Renesas M37906T-PRB User Manual

M37906T-PRB
Pod Probe for 7906 Group MCUs
User's Manual
Rev.1.00 September 1, 2003 REJ10J0288-0100Z
• AXS69204201 is a product of Matsushita Electric Works, Ltd.
• Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
• These materials are intended as a reference to assist our customers in the selection of the Renesas Technology product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation, Renesas Solutions Corporation or a third party.
• Renesas Technology Corporation and Renesas Solutions Corporation assume no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
• All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation and Renesas Solutions Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation, Renesas Solutions Corporation or an authorized Renesas Technology product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation and Renesas Solutions Corporation assume no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation and Renesas Solutions Corporation by various means, including the Renesas home page (http://www.renesas.com).
• When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation and Renesas Solutions Corporation assume no responsibility for any damage, liability or other loss resulting from the information contained herein.
• Renesas Technology semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation, Renesas Solutions Corporation or an authorized Renesas Technology product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
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• If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
• Please contact Renesas Technology Corporation or Renesas Solutions Corporation for further details on these materials or the products contained therein.
Notes regarding these materials
• This product is a development supporting unit for use in your program development and evaluation stages. In mass-producing your program you have finished developing, be sure to make a judgment on your own risk that it can be put to practical use by performing integration test, evaluation, or some experiment else.
• In no event shall Renesas Solutions Corporation be liable for any consequence arising from the use of this product.
• Renesas Solutions Corporation strives to renovate or provide a workaround for product malfunction at some charge or without charge. However, this does not necessarily mean that Renesas Solutions Corporation guarantees the renovation or the provision under any circumstances.
• This product has been developed by assuming its use for program development and evaluation in laboratories. Therefore, it does not fall under the application of Electrical Appliance and Material Safety Law and protection against electromagnetic interference when used in Japan.
For inquiries about the contents of this document or product, fill in the text file the installer of the emulator debugger generates in the following directory and email to your local distributor.
\SUPPORT\Product-name\SUPPORT.TXT Renesas Tools Homepage http://www.renesas.com/en/tools
Precautions to be taken when using this product
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Preface

The M37906T-PRB is a pod probe for the 7906 Group of Renesas 16-bit microcomputers. The M37906T-PRB is used by connecting to the PC4701 emulator main unit and the M37900T2-RPD-E emulation pod main unit (option).
This manual mainly explains specifications and how to set up the M37906T-PRB. For detail information about the emulator main unit, emulation pod main unit, and emulator debugger, refer to each user's manual.
Emulator main unit : PC4701 User's Manual Emulation pod main unit : M37900T2-RPD-E User's Manual Emulator debugger : M3T-PD79 User's Manual
To check the components of this product, refer to "2.2 Package Components" (page 17) in this manual. If there is any question or doubt about this product, contact your local distributor.
To use the product properly
Precautions for Safety:
•Both in this User's Manual and on the product itself, several icons are used to insure proper handling of this product and also to prevent injuries to you or other persons, or damage to your properties.
• The icons' graphic images and meanings are given in "Chapter 1 Precautions for Safety". Be sure to read this chapter before using the product.
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Contents

Chapter 1. Precautions for Safety ...........................................................................................7
1.1 Safety Symbols and Meanings ..............................................................................8
Warning for Installation...................................................................................9
Warning for Use Environment.........................................................................9
Caution to Be Taken for Modifying This Product ...........................................9
Cautions to Be Taken for This Product ...........................................................9
Notes on Target System .................................................................................10
Note on Reset Input from the Target System ................................................10
Notes on Stack Area ......................................................................................10
Note on MCU Files........................................................................................10
Notes on EMEM Dialog ................................................................................11
Note on Boot Mode........................................................................................11
Note on Breaks Used with Internal Resources ..............................................11
Note on Debug Monitor Area ........................................................................11
Note on Interface with the Target System .....................................................12
Notes on Service-Life of the MCU's Internal Flash ROM ............................12
Note on Debug Commands during STP/WIT Instruction .............................12
Notes on Disabling Watchdog Function ........................................................12
Note on Real-Time RAM Monitor ................................................................12
Note on Coverage Measurement....................................................................12
Note on Differences between Actual MCU and Emulator ............................13
Chapter 2. Preparation ..........................................................................................................15
2.1 Terminology ........................................................................................................16
2.2 Package Components ..........................................................................................17
2.3 Other Tool Products Required for Development ................................................17
2.4 System Configuration..........................................................................................18
Chapter 3. Setting Up ...........................................................................................................19
3.1 Switch Settings....................................................................................................20
3.2 A-D Conversion Bypass Capacitor .....................................................................21
3.3 Connecting the Emulation Pod Main Unit ..........................................................22
3.4 Connecting the Target System ............................................................................24
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Chapter 4. Specifications......................................................................................................27
4.1 Specifications ......................................................................................................28
4.2 Electrical Characteristics.....................................................................................28
4.3 Connection Diagram ...........................................................................................29
4.4 External Dimensions of Pod Probe .....................................................................30
Chapter 5. Troubleshooting ..................................................................................................31
5.1 When the Emulator Debugger Does Not Operate...............................................32
(1) Errors Occur When Operating the Emulator Debugger
(When the target system is connected)....................................32
(2) Errors Occur When Operating the Emulator Debugger
(When the target system is not connected) .............................33
5.2 Operation Differs from That of Actual MCUs....................................................33
(1) Initializing the Internal Resources of MCU at Power-on.........................33
(2) Oscillator Circuits......................................................................................33
(3) Flash ROM 2KB Expansion Area..............................................................33
(4) When the A-D Conversion Values are Different from Expected Values ....33
(5) When the D-A Conversion Values are Different from Expected Values ....33
Chapter 6. Maintenance and Warranty .................................................................................35
6.1 Maintenance ........................................................................................................36
6.2 Warranty..............................................................................................................36
6.3 Repair Provisions ................................................................................................36
6.4 How to Request for Repair..................................................................................37
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MEMO
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Chapter 1. Precautions for Safety
This chapter describes precautions for using this product safely and properly. For precautions for the emulator main unit, the emulation pod main unit and the emulator debugger, refer to each user's manual included with your product.
1.1 Safety Symbols and Meanings ..................................................................................................... 8
WARNING
CAUTION
IMPORTANT
Warning for Installation...............................................................................................9
Warning for Use Environment.....................................................................................9
Caution to Be Taken for Modifying This Product ....................................................... 9
Cautions to Be Taken for This Product........................................................................9
Notes on Target System ............................................................................................. 10
Note on Reset Input from the Target System.............................................................10
Notes on Stack Area...................................................................................................10
Note on MCU Files....................................................................................................10
Notes on EMEM Dialog ............................................................................................ 11
Note on Boot Mode.................................................................................................... 11
Note on Breaks Used with Internal Resources ..........................................................11
Note on Debug Monitor Area .................................................................................... 11
Note on Interface with the Target System ................................................................. 12
Notes on Service-Life of the MCU's Internal Flash ROM ........................................12
Note on Debug Commands during STP/WIT Instruction..........................................12
Notes on Disabling Watchdog Function .................................................................... 12
Note on Real-Time RAM Monitor ............................................................................12
Note on Coverage Measurement................................................................................ 12
Note on Differences between Actual MCU and Emulator ........................................ 13
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Chapter 1. Precautions for Safety
In both the user's manual and on the product itself, several icons are used to insure proper handling of this product and also to prevent injuries to you or other persons, or damage to your properties.
This chapter describes the precautions which should be taken in order to use this product safely and properly. Be sure to read this chapter before using this product.

