Notice: This is not a final specification.
Some parametric limits are subject to change.
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)
DESCRIPTION
The M5M29KE131BVP is a Stacked micro Multi Chip
Package that contents 2 Dies of 64M-bit Flash memory in a
48-pin TSOP(I) for lead free use.
128M-bit Flash memory is a 16,777,216 bytes / 8,388,608
words, single power supply and high performance nonvolatile memory fabricated by CMOS technology for the
peripheral circuit and DINOR IV (Divided bit-line NOR IV)
architecture for the memory cell. All memory blocks are
locked and can not be programmed or erased, when WP# is
Low. Using Software Lock Release function, program or
erase operation can be executed.
Renesas LSIs
M5M29KE131BVP
CMOS FLASH MEMORY
Stacked-uMCP (micro Multi Chip Package)
The M5M29KE131BVP is suitable for a high performance cellular
phone and a mobile PC that are required to be small mounting
area, weight and small power dissipation.
FEATURES
Access timeRandom70ns (Max.)
Page25ns(Max.)
Supply voltageVCC= 3.0 ~ 3.6V
Ambient temperatureTa=-40 ~ 85 °C
Package48pin TSOP(Type-I), Lead pitch 0.5mm
Outer-lead finishing : Sn-Cu
APPLICATION
Digital Cellar Phone, Telecommunication,
PDA, Car Navigation System, Video Game Machine
WE#: Write enable
WP#: Write protect
RP#: Reset power down
BYTE#: Byte enable
Rev.0.2_48a_bezz
Preliminary
Input
A22-A0, OE#, WE#, CE#, WP#,
Output
Notice: This is not a final specification.
Some parametric limits are subject to change.
MCP Block Diagram
A0 to A22
CE#
WP#
RP#
WE#
OE#
BYTE#
Renesas LSIs
M5M29KE131BVP
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)
CMOS FLASH MEMORY
Stacked-uMCP (micro Multi Chip Package)
VccGND
64Mbit DINOR IV
Flash Memory
DQ0 to DQ15
64Mbit DINOR IV
Flash Memory
Capacitance
SymbolConditions
CIN
COUT
capacitance
Capacitance
RP#,BYTE#
Parameter
Ta=25°C, f=1MHz,
DQ15-DQ024pF
Vin=Vout=0V
Limits
Min.Typ.Max.
24pF
Unit
2
Rev.0.2_48a_bezz
Preliminary
Notice: This is not a final specification.
Some parametric limits are subject to change.
Flash Memory Part
Renesas LSIs
M5M29KE131BVP
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)
CMOS FLASH MEMORY
Stacked-uMCP (micro Multi Chip Package)
Description
The 128M-bit DINOR IV(Divided bit line NOR IV) Flash
Memory is 3.3V-only high speed 134,217,728-bit CMOS
boot block Flash Memory. Alternating BGO(Back Ground
Operation) feature of the device allows Program or Erase
operations to be performed in one bank while the device
simultaneously allows Read operations to be performed
on the other bank in each 64M-bit area which is selected
by A22=L or H. This BGO feature is suitable for
communication products and cellular phone.The Flash
Memory is fabricated by CMOS technology for the
peripheral circuits and DINOR IV architecture for the
memory cells.
Features
- Organization8,388,608-word x 16-bit
16,777,216-word x 8-bit
- Supply VoltageVCC = 3.0 ~ 3.6V
- Access time
Random Access70ns(Max.)
Random Page Read25ns(Max.)
- Read108mW (Max. at 5MHz)
- Page Read36mW (Max.)
(After Automatic Power Down)0.66µW(typ.)
- Program/Erase126mW(Max.)
Standby0.66µW(typ.)
Deep Power Down mode0.66µW(typ.)
- Auto Program for Bank(I) – Bank(IV)
Program Time
Word Program30µs/1word(typ.)
Byte Program30µs/1byte(typ.)
Page Program4ms(typ.)
Program Unit
Word Program1 word
Byte Program1 byte
Page Program128 words/256 bytes
- Auto Erase
Erase time150ms(typ.)
Erase unit
Bank(I) ,Bank(VIII)
Boot Block4K-word /8K-byte x 2
Parameter Block 4K-word /8K-byte x 6
Main Block32K-word /64K-byte x 7
Bank(II) ,Bank(VII)
Main Block32K-word /64K-byte 8
Bank(III) ,Bank(VI)
Main Block32K-word /64K-byte x 56
Bank(IV) ,Bank(V)
Main Block32K-word /64K-byte x 56
- Program/Erase cycles100Kcycles
- Dual Boot Block Architecture
There are Bottom and Top boot blocks in both sides.
