Renesas RA2E1 User Manual

Rev 1.00 Jan.04.21

Renesas RA Family

RA2 Series

www.renesas.com

All information conta ined in these materi als, includin g products and pr oduct specificat ions, represent s

RA2E1 Group

Microcontroller Grou p

User’s Manual

Evaluation Kit f or RA2E1

EK-RA2E1

information on the product at the time of publicat ion and is subject t o change by Renesas El ectronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, in cluding the Renesas Electronics Corp. website (http://www.renesas.com).

Corporate Headquarters

Contact information

www.renesas.com

Trademarks

of their respective owners.

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor produ cts and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and informati on in the des i gn of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving pat ent s, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home

"High Quality": T rans por tation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key

Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirect ly controlled

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

subsidiaries.

electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.

financial terminal systems; safety control equipment; etc.

(Rev.4.0-1 November 2017)

TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan

Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property

For further information on a product, technology, the most up-to-date version of a document, or your ne are s t sales office, please visit:

www.renesas.com/contact/

General Precautions in the Handling of Microprocessing Unit and Microcontrolle r Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD)

A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on

The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level at which resetting is specified.

3. Input of signal during power-off state

Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins

Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot -through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible.

5. Clock signals

After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an ext ern al osci ll at or during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin

Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V (Max.) and V input level is fixed, and also in the transition period when the input level passes through the area between V

7. Prohibition of access to reserved addresses

Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these addresses as the correct ope ration of the LSI is not guaranteed.

8. Differences between products

Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems. The characteristics of a Microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system evaluation test for the given product.

(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the

(Max.) and VIH (Min.).

Renesas EK-RA2E1 Disclaimer

By using this EK-RA2E1, the User accepts the following terms, which are in addition to, and control in the event of disagreement, with Renesas’ General Terms and Conditions available at https://www.renesas.com/en-us/legal/disclaimer.html

The EK-RA2E1 is not guaranteed to be error free, and the entire risk as to the results and performance of the EK-RA2E1 is assumed by the User. The EK-RA2E1 is provided by Renesas on an “as is” basis without warranty of any kind whether expres s or impl ie d, in cluding but not limited to the implied warranties of good workmanship, fitness for a particular purpose, title, merchantability, and non-infringement of intellectual property rights. Renesas expressly disclaims any implied warranty.

Renesas does not consid er the EK -RA2E1 to be a finished product and therefore the EK-RA2E1 may not comply with some requirements applicable to finished products, including, but not limited to recycling, restricted substances and electromagnetic compatibility regulations. Refer to Certifications section, for information about certifications and compliance information for the EK-RA2E1. It is the kit User’s responsibility to make sure the kit meets any local requirements applicable to their region.

Renesas or its affiliates shall in no event be liable for any loss of profit, loss of data, loss of contract, loss of business, damage to reputation or goodwill, any economic loss, any reprogramming or recall costs (whether the foregoing losses are direct or indirect) nor shall Renesas or its affiliates be liable for any other direct or indirect special, incidental or consequential damages arising out of or in relation to the use of this EK-RA2E1, even if Renesas or its affiliates have been advised of the possibility of such damages.

Renesas has used reasonable care in preparing the information included in this document, but Renesas does not warrant that such information is error free nor does Renesas guarantee an exact match for every application or parameter to part numbers designated by other vendors listed herein. The information provided in this document is intended solely to enable the use of Renesas products. No express or implied license to any intellectual property right is granted by this document or in connection with the sale of Renesas products. Renesas reserves the right to make changes to specifications and product descriptions at any time without notice. Renesas assumes no liability for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas cannot verify, and assumes no liability for, the accuracy of information available on another company’s website.

Precautions

This Evaluation Kit is only intended for use in a laboratory environment under ambient temperature and humidity conditions. A safe separation distance should be used between this and any sensitive equipment. Its use outside the laboratory, classroom, study area, or similar such area invalidates conformity with the protection requirements of the Electromagnetic Compatibility Directive and could lead to prosecution.

The product generates, uses, and can radiate radio frequency energy and may cause harmful interference to radio communications. Ther e is no gu ar ant ee that interference will not occur in a particular installation. If this equipment causes harmful interference to radio or television reception, which can be determined by turning the equipment off or on, you are encouraged to try to correct the interference by one or more of the following measures:

• Ensure attached cables do not lie across the equipment.

• Reorient the receivi ng ant enna.

• Increase the distance between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that which the receiver is connected.

• Power down the equipment when not in use.

• Consult the dealer or an experienced radio/TV technician for help.

Note: It is recommended that wherever possible shielded interface cables are used. The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that the following measur es be un de rtaken:

• The user is advised that mobile phones should not be used within 10 m of the product when in use.

• The user is advised to take ESD precautions when handling the equipment.

