Renesas RA6M3 Application Note

Download

Application Note

R12AN0106EJ0100 Rev.1.00 Page 1 of 25 Apr.30.2020

RA6M3 Group

RA6M3 HMI Expansion Board

Introduction

This application note explains the hardware specifications of RTK0EG001BB00001BJ, which is an

expansion board of RA6M3 MCU Group evaluation kit, EK-RA6M3G.

Target Device

RA6M3 Group

1. Outline

This product provides below features and system configuration.

(1) Voice Recognition by analog output MEMS microphone circuit

Direction forming technology (Beamforming) for voice

(2) Sound playback by D-Amp Driver® circuit(*) (3) Built-in Temperature and Humidity sensor (4) Built-in Gas sensor for indoor environment gas detection

• Measurement of Total Volatile Organic Compounds(TVOC)

• Measurement of equivalent CO2(eCO2)

• Measurement of Indoor Air Quality(IAQ)

• Measurement of Odor

(5) Built-in 64Mbit Serial Flash (6) Expansion connectors (optional)

• External Analog microphone connection

• External I2C Interface device connection

• External UART Interface device connection

(*) D-Amp Driver® is a registered trademark of CRI Middleware Co., Ltd.

RA6M3 HDMI 　

expansion board

J-Link OB USB

Temperature

measurement

Humidity

measurement

Gas measurement

voice

recognition

Audio

playback

USB

EK-RA6M3G board

Figure 1 System configuration

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 4 of 25 Apr.30.2020

2. Product External Appearance

Speaker connector

Microphone 1 (back side)

Microphone 2 (back side)

External microphone 1 (optional)

External microphone 2 (optional)

Serial expansion connector (optional)

Sensor expansion I2C Interface connector (optional)

Temperature and humidity sensor Renesas (IDT)

Gas sensor Renesas (IDT)

Arduino Uno connector (Analog & Power)

Arduino Uno connector (Digital)

External microphone jumper

External microphone gain setting resistor

Internal / external microphone selection jumper

Power LED

Speaker

Microphone amplifier Renesas

Figure 2 Product External Appearance

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 5 of 25 Apr.30.2020

3. Hardware Specifications

Table 1 Hardware Specifications

Item

Description

Remarks

Board size

78.0×80.0[mm]

max external dimension

Power

EK-RA6M3G board J18

3.3V、5V

Serial Flash

MACRONIX International Co., Ltd.

MX25R6435FM2IL0

SPI I/F、64Mbit LED

For Power： yellow LED 1pc

Microphone

KNOWLES Corp SPU0410LR5H-QB 2pcs

MEMS microphone, Omnidirectional, Sensitivity: -38dBV/Pa, Analog Output Amp circuit gain 40dB(x100)

External expansion microphone (Optional)

MEMS type (Analog output) Or Electret condenser type

Omnidirectional, Amp circuit default gain 40dB(x100)

Speaker operation circuit

D-Amp Driver® support H bridge circuit

Speaker

CUI Devices CMS-28588N-L152

dimensionsΦ28mm maximum input power 2W Impedance 8Ω Sound Presser Level 88dB SPL(2W、

0.5m)

Humidity and Temperature Sensor

RENESAS(IDT) HS3001

I2C IF, 14bit resolution, Sensor Accuracy

• Temperature ±0.2℃ typ (-10 to +80℃)

• RH ±1.5%RH typ (10 to 90%RH, 25℃)

Gas Sensor

RENESAS(IDT) ZMOD4410AI1V

I2C IF, 10～16bit resolution, Measurement value

• TVOC measurement

• eCO2 measurement

• IAQ measurement

• Odor measurement

Measurement Accuracy

• TVOC±15% typ (after calibration)

• eCO2±25%typ (compared to

NDIR)

I2C Expansion Interface (Optional)

5V I/F Connector 1pc

3.3V I/F Connector 1pc

UART Expansion Interface (Optional)

3.3V I/F Connector 1pc

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 6 of 25 Apr.30.2020

4. Block Diagram

Power supply

LED

H bridge

3.3V

Speaker

D-Amp driver® external circuit

MIC0

MIC1

MEMS MIC

MIC amplifier

External MIC

(optional)