Bottom Boot (A22=VIL )
Top Boot(A22=VIH)
- The Other Functions
Software Command Control
Quick Data Reclaim
Software Lock Release(while WP# is low)
Erase Suspend/Resume
Program Suspend/Resume
Status Register Read
Alternating Back Ground Program/Erase Operation
Among Bank (I)-Bank(IV)
in Bottom 64Mbit area (A22=VIL),
Among Bank (V)-Bank(VIII)
in Top 64Mbit area (A22=VIH)
Random Page Read
3
Rev.0.2_48a_bezz
Preliminary
Boot Block T134 4Kword
.
Boot Block T133 4Kword
.
Parameter Block T132 4Kword
.
Bank(VIII)
..15blocks
Parameter Block T127 4Kword
.
Main Block T126 32Kword
...
Main Block T120 32Kword
.
Main Block T119 32Kword
.
Bank(VII)
..8blocks
..Main Block T112 32Kword
.
Main Block T111 32Kword
.
Bank(VI)
..56blocks
..Main Block T56 32Kword
.
Main Block T55 32Kword
.
Bank(V)
..56blocks
.
Main Block T0 32Kword
Main Block B134 32Kword
.
Bank(IV)
..56blocks
..Main Block B79 32Kword
.
Main Block B78 32Kword
.
Bank(III)
..56blocks
..Main Block B23 32Kword
.
Main Block B22 32Kword
.
Bank(II)
..8blocks
..Main Block B15 32Kword
.
Main Block B14 32Kword
...
Main Block B8 32Kword
.
Bank(I)
Parameter Block B7 4Kword
.
15blocks
..Parameter Block B2 4Kword
.
Boot Block B1 4Kword
Boot Block B0 4Kword
.....
128word Page Buffer
……………………
Notice: This is not a final specification.
Some parametric limits are subject to change.
Block Diagram
(128Mbit Flash Memory)
A22
Renesas LSIs
M5M29KE131BVP
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)
CMOS FLASH MEMORY
Stacked-uMCP (micro Multi Chip Package)
Address
Input
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
VCC
GND
A22="H"A22="L"
X-Decoder
Chip
Enable
Output Enable
Write Enable
Write
Protect
Reset
/PowerDown
BYTE
Enable
A4
A3
A2
A1
A0
F-CE#
OE#
WE#
F-WP#
F-RP#
BYTE#
Y-Decoder
Status / ID Register
Command
User
Interface
Write
State
Machine
DQ15
/A-1
Y-Gate / Sense Amp.
………………………………….
Multiplexer
………………………………….
I/O Buffer
……………………
Data I/O
DQ14
DQ0DQ1
4
Rev.0.2_48a_bezz
Preliminary
Notice: This is not a final specification.
Some parametric limits are subject to change.
Renesas LSIs
M5M29KE131BVP
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)
CMOS FLASH MEMORY
Stacked-uMCP (micro Multi Chip Package)
Function of Flash Memory
The 128M-bit DINOR IV Flash Memory includes on-chip
program/erase control circuitry. The Write State Machine
(WSM) controls block erase and word/page program
operations. Operational modes are selected by the
commands written to the Command User Interface (CUI).
The Status Register indicates the status of the WSM and
when the WSM successfully completes the desired
program or block erase operation.
A Deep Power Down mode is enabled when the RP# pin
is at GND, minimizing power consumption.
Read
The 128M-bit DINOR IV Flash Memory has four read
modes, which accesses to the memory array ,the Page read,
the Device Identifier and the Status Register. The
appropriate read commands are required to be written to the
CUI. Upon initial device power up or after exit from deep
power down, the 128M-bit DINOR IV Flash Memory
automatically resets to read array mode. In the read array
mode and in the conditions are low level input to OE#, high
level input to WE# and RP#, low level input to CE# and
address signals to the address inputs (A22 - A0:Word Mode,
A22-A-1:Byte Mode) the data of the addressed location to
the data input/output (DQ15-DQ0:Word Mode, DQ7DQ0:Byte Mode) is output.
Output Disable
When OE# is at VIH, output from the devices is disabled.
