Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
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these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas T echnology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
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contained therein.
HN29V25611AT-50H
256M AND type Flash Memory
More than 16,057-sector (271,299,072-bit)
ADE-203-1334A (Z)
Rev. 1.0
Apr. 5, 2002
Description
The Hitachi HN29V25611AT-50H Series is a CMOS Flash Memory with AND type multi-level memory
cells. It has fully automatic programming and erase capabilities with a single 3.0 V power supply. The
functions are controlled by simple external commands. To fit the I/O card applications, the unit of
programming and erase is as small as (2048 + 64) bytes. Initial available sectors of HN29V25611AT-50H are
more than 16,057 (98% of all sector address) and less than 16,384 sectors.
Features
• On-board single power supply (VCC): VCC = 2.7 V to 3.6 V
• Organization
AND Flash Memory: (2048 + 64) bytes × (More than 16,057 sectors)
Data register: (2048 + 64) bytes
• Multi-level memory cell
2 bit/per memory cell
• Automatic programming
Sector program time: 1.0 ms (typ)
System bus free
Address, data latch function
Internal automatic program verify function
Status data polling function
• Automatic erase
Single sector erase time: 1.0 ms (typ)
System bus free
Internal automatic erase verify function
Status data polling function
• Fast serial read access time:
First access time: 50 µs (max)
Serial access time: 50 ns (max)
• Low power dissipation:
I
= 2 mA (typ) (Read)
CC1
I
= 20 mA (max) (Read)
CC2
I
= 50 µA (max) (Standby)
SB2
I
I
• The following architecture is required for data reliability.
Error correction: more than 3-bit error correction per each sector read
Spare sectors: 1.8% (290 sectors) (min) within usable sectors
Ordering Information
Type No.Available sectorPackage
HN29V25611AT-50HMore than 16,057 sectors12.0 × 20.00 mm
Note:1. All VCC and VSS pins should be connected to a common power supply and a ground, respectively.
Power supply
Ground
4
Block Diagram
HN29V25611AT-50H
2048 + 64
I/O0
to
I/O7
RDY/Busy
V
CC
V
SS
Sector
address
buffer
• •
•
Multiplexer
•
• •• • •
•
•
•
•
Data
input
buffer
X-decoder
Input
•
data
•
control
Y-address
counter
16384 × (2048 + 64) × 8
memory matrix
Data register (2048 + 64)
•
•
Y-gating
Y-decoder
16057 - 16384
Data
output
buffer
CE
OE
WE
SC
RES
CDE
Control
signal
buffer
Read/Program/Erase control
5
HN29V25611AT-50H
Memory Map and Address
Sector address
3FFFH
3FFEH
3FFDH
0002H
0001H
0000H
000H
2048 bytes
2048 bytes
2048 bytes
2048 bytes
2048 bytes
2048 bytes
64 bytes
64 bytes
64 bytes
64 bytes
64 bytes
64 bytes
800H83FH
1
16057 - 16384 sectors *
Column address
2048 + 64 bytes
Control bytes
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
Address
Sector address
Column address
Notes: 1. Some failed sectors may exist in the device. The failed sectors can be recognized
by reading the sector valid data written in a part of the column address 800 to 83F
(The specific address is TBD.). The sector valid data must be read and kept outside
of the sector before the sector erase. When the sector is programmed, the sector
valid data should be written back to the sector.
2. An × means "Don't care". The pin level can be set to either V
to DC characteristics.
Cycles
SA (1): First cycle
SA (2): Second cycle
CA (1): First cycle
CA (2): Second cycle
I/O0
A0
A8
A0
A8
A1
A9
A1
A9
A2
A10
A2
A10
A3
A11
A3
A11
A5
A4
A13
A12
A5
A4
×
×
or VIH, referred
IL
A6
×*
A6
I/O7
A7
2
×
A7
×
×
6
HN29V25611AT-50H
Pin Function
CE: CE is used to select the device. The status returns to the standby at the rising edge of CE in the reading
operation. However, the status does not return to the standby at the rising edge of CE in the busy state in
programming and erase operation.
OE: Memory data and status register data can be read, when OE is VIL.
WE: Commands and address are latched at the rising edge of WE.
SC: Programming and reading data is latched at the rising edge of SC.
RES: RES pin must be kept at the V
in the memory is protected against unintentional erase and programming. RES must be kept at the V
(VSS ± 0.2 V) level when VCC is turned on and off. In this way, data
ILR
IHR
(V
CC
± 0.2 V) level during any operations such as programming, erase and read.
CDE: Commands and data are latched when CDE is VIL and address is latched when CDE is VIH.