EX_MIC0

64Mbit

Serial

Flash

3.3V

SPI

Relative Humidity/

Temperature sensor

3.3V

40dB(x100)※

40dB(x100)

Gas

sensor

3.3V

Voltage level

translator

3.3V

I2C

I2C(5V)

EK- RA6M3G board

AN0

AN1

3.3V

PWM

Sensor expansion connector (5V) (optional)

Sensor expansion connector (3.3V) (optional)

UART expansion connector (optional)

UART

Arduino Uno Connectors

Jumper

※User configurable

EX_MIC1

Figure 3 Block Diagram

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 7 of 25 Apr.30.2020

5. Settings and Connection to the board

5.1 Connects EK-RA6M3 board

As figure 4 shows below, connect RA6M3 HMI expansion board with Arduino Uno connector of EK-

RA6M3G board.

Figure 4 EK-RA6M3G board Connection

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 8 of 25 Apr.30.2020

5.2 Microphone

5.2.1 Inside microphone

Table 2 and Figure 5 shows jumper settings. Figure 3 shows direction of microphone when uses

beamforming.

Table 2 Jumper Setting(Inside microphone)

Reference

Setting

J49

Short 1-2pin

J50

Short 1-2pin

MIC1 MIC2

Direction 1 Direction 2

Figure 5 Jumper setting of inside microphone

Table 3 Microphone direction of beamforming(Inside microphone)

Direction

MIC1

MIC2

Direction1

Direction2

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 9 of 25 Apr.30.2020

5.2.2 External Expansion microphone

External Expansion microphone can be connected to Analog MEMS microphone and Electret condenser

microphone.

Table 4 shows signal of external microphone connector and Table 5 shows Amp gain settings. Also ,chapter 5.2.2.1 explains Setting of analog MEMS microphone, 5.2.2.2 explains electret condenser

microphone settings.

Table 4 External expansion microphone interface

J9, J8

Signal name

Type

POW/ECMO

POWER/OUT

MEMSO

OUT

GND

POWER

Table 5 Amp Gain setting of External Expansion microphone

Reference

Gain

U1C

Gain = (Resistance Value J31-J32) / R7 Default：1M / 10K = 100 (40dB)

U1D

Gain = (Resistance Value J41-J42) / R8 Default：1M / 10K = 100 (40dB)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 10 of 25 Apr.30.2020

5.2.2.1 External Analog MEMS microphone

Table 6 and Figure 6 shows Jumper setting of External Analog MEMS microphone. Table 7 shows

microphone direction when beamforming.

Figure 6 Ⓐ part is explained in Table 5.

Table 6 Jumper Setting(External Analog MEMS microphone)

Reference

Settings

J49

Short PIN 2-3

J50

Short PIN 2-3

J35、J36

Implement Jumper resistance J35-J36

J37、J38

No implementation

J39、J40

Implement Jumper resistance J39-J40

J25、J26

Implement Jumper resistance J25-J26

J27、J28

No implementation

J29、J30

Implement Jumper resistance J29-J30

20mm

Ⓐ

Direction 1 Direction 2

MEMS MIC

EX_MIC2

MEMS MIC

EX_MIC1

Figure 6 Jumper Settings of External MEMS microphone

Table 7 Beamforming Direction(External Expansion microphone)

Direction

EX_MIC1

EX_MIC2

Direction1

Direction2

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 11 of 25 Apr.30.2020

5.2.2.2 External electret condenser microphone

Table 8 and Figure 7 shows Jumper setting of external electret condenser microphone. Figure 7 Ⓐ part is explained in Table 5 and refer Table7 for Direction1 and 2.

Table 8 Jumper setting of external electret condenser microphone

Reference

Settings

J49

Short PIN 2-3

J50

Short PIN 2-3

J35、J36

Implement resistance adopted to electret condenser microphone between J35-J33

J37、J38

Implement jumper resistance between J37-J38

J39、J40

No implementation

J25、J26

Implement resistance adopted to electret condenser microphone between J25-J26

J27、J28

Implement jumper resistance between J27-J28

J29、J30

No implementation

Electret Condenser

MIC

Ⓐ

20mm

Direction 1 Direction 2

EX_MIC2

EX_MIC1

Figure 7 Jumper setting of external electret condenser microphone

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 12 of 25 Apr.30.2020

5.3 Speaker

Table 9 shows speaker connector signals.

Table 9 Speaker Interface

J48

Signal

Type

SPOUT1

OUT

SPOUT2

OUT

5.4 Sensor expansion connector(optional)

Table 10 shows sensor expansion 3.3Ｖ I2C connector signals. Table 11 shows 5Ｖ I2C connector

signals.

Table 10 Sensor Expansion 3.3V I2C Interface

J45

Signal

Type

SCL

IN/OUT

SDA

IN/OUT

GND

POWER

3.3V

POWER

Table 11 Sensor Expansion 5V I2C Interfcace

J46

Signal

Type

SCL

IN/OUT

SDA

IN/OUT

GND

POWER

5.5 Serial expansion connector(optional)

Table 12 shows serial expansion connector signals.

Table 12 Serial expansion interface

J47

Signal

Type

3.3V

POWER

RXD

TXD

OUT

GND

POWER

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 13 of 25 Apr.30.2020

6. Circuit diagram

Figure 8 circuit diagram(1/3)

【*】”NM” shows no implementation

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 14 of 25 Apr.30.2020

Figure 8 circuit diagram(2/3)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 15 of 25 Apr.30.2020

Figure 8 circuit diagram(3/3)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 16 of 25 Apr.30.2020

7. Board Layout Diagram

Figure 9 Component Side Silkscreen (top view)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 17 of 25 Apr.30.2020

Figure 10 1st Layer Pattern (top view)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 18 of 25 Apr.30.2020

Figure 11 2nd Layer Pattern (top view)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 19 of 25 Apr.30.2020

Figure 12 3rd Layer Pattern (top view)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 20 of 25 Apr.30.2020

Figure 13 4th Layer Pattern (top view)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 21 of 25 Apr.30.2020

Figure 14 Solder Side Silkscreen (top view)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 22 of 25 Apr.30.2020

Figure 15 External dimensions (Unit:mm)

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 23 of 25 Apr.30.2020

8. BOM (parts list)

Table 13 BOM List (1/2)

Item

Parts Type

Reference

PartNo.

Manufacture

Impl

Qty

Remarks

64Mbit Flash Memory

MX25R6435FM2IL0

MACRONIX

Mount

8-SOIP

Temp and RH sensor

HS3001

Renesas (IDT) Mount

TVOC sensor

ZMOD4410AI1V

Renesas (IDT)

Mount

I2C level converter

PCA9306DTR2G

ON Semiconductor

Mount

8-TSSOP

Operational amplifier

ISL28414FBZ

Renesas

Mount

14-SOIC

MEMS microphone

MIC1,MIC2

SPU0410LR5H-QB-7

Knowles

Mount

Composite FET

FET1,FET2

QH8MA2TCR

Rohm

Mount

Nch+Pch

LED

LED1

SML-D13Y8WT86

Rohm

Mount

Golden Yellow

Chip Resistor

R23,R24

MCR03EZPJ220

Rohm

Mount

22Ω 5%

Chip Resistor

R12

MCR03EZPJ330

Rohm

Mount

33Ω 5%

Chip Resistor

R33,R34

MCR03EZPJ102

Rohm

Mount

1KΩ 5%

Chip Resistor

R31

MCR03EZPJ122

Rohm

Mount

1.2kΩ 5%

Chip Resistor

R9,R21,R22,R29

MCR01MZPJ103

Rohm

Mount

10kΩ 5%

Chip Resistor

R25,R28

MCR03EZPJ103

Rohm

Mount

10kΩ 5%

Chip Resistor

R30

MCR03EZPJ204

Rohm

Mount

200kΩ 5%

Chip Resistor

R3,R5,R7,R8

MCR01MZPF1002

Rohm

Mount

10kΩ 1%

Chip Resistor

R1,R2

MCR01MZPF1003

Rohm

Mount

100kΩ 1%

Chip Resistor

R4,R6

MCR03EZPFX1004

Rohm

Mount

1MΩ 1%

Chip Capacitor

C3,C6,C9,C11,C12,C1 3,C15,C16,C17,C18,C 19,C20,C21,C25

EMK105B7104KV-F

Taiyo Yuden

Mount

Ceramic

0.1uF/16V

Chip Capacitor

C2,C5,C8,C10

EMK105BJ224KV-F

Taiyo Yuden

Mount

Ceramic

0.22uF/16V

Chip Capacitor

EMK107B7105KA-T

Taiyo Yuden

Mount

Ceramic 1uF/16V

Chip Capacitor

C24

EMK325AC6476MMP

Taiyo Yuden

Mount

Ceramic 47uF/16V

Check Terminal

TP1,TP2,TP3,TP4,TP1 0,TP11,TP12,TP13

LC-22G(Yellow)