Data input/output are in a high-impedance (High-Z) state.
Standby
When CE# is at VIH, the device is in the standby mode
and its power consumption is reduced. Data input/output
are in a high-impedance (High-Z) state. If the memory is
deselected during block erase or program, the internal
control circuits remain active and the device consumes
normal active power until the operation completes.
Deep Power Down
When RP# is at VIL, the device is in the deep power down
mode and its power consumption is substantially low.
During read modes, the memory is deselected and the data
input/output are in a high-impedance (High-Z) state. After
return from power down, the CUI is reset to Read Array,
and the Status Register is cleared to value 80H.
During block erase or program modes, RP# low will abort
either operation. Memory array data of the block being
altered become invalid.
Automatic Power Down (Auto-PD)
Write
Writes to the CUI enables reading of memory array data,
device identifiers and reading and clearing of the Status
Register. They also enable block erase and program. The
CUI is written by bringing WE# to low level and OE# is at
high level, while CE# is at low level. Address and data are
latched on the earlier rising edge of WE# and CE#.
Standard micro processor write timings are used.
Alternating Background Operation (BGO)
The 128M-bit DINOR IV Flash Memory allows to read array
from one bank while the other bank operates in software
command write cycling or the erasing / programming
operation in the background. Array Read operation with the
other bank in BGO is performed by changing the bank
address without any additional command. When the bank
address points the bank in software command write cycling
or the erasing / programming operation, the data is read out
from the status register. The access time with BGO is the
same as the normal read operation.
The Automatic Power Down minimizes the power
consumption during read mode. The device automatically
turns to this mode when any addresses or CE# isn't
changed more than 200ns after the last alternation. The
power consumption becomes the same as the stand-by
mode. During this mode, the output data is latched and can
be read out. New data is read out correctly when
addresses are changed.
BBR(Back Bank array Read)
In the 128M-bit DINOR IV Flash Memory , when one
memory address is read according to a Read Mode in the
case of the same as an access when a Read Mode
command is input, an another Bank memory data can be
read out (Read Array or Page Read) by changing an
another Bank address.
5
Rev.0.2_48a_bezz
Preliminary
Notice: This is not a final specification.
Some parametric limits are subject to change.
Renesas LSIs
M5M29KE131BVP
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)
CMOS FLASH MEMORY
Stacked-uMCP (micro Multi Chip Package)
Software Command Definitions
The device operations are selected by writing specific
software command into the Command User Interface.
Clear Status Register Command (50H)
The Erase Status, Program Status and Block Status bits
are set to "1"s by the Write State Machine and can only
be reset by the Clear Status Register command of 50H.
These bits indicate various failure conditions.
Read Array Command (FFH)
The device is in Read Array mode on initial device power
up and after exit from deep power down, or by writing FFH
to the Command User Interface. After starting the internal
operation the device is set to the read status register mode
automatically.Automated block erase is initiated by writing the Block
Read Device Identifier Command (90H)
We can normally read device identifier codes when Read
Device Identifier Code Command (90H) is written to the
command latch. Following the command write, the
manufacturer code and the device code can be read from
A0 address 0H and 1H in a bank address, respectively.
Read Status Register Command (70H)
The Status Register is read after writing the Read Status
Register command of 70H to the Command User Interface.
Also, after starting the internal operation the device is set to
the Read Status Register mode automatically.
The contents of Status Register are latched on the later
falling edge of OE# must be toggled every status read.
Block Erase / Confirm Command (20H/D0H)
Erase command of 20H followed by the Confirm
command of D0H. An address within the block to be
erased is required. The WSM executes iterative erase
pulse application and erase verify operation.
Program Commands
A) Word / Byte Program (40H)
Word/Byte program is executed by a two-command
sequence. The Word/Byte program Setup command of
40H is written to the Command Interface, followed by a
second write specifying the address and data to be written.
The WSM controls the program pulse application and
verify operation.
Page Read Command (F3H)
The Page Read command (F3H) timing can be used by
writing the first command to CUI and F-CE# falls VIL or
changing the address(A22-A2) is necessary to start
activating page read mode. This command is fast random
4 words read. During the read it is necessary to fix F-CE#
low and change addresses that are defined by A0 and
A1(0h - 3h) at random continuously. The mode is kept until
F-RP# is set to L or this chip is powered down.
