All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Technology Corp. without notice. Please review the latest information published
by Renesas Technology Corp. through various means, including the Renesas Technology
Corp. website (http://www.renesas.com).
Rev. 2.00
Revision Date: Feb.15, 2007
www.renesas.com
Notes regarding these materials
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes
on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under
General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each
other, the description in the body of the manual takes precedence.
1. Handling of Unused Pins
Handle unused pins in accord with the directions given under Handling of Unused Pins in the
manual.
The input pins of CMOS products are generally in the high-impedance state. In operation
with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the
vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur
due to the false recognition of the pin state as an input signal become possible. Unused
pins should be handled as described under Handling of Unused Pins in the manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
The states of internal circuits in the LSI are indeterminate and the states of register
settings and pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the states
of pins are not guaranteed from the moment when power is supplied until the reset
process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on reset
function are not guaranteed from the moment when power is supplied until the power
reaches the level at which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
The reserved addresses are provided for the possible future expansion of functions. Do
not access these addresses; the correct operation of LSI is not guaranteed if they are
accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has become
stable. When switching the clock signal during program execution, wait until the target clock
signal has stabilized.
When the clock signal is generated with an external resonator (or from an external
oscillator) during a reset, ensure that the reset line is only released after full stabilization of
the clock signal. Moreover, when switching to a clock signal produced with an external
resonator (or by an external oscillator) while program execution is in progress, wait until
the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to one with a different part number, confirm
that the change will not lead to problems.
The characteristics of MPU/MCU in the same group but having different part numbers may
differ because of the differences in internal memory capacity and layout pattern. When
changing to products of different part numbers, implement a system-evaluation test for
each of the products.
How to Use This Manual
1.Purpose and Target Readers
This manual is designed to provide the user with an understanding of the hardware functions and electrical
characteristics of the MCU. It is intended for users designing application systems incorporating the MCU. A basic
knowledge of electric circuits, logical circuits, and MCUs is necessary in order to use this manual.
The manual comprises an overview of the product; descriptions of the CPU, system control functions, peripheral
functions, and electrical characteristics; and usage notes.
Particular attention should be paid to the precautionary notes when using the manual. These notes occur
within the body of the text, at the end of each section, and in the Usage Notes section.
The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer
to the text of the manual for details.
The following documents apply to the M16C/26A Group (M16C/26A, M16C/26B, and M16C/26T). Make sure to
refer to the latest versions of these documents. The newest versions of the documents listed may be obtained from the
Renesas Technology Web site.
memory maps, peripheral function
specifications, electrical characteristics, timing
charts) and operation description
Note: Refer to the application notes for details on
using peripheral functions.
Software manual Description of CPU instruction setM16C/60,
Application noteInformation on using peripheral functions and
application examples
Sample programs
Information on writing programs in assembly
language and C
Renesas
technical update
Product specifications, updates on documents,
etc.
M16C/26A Group
(M16C/26A,
M16C/26B,
M16C/26T)
Hardware Manual
M16C/20,
M16C/Tiny Series
Software Manual
Available from Renesas
Technology Web site.
This hardware
manual
REJ09B0137
2.Notation of Numbers and Symbols
The notation conventions for register names, bit names, numbers, and symbols used in this manual are described
below.
(1)Register Names, Bit Names, and Pin Names
Registers, bits, and pins are referred to in the text by symbols. The symbol is accompanied by the word
“register,” “bit,” or “pin” to distinguish the three categories.
Examples the PM03 bit in the PM0 register
P3_5 pin, VCC pin
(2)Notation of Numbers
The indication “
values of single bits. The indication “
is appended to numeric values given in decimal format.
Examples Binary: 11
2” is appended to numeric values given in binary format. However, nothing is appended to the
16” is appended to numeric values given in hexadecimal format. Nothing
2
Hexadecimal: EFA016
Decimal: 1234
3.Register Notation
The symbols and terms used in register diagrams are described below.
XXX Register
b7 b6 b5 b4 b3 b2 b1 b0
0
XXX0
XXX1
(b2)
(b3)
XXX4
XXX5
XXX6
XXX7
*1
SymbolAddressAfter Reset
XXXXXX00
Bit NameBit Symbol
XXX bits
Nothing is assigned. If necessary, set to 0.
