Renesas M3A-HS19 User Manual
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
st
, 2010
Send any inquiries to http://www.renesas.com/inquiry
.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
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does not warrant that such informatio n is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
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expressly specified in a Ren esas E lectronics data sheets or dat a books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electron ic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other appl i cations or purposes that pose a d irect threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as t he occu rrence o f failure at a certai n rate an d malfunct io ns under cert ain u se con dition s. Further,
Renesas Electronics prod ucts are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
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Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation an d also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
User’s Manual
SH7619 CPU Board
M3A-HS19
User’s Manual
Renesas 32-Bit RISC Microcomputers
SuperH™ RISC engine Family/SH7619 Group
Rev.1.01 2008.10
Notes regarding these materials
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.
Table of Contents
Chapter1 Overview..............................................................................................................................1-1
1.1 Overview .................................................................................................................................................................... 1-2
1.2 Configuration.............................................................................................................................................................. 1-2
1.3 External Specifications...............................................................................................................................................1-3
1.4 Appearance................................................................................................................................................................ 1-4
1.5 M3A-HS19 Block Diagrams........................................................................................................................................ 1-5
1.6 M3A-HS19 Board Overview ....................................................................................................................................... 1-6
1.7 M3A-HS19 Memory Mapping.....................................................................................................................................1-9
1.8 Absolute Maximum Ratings...................................................................................................................................... 1-10
1.9 Recommended Operating Conditions ......................................................................................................................1-10
Chapter2 Features and Specifications.................................................................................................2-1
2.1 Features.....................................................................................................................................................................2-2
2.2 CPU............................................................................................................................................................................ 2-3
2.2.1 SH7619.............................................................................................................................................................2-3
2.3 Memory ......................................................................................................................................................................2-4
2.3.1 SH7619 U Memory and Cache Memory ........................................................................................................... 2-4
2.3.2 Flash Memory S29GL032A90TFIR4 (Standard component)............................................................................. 2-4
2.3.3 External Synchronous DRAM (SDRAM)...........................................................................................................2-6
2.3.4 External EEPROM .......................................................................................................................................... 2-11
2.4 Serial Port Interface.................................................................................................................................................. 2-13
2.5 PCMCIA Card Interface............................................................................................................................................ 2-14
2.6 LAN Port Interface.................................................................................................................................................... 2-15
2.7 I/O Port..................................................................................................................................................................... 2-16
2.8 Power Supply Circuit................................................................................................................................................ 2-19
2.9 Clock Module............................................................................................................................................................ 2-20
2.10 Reset Module.........................................................................................................................................................2-21
2.11 Interrupt Switch ...................................................................................................................................................... 2-22
2.12 E10A-USB Interface...............................................................................................................................................2-23
Chapter3 Operational Specifications...................................................................................................3-1
3.1 M3A-HS19 Connectors...............................................................................................................................................3-2
3.1.1 UART Connector Pin (J1).................................................................................................................................. 3-3
3.1.2 UART Connector (J2)........................................................................................................................................ 3-4
3.1.3 RS-422 Connector Pin (J3)...............................................................................................................................3-5
3.1.4 PCMCIA Connector (J4)....................................................................................................................................3-6
3.1.5 LAN Connector (J5) .......................................................................................................................................... 3-8
3.1.6 H-UDI Connector (J6) ....................................................................................................................................... 3-9
3.1.7 Power Supply Connector (J7) ......................................................................................................................... 3-10
3.1.8 External Power Supply Connector (J8)...........................................................................................................3-11
3.1.9 Expansion Connectors (J9-J13).................................................................. 3-12
3.2 Switches and LEDs ..................................................................................................................................................3-15
3.2.1 Jumpers (JP1 - JP9) ....................................................................................................................................... 3-16
Rev. 1.01 Oct 28, 2008
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3.2.2 Features of Switches and LEDs...................................................................................................................... 3-18
3.3 Dimensions...............................................................................................................................................................3-20
Appendix..............................................................................................................................................A-1
M3A-HS19 SCHEMATICS
Rev. 1.01 Oct 28, 2008
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(ii)
Chapter1 Overview
Chapter1
Overview
1-1
1
1.1 Overview
1.1 Overview
The M3A-HS19 is a CPU board designed to evaluate the feature and performance of the SH7619 Group of Renesas Technology
original MCU, as well as developing and evaluating the application software for the MCUs.
SH7619 data bus, address bus and on-chip peripheral pins are all connected to expansion connectors and appropriate connectors
to allow for the timing evaluation with peripherals using measurement instruments, and the development of the optional boards
according to its application. Furthermore, it can be connected with an RS-232C connector and a LAN connector, and a PC card
can be mounted on the board.
Renesas Technology E10A-USB on-chip emulator can also be connected to the M3A-HS19.
1.2 Configuration
Figure 1.2.1 shows an example of system configuration using the M3A-HS19.
Overview
PC card*
High-performance
Embedded Workshop
SuperHRISC engine
C/C++ CompilerPackage
*
Expansion
connector
PCMCIA
connector
*
SH7619 CPU board
M3A-HS19
SH7619
Debugger
Host computer*
USB
5V DC output
regulated PS
(1.5A min.)
Serial port connector
H-UDI connector
LAN port connector
E10A-U SB
*
These items should be prepared by user.
*
Figure 1.2.1 M3A-HS19 System Configuration
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1.3 External Specifications
Table 1.3.1 lists external specifications.
Table 1.3.1 External Specifications
No. Items Description
1 CPU SH7619
1.3 External Specification
• Input (XIN) clock: 15.625 MHz
• Bus clock: 62.5 MHz at maximum
• CPU clock: 125 MHz at maximum
2 Memories • SDRAM (16-bit data bus)
• EDS1216AATA-75E: 1 (16 MB)
• Flash memory (16-bit data bus)
• S29GL032A90TFIR4: 1 (4 MB)
• EEPROM (Serial)
• S93C76AFT-V-G: 1 (8 KB, 512 x 16)
3 Connectors • Expansion Connector (Bus, I/O, VCC, GND: 140 pins in total: Through-hole)
• Channel 1 serial port connector (2-pin: Through-hole)
• Channel 2 serial port connector (D-sub 9-pin)
• RS-422 serial connector (4-pin: Through-hole)
• RJ-45 LAN connector (8-pin, RJ-45)
• PC card connector (68-pin)
• H-UDI connector (14-pin)
• Power connector (2-pin: 5 V)
• External power connector (2-pin: 1.8 V: Through-hole)
4 LEDs • Power LED: 1
• User LEDs: 4
5 Switches • Power switch: 1
• Reset push-button switch: 1
• NMI push-button switch: 1
• IRQ0 push-button switch: 1
• User DIP switches: 4/package
• Mode DIP switches: 4/package
• 1.8 V external switch jumper: 1
• PCMCIA power switch jumper: 1
• PCMCIA bus switch enable jumper: 1
• Expansion connector signal select jumpers: 5
6 Dimensions • Dimensions: 100 mm x 100 mm
• Mounting form:6 layers, double-sided
• Board configuration:1 board
Overview
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1.4 Appearance
Figure 1.4.1 shows the appearance of the M3A-HS19.
Overview
1.4
Figure 1.4.1 M3A-HS19 Appearance
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1.5 M3A-HS19 Block Diagrams
Figure 1.5.1 shows the system block diagram.
Overview
1.5 M3A-HS19 Block Diagram
LAN
connector
H-UDI (14-pin)
Bus switch
PCMCIA
connector
H-UDI
EtherC
16-bit
Serial port connector
(RS-232C x 2, RS-422 x 1)
SCIF
/SCI
SH7619
BSC
HIF
GPIO/
Other
Peripheral
Functions
16-bit
SDRAM
SDRAM
(16MB)
(16MB)
SH7619 CPU Board
16-bit
16-bit
Flash Memory
M3A-HS19
Expansion connector
(HIF bus)
Expansion connector
(CPU bus)
(4MB)
(4MB)
Figure 1.5.1 System Block Diagram
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1.6 M3A-HS19 Board Overview
Figure 1.6.1 shows the M3A-HS19 board overview.
