectors are on a common 2.54 mm pitch grid for easy interfacing.
Figure 2-3: Main Board Dimensions (Unit: mm)
R20UT4801EJ0102 Rev.1.02 Page 15 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 2.Board Layout
Figure 2-4: MIP-LCD Expansion Board Dimension (Unit: mm)
R20UT4801EJ0102 Rev.1.02 Page 16 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 2.Board Layout
R1
R10
R11
GND2
LED 0
LED 1
J2
GND1
CN1
R2
R3
R4
R5
R6
R7
R8
R9
SW1 SW2
R12
R13
R14
R15
R16
R17
R18
R19
R20
R21
R22
R23
R24
R25
R26
R27
R28
R29
R30
R31
R32
R33
R39
R40 C1
C2
C3
L1
J3
J4
R34
R35
R36
R37
R38
T1
U2
C6
R41
R42
R43
R44
R45
R46
R48
R49
R50
R51
R52
R53
R47
C4 C5
CN2
POW ER1
C9
U6
R57
L2
L3
D1
D2
D3
R59
L4
X1
C8
R58
R61
C10
R60
U1
C7
R54
R55
R56
T2
C12
J5
J6
J7
C15
T4
T5
USB1
J-Link_
10pin_Needle
R68 R86
GND3
C19
L6
LED 2 R69
R66
J8
J9
J10
T3
T6
L5
U3
C16
C18
C13
R67
U7
C11
X2
C14
R62
R63
R64
C17
R71
R72
R73
R74
R75
R76
R77
R78
R79
R80
R81
R82
R83
R84
R85
R70
R87
R88
R89
R90
PMOD1
USB2
C22
C26
R91
R92
T7
J11
J12
SW3 SW4
SW5 SW6
C20
C21
R93
R94
C29
C25
C30
C23
C31
U5
L7
C24
U4
L8
C32
C27
C28
BT1
BT2
R95
SW7 S W8
RES
J13 J14
T8
GND4
J1
T9
T10
R98
R97
SW9
SW10
SW11
SW12
J15
2.3 Component Placement
Figure 2-5, Figure 2-6, and Figure 2-7 show placement of individual components of Evaluation Kit
Component types and values are shown on the board schematics.
.
Figure 2-5: Main Board Component Placement (Top-Side View)
R20UT4801EJ0102 Rev.1.02 Page 17 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 2.Board Layout
J2
R99
R10 0
R10 5 R106
R10 4
R10 3
R10 2
R10 1
C33
R11 0
R10 9
R10 8
R10 7
C35
R11 2
C34
C37
R11 1
C36
C38
C39
C40
R11 3
R11 4
R11 5
R11 6
R11 7
R11 8
R12 2
R11 9
R12 0
R12 3
R12 4
R12 6
R12 8
R13 0
R13 1
R13 3
R13 4
R12 9
R12 7
R12 5
R12 1
R13 2
C41
C42
C43
U8
R135
R138
R13 7
C44
R13 6
J1
Figure 2-6: Main Board Component Placement (Bottom-Side View)
R20UT4801EJ0102 Rev.1.02 Page 18 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 2.Board Layout
CN1
PMOD1
Figure 2-7: MIP-LCD Component Placement (Top-Side View)
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Apr 16, 2021
Evaluation Kit RE01 256KB 2.Board Layout
Item
Function
Setting
SW3, SW5
Operation mode setting
(Emulator setting)
1-2, 5-6: short
Normal mode (using J-LinkTM OB)
SW4, SW6
Operation mode setting
1-2, 5-6: short
Normal mode
SW9
Start-up mode setting
1-2: short
Normal start-up
SW10
2-3: short
SW11,
SW12
Internal LDO setting
1-4: OFF
2-3: OFF
Internal LDO use
J5
Reference voltage generation
circuit setting
1-2: short
Reference voltage generation circuit not
used
J6
IOVCC0 power supply setting
1-2: short
Use output voltage from DCDC converter
J7
IOVCC1 power supply setting
1-2: short
Use output voltage from DCDC converter
J8
Operation mode setting
1-2: short
Normal operation
J9
Current measurement setting
1-2: short
Current measurement not performed
J10
Operation mode setting
1-2: short
Normal start-up
J11
Supercapacitor charging
method selection
1-2: short
Charge from external power supply
J12
Secondary battery selection
2-3: short
Supercapacitor
J15
Operation mode setting
1-2: short
Normal start-up
J8: 1-2 short
J9: 1-2 short
J10: 1-2 short
J11: 1-2 short
J12: 2-3 short
J15: 1-2 short
J7: 1-2 short
J6: 1-2 short
J5: 1-2 short
SW11: 1-4 OFF
2-3 OFF
SW12: 1-4 OFF
2-3 OFF
SW9: 1-2 short
SW10: 2-3 short
SW3: 1-2, 5-6 short
SW5: 1-2, 5-6 short
SW4: 1-2, 5-6 short
SW6: 1-2, 5-6 short
2.4 Board Initial Settings
The switch settings of the default kit configuration are as follows. The component layout is shown in Figure
2-8 and the detailed settings are shown in Table 2-1.
Figure 2-8: Component Layout and Settings
Table 2-1: Board Initial Settings
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Apr 16, 2021
Evaluation Kit RE01 256KB 3.Internal Board Connections
Arduin o UNO Header
(J3,J4,J13,J14)
RE01-25 6KB
IOVCC IOVC C0 IOV CC1 AVCC0 V REFH0
J-LinkTM OB
Emula tor Con nector（CN2 )
Micro -B Connector
（US B2)
USB-UART Circuit
USB-UART IC
(U8)
Flash Memory (U7)
MIP-LCD E xpansi on Boar d Inte rface ( PMOD1)
MIP-LCD(P arallel ) Interf ace (CN 1)
VCC/ IOVCC to VCLH
Voltag e Regulator
VCC/ IOVCC to VCL
Voltag e Regulator
: Signal Line
R
: Resisto r
R
: Resistor(Do no fit)
SSW
: Slide switch
VCC/IOVCC to 3.3V
Voltag e Regulator
SW3, SW5
R
R
R
R
SPI0/1
SWD, RESn
DCDC_Ext_EN
DCDC_EHC_EN
R
QSPI
SC I0
R
User LE DS (LED0, LED 1)
R
IO
Analog IO
IO
MLCD
IIC0/1
IIC0/1
IIC0/1
Analog VREF
R
IO
IO
P000
P001
P002
P003
P004
P005
IO(IOVCC):
Analog IO:
SDA P012
SCL P 013
IIC0/1
(IOVCC0):
CLK P 011
SSL P015
MOSI P 010
MISO P815
SPI0/1:
(IOVCC0):
P409
IO(IOVCC1):
P204
P205
P302
P314
P315
P602
P603
P604
SWCL K P411, SWDIO P207
TXD P7 02, RXD P702, C TS P704, RTS P202
IO: P210,P410
SPCLK P011, SS L P015, MOSI P010, MISO P815
QSPC LK P812, QSS L P807, QIO P80[ 8:11]
IO: P508,P509
SCLK P111, VCOM P113, ENBS P1 09,
XRST P1 12, DATA P10 [0:7],
DEN P110, ENBG P108
P204 P 205 P302 P314 P3 15 P602 P60 3 P604
P000 P 001 P002 P003 P0 04 P005
P409
VR EF
(VREFH0)
VR EFH0
VR EFH0
SDA P012
SCL P 013
P208
P209
User Switches (SW1,SW2)
Contr ol MCU
(U6)
Micro -B Connector
（US B1)
SSW
R
3.Internal Board Connections
Figure 3-1 shows the connectivity between Evaluation Kit and RE01. The pin connections are listed in Table
3-1 and Table 3-2.
Figure 3-1: Internal Board Block Diagram
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Apr 16, 2021
Evaluation Kit RE01 256KB 3.Internal Board Connections
RE01
Main board
XTAL - 12
-
IOVCC
XCOUT - 9
-
IOVCC
SW1
P509
74
J2-24
IOVCC1
LED
LED0
P210
32
J1-32
IOVCC
PMOD*
PMOD_SSLA1_B_P015
P015
92
J2-42
IOVCC0
PMOD_MISOA_B_CTS4_C
P815
98
J2-48
IOVCC0
PMOD_INT_AGTWOA1_B_P814
P814
99
J2-49
IOVCC0
PMOD_IO0_P014
P014
93
J2-43
IOVCC0
USB-Serial
USB_SCI_TXD
P703
40
J1-40
IOVCC
USB_SCI_CTS
P704
39
J1-39
IOVCC1
MIP-LCD
MLCD_VCOM
P113
56
J2-6
IOVCC1
MLCD_XRST
P112
57
J2-7
IOVCC1
MLCD_SI6
P101
70
J2-20
IOVCC1
MLCD_SI4
P103
68
J2-18
IOVCC1
MLCD_SI2
P105
66
J2-16
IOVCC1
MLCD_SI0
P107
64
J2-64
IOVCC1
MLCD_SCLK
P111
58
J2-8
IOVCC1
Table 3-1: List of RE01 functions, pin number and header connections(1/2)
Category Function Port
Clock EXTAL - 13 - IOVCC
XCIN - 10 - IOVCC
Switch RES RES# 23 J1-23 IOVCC
SW2 P508 75 J2-25 IOVCC1
LED1 P410 17 J1-17 IOVCC
PMOD_MOSIA_B_P010 P010 97 J2-47 IOVCC0
PMOD_RSPCKA_B_P011 P011 96 J2-46 IOVCC0
PMOD_RESET_RXD4_C P813 100 J2-50 IOVCC0
PMOD_IO1 P806 7 J1-7 IOVCC0
Pin No.