RDY/Busy: The RDY/Busy indicates the program/erase status of the flash memory. The RDY/ Busy signal
is initially at a high impedance state. It turns to a VOL level after the (40H) command in programming
operation or the (B0H) command in erase operation. After the erase or programming operation finishes, the
RDY/Busy signal turns back to the high impedance state.
I/O0 to I/O7: The I/O pins are used to input data, address and command, and are used to output memory data
and status register data.
Mode Selection
ModeCEOEWESCRES CDE RDY/Busy*3I/O0 to I/O7
4
Deep standby×*
StandbyV
Output disableV
Status register read*
Command write*
1
2
×××V
×××V
IH
V
IL
IH
V
V
IL
IL
V
V
IL
IH
V
×V
IH
V
×V
IH
V
V
IL
IL
Notes: 1. Default mode after the power on is the status register read mode (refer to status transition). From
I/O0 to I/O7 pins output the status, when CE = V
condition).
2. Refer to the command definition. Data can be read, programmed and erased after commands are
written in this mode.
3. The RDY/Busy bus should be pulled up to V
to maintain the VOH level while the RDY/Busy pin
CC
outputs a high impedance.
4. An × means “Don’t care”. The pin level can be set to either V
9. The manufacturer identifier code is output when CDE is low and the device identifier code is output
when CDE is high.
10.Before program (2) operations, data in the programmed sector must be erased.
11.No commands can be written during auto program and erase (when the RDY/Busy pin outputs a
V
).
OL
12.The fourth or sixth cycle of the auto program comes after the program data input is complete.
Operation
mode
Data inOperation
mode
5
5
Write40H
first time after the power up.
IHR
Data in
*11, 12
*11, 12
10
HN29V25611AT-50H
Mode Description
Read
Serial Read (1): Memory data D0 to D2111 in the sector of address SA is sequentially read. Output data is
not valid after the number of the SC pulse exceeds 2112. When CA is input, memory data D (m) to D (m + j)
in the sector of address SA is sequentially read. Then output data is not valid after the number of the SC pulse
exceeds (2112 to m). The mode turns back to the standby mode at any time when CE is VIH.
Serial Read (2): Memory data D2048 to D2111 in the sector of address SA is sequentially read. Output data
is not valid after the number of the SC pulse exceeds 64. The mode turns back to the standby mode at any
time when CE is VIH.
Automatic Erase
Single Sector Erase: Memory data D0 to D2111 in the sector of address SA is erased automatically by
internal control circuits. After the sector erase starts, the erasure completion can be checked through the
RDY/Busy signal and status data polling. All the bits in the sector are "1" after the erase. The sector valid
data stored in a part of memory data D2048 to D2111 must be read and kept outside of the sector before the
sector erase.
Automatic Program
Program (1): Program data PD0 to PD2111 is programmed into the sector of address SA automatically by
internal control circuits. When CA is input, program data PD (m) to PD (m + j) is programmed from CA into
the sector of address SA automatically by internal control circuits. By using program (1), data can
additionally be programed 15 times for each sector before the following erase. When the column is
programmed, the data of the column must be [FF]. After the programming starts, the program completion can
be checked through the RDY/Busy signal and status data polling. Programmed bits in the sector turn from
"1" to "0" when they are programmed. The sector valid data should be included in the program data PD2048
to PD2111.
Program (2): Program data PD0 to PD2111 is programmed into the sector of address SA automatically by
internal control circuits. After the programming starts, the program completion can be checked through the
RDY/Busy signal and status data polling. Programmed bits in the sector turn from "1" to "0" when they are
programmed. The sector must be erased before programming. The sector valid data should be included in the
program data PD2048 to PD2111.
Program (3): Program data PD2048 to PD2111 is programmed into the sector of address SA automatically
by internal control circuits. By using program (3), data can additionally be programed 15 times for each
sector befor the following erase. When the column is programmed, the data of the column must be [FF].
After the programming starts, the program completion can be checked through the RDY/Busy signal and
status data polling. Programmed bits in the sector turn from "1" to "0" when they are programmed.
11
HN29V25611AT-50H
Program (4): Program data PD0 to PD2111 is programmed into the sector of address SA automatically by
internal control circuits. When CA is input, program data PD (m) to PD (m + j) is programmed from CA into
the sector of address SA automatically by internal control circuits. By using program (4), data can be
rewritten for each sector before the following erase. So the column data before programming operation are
either "1" or "0". In this mode, E/W number of times must be counted whenever program (4) execute. After
the programming starts, the program completion can be checked through the RDY/Busy signal and status data
polling. The sector valid data should be included in the program data PD2048 to PD2111.
