Renesas Linux Interface User manual
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
Linux Interface
Specification
Yocto recipe Start-Up Guide
User’s Manual: Software
Rev.1.07 Feb. 26, 2021
RZ/G2 group
User
’s Manual
www.renesas.com
Corporate Headquarters
Contact information
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
For further information on a product, technology, the most up-to-date
version of a document, or your nearest sales office, please visit:
www.renesas.com/contact/.
Trademarks
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered trademarks
are the property of their respective owners.
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your
product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of
these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or
other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this
document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any
and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for
each Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to
human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system;
undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims
any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is
inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by
Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such
specified ranges.
7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific
characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products
are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury,
injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety
design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are
responsible for evaluating the safety of the final products or systems manufactured by you.
8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these
applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance
with applicable laws and regulations.
9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations
promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or
transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled
(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
subsidiaries.
electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
financial terminal systems; safety control equipment; etc.
(Rev.4.0-1 November 2017)
© 2020 Renesas Electronics Corporation. All rights reserved.
General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be
touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level
at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.
5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced
with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.)
and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level
is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).
7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct operation of the LSI is not guaranteed.
8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of
internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.
Particular attention should be paid to the precautionary notes when using the manual. These notes occur within
the body of the text, at the end of each section, and in the Usage Notes section.
The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the
text of the manual for details.
Document
Type
Description
Document Title
Document No.
Verified Linux
Package user’s
manual
Describes all basic steps to use Yocto build
environment with Verified Linux Package
RZ/G Verified Linux
Package for 64bit kernel
Version 1.0.7 Release
Note
R01TU0277EJ0107
Application
note
Describes the procedure to develop application
software with GStreamer and Qt
RZ/G2 Group Application
Note
R01US0429EJ0101
Describes build steps using Yocto build
environment without Verified Linux Package
Linux Interface
Specification Yocto recipe
Start-Up Guide
R01US0398EJ0107
Hardware
user’s manual
Describes common specifications.
RZ/G Series, 2nd
Generation User's
Manual: Hardware
R01UH0808EJ0100
How to Use This Manual
1. Purpose and Target Readers
This document is designed to provide the user with an understanding of the software development environment for
RZ/G2 Group processors. It is intended for users developing software incorporating the processors. A basic knowledge
of software development and Linux systems is necessary in order to use this document.
The following documents apply to the RZ/G2 Group. Make sure to refer to the latest versions of these documents.
The newest versions of the documents listed may be obtained from the Renesas Electronics Web site.
Abbreviation
Description
AHCl
Advanced Host Controller Interface
ALSA
Advanced Linux Sound Architecture
ATA
Advanced Technology Attachment
BSP
Board Support Package
CPRM
Content Protection for Recordable Media
DMA
Direct Memory Access
DMAC
DMA Controller
DRM
Direct Rendering Manager
DU
Display Unit on RZ/G
EHCI
Enhanced Host Controller Interface
eMMC
Embedded Multi Media Card
FB
Framebuffer
GLSL
OpenGL Shading Language
GPIO
General Purpose Input/Output interface
GPL
GNU General Public License
gPTP
Generalized Precision Time Protocol
GUI
Graphical User Interface
HSCIF
High Speed Serial Communications Interface with FIFO
I2C
Inter-Integrated Circuit
LGPL
GNU Lesser General Public License
MMC
Multi Media Card
MMCIF
Multi Media Card Interface H/W module
MMP
Multi Media Package
MSIOF
Clock-Synchronized Serial Interface with FIFO
MTD
Memory Technology Device
NCQ
Native Command Queuing
OHCI
Open Host Controller Interface
OSS
Open Source Software
2. List of Abbreviations and Acronyms
PCI
Peripheral Component Interconnect
PCIe
PCI Express
PCIEC
PCIe host controller
PCM
Pulse Code Modulation
PTP
Precision Time Protocol
QSPI
Quad Serial Peripheral Interface
SATA
Serial Advanced Technology Attachment
SCIF
Serial Communications Interface with FIFO
SD
Secure Digital
SDIO
Secure Digital Input/Output
SPI
Serial Peripheral Interface
SRC
Sampling Rate Converter
SSI
Serial Sound Interface
USB
Universal Serial Bus
V4L2
Video for Linux2
VLP
Verified Linux Package
VSPD
VSP for DU
xHCI
Extensible Host Controller Interface
3. Conventions
Command line run on Linux host PC will be shown as below:
$ echo "This is command line run on x86-64 Linux PC"
Command line run on target board will be shown as below:
# echo "This is command line run on ARM board"
File content will be shown as below:
<$WORK/a script>
#!/bin/bash
echo "This is content in a file"
Table of Contents
Introduction ............................................................................................................................................ 1
1. RZ/G2 Linux BSP package files ........................................................................................................ 2
1.1 Reference (RZ/G2) .................................................................................................................................................... 2
1.2 Environmental Requirement ..................................................................................................................................... 3
2. Building Instructions .......................................................................................................................... 5
Step 1 installation of required commands ................................................................................................................ 5
Step 2 download of required files ................................................................................................................................ 5