Top view of the component side
U5
PCMCIA
power control IC
J7
Power connector
JP9
Power switching
jumper
J14
AC adaptor jack
SW1
Power switch
LED5
Power LED
U7,U8,U9
Bus switch
Overview
1.6 M3A-HS19 Board Overview
LED1-4
User LED
J6
H-UDI connector
(14-pin)
U6
RS-232C
driver
U12, U16
3.3V/1.8V
regulator IC
SW2
Reset switch
SW6
IRQ0 switch
Top view of the solder side
J4
PC card
connector
(68-pin)
J12
Expansion
connector
SW5
NMI switch
SW4
Mode DIP
switch
U2
Flash
memory
U1
SH7619
SW3
User DIP switch
J2
RS-232C
serial connector
X3
25MHz oscillator
X1
15.625MHz oscillator
J5
RJ-45
LAN connector
J10
Extension
connector
U14
Logic IC
U10
J9, J11, J13
Expansion connector
U4
EEPROM
RS-422
driver
U13
Reset IC
Figure 1.6.1 M3A-HS19 Board External View
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Table 1.6.1 lists major compo nents mounted on the M3A-HS19
Table 1.6.1 Major Components
Part
Number
U1 CPU R4S76190W125BGV (Renesas)
U2 Flash memory S29GL032A90TFIR4 (Spansion)
U3 SDRAM EDS1216AATA-75E (Elpida)
U4 EEPROM S93C76AFT-V-G (SII)
U5 PCMCIA power con trol IC LTC1470CS8#PBF (Linear)
U6 RS-232C driver SP3222ECY (Sipex)
U7,U8,U9 Bus switch SN74CBTLV16210GR (TI)
U10 RS-422 driver SP3077EEN-L (Sipex)
U11,U15 Logic IC TC7S08FU (TOSHIBA)
U12,U16 Regulator IC LMS1587CSX-ADJ (NS)
U13 Reset IC M51957BFP
U14 Logic IC SN74LVC14APWR (TI)
X1
X2
X3
J1
J2
J3 RS-422 serial connector
J4 PC card connector ICM-C68H-S112-400R1 (J.S.T.)
J5 RJ-45 LAN connector TLA-6T718 (TDK)
J6 H-UDI connector 7614-6002
J7 Power supply connector S2B-XH-A (J.S.T.)
J8
J9,J11-J13 Expansion connector
J10 Expansion connector
J14 AC adapter jack
J15 3-pin connector
JP1-8 Jumper HW-3P-G (MAC8)
JP9 Jumper XG8V-0334 (OMRON)
LED1-4 User LED Yellow, SML-3 11YT (ROHM)
LED5 Power LED Blue, UB1114C (STANLEY)
SW1 Power switch MS-12AAH1 (Nikkai)
SW2 Reset switch (MRES) B3SN-3012
SW3 User DIP switch A6S-4104-H
SW4 Mode DIP switch A6S-4101-H
SW5 NMI switch B3SN-3012
SW6 IRQ0 switch B3SN-3012
Oscillator
Ceramic resonator
Oscillator
Serial port connector (Ch1)
Serial port connector (Ch2)
1.8 V External power supply
connector
Name
SG-8002JF_15.625 MHz (Epson)
SG-8002JF_25.000 MHz (Epson)
Optional
Optional
2-pin MIL standard connector
XM2C-0912-112 (OMRON)
Optional
Optional
2-pin MIL standard connector
Optional,
20-pin MIL pitch connector
Optional,
40-pin MIL pitch connector
HEC0470-01-630 (Hoshiden)
XG8V-0331 (OMRON)
Remarks
(By manufacturer)
(Renesas)
, 15.625 MH z CSTCE15M7 (Murata)
,
A2-4PA-2.54DSA
(Sumitomo 3M)
,
(OMRON)
(OMRON)
(OMRON)
(OMRON)
(OMRON)
1.6 M3A-HS19 Board Overview
Recommended Optional Parts
(By manufacturer)
A2-2PA-2.54DSA
A2-2PA-2.54DSA
(Hirose)
XG4C-2031
XG4C-4031
(OMRON)
(OMRON)
(Hirose)
(Hirose)
Overview
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1.7 M3A-HS19 Memory Mapping
Area 0 bus width: (Default) MD3 = 0 •••16-bit
Data alignment: (SW4-1) MD5 = 0(ON) •••Big endian
MD5 = 1(OFF) •••Little endian
Figure 1.7.1 show the memory mapping examples of the SH7619 on the M3A-HS19.
Logical Address [31~29] Area Cacheable/Non-cacheable
000~011 P0 Cacheable
100~ P1 Cacheable
101~ P2 Non cacheable
110~ P3 Cacheable
111~ P4 Non-cacheable (on-chip I/O) etc.
(P0 and shadow area (P1, P2, P3))
Overview
1.7 M3A-HS19 Memory Mapping
Address [28~0] Area MAP = 0 MAP = 1
H'0000 0000
H'0400 0000
H'0800 0000
H'0C00 0000
H'1000 0000
H'1400 0000
H'1600 0000
H'1800 0000
H'1A00 0000
H'1C00 0000
H'1FFF FFFF
Area 0
64 MB
Area 1
64 MB
Area 2
64 MB
Area 3
64 MB
Area 4
64 MB
Area 5A
32 MB
Area 5B
32 MB
Area 6A
32 MB
Area 6B
32 MB
Area 7
64 MB
Flash Memory (4 MB)
H’0000 0000~H’003F FFFF
User Area
Reserved *
(Do not use)
Reserved *
(Do not use)
SDRAM (16 MB)
H’0C00 0000~H’0CFF FFFF
User Area
User Area User Area
Reserved
(Do not use)
User Area
Reserved
(Do not use)
User Area
Reserved *
(Do not use)
Flash Memory (4 MB)
H’0000 0000~H’003F FFFF
User Area
Reserved *
(Do not use)
Reserved *
(Do not use)
SDRAM (16 MB)
H’0C00 0000~H’0CFF FFFF
User Area
User Area
PCMCIA
User Area
PCMCIA
Reserved
(Do not use)
Note: H'0000 0000 to H'1FFF FFFF are the cache-enabled area.
Figure 1.7.1 SH7619 Memory Mapping Examples
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1.8 Absolute Maximum Ratings
1.8 Absolute Maximum Ratings
Table 1.8.1 lists the absolute maximum ratings.
Table 1.8.1 Absolute Maximum Ratings
Symbol Parameter Value Remarks
Overview
VCC
3VCC
1.8VCC 1.8 V
Topr
Tstr
Note: Temperature refers to the air temperature in the vicinity of the board.
5 V system power supply voltage
3.3 V system power supply voltage
system power supply voltage
Operating temperature
Storage temperature
-0.3 to 6.0 V
-0.3 to 3.8 V
-0.3 to 2.1 V
-5 to 55°C No condensation, no corrosion gas allowed.
-10 to 60°C No condensation, no corrosion gas allowed.
Relative to VSS
Relative to VSS
Relative to VSS
1.9 Recommended Operating Conditions
Table 1.9.1 lists the recomme nded operating conditions.
Table 1.9.1 Recommended Operating Conditions
Symbol Parameter Value Remarks
VCC
3VCC
1.8VCC
-
Topr
5 V power supply voltage
3.3 V power supply voltage
1.8 V power supply voltage
Maximum current consumption
on the board
Operating temperature 0 to 50°C
4.75 to 5.25 V
3.0 to 3.6 V
1.71 to 1.89 V
1 A max.
Relative to VSS
Relative to VSS
(Always supplied by regulator)
Relative to VSS
(Normally supplied by regulator)
No condensation, no corrosion gas allowed.
Rev.1.01 Oct 28, 2008 1-9
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Overview
1.8 Absolute Maximum Ratings
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Chapter2Features and Specifications
Chapter2
Features and Specifications
2-1
2
2.1 Features
Table 2.1.1 lists the functional modules.
Table 2.1.1 F unctional Modules
Section Features Description
Features and Specifications
2.1 Features
2.2 CPU
SH7619, clock mode 1
• Input (XIN) clock: 15.625 MHz
• Bus clock: 62.5 MHz, max.
• CPU clock: 125 MHz, max.
2.3
Memories
• U Memory (CPU)
• 16-KB memory
• Flash Memory
• S29GL032A90TFIR4: 1 (4 MB)
• SDRAM
• EDS1216AATA-75E: 1 (16 MB)
• EEPROM
• S-93C76AFT-V-G: 1 (8 KB, 512 x 16)
2.4 Serial Port Interface Connects SCIF2 of the SH7619 to a serial port connector
2.5 PCMCIA Card Interface Connects PCMCIA control signal and bus of the SH7619 to the
PCMCIA connector
2.6 LAN Port Interface Connects the SH7619 Ether I/O to an RJ-45 connector
2.7 I/O Ports Connects the SH7619 I/O port to an expansion connector
2.8 Power Supply Circuit Controls the system power supply of the M3A-HS19
2.9 Clock Module Controls the clock
2.10 Reset Module Reset control of device mounted on the M3A-HS19
2.11 Interrupt Switches Connects to the NMI pin and IRQ0 pin
2.12 E10A-USB Interface SH7619 H-UDI/AUD interface
- Operational specifications Connectors, switches, jumpers, LEDs
• Expansion connector, H-UDI connector
• PCMCIA, ETHER, RS-232C connector
• Switches and LEDs
Refer to Chapter 3 for details
Rev.1.01
REJ10J1351-0101
Oct 28, .2008 2-2
Features and Specifications
2
2.2 CPU
2.2 CPU
2.2.1 SH7619
The M3A-HS19 CPU board includes the SH7619, the 32-bit RISC MCU operates with a maximum frequency of 125 MHz.
The SH7619 is equipped with an Ethernet controller that includes an IEEE802.3u compliant Media Access Controller and
a Physical Layer Transceiver. Moreover, the SH7619 has both a 16-KB U memory (RAM) and a 16-KB instruction/data
unified cache memory. These on-chip modules enable the SH7619 to be used in a wide range of applications from data
processing to control equipments.
The M3A-HS19 can be operated at a maximum frequency of 125 MHz (external bus: 62.5 MHz, max) using a 15.625 MHz
input clock. The dedicated clock of 25.000 MHz input from CK_PHY pin is used as an on-chip PHY clock.
Figure 2.2.1 shows the SH7619 pin assignments.
SH7619
Mode
Clock
System
Control
CPU
Address Bus
Lower
Data Bus
HIF-D/Upper
Data bus
SW3
User port
(Ether)
LED
User port
(Ether)
Ether.ref
SW4-1
"H/L"
15.625MHz
25.000MHz
Serial Channel 0
"H"
MD0
"L"
MD1
"L"
MD2
"L"
MD3
MD5
"H"
TESTMD#
TESTOUT#
EXTAL
XTAL
CKI0
CK_PHY
RES#
NMI
PD0/IRQ0/-/TEND0
PA25/A25/SIOFSYNCO
PA24/A24/TXD_SIO0
PA23/A23/RXD_SIO0
PA22/A22/SIOMCLK0
PA21/A21/SCK_SIO0
PA20/A20
PA19/A19
PA18/A18
PA17/A17
PA16/A16
16
A15-A0
16
D15-D0
PE24/HIFD15/CTS1/D31
PE23/HIFD14/RTS1/D30
PE22/HIFD13/CTS1/D29
PE21/HIFD12/RTS0/D28
PE20/HIFD11/SCK0/D27
PE19/HIFD10/RXD0/D26
PE18/HIFD09/TXD1/D25
PE17/HIFD08/SCK0/D24
PE16/HIFD07/RXD0/D23
PE15/HIFD06/TXD0/D22
PE14/HIFD05/-/D21
PE13/HIFD04/-/D20
PE12/HIFD03/-/D19
PE11/HIFD02/-/D18
PE10/HIFD01/-/D17
PE09/HIFD00/-/D16
PC16/MDIO
PC17/MDC
PC18/LINKSTA
PC19/EXOUT
PC04/MII_TXD0/-/SPEED100#
PC05/MII_TXD1/-/LINK#
PC06/MII_TXD2/-/CRS#
PC07/MII_TXD3/-/DUPLEX#
EXRES1
TSTBUSA
PB13/BS#
RD/WR#
WE0#/DQMLL
PB05/WE2(BE2)#/DQMUL/ICIORD#
