The ISL8273M is a 80A step-down DC/DC power supply
module with an integrated digital PWM controller, dual-phase
synchronous power switches, inductors and passives. Only
input/output capacitors and minimal passives are needed to
finish the design. 80A of continuous output current can be
delivered without a need of airflow or heatsink. The ISL8273M
uses ChargeMode™
responds to a transient load within a single switching cycle.
The ISL8273MEVAL1Z evaluation board is a 4.7inx 4.8in
8-layer FR4 board with 2oz. copper on all layers. This
evaluation board comes with placeholders for pin-strap
resistor population to adjust output voltage, switching
frequency, soft-start/stop timing and input UVLO threshold,
ASCR gain and residual parameters and device PMBus™
address. More configurations, such as sequencing, Digital-DC™
(DDC) bus configuration and fault limits can be easily
programmed or changed via PMBus compliant serial bus
interface.
The optional ZLUSBEVAL3Z (USB to PMBus adapter) is
provided with this evaluation board, which connects the
evaluation board to a PC to activate the PMBus
communication interface. The PMBus command set is
accessed by using the PowerNavigator™ evaluation software
from a PC running Microsoft Windows. The ISL8273MEVAL1Z
can operate in pin-strap mode without needing the
ZLUSBEVAL3Z adapter or PMBus communication.
control (ASCR) architecture, which
UG036
Rev 0.00
August 7, 2015
Key Features
•VIN range of 4.5V to 14V, V
•Programmable V
limit, OTP/UTP, soft-start/stop, sequencing and
I
OUT
, margining, input and output UVP/OVP,
OUT
external synchronization
, V
• Monitor: V
IN
OUT
, I
OUT
frequency and faults
•ChargeMode™
control tunable with PMBus
• Mechanical switch for enable and power-good LED indicator
adjustable from 0.6V to 2.5V
OUT
, temperature, duty cycle, switching
Specifications
This board has been configured for the following operating
conditions by default:
CONNECT TO ZLUSBEVAL3Z
DONGLE. FOR MULTIPLE
BOARD EVALUATION,
CONNECT TO PMBus DONGLE
OUT CONNECTION OF OTHER
BOARD
INTERCONNECTS DDC
BETWEEN BOARDS
TO DAISY CHAIN PMBus
CONNECTION
PGOOD LED
ENABLE SWITCH
VOUT REGULATION MONITOR
AND SYNC
RESISTOR PLACEHOLDERS
FIGURE 2. TOP SIDE
FIGURE 3. BOTTOM SIDE
UG036 Rev 0.00Page 2 of 17
August 7, 2015
lSL8273MEVAL1Z
Recommended Equipment
• DC power supply with minimum 15V/40A sourcing capacity
• Electronic load capable of sinking current up to 80A
• Digital Multimeters (DMMs)
• Oscilloscope with higher than 100MHz bandwidth
Functional Description
The ISL8273MEVAL1Z provides all circuitry required to evaluate
the features of the ISL8273M. A majority of the features of the
ISL8273M, such as compensation-free ChargeMode™ control,
soft-start delay and ramp times, supply sequencing and voltage
margining are available on this evaluation board. For sequencing
evaluation, the board can be connected to any Intersil digital
module evaluation board that supports the DDC bus.
Figures 2
evaluation board.
and 3 show the board images of the ISL8273MEVAL1Z
Quick Start Guide
Pin-strap Option
ISL8273MEVAL1Z can be configured in pin-strap mode with
standard 1% 0603 resistors. PMBus interface is not required to
evaluate ISL8273M in pin-strap mode. Output voltage (V
switching frequency (f
input undervoltage protection (UVLO) threshold, ASCR gain and
residual, and device PMBus address can be changed by
populating recommended resistors at placeholders provided in
the evaluation board. By default, the evaluation board operates
in pin-strap mode and regulates at V
soft-start/stop delay time = 5ms, soft-start/stop ramp
time = -5ms to 5ms, UVLO = 4.5V, ASCR gain = 200, ASCR
residual = 90 and PMBus address = 28h. Follow these steps to
evaluate the ISL8273M in pin-strap mode.
1. Set ENABLE switch to “DISABLE”.
2. Connect Load to VOUT lug connectors (J7-J8 and J9-J10).
3. Connect power supply to VIN connectors (J5 and J6). Make
sure power supply is not enabled when making connection.