1.1 Safety Symbols and Meanings

If the requirements shown in the "WARNING"
WARNING
CAUTION
IMPORTANT
In addition to the three above, the following are also used as appropriate.
sentences are ignored, the equipment may cause serious personal injury or death.
If the requirements shown in the "CAUTION" sentences are ignored, the equipment may malfunction.
It means important information on using this product.
means WARNING or CAUTION.
Example: CAUTION AGAINST AN ELECTRIC SHOCK
means PROHIBITION.
Example: DISASSEMBLY PROHIBITED
means A FORCIBLE ACTION.
Example:
The following pages describe the symbols "WARNING", "CAUTION", and "IMPORTANT".
UNPLUG THE POWER CABLE FROM THE RECEPTACLE.
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WARNING
Warning for Installation:
• Do not set this product in water or areas of high humidity. Spilling water or some other liquid into the main unit can cause an unrepairable damage.
Warning for Use Environment:
• This equipment is to be used in an environment with a maximum ambient temperature of 35°C. Care should be taken that this temperature is not exceeded.
CAUTION
Caution to Be Taken for Modifying This Product:
• Do not disassemble or modify this product. Disassembling or modifying this product can cause damage. Disassembling and modifying the product will void your warranty.
Cautions to Be Taken for This Product:
• Use caution when handling the main unit. Be careful not to apply a mechanical shock.
• Do not touch the connector pins of the emulator main unit and the target MCU connector pins directly. Static electricity may damage the internal circuits.
• Do not pull the pod probe by the flexible cable (FLX120-RPD) for connecting to the emulator main unit or the flexible cable (FLX100) for connecting the target system. The cable may cause a break.
•Flexible cable FLX120-RPD and FLX100 are different from earlier models. The slits make them more flexible. However, excessive flexing or force may break conductors.
•Do not use inch-size screws for this equipment. The screws used in this equipment are all ISO (meter-size) type screws. When replacing screws, use same type screws as equipped before.
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Notes on Target System:
• The Vcc pin of emulator is connected to the target system to observe the voltage of the target system. Therefore the emulator cannot supply the power to the target system. Design your system so that the target system is powered separately.
• The voltage of the target system should be within the range of the MCU specification and suit to the emulator MCUs as shown below:
- For 5.0V version MCUs: +4.5 to +5.5V
•Do not change the voltage of the target system after turning on the power.
• Before powering on your emulator system, check that the host machine, the PC4701, M37900T2­RPD-E, the converter board and target system are all connected correctly. Next, turn on the power to each equipment following the procedure below.
(1) Turn ON/OFF the target system and the PC4701 as simultaneously as possible. (2) When the PC4701 and emulator debugger M3T-PD79 start up, check the target status LEDs
on the emulator main unit's front panel to see if this product is ready to operate.
• Is the power supplied? Check that target status LED (POWER) is ON.
• Is the clock supplied? Check that target status LED (CLOCK) is ON.
IMPORTANT
Note on Reset Input from the Target System:
• The reset input from the target system is accepted only while a user program is being executed (only while the RUN status LED on the PC4701's front panel is lit).
Notes on Stack Area:
• With this product, a maximum 26 bytes of the user stack is consumed as work area.
• If the user stack does not have enough area, do not use areas which cannot be used as stack (SFR area, RAM area which stores data, or ROM area) as work area. Using areas like this is a cause of user program crashes and destabilized emulator control. Therefore, ensure the +26 byte maximum capacity used by the user program as the user stack area.
Note on MCU Files:
• When starting up the emulator debugger M3T-PD79, select the MCU file corresponding to the MCU which is going to be debugged by Init dialog (MCU files are included with the emulator debugger M3T-PD79).
MCU MCU file name
M37906F8 M37906F8.MCU
M37906M4 M37906M4.MCU
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Notes on EMEM Dialog:
• When setting the EMEM dialog box of emulator debugger M3T-PD79, pay attention to the following:
(1) Processor Mode
Specify a processor mode for the target MCU to be debugged. With 7906 Group MCUs, only the single-chip mode is specifiable. If the MD0 pin setting is not "L" level, emulator debugger M3T-PD79 outputs an error message. In such a case, check the pin settings on the target system.
(2) Emem Address
Allocate the 1MB emulation memory that is included in the emulation pod. For the 7906 Group, it is not necessary to set this because this group operates only in the single-chip mode.
(3) ROM Address
Disable the allocated emulation memory against writes by the user program. For the 7906 Group, it is not necessary to set this because this group operates only in the single-chip mode.
(4) DMA Address
In this dialog box, set a transfer area when using the MCU's DMA function, and executing 1­bus transfer between emulation memory and the target system. For the 7906 Group, do not set such areas because this group does not have the DMA function.
IMPORTANT
(5) 8-bit bus mode Address
When accessing external data buses in 8-bit width using the chip select wait controller when BYTE pin = Low, set this address for the relevant area. For the 7906 Group, it is not necessary to set this because this group operates only in the single-chip mode.
(6) Map Address
Set external or internal for the allocated emulation memory area. For the 7906 Group, it is not necessary to set this because this group operates only in the single-chip mode.
Note on Boot Mode:
• It is not possible to debug the MCUs in the boot mode using this emulator system. (The MD1 pin of the MCU is fixed to the "L" level.)
Note on Breaks Used with Internal Resources:
•H/W breaks cannot be used with internal resources (SFR, internal RAM and internal flash ROM) when using emulator PC4701L.
Note on Debug Monitor Area:
• The debug monitor area is fixed to the "FF" bank. It cannot be set to other banks.
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IMPORTANT
Note on Interface with the Target System:
• The pin that connects to the target system is pulled-up by the emulation pod probe using local resistors. For the difference in electric characteristics between the actual MCU and the emulator, see "Chapter 4. Specifications" (page 27).
Pullup resistors of Init4* pin To avoid high impedance, this pin is pulled-up with a 510kresistor. These pullup resistors
cannot be removed.
Notes on Service-Life of the MCU's Internal Flash ROM:
•With emulators of the 7900 Series, programs are downloaded to the MCU's flash ROM when debugging in the single-chip mode and memory expansion mode. Because the number of write/ erase cycles of this ROM is limited, the ROM must be replaced when at the end of its service-life.
• If the following errors occur frequently during program download, replace the MCU board (M37906T-PRBM).
Flash memory erase error ERROR (11508) Flash memory verify error ERROR (11509)
To purchase the MCU board (M37906T-PRBM) for replacement, contact your local distributor.
Note on Debug Commands during STP/WIT Instruction:
• When a debug command (e.g. referencing memory) is issued during execution of STP/WIT instruction, STP/WIT instruction is canceled. And when the debug program has completed, the following instructions are executed.
Note on Disabling Watchdog Function:
•When disabling the watchdog timer during programming, do not open the DUMP window, the memory window and the RAM monitor window in the area which contains the special function select register 2 (address 64h). When displaying address 64h, it is not possible to disable the timer.
Note on Real-Time RAM Monitor:
• Word access from an odd-numbered address cannot be correctly displayed. This restriction of the MCU - emulator interface cannot be avoided. Use the optional function of assembler AS79 to arrange word data to start from an even-numbered address.
Note on Coverage Measurement:
• The trace data output from the MCU is operational code address information only. Make note of the fact that, in coverage measurement, the calculation result is unpredictable because the operand address is not tagged.
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