PB06/WE3(BE3)#/DQMUU/ICIOWR#
WE1#/DQMLU/WE#
PB12/CS3#
PB02/CKE
PB03/CAS#
PB04/RAS#
PB10/CS5B#/CE1A#
PB09/CE2A#
PB00/WAIT#
PB01/IOIS16#
PC00/MII_RXD0
PC01/MII_RXD1
PC02/MII_RXD2
PC03/MII_RXD3
PE08/HIFCS#
PE06/HIFWR#/SIOFSYNC0
PE02/HIFDREQ/RXD_SIO0
PE01/HIFRDY/SIOMCLK0
PE07/HIFRS
PE05/HIFRD
PE03/HIFMD
PE00/HIFEBL/SCK_SIO0
PE04/HIFINT#/TXD_SIO0
PC09/RX_ER
PC14/COL
PC15/CRS
PC20/WOL
PC08/RX_DV
PC10/RX_CLK
PC11/TX_ER
PC12/TX_EN
PC13/TX_CLK
PD2/IRQ2/TXD1/DREQ0
PD3/IRQ3/RXD1/DACK0
PD5/IRQ5/TXD2/DREQ1
PD6/IRQ6/RXD2/DACK1
ASEMD#
CS0#
TRST#
TMS
RD#
RXM
RXP
TXM
TXP
TDO
TDI
TCK
SW4-3
SW4-2
RESET#
REG#
CD#
EN#
Bus Control
(All,FLASH
SDRAM,PCMCIA)
Bus Control
(SDRAM)
Bus Control
(PCMCIA)
Ether
Interface
EEPROM
Extension
Connector
HIF
Interface
PCMCIA
Interface
Other Extension
Bus Interface
RS-422,RS-232C
Interface
H-UDI
Interface
Rev.1.01
Oct 28, .2008 2-3
REJ10J1351-0101
Figure 2.2.1 Pin Assignments by function
Features and Specifications
2
2.3 Memory
2.3 Memory
The M3A-HS19 includes the SH7619 on-chip U memory, an external flash memory, external SDRAM and EEPROM.
Details are described below (Except the PC card).
2.3.1 SH7619 U Memory and Cache Memory
The SH7619 has a 16-KB (RAM) U memory module (address: H’E55FC000~H’E55FFFFF) and a 16-KB
instruction/data-unified cache memory.
2.3.2 Flash Memory S29GL032A90TFIR4 (Standard component)
The M3A-HS19 comes standard with a flash memory listed in Table 2.3.1 to store a user program.
The flash memory is an external bus 16-bit mode fixed and operates at 3.3 V single. The write-protection of flash memory
can be enabled or disabled by DIP switches (SW4-4).
Figure 2.3.1 shows the Flash Memory Block Diagram. Table 2.3.2 lists setting examples of the bus state
controller(write/read) when the SH7619 bus clock operates at 62.5 MHz (clock mode 1), and Figure 2.3.2 shows read and
write access timing example.
Table 2.3.1 Flash Memory Specifications
Part Number Bus Size Capacity Access Time
S29GL032A90TFIR4 16-bit mode 4 MB (16 bits x 2 Mwords x 1) 90 ns
SH7619 (U1)
D15-D0
A21-A1
RD#
WE0#
CS0#
3.3 V
21
16
3.3 V
3.3 V
3.3 V
Reset Signal
NC
3.3 V
DIP Switch
(SW4-4)
S29GL032A90TFIR4 (U2)
(2 Mwords x 16 bits)
A20-A0
DQ15-DQ0
BYTE#
OE#
WE#
CE#
RESET#
RY/BY#
WP#
Rev.1.01
REJ10J1351-0101
Oct 28, .2008 2-4
Figure 2.3.1 Flash Memory Block Diagram
Features and Specifications
A
2
Table 2.3.2 Setting Example of Bus State Controller (Flash Memory Write and Read)
User Area Applicable Device Settings for Bus State Controller
CS0 S29GL032A90TFIR4 CS0 Space Bus Control Register: CS0BCR
2.3.2 Flash Memory S29GL032A90TFIR4 (Standard component)
Initial value: H'36DB 0400 (MD3 = "L")
Recommended value: H'1000 0400
• Idle Cycles between Write-Read Cycles and
Write-Write Cycles
IWW[1:0] = B'01: 1 idle cycle inserted
• Data bus width
BSZ[1:0] = B’10: *Shall be ignored.