The Evaluation Kit does not represent an ideal refe ren c e desi gn f or an end pr odu ct and do es not fulfi l th e regulatory standards for an end pr oduct.

User’s Manual Renesas RA Family

EK-RA2E1 v1

Contents

1. Kit Overview ............................................................................................................................ 4

1.1 Assumptions and Advisory Notes ............................................................................................................ 6

2. Kit Contents ............................................................................................................................. 7

3. Kit Ordering Information ........................................................................................................... 7

4. Hardware Architecture and Default Configuration .................................................................... 8

4.1 Kit Architecture ........................................................................................................................................ 8

4.2 System Block Diagram ............................................................................................................................ 9

4.3 Jumper Settings ..................................................................................................................................... 10

4.3.1 Copper Jumpers .................................................................................................................................. 10

4.3.2 Traditional Pin Header Jumpers .......................................................................................................... 10

4.3.3 Default Jumper Configuration .............................................................................................................. 10

5. System Control and Ecosystem Access Area ........................................................................ 12

5.1 Power .................................................................................................................................................... 13

5.1.1 Power Supply Options ......................................................................................................................... 13

5.1.2 Power Supply Considerations ............................................................................................................. 13

5.1.3 Power-up Behavior .............................................................................................................................. 13

5.2 Debug and Trace ................................................................................................................................... 14

5.2.1 Debug On-Board ................................................................................................................................. 14

5.2.2 Debug In .............................................................................................................................................. 15

5.2.3 Debug Out ........................................................................................................................................... 17

5.3 Ecosystem ............................................................................................................................................. 17

5.3.1 Seeed Grove® Connectors .................................................................................................................. 17

5.3.2 SparkFun® Qwiic® Connector .............................................................................................................. 18

5.3.3 Digilent Pmod™ Connectors ............................................................................................................... 19

5.3.4 Arduino™ Connector ........................................................................................................................... 21

5.3.5 MikroElektronika™ mikroBUS Connector ........................................................................................... 22

5.4 Miscellaneous ........................................................................................................................................ 23

5.4.1 User and Power LEDs ......................................................................................................................... 23

5.4.2 User and Reset Switches .................................................................................................................... 24

5.4.3 MCU Boot Mode .................................................................................................................................. 24

6. MCU Native Pin Access Area ................................................................................................ 25

6.1 Breakout Pin Headers ........................................................................................................................... 25

6.2 MCU Current Measurement .................................................................................................................. 25

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7. Certifications .......................................................................................................................... 27

7.1 EMC/EMI Standards .............................................................................................................................. 27

7.2 Material Selection, Waste, Recycling and Disposal Standards ............................................................ 27

7.3 Safety Standards ................................................................................................................................... 27

8. Design and Manufacturing Information .................................................................................. 28

9. Website and Support ............................................................................................................. 28

Revision History ............................................................................................................................ 29

Figures

Figure 1. EK-RA2E1 Bo ar d Top Side .............................................................................................................. 5

Figure 2. EK-RA2E1 Board Bottom Side ......................................................................................................... 6

Figure 3. EK-RA2E1 Kit Contents .................................................................................................................... 7

Figure 4. EK-RA2E1 Bo ar d Functi ona l Area D ef init ions ................................................................................. 8

Figure 5. EK-RA2E1 Board Block Diagram ..................................................................................................... 9

Figure 6. Copper Jumpers ............................................................................................................................. 10

Figure 7. System Control and Ecosystem Access Area ................................................................................ 12

Figure 8. Power Supply Options .................................................................................................................... 13

Figure 9. EK-RA2E1 Debug Interface ........................................................................................................... 15

Figure 10. Seeed Grove and Qwiic Connectors ............................................................................................ 18

Figure 11. Pmod 1 ......................................................................................................................................... 19

Figure 12. Pmod 1 Trace Cut Jumpers ......................................................................................................... 20

Figure 13. Pmod 2 ......................................................................................................................................... 20

Figure 14. Arduino Uno Connectors .............................................................................................................. 22

Figure 15. mikroBUS Connection .................................................................................................................. 23

Figure 16. User LEDs .................................................................................................................................... 23

Figure 17. Power LED ................................................................................................................................... 23

Figure 18. Reset and User Switches ............................................................................................................. 24

Figure 19. Boot Mode .................................................................................................................................... 24

Figure 20. Native Pin Access Area ................................................................................................................ 25

Figure 21. RA +3.3 V Current Measurement Circuit...................................................................................... 25

Figure 22. RA MCU Current Measurement ................................................................................................... 26

Tables

Table 1. Default Jumper Settings ................................................................................................................ 10

Table 2. Debug Modes ................................................................................................................................ 14

Table 3. Jumper Connection Summary for Different Debug Modes ........................................................... 14

Table 4. Debug USB Connector .................................................................................................................. 14

Table 5. Debug On-Board Jumper Configuration ........................................................................................ 15

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Table 6. Debug In Mode Jumper Configuration .......................................................................................... 15

Table 7. JTAG/SWD/TRACE Connector ..................................................................................................... 16

Table 8. JTAG/SWD Connector .................................................................................................................. 16

Table 9. Debug Out Jumper Configuration .................................................................................................. 17

Table 10. Grove 1 Connector ..................................................................................................................... 17

Table 11. Grove 2 Connector ..................................................................................................................... 17

Table 12. Qwiic Connector ......................................................................................................................... 18

Table 13. Pmod 1 Connector ..................................................................................................................... 19

Table 14. Pmod 2 Connector ..................................................................................................................... 20

Table 15. Arduino Uno Connections .......................................................................................................... 21

Table 16. mikroBUS Connections .............................................................................................................. 22

Table 17. EK-RA2E1 Board LED Functions .............................................................................................. 23

Table 18. EK-RA2E1 Board Switches ........................................................................................................ 24

Table 19. EK-RA2E1 Board Design Package Contents ............................................................................ 28

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Renesas RA Family EK-RA2E1 v1 – User's Manual

1. Kit Overview

The EK-RA2E1, Evaluation Kit for RA2E1 MCU Group, enables users to seamlessly evaluate the features of the RA2E1 MCU group and develop embedded systems applications using Flexible Software Package (FSP)

studio IDE. The users can utilize rich on-board features along with their choice of popular ecosystems

and e add-ons to bring their big ideas to life.

The key features of the EK-RA2E1 board are categorized in three groups (consistent with the architecture of the kit) as follows:

MCU Native Pin Access

• R7FA2E1A92DFM MCU (referred to as RA MCU)

• 48 MHz, Arm® Cortex®-M23 core

• 128 kB Code Flash, 16 kB SRAM

• 64 pins, LQFP package

• Native pin access through 1 x 40-pin and 2 x 14-pin male headers

• MCU current measurement points for precision current consumption measurement

• Multiple clock sources - RA MCU oscillator and sub-clock oscillator crystals, providing precision

24.000 MHz and 32,768 Hz reference clock. Additional low-precision clocks are available internal to the RA MCU

System Control and Ecosystem Access

• Two 5 V input sources  USB (Debug)  External power supply (using surface mount clamp test points and power input vias)

• Three Debug modes  Debug on-board (SWD)  Debug in (ETM, SWD, an d JTAG)  Debug out (SWD)

• User LEDs and buttons  Three User LEDs (red, blue, green)  Power LED (white) indicating availability of regulated power  Debug LED (yellow) indicating the debug connection  Two User buttons  One Reset button

• Five most popular ecosystems expansions  2 Seeed Grove  SparkFun  2 Digilent Pmod  Arduino

 MikroElektronika

• MCU boot configuration jumper

system (I2C/Analog) connectors

Qwiic® connector

(SPI and UART) connectors

(Uno R3) connector

mikroBUS connector

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Renesas RA Family EK-RA2E1 v1 – User's Manual

Arduino (Analog and

MCU Clock Crystals

Power) Connector

Figure 1. EK-RA2E1 Board Top Side

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Renesas RA Family EK-RA2E1 v1 – User's Manual

Figure 2. EK-RA2E1 Board Bottom Side

1.1 Assum pti ons and Advisory Notes

1. It is assumed that the user has basic understanding of microcontrollers and embedded systems

hardware.

2. It is recommended that the us er refers to the EK-RA2E1 Quick Start Guide to get acquainted with the kit

and the Quick Start example project that EK-RA2E1 board comes pre-programmed with.

3. Flexib le Softw are Pac kage (FSP) and Integrated Developme nt Enviro nment (IDE) such as e

required to develop embedded applications on EK-RA2E1 kit.

4. Instructions to download and install software, import example projects, build them and program the

EK-RA2E1 board are provided in the quick start guide.

studio are

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Renesas RA Family EK-RA2E1 v1 – User's Manual

2. Kit Contents

The following components are included in the kit:

1. EK-RA2E1 v1 board

2. Micro USB device cable (type-A male to micro-B male)

Figure 3. EK-RA2E1 Kit Contents

3. Kit Ordering Information

• EK-RA2E1 v1 kit orderable part number: RTK7EKA2E1S00001BE

Note: The underlined character in the orderable part number represents the kit version.

• EK-RA2E1 board dimensions: 80 mm (width) x 120 mm (length)

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+ 24 hidden pages

Renesas RA2E1 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Kit Overview

1.1 Assum pti ons and Advisory Notes

2. Kit Contents

3. Kit Ordering Information