4. Turn power supply on.
5. Set ENABLE switch to “ENABLE”.
6. Measure 1V V
MONITOR” (J11).
7. Observe switching frequency of 364kHz at probe points
labeled “PHASE1” (TP10) and “PHASE2” (TP11).
8. To measure the module efficiency, connect the multimeter
voltage probes at probe points labeled “VIN” (TP1), “GND”
(TP2) and “VOUT” (TP12).
9. To change V
populate a 1% standard 0603 resistor at RVSET placeholder
location on bottom layer. Refer to the “Output Voltage
Resistor Settings” table in the ISL8273M
recommended values. By default, VOUT_MAX is set to 110%
of V
OUT
10. To change switching frequency, disconnect board from the
setup and populate a 1% standard 0603 resistor at the RFSET
OUT,
set by pin-strap resistor.
), soft-start/stop delay and ramp time,
SW
= 1V, fSW = 364kHz,
OUT
at probe point labeled “VOUT REGULATION
OUT
disconnect board from the setup and
datasheet for
OUT
),
placeholder location on bottom layer. Refer to the “Switching
Frequency Resistor Settings” table in the ISL8273M
datasheet for recommended values.
11. To change soft-start/stop delay and ramp time, disconnect
board from the setup and populate a 1% standard 0603
resistor at R6 placeholder location on bottom layer. Refer to
the “Soft Start/Stop Resistor Settings” table in the ISL8273M
datasheet for recommended values.
12. To change UVLO, disconnect board from the setup and
populate a 1% standard 0603 resistor at the R6 placeholder
location on bottom layer. Refer to the “UVLO Resistor Settings”
table in the ISL8273M
Notice that the UVLO programming shares the same pin with
soft-start/stop programming.
13. To change ASCR gain and residual, disconnect board from the
setup and populate a 1% standard 0603 resistor at the R7
placeholder location on bottom layer. Refer to the “ASCR
Resistor Settings” table and the design guide matrix in the
ISL8273M
datasheet for recommended values.
datasheet for recommended values.
PMBus Option
ISL8273MEVAL1Z can be evaluated for all features using the
provided ZLUSBEVAL3Z dongle and PowerNavigator™ evaluation
software. Follow these steps to evaluate theISL8273M with
PMBus option.
1. Install PowerNavigator™ software from the following Intersil
website: www.intersil.com/powernavigator
2. Set ENABLE switch to “DISABLE”.
3. Connect Load to VOUT lug connectors (J7-J8 and J9-J10).
4. Connect power supply to VIN connectors (J5 and J6). Make
sure power supply is not enabled when making connection.
5. Connect the ZLUSBEVAL3Z dongle (USB to PMBus™ adapter)
to the ISL8273MEVAL1Z board using the 6-pin male
connector labeled “PMBus DONGLE IN”.
6. Turn power supply on.
7. Connect supplied USB cable from computer USB to
ZLUSBEVAL3Z dongle.
8. Launch PowerNavigator™ software.
9. It is optional to load a predefined setup from a configuration
file using the PowerNavigator™ software. The ISL8273M
device on the board operates in pin-strap mode from factory
default, but the user may modify the operating parameters
through the evaluation software or by loading a predefined
set-up from a configuration file. A sample “
on page 7 is provided and can be copied to a notepad editor
to make desired changes. The default pin-strap
configurations will be overwritten if a user-defined
configuration file is loaded.
10. Set the ENABLE switch to “ENABLE”. Alternatively, the PMBus
ON_OFF_CONFIG and OPERATION commands may be used
from the PowerNavigator™ software to allow PMBus Enable.
11. Monitor and configure the ISL8273MEVAL1Z board using the
PMBus commands in the evaluation software. To store the
configuration changes, disable the module and use the
command STORE_USER_ALL. To restore factory default
Configuration File”
UG036 Rev 0.00Page 3 of 17
August 7, 2015
lSL8273MEVAL1Z
VOUT
J16
47k
10m
J15
BSC010NE2LSI
TRANSIENT LOAD
PULSE INPUT
TRANSIENT LOAD
MONITOR
settings, disable the module and use the command
RESTORE_FACTORY and STORE_USER_ALL.
12. PowerNavigator™ tutorial videos are available on the Intersil
website. www.intersil.com/powernavigator
13. For sequencing via Digital-DC Bus (DDC) or to evaluate
multiple Intersil digital power products using a single
ZLUSBEVAL3Z dongle, the ISL8273M can be daisy chained
with other digital power evaluation boards. The PMBus
address can be changed by placing a 1% standard 0603
resistor at the R
Refer to the “SMBus Address Resistor Selection” table in the
ISL8273M
placeholder location on the bottom layer.
4
datasheet for recommended values.
Evaluation Board Information
If input voltage is less than 5.3V, tie the VCC test point directly to
VIN or to a separate 5V power supply for best efficiency.
If external synchronization is used, connect the SYNC test point to
the external clock. Note that the external clock signal should be
active before the module is enabled.
V
Transient Response Check
OUT
The ISL8273MEVAL1Z board has a built-in transient load test
circuit (see the schematic in Figure 4). A 100A N-Channel
MOSFET (Manufacturer PN: BSC010NE2LSI) is connected across
VOUT and PGND next to the remote voltage sensing location
(CVSEN). A 10mΩ current-sense resistor R
monitoring the drain-to-source current of the MOSFET. For a
transient load test, inject the gate drive pulse signal at J16. The
load current can be monitored through J15. Because the MOSFET
will operate in the saturation region instead of the linear region
when the gate turn-on signal is applied, the pulse width and duty
cycle of the gate signal must be limited small enough to avoid
MOSFET overheating (recommended duty cycle should be less
than 2%). The amplitude of the gate driver pulse voltage can be
adjusted to obtain a desired transient load current step size.
FIGURE 4. SCHEMATIC FOR TRANSIENT LOAD MEASUREMENT
is used for
54
Thermal Considerations and
Current Derating
Board layout is very critical in order to make the module operate
safely and deliver maximum allowable power. To work in the high
temperature environments and carry large currents, the board
layout needs to be carefully designed to maximize thermal
performance. To achieve this, select enough trace width, copper
weight and the proper connectors.
The ISL8273MEVAL1Z evaluation board is designed for running
80A at room temperature without additional cooling systems
needed. However, if the output voltage is increased or the board
is operated at elevated temperatures, then the available current
is derated. Refer to the derated current curves in the ISL8273M
datasheet to determine the maximum output current the
evaluation board can supply. JA is measured by inserting a
thermocouple inside the module to measure peak junction
temperature.
PCB Layout Guidelines
The ISL8273MEVAL1Z board layout has been optimized for
electrical performance, low loss and good thermal performance.
The key features of the ISL8273MEVAL1Z layout are:
• Large PGND planes and a separate SGND plane. The SGND
plane is connected to PGND on the second layer with a single
point connection. Multiple vias are used for small pins such as
J16, H16, K16, M5, M14, M17 and N5 to connect to inner
SGND or PGND layer.
• Ceramic capacitors between VIN and PGND, VOUT and PGND,
and bypass capacitors between VDD, VDRV and the ground
plane are placed close to the module to minimize high
frequency noise. Some output ceramic capacitors are placed
close to the VOUT pads in the direction of the load current path
to create a low impedance path for the high frequency inductor
ripple current.
• Large copper areas are used for power path (VIN, PGND, VOUT)
to minimize conduction loss and thermal stress. Multiple vias
are used to connect the power planes in different layers.
• Remote sensing traces are connected from the regulation
point to VSENP and VSENN pins. The two traces are placed in
parallel, to achieve tight output voltage regulation. The
regulation point is on the right side of the board in between the
VOUT power lugs and the PGND power lugs.
• Multiple vias are used to connect PAD14 and 16 (SW1 and
SW2) to inner layers for better thermal performance. The inner
layer SW1 and SW2 traces are limited in area and are
surrounded by PGND planes to avoid noise coupling. Caution
was taken that no sensitive traces, such as the remote sensing
traces, were placed close to these noisy planes.
• SWD1 (L3) and SWD2 (P10) pins are connected to SW1 and
SW2 pads respectively with short loop wires of 40mil width.
The wire width should be at least 20mils.
Sample Configuration File for ISL8273M Module. Copy and paste (from RESTORE_FACTORY TO ### End User Store) to a notepad and
save it as Confile_file_name.txt. The # symbol is used for a comment line. Following settings are already loaded to ISL8273M module
as factory defaults.
RESTORE_FACTORY# reset device to the factory setting
STORE_USER_ALL# Clears user memory space
# VOUT Related
VOUT_COMMAND
VOUT_MAX
VOUT_MARGIN_HIGH
VOUT_MARGIN_LOW
VOUT_OV_FAULT_LIMIT
VOUT_OV_FAULT_RESPONSE0x80# Disable and no retry
VOUT_OV_WARN_LIMIT
VOUT_UV_WARN_LIMIT
VOUT_UV_FAULT_LIMIT
VOUT_UV_FAULT_RESPONSE 0x80# Disable and no retry
POWER_GOOD_ON
VOUT_TRANSITION_RATE 0xba00 # 1 mV/us
VOUT_DROOP0x0000 # 0 mV/A
VOUT_CAL_OFFSET0x0000 # 0 mV/A
# IOUT Related
IOUT_CAL_GAIN 0xb370# 0.86 mV/A
IOUT_CAL_OFFSET0x0000# 0 A
IOUT_OC_FAULT_LIMIT
IOUT_UC_FAULT_LIMIT
MFR_IOUT_OC_FAULT_RESPONSE0x80# Disable and no retry
MFR_IOUT_UC_FAULT_RESPONSE 0x80# Disable and no retry
ISENSE_CONFIG
# Other Faults
OT_FAULT_LIMIT0xebe8 # 125 °C
OT_FAULT_RESPONSE 0x80# Disable and no retry
OT_WARN_LIMIT 0xeb70 # 110 °C
UT_WARN_LIMIT0xdc40 # -30 °C
UT_FAULT_LIMIT 0xe530 # -45 °C
UT_FAULT_RESPONSE 0x80# Disable and no retry
VIN_OV_FAULT_LIMIT 0xd380 # 14 V
VIN_OV_FAULT_RESPONSE 0x80# Disable and no retry
VIN_OV_WARN_LIMIT 0xd353 # 13.3 V
VIN_UV_WARN_LIMIT 0xca5d # 4.73 V
VIN_UV_FAULT_LIMIT 0xca40 # 4.5 V
VIN_UV_FAULT_RESPONSE 0x80# Disable and no retry
#Enable, Timing and Sequence Related
ON_OFF_CONFIG0x16# Pin Enable, Soft Off
TON_DELAY 0xca80 # 5 ms
TON_RISE 0xca80 # 5 ms
TOFF_DELAY 0xca80 # 5 ms
TOFF_FALL 0xca80 # 5 ms
POWER_GOOD_DELAY 0xca00 # 4 ms
FREQUENCY_SWITCH
SYNC_CONFIG 0x00# Use Pin-strap for FSW setting
SEQUENCE 0x0000# Sequence Disabled
# Manufacturer Related
MFR_ID Intersil Corp# Example Only
MFR_MODEL # Example Only
MFR_REVISION Rev-1# Example Only
MFR_LOCATION Milpitas, CA# Example Only
MFR_DATE 09/05/2014# Example Only
MFR_SERIAL 1234# Example Only
USER_DATA_00Module# Example Only
# Advance Settings
USER_CONFIG 0x80# ASCR on for Start, Open Drain PG
DDC_CONFIG 0x0a01# DDC rail ID = 10, 2-phase
DDC_GROUP 0x00000000# All Broadcast disabled
# Loop Compensation
ASCR_CONFIG # ASCR gain = , Residual =
STORE_USER_ALL# Store all above settings to NVRAM
### End User Store
UG036 Rev 0.00Page 7 of 17
August 7, 2015
lSL8273MEVAL1Z
Layout
FIGURE 6. SILKSCREEN TOP
UG036 Rev 0.00Page 8 of 17
August 7, 2015
FIGURE 7. TOP LAYER COMPONENT SIDE
lSL8273MEVAL1Z
Layout (Continued)
FIGURE 8. LAYER 2
UG036 Rev 0.00Page 9 of 17
August 7, 2015
FIGURE 9. LAYER 3
lSL8273MEVAL1Z
Layout (Continued)
FIGURE 10. LAYER 4
UG036 Rev 0.00Page 10 of 17
August 7, 2015
FIGURE 11. LAYER 5
lSL8273MEVAL1Z
Layout (Continued)
FIGURE 12. LAYER 6
UG036 Rev 0.00Page 11 of 17
August 7, 2015
FIGURE 13. LAYER 7
lSL8273MEVAL1Z
Layout (Continued)
FIGURE 14. BOTTOM LAYER SOLDER SIDE
UG036 Rev 0.00Page 12 of 17
August 7, 2015
FIGURE 15. SILKSCREEN BOTTOM
lSL8273MEVAL1Z
0
10
20
30
40
50
60
70
80
0 1020304050607080
ACTUAL OUTPUT CURRENT (A)
READ_IOUT
300kHz
421kHz
533kHz
889kHz
0
10
20
30
40
50
60
70
80
0 1020304050607080
ACTUAL OUTPUT CURRENT (A)
READ_IOUT
0°C
+25°C
+45°C
+65°C
0
10
20
30
40
50
60
70
80
0 1020304050607080
ACTUAL OUTPUT CURRENT (A)
READ_IOUT
471kHz
571kHz
670kHz
889kHz
0
10
20
30
40
50
60
70
80
0 1020304050607080
ACTUAL OUTPUT CURRENT (A)
READ_IOUT
0°C
+25°C
+45°C
+65°C
65
70
75
80
85
90
95
100
0 1020304050607080
0.8V, 300kHz
1V, 300kHz
1.2V, 300kHz
1.5V, 346kHz
1.8V, 346kHz
2.5V, 530kHz
LOAD CURRENT (A)
EFFICIENCY (%)
80
82
84
86
88
90
92
94
300350400450500550600650700
0.8V
1V
2.5V
1.2V
1.5V
1.8V
EFFICIENCY (%)
FREQUENCY (kHz)
Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board.
FIGURE 16. OUTPUT CURRENT MEASUREMENT ACCURACY AT
V
= 12V, V
IN
SWITCHING FREQUENCIES
= 1V, TA = +25°C FOR VARIOUS
OUT
FIGURE 18. OUTPUT CURRENT MEASUREMENT ACCURACY AT
V
= 12V, V
IN
= 2.5V, TA = +25°C FOR VARIOUS
OUT
SWITCHING FREQUENCIES
FIGURE 17. OUTPUT CURRENT MEASUREMENT ACCURACY AT
V
= 12V, V
IN
AMBIENT TEMPERATURES
= 1V, fSW = 300kHz FOR VARIOUS
OUT
FIGURE 19. OUTPUT CURRENT MEASUREMENT ACCURACY AT
V
= 12V, V
IN
= 2.5V, fSW = 571kHz FOR VARIOUS
OUT
AMBIENT TEMPERATURES
FIGURE 20. EFFICIENCY vs OUTPUT CURRENT AT V
UG036 Rev 0.00Page 13 of 17
August 7, 2015
VARIOUS OUTPUT VOLTAGES
= 12V, FOR
IN
FIGURE 21. EFFICIENCY vs SWITCHING FREQUENCY AT V
I
= 70A FOR VARIOUS OUTPUT VOLTAGES
OUT
IN
= 12V,
lSL8273MEVAL1Z
V
OUT
(50mV/DIV)
I
OUT
(20A/DIV)
50µs/DIV
ASCR GAIN = 140
RESIDUAL = 90
ASCR GAIN = 220
RESIDUAL = 90
V
OUT
(100mV/DIV)
I
OUT
(20A/DIV)
50µs/DIV
ENABLE
V
OUT
(500mV/DIV)
POWER GOOD
5ms/DIV
ENABLE
V
OUT
(500mV/DIV)
POWER GOOD
5ms/DIV
SW1 (10V/DIV)
SW2 (10V/DIV)
V
OUT
(500mV/DIV)
50µs/DIV
I
IN
5A/DIV
SW1 (10V/DIV)
SW2 (10V/DIV)
V
OUT
(500mV/DIV)
50µs/DIV
Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board. (Continued)
FIGURE 22. LOAD TRANSIENT RESPONSE AT VIN = 12V, V
I
= 0A TO 40A (>100A/μs), fSW = 300kHz.
OUT
C
=14x 100μF CERAMIC + 6 x 470μF POSCAP
OUT
FIGURE 24. SOFT-START AT V
TON_RISE = 5ms, POWER_GOOD_DELAY = 3ms
= 12V, V
IN
= 1V, TON_DELAY = 5ms,
OUT
OUT
= 1V,
FIGURE 23. LOAD TRANSIENT RESPONSE AT V
I
= 0A TO 40A (>100A/μs), fSW = 800kHz.
OUT
C
=6x 100μF CERAMIC + 3 x 470μF POSCAP
OUT
FIGURE 25. SOFT-STOP AT V
TOFF_FALL = 5ms
= 12V, V
IN
= 1V, TOFF_DELAY = 5ms,
OUT
= 12V, V
IN
OUT
= 2.5V,
FIGURE 26. OUTPUT SHORT-CIRCUIT PROTECTION AT V
UG036 Rev 0.00Page 14 of 17
V
= 1V, fSW = 421kHz
OUT
August 7, 2015
= 12V,
IN
FIGURE 27. OUTPUT OVERVOLTAGE PROTECTION AT VIN = 12V,
V
= 1V, f
OUT
VOUT_OV_FAULT_LIMIT = 1.15V
= 421kHz,
SW
lSL8273MEVAL1Z
SW1 (10V/DIV)
SW2 (10V/DIV)
V
OUT
(1V/DIV)
50ms/DIV
I
IN
(5A/DIV)
SW1 (10V/DIV)
SW2 (10V/DIV)
V
OUT
(1V/DIV)
I
IN
(5A/DIV)
50ms/DIV
5ms/DIV
VOUT_3 (1V/DIV)
VOUT_2 (1V/DIV)
VOUT_1 (1V/DIV)
ENABLE
MODULE #1:V
OUT
= 1V
MODULE #2:V
OUT
= 1.5V
MODULE #3:V
OUT
= 2.5V
5ms/DIV
VOUT_3 (1V/DIV)
VOUT_2 (1V/DIV)
VOUT_1 (1V/DIV)
ENABLE
MODULE #1:V
OUT
= 1V
MODULE #2:V
OUT
= 1.5V
MODULE #3:V
OUT
= 2.5V
V
OUT
(200mV/DIV)
5ms/DIV
10V/DIV
10V/DIV
10V/DIV
10V/DIV
SW1 OF MODULE #1
SW2 OF MODULE #1
SW1 OF MODULE #2
SW2 OF MODULE #2
1µs/DIV
Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board. (Continued)
FIGURE 28. OUTPUT SHORT-CIRCUIT PROTECTION WITH
CONTINUOUS RETRY ENABLED (HICCUP MODE),
V
= 12V, V
IN
OUT
= 1V
FIGURE 30. SOFT-START WITH OUTPUT SEQUENCING AT V
THREE ISL8273MEVAL1Z BOARDS ARE CONNECTED IN
DAISY CHAIN
= 12V,
IN
FIGURE 29. OUTPUT SHORT-CIRCUIT RECOVERY FROM CONTINUOUS
RETRY (HICCUP MODE). V
FIGURE 31. SOFT-STOP WITH OUTPUT SEQUENCING AT V
THREE ISL8273MEVAL1Z BOARDS ARE CONNECTED IN
= 12V, V
IN
OUT
= 1V
= 12V,
IN
DAISY CHAIN
FIGURE 32. DYNAMIC VOLTAGE SCALING WITH V
CHANGE FROM 1V TO 1.1V, V
VOUT_TRANSITION_RATE = 1mV/µs
UG036 Rev 0.00Page 15 of 17
August 7, 2015
IN
OUT
= 12V,
FIGURE 33. PHASE SPREADING/INTERLEAVING, TWO
ISL8273MEVAL1Z BOARDS ARE CONNECTED IN DAISY
CHAIN, MODULE #1 RAIL POSITION: 0; MODULE #2
RAIL POSITION:4. V
VOUT_2 = 1.2V, f
= 12V, VOUT_1 = 1.8V,
IN
= 421kHz
SW
lSL8273MEVAL1Z
Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board. (Continued)
FIGURE 34. THERMAL IMAGE AT VIN = 12V, V
f
= 300kHz, TA = +25°C, NO AIRFLOW
SW
OUT
= 1V, I
OUT
= 80A,
FIGURE 35. THERMAL IMAGE AT V
f
= 350kHz, TA = +25°C, NO AIRFLOW
SW
= 12V, V
IN
OUT
= 1.8V, I
OUT
= 80A,
UG036 Rev 0.00Page 16 of 17
August 7, 2015
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you or third parties arising from the use of these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
you or third parties arising from such alteration, modification, copying or reverse engineering.
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
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