When read, the content is undefined.
Reserved bits
XXX bits
XXX bit
b1 b0
1 0: XXX
0 1: XXX
1 0: Do not set.
1 1: XXX
Set to 0.
Function varies according to the operating
mode.
0: XXX
1: XXX
Function
16
RW
RW
RW
*2
*3
RW
*4
RW
WO
RW
RO
*1
Blank: Set to 0 or 1 according to the application.
0: Set to 0.
1: Set to 1.
X: Nothing is assigned.
*2
RW: Read and write.
RO: Read only.
WO: Write only.
−: Nothing is assigned.
*3
• Reserved bit
Reserved bit. Set to specified value.
*4
• Nothing is assigned
Nothing is assigned to the bit. As the bit may be used for future functions, if necessary, set to 0.
• Do not set to a value
Operation is not guaranteed when a value is set.
• Function varies according to the operating mode.
The function of the bit varies with the peripheral function mode. Refer to the register diagram for information
on the individual modes.
4.List of Abbreviations and Acronyms
AbbreviationFull Form
ACIAAsynchronous Communication Interface Adapter
bpsbits per second
CRCCyclic Redundancy Check
DMADirect Memory Access
DMACDirect Memory Access Controller
GSMGlobal System for Mobile Communications
Hi-ZHigh Impedance
IEBusInter Equipment bus
I/OInput/Output
IrDAInfrared Data Association
LSBLeast Significant Bit
MSBMost Significant Bit
NCNon-Connection
PLLPhase Locked Loop
PWMPulse Width Modulation
SFRSpecial Function Registers
SIMSubscriber Identity Module
UARTUniversal Asynchronous Receiver/Transmitter
VCOVoltage Controlled Oscillator
All trademarks and registered trademarks are the property of their respective owners.
IEBus is a registered trademark of NEC Electronics Corporation.
Table of Contents
Quick Reference by Address_______________________ B-1
The M16C/26A Group (M16C/26A, M16C/26B, M16C/26T) is a single-chip control MCU, fabricated using
high-performance silicon gate CMOS technology, embedding the M16C/60 Series CPU core. The M16C/
26A Group (M16C/26A, M16C/26B, M16C/26T) is housed in 42-pin and 48-pin plastic molded packages.
This MCU combines advanced instruction manipulation capabilities to process complex instructions by less
bytes and execute instructions at higher speed. The M16C/26A Group (M16C/26A, M16C/26B, M16C/
26T) has a multiplier and DMAC adequate for office automation, communication devices and industrial
equipment, and other high-speed processing applications. The M16C/26A and M16C/26B have normal
version. The M16C/26T has T version and V version.
1.1 Applications
Audio, cameras, office/communications/portable/ equipment, air-conditioning equipment, home appliances, etc.
0020-2020B90JER
page 1
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)T62/C61M,B62/C61M,A62/C61M(puorGA62/C61M
1. Overview
1.2 Performance Outline
Table 1.1 and 1.2 outline performance overview of the M16C/26A Group (M16C/26A, M16C/26B, M16C/
Memory capacityROM/RAM: See 1.4 Product Information
PeripheralI/O ports39 I/O pins
FunctionMultifunction timersTimerA:16 bits x 5 channels, TimerB:16 bits x 3 channels
Serial I/O2 channels (UART, clock synchronous serial I/O)
A/D converter10 bit A/D Converter : 1 circuit, 12 channels
DMAC2 channels
CRC calcuration circuit
Watchdog timer15 bits x 1 channel (with prescaler)
Interrupts20 internal and 8 external sources, 4 software sources,
Clock generation circuit4 circuits
Oscillation stop detectionMain clock oscillation stop, re-oscillation detection function
Voltage detection circuitOn-chip (M16C/26A, M16C/26B), not on-chip (M16C/26T)
ElectricalPower supply voltageVCC = 4.2 to 5.5 V (f(BCLK) = 24 MHZ)
CharacteristicsV
Power consumption20 mA (Vcc = 5 V, f(BCLK) = 24 MHz) (M16C/26B)
Flash Memory Programming /erasure2.7 to 5.5 V (M16C/26A, M16C/26B)
Versionvoltage3.0 to 5.5 V (M16C/26T(T-ver.)) 4.2 to 5.5 V (M16C/26T(V-ver.))
Programming /erasure
endurance
Operating Ambient Temperature-20 to 85°C / -40 to 85°C
Package48-pin plastic molded QFP
NOTES:
1. IEBus is a trademark of NEC Electronics Corporation.
2. See Tables 1.7 to 1.10 Product Code for the program and erase endurance, and operating ambient temperature.
3. The PLL frequency synthesizer is used to run the M16C/26B at f(BCLK) = 24 MHz.
41.7 ns (f(BCLK) = 24MHZ
50 ns (f(BCLK) = 20MHZ, VCC = 3.0 to 5.5 V)
100 ns (f(BCLK) = 10MHZ, VCC = 2.7 to 5.5 V)
50 ns (f(BCLK) = 20MHZ, VCC = 4.2 to 5.5 V -40 to 105°C)
62.5 ns (f(BCLK) = 16MHZ, VCC = 4.2 to 5.5 V -40 to 125°C)
Three-phase motor control timer
1 channel
1 circuit (CRC-CCITT and CRC-16) with MSB/LSB selectable
Interrupt priority level: 7
Main clock oscillation circuit(*), Sub-clock oscillation circuit(*)
On-chip oscillator, PLL frequency synthesizer
(*)Equipped with a built-in feedback resister.
CC = 3.0 to 5.5 V (f(BCLK) = 20 MHZ)(M16C/26A, M16C/26B)
VCC = 2.7 to 5.5 V (f(BCLK) = 10 MHZ)
VCC = 3.0 to 5.5 V (M16C/26T(T-ver.))
VCC = 4.2 to 5.5 V (M16C/26T(V-ver.))
(*)Equipped with a built-in feedback resister.
Oscillation stop detectionMain clock oscillation stop, re-oscillation detection function
Voltage detection circuitOn-chip
ElectricalSupply voltageVCC = 4.2 to 5.5 V (f(BCLK) = 24 MHZ)
CharacteristicsV
CC = 3.0 to 5.5 V (f(BCLK) = 20 MHZ)(M16C/26A, M16C/26B)
VCC = 2.7 to 5.5 V (f(BCLK) = 10 MHZ)
Power Consumption20 mA (Vcc = 5 V, f(BCLK) = 24 MHz) (M16C/26B)
16 mA (Vcc = 5 V, f(BCLK) = 20 MHz)
25 µA (f(XCIN) = 32 KHz on RAM)
3 µA (Vcc = 3 V, f(XCIN) = 32 KHz, in wait mode)
0.7 µA (Vcc = 3 V, in stop mode)
Flash memory Programming/erasure2.7 to 5.5 V
voltage
Programming/erasure100 times (all area) or 1,000 times (block 0 to 3)
endurance/ 10,000 times (block A, block B)
Operating Ambient Temperature-20 to 85°C / -40 to 85°C
Package42-pin plastic molded SSOP
NOTES:
1. IEBus is a trademark of NEC Electronics Corporation.
2. See Tables 1.7 and 1.8 Product Code for the program and erase endurance, and operating ambient temperature.
3. The PLL frequency synthesizer is used to run the M16C/26B at f(BCLK) = 24 MHz.
(3)
, VCC = 4.2 to 5.5 V(M16C/26B)
CC
= 3.0 to 5.5 V)(M16C/26A, M16C/26B)
CC
= 2.7 to 5.5 V)(M16C/26A, M16C/26B)
(1)
)
(3)
(2)
(2)
(M16C/26B)
page 3
923fo7002,51.beF00.2.veR
0020-2020B90JER
)T62/C61M,B62/C61M,A62/C61M(puorGA62/C61M
1. Overview
1.3 Block Diagram
Figure 1.1 and 1.2 show block diagrams of the M16C/26A Group (M16C/26A, M16C/26B, M16C/26T) 48-
Table 1.8 Product Code (Mask ROM Version - M16C/26A)
1. Overview
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NOTE:
1. The lead contained products, D3, D5, D7, and D9 are put together with U3, U5, U7, and U9 respectively.
Lead-free products can be mounted by both conventional Sn-Pb paste and Lead-free paste (Sn-Ag-Cu