CS0 space wait control register: CS0WCR
Initial value: H'0000 0500
Recommended value: H'0000 0AC1
• Number of Delay Cycles from address, CS0#
Assertion to RD#, WEn#
SW[1:0] = B'01; 1.5 cycles
• Number of Access Wait Cycles
WR[3:0] = B'0101; 5 cycles
• Ignore external WAIT input
WM = B’1;
• Number of Delay Cycles from RD#, WEn# negation
to address, CS0# negation
HW[1:0] = B'01; 1.5 cycles
<Write/Read Timing>
CKIO
21-A1
CS0#
RD#
tCS
WE0#
D15-D0
Write1 Write2 Read1
tWCtWC
tCH
tWPtAS
tWP
tDS
DATA DATA DATA
tAH
T1T2Tw 4T1 Tw 1 Tw 2 Tw 1 Tw2 T2 T1 Tw1 Tw 2 Tw3 T2Tf Tf Taw1Taw 1Th Th Th TfTw 4Tw3 Tw 3 Tw4 Tw5Tw 5 Tw5
tAD1
tAD1tAD1
tCSD1
tCSD1tCSD1
tWPH
tWDD1
tWDH1tWDD1
ta(AD)
ta(CE1)
tRCtRC
ta(OE)
tAD1
tCSD1
tCSD1
tWED1tWED1tWED1tWED1
tCH
tAH
tWPtWPH tWP
tOEH
tWDH1
Figure 2.3.2 Flash Memory Read and Write Access Timing Example
tAD1tAD1
tCSD1
tRSDtRSD
tDF(CE)
tRDS1tDHtDStDH
tRDH1
tDF(OE)
Rev.1.01
REJ10J1351-0101
Oct 28, .2008 2-5
Features and Specifications
2
2.3.3 External Synchronous DRAM (SDRAM)
The M3A-HS19 is provided with a 16-MB synchronous DRAM (SDRAM) as an external main memory. T he SDRAM is
controlled by the SH7619 on-chip bus state controller. The SDRAM is accessed in 16-bit bus.
Table 2.3.3 lists SDRAM specifications used on the M3A-HS19, and Figure 2.3.3 shows its block diagram.
Table 2.3.3 SDRAM Specifications
Items Description
Part Number EDS1216AATA-75E
Configuration 16 MB (16-bit bus width) x 1
Capacity 16 MB
Access Time 5.4 ns
CAS Latency 2 (at 62.5 MHz bus clock)
Refresh Interval 4,096 refresh cycles in every 64 ms
Row Address A1 1- A0
Column Address A8 - A0
Number of Banks 4-banks controlled by BA0, BA1
2.3.3 External Synchronous DRAM
3.3V
EDS1216AATA-75(U3)
(
SH7619(U1)
A14-13 BA1-0
A12-1
CS3#
CKIO
CKE
RD/WR#
RAS#
CAS#
DQMLU
DQMLL
D15-0
x 16
2
11
16
2 M x 16 bits x 4-bank)
A11-0
CS#
CLK
CKE
WE#
RAS#
CAS#
DQMU
DQML
DQ15-DQ0
Figure 2.3.3 External SDRAM Block Diagram
Rev.1.01
Oct 28, .2008 2-6
REJ10J1351-0101
Features and Specifications
2
A power-on sequence is required to use a SDRAM. Power-on sequence is to initialize the pin function controller (PFC),
set registers in the bus state controller and write data in the SDRAM mode register.
Table 2.3.4 lists the access address when writing in the SDRAM mode register on the CS3 space.
Table 2.3.4 Access Address for SDRAM Mode Register Write (CS3 Space)
2.3.3 External Synchronous DRAM
Data bus
width
16 bits 2 H'F8F D 5440 H'0000 0440 H'F8FD 5040 H'0000 0040
Execute following settings to the M3A-HS19 SDRAM mode register.
• Burst length: Burst read/single write (burst length 1)
• Wrap type: Sequential
• CAS latency: 2 cycles
To write data in the SDRAM mode register as shown in Table 2.3.4, write the arbitrary data in words to the address of
H'F8FD 5440 (the data in this case is ignored). Following commands are sequentially issued to the SDRAM by the word
writing.
1.All banks precharge command (PALL)
Idle cycles (Tpw), of which number is specified by bits WTRP1 and WTRP0 in CS3WCR, are inserted between the PALL
and the first REF commands.
2. Auto-refreshing command (REF) for eight times
Idle cycles (Trc), of which number is specified by bits WTRP1 and WTRP0 in CS3WCR are inserted after issuing REF
command
3. Mode register write command (MRS)
CAS
latency
Burst read/single write (burst length 1) Burst read/burst write (burst length 1)
Access Address External Address Pin Access Address External Address Pin
Rev.1.01
REJ10J1351-0101
Oct 28, .2008 2-7
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