Step 3 checkout ................................................................................................................................................................ 6
Step 4 copy proprietary software into recipe directory structure ....................................................................... 6
Step 5 execute source command ................................................................................................................................ 7
Step 6 copy bblayers.conf and local.conf ................................................................................................................. 7
Step 7 enable Multimedia package .............................................................................................................................. 7
Step 8 enable/disable other functions ........................................................................................................................ 9
Step 9 building with bitbake ................................................................................................................................ ........ 10
3. Writing of IPL/Secure ...................................................................................................................... 11
3.1 Writing data ............................................................................................................................................................ 11
3.2 Dip-Switch .............................................................................................................................................................. 11
3.3 Switch setting for EK874 (RZG2E) ........................................................................................................................ 11
3.4 Switch setting for HiHope-RZG2M, HiHope-RZG2N and HiHope-RZG2H ......................................................... 11
3.5 How to write ........................................................................................................................................................... 12
Step 1 connect cable ..................................................................................................................................................... 12
Step 2 setting the terminal software ......................................................................................................................... 12
Step 3 write data file to SPI Flash .............................................................................................................................. 12
3.6 IPL/Secure write ..................................................................................................................................................... 13
4. Confirm starting of U-Boot and Linux ............................................................................................ 14
Step 1 setting Linux Host PC ...................................................................................................................................... 14
Step 2 connect cable ..................................................................................................................................................... 14
Step 3 setting the terminal software ......................................................................................................................... 14
Step 4 write U-Boot to SPI Flash ................................................................................................................................ 14
Step 5 set U-Boot environment variables ................................................................................................ ................ 14
Step 6 change the bootargs by U-Boot .................................................................................................................... 15
Step 7 save environment variables ........................................................................................................................... 15
Step 8 set file system .................................................................................................................................................... 15
Step 9 start Linux ........................................................................................................................................................... 16
5. Exporting Toolchains ....................................................................................................................... 17
Step 1 configure architectures of Host PC which are installed this toolchain .............................................. 17
Step 2 building toolchain package with bitbake .................................................................................................... 18
Step 3 Install toolchain on each Host PCs .............................................................................................................. 18
Step 4 setup environment variables for each compilation on each Host PCs ............................................... 18
6. Memory map .................................................................................................................................... 19
7. U-Boot command ............................................................................................................................. 30
8. System Service ................................................................................................................................. 31
8.1 Watchdog Service ................................................................................................................................................... 31
8.2 Video Input Initializing Service ................................................................................................ .............................. 32
Linux Interface Specification Yocto recipe Start-Up Guide
Introduction
This start-up guide explains RZ/G2 Group Yocto recipe package files, the system environments, the make method of
kernel, the operating of U-Boot and so on.
This product RZ/G2 Yocto recipe is a basic package to operate built-in Linux and basic middleware on the RZ/G2
System Evaluation Board. Please contact Renesas Electronics person who provided this product to you in case of
questions.
Note: Currently, RZ/G2E, RZ/G2M v1.3, RZ/G2M v3.0, RZ/G2N and RZ/G2H, with reference boards EK874 (Revision
C and E), HiHope-RZG2M, HiHope-RZG2N and HiHope-RZG2H are supported.
EK874 Revision E is supported in this release, but it is preliminary and provided AS IS with no warranty. In next release,
EK874 Revision E is going to be supported officially and verified.
R01US0398EJ017 Rev.1.07 Page 1 of 32
Feb. 26, 2021
Linux Interface Specification Yocto recipe Start-Up Guide
Document name
Version
RZ/G2 Series User’s Manual: Hardware
---
RZ/G2 System Evaluation Board Hardware Manual
---
1. RZ/G2 Linux BSP package files
This Yocto recipe will be taken
The U-Boot source code from:
https://github.com/renesas-rz/renesas-u-boot-cip.git, branch=v2018.09/rzg2
RZ/G2 Linux source code from:
https://git.kernel.org/pub/scm/linux/kernel/git/cip/linux-cip.git,branch=linux-4.19.y-cip
https://git.kernel.org/pub/scm/linux/kernel/git/cip/linux-cip.git,branch=linux-4.19.y-cip-rt
1.1 Reference (RZ/G2)
R01US0398EJ017 Rev.1.07 Page 2 of 32
Feb. 26, 2021
Linux Interface Specification Yocto recipe Start-Up Guide
Equipment
Explanation
Linux Host PC
Ubuntu 18.04 LTS (64bit) is recommended as OS. 32bit version is not supported.