Pin header
Power Domain
USB_SCI_RXD P702 41 J1-41 IOVCC
USB_SCI_RTS P202 38 J1-38 IOVCC1
MLCD_ENBS P109 60 J2-10 IOVCC1
MLCD_SI7 P100 71 J2-21 IOVCC1
MLCD_SI5 P102 69 J2-19 IOVCC1
MLCD_SI3 P104 67 J2-17 IOVCC1
MLCD_SI1 P106 65 J2-15 IOVCC1
MLCD_DEN P110 59 J2-9 IOVCC1
MLCD_ENBG P108 61 J2-11 IOVCC1
*: Please refer to Section 8.5 Pmod™ Interface for the relationship with the pin number of the PMOD connector.
R20UT4801EJ0102 Rev.1.02 Page 22 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 3.Internal Board Connections
RE01
Main board
QSPI_QIO1_A
P810 3 J1-3
IOVCC0
QSPI_QIO0_A
P811 2 J1-2
IOVCC0
QSPI_QIO3_A
P808 5 J1-5
IOVCC0
ARDUINO_IO9_GTIOC2A_B
P302
48
J1-48/J3-2
IOVCC1
ARDUINO_MOSIA_B
P010
97
J2-47/J3-4
IOVCC0
ARDUINO_RSPCKA_B
P011
96
J2-46/J3-6
IOVCC0
ARDUINO_SDA0*
P012
95
J2-45/J3-9
IOVCC0
Arduino
ARDUINO_IO0_RXD5_B
P314
45
J1-45/J4-1
IOVCC1
ARDUINO_IO2_IRQ7_B
P204
36
J1-36/J4-3
IOVCC1
ARDUINO_IO4
P602
53
J2-3/J4-5
IOVCC1
ARDUINO_IO6_GTIOC5B_B
P604
51
J2-1/J4-7
IOVCC1
Arduino
IOVCC0/IOVCC1/
RESn
RES#
23
J1-23/ J13-3
IOVCC
Board_5V
- - J13-5
-
Arduino
ARDUINO_AN000
P000
89
J2-49/J14-1
AVCC0
ARDUINO_AN002
P002
87
J2-37/J14-3
AVCC0
ARDUINO_AN004
P004
85
J2-35/J14-5
AVCC0
Table 3-2: List of RE01 functions, pin number and header connections (2/2)
Category Function Port
Flash
Memory
Arduino
UNO (J3)
UNO (J4)
QSPI_QSSL_A P807 6 J1-6 IOVCC0
QSPI_QIO2_A P809 4 J1-4 IOVCC0
QSPI_QSPCLK_A P812 1 J1-1 IOVCC0
ARDUINO_IO8 P409 18 J1-18/J3-1 IOVCC
ARDUINO_SSLA1_B P015 92 J2-42/J3-3 IOVCC0
ARDUINO_MISOA_B P815 98 J2-48/J3-5 IOVCC0
ARDUINO_VREF** - 84 J3-8 VREFH0
ARDUINO_SCL0* P013 94 J2-44/J3-10 IOVCC0
ARDUINO_IO1_TXD5_B P315 44 J1-44/J4-2 IOVCC1
Pin No.
Pin header
Power Domain
ARDUINO_IO3_IRQ8_C P205 35 J1-35/J4-4 IOVCC1
ARDUINO_IO5_GTIOC5A_B P603 52 J2-2/J4-6 IOVCC1
ARDUINO_IO7 P300 50 J1-50J4-8 IOVCC1
UNO (J13)
UNO (J14)
*: The default kit configuration uses a transfer rate of 50kbps or less. To increase the transfer rate, change the resistor
values (R21, R22).
**: Not connected by default. Please change the resistor based on your application.
IOVCC0**/IOVCC1/AVCC0** - 91/46/78 J13-1
LP_3V3 - - J13-2 -
LP_3V3 - - J13-4 -
VCC_MCU - 14 J1-14/J13-8 IOVCC
ARDUINO_AN001 P001 88 J2-48/J14-2 AVCC0
ARDUINO_AN003 P003 86 J2-36/J14-4 AVCC0
ARDUINO_AN005 P005 82 J2-32/J14-6 AVCC0
AVCC0
R20UT4801EJ0102 Rev.1.02 Page 23 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 4.Power Supply
RE01-25 6KB
IOVCC
5.0V to 3. 3V
Voltag e Regulator
EHC
VCC/ IOVCC
IOVC C0
IOVC C1 AVCC0 V REF H0
R
R
R
CC
Contr ol MCU
(U6)
Micro -B Connector
（US B1)
J-LinkTM OB
Emula to r Connect or
（CN2 )
Micro -B Connector
（US B2)
USB-UART Circuit
USB-UART IC
(U8)
Flash Memory
(U7)
USER S witches
(SW1, SW2)
MIP-LCD E xpans ion Boar d Inte rface
(PMO D1)
MIP-LCD(P arallel) Int erface
(CN1)
IOVC C0
IOVC C1
Arduin o UNO Header
(J3,J4,J13,J14)
5.0V
R
R
R
R
MCU
VCC/ IOVCC to VCLH
Voltag e Regulator
VCC/ IOVCC to VCL
Voltag e Regulator
R
R
UC_ VCC
VCC_ MCU
VCC_ MCU
UC_ VCC
VR EFH0
5.0V
J8
J10
J6
J7
J5
SSW
SSW
VCC/IOVCC to 3.3V
Voltag e Regulator
J15
SW11
SW12
R
J9
: Power Line
R
: Resisto r
R : Resistor(Do no fit)
C
: Cap acitor
: Jum per sw itch
: T hrough ho le
SSW
: Slide swit ch
LP_P RODUCT_3V3
4. Power Supply
4.1 Power Supply System
Figure 4-1 shows power supply system diagram of Evaluation kit.
Figure 4-1: Power Supply System Diagram
R20UT4801EJ0102 Rev.1.02 Page 24 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 4.Power Supply
Source
Supply voltage
Supply current
I-jetTM (CN2)
5V
Maximum 420mA
J-LinkTM OB (USB1)
5V
Maximum 500mA
J-LinkTM (CN2)
5V
Maximum 300mA
E2 (CN2)
3.3V
Maximum 200mA
USB serial (USB2)
5V
Maximum 500mA
Emulator
Emulator connector (CN2)
J-LinkTM OB connector (USB1)
USB cable
USB serial connector (USB2)
USB cable
4.2 Power Supply Source
Evaluation Kit is supplied by emulator through USB cable. The details of power supply components are
shown in Figure 4-2 and Table 4-1. When the Evaluation Kit is connected to another system then that system
should supply power to the Evaluation Kit.
When operating in stand-alone mode, connect a USB cable to USB1 or USB2 and supply the voltage
through VBUS. At that time, do not use J-Link
TM
OB or USB serial function.
Figure 4-2: Components Layout (power supply)
Table 4-1: Power Supply Specifications
R20UT4801EJ0102 Rev.1.02 Page 25 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 4.Power Supply
J8: 1-2 open
Current Measurement Point
SW3: EHC
SW5: EHC
4.3 External Power Supply
It is possible to supply voltage to RE01 power terminal by using external power supply. This allows the entire
or individual power domain to operate at any voltage (1.62 – 3.6V). Normally, the emulator supplies voltage
equivalent to 3.3V, which is the voltage value after reduction by the regulator. (excluding device which can
supply 3.3V)
4.3.1 All power pins
Figure 4-3 shows the component layout. Follow the steps below when supplying voltage from external p
supply to all RE01 power pins:
1. Set SW3 and SW5 to EHC.
2. Open J8 jumper pin 1-2 and 2-3.
3. Supply voltage (1.62V-3.6V) from pin 2 of J8 or T6 using an external power supply.
ower
2-3 open
Figure 4-3: Component Layout and Setting (External Power Supply)
Keep the following in mind when using this feature:
• Debugging using J-Link OB is not possible. Please use another emulator. For details on the other
emulators, refer to chapter 6 Debug.
• When using the E2 emulator, do not supply power from the emulator.
(T6)
R20UT4801EJ0102 Rev.1.02 Page 26 of 95
Apr 16, 2021
Evaluation Kit RE01 256KB 4.Power Supply
IOVCC0(T4)
J6: 1-2 open
2-3 open
4.3.2 IOVCC0
Figure 4-4 shows the component layout. Follow the steps below when supplying voltage from external power
supply to IOVCC0 pin:
1. Open J6 jumper pin 1-2 and 2-3.
2. Supply voltage (1.62V – 3.6V) to any power supply pins other than IOVCC0 pin.
3. Supply voltage to T4.
Figure 4-4: Component Layout and setting (External Power Supply)
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Apr 16, 2021
Evaluation Kit RE01 256KB 4.Power Supply
IOVCC1(T1)
J7: 1-2 open
4.3.3 IOVCC1
Figure 4-5 shows the component layout. Follow the steps below when supplying voltage from external power
supply to IOVCC1 pin:
1. Open J7 jumper pin 1-2 and 2-3.
2. Supply voltage (1.62V – 3.6V) to any power supply pins other than IOVCC1 pin.
3. Supply voltage to T1.
2-3 open
Figure 4-5: Component Layout and Setting (External Power Supply)
R20UT4801EJ0102 Rev.1.02 Page 28 of 95
Apr 16, 2021
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