Mac-Eight

UnMo unt

Check Terminal

TP5

LC-22G(Orange)

Mac-Eight

UnMo unt

Check Terminal

TP6

LC-22G(Red)

Mac-Eight

UnMo unt

Check Terminal

TP7

LC-22G(Black)

Mac-Eight

Mount

Connector

J8,J9,J49,J50

XJ8B-0311

OMRON

Mount

Header 3 position

Connector

J19

SSQ-106-03-T-S

Samtec

Mount

Receptacle 6 position

Connector

J18,J23

SSQ-108-03-T-S

Samtec

Mount

Receptacle 8 position

Connector

J24

SSQ-110-03-T-S

Samtec

Mount

Receptacle 10 position

Connector

J48

22-28-6020

MOLEX

Mount

Right Angle Header 2 position

Connector

J25,J26,J27,J28,J29,J 30,J31,J32,J35,J36,J3 7,J38,J39,J40,J41,J42

PD-1

Mac-Eight

Mount

Socket pin

Resetable Fuse

PSW1

PRCP-R025-0-99

Nidec Copal Electronics

Mount

Chip Capacitor

C4,C7,C22,C23

UnMo unt

1608 Pad

Chip Resistor

R10,R11 - -

UnMo unt

1608 Pad

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 24 of 25 Apr.30.2020

Table 13 BOM List (2/2)

Item

Parts Type

Reference

PartNo.

Manufacture

Impl

Qty

Remarks

Connector

J45,J46,J47

XJ8B-0411

OMRON

UnMo unt

Resistor

(J31-J32,J41-J42)

MFS1/4CC1004F

KOA

Mount

1MΩ 1%

Jumper Resistor

(J25-J26,J29-J30,J35J36,J39-J40)

Z16C

KOA

Mount

Jumper Resistor

Shunt Connector

(J49,J50)

XJ8A-0211

OMRON

Mount

PCB

RTK0EG001BB0000 1BJ

- 1

Speaker

CMS-28588N-L152

CUI inc

Mount

8Ω 2W Wire leads

Housing connector

2226A-02

Neltron

Mount

Speaker harness

Crimp terminal

2226TG

Neltron

Mount

Speaker harness

RA6M3 Group RA6M3 HMI Expansion Board

R12AN0106EJ0100 Rev.1.00 Page 25 of 25 Apr.30.2020

Revision History

Rev.

Date

Description

Page

Summary

1.00

Apr 30, 2020

First edition issued

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the

products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD) A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level at which resetting is specified.

3. Input of signal during power-off state Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible.

5. Clock signals After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7. Prohibition of access to reserved addresses Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these addresses as the correct operation of the LSI is not guaranteed.

8. Differences between products Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems. The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home

electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key

financial terminal systems; safety control equipment; etc. Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled

subsidiaries.

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(Rev.4.0-1 November 2017)

Corporate Headquarters

Contact information

TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan

www.renesas.com

For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit:

www.renesas.com/contact/.

Trademarks

Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners.

Renesas RA6M3 Application Note

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Outline

(1) Voice Recognition by analog output MEMS microphone circuit

2. Product External Appearance

3. Hardware Specifications

4. Block Diagram

5. Settings and Connection to the board

5.1 Connects EK-RA6M3 board

5.2 Microphone

5.2.1 Inside microphone

5.2.2 External Expansion microphone

5.2.2.1 External Analog MEMS microphone

5.2.2.2 External electret condenser microphone

5.3 Speaker

5.4 Sensor expansion connector(optional)

5.5 Serial expansion connector(optional)

6. Circuit diagram

7. Board Layout Diagram

8. BOM (parts list)