It is used as building and debugging environment.
It is used as TFTP server and NFS server.
Windows Host PC
Windows 10 is recommended as OS.
It is used as debugging environment.
Terminal software and VCP driver are executed.
Terminal software
Please use following software.
1) Tera Term
(Confirmed with Japanese version of Tera Term 4.88
Available at http://sourceforge.jp/projects/ttssh2 )
VCP driver
Please install in Windows Host PC.
Execute CP210xVCPInstaller_x86/x64.exe for install before connect. USB become virtual
COM port on terminal software. Please connect to Serial-USB Bridge on RZG2 System
Evaluation Board
(Available at
http://www.silabs.com/products/mcu/Pages/USBtoUARTBridgeVCPDrivers.aspx)
TFTP server software
It is used when SPI Flash is written by U-Boot or Image is downloaded.
NFS server software
It is used when File system is mounted by NFS.
1.2 Environmental Requirement
Host PC and terminal software are necessary for the operation of this product. Furthermore, Ethernet cable is required to
use NFS mount function. Please refer to Table 1.
Table 1 RZ/G2 Linux BSP Environmental Requirement
R01US0398EJ017 Rev.1.07 Page 3 of 32
Feb. 26, 2021
Linux Interface Specification Yocto recipe Start-Up Guide
Hub
[Linux Host PC]
NFS server
Straight Ethernet cable
USB cable (type A
[Windows 10 Host PC]
(ssh to control Linux Host)
(Straight Ethernet cable)
RZ/G2
System Evaluation Board
Recommended Environment
The following shows a Recommended Environment.
to mini/micro AB)
TFTP server
Figure 1. Recommended Environment for RZ/G2 Linux BSP
Note) Functions in covered with () are optional.
Terminal software to display console
R01US0398EJ017 Rev.1.07 Page 4 of 32
Feb. 26, 2021
Linux Interface Specification Yocto recipe Start-Up Guide
$ sudo apt-get install gawk wget git-core diffstat unzip texinfo gcc-multilib \
build-essential chrpath socat libsdl1.2-dev xterm cpio python python3 \
python3-pip python3-pexpect xz-utils debianutils iputils-ping libssl-dev
$ cd ${WORK}
$ git clone git://git.yoctoproject.org/poky
$ git clone git://git.linaro.org/openembedded/meta-linaro.git
$ git clone git://git.openembedded.org/meta-openembedded
$ git clone https://github.com/renesas-rz/meta-rzg2.git
$ git clone http://git.yoctoproject.org/cgit.cgi/meta-gplv2
$ git clone https://github.com/meta-qt5/meta-qt5.git
2. Building Instructions
You can build BSP by using Yocto Project. Please execute following steps in ${WORK} directory on Linux Host PC.
Filesystem by making following instruction is the one for testing current BSP package in Renesas. Please note that
Renesas has not been verified with any other build configuration or modified recipes except “core-image-weston”
configuration which is based on upstream Yocto Project deliverables and some additional packages correspond to
gstreamer.
Note) Renesas executed following instructions with clean ${WORK}/build directory. You may use wipe-sysroot and/or
bitbake -c cleansstate to reflect modifications of configuration files for Recipe as in open source Yocto Project’s
standards, however Renesas strongly recommends to use recipe with clean ${WORK}/build directory for each
configurations because there are some implicit dependency for header files exist to keep compatibility between
application build scheme with/without proprietary software.
Step 1 installation of required commands
Ubuntu is used as Linux Host PC since Yocto Project Quick Start specifies Ubuntu as one of the distribution. In case of
that you can install the required commands as follows.
Please refer to http://www.yoctoproject.org/docs/current/yocto-project-qs/yocto-project-qs.html for detail.
Note) There is a bitbake command in ${WORK}/poky/scripts/. Command path is available after step 6.
Note) When you use terminal interactions to build such as menuconfig under non-X terminal (ssh, etc.), please install
“screen” command package to Host PC.
Note) Please set up user name and e-mail in Git. You can set up with ‘git config --global’. Please refer to online manual
for git command.
Note) In Renesas environment, Ubuntu version is 18.04 LTS and git version is 2.7.4. Step 2 download of required files
Required files (poky, meta-linaro) are downloaded by git clone.
R01US0398EJ017 Rev.1.07 Page 5 of 32
Feb. 26, 2021
Loading...