2111
16383
Sector
address
Memory array
0
0
Serial read (2)
Program (3)
2048
Register
2111
16383
Sector
address
Memory array
0
0
Register
Serial read (1) (Without CA)
Program (1) (Without CA)
Program (2)
2111
16383
Sector
address
Memory array
0
0
Column address
Register
Serial read (1) (With CA)
Program (1) (With CA)
Status Register Read
The status returns to the status register read mode from standby mode, when CE and OE is VIL. In the status
register read mode, I/O pins output the same operation status as in the status data polling defined in the
function description.
Identifier Read
The manufacturer and device identifier code can be read in the identifier read mode. The manufacturer and
device identifier code is selected with CDE VIL and VIH, respectively.
12
HN29V25611AT-50H
Data Recovery Read
When the programming was an error, the program data can be read by using data recovery read. When an
additional programming was an error, the data compounded of the program data and the origin data in the
sector address SA can be read. Output data are not valid after the number of SA pulse exeeds 2112. The
mode turns back to the standby mode at any time when CE is VIH. The read data are invalid when addresses
are latched at a rising edge of WE pulse after the data recovery read command is written.
Data Recovery Write
When the programming into a sector of address SA was an error, the program data can be rewritten
automatically by internal control circuit into the other selected sector of address SA’. Since the data recovery
write mode is internally Program (4) mode, rewritten sector of address SA’ needs no sector erase before
rewrite. After the data recovery write mode starts, the program completion can be checked through the
RDY/Busy signal and the status data polling.
13
HN29V25611AT-50H
Command/Address/Data Input Sequence
Serial Read (1) (With CA before SC)
Command
/Address
CDE
WE
SC
00HSA (1)SA (2)CA (1)CA (2)CA (1)'CA (2)'
Low
Serial Read (1) (With CA after SC)
Command
/Address
CDE
00HSA (1)SA (2)CA (1)'CA (2)'CA (1)CA (2)
WE
Low
SC
Data outputData outputData output
Serial Read (1) (Without CA), (2)
Command/Address
CDE
WE
SC
00H/F0HSA (1)SA (2)
Low
Data outputData output
Data output
Single Sector Erase
Command/Address
14
CDE
WE
SC
20HB0HSA (1)SA (2)
Low
Erase start
Program (1), (4) (With CA before SC)
HN29V25611AT-50H
Command
/Address
10H/11HSA (1)SA (2)CA (1)CA (2)CA (1)'CA (2)'40H
CDE
WE
Low
SC
Program (1), (4) (With CA after SC)
Command
/Address
10H/11HSA (1)SA (2)CA (1)CA (2)40H
CDE
WE
Low
SC
Data inputData inputProgram start
Program (1), (4) (Without CA)
Command/Address
CDE
WE
SC
10H/11H40HSA (1)SA (2)
Low
Data inputData inputProgram start
CA (1)'CA (2)'
Data input
Data input
Program start
Program (2)
Command/Address
CDE
WE
SC
1FH40HSA (1)SA (2)
Low
Data input
Program start
15
HN29V25611AT-50H
Program (3)
Command/Address
CDE
WE
SC
Low
ID Read Mode
Command/Address
Data Recovery Read Mode
Command/Address
0FH40HSA (1)SA (2)
90H
CDE
WE
SC
Low
Manufacture
code output
01H
Data input
Device code
output
Program start
Manufacture
code output
Data Recovery Write Mode
Command/Address
CDE
WE
SC
CDE
WE
SC
Low
12H40HSA (1)SA (2)
Low
Data output
Program start
16
Status Transition
HN29V25611AT-50H
Deep
standby
Standby
RES
CE
V
CC
Output
disable
Power off
00H/F0H
FFH
CE
90HCDE, OE
FFH
CE
20H
10H
/11H
FFH
1FH
/0FH
FFH
Status register clear
CE*
FFH*
Read (1) / (2)
setup
ID read setup
Sector
Erase setup
FFH
Program
(1)/(4) setup
Program (2)/(3)
setup
2
2
SA (1), SA (2)OE, SC
SA (1), SA (2)
Erase finish
SA (1),
SA (2)
Program finish
SA (1),
SA (2)
Program finish
50H
Sector address
ID read
address input
Column address
CA(1)
CA(2)
Sector address
input
Sector address
input
CA(1)
CA(2)
input
Sector
input
PD0 to
PD2111
SC, CDE
PD0 to
PD2111*3
SC, CDE
Column address
input
B0H
SC, CDE
PD(m)
to
CA(1)'
PD(m+j)
CA(2)'
Program
data input
Program
data input
40H
40H
OE
CA(1)'
SC
CA(2)'
Read (1) / (2)
Erase
start
Program
start
Program
start
OE
OE
OE
BUSY
Status register
Status register
Status register
Program error or
Erase error
read
read
read
1
01H*
Data recovery
CE
Error
standby
OE
Status register
read
Notes: 1. (01H)/(12H) Data recovery read/write can be used only for Program (1), (2), (3), (4) errors.
2. When reset is done by CE or FFH, error status flag is cleared.
3. When Program (3) mode, input data is PD2048 to PD2111.
Output
disable
12H*
FFH
read setup
1
Data recovery
write setup
OE
SA(1)
SA(2)
Status register
OE, SC
Sector address
read
ERROR
Data recovery
read
40H
input
17
HN29V25611AT-50H
Absolute Maximum Ratings
ParameterSymbolValueUnitNotes
voltageV
V
CC
VSS voltageV
CC
SS
All input and output voltagesVin, Vout–0.6 to +4.6V1, 2
Operating temperature rangeTopr0 to +70˚C
Storage temperature rangeTstg–65 to +125˚C3
Storage temperature under biasTbias–10 to +80˚C
Notes: 1. Relative to VSS.
2. Vin, Vout = –2.0 V for pulse width ≤ 20 ns.
3. Device storage temperature range before programming.
Capacitance (Ta = 25˚C, f = 1 MHz)
ParameterSymbolMinTypMaxUnitTest conditions
Input capacitanceCin——6pFVin = 0 V
Output capacitanceCout——12pFVout = 0 V
–0.6 to +4.6V1
0V
18
HN29V25611AT-50H
DC Characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to +70˚C)
CE to output delayt
OE to output delayt
OE high to output floatt
RES to CE setup timet
CDE setup time for WEt
CDE hold time for WEt
CDE setup time for SCt
CDE hold time for SCt
Next cycle ready timet
CDE to OE hold timet
CDE to output delayt
CDE to output invalidt
CE hold time for OEt
OE setup time for SCt
OE low to output low-Zt
SC to output delayt
SC to output holdt
RDY/Busy setup for SCt
Busy time on read modet
CE
OE
DF
RP
CDS
CDH
CDSS
CDSH
RDY
CDOH
CDAC
CDF
COH
OES
OEL
SAC
SH
RS
RBSY
Note:1. tDF is a time after which the I/O pins become open.
2. The programming operation is not guaranteed when the number of the SC pulse exceeds (2112 – m).(j ≤ 2111 – m, 0 ≤ m ≤ 2111)
3. Any commands, including reset command FFH, cannot be input while RDY/Busy is V
4. The status returns to the standby status after RDY/Busy returns to High-Z.
5. By using program (1), data can be programmed additionally for each sector before erase.
6. This interval can be repeated (h – 1) cycle.(1 ≤ h ≤ 2048 + 64)
*
SP
PD(m+j)*
t
CEHtCE
t
t
OEPS
OE
t
RDY
t
t
WP
t
SW
2
t
DS
2
40H
t
ASP
t
CDH
t
SCHW
t
DH
I/O7=VOLI/O7=V
t
DB
t
DF
3
*
CDS
t
DF
OH
4
Program (1) with CA after SC and Status Data Polling Timing Waveform
6
h cycle*
CE
OE
WE
CDE
SC
I/O0 to I/O7
RES
RDY
/Busy
Notes: 1. The programming operation is not guaranteed when the number of the SC pulse exceeds 2112.(0 ≤ k ≤ 2111)
t
CES
t
CDS
1
*
SP
PD(k)*
t
SW
t
CDSH
1
t
CWC
t
WPH
t
WPtWP
tAHt
t
AStAS
t
CDSS
t
CDH
AHtSDH
t
SDS
PD(m) PD(m+1)
.
OL
t
SCC
t
SPL
tSPt
PD(m+j)*
t
t
CWCtCWC
OEWS
t
WPHtWPH
t
CDStCDS
t
t
WP
t
AHtAHtSDH
t
DH
t
WP
t
CDSS
t
SCC
t
CDH
t
SPL
tSPt
WP
t
SCS
t
CDH
t
DStAStAStSDS
10HSA(1) SA(2) PD0PD1CA(1) CA(2)
t
RP
2. The programming operation is not guaranteed when the number of the SC pulse exceeds (2112 – m).(j ≤ 2111 – m, 0 ≤ m ≤ 2111)
3. Any commands, including reset command FFH, cannot be input while RDY/Busy is V
4. The status returns to the standby status after RDY/Busy returns to High-Z.
5. By using program (1), data can be programmed additionally for each sector before erase.
6. This interval can be repeated h cycle.(1 ≤ h ≤ 2048 + 64)
High-ZHigh-Z*
t
CEHtCE
t
t
OEPS
OE
t
WP
t
SW
2
*
t
SP
DS
2
40H
t
t
CDH
t
SCHW
t
DH
I/O7=VOLI/O7=V
t
DB
ASP
3
*
t
RDY
t
CDS
t
t
DF
DF
OH
4
28
Program (2) and Status Data Polling Timing Waveform
CE
t
OE
WE
CDE
SC
I/O0 to I/O7
RES
RDY
/Busy
CES
t
OEWStCWC
t
CDS
t
SCS
t
RP
t
t
WP
DS
t
WPH
t
CDS
t
CDH
t
DH
t
AStAS
t
CWC
t
WPH
t
t
WP
CDSS
t
WP
t
CDH
SCC
t
SPL
t
t
AH
SDH
t
SDS
t
SPtSP
*
t
t
AH
SA (1) SA (2)
High-ZHigh-Z
t
CEH
t
OEPS
t
t
WP
SW
t
1
t
DS
t
SCHW
t
DH
CDH
40H1FHPD0PD1 PD2111I/O7 = V
t
DB
HN29V25611AT-50H
t
CE
t
t
DF
I/O7 = V
RDY
3
*
OH
t
ASP
t
OE
t
DF
OL
2
*
t
CDS
Notes: 1. The programming operation is not guranteed when the number of the SC pulse exceeds 2112.
2. Any commands, including reset command FFH, cannot be input while RDY/Busy is V
3. The status returns to the standby status after RDY/Busy returns to High-Z.
.
OL
4. By using program (2), the programmed data of each sector must be erased before programming next data.
29
HN29V25611AT-50H
Program (3) and Status Data Polling Timing Waveform
CE
t
OE
WE
CDE
SC
I/O0 to I/O7
RES
RDY
/Busy
CES
t
OEWStCWC
t
CDS
t
SCS
t
RP
t
t
WP
DS
t
WPH
t
CDS
t
CDH
t
t
AStAS
DH
t
CWC
t
t
WP
CDSS
t
WP
t
CDH
SCC
t
SPL
t
t
AH
SDH
t
SDS
t
SPtSP
*
t
t
AH
SA (1) SA (2)
High-ZHigh-Z
t
CEH
t
OEPS
t
t
WP
SW
t
1
t
DS
t
SCHW
t
DH
CDH
40H0FHPD2048 PD2049 PD2111I/O7 = V
t
DB
t
ASP
t
CE
t
DF
I/O7 = V
t
RDY
*
t
CDS
OH
3
t
OE
t
DF
OL
2
*
Notes: 1. The programming operation is not guranteed when the number of the SC pulse exceeds 64.
2. Any commands, including reset command FFH, cannot be input while RDY/Busy is V
3. The status returns to the standby status after RDY/Busy returns to High-Z.
.
OL
4. By using program (3), the data can be programmed additionally for each sector before erase.
30
Program (4) and Status Data Polling Timing Waveform
CE
t
OE
CES
t
OEWStCWC
t
WPH
t
CWC
t
WPH
WE
t
CDSS
t
WP
t
CDH
t
WSD
SCC
t
SPL
t
t
AH
SDH
t
SPtSP
t
SDS
t
t
AH
t
SW
1
*
CDE
SC
I/O0 to I/O7
t
SCS
t
CDS
t
t
WP
DS
t
CDS
t
CDH
t
DH
t
AStAS
t
WP
SA (1) SA (2)
RES
RDY
t
RP
t
DB
t
t
DB
RS
High-ZHigh-Z
/Busy
t
RBSY
Notes: 1. The programming operation is not guranteed when the number of the SC pulse exceeds 2112.
2. Any commands, including reset command FFH, cannot be input while RDY/Busy is V
3. The status returns to the standby status after RDY/Busy returns to High-Z.
4. By using program (4), data can be rewritten for each sector.
t
CEH
t
OEPS
t
WP
t
CDH
t
SCHW
t
t
DS
DH
40H11HPD0PD1PD2111I/O7 = V
t
DB
OL
HN29V25611AT-50H
t
CE
t
t
DF
I/O7 = V
RDY
*
OH
3
.
t
ASP
t
OE
t
DF
OL
2
*
t
CDS
31
HN29V25611AT-50H
Program (4) with CA before SC and Status Data Polling Timing Waveform
6
h–1 cycle*
CE
OE
WE
CDE
SC
I/O0 to I/O7
RES
RDY
/Busy
Notes: 1. The programming operation is not guaranteed when the number of the SC pulse exceeds (2112 – n).(i ≤ 2111 – n, 0 ≤ n ≤ 2111)
t
CES
t
SW
tWPt
t
CDS
t
CDSH
1
*
t
SP
AStAStSDS
1
OL
t
CWC
t
WPH
WP
t
t
CDH
t
AHtAHtSDH
.
CDSS
t
SCC
t
SPL
PD(m) PD(m+1)
tSPt
t
t
CWCtCWCtCWCtCWC
OEWS
t
WPHtWPHtWPHtWPH
t
CDStCDS
t
t
WP
t
SCS
t
t
DStAStAStAStAStSDS
11HSA(1)CA(1) CA(2)CA(1)' CA(2)'PD(n+1)
t
RP
2. The programming operation is not guaranteed when the number of the SC pulse exceeds (2112 – m).(j ≤ 2111 – m, 0 ≤ m ≤ 2111)
3. Any commands, including reset command FFH, cannot be input while RDY/Busy is V
4. The status returns to the standby status after RDY/Busy returns to High-Z.
5. By using program (4), data can be rewritten for each sector.
6. This interval can be repeated (h – 1) cycle.(1 ≤ h ≤ 2048 + 64)
t
WP
WPtWPtWP
CDH
t
AHtAHtAHtAH
t
DH
SA(2)PD(n)
t
DB
WSD
t
RBSY
t
CDSS
t
SCC
t
CDHt
t
SPL
t
SDH
tSPt
PD(n+i)*
t
RS
High-ZHigh-Z*
*
PD(m+j)*
t
CEHtCE
t
t
OEPS
OE
t
RDY
t
t
WP
t
SW
2
t
SP
DS
2
40H
t
ASP
t
CDH
t
SCHW
t
DH
I/O7=VOLI/O7=V
t
DB
t
DF
3
*
CDS
t
DF
OH
4
Program (4) with CA after SC and Status Data Polling Timing Waveform
6
h cycle*
CE
t
CES
OE
t
OEWS
t
CWCtCWC
t
WPHtWPH
WE
t
CDStCDS
t
t
WP
t
AHtAHtSDH
DH
t
WP
t
CDSS
t
CDH
t
SCC
t
WSD
t
SPL
t
SPtSP
CDE
SC
WP
t
SCS
t
CDH
t
DStAStAStSDS
t
I/O0 to I/O7
11HSA(1)PD1CA(1) CA(2)
RES
t
RP
RDY
/Busy
Notes: 1. The programming operation is not guaranteed when the number of the SC pulse exceeds 2112.(0 ≤ k ≤ 2111)
2. The programming operation is not guaranteed when the number of the SC pulse exceeds (2112 – m).(j ≤ 2111 – m, 0 ≤ m ≤ 2111)
3. Any commands, including reset command FFH, cannot be input while RDY/Busy is V
4. The status returns to the standby status after RDY/Busy returns to High-Z.
5. By using program (4), data can be rewritten for each sector.
6. This interval can be repeated h cycle.(1 ≤ h ≤ 2048 + 64)
SA(2) PD0
t
RBSY
t
DB
t
RS
High-ZHigh-Z*
t
CDS
1
*
PD(k)*
t
SW
t
CDSH
1
t
CWC
t
WPH
t
WPtWP
tAHt
t
AStAS
t
CDSS
t
CDH
AH
t
SDS
OL
t
SCC
t
SPL
t
SDH
tSPt
PD(m) PD(m+1)
.
PD(m+j)*
t
CEHtCE
t
t
WP
t
SW
2
*
t
t
SP
DS
2
40H
t
DB
t
OEPS
DH
t
CDH
t
SCHW
OE
t
ASP
I/O7=VOLI/O7=V
3
*
t
RDY
t
CDS
t
t
DF
DF
OH
4
32
ID and Status Register Read Timing Waveform
HN29V25611AT-50H
CE
t
CES
OE
t
OEWS
t
OEPS
WE
t
CDS
t
WP
t
CDH
CDE
t
SCHW
SC
t
SCS
t
DS
t
t
DH
OE
t
CDF
I/O0 to I/O7
90H
Manufacturer
code
RES
t
RP
RDY
/Busy
Note: 1. The status returns to the standby at the rising edge of CE.
t
CDAC
t
CDF
Device
code
t
CDOH
t
CDAC
Manufacturer
code
High-Z
t
COH
t
DF
t
COH
1
*
1
*
t
CE
t
SCS
t
OE
Status
register
t
DF
33
HN29V25611AT-50H
Data Recovery Read Timing Waveform
CE
t
CES
OE
t
OEWS
t
OER
WE
DS
t
WP
t
t
DH
CDH
t
t
OEL
t
OES
SP
t
SCC
t
SCC
t
SPLt
t
SAC
t
SAC
t
SH
CDE
SC
t
SCS
t
CDS
t
I/O0 to I/O7
01HFFH
D0outD1outD2111out
RES
RDY
/Busy
Notes: 1. The status returns to the standby at the rising edge of CE.
2. Output data is not valid after the number of the SC pulse exceed 2112 in the recovery data read mode.
3. After any commands are written, the status can turns to the standby after the command FFH is input
and CE turns to the V
level.
IH
2
*
t
SACtSAC
t
SH
t
SOH
High
High-Z
t
COH
t
CPH
1
*
t
WP
t
CDS
DF
2
*
t
DS
3
*
t
CEH
t
CDH
t
DH
34
Data Recovery Write Timing Waveform
HN29V25611AT-50H
CE
t
CE
OE
t
OEWS
t
CES
t
CWC
t
WPH
t
CWC
t
WPH
t
CWC
t
WPH
t
CEH
t
OEPS
WE
t
CDE
CDS
WP
t
CDS
t
CDH
t
WP
t
WP
t
CDH
t
CDS
tWPt
t
CDH
t
SCHW
SC
t
SCS
t
t
DH
DS
t
AH
t
AS
t
AH
t
AS
t
DH
t
DS
I/O0 to I/O7
12HSA(1)SA(2)
40H
High
RES
t
High-Z
DB
RDY
/Busy
Notes: 1. Any commands,including reset command FFH, cannot be input while RDY/Busy is VOL.
2. The status returns to the standby status after RDY/Busy returns to High-Z.
t
OE
t
ASP
IO7 = V
1
*
t
RDY
t
CDS
t
DF
OL
IO7 = V
OH
t
DF
2
*
High-Z
35
HN29V25611AT-50H
Clear Status Register Timing Waveform
CE
t
CES
t
1
*
CPH
t
CES
OE
t
OEWS
t
WPH
t
CEH
WE
t
t
CDH
WP
CDE
t
CDS
SC
t
SCS
t
t
DS
DH
I/O0 to I/O7
50H
RES
RDY
High
High-Z
/Busy
Note 1. The status returns to the standby at the rising edge of CE.
t
CDS
t
CDH
t
WP
t
t
DS
DH
Next
Command
t
SCS
t
OEWS
t
CDS
t
CDH
t
WP
tDH
tDS
Next
Command
36
HN29V25611AT-50H
Function Description
Status Register: The HN29V25611AT-50H outputs the operation status data as follows: I/O7 pin outputs a
VOL to indicate that the memory is in either erase or program operation. The level of I/O7 pin turns to a V
when the operation finishes. I/O5 and I/O4 pins output VOLs to indicate that the erase and program operations
complete in a finite time, respectively. If these pins output VOHs, it indicates that these operations have timed
out. If I/O6 pin outputs VOH, it indicates a possibility that can be corrected by ECC, choose data correction by
ECC or not by reading out the data. When these pins monitor, I/O7 pin must turn to a VOH. To execute other
erase and program operation, the status data must be cleared after a time out occurs. From I/O0 to I/O3 pins
are reserved for future use. The pins output VOLs and should be masked out during the status data read mode.
The function of the status register is summarized in the following table.
I/OFlag definitionDefinition
I/O7Ready/BusyV
I/O6Program/Erase ECC
check
I/O5Erase checkVOH = Fail, VOL = Pass
I/O4Program checkVOH = Fail, VOL = Pass
I/O3ReservedOutputs a VOL and should be masked out during the status data poling mode.
I/O2Reserved
I/O1Reserved
I/O0Reserved
= Ready, VOL = Busy
OH
When I/O7 outputs VOH, VOH = ECC available, VOL = ECC not available.
OH
ECC Applicability
I/O7I/O6I/O5I/O4System data correction by ECC
V
OH
V
OH
V
OH
V
OH
V
OH
V
OL
V
OH
V
OL
V
OH
V
OH
V
OL
V
OL
V
OL
V
OL
V
OH
V
OH
Needed
Not needed. Sector replacement
Needed
Not needed. Sector replacement
This device needs to be corrected failure data by ECC on system or Spare sectors, by reading out again the
failure sector data when program/erase error occures.
Initially, the HN29V25611AT-50H includes unusable sectors. The unusable sectors must be distinguished
from the usable sectors by the system as follows.
1. Check the partial invalid sectors in the devices on the system. The usable sectors were programmed the
following data. Refer to the flowchart “Indication of unusable sectors”.
Initial Data of Usable Sectors
Column address 0H to 81FH820H821H822H823H824H825H826H to 83FH
DataFFH1CH71HC7H1CH71HC7HFFH
2. Do not erase and program to the partial invalid sectors by the system.
START
Sector number = 0
Sector number =
Sector number + 1
Read data
No
Bad sector*
Notes: 1. Refer to table "Initial data of usable sectors".
2
No
2. Bad sectors are installed in system.
Check data*
Yes
Sector number = 16,383
Yes
1
END
The Unusable Sector Indication Flow
Column address = 820H to 825H
39
HN29V25611AT-50H
Requirements for High System Reliability
The device may fail during a program, erase or read operation due to write or erase cycles. The following
architecture will enable high system reliability if a failure occurs.
1. For an error in read operation: An ECC (Error Correction Code) or a similar function which can correct
3-bits per each sectors is required for data reliability. When error occurs, data must not be corrected by
replacing to spare sector.
2. For errors in program or erase operations: The device may fail during a program or erase operation due to
write or erase cycles. The status register indicates if the erase and program operation complete in a finite
time. When an error occured in the sector, try to reprogram the data into another sector. Avoid further
system access to the sector that error happens. Typically, recommended number of a spare sectors are
1.8% (290 sectors (min)) of initial usable 16,057 sectors (min) by each device. For the reprogramming, do
not use the data from the failed sectors, because the data from the failed sectors are not fixed. So the
reprogram data must be the data reloaded from the external buffer, or use the Data recovery read mode or
the Data recovery write mode (see the “Mode Description” and under figure “Spare Sector Replacement
Flow after Program Error”). To avoid consecutive sector failures, choose addresses of spare sectors as far
as possible from the failed sectors. In this case, 105 cycles of program/erase endurance is guaranteed.
3. Prolongation of flash memory life: Due to the life of the memory prolongation, to do ware leveling at
about 5000 each. The write/erase endurance is 3 × 105 cycles under the condition of the 3-bit error
correction and of ware leveling at 5000 each.
40
START
HN29V25611AT-50H
Program start
Program end
Check status
Yes
Set an usable sector
Check RDY/Busy
No
Clear status register
Load data from
external buffer
Data recovery readData recovery write
Program start
Program end
Check status
Yes
Set another
usable sector
Check RDY/Busy
No
END
Check status: Status register read
Spare Sector Replacement Flow after Program Error
41
HN29V25611AT-50H
For Errors in program or erase operations
The device may fail during a program or erase operation. Failure mode can be confirmed by read out the
status register after complete the erase and program operations. There are two failure modes specified by
each codes:
1: Status register error flag: I/O6 = V
OL
Replace sector under the “Spare Sectors Replacement Flow at Status Register I/O6 Read”. Replacement must
be applied to one sector(2k bytes) which contains failure bits.
2: Status register error flag: I/O6 = V
OH
Escape the program data temporary under the “Replacement Flow at Status Register I/O6 Read”. If failure
data can be corrected by ECC, do not replace to spare sector. If failure data can not be corrected by ECC,
replace to spare sector. Replacement must be applied to one sector(2k bytes) which contains failure bits.
START
Program start
Program end
Check status
Yes
Set an usable sector
Check RDY/Busy
No
Check I/O6
V
OL
Sector Replacement
V
OH
Check status: Status register read
Check I/O6: I/O6 output monitor
Check ECC: Correct by ECC?
Escape program deta*
1
42
Program end
Check statusCheck ECC
YesYes
END
Note: 1. Refer to 'Spare sector replacement flow after program error' to escape the deta.
No
Read error sector
Spare Sectors Replacement Flow at Status Register I/O6 Read
No
Sector Replacement
Program end
Check status
Yes
No
Memory Structure
HN29V25611AT-50H
bit
sector
16,384 sectors
2,112 bytes (16,896 bits)
byte (8 bits)
Bit: Minimum unit of data.
Byte: Input/output data unit in programming and reading. (1 byte = 8 bits)
Sector: Page unit in erase, programming and reading. (1 sector = 2,112 bytes = 16,896 bits)
Device: 1 device = 16,384 sectors.
43
HN29V25611AT-50H
Package Dimensions
HN29V25611AT-50H (TFP-48DA)
12.00
12.40 Max
48
124
0.50
*0.22 ± 0.08
0.20 ± 0.06
1.20 Max
*Dimension including the plating thickness
Base material dimension
0.08
0.45 Max
0.10
25
M
18.40
*0.17 ± 0.05
20.00 ± 0.20
0.125 ± 0.04
0.05 ± 0.05
Hitachi Code
JEDEC
JEITA
Mass
(reference value)
As of January, 2002
Unit: mm
0.80
0˚ – 8˚
0.50 ± 0.10
TFP-48DA
Conforms
Conforms
0.52 g
44
HN29V25611AT-50H
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual
property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of
bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic,
safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for
maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and
other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the
guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or
failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the
equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage
due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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