The first read of Page Read timing is the same as normal
read (ta(CE)). F-CE# should be fallen “L”. The read timing
after the first is the same as ta(PAD).
In the page read mode the upper address(A22-A2) or FCE# are supposed not to be clocked during read operation.
Otherwise the access time is as same as normal read.
B) Page Program for Data Blocks (41H)
Page Program allows fast programming of 128words
/256bytes of data. Writing of 41H initiates the page
program operation for the Data area. From 2nd cycle to
129th cycle :Word Mode, 257th cycle :Byte Mode, write
data must be serially inputted. Address A6-A0:Word
Mode, A6-A-1:Byte Mode have to be incremented from
00H to 7FH. After completion of data loading, the WSM
controls the program pulse application and verify
operation.
C) Single Data Load to Page Buffer (74H)
/ Page Buffer to Flash (0EH/D0H)
Single data load to the page buffer is performed by
writing 74H followed by a second write specifying the
column address(A6-A0:Word Mode, A6-A-1:Byte Mode)
and data. Distinct data up to 128word/256bytes can be
loaded to the page buffer by this two-command sequence.
On the other hand, all of the loaded data to the page buffer
is programmed simultaneously by writing Page Buffer to
Flash command of 0EH followed by the confirm command
of D0H. After completion of programming the data on the
page buffer is cleared automatically.
6
Rev.0.2_48a_bezz
Preliminary
Notice: This is not a final specification.
Some parametric limits are subject to change.
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)
Flash to Page Buffer Command (F1H/D0H)Power Supply Voltage
M5M29KE131BVP
Stacked-uMCP (micro Multi Chip Package)
Renesas LSIs
CMOS FLASH MEMORY
Array data load to the page buffer is performed by
writing the Flash to Page Buffer command of F1H
followed by the Confirm command of D0H. An address
within the page to be loaded is required. Then the array
data can be copied into the other pages within the same
bank by using the Page Buffer to Flash command.
Clear Page Buffer Command (55H/D0H)
Loaded data to the page buffer is cleared by writing the
Clear Page Buffer command of 55H followed by the
Confirm command of D0H. This command is valid for
clearing data loaded by Single Data Load to Page Buffer
command.
Data Protection
The 128M-bit DINOR IV Flash Memory has a master
Write Protect pin (WP#). When WP# is at VIH, all blocks
can be programmed or erased. When WP# is low, all
blocks are in locked mode which prevents any
modifications to memory blocks. Software Lock Release
function is only command which allows to program or erase.
When the power supply voltage is less than VLKO, Low
VCC Lock-Out voltage, the device is set to the Read-only
mode.
A delay time of 60µs is required before any device
operation is initiated. The delay time is measured from the
time Flash VCC reaches Flash VCCmin (3.0V).
During power up, RP# = GND is recommended. Falling in
Busy status is not recommended for possibility of
damaging the device.
Memory Organization
The 128M-bit DINOR IV Flash Memory is constructed by
2 boot blocks of 4K words, 6 parameter blocks of 4K words
and 7 main blocks of 32K words in Bank(I) and Bank(VIII),
by 8 main blocks of 32K words in Bank(II) and Bank(VII),
and by 56 main blocks of 32K words in Bank(III),
BANK(IV) , BANK(V) and Bank(VI).
A block is erased independently of other blocks in the
array.
Suspend/Resume Command (B0H/D0H)
Writing the Suspend command of B0H during block erase
operation interrupts the block erase operation and allows
read out from another block of memory. Writing the
Suspend command of B0H during program operation
interrupts the program operation and allows read out from
another block of memory. The Bank address is required
when writing the Suspend/Resume Command. The device
continues to output Status Register data when read, after
the Suspend command is written to it. Polling the WSM
Status and Suspend Status bits will determine when the
erase operation or program operation has been suspended.
At this point, writing of the Read Array command to the CUI
enables reading data from blocks other than that which is
suspended. When the Resume command of D0H is written
to the CUI, the WSM will continue with the erase or
program processes.
Erase All Unlocked Blocks Command (A7H/D0H)
The command sequence enable us to erase all blocks.
The command can be used by writing Setup command
A7H(1stcycle) and confirm command D0H(2ndcycle). The
sequence is not valid in case of WP#=VIL.
7
Rev.0.2_48a_bezz
Preliminary
Notice: This is not a final specification.
Some parametric limits are subject to change.
Renesas LSIs
M5M29KE131BVP
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT)