Renesas H8 Series, H8/36094F, HD64F36094, HD64F36094G, H8/36092F Hardware Manual

...
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry
Electronics Corporation took over all the business of both
Renesas Electronics website: http://www.renesas.com
st
, 2010
April 1 Renesas Electronics Corporation
.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different inform ation to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrig hts, or other intellectual property rights
of third parties by or arising from the use of Renesa s Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, w hether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsi bility for any losses incurred by you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You sho uld not use Renesas Electronics products or the technolog y described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporate d into any products or systems whose manufac ture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable ca re in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesa s Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronic s. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Spec ific” or for which the product is not intended where you have failed t o obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and othe r product characteristics. Renesas Elec tronics shall have no liability for malfunctions or damages arising out of the use of Renesa s Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, se miconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measure s to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
equipment; home electronic applianc es; machine tools; personal electronic equipment; and industrial robots.
crime systems; safety equipment; and medical equipment not specifically designed for life support.
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
User’s Manual
16
H8/36094 Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Tiny Series
H8/36094F HD64F36094 HD64F36094G H8/36092F HD64F36092 HD64F36092G
Rev.1.00 2006.08
Rev. 1.00 Aug. 28, 2006 Page ii of xxviii

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third­party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Rev. 1.00 Aug. 28, 2006 Page iii of xxviii

General Precautions on Handling of Product

1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are used as test pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states, intermediate levels are induced by noise in the vicinity, a pass­through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product's state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is input on the reset pin. During the period where the states are undefined, the register settings and the output state of each pin are also undefined. Design your system so that it does not malfunction because of processing while it is in this undefined state. For those products which have a reset function, reset the LSI immediately after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated to these addresses. Do not access these registers; the system's operation is not guaranteed if they are accessed.
Rev. 1.00 Aug. 28, 2006 Page iv of xxviii

Configuration of This Manual

This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
• CPU and System-Control Modules
• On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section includes notes in relation to the descriptions given, and usage notes are given, as required, as the final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions. This does not include all of the revised contents. For details, see the actual locations in this manual.
11. Index
Rev. 1.00 Aug. 28, 2006 Page v of xxviii

Preface

The H8/36094 Group are single-chip microcomputers made up of the high-speed H8/300H CPU employing Renesas Technology original architecture as their cores, and the peripheral functions required to configure a system. The H8/300H CPU has an instruction set that is compatible with the H8/300 CPU.
Target Users: This manual was written for users who will be using the H8/36094 Group in the
design of application systems. Target users are expected to understand the fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective: This manual was written to explain the hardware functions and electrical
characteristics of the H8/36094 Group to the target users. Refer to the H8/300H Series Software Manual for a detailed description of the instruction set.
Notes on reading this manual:
In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts on the CPU, system control functions, peripheral functions and electrical characteristics.
In order to understand the details of the CPU's functions
Read the H8/300H Series Software Manual.
In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the register. The addresses, bits, and initial values of the registers are summarized in section 19, List of Registers.
Example: Bit order: The MSB is on the left and the LSB is on the right.
Notes:
When using the on-chip emulator (E7, E8) for H8/36094 program development and debugging, the following restrictions must be noted.
1. The NMI pin is reserved for the E7 or E8, and cannot be used.
2. Pins P85, P86, and P87 cannot be used. In order to use these pins, additional hardware must be provided on the user board.
3. Area H'7000 to H'7FFF is used by the E7 or E8, and is not available to the user.
4. Area H'F780 to H'FB7F must on no account be accessed.
Rev. 1.00 Aug. 28, 2006 Page vi of xxviii
5. When the E7 or E8 is used, address breaks can be set as either available to the user or for use by the E7 or E8. If address breaks are set as being used by the E7 or E8, the address break control registers must not be accessed.
6. When the E7 or E8 is used, NMI is an input/output pin (open-drain in output mode), P85 and P87 are input pins, and P86 is an output pin.
Related Manuals: The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require. http://www.renesas.com/
H8/36094 Group manuals:
Document Title Document No.
H8/36094 Group Hardware Manual This manual
H8/300H Series Software Manual REJ09B0213
User's manuals for development tools:
Document Title Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor User's Manual
H8S, H8/300 Series Simulator/Debugger User's Manual REJ10B0211
H8S, H8/300 Series High-Performance Embedded Workshop 3, Tutorial REJ10B0024
H8S, H8/300 Series High-Performance Embedded Workshop 3, User's Manual REJ10B0026
REJ10B0058
Application notes:
Document Title Document No.
H8S, H8/300 Series C/C++ Compiler Package Application Note REJ05B0464
Single Power Supply F-ZTATTM On-Board Programming REJ05B0520
Rev. 1.00 Aug. 28, 2006 Page vii of xxviii
Rev. 1.00 Aug. 28, 2006 Page viii of xxviii

Contents

Section 1 Overview................................................................................................1
1.1 Features.................................................................................................................................. 1
1.2 Internal Block Diagram..........................................................................................................3
1.3 Pin Assignments..................................................................................................................... 4
1.4 Pin Functions .........................................................................................................................6
Section 2 CPU........................................................................................................9
2.1 Address Space and Memory Map ........................................................................................ 10
2.2 Register Configuration......................................................................................................... 11
2.2.1 General Registers.................................................................................................... 12
2.2.2 Program Counter (PC) ............................................................................................ 13
2.2.3 Condition-Code Register (CCR)............................................................................. 13
2.3 Data Formats........................................................................................................................ 15
2.3.1 General Register Data Formats............................................................................... 15
2.3.2 Memory Data Formats ............................................................................................ 17
2.4 Instruction Set ...................................................................................................................... 18
2.4.1 Table of Instructions Classified by Function .......................................................... 18
2.4.2 Basic Instruction Formats ....................................................................................... 27
2.5 Addressing Modes and Effective Address Calculation........................................................ 28
2.5.1 Addressing Modes ..................................................................................................28
2.5.2 Effective Address Calculation ................................................................................ 32
2.6 Basic Bus Cycle ................................................................................................................... 34
2.6.1 Access to On-Chip Memory (RAM, ROM)............................................................ 34
2.6.2 On-Chip Peripheral Modules .................................................................................. 35
2.7 CPU States ........................................................................................................................... 36
2.8 Usage Notes ......................................................................................................................... 37
2.8.1 Notes on Data Access to Empty Areas ................................................................... 37
2.8.2 EEPMOV Instruction.............................................................................................. 37
2.8.3 Bit Manipulation Instruction................................................................................... 37
Section 3 Exception Handling .............................................................................43
3.1 Exception Sources and Vector Address ............................................................................... 43
3.2 Register Descriptions...........................................................................................................45
3.2.1 Interrupt Edge Select Register 1 (IEGR1) ..............................................................45
3.2.2 Interrupt Edge Select Register 2 (IEGR2) ..............................................................46
3.2.3 Interrupt Enable Register 1 (IENR1) ...................................................................... 47
Rev. 1.00 Aug. 28, 2006 Page ix of xxviii
3.2.4 Interrupt Flag Register 1 (IRR1)............................................................................. 48
3.2.5 Wakeup Interrupt Flag Register (IWPR) ................................................................ 49
3.3 Reset Exception Handling.................................................................................................... 51
3.4 Interrupt Exception Handling .............................................................................................. 51
3.4.1 External Interrupts .................................................................................................. 51
3.4.2 Internal Interrupts ................................................................................................... 53
3.4.3 Interrupt Handling Sequence .................................................................................. 53
3.4.4 Interrupt Response Time......................................................................................... 54
3.5 Usage Notes ......................................................................................................................... 56
3.5.1 Interrupts after Reset............................................................................................... 56
3.5.2 Notes on Stack Area Use ........................................................................................ 56
3.5.3 Notes on Rewriting Port Mode Registers ............................................................... 56
Section 4 Address Break .....................................................................................57
4.1 Register Descriptions...........................................................................................................57
4.1.1 Address Break Control Register (ABRKCR) ......................................................... 58
4.1.2 Address Break Status Register (ABRKSR) ............................................................ 59
4.1.3 Break Address Registers (BARH, BARL).............................................................. 60
4.1.4 Break Data Registers (BDRH, BDRL) ................................................................... 60
4.2 Operation ............................................................................................................................. 60
Section 5 Clock Pulse Generators .......................................................................63
5.1 Features................................................................................................................................ 64
5.2 Register Descriptions...........................................................................................................64
5.2.1 RC Control Register (RCCR) ................................................................................. 65
5.2.2 RC Trimming Data Protect Register (RCTRMDPR).............................................. 66
5.2.3 RC Trimming Data Register (RCTRMDR)............................................................ 67
5.2.4 Clock Control/Status Register (CKCSR)................................................................ 68
5.3 System Clock Select Operation ........................................................................................... 70
5.3.1 Clock Control Operation......................................................................................... 71
5.3.2 Clock Switching Timing......................................................................................... 74
5.4 Trimming of On-Chip Oscillator Frequency........................................................................ 77
5.5 External Clock Oscillators ................................................................................................... 79
5.5.1 Connecting Crystal Resonator ................................................................................ 79
5.5.2 Connecting Ceramic Resonator .............................................................................. 80
5.5.3 Inputting External Clock......................................................................................... 80
5.6 Subclock Oscillator.............................................................................................................. 81
5.6.1 Connecting 32.768-kHz Crystal Resonator ............................................................ 81
5.6.2 Pin Connection when Not Using Subclock............................................................. 82
5.7 Prescaler............................................................................................................................... 82
Rev. 1.00 Aug. 28, 2006 Page x of xxviii
5.7.1 Prescaler S .............................................................................................................. 82
5.7.2 Prescaler W............................................................................................................. 82
5.8 Usage Notes ......................................................................................................................... 83
5.8.1 Note on Resonators................................................................................................. 83
5.8.2 Notes on Board Design ........................................................................................... 83
Section 6 Power-Down Modes ............................................................................85
6.1 Register Descriptions...........................................................................................................85
6.1.1 System Control Register 1 (SYSCR1) .................................................................... 85
6.1.2 System Control Register 2 (SYSCR2) .................................................................... 87
6.1.3 Module Standby Control Register 1 (MSTCR1) .................................................... 88
6.2 Mode Transitions and States of LSI..................................................................................... 89
6.2.1 Sleep Mode ............................................................................................................. 92
6.2.2 Standby Mode......................................................................................................... 92
6.2.3 Subsleep Mode........................................................................................................ 93
6.2.4 Subactive Mode ...................................................................................................... 93
6.3 Operating Frequency in Active Mode.................................................................................. 94
6.4 Direct Transition .................................................................................................................. 94
6.4.1 Direct Transition from Active Mode to Subactive Mode ....................................... 94
6.4.2 Direct Transition from Subactive Mode to Active Mode ....................................... 95
6.5 Module Standby Function.................................................................................................... 95
Section 7 ROM ....................................................................................................97
7.1 Block Configuration.............................................................................................................98
7.2 Register Descriptions...........................................................................................................99
7.2.1 Flash Memory Control Register 1 (FLMCR1)........................................................ 99
7.2.2 Flash Memory Control Register 2 (FLMCR2)...................................................... 100
7.2.3 Erase Block Register 1 (EBR1) ............................................................................ 101
7.2.4 Flash Memory Power Control Register (FLPWCR)............................................. 102
7.2.5 Flash Memory Enable Register (FENR)............................................................... 102
7.3 On-Board Programming Modes......................................................................................... 103
7.3.1 Boot Mode ............................................................................................................ 103
7.3.2 Programming/Erasing in User Program Mode...................................................... 106
7.4 Flash Memory Programming/Erasing................................................................................ 107
7.4.1 Program/Program-Verify ...................................................................................... 107
7.4.2 Erase/Erase-Verify................................................................................................ 109
7.4.3 Interrupt Handling when Programming/Erasing Flash Memory........................... 110
7.5 Program/Erase Protection .................................................................................................. 112
7.5.1 Hardware Protection .............................................................................................112
7.5.2 Software Protection............................................................................................... 112
Rev. 1.00 Aug. 28, 2006 Page xi of xxviii
7.5.3 Error Protection .................................................................................................... 112
7.6 Programmer Mode ............................................................................................................. 113
7.7 Power-Down States for Flash Memory.............................................................................. 113
Section 8 RAM ..................................................................................................115
Section 9 I/O Ports.............................................................................................117
9.1 Port 1.................................................................................................................................. 117
9.1.1 Port Mode Register 1 (PMR1) .............................................................................. 118
9.1.2 Port Control Register 1 (PCR1) ............................................................................ 119
9.1.3 Port Data Register 1 (PDR1) ................................................................................ 120
9.1.4 Port Pull-Up Control Register 1 (PUCR1)............................................................ 120
9.1.5 Pin Functions ........................................................................................................ 121
9.2 Port 2.................................................................................................................................. 123
9.2.1 Port Control Register 2 (PCR2) ............................................................................ 123
9.2.2 Port Data Register 2 (PDR2) ................................................................................ 124
9.2.3 Pin Functions ........................................................................................................ 124
9.3 Port 5.................................................................................................................................. 125
9.3.1 Port Mode Register 5 (PMR5) .............................................................................. 126
9.3.2 Port Control Register 5 (PCR5) ............................................................................ 127
9.3.3 Port Data Register 5 (PDR5) ................................................................................ 128
9.3.4 Port Pull-Up Control Register 5 (PUCR5)............................................................ 128
9.3.5 Pin Functions ........................................................................................................ 129
9.4 Port 7.................................................................................................................................. 131
9.4.1 Port Control Register 7 (PCR7) ............................................................................ 132
9.4.2 Port Data Register 7 (PDR7) ................................................................................ 132
9.4.3 Pin Functions ........................................................................................................ 133
9.5 Port 8.................................................................................................................................. 134
9.5.1 Port Control Register 8 (PCR8) ............................................................................ 135
9.5.2 Port Data Register 8 (PDR8) ................................................................................ 135
9.5.3 Pin Functions ........................................................................................................ 136
9.6 Port B................................................................................................................................. 139
9.6.1 Port Data Register B (PDRB) ............................................................................... 139
9.7 Port C................................................................................................................................. 140
9.7.1 Port Control Register C (PCRC)........................................................................... 140
9.7.2 Port Data Register C (PDRC) ............................................................................... 141
9.7.3 Pin Functions ........................................................................................................ 141
Rev. 1.00 Aug. 28, 2006 Page xii of xxviii
Section 10 Timer A............................................................................................143
10.1 Features.............................................................................................................................. 143
10.2 Input/Output Pins...............................................................................................................144
10.3 Register Descriptions......................................................................................................... 145
10.3.1 Timer Mode Register A (TMA)............................................................................ 145
10.3.2 Timer Counter A (TCA) ....................................................................................... 146
10.4 Operation ........................................................................................................................... 147
10.4.1 Interval Timer Operation ...................................................................................... 147
10.4.2 Clock Time Base Operation.................................................................................. 147
10.4.3 Clock Output......................................................................................................... 147
10.5 Usage Note......................................................................................................................... 147
Section 11 Timer V............................................................................................149
11.1 Features.............................................................................................................................. 149
11.2 Input/Output Pins...............................................................................................................151
11.3 Register Descriptions......................................................................................................... 151
11.3.1 Timer Counter V (TCNTV) .................................................................................. 151
11.3.2 Time Constant Registers A and B (TCORA, TCORB) ........................................ 152
11.3.3 Timer Control Register V0 (TCRV0) ...................................................................152
11.3.4 Timer Control/Status Register V (TCSRV) .......................................................... 154
11.3.5 Timer Control Register V1 (TCRV1) ...................................................................155
11.4 Operation ........................................................................................................................... 156
11.4.1 Timer V Operation................................................................................................ 156
11.5 Timer V Application Examples ......................................................................................... 159
11.5.1 Pulse Output with Arbitrary Duty Cycle............................................................... 159
11.5.2 Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input ..............160
11.6 Usage Notes ....................................................................................................................... 161
Section 12 Timer W...........................................................................................163
12.1 Features.............................................................................................................................. 163
12.2 Input/Output Pins...............................................................................................................166
12.3 Register Descriptions......................................................................................................... 166
12.3.1 Timer Mode Register W (TMRW) ....................................................................... 167
12.3.2 Timer Control Register W (TCRW) ..................................................................... 168
12.3.3 Timer Interrupt Enable Register W (TIERW) ...................................................... 169
12.3.4 Timer Status Register W (TSRW) ........................................................................ 170
12.3.5 Timer I/O Control Register 0 (TIOR0) ................................................................. 171
12.3.6 Timer I/O Control Register 1 (TIOR1) ................................................................. 173
12.3.7 Timer Counter (TCNT)......................................................................................... 174
Rev. 1.00 Aug. 28, 2006 Page xiii of xxviii
12.3.8 General Registers A to D (GRA to GRD)............................................................. 175
12.4 Operation ........................................................................................................................... 176
12.4.1 Normal Operation ................................................................................................. 176
12.4.2 PWM Operation .................................................................................................... 181
12.5 Operation Timing............................................................................................................... 186
12.5.1 TCNT Count Timing ............................................................................................ 186
12.5.2 Output Compare Output Timing........................................................................... 186
12.5.3 Input Capture Timing ........................................................................................... 187
12.5.4 Timing of Counter Clearing by Compare Match .................................................. 188
12.5.5 Buffer Operation Timing ...................................................................................... 188
12.5.6 Timing of IMFA to IMFD Flag Setting at Compare Match ................................. 189
12.5.7 Timing of IMFA to IMFD Setting at Input Capture ............................................. 190
12.5.8 Timing of Status Flag Clearing............................................................................. 190
12.6 Usage Notes ....................................................................................................................... 191
Section 13 Watchdog Timer.............................................................................. 195
13.1 Features.............................................................................................................................. 195
13.2 Register Descriptions......................................................................................................... 196
13.2.1 Timer Control/Status Register WD (TCSRWD) .................................................. 196
13.2.2 Timer Counter WD (TCWD)................................................................................ 197
13.2.3 Timer Mode Register WD (TMWD) .................................................................... 198
13.3 Operation ........................................................................................................................... 199
Section 14 Serial Communication Interface 3 (SCI3)....................................... 201
14.1 Features.............................................................................................................................. 201
14.2 Input/Output Pins...............................................................................................................203
14.3 Register Descriptions......................................................................................................... 203
14.3.1 Receive Shift Register (RSR) ............................................................................... 204
14.3.2 Receive Data Register (RDR)............................................................................... 204
14.3.3 Transmit Shift Register (TSR) .............................................................................. 204
14.3.4 Transmit Data Register (TDR).............................................................................. 204
14.3.5 Serial Mode Register (SMR) ................................................................................ 205
14.3.6 Serial Control Register 3 (SCR3) ......................................................................... 206
14.3.7 Serial Status Register (SSR) ................................................................................. 208
14.3.8 Bit Rate Register (BRR) ....................................................................................... 210
14.4 Operation in Asynchronous Mode ..................................................................................... 215
14.4.1 Clock..................................................................................................................... 215
14.4.2 SCI3 Initialization................................................................................................. 216
14.4.3 Data Transmission ................................................................................................ 217
14.4.4 Serial Data Reception ........................................................................................... 219
Rev. 1.00 Aug. 28, 2006 Page xiv of xxviii
14.5 Operation in Clocked Synchronous Mode......................................................................... 223
14.5.1 Clock..................................................................................................................... 223
14.5.2 SCI3 Initialization ................................................................................................. 224
14.5.3 Serial Data Transmission ...................................................................................... 224
14.5.4 Serial Data Reception (Clocked Synchronous Mode)........................................... 227
14.5.5 Simultaneous Serial Data Transmission and Reception........................................ 229
14.6 Multiprocessor Communication Function.......................................................................... 231
14.6.1 Multiprocessor Serial Data Transmission ............................................................. 233
14.6.2 Multiprocessor Serial Data Reception .................................................................. 234
14.7 Interrupts............................................................................................................................ 238
14.8 Usage Notes ....................................................................................................................... 238
14.8.1 Break Detection and Processing ........................................................................... 238
14.8.2 Mark State and Break Sending.............................................................................. 239
14.8.3 Receive Error Flags and Transmit Operations
(Clocked Synchronous Mode Only) ..................................................................... 239
14.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous
Mode..................................................................................................................... 239
Section 15 I2C Bus Interface 2 (IIC2) ................................................................241
15.1 Features.............................................................................................................................. 241
15.2 Input/Output Pins...............................................................................................................243
15.3 Register Descriptions......................................................................................................... 244
15.3.1 I2C Bus Control Register 1 (ICCR1)..................................................................... 244
15.3.2 I2C Bus Control Register 2 (ICCR2)..................................................................... 247
15.3.3 I2C Bus Mode Register (ICMR)............................................................................ 249
15.3.4 I2C Bus Interrupt Enable Register (ICIER)........................................................... 251
15.3.5 I2C Bus Status Register (ICSR)............................................................................. 253
15.3.6 Slave Address Register (SAR).............................................................................. 255
15.3.7 I2C Bus Transmit Data Register (ICDRT)............................................................. 256
15.3.8 I2C Bus Receive Data Register (ICDRR).............................................................. 256
15.3.9 I2C Bus Shift Register (ICDRS)............................................................................ 256
15.4 Operation ........................................................................................................................... 257
15.4.1 I2C Bus Format...................................................................................................... 257
15.4.2 Master Transmit Operation ................................................................................... 258
15.4.3 Master Receive Operation..................................................................................... 260
15.4.4 Slave Transmit Operation ..................................................................................... 262
15.4.5 Slave Receive Operation....................................................................................... 264
15.4.6 Clocked Synchronous Serial Format..................................................................... 266
15.4.7 Noise Canceler ...................................................................................................... 268
15.4.8 Example of Use..................................................................................................... 269
Rev. 1.00 Aug. 28, 2006 Page xv of xxviii
15.5 Interrupt Request................................................................................................................ 273
15.6 Bit Synchronous Circuit..................................................................................................... 273
15.7 Usage Notes ....................................................................................................................... 274
15.7.1 Issue (Retransmission) of Start/Stop Conditions .................................................. 274
15.7.2 WAIT Setting in I2C Bus Mode Register (ICMR)................................................ 274
Section 16 A/D Converter ................................................................................. 275
16.1 Features.............................................................................................................................. 275
16.2 Input/Output Pins...............................................................................................................277
16.3 Register Descriptions......................................................................................................... 278
16.3.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 278
16.3.2 A/D Control/Status Register (ADCSR) ................................................................ 279
16.3.3 A/D Control Register (ADCR) ............................................................................. 281
16.4 Operation ........................................................................................................................... 282
16.4.1 Single Mode.......................................................................................................... 282
16.4.2 Scan Mode ............................................................................................................ 282
16.4.3 Input Sampling and A/D Conversion Time .......................................................... 283
16.4.4 External Trigger Input Timing.............................................................................. 284
16.5 A/D Conversion Accuracy Definitions.............................................................................. 285
16.6 Usage Notes ....................................................................................................................... 287
16.6.1 Permissible Signal Source Impedance .................................................................. 287
16.6.2 Influences on Absolute Accuracy ......................................................................... 287
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection
Circuits ............................................................................................289
17.1 Features.............................................................................................................................. 290
17.2 Register Descriptions......................................................................................................... 292
17.2.1 Low-Voltage-Detection Control Register (LVDCR)............................................ 292
17.2.2 Low-Voltage-Detection Status Register (LVDSR)............................................... 293
17.2.3 Reset Source Decision Register (LVDRF) ........................................................... 294
17.3 Operations.......................................................................................................................... 295
17.3.1 Power-On Reset Circuit ........................................................................................ 295
17.3.2 Low-Voltage Detection Circuit............................................................................. 296
17.3.3 Deciding Reset Source.......................................................................................... 299
Section 18 Power Supply Circuit ......................................................................301
18.1 When Using Internal Power Supply Step-Down Circuit ................................................... 301
18.2 When Not Using Internal Power Supply Step-Down Circuit............................................. 302
Rev. 1.00 Aug. 28, 2006 Page xvi of xxviii
Section 19 List of Registers ...............................................................................303
19.1 Register Addresses (Address Order).................................................................................. 304
19.2 Register Bits....................................................................................................................... 309
19.3 Registers States in Each Operating Mode.......................................................................... 313
Section 20 Electrical Characteristics .................................................................317
20.1 Absolute Maximum Ratings .............................................................................................. 317
20.2 Electrical Characteristics.................................................................................................... 317
20.2.1 Power Supply Voltage and Operating Ranges ...................................................... 317
20.2.2 DC Characteristics ................................................................................................320
20.2.3 AC Characteristics ................................................................................................325
20.2.4 A/D Converter Characteristics .............................................................................. 330
20.2.5 Watchdog Timer Characteristics........................................................................... 331
20.2.6 Flash Memory Characteristics .............................................................................. 332
20.2.7 Power-Supply-Voltage Detection Circuit Characteristics (Optional) ................... 334
20.2.8 Power-On Reset Circuit Characteristics (Optional) .............................................. 334
20.3 Operation Timing............................................................................................................... 335
20.4 Output Load Condition ...................................................................................................... 337
Appendix A Instruction Set ...............................................................................339
A.1 Instruction List................................................................................................................... 339
A.2 Operation Code Map.......................................................................................................... 354
A.3 Number of Execution States .............................................................................................. 357
A.4 Combinations of Instructions and Addressing Modes ....................................................... 368
Appendix B I/O Port Block Diagrams...............................................................369
B.1 I/O Port Block Diagrams.................................................................................................... 369
B.2 Port States in Each Operating State ................................................................................... 388
Appendix C Product Code Lineup.....................................................................389
Appendix D Package Dimensions .....................................................................390
Appendix E Function Comparison ....................................................................396
Index .........................................................................................................397
Rev. 1.00 Aug. 28, 2006 Page xvii of xxviii
Rev. 1.00 Aug. 28, 2006 Page xviii of xxviii

Figures

Section 1 Overview
Figure 1.1 Internal Block Diagram of H8/36094 Group of F-ZTATTM.......................................... 3
Figure 1.2 Pin Assignments of H8/36094 Group of F-ZTATTM (FP-64K, FP-64A)...................... 4
Figure 1.3 Pin Assignments of H8/36094 Group of F-ZTATTM (FP-48F, FP-48B, TNP-48) ........ 5
Section 2 CPU
Figure 2.1 Memory map ...............................................................................................................10
Figure 2.2 CPU Registers .............................................................................................................11
Figure 2.3 Usage of General Registers .........................................................................................12
Figure 2.4 Relationship between Stack Pointer and Stack Area................................................... 13
Figure 2.5 General Register Data Formats (1).............................................................................. 15
Figure 2.5 General Register Data Formats (2).............................................................................. 16
Figure 2.6 Memory Data Formats.................................................................................................17
Figure 2.7 Instruction Formats......................................................................................................28
Figure 2.8 Branch Address Specification in Memory Indirect Mode........................................... 31
Figure 2.9 On-Chip Memory Access Cycle.................................................................................. 34
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access).....................................35
Figure 2.11 CPU Operation States................................................................................................ 36
Figure 2.12 State Transitions........................................................................................................ 37
Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same
Address...................................................................................................................... 38
Section 3 Exception Handling
Figure 3.1 Reset Sequence............................................................................................................ 52
Figure 3.2 Stack Status after Exception Handling........................................................................ 54
Figure 3.3 Interrupt Sequence....................................................................................................... 55
Figure 3.4 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure .............. 56
Section 4 Address Break
Figure 4.1 Block Diagram of Address Break................................................................................57
Figure 4.2 Address Break Interrupt Operation Example (1)......................................................... 61
Figure 4.2 Address Break Interrupt Operation Example (2)......................................................... 61
Section 5 Clock Pulse Generators
Figure 5.1 Block Diagram of Clock Pulse Generators..................................................................63
Figure 5.2 State Transition of System Clock................................................................................ 70
Figure 5.3 Flowchart of Clock Switching with Backup Function Enabled................................... 71
Figure 5.4 Flowchart of Clock Switching with Backup Function Disabled (1)
(From On-Chip Oscillator Clock to External Clock) ................................................72
Rev. 1.00 Aug. 28, 2006 Page xix of xxviii
Figure 5.5 Flowchart of Clock Switching with Backup Function Disabled (2)
(From External Clock to On-Chip Oscillator Clock).................................................. 73
Figure 5.6 Timing Chart of Switching from On-Chip Oscillator Clock to External Clock.......... 74
Figure 5.7 Timing Chart to Switch from External Clock to On-Chip Oscillator Clock ...............75
Figure 5.8 External Oscillation Backup Timing........................................................................... 76
Figure 5.9 Example of Trimming Flow for On-Chip Oscillator Clock ........................................77
Figure 5.10 Timing Chart of Trimming of On-Chip Oscillator Frequency .................................. 78
Figure 5.11 Example of Connection to Crystal Resonator ........................................................... 79
Figure 5.12 Equivalent Circuit of Crystal Resonator....................................................................79
Figure 5.13 Example of Connection to Ceramic Resonator ......................................................... 80
Figure 5.14 Example of External Clock Input.............................................................................. 80
Figure 5.15 Block Diagram of Subclock Oscillator...................................................................... 81
Figure 5.16 Typical Connection to 32.768-kHz Crystal Resonator.............................................. 81
Figure 5.17 Equivalent Circuit of 32.768-kHz Crystal Resonator................................................ 81
Figure 5.18 Pin Connection when not Using Subclock ................................................................ 82
Figure 5.19 Example of Incorrect Board Design.......................................................................... 83
Section 6 Power-Down Modes
Figure 6.1 Mode Transition Diagram ........................................................................................... 89
Section 7 ROM
Figure 7.1 Flash Memory Block Configuration............................................................................98
Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode.......................... 106
Figure 7.3 Program/Program-Verify Flowchart ......................................................................... 108
Figure 7.4 Erase/Erase-Verify Flowchart ................................................................................... 111
Section 9 I/O Ports
Figure 9.1 Port 1 Pin Configuration............................................................................................ 117
Figure 9.2 Port 2 Pin Configuration............................................................................................ 123
Figure 9.3 Port 5 Pin Configuration............................................................................................ 125
Figure 9.4 Port 7 Pin Configuration............................................................................................ 131
Figure 9.5 Port 8 Pin Configuration............................................................................................ 134
Figure 9.6 Port B Pin Configuration...........................................................................................139
Figure 9.7 Port C Pin Configuration...........................................................................................140
Section 10 Timer A
Figure 10.1 Block Diagram of Timer A .....................................................................................144
Section 11 Timer V
Figure 11.1 Block Diagram of Timer V .....................................................................................150
Figure 11.2 Increment Timing with Internal Clock.................................................................... 157
Figure 11.3 Increment Timing with External Clock................................................................... 157
Figure 11.4 OVF Set Timing...................................................................................................... 157
Rev. 1.00 Aug. 28, 2006 Page xx of xxviii
Figure 11.5 CMFA and CMFB Set Timing................................................................................ 158
Figure 11.6 TMOV Output Timing ............................................................................................158
Figure 11.7 Clear Timing by Compare Match............................................................................ 158
Figure 11.8 Clear Timing by TMRIV Input ...............................................................................159
Figure 11.9 Pulse Output Example............................................................................................. 159
Figure 11.10 Example of Pulse Output Synchronized to TRGV Input.......................................160
Figure 11.11 Contention between TCNTV Write and Clear ...................................................... 161
Figure 11.12 Contention between TCORA Write and Compare Match..................................... 162
Figure 11.13 Internal Clock Switching and TCNTV Operation ................................................. 162
Section 12 Timer W
Figure 12.1 Timer W Block Diagram......................................................................................... 165
Figure 12.2 Free-Running Counter Operation............................................................................ 176
Figure 12.3 Periodic Counter Operation..................................................................................... 177
Figure 12.4 0 and 1 Output Example (TOA = 0, TOB = 1)........................................................ 177
Figure 12.5 Toggle Output Example (TOA = 0, TOB = 1) ........................................................178
Figure 12.6 Toggle Output Example (TOA = 0, TOB = 1) ........................................................178
Figure 12.7 Input Capture Operating Example........................................................................... 179
Figure 12.8 Buffer Operation Example (Input Capture)............................................................. 180
Figure 12.9 PWM Mode Example (1) ........................................................................................ 181
Figure 12.10 PWM Mode Example (2) ......................................................................................182
Figure 12.11 Buffer Operation Example (Output Compare) ......................................................183
Figure 12.12 PWM Mode Example
(TOB, TOC, and TOD = 0: initial output values are set to 0)............................... 184
Figure 12.13 PWM Mode Example
(TOB, TOC, and TOD = 1: initial output values are set to 1)............................... 185
Figure 12.14 Count Timing for Internal Clock Source............................................................... 186
Figure 12.15 Count Timing for External Clock Source.............................................................. 186
Figure 12.16 Output Compare Output Timing ...........................................................................187
Figure 12.17 Input Capture Input Signal Timing........................................................................ 187
Figure 12.18 Timing of Counter Clearing by Compare Match................................................... 188
Figure 12.19 Buffer Operation Timing (Compare Match)..........................................................188
Figure 12.20 Buffer Operation Timing (Input Capture) .............................................................189
Figure 12.21 Timing of IMFA to IMFD Flag Setting at Compare Match.................................. 189
Figure 12.22 Timing of IMFA to IMFD Flag Setting at Input Capture...................................... 190
Figure 12.23 Timing of Status Flag Clearing by CPU................................................................190
Figure 12.24 Contention between TCNT Write and Clear .........................................................191
Figure 12.25 Internal Clock Switching and TCNT Operation.................................................... 192
Figure 12.26 When Compare Match and Bit Manipulation Instruction to TCRW Occur at
the Same Timing ................................................................................................... 193
Rev. 1.00 Aug. 28, 2006 Page xxi of xxviii
Section 13 Watchdog Timer
Figure 13.1 Block Diagram of Watchdog Timer........................................................................ 195
Figure 13.2 Watchdog Timer Operation Example...................................................................... 199
Section 14 Serial Communication Interface 3 (SCI3)
Figure 14.1 Block Diagram of SCI3........................................................................................... 202
Figure 14.2 Data Format in Asynchronous Communication...................................................... 215
Figure 14.3 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) ............. 215
Figure 14.4 Sample SCI3 Initialization Flowchart ..................................................................... 216
Figure 14.5 Example SCI3 Operation in Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) ...........................................................................217
Figure 14.6 Sample Serial Transmission Flowchart (Asynchronous Mode) .............................. 218
Figure 14.7 Example SCI3 Operation in Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) ...........................................................................219
Figure 14.8 Sample Serial Data Reception Flowchart (Asynchronous mode) (1)...................... 221
Figure 14.8 Sample Serial Reception Data Flowchart (2) ..........................................................222
Figure 14.9 Data Format in Clocked Synchronous Communication ..........................................223
Figure 14.10 Example of SCI3 Operation in Transmission in Clocked Synchronous Mode......225
Figure 14.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode)................ 226
Figure 14.12 Example of SCI3 Reception Operation in Clocked Synchronous Mode............... 227
Figure 14.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode)......................228
Figure 14.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode) .............................................................................. 230
Figure 14.15 Example of Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A).......................................... 232
Figure 14.16 Sample Multiprocessor Serial Transmission Flowchart........................................ 233
Figure 14.17 Sample Multiprocessor Serial Reception Flowchart (1)........................................ 235
Figure 14.17 Sample Multiprocessor Serial Reception Flowchart (2)........................................ 236
Figure 14.18 Example of SCI3 Operation in Reception Using Multiprocessor Format
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)............................. 237
Figure 14.19 Receive Data Sampling Timing in Asynchronous Mode ...................................... 240
Section 15 I2C Bus Interface 2 (IIC2)
Figure 15.1 Block Diagram of I2C Bus Interface 2..................................................................... 242
Figure 15.2 External Circuit Connections of I/O Pins................................................................ 243
Figure 15.3 I2C Bus Formats ...................................................................................................... 257
Figure 15.4 I2C Bus Timing........................................................................................................ 257
Figure 15.5 Master Transmit Mode Operation Timing (1)......................................................... 259
Figure 15.6 Master Transmit Mode Operation Timing (2)......................................................... 259
Figure 15.7 Master Receive Mode Operation Timing (1) .......................................................... 261
Rev. 1.00 Aug. 28, 2006 Page xxii of xxviii
Figure 15.8 Master Receive Mode Operation Timing (2)........................................................... 262
Figure 15.9 Slave Transmit Mode Operation Timing (1)........................................................... 263
Figure 15.10 Slave Transmit Mode Operation Timing (2) ......................................................... 264
Figure 15.11 Slave Receive Mode Operation Timing (1)........................................................... 265
Figure 15.12 Slave Receive Mode Operation Timing (2)........................................................... 265
Figure 15.13 Clocked Synchronous Serial Transfer Format....................................................... 266
Figure 15.14 Transmit Mode Operation Timing.........................................................................267
Figure 15.15 Receive Mode Operation Timing ..........................................................................268
Figure 15.16 Block Diagram of Noise Conceler.........................................................................268
Figure 15.17 Sample Flowchart for Master Transmit Mode.......................................................269
Figure 15.18 Sample Flowchart for Master Receive Mode ........................................................ 270
Figure 15.19 Sample Flowchart for Slave Transmit Mode......................................................... 271
Figure 15.20 Sample Flowchart for Slave Receive Mode .......................................................... 272
Figure 15.21 The Timing of the Bit Synchronous Circuit .......................................................... 274
Section 16 A/D Converter
Figure 16.1 Block Diagram of A/D Converter ...........................................................................276
Figure 16.2 A/D Conversion Timing.......................................................................................... 283
Figure 16.3 External Trigger Input Timing ................................................................................ 284
Figure 16.4 A/D Conversion Accuracy Definitions (1).............................................................. 286
Figure 16.5 A/D Conversion Accuracy Definitions (2).............................................................. 286
Figure 16.6 Analog Input Circuit Example................................................................................. 287
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
Figure 17.1 Block Diagram around BGR ................................................................................... 290
Figure 17.2 Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit....291
Figure 17.3 Operational Timing of Power-On Reset Circuit...................................................... 296
Figure 17.4 Operating Timing of LVDR Circuit........................................................................ 297
Figure 17.5 Operational Timing of LVDI Circuit.......................................................................298
Figure 17.6 Timing of Setting Bits in Reset Source Decision Register...................................... 299
Section 18 Power Supply Circuit
Figure 18.1 Power Supply Connection when Internal Step-Down Circuit is Used ....................301
Figure 18.2 Power Supply Connection when Internal Step-Down Circuit is Not Used .............302
Section 20 Electrical Characteristics
Figure 20.1 System Clock Input Timing.....................................................................................335
Figure 20.2 RES Low Width Timing.......................................................................................... 335
Figure 20.3 Input Timing............................................................................................................ 335
Figure 20.4 I2C Bus Interface Input/Output Timing................................................................... 336
Figure 20.5 SCK3 Input Clock Timing.......................................................................................336
Figure 20.6 SCI Input/Output Timing in Clocked Synchronous Mode ...................................... 337
Rev. 1.00 Aug. 28, 2006 Page xxiii of xxviii
Figure 20.7 Output Load Circuit ................................................................................................ 337
Appendix
Figure B.1 Port 1 Block Diagram (P17) .....................................................................................369
Figure B.2 Port 1 Block Diagram (P16 to P14).......................................................................... 370
Figure B.3 Port 1 Block Diagram (P12, P11)............................................................................. 371
Figure B.4 Port 1 Block Diagram (P10) .....................................................................................372
Figure B.5 Port 2 Block Diagram (P22) .....................................................................................373
Figure B.6 Port 2 Block Diagram (P21) .....................................................................................374
Figure B.7 Port 2 Block Diagram (P20) .....................................................................................375
Figure B.8 Port 5 Block Diagram (P57, P56)............................................................................. 376
Figure B.9 Port 5 Block Diagram (P55) .....................................................................................377
Figure B.10 Port 5 Block Diagram (P54 to P50)........................................................................ 378
Figure B.11 Port 7 Block Diagram (P76) ................................................................................... 379
Figure B.12 Port 7 Block Diagram (P75) ................................................................................... 380
Figure B.13 Port 7 Block Diagram (P74) ................................................................................... 381
Figure B.14 Port 8 Block Diagram (P87 to P85)........................................................................ 382
Figure B.15 Port 8 Block Diagram (P84 to P81)........................................................................ 383
Figure B.16 Port 8 Block Diagram (P80) ................................................................................... 384
Figure B.17 Port B Block Diagram (PB7 to PB0)...................................................................... 385
Figure B.18 Port C Block Diagram (PC1).................................................................................. 386
Figure B.19 Port C Block Diagram (PC0).................................................................................. 387
Figure D.1 FP-64K Package Dimensions................................................................................... 391
Figure D.2 FP-64A Package Dimensions................................................................................... 392
Figure D.3 FP-48F Package Dimensions.................................................................................... 393
Figure D.4 FP-48B Package Dimensions ...................................................................................394
Figure D.5 TNP-48 Package Dimensions................................................................................... 395
Rev. 1.00 Aug. 28, 2006 Page xxiv of xxviii

Tables

Section 1 Overview
Table 1.1
Section 2 CPU
Table 2.1 Operation Notation .................................................................................................18
Table 2.2 Data Transfer Instructions.......................................................................................19
Table 2.3 Arithmetic Operations Instructions (1) ...................................................................20
Table 2.3 Arithmetic Operations Instructions (2) ...................................................................21
Table 2.4 Logic Operations Instructions................................................................................. 22
Table 2.5 Shift Instructions.....................................................................................................22
Table 2.6 Bit Manipulation Instructions (1)............................................................................ 23
Table 2.6 Bit Manipulation Instructions (2)............................................................................ 24
Table 2.7 Branch Instructions................................................................................................. 25
Table 2.8 System Control Instructions.................................................................................... 26
Table 2.9 Block Data Transfer Instructions ............................................................................ 27
Table 2.10 Addressing Modes .................................................................................................. 29
Table 2.11 Absolute Address Access Ranges........................................................................... 30
Table 2.12 Effective Address Calculation (1)........................................................................... 32
Table 2.12 Effective Address Calculation (2)........................................................................... 33
Section 3 Exception Handling
Table 3.1 Exception Sources and Vector Address.................................................................. 43
Table 3.2 Interrupt Wait States ...............................................................................................54
Pin Functions ............................................................................................................ 6
Section 4 Address Break
Table 4.1 Access and Data Bus Used .....................................................................................59
Section 5 Clock Pulse Generators
Table 5.1 Crystal Resonator Parameters ................................................................................. 79
Section 6 Power-Down Modes
Table 6.1 Operating Frequency and Waiting Time................................................................. 87
Table 6.2 Transition Mode after SLEEP Instruction Execution and Interrupt Handling........ 90
Table 6.3 Internal State in Each Operating Mode................................................................... 91
Section 7 ROM
Table 7.1 Setting Programming Modes ................................................................................ 103
Table 7.2 Boot Mode Operation ...........................................................................................105
Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible................................................................................................................. 106
Rev. 1.00 Aug. 28, 2006 Page xxv of xxviii
Table 7.4 Reprogram Data Computation Table.................................................................... 109
Table 7.5 Additional-Program Data Computation Table...................................................... 109
Table 7.6 Programming Time............................................................................................... 109
Table 7.7 Flash Memory Operating States............................................................................ 113
Section 10 Timer A
Table 10.1 Pin Configuration.................................................................................................. 144
Section 11 Timer V
Table 11.1 Pin Configuration.................................................................................................. 151
Table 11.2 Clock Signals to Input to TCNTV and Counting Conditions ............................... 153
Section 12 Timer W
Table 12.1 Timer W Functions............................................................................................... 164
Table 12.2 Pin Configuration.................................................................................................. 166
Section 14 Serial Communication Interface 3 (SCI3)
Table 14.1 Pin Configuration.................................................................................................. 203
Table 14.2 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1) ...... 211
Table 14.2 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2) ...... 212
Table 14.3 Maximum Bit Rate for Each Frequency (Asynchronous Mode) ..........................213
Table 14.4 Examples of BBR Setting for Various Bit Rates
(Clocked Synchronous Mode) .............................................................................. 214
Table 14.5 SSR Status Flags and Receive Data Handling...................................................... 220
Table 14.6 SCI3 Interrupt Requests........................................................................................ 238
Section 15 I2C Bus Interface 2 (IIC2)
Table 15.1 I2C Bus Interface Pins........................................................................................... 243
Table 15.2 Transfer Rate ........................................................................................................246
Table 15.3 Interrupt Requests................................................................................................. 273
Table 15.4 Time for Monitoring SCL..................................................................................... 274
Section 16 A/D Converter
Table 16.1 Pin Configuration.................................................................................................. 277
Table 16.2 Analog Input Channels and Corresponding ADDR Registers.............................. 278
Table 16.3 A/D Conversion Time (Single Mode)................................................................... 284
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
Table 17.1 LVDCR Settings and Select Functions................................................................. 293
Table 17.2 Deciding Reset Source.......................................................................................... 299
Section 20 Electrical Characteristics
Table 20.1 Absolute Maximum Ratings ................................................................................. 317
Table 20.2 DC Characteristics (1) ..........................................................................................320
Rev. 1.00 Aug. 28, 2006 Page xxvi of xxviii
Table 20.2 DC Characteristics (2)...........................................................................................324
Table 20.3 AC Characteristics ................................................................................................325
Table 20.4 I2C Bus Interface Timing...................................................................................... 328
Table 20.5 Serial Communication Interface (SCI) Timing..................................................... 329
Table 20.6 A/D Converter Characteristics.............................................................................. 330
Table 20.7 Watchdog Timer Characteristics........................................................................... 331
Table 20.8 Flash Memory Characteristics ..............................................................................332
Table 20.9 Power-Supply-Voltage Detection Circuit Characteristics.....................................334
Table 20.10 Power-On Reset Circuit Characteristics............................................................334
Appendix
Table A.1 Instruction Set....................................................................................................... 341
Table A.2 Operation Code Map (1) ....................................................................................... 354
Table A.2 Operation Code Map (2) ....................................................................................... 355
Table A.2 Operation Code Map (3) ....................................................................................... 356
Table A.3 Number of Cycles in Each Instruction.................................................................. 358
Table A.4 Number of Cycles in Each Instruction.................................................................. 359
Table A.5 Combinations of Instructions and Addressing Modes ..........................................368
Rev. 1.00 Aug. 28, 2006 Page xxvii of xxviii
Rev. 1.00 Aug. 28, 2006 Page xxviii of xxviii

Section 1 Overview

Section 1 Overview

1.1 Features

High-speed H8/300H central processing unit with an internal 16-bit architecture Upward-compatible with H8/300 CPU on an object level Sixteen 16-bit general registers 62 basic instructions
Various peripheral functions Timer A (can be used as a time base for a clock) Timer V (8-bit timer) Timer W (16-bit timer) Watchdog timer SCI (Asynchronous or clocked synchronous serial communication interface)
2
I
C Bus Interface (conforms to the I2C bus interface format that is advocated by Philips
Electronics)
10-bit A/D converter POR/LVD: power-on reset and low-voltage detecting circuit (optional) On-chip oscillator
On-chip memory
Model
On-Chip Power­On Reset and Low-Voltage Detecting Circuit Version ROM RAM Remarks
Product Classification
(F-ZTAT
TM
version)
Standard Version
H8/36094F HD64F36094 HD64F36094G 32 kbytes 2,048 bytes Flash memory version
H8/36092F HD64F36092 HD64F36092G 16 kbytes 2,048 bytes
Rev. 1.00 Aug. 28, 2006 Page 1 of 400
REJ09B0268-0100
Section 1 Overview
General I/O ports I/O pins: 31 I/O pins, including 8 large current ports (I
= 20 mA, @VOL = 1.5 V)
OL
Input-only pins: 8 input pins (also used for analog input)
Frequency accuracy:
20 MHz ± 1.5% V 16 MHz ± 1.5% V 20 MHz ± 3% V 16 MHz ± 3% V 20 MHz ± 4% V 16 MHz ± 4% V
= 4.0 to 5.0 V, T
CC
= 4.0 to 5.0 V, T
CC
= 4.0 to 5.5 V, T
CC
= 4.0 to 5.5 V, T
CC
= 3.0 to 5.5 V, T
CC
= 3.0 to 5.5 V, T
CC
= 25°C
a
= 25°C
a
= –20 to 75°C
a
= –20 to 75°C
a
= –20 to 75°C
a
= –20 to 75°C
a
Supports various power-down modes
Note: F-ZTATTM is a trademark of Renesas Technology Corp.
Compact package
Package Code Body Size Pin Pitch
LQFP-64 FP-64K 10.0
QFP-64 FP-64A 14.0 × 14.0 mm 0.8 mm LQFP-48 FP-48F 10.0 × 10.0 mm 0.65 mm LQFP-48 FP-48B 7.0 × 7.0 mm 0.5 mm QFN-48 TNP-48 7.0 × 7.0 mm 0.5 mm
× 10.0 mm 0.5 mm
Rev. 1.00 Aug. 28, 2006 Page 2 of 400
REJ09B0268-0100

1.2 Internal Block Diagram

G
Section 1 Overview
P10/TMOW
P11 P12
P14/IRQ0 P15/IRQ1 P16/IRQ2
P17/IRQ3/TRGV
P20/SCK3
P21/RXD
P22/TXD
X1
Subclock
generator
Port 1
Port 2
X2
(OSC1)
External
clock
generator
(OSC2)
On-chip
oscillator
VCCVSSVCLRES
Data bus (lower)
ROM
Timer W
Timer A
Timer V
A/D
converter
Data bus (upper)
Address bus
CPU
H8/300H
Watchdog
POR/LVD (optional)
RAM
SCI3
timer
IIC2
TEST
NMI
P80/FTCI P81/FTIOA P82/FTIOB P83/FTIOC P84/FTIOD
Port 8Port 7Port 5Port B
P85 P86 P87
P74/TMRIV P75/TMCIV P76/TMOV
P50/WKP0 P51/WKP1 P52/WKP2 P53/WKP3 P54/WKP4 P55/WKP5/ADTR P56/SDA P57/SCL
PB0/AN0 PB1/AN1 PB2/AN2 PB3/AN3 PB4/AN4 PB5/AN5 PB6/AN6 PB7/AN7
AV
CC
Port C
PC0/OSC1
PC1/OSC2/CLKOUT
Figure 1.1 Internal Block Diagram of H8/36094 Group of F-ZTATTM
Rev. 1.00 Aug. 28, 2006 Page 3 of 400
REJ09B0268-0100
Section 1 Overview
G

1.3 Pin Assignments

NC
NC
P14/IRQ0 P15/IRQ1 P16/IRQ2
P17/IRQ3/TRGV
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
PB3/AN3
PB2/AN2
PB1/AN1
PB0/AN0
NC
NC
NCNCP22/TXD
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
1 2 3 4 5 6 7 8 9 10111213141516
NC
NC
CC
AV
P21/RXD
P20/SCK3
P87
H8/36094 Group
X2
X1
V
P86
(Top view)
CL
RES
P85
P84/FTIOD
SS
V
TEST
P83/FTIOC
P82/FTIOB
P81/FTIOA
CC
V
PC0/OSC1
P80/FTCI
P50/WKP0
NMINCNC
NC
NC
P51/WKP1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NC
NC
P76/TMOV
P75/TMCIV
P74/TMRIV
P57/SCL
P56/SDA
P12
P11
P10/TMOW P55/WKP5/ADTR P54/WKP4 P53/WKP3 P52/WKP2
NC
NC
PC1/OSC2/CLKOUT
Note: Do not connect NC pins (these pins are not connected to the internal circuitry).
Figure 1.2 Pin Assignments of H8/36094 Group of F-ZTATTM (FP-64K, FP-64A)
Rev. 1.00 Aug. 28, 2006 Page 4 of 400
REJ09B0268-0100
P22/TXD
G
P21/RXD
P20/SCK3
P87
P86
P85
P84/FTIOD
P83/FTIOC
P82/FTIOB
P81/FTIOA
P80/FTCI
NMI
Section 1 Overview
P14/IRQ0 P15/IRQ1 P16/IRQ2
P17/IRQ3/TRGV
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
PB3/AN3
PB2/AN2
PB1/AN1
PB0/AN0
36 35 34 33 32 31 30 29 28 27 26 25
37
38
39
40
41
42
43
44
45
46
47
48
123456789101112
AVcc
X2
X1
H8/36094 Group
(Top View)
CL
V
RES
TEST
SS
V
Vcc
PC0/OSC1
PC1/OSC2/CLKOUT
P50/WKP0
24
23
22
21
20
19
18
17
16
15
14
13
P51/WKP1
P76/TMOV
P75/TMCIV
P74/TMRIV
P57/SCL
P56/SDA
P12
P11
P10/TMOW P55/WKP5/ADTR P54/WKP4 P53/WKP3 P52/WKP2
Figure 1.3 Pin Assignments of H8/36094 Group of F-ZTATTM (FP-48F, FP-48B, TNP-48)
Rev. 1.00 Aug. 28, 2006 Page 5 of 400
REJ09B0268-0100
Section 1 Overview

1.4 Pin Functions

Table 1.1 Pin Functions
Pin No.
FP-48F
Type Symbol
Power
VCC 12 10 Input Power supply pin. Connect this pin to the source pins
VSS 9 7 Input Ground pin. Connect this pin to the system
AVCC 3 1 Input Analog power supply pin for the A/D converter.
V
CL
OSC1 11 9 Input Clock pins
OSC2/
CLKOUT
X1 5 3 Input
X2 4 2 Output
System
RES 7 5 Input Reset pin. The pull-up resistor (typ. 150 kΩ) is control
TEST 8 6 Input Test pin. Connect this pin to Vss.
Interrupt
NMI 35 25 Input Non-maskable interrupt request input pin. Be pins
IRQ0 to
IRQ3 WKP0 to
WKP5
Timer A TMOW 23 17 Output This is an output pin for divided clocks.
FP-64K FP-64A
FP-48B TNP-48 I/O
Functions
system power supply.
power supply (0V).
When the A/D converter is not used, connect this pin to the system power supply.
6 4 Input Internal step-down power supply pin. Connect a
capacitor of around 0.1 µF between this pin and the Vss pin for stabilization.
These pins connect with crystal or ceramic
10 8 Output
resonator for the system clock, or can be used to input an external clock.
See section 5, Clock Pulse Generators, for a typical connection.
These pins connect with a 32.768-kHz crystal resonator for the subclock. See section 5, Clock Pulse Generators, for a typical connection.
incorporated. When driven low, the chip is reset.
sure to pull-up by a pull-up resistor.
51 to 54 37 to 40 Input External interrupt request input pins. Can select
the rising or falling edge.
13, 14, 19 to 22
11 to 16 Input External interrupt request input pins. Can select
the rising or falling edge.
Rev. 1.00 Aug. 28, 2006 Page 6 of 400
REJ09B0268-0100
Section 1 Overview
Pin No.
FP-48F
Type
Symbol
FP-64K FP-64A
FP-48B TNP-48 I/O
Functions
Timer V TMOV 30 24 Output This is an output pin for waveforms
generated by the output compare function.
TMCIV 29 23 Input External event input pin.
TMRIV 28 22 Input Counter reset input pin.
TRGV 54 40 Input Counter start trigger input pin.
Timer W FTCI 36 26 Input External event input pin.
FTIOA to
FTIOD
I2C bus
SDA 26 20 I/O IIC data I/O pin. Can directly drive a bus by interface 2 (IIC2)
SCL 27 21 I/O
37 to 40 27 to 30 I/O Output compare output/ input capture input/
PWM output pins
NMOS open-drain output.
IIC clock I/O pin. Can directly drive a bus
(EEPROM:
by NMOS open-drain output.
Input)
Serial communi­cation interface
TXD 46 36 Output Transmit data output pin
RXD 45 35 Input Receive data input pin
SCK3 44 34 I/O Clock I/O pin 3 (SCI3)
A/D converter
AN7 to
AN0
55 to 62 41 to 48 Input Analog input pins
ADTRG 22 16 Input A/D converter trigger input pin.
I/O ports PB7 to
55 to 62 41 to 48 Input 8-bit input port
PB0
PC1,
10, 11 8, 9 I/O 2-bit I/O port
PC0
P17 to
P14,
51 to 54, 23 to 25
37 to 40 17 to 19
I/O 7-bit I/O port
P12 to
P10
P22 to
44 to 46 34 to 36 I/O 3-bit I/O port
P20
P57 to
P50
13, 14, 19 to 22, 26, 27
20, 21, 13 to 16, 11, 12
I/O 8-bit I/O port
Rev. 1.00 Aug. 28, 2006 Page 7 of 400
REJ09B0268-0100
Section 1 Overview
Pin No.
FP-48F
Type
I/O ports P76 to
Symbol
FP-64K FP-64A
FP-48B TNP-48 I/O
Functions
28 to 30 22 to 24 I/O 3-bit I/O port
P74
P87 to
36 to 43 26 to 33 I/O 8-bit I/O port
P80
Rev. 1.00 Aug. 28, 2006 Page 8 of 400
REJ09B0268-0100

Section 2 CPU

Section 2 CPU
This LSI has an H8/300H CPU with an internal 32-bit architecture that is upward-compatible with the H8/300CPU, and supports only normal mode, which has a 64-kbyte address space.
Upward-compatible with H8/300 CPUs
Can execute H8/300 CPUs object programs Additional eight 16-bit extended registers 32-bit transfer and arithmetic and logic instructions are added Signed multiply and divide instructions are added.
General-register architecture
Sixteen 16-bit general registers also usable as sixteen 8-bit registers and eight 16-bit
registers, or eight 32-bit registers
Sixty-two basic instructions
8/16/32-bit data transfer and arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions
Eight addressing modes
Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16,ERn) or @(d:24,ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn] Absolute address [@aa:8, @aa:16, @aa:24] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8,PC) or @(d:16,PC)] Memory indirect [@@aa:8]
64-kbyte address space
High-speed operation
All frequently-used instructions execute in one or two states 8/16/32-bit register-register add/subtract : 2 state 8 × 8-bit register-register multiply : 14 states 16 ÷ 8-bit register-register divide : 14 states 16 × 16-bit register-register multiply : 22 states 32 ÷ 16-bit register-register divide : 22 states
Rev. 1.00 Aug. 28, 2006 Page 9 of 400
REJ09B0268-0100
Section 2 CPU
Power-down state Transition to power-down state by SLEEP instruction

2.1 Address Space and Memory Map

The address space of this LSI is 64 kbytes, which includes the program area and the data area. Figure 2.1 shows the memory map.
HD64F36094, HD64F36094G
H'0000 H'0041 H'0042
H'7FFF
H'F730
H'F74F
H'F780
Interrupt vector
On-chip ROM
(32 kbytes)
Not used
Internal I/O register
Not used
(1-kbyte work area
for flash memory
programming)
HD64F36092, HD64F36092G
H'0000 H'0041 H'0042
H'3FFF
H'F730
H'F74F
H'F780
Interrupt vector
On-chip ROM
(16 kbytes)
Not used
Internal I/O register
Not used
(1-kbyte work area
for flash memory
programming)
H'FB7F H'FB80
H'FF7F H'FF80
H'FFFF
On-chip RAM
(2 kbytes)
(1-kbyte user area)
Internal I/O register
H'FB7F H'FB80
H'FF7F H'FF80
H'FFFF
Figure 2.1 Memory Map
Rev. 1.00 Aug. 28, 2006 Page 10 of 400
REJ09B0268-0100
On-chip RAM
(2 kbytes)
(1-kbyte user area)
Internal I/O register
Section 2 CPU

2.2 Register Configuration

The H8/300H CPU has the internal registers shown in figure 2.2. There are two types of registers; general registers and control registers. The control registers are a 24-bit program counter (PC), and an 8-bit condition code register (CCR).
General Registers (ERn)
15 0 7 0 7 0
ER0
ER1
ER2
ER3
ER4
ER5
ER6
ER7
E0
E1
E2
E3
E4
E5
E6
E7
(SP)
R0H
R1H
R2H
R3H
R4H
R5H
R6H
R7H
R0L
R1L
R2L
R3L
R4L
R5L
R6L
R7L
Control Registers (CR)
[Legend]
SP:
Stack pointer
PC:
Program counter
CCR:
Condition-code register
I:
Interrupt mask bit
UI:
User bit
23 0
PC
76543210
CCR
IUIHUNZVC
Half-carry flag
H:
User bit
U:
Negative flag
N:
Zero flag
Z:
Overflow flag
V:
Carry flag
C:
Figure 2.2 CPU Registers
Rev. 1.00 Aug. 28, 2006 Page 11 of 400
REJ09B0268-0100
Section 2 CPU

2.2.1 General Registers

The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally identical and can be used as both address registers and data registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.3 illustrates the usage of the general registers. When the general registers are used as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8-bit registers.
The usage of each register can be selected independently.
• Address registers
• 32-bit registers
ER registers
(ER0 to ER7)
• 16-bit registers • 8-bit registers
E registers (extended registers)
(E0 to E7)
R registers
(R0 to R7)
Figure 2.3 Usage of General Registers
RH registers
(R0H to R7H)
RL registers
(R0L to R7L)
Rev. 1.00 Aug. 28, 2006 Page 12 of 400
REJ09B0268-0100
Section 2 CPU
General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2.4 shows the relationship between stack pointer and the stack area.
Free area
SP (ER7)
Stack area
Figure 2.4 Relationship between Stack Pointer and Stack Area

2.2.2 Program Counter (PC)

This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an instruction is fetched, the least significant PC bit is regarded as 0). The PC is initialized when the start address is loaded by the vector address generated during reset exception-handling sequence.

2.2.3 Condition-Code Register (CCR)

This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. The I bit is initialized to 1 by reset exception-handling sequence, but other bits are not initialized.
Some instructions leave flag bits unchanged. Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch (Bcc) instructions.
For the action of each instruction on the flag bits, see appendix A.1, Instruction List.
Rev. 1.00 Aug. 28, 2006 Page 13 of 400
REJ09B0268-0100
Section 2 CPU
Initial
Bit Bit Name
Value R/W Description
7 I 1 R/W Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is accepted regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling sequence.
6 UI Undefined R/W User Bit
Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions.
5 H Undefined R/W Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise.
4 U Undefined R/W User Bit
Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions.
3 N Undefined R/W Negative Flag
Stores the value of the most significant bit of data as a sign bit.
2 Z Undefined R/W Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data.
1 V Undefined R/W Overflow Flag
Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times.
0 C Undefined R/W Carry Flag
Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
Add instructions, to indicate a carry
Subtract instructions, to indicate a borrow
Shift and rotate instructions, to indicate a carry
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Rev. 1.00 Aug. 28, 2006 Page 14 of 400
REJ09B0268-0100
Section 2 CPU

2.3 Data Formats

The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data.

2.3.1 General Register Data Formats

Figure 2.5 shows the data formats in general registers.
Data Type General Register Data Format
70
6543271
Don't care
0
1-bit data
RnH
1-bit data
4-bit BCD data
4-bit BCD data
Byte data
Byte data
7
RnL
RnH
RnL
RnH
RnL
Don't care
7 04 3
Upper Lower
Don't care
7 0
MSB LSB
Don't care
65432710
Don't care
704 3
Upper Lower
7
MSB LSB
Figure 2.5 General Register Data Formats (1)
0
Don't care
0
Rev. 1.00 Aug. 28, 2006 Page 15 of 400
REJ09B0268-0100
Section 2 CPU
Data Type Data FormatGeneral
Register
Word data
Word dataRnEn
Longword
ERn
data
[Legend]
ERn:
General register ER
En:
General register E
Rn:
General register R
RnH:
General register RH
RnL:
General register RL
MSB:
Most significant bit
LSB:
Least significant bit
15 0
MSB LSB
15 0
MSB LSB
31 16
MSB
15 0
Figure 2.5 General Register Data Formats (2)
LSB
Rev. 1.00 Aug. 28, 2006 Page 16 of 400
REJ09B0268-0100
Section 2 CPU

2.3.2 Memory Data Formats

Figure 2.6 shows the data formats in memory. The H8/300H CPU can access word data and longword data in memory, however word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, an address error does not occur, however the least significant bit of the address is regarded as 0, so access begins the preceding address. This also applies to instruction fetches.
When ER7 (SP) is used as an address register to access the stack area, the operand size should be word or longword.
Data Type Address
1-bit data
Byte data
Word data
Longword data Address 2N
Address L
Address L
Address 2M
Address 2M+1
Address 2N+1
Address 2N+2
Address 2N+3
MSB
MSB
MSB
Figure 2.6 Memory Data Formats
Data Format
70
76 543210
LSB
LSB
LSB
Rev. 1.00 Aug. 28, 2006 Page 17 of 400
REJ09B0268-0100
Section 2 CPU

2.4 Instruction Set

2.4.1 Table of Instructions Classified by Function

The H8/300H CPU has 62 instructions. Tables 2.2 to 2.9 summarize the instructions in each functional category. The notation used in tables 2.2 to 2.9 is defined below.
Table 2.1 Operation Notation
Symbol Description
Rd General register (destination)*
Rs General register (source)*
Rn General register*
ERn General register (32-bit register or address register)
(EAd) Destination operand
(EAs) Source operand
CCR Condition-code register
N N (negative) flag in CCR
Z Z (zero) flag in CCR
V V (overflow) flag in CCR
C C (carry) flag in CCR
PC Program counter
SP Stack pointer
#IMM Immediate data
disp Displacement
+ Addition
– Subtraction × Multiplication
÷ Division
Logical AND Logical OR Logical XOR Move
¬ NOT (logical complement)
Rev. 1.00 Aug. 28, 2006 Page 18 of 400
REJ09B0268-0100
Section 2 CPU
Symbol Description
:3/:8/:16/:24 3-, 8-, 16-, or 24-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers/address register (ER0 to ER7).
Table 2.2 Data Transfer Instructions
Instruction Size* Function
MOV B/W/L (EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register and memory, or moves immediate data to a general register.
MOVFPE B (EAs) → Rd, Cannot be used in this LSI. MOVTPE B Rs → (EAs) Cannot be used in this LSI. POP W/L @SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH W/L Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
Note: * Refers to the operand size. B: Byte W: Word L: Longword
Rev. 1.00 Aug. 28, 2006 Page 19 of 400
REJ09B0268-0100
Section 2 CPU
Table 2.3 Arithmetic Operations Instructions (1)
Instruction Size* Function
ADD SUB
ADDX SUBX
INC DEC
ADDS SUBS
DAA DAS
MULXU B/W Rd × Rs → Rd
MULXS B/W Rd × Rs → Rd
DIVXU B/W Rd ÷ Rs Rd
Note: * Refers to the operand size. B: Byte W: Word L: Longword
B/W/L Rd ± Rs Rd, Rd ± #IMM Rd
Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register (immediate byte data cannot be subtracted from byte data in a general register. Use the SUBX or ADD instruction.)
B Rd ± Rs ± C Rd, Rd ± #IMM ± C Rd
Performs addition or subtraction with carry on byte data in two general registers, or on immediate data and data in a general register.
B/W/L Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.)
L Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
B Rd decimal adjust Rd
Decimal-adjusts an addition or subtraction result in a general register by referring to the CCR to produce 4-bit BCD data.
Performs unsigned multiplication on data in two general registers: either 8 bits × 8 bits 16 bits or 16 bits × 16 bits 32 bits.
Performs signed multiplication on data in two general registers: either 8 bits × 8 bits 16 bits or 16 bits × 16 bits 32 bits.
Performs unsigned division on data in two general registers: either 16 bits ÷ 8 bits 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits 16-bit quotient and 16-bit remainder.
Rev. 1.00 Aug. 28, 2006 Page 20 of 400
REJ09B0268-0100
Table 2.3 Arithmetic Operations Instructions (2)
Instruction Size* Function
DIVXS B/W Rd ÷ Rs Rd
Performs signed division on data in two general registers: either 16 bits ÷ 8 bits 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits 16-bit quotient and 16-bit remainder.
CMP B/W/L Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register or with immediate data, and sets CCR bits according to the result.
NEG B/W/L 0 – Rd Rd
Takes the two's complement (arithmetic complement) of data in a general register.
EXTU W/L Rd (zero extension) Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by padding with zeros on the left.
EXTS W/L Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by extending the sign bit.
Note: * Refers to the operand size. B: Byte W: Word L: Longword
Section 2 CPU
Rev. 1.00 Aug. 28, 2006 Page 21 of 400
REJ09B0268-0100
Section 2 CPU
Table 2.4 Logic Operations Instructions
Instruction Size* Function
AND B/W/L Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another general register or immediate data.
OR B/W/L Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another general register or immediate data.
XOR B/W/L Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and another general register or immediate data.
NOT B/W/L ¬ (Rd) → (Rd)
Takes the one's complement (logical complement) of general register contents.
Note: * Refers to the operand size. B: Byte W: Word L: Longword
Table 2.5 Shift Instructions
Instruction Size* Function
SHAL SHAR
SHLL SHLR
ROTL ROTR
ROTXL ROTXR
B/W/L Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
B/W/L Rd (shift) → Rd
Performs a logical shift on general register contents.
B/W/L Rd (rotate) → Rd
Rotates general register contents.
B/W/L Rd (rotate) → Rd
Rotates general register contents through the carry flag.
Note: * Refers to the operand size. B: Byte W: Word L: Longword
Rev. 1.00 Aug. 28, 2006 Page 22 of 400
REJ09B0268-0100
Table 2.6 Bit Manipulation Instructions (1)
Instruction Size* Function
BSET B 1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower three bits of a general register.
BCLR B 0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower three bits of a general register.
BNOT B ¬ (<bit-No.> of <EAd>) (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower three bits of a general register.
BTST B ¬ (<bit-No.> of <EAd>) Z
Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower three bits of a general register.
BAND
BIAND
BOR
BIOR
Note: * Refers to the operand size. B: Byte
B
B
B
B
C (<bit-No.> of <EAd>) C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag.
C ¬ (<bit-No.> of <EAd>) C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
C (<bit-No.> of <EAd>) C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag.
C ¬ (<bit-No.> of <EAd>) C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
Section 2 CPU
Rev. 1.00 Aug. 28, 2006 Page 23 of 400
REJ09B0268-0100
Section 2 CPU
Table 2.6 Bit Manipulation Instructions (2)
Instruction Size* Function
BXOR
BIXOR
BLD
BILD
BST
BIST
Note: * Refers to the operand size. B: Byte
B
B
B
B
B
B
C (<bit-No.> of <EAd>) C XORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag.
C ¬ (<bit-No.> of <EAd>) C XORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
(<bit-No.> of <EAd>) C Transfers a specified bit in a general register or memory operand to the carry flag.
¬ (<bit-No.> of <EAd>) C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data.
C (<bit-No.> of <EAd>) Transfers the carry flag value to a specified bit in a general register or memory operand.
¬ C (<bit-No.> of <EAd>) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data.
Rev. 1.00 Aug. 28, 2006 Page 24 of 400
REJ09B0268-0100
Section 2 CPU
Table 2.7 Branch Instructions
Instruction Size Function
Bcc* Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic Description Condition
BRA(BT) Always (true) Always
BRN(BF) Never (false) Never BHI High C Z = 0 BLS Low or same C Z = 1
BCC(BHS) Carry clear
(high or same)
BCS(BLO) Carry set (low) C = 1
BNE Not equal Z = 0
BEQ Equal Z = 1
BVC Overflow clear V = 0
BVS Overflow set V = 1
BPL Plus N = 0
BMI Minus N = 1 BGE Greater or equal N V = 0 BLT Less than N ⊕ V = 1 BGT Greater than Z∨(N ⊕ V) = 0 BLE Less or equal Z∨(N ⊕ V) = 1
JMP Branches unconditionally to a specified address.
BSR Branches to a subroutine at a specified address.
JSR Branches to a subroutine at a specified address.
RTS Returns from a subroutine
Note: * Bcc is the general name for conditional branch instructions.
C = 0
Rev. 1.00 Aug. 28, 2006 Page 25 of 400
REJ09B0268-0100
Section 2 CPU
Table 2.8 System Control Instructions
Instruction Size* Function
TRAPA — Starts trap-instruction exception handling.
RTE Returns from an exception-handling routine.
SLEEP — Causes a transition to a power-down state. LDC B/W (EAs) → CCR
Moves the source operand contents to the CCR. The CCR size is one byte, but in transfer from memory, data is read by word access.
STC B/W CCR → (EAd)
Transfers the CCR contents to a destination location. The condition code register size is one byte, but in transfer to memory, data is written by word access.
ANDC B CCR ∧ #IMM → CCR
Logically ANDs the CCR with immediate data.
ORC B CCR #IMM CCR
Logically ORs the CCR with immediate data.
XORC B CCR ⊕ #IMM → CCR
Logically XORs the CCR with immediate data.
NOP PC + 2 PC
Only increments the program counter.
Note: * Refers to the operand size. B: Byte W: Word
Rev. 1.00 Aug. 28, 2006 Page 26 of 400
REJ09B0268-0100
Table 2.9 Block Data Transfer Instructions
Instruction Size Function
EEPMOV.B — if R4L ≠ 0 then
Repeat @ER5+ → @ER6+, R4L–1 R4L Until R4L = 0 else next;
EEPMOV.W — if R4 ≠ 0 then
Repeat @ER5+ → @ER6+, R4–1 R4 Until R4 = 0 else next;
Transfers a data block. Starting from the address set in ER5, transfers data for the number of bytes set in R4L or R4 to the address location set in ER6.
Execution of the next instruction begins as soon as the transfer is completed.

2.4.2 Basic Instruction Formats

Section 2 CPU
H8/300H CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (op), a register field (r), an effective address extension (EA), and a condition field (cc).
Figure 2.7 shows examples of instruction formats.
(1) Operation Field
Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first four bits of the instruction. Some instructions have two operation fields.
(2) Register Field
Specifies a general register. Address registers are specified by 3 bits, and data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field.
(3) Effective Address Extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A24-bit address or displacement is treated as a 32-bit data in which the first 8 bits are 0 (H'00).
Rev. 1.00 Aug. 28, 2006 Page 27 of 400
REJ09B0268-0100
Section 2 CPU
(4) Condition Field
Specifies the branching condition of Bcc instructions.
(1) Operation field only
op
(2) Operation field and register fields
op
(3) Operation field, register fields, and effective address extension
op
EA(disp)
(4) Operation field, effective address extension, and condition field
op cc EA(disp) BRA d:8
rn
rn rm
Figure 2.7 Instruction Formats
rm
NOP, RTS, etc.
ADD.B Rn, Rm, etc.
MOV.B @(d:16, Rn), Rm

2.5 Addressing Modes and Effective Address Calculation

The following describes the H8/300H CPU. In this LSI, the upper eight bits are ignored in the generated 24-bit address, so the effective address is 16 bits.

2.5.1 Addressing Modes

The H8/300H CPU supports the eight addressing modes listed in table 2.10. Each instruction uses a subset of these addressing modes. Addressing modes that can be used differ depending on the instruction. For details, refer to appendix A.4, Combinations of Instructions and Addressing Modes.
Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except program-counter relative and memory indirect. Bit manipulation instructions use register direct, register indirect, or the absolute addressing mode (@aa:8) to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand.
Rev. 1.00 Aug. 28, 2006 Page 28 of 400
REJ09B0268-0100
Section 2 CPU
Table 2.10 Addressing Modes
No. Addressing Mode Symbol
1 Register direct Rn
2 Register indirect @ERn
3 Register indirect with displacement @(d:16,ERn)/@(d:24,ERn)
4 Register indirect with post-increment
Register indirect with pre-decrement
5 Absolute address @aa:8/@aa:16/@aa:24
6 Immediate #xx:8/#xx:16/#xx:32
7 Program-counter relative @(d:8,PC)/@(d:16,PC)
8 Memory indirect @@aa:8
@ERn+ @–ERn
(1) Register Direct—Rn
The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
(2) Register Indirect—@ERn
The register field of the instruction code specifies an address register (ERn), the lower 24 bits of which contain the address of the operand on memory.
(3) Register Indirect with Displacement—@(d:16, ERn) or @(d:24, ERn)
A 16-bit or 24-bit displacement contained in the instruction is added to an address register (ERn) specified by the register field of the instruction, and the lower 24 bits of the sum the address of a memory operand. A 16-bit displacement is sign-extended when added.
(4) Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn
Register indirect with post-increment—@ERn+
The register field of the instruction code specifies an address register (ERn) the lower 24 bits of which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents (32 bits) and the sum is stored in the address register. The value added is 1 for byte access, 2 for word access, or 4 for longword access. For the word
or longword access, the register value should be even.
Rev. 1.00 Aug. 28, 2006 Page 29 of 400
REJ09B0268-0100
Section 2 CPU
Register indirect with pre-decrement—@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the lower 24 bits of the result is the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word access, or 4 for longword access. For the word or longword access, the register value should be even.
(5) Ab solute Address—@aa:8, @aa:16, @aa:24
The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24)
For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the entire address space.
The access ranges of absolute addresses for the group of this LSI are those shown in table 2.11,
because the upper 8 bits are ignored.
Table 2.11 Absolute Address Access Ranges
Absolute Address Access Range
8 bits (@aa:8) H'FF00 to H'FFFF
16 bits (@aa:16) H'0000 to H'FFFF
24 bits (@aa:24) H'0000 to H'FFFF
(6) Immediate—#xx:8, #xx:16, or #xx:32
The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a vector address.
Rev. 1.00 Aug. 28, 2006 Page 30 of 400
REJ09B0268-0100
Section 2 CPU
(7) Program-Counter Relative—@(d:8, PC) or @(d:16, PC)
This mode is used in the BSR instruction. An 8-bit or 16-bit displacement contained in the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an even number.
(8) Memory Indirect—@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The memory operand is accessed by longword access. The first byte of the memory operand is ignored, generating a 24-bit branch address. Figure 2.8 shows how to specify branch address for in memory indirect mode. The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255 (H'0000 to H'00FF).
Note that the first part of the address range is also the exception vector area.
Specified by @aa:8
Dummy
Branch address
Figure 2.8 Branch Address Specification in Memory Indirect Mode
Rev. 1.00 Aug. 28, 2006 Page 31 of 400
REJ09B0268-0100
Section 2 CPU

2.5.2 Effective Address Calculation

Table 2.12 indicates how effective addresses are calculated in each addressing mode. In this LSI the upper 8 bits of the effective address are ignored in order to generate a 16-bit effective address.
Table 2.12 Effective Address Calculation (1)
No
Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA)
1
Register direct(Rn)
op
2
Register indirect(@ERn)
op
Register indirect with dis
3
@(d:16,ERn)
o
Register indirect with post-increment or
4
pre-decrement
•Register indirect with post-increment @ERn+
p
rn
rm
r
placement
or @(d:24,ERn)
r
disp
31
General register contents
31
General register contents
31
Sign extension
1
3
General register contents
p
dis
Operand is general register contents.
0
0
0
0
23
23
3
2
0
0
0
p
o
r
•Register indirect with pre-decrement @-ERn
p
o
r
31
General register contents
The value to be added or subtracted is 1 when the operand is byte size, 2 for word size, and 4 for longword size.
1, 2, or 4
1, 2, or 4
Rev. 1.00 Aug. 28, 2006 Page 32 of 400
REJ09B0268-0100
0
23
0
Table 2.12 Effective Address Calculation (2)
Addressing Mode and Instruction Format
No
5
@aa:8
Absolute address
op
abs
Effective Address Calculation Effective Address (EA)
Section 2 CPU
7
0
23
H'FFFF
8
@aa:16
@aa:24
6
Immediate
#xx:8/#xx:16/#xx:32
7
P
@
M
[Legend] r, rm,rn: op: disp: IMM: abs:
op
p
o
p
o
rogram-counter relative
(d:8,PC) @(d:16
emory indirect @@
Register field Operation field Displacement Immediate data Absolute address
,PC)
op
op8abs
23
abs
abs
IMM
23
PC contents
p
dis
:8
aa
23
Sign
extension
23
H'0000
dis
5
1
Memory contents
0
0
p
7
8
0
abs
0
Sign extension
23
Operand is immediate data.
23
23
H'00
15
16
5
1
16
0
0
0
0
Rev. 1.00 Aug. 28, 2006 Page 33 of 400
REJ09B0268-0100
Section 2 CPU

2.6 Basic Bus Cycle

CPU operation is synchronized by a system clock (φ) or a subclock (φ edge of φ or φ
to the next rising edge is called one state. A bus cycle consists of two states or
SUB
). The period from a rising
SUB
three states. The cycle differs depending on whether access is to on-chip memory or to on-chip peripheral modules.

2.6.1 Access to On-Chip Memory (RAM, ROM)

Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access in byte or word size. Figure 2.9 shows the on-chip memory access cycle.
Bus cycle
T
state
2
Read data
ø or ø
SUB
Internal address bus
Internal read signal
Internal data bus (read access)
Internal write signal
T1 state
Address
Internal data bus (write access)
Figure 2.9 On-Chip Memory Access Cycle
Rev. 1.00 Aug. 28, 2006 Page 34 of 400
REJ09B0268-0100
Write data
Section 2 CPU

2.6.2 On-Chip Peripheral Modules

On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits or 16 bits depending on the register. For description on the data bus width and number of accessing states of each register, refer to section 19.1, Register Addresses (Address Order). Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data bus width can be accessed by byte or word size. When a register with 8-bit data bus width is accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the same as that for on-chip memory.
Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral module.
Bus cycle
ø or ø
T1 state
SUB
T2 state T3 state
Internal address bus
Internal read signal
Internal data bus (read access)
Internal write signal
Internal data bus (write access)
Address
Read data
Write data
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)
Rev. 1.00 Aug. 28, 2006 Page 35 of 400
REJ09B0268-0100
Section 2 CPU

2.7 CPU States

There are four CPU states: the reset state, program execution state, program halt state, and exception-handling state. The program execution state includes active mode and subactive mode. For the program halt state there are a sleep mode, standby mode, and sub-sleep mode. These states are shown in figure 2.11. Figure 2.12 shows the state transitions. For details on program execution state and program halt state, refer to section 6, Power-Down Modes. For details on exception processing, refer to section 3, Exception Handling.
CPU state Reset state
The CPU is initialized
Program
execution state
Program halt state
A state in which some or all of the chip functions are stopped to conserve power
The CPU executes successive program instructions at high speed, synchronized by the system clock
The CPU executes successive program instructions at reduced speed, synchronized by the subclock
Active
(high speed) mode
Subactive mode
Sleep mode
Standby mode
Subsleep mode
Power-down
modes
Exception-
handling state
A transient state in which the CPU changes the processing flow due to a reset or an interrupt
Figure 2.11 CPU Operation States
Rev. 1.00 Aug. 28, 2006 Page 36 of 400
REJ09B0268-0100
Section 2 CPU
Reset state
Reset occurs
Program halt state
Reset cleared
Reset occurs
Reset occurs
SLEEP instruction executed
Exception-handling state
Interrupt source
Interrupt source
Program execution state
Exception­handling complete
Figure 2.12 State Transitions

2.8 Usage Notes

2.8.1 Notes on Data Access to Empty Areas

The address space of this LSI includes empty areas in addition to the ROM, RAM, and on-chip I/O registers areas available to the user. When data is transferred from CPU to empty areas, the transferred data will be lost. This action may also cause the CPU to malfunction. When data is transferred from an empty area to CPU, the contents of the data cannot be guaranteed.

2.8.2 EEPMOV Instruction

EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4L, which starts from the address indicated by R5, to the address indicated by R6. Set R4L and R6 so that the end address of the destination address (value of R6 + R4L) does not exceed H'FFFF (the value of R6 must not change from H'FFFF to H'0000 during execution).

2.8.3 Bit Manipulation Instruction

The BSET, BCLR, BNOT, BST, and BIST instructions read data from the specified address in byte units, manipulate the data of the target bit, and write data to the same address again in byte units. Special care is required when using these instructions in cases where two registers are assigned to the same address or when a bit is directly manipulated for a port or a register containing a write-only bit, because this may rewrite data of a bit other than the bit to be manipulated.
Rev. 1.00 Aug. 28, 2006 Page 37 of 400
REJ09B0268-0100
Section 2 CPU
(1) Bit manipulation for two registers assigned to the same address
Example 1: Bit manipulation for the timer load register and timer counter
(Applicable for timer B and timer C, not for the group of this LSI.)
Figure 2.13 shows an example of a timer in which two timer registers are assigned to the same address. When a bit manipulation instruction accesses the timer load register and timer counter of a reloadable timer, since these two registers share the same address, the following operations takes place.
1. Data is read in byte units.
2. The CPU sets or resets the bit to be manipulated with the bit manipulation instruction.
3. The written data is written again in byte units to the timer load register.
The timer is counting, so the value read is not necessarily the same as the value in the timer load register. As a result, bits other than the intended bit in the timer counter may be modified and the modified value may be written to the timer load register.
Count clock Timer counter
Reload
Timer load register
Read
Write
Internal data bus
Figure 2.13 Example of Timer Configuration with Two Regis ters Allocated to Same
Address
Rev. 1.00 Aug. 28, 2006 Page 38 of 400
REJ09B0268-0100
Section 2 CPU
Example 2: The BSET instruction is executed for port 5.
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at P56. P55 to P50 are output pins and output low-level signals. An example to output a high-level signal at P50 with a BSET instruction is shown below.
Prior to executing BSET instruction
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
High level
Low level
Low level
Low level
Low level
Low level
Low level
BSET instruction executed instruction
BSET #0, @PDR5
The BSET instruction is executed for port 5.
After executing BSET instruction
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 0 1 0 0 0 0 0 1
High level
Low level
Low level
Low level
Low level
Low level
High level
Description on operation
1. When the BSET instruction is executed, first the CPU reads port 5.
Since P57 and P56 are input pins, the CPU reads the pin states (low-level and high-level input). P55 to P50 are output pins, so the CPU reads the value in PDR5. In this example PDR5 has a value of H'80, but the value read by the CPU is H'40.
2. Next, the CPU sets bit 0 of the read data to 1, changing the PDR5 data to H'41.
Rev. 1.00 Aug. 28, 2006 Page 39 of 400
REJ09B0268-0100
Section 2 CPU
3. Finally, the CPU writes H'41 to PDR5, completing execution of BSET instruction.
As a result of the BSET instruction, bit 0 in PDR5 becomes 1, and P50 outputs a high-level signal. However, bits 7 and 6 of PDR5 end up with different values. To prevent this problem, store a copy of the PDR5 data in a work area in memory. Perform the bit manipulation on the data in the work area, then write this data to PDR5.
Prior to executing BSET instruction
MOV.B #80, R0L MOV.B R0L, @RAM0 MOV.B R0L, @PDR5
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
RAM0 1 0 0 0 0 0 0 0
The PDR5 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR5.
High level
Low level
Low level
Low level
Low level
Low level
Low level
BSET instruction executed
BSET #0, @RAM0
The BSET instruction is executed designating the PDR5
work area (RAM0).
After executing BSET instruction
MOV.B @RAM0, R0L
The work area (RAM0) value is written to PDR5.
MOV.B R0L, @PDR5
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 1
RAM0 1 0 0 0 0 0 0 1
High level
Low level
Low level
Low level
Low level
Low level
High level
Rev. 1.00 Aug. 28, 2006 Page 40 of 400
REJ09B0268-0100
Section 2 CPU
(2) Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: BCLR instruction executed designating port 5 control register PCR5
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at P56. P55 to P50 are output pins that output low-level signals. An example of setting the P50 pin as an input pin by the BCLR instruction is shown below. It is assumed that a high-level signal will be input to this input pin.
Prior to executing BCLR instruction
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
High level
Low level
Low level
Low level
Low level
Low level
Low level
BCLR instruction executed
BCLR #0, @PCR5
The BCLR instruction is executed for PCR5.
After executing BCLR instruction
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Output Output Output Output Output Output Output Input
Pin state Low
level
PCR5 1 1 1 1 1 1 1 0
PDR5 1 0 0 0 0 0 0 0
High level
Low level
Low level
Low level
Low level
Low level
High level
Description on operation
1. When the BCLR instruction is executed, first the CPU reads PCR5. Since PCR5 is a write-only register, the CPU reads a value of H'FF, even though the PCR5 value is actually H'3F.
2. Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE.
Rev. 1.00 Aug. 28, 2006 Page 41 of 400
REJ09B0268-0100
Section 2 CPU
3. Finally, H'FE is written to PCR5 and BCLR instruction execution ends.
As a result of this operation, bit 0 in PCR5 becomes 0, making P50 an input port. However, bits 7 and 6 in PCR5 change to 1, so that P57 and P56 change from input pins to output pins. To prevent this problem, store a copy of the PDR5 data in a work area in memory and manipulate data of the bit in the work area, then write this data to PDR5.
Prior to executing BCLR instruction
MOV.B #3F, R0L MOV.B R0L, @RAM0 MOV.B R0L, @PCR5
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
RAM0 0 0 1 1 1 1 1 1
The PCR5 value (H'3F) is written to a work area in
memory (RAM0) as well as to PCR5.
High level
Low level
Low level
Low level
Low level
Low level
Low level
BCLR instruction executed
BCLR #0, @RAM0
The BCLR instructions executed for the PCR5 work area
(RAM0).
After executing BCLR instruction
MOV.B @RAM0, R0L
The work area (RAM0) value is written to PCR5.
MOV.B R0L, @PCR5
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
PCR5 0 0 1 1 1 1 1 0
PDR5 1 0 0 0 0 0 0 0
RAM0 0 0 1 1 1 1 1 0
High level
Low level
Low level
Low level
Low level
Low level
High level
Rev. 1.00 Aug. 28, 2006 Page 42 of 400
REJ09B0268-0100

Section 3 Exception Handling

Section 3 Exception Handling
Exception handling may be caused by a reset, a trap instruction (TRAPA), or interrupts.
Reset
A reset has the highest exception priority. Exception handling starts as soon as the reset is cleared by the RES pin. The chip is also reset when the watchdog timer overflows, and exception handling starts. Exception handling is the same as exception handling by the RES pin.
Trap Instruction
Exception handling starts when a trap instruction (TRAPA) is executed. The TRAPA instruction generates a vector address corresponding to a vector number from 0 to 3, as specified in the instruction code. Exception handling can be executed at all times in the program execution state, regardless of the setting of the I bit in CCR.
Interrupts
External interrupts other than NMI and internal interrupts other than address break are masked by the I bit in CCR, and kept masked while the I bit is set to 1. Exception handling starts when the current instruction or exception handling ends, if an interrupt request has been issued.

3.1 Exception Sources and Vector Address

Table 3.1 shows the vector addresses and priority of each exception handling. When more than one interrupt is requested, handling is performed from the interrupt with the highest priority.
Table 3.1 Exception Sources and Vector Address
Relative Module
RES pin Watchdog timer
Reserved for system use 1 to 6 H'0002 to H'000D
External interrupt pin NMI 7 H'000E to H'000F
CPU Trap instruction (#0) 8 H'0010 to H'0011
(#1) 9 H'0012 to H'0013
(#2) 10 H'0014 to H'0015
(#3) 11 H'0016 to H'0017
Address break Break conditions satisfied 12 H'0018 to H'0019 Low
Rev. 1.00 Aug. 28, 2006 Page 43 of 400
REJ09B0268-0100
Exception Sources
Reset 0 H'0000 to H'0001 High
Vector Number Vector Address Priority
Section 3 Exception Handling
Relative Module Exception Sources
CPU Direct transition by executing the
Vector Number Vector Address Priority
13 H'001A to H'001B High
SLEEP instruction
External interrupt pin
IRQ0 Low-voltage detection interrupt*
14 H'001C to H'001D
IRQ1 15 H'001E to H'001F
IRQ2 16 H'0020 to H'0021
IRQ3 17 H'0022 to H'0023
WKP 18 H'0024 to H'0025
Timer A Overflow 19 H'0026 to H'0027 Reserved for system use 20 H'0028 to H'0029
Timer W Timer W input capture A/
21 H'002A to H'002B compare match A Timer W input capture B/ compare match B Timer W input capture C/ compare match C Timer W input capture D/ compare match D Timer W overflow
Timer V Timer V compare match A
22 H'002C to H'002D Timer V compare match B Timer V overflow
SCI3 SCI3 receive data full
23 H'002E to H'002F SCI3 transmit data empty SCI3 transmit end SCI3 receive error
IIC2 Transmit data empty
24 H'0030 to H'0031 Transmit end Receive data full Arbitration lost/Overrun error NACK detection Stop conditions detected
A/D converter A/D conversion end 25 H'0032 to H'0033 Reserved for system use 26 to 33 H'0034 to H'0043
Clock switching Clock switching
(from external clock to on-chip oscillator clock)
34 H'0044 to H'0045
Low
Note * A low-voltage detection interrupt is enabled only in the product with an on-chip power-
on reset and low-voltage detection circuit.
Rev. 1.00 Aug. 28, 2006 Page 44 of 400
REJ09B0268-0100
Section 3 Exception Handling

3.2 Register Descriptions

Interrupts are controlled by the following registers.
Interrupt edge select register 1 (IEGR1)
Interrupt edge select register 2 (IEGR2)
Interrupt enable register 1 (IENR1)
Interrupt flag register 1 (IRR1)
Wakeup interrupt flag register (IWPR)

3.2.1 Interrupt Edge Select Register 1 (IEGR1)

IEGR1 selects the direction of an edge that generates interrupt requests of pins NMI and IRQ3 to IRQ0.
Initial
Bit Bit Name
7 NMIEG 0 R/W NMI Edge Select
6 to 4 All 1  Reserved
3 IEG3 0 R/W IRQ3 Edge Select
2 IEG2 0 R/W IRQ2 Edge Select
1 IEG1 0 R/W IRQ1 Edge Select
0 IEG0 0 R/W IRQ0 Edge Select
Value R/W Description
0: Falling edge of NMI pin input is detected 1: Rising edge of NMI pin input is detected
These bits are always read as 1.
0: Falling edge of IRQ3 pin input is detected 1: Rising edge of IRQ3 pin input is detected
0: Falling edge of IRQ2 pin input is detected 1: Rising edge of IRQ2 pin input is detected
0: Falling edge of IRQ1 pin input is detected 1: Rising edge of IRQ1 pin input is detected
0: Falling edge of IRQ0 pin input is detected 1: Rising edge of IRQ0 pin input is detected
Rev. 1.00 Aug. 28, 2006 Page 45 of 400
REJ09B0268-0100
Section 3 Exception Handling

3.2.2 Interrupt Edge Select Register 2 (IEGR2)

IEGR2 selects the direction of an edge that generates interrupt requests of the pins ADTRG and WKP5 to WKP0.
Initial
Bit Bit Name
7, 6 All 1  Reserved
5 WPEG5 0 R/W WKP5 Edge Select
4 WPEG4 0 R/W WKP4 Edge Select
3 WPEG3 0 R/W WKP3 Edge Select
2 WPEG2 0 R/W WKP2 Edge Select
1 WPEG1 0 R/W WKP1Edge Select
0 WPEG0 0 R/W WKP0 Edge Select
Value R/W Description
These bits are always read as 1.
0: Falling edge of WKP5(ADTRG) pin input is detected 1: Rising edge of WKP5(ADTRG) pin input is detected
0: Falling edge of WKP4 pin input is detected 1: Rising edge of WKP4 pin input is detected
0: Falling edge of WKP3 pin input is detected 1: Rising edge of WKP3 pin input is detected
0: Falling edge of WKP2 pin input is detected 1: Rising edge of WKP2 pin input is detected
0: Falling edge of WKP1 pin input is detected 1: Rising edge of WKP1 pin input is detected
0: Falling edge of WKP0 pin input is detected 1: Rising edge of WKP0 pin input is detected
Rev. 1.00 Aug. 28, 2006 Page 46 of 400
REJ09B0268-0100
Section 3 Exception Handling

3.2.3 Interrupt Enable Register 1 (IENR1)

IENR1 enables direct transition interrupts, timer A overflow interrupts, and external pin interrupts.
Initial
Bit Bit Name
7 IENDT 0 R/W Direct Transfer Interrupt Enable
6 IENTA 0 R/W Timer A Interrupt Enable
5 IENWP 0 R/W Wakeup Interrupt Enable
4 1  Reserved
3 IEN3 0 R/W IRQ3 Interrupt Enable
2 IEN2 0 R/W IRQ2 Interrupt Enable
1 IEN1 0 R/W IRQ1 Interrupt Enable
0 IEN0 0 R/W IRQ0 Interrupt Enable
Value R/W Description
When this bit is set to 1, direct transition interrupt requests are enabled.
When this bit is set to 1, timer A overflow interrupt requests are enabled.
This bit is an enable bit, which is common to the pins WKP5 to WKP0. When the bit is set to 1, interrupt requests are enabled.
This bit is always read as 1.
When this bit is set to 1, interrupt requests of the IRQ3 pin are enabled.
When this bit is set to 1, interrupt requests of the IRQ2 pin are enabled.
When this bit is set to 1, interrupt requests of the IRQ1 pin are enabled.
When this bit is set to 1, interrupt requests of the IRQ0 pin are enabled.
When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear operations are performed while I = 0, and as a result a conflict arises between the clear instruction and an interrupt request, exception handling for the interrupt will be executed after the clear instruction has been executed.
Rev. 1.00 Aug. 28, 2006 Page 47 of 400
REJ09B0268-0100
Section 3 Exception Handling

3.2.4 Interrupt Flag Register 1 (IRR1)

IRR1 is a status flag register for direct transition interrupts, timer A overflow interrupts, and IRQ3 to IRQ0 interrupt requests.
Initial
Bit Bit Name
7 IRRDT 0 R/W Direct Transfer Interrupt Request Flag
6 IRRTA 0 R/W Timer A Interrupt Request Flag
5, 4 All 1  Reserved
3 IRRI3 0 R/W IRQ3 Interrupt Request Flag
2 IRRI2 0 R/W IRQ2 Interrupt Request Flag
Value R/W Description
[Setting condition]
When a direct transfer is made by executing a SLEEP instruction while DTON in SYSCR2 is set to 1.
[Clearing condition]
When IRRDT is cleared by writing 0
[Setting condition]
When the timer A counter value overflows
[Clearing condition]
When IRRTA is cleared by writing 0
These bits are always read as 1.
[Setting condition] When IRQ3 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI3 is cleared by writing 0
[Setting condition] When IRQ2 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI2 is cleared by writing 0
Rev. 1.00 Aug. 28, 2006 Page 48 of 400
REJ09B0268-0100
Initial
Bit Bit Name
Value R/W Description
1 IRRI1 0 R/W IRQ1 Interrupt Request Flag
[Setting condition] When IRQ1 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI1 is cleared by writing 0
0 IRRl0 0 R/W IRQ0 Interrupt Request Flag
[Setting condition] When IRQ0 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI0 is cleared by writing 0

3.2.5 Wakeup Interrupt Flag Register (IWPR)

IWPR is a status flag register for WKP5 to WKP0 interrupt requests.
Initial
Bit Bit Name
7, 6 All 1
5 IWPF5 0 R/W
4 IWPF4 0 R/W
Value R/W Description
Reserved
These bits are always read as 1.
WKP5 Interrupt Request Flag
[Setting condition] When WKP5 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF5 is cleared by writing 0.
WKP4 Interrupt Request Flag
[Setting condition] When WKP4 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF4 is cleared by writing 0.
Section 3 Exception Handling
Rev. 1.00 Aug. 28, 2006 Page 49 of 400
REJ09B0268-0100
Section 3 Exception Handling
Initial
Bit Bit Name
3 IWPF3 0 R/W
Value R/W Description
WKP3 Interrupt Request Flag
[Setting condition] When WKP3 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF3 is cleared by writing 0.
2 IWPF2 0 R/W
WKP2 Interrupt Request Flag
[Setting condition] When WKP2 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF2 is cleared by writing 0.
1 IWPF1 0 R/W
WKP1 Interrupt Request Flag
[Setting condition] When WKP1 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF1 is cleared by writing 0.
0 IWPF0 0 R/W
WKP0 Interrupt Request Flag
[Setting condition] When WKP0 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF0 is cleared by writing 0.
Rev. 1.00 Aug. 28, 2006 Page 50 of 400
REJ09B0268-0100
Section 3 Exception Handling

3.3 Reset Exception Handling

When the RES pin goes low, all processing halts and this LSI enters the reset. The internal state of the CPU and the registers of the on-chip peripheral modules are initialized by the reset. To ensure that this LSI is reset at power-up, hold the RES pin low until the clock pulse generator output stabilizes. To reset the chip during operation, hold the RES pin low for at least 10 system clock cycles. When the RES pin goes high after being held low for the necessary time, this LSI starts reset exception handling. The reset exception handling sequence is shown in figure 3.1.
The reset exception handling sequence is as follows. However, for the reset exception handling sequence of the product with on-chip power-on reset circuit, refer to section 17, Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits.
1. Set the I bit in the condition code register (CCR) to 1.
2. The CPU generates a reset exception handling vector address (from H'0000 to H'0001), the data in that address is sent to the program counter (PC) as the start address, and program execution starts from that address.

3.4 Interrupt Exception Handling

3.4.1 External Interrupts

As the external interrupts, there are NMI, IRQ3 to IRQ0, and WKP5 to WKP0 interrupts.
(1) NMI Interrupt
NMI interrupt is requested by input signal edge to pin NMI. This interrupt is detected by either rising edge sensing or falling edge sensing, depending on the setting of bit NMIEG in IEGR1.
NMI is the highest-priority interrupt, and can always be accepted without depending on the I bit value in CCR.
(2) IRQ3 to IRQ0 Interrupts
IRQ3 to IRQ0 interrupts are requested by input signals to pins IRQ3 to IRQ0. These four interrupts are given different vector addresses, and are detected individually by either rising edge sensing or falling edge sensing, depending on the settings of bits IEG3 to IEG0 in IEGR1.
When pins IRQ3 to IRQ0 are designated for interrupt input in PMR1 and the designated signal edge is input, the corresponding bit in IRR1 is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by setting bits IEN3 to IEN0 in IENR1.
Rev. 1.00 Aug. 28, 2006 Page 51 of 400
REJ09B0268-0100
Section 3 Exception Handling
(3) WKP5 to WKP0 Interrupts
WKP5 to WKP0 interrupts are requested by input signals to pins WKP5 to WKP0. These six interrupts have the same vector addresses, and are detected individually by either rising edge sensing or falling edge sensing, depending on the settings of bits WPEG5 to WPEG0 in IEGR2.
When pins WKP5 to WKP0 are designated for interrupt input in PMR5 and the designated signal edge is input, the corresponding bit in IWPR is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by setting bit IENWP in IENR1.
Reset cleared
Initial program instruction prefetch
RES
ø
Vector fetch
Internal processing
Internal address bus
Internal read signal
Internal write signal
Internal data bus (16 bits)
(1) Reset exception handling vector address (H'0000) (2) Program start address (3) Initial program instruction
Figure 3.1 Reset Sequence
(2)(1)
(2) (3)
Rev. 1.00 Aug. 28, 2006 Page 52 of 400
REJ09B0268-0100
Section 3 Exception Handling

3.4.2 Internal Interrupts

Each on-chip peripheral module has a flag to show the interrupt request status and the enable bit to enable or disable the interrupt. For timer A interrupt requests and direct transfer interrupt requests generated by execution of a SLEEP instruction, this function is included in IRR1 and IENR1.
When an on-chip peripheral module requests an interrupt, the corresponding interrupt request status flag is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by writing 0 to clear the corresponding enable bit.

3.4.3 Interrupt Handling Sequence

Interrupts are controlled by an interrupt controller.
Interrupt operation is described as follows.
1. If an interrupt occurs while the NMI or interrupt enable bit is set to 1, an interrupt request signal is sent to the interrupt controller.
2. When multiple interrupt requests are generated, the interrupt controller requests to the CPU for the interrupt handling with the highest priority at that time according to table 3.1. Other interrupt requests are held pending.
3. The CPU accepts the NMI and address break without depending on the I bit value. Other interrupt requests are accepted, if the I bit is cleared to 0 in CCR; if the I bit is set to 1, the interrupt request is held pending.
4. If the CPU accepts the interrupt after processing of the current instruction is completed, interrupt exception handling will begin. First, both PC and CCR are pushed onto the stack. The state of the stack at this time is shown in figure 3.2. The PC value pushed onto the stack is the address of the first instruction to be executed upon return from interrupt handling.
5. Then, the I bit of CCR is set to 1, masking further interrupts excluding the NMI and address break. Upon return from interrupt handling, the values of I bit and other bits in CCR will be restored and returned to the values prior to the start of interrupt exception handling.
6. Next, the CPU generates the vector address corresponding to the accepted interrupt, and transfers the address to PC as a start address of the interrupt handling-routine. Then a program starts executing from the address indicated in PC.
Rev. 1.00 Aug. 28, 2006 Page 53 of 400
REJ09B0268-0100
Section 3 Exception Handling
Figure 3.3 shows a typical interrupt sequence where the program area is in the on-chip ROM and the stack area is in the on-chip RAM.
SP – 4
SP – 3
SP – 2
SP – 1
SP (R7)
[Legend] PC
:
Upper 8 bits of program counter (PC)
H
PC
:
Lower 8 bits of program counter (PC)
L
CCR:
Condition code register
SP:
Stack pointer
1.2.PC shows the address of the first instruction to be executed upon return from the interrupt
Notes:
handling routine. Register contents must always be saved and restored by word length, starting from an even-numbered address.
3. Ignored when returning from the interrupt handling routine.
Stack area
Prior to start of interrupt
exception handling
SP (R7)
SP + 1
SP + 2
SP + 3
SP + 4
PC and CCR
saved to stack
CCR
*3
CCR
PCH
PCL
After completion of interrupt
exception handling
Even address
Figure 3.2 Stack Status after Exception Handling

3.4.4 Interrupt Response Time

Table 3.2 shows the number of wait states after an interrupt request flag is set until the first instruction of the interrupt handling-routine is executed.
Table 3.2 Interrupt Wait States
Item States Total
Waiting time for completion of executing instruction* 1 to 23 15 to 37
Saving of PC and CCR to stack 4
Vector fetch 2
Instruction fetch 4
Internal processing 4
Note: * Not including EEPMOV instruction.
Rev. 1.00 Aug. 28, 2006 Page 54 of 400
REJ09B0268-0100
Prefetch instruction of
interrupt-handling routine
Internal
processing
Vector fetch
Stack access
Section 3 Exception Handling
(9)
Internal
processing
(3) (9)(8)(6)(5)
(4) (1) (7) (10)
Instruction
prefetch
Interrupt is
accepted
Interrupt level
decision and wait for
end of instruction
Interrupt
request signal
(1)
ø
Internal
address bus
Internal read
signal
(2)
Internal write
signal
Internal data bus
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector)
(16 bits)
(10) First instruction of interrupt-handling routine
Figure 3.3 Interrupt Sequence
Rev. 1.00 Aug. 28, 2006 Page 55 of 400
REJ09B0268-0100
Section 3 Exception Handling

3.5 Usage Notes

3.5.1 Interrupts after Reset

If an interrupt is accepted after a reset and before the stack pointer (SP) is initialized, the PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset. Since the first instruction of a program is always executed immediately after the reset state ends, make sure that this instruction initializes the stack pointer (example: MOV.W #xx: 16, SP).

3.5.2 Notes on Stack Area Use

When word data is accessed, the least significant bit of the address is regarded as 0. Access to the stack always takes place in word size, so the stack pointer (SP: R7) should never indicate an odd address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W @SP+, Rn) to save or restore register values.

3.5.3 Notes on Rewriting Port Mode Registers

When a port mode register is rewritten to switch the functions of external interrupt pins, IRQ3 to IRQ0, and WKP5 to WKP0, the interrupt request flag may be set to 1.
When switching a pin function, mask the interrupt before setting the bit in the port mode register. After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the interrupt request flag from 1 to 0.
Figure 3.4 shows a port mode register setting and interrupt request flag clearing procedure.
Interrupts masked. (Another possibility
CCR I bit 1
Set port mode register bit
Execute NOP instruction
Clear interrupt request flag to 0
CCR I bit 0
is to disable the relevant interrupt in interrupt enable register 1.)
After setting the port mode register bit, first execute at least one instruction (e.g., NOP), then clear the interrupt request flag to 0.
Interrupt mask cleared
Figure 3.4 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure
Rev. 1.00 Aug. 28, 2006 Page 56 of 400
REJ09B0268-0100

Section 4 Address Break

Section 4 Address Break
The address break simplifies on-board program debugging. It requests an address break interrupt when the set break condition is satisfied. The interrupt request is not affected by the I bit of CCR. Break conditions that can be set include instruction execution at a specific address and a combination of access and data at a specific address. With the address break function, the execution start point of a program containing a bug is detected and execution is branched to the correcting program. Figure 4.1 shows a block diagram of the address break.
Internal address bus
Comparator
BARH BARL
Interrupt
generation
control circuit
BDRH BDRL
[Legend] BARH, BARL: Break address register BDRH, BDRL: Break data register ABRKCR: Address break control register ABRKSR: Address break status register
Figure 4.1 Block Diagram of Address Break

4.1 Register Descriptions

Address break has the following registers.
Address break control register (ABRKCR)
Address break status register (ABRKSR)
Break address register (BARH, BARL)
ABRKCR
ABRKSR
Internal data bus
Comparator
Interrupt
Rev. 1.00 Aug. 28, 2006 Page 57 of 400
REJ09B0268-0100
Section 4 Address Break
Break data register (BDRH, BDRL)

4.1.1 Address Break Control Register (ABRKCR)

ABRKCR sets address break conditions.
Initial
Bit Bit Name
7 RTINTE 1 R/W RTE Interrupt Enable
6
5
4
3
2
1
0
Legend: X: Don't care.
CSEL1
CSEL0 0 0
ACMP2
ACMP1
ACMP0
DCMP1
DCMP0 0 0
Value R/W Description
When this bit is 0, the interrupt immediately after executing RTE is masked and then one instruction must be executed. When this bit is 1, the interrupt is not masked.
R/W
R/W
0
0
0
R/W
R/W
R/W
R/W
R/W
Condition Select 1 and 0
These bits set address break conditions.
00: Instruction execution cycle
01: CPU data read cycle
10: CPU data write cycle
11: CPU data read/write cycle
Address Compare Condition Select 2 to 0
These bits set the comparison condition between the address set in BAR and the internal address bus.
000: Compares 16-bit addresses
001: Compares upper 12-bit addresses
010: Compares upper 8-bit addresses
011: Compares upper 4-bit addresses
1XX: Reserved (setting prohibited)
Data Compare Condition Select 1 and 0
These bits set the comparison condition between the data set in BDR and the internal data bus.
00: No data comparison
01: Compares lower 8-bit data between BDRL and data
bus
10: Compares upper 8-bit data between BDRH and data
bus
11: Compares 16-bit data between BDR and data bus
Rev. 1.00 Aug. 28, 2006 Page 58 of 400
REJ09B0268-0100
Section 4 Address Break
When an address break is set in the data read cycle or data write cycle, the data bus used will depend on the combination of the byte/word access and address. Table 4.1 shows the access and data bus used. When an I/O register space with an 8-bit data bus width is accessed in word size, a byte access is generated twice. For details on data widths of each register, see section 19.1, Register Addresses (Address Order).
Table 4.1 Access and Data Bus Used
Word Access Byte Access Even Address Odd Address Even Address Odd Address
ROM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits
RAM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits
I/O register with 8-bit data bus width
I/O register with 16-bit data bus width
Upper 8 bits Upper 8 bits Upper 8 bits Upper 8 bits
Upper 8 bits Lower 8 bits

4.1.2 Address Break Status Register (ABRKSR)

ABRKSR consists of the address break interrupt flag and the address break interrupt enable bit.
Initial
Bit Bit Name
7 ABIF 0 R/W Address Break Interrupt Flag
6 ABIE 0 R/W Address Break Interrupt Enable
5 to 0 All 1 Reserved
Rev. 1.00 Aug. 28, 2006 Page 59 of 400
REJ09B0268-0100
Value R/W Description
[Setting condition]
When the condition set in ABRKCR is satisfied
[Clearing condition]
When 0 is written after ABIF=1 is read
When this bit is 1, an address break interrupt request is enabled.
These bits are always read as 1.
Section 4 Address Break

4.1.3 Break Address Registers (BARH, BARL)

BARH and BARL are 16-bit read/write registers that set the address for generating an address break interrupt. When setting the address break condition to the instruction execution cycle, set the first byte address of the instruction. The initial value of this register is H'FFFF.

4.1.4 Break Data Registers (BDRH, BDRL)

BDRH and BDRL are 16-bit read/write registers that set the data for generating an address break interrupt. BDRH is compared with the upper 8-bit data bus. BDRL is compared with the lower 8­bit data bus. When memory or registers are accessed by byte, the upper 8-bit data bus is used for even and odd addresses in the data transmission. Therefore, comparison data must be set in BDRH for byte access. For word access, the data bus used depends on the address. See section
4.1.1, Address Break Control Register (ABRKCR), for details. The initial value of this register is undefined.

4.2 Operation

When the ABIF and ABIE bits in ABRKSR are set to 1, the address break function generates an interrupt request to the CPU. The ABIF bit in ABRKSR is set to 1 by the combination of the address set in BAR, the data set in BDR, and the conditions set in ABRKCR. When the interrupt request is accepted, interrupt exception handling starts after the instruction being executed ends. The address break interrupt is not masked by the I bit in CCR of the CPU.
Rev. 1.00 Aug. 28, 2006 Page 60 of 400
REJ09B0268-0100
Section 4 Address Break
Figures 4.2 show the operation examples of the address break interrupt setting.
When the address break is specified in instruction execution cycle
Register setting
• ABRKCR = H'80
• BAR = H'025A
NOP
instruc-
tion
prefetch
φ
Address bus
Interrupt request
0258
Program
0258
NOP
025A
*
NOP
025C
MOV.W @H'025A,R0
0260
NOP
0262
NOP
:
:
NOP
instruc-
prefetch
MOV
instruc-
tion
tion 1
prefetch
025A 025C 025E SP-2 SP-4
Interrupt acceptance
MOV
instruc-
tion 2
prefetch
Figure 4.2 Address Break Interrupt Operation Example (1)
When the address break is specified in the data read cycle
Register setting
• ABRKCR = H'A0
• BAR = H'025A
Program
0258
NOP
025A
NOP
025C
*
MOV.W @H'025A,R0
0260
NOP
0262
NOP
:
:
Underline indicates the address to be stacked.
Internal
processing
Underline indicates the address to be stacked.
Stack save
φ
Address bus
Interrupt request
MOV
instruc-
tion 1
prefetch
025C
MOV
instruc-
tion 2
prefetch
NOP
instruc-
tion
prefetch
025E 0260 025A 0262 0264 SP-2
MOV
instruc-
tion
execution
NOP
instruc-
tion
prefetch
Interrupt acceptance
Next
instru-
ction
prefetch
Internal
processing
Stack
save
Figure 4.2 Address Break Interrupt Operation Example (2)
Rev. 1.00 Aug. 28, 2006 Page 61 of 400
REJ09B0268-0100
Section 4 Address Break
Rev. 1.00 Aug. 28, 2006 Page 62 of 400
REJ09B0268-0100

Section 5 Clock Pulse Generators

Section 5 Clock Pulse Generators
The clock pulse generator (CPG) consists of a system clock generating circuitry, a subclock generating circuitry, and two prescalers. The system clock generating circuitry includes an external clock oscillator, a duty correction circuit, an on-chip oscillator, an RC clock divider, a clock select circuit, and a system clock divider. The subclock generating circuitry includes a subclock oscillator, and a subclock divider. The CPG can function as a clock generating circuitry itself or in combination with an external oscillator. Figure 5.1 shows a block diagram of the clock pulse generator.
OSC1
OSC2
X
1
X
2
External
clock
oscillator
On-chip oscillator
System clock generating circuitry
Subclock oscillator
Subclock generating circuitry
φ
R
OSC
OSC
Duty
correction
circuit
RC clock divider
φ
(fW)
φ
OSC
Clock
R
OSC
R
/2
OSC
R
/4
OSC
W
select circuit
φ
RC
φ
Subclock
divider
System
clock
divider
φ
W
φ
W
φW/8
φ φ/8
φ
φ/16 φ/32
SUB
φ/2 to φ/8192
/8
φ
W
to
φ
/128
W
φ/64
/2
/4
Prescaler S
(13 bits)
φ
Prescaler W
(5 bits)
Figure 5.1 Block Diagram of Clock Pulse Generators
The system clock (φ) and subclock (φ
) are basic clocks on which the CPU and on-chip
SUB
peripheral modules operate. The system clock is divided into from φ/2 to φ/8192 by prescaler S. The subclock is divided into from φ
/8 to φ
W
/128 by prescaler W. These divided clocks are
W
supplied to respective peripheral modules.
Rev. 1.00 Aug. 28, 2006 Page 63 of 400
REJ09B0268-0100
Section 5 Clock Pulse Generators

5.1 Features

Choice of two clock sources
On-chip oscillator clock
Clock by an external oscillator output
Choice of two types of RC oscillation frequency by the user software
16 MHz
20 MHz
Frequency trimming
Since the initial frequency of the on-chip oscillator is within the range of two frequencies shown above, it is normally unnecessary to trim the frequency. It is, however, still possible to adjust it by rewriting the trimming registers.
Backup of the external oscillation halt
This system detects the external oscillator halt. If detected, the system clock source is automatically switched to the on-chip oscillator clock.
Interrupt can be requested to the CPU when the system clock is switched from the external
clock to the on-chip oscillator clock.

5.2 Register Descriptions

Figure 5.3 shows a typical method of connecting a crystal resonator. An AT-cut parallel-resonance crystal resonator should be used. Figure 5.4 shows the equivalent circuit of a crystal resonator. A resonator having the characteristics given in table 5.1 should be used.
The CPG has the following registers.
RC control register (RCCR)
RC trimming data protect register (RCTRMDPR)
RC trimming data register (RCTRMDR)
Clock control/status register (CKCSR)
Rev. 1.00 Aug. 28, 2006 Page 64 of 400
REJ09B0268-0100
Section 5 Clock Pulse Generators

5.2.1 RC Control Register (RCCR)

RCCR controls the on-chip oscillator.
Initial
Bit Bit Name
7 RCSTP 0 R/W On-Chip Oscillator Standby
6 FSEL 1 R/W Frequency Select for On-chip Oscillator
5 VCLSEL 0 R/W Power Supply Select for On-chip Oscillator
4 to 2 All 0  Reserved
1
0
RCPSC1
RCPSC0 1 0
Value R/W Description
The on-chip oscillator standby state is entered by setting this bit to 1.
0: 16 MHz
1: 20 MHz
0: Selects VBGR
1: Selects VCL
When the VCL power is selected, the accuracy of the on­chip oscillator frequency cannot be guaranteed.
These bits are always read as 0.
R/W
R/W
Division Ratio Select for On-chip Oscillator
The division ratio of R bit.
These bits can be written to only when the CKSTA bit in CKCSR is 0.
0X: R
10: R
11: R
(not divided)
OSC
/2
OSC
/4
OSC
changes right after rewriting this
OSC
Rev. 1.00 Aug. 28, 2006 Page 65 of 400
REJ09B0268-0100
Section 5 Clock Pulse Generators

5.2.2 RC Trimming Data Protect Register (RCTRMDPR)

RCTRMDPR controls RCTRMDPR itself and writing to RCTRMDR. Use the MOV instruction to rewrite this register. Bit manipulation instruction cannot change the settings.
Initial
Bit Bit Name
7 WRI 1 W Write Inhibit
6 PRWE 0 R/W Protect Information Write Enable
5 LOCKDW 0 R/W Trimming Data Register Lock Down
Value R/W Description
Only when writing 0 to this bit, this register can be written to. This bit is always read as 1.
Bits 5 and 4 can be written to when this bit is set to 1.
[Setting condition]
When writing 0 to the WRI bit and writing 1 to the
PRWE bit
[Clearing conditions]
Reset
When writing 0 to the WRI bit and writing 0 to the
PRWE bit
The RC trimming data register (RCTRMDR) cannot be written to when this bit is set to 1. Once this bit is set to 1, this register cannot be written to until a reset is input even if 0 is written to this bit.
[Setting condition]
When writing 0 to the WRI bit and writing 1 to the
LOCKDW bit while the PRWE bit is 1
[Clearing condition]
Reset
Rev. 1.00 Aug. 28, 2006 Page 66 of 400
REJ09B0268-0100
Section 5 Clock Pulse Generators
Initial
Bit Bit Name
Value R/W Description
4 TRMDRWE 0 R/W Trimming Data Register Write Enable
This register can be written to when the LOCKDW bit is 0 and this bit is 1.
[Setting condition]
When writing 0 to the WRI bit while writing 1 to the
TRMDRWE bit while the PRWE bit is 1
[Clearing conditions]
Reset
When writing 0 to the WRI bit and writing 0 to the
TRMDRWE bit while the PRWE bit is 1
3 to 0 All 1  Reserved
These bits are always read as 1.

5.2.3 RC Trimming Data Register (RCTRMDR)

RCTRMDR stores the trimming data of the on-chip oscillator frequency (FSEL = 1, 20 MHz).
Initial
Bit Bit Name
7 TRMD7 (0)* R/W
6 TRMD6 (0)* R/W
5 TRMD5 (0)* R/W
4 TRMD4 (0)* R/W
3 TRMD3 (0)* R/W
2 TRMD2 (0)* R/W
1 TRMD1 (0)* R/W
0 TRMD0 (0)* R/W
Value R/W Description
Trimming Data (FSEL = 1, 20 MHz)
The trimming data is loaded from the flash memory to this register right after a reset.
The on-chip oscillator clock (FSEL = 1, 20 MHz) can be trimmed by changing these bits.
The frequency of the on-chip oscillator clock changes right after writing these bits. These bits are initialized to H'00.
Changes in frequency are shown below (bit TRMD7 is a sign bit).
(Min.) H'80 ← … ← H'FF ← … ← H'00 → … →H'01 → … H'7F (Max.)
Note: * These values are initialized to the trimming data loaded from the flash memory.
Rev. 1.00 Aug. 28, 2006 Page 67 of 400
REJ09B0268-0100
Section 5 Clock Pulse Generators

5.2.4 Clock Control/Status Register (CKCSR)

CKCSR selects the port C function, controls switching the system clocks, and indicates the system clock state.
Initial
Bit Bit Name
7
6
5 OSCBAKE 0 R/W External Clock Backup Enable
PMRC1
PMRC0 0 0
Value R/W Description
R/W
R/W
Port C Function Select 1 and 2 PMRC1 PMRC0 PC1 PC0
0 0 I/O I/O
1 0 CLKOUT I/O
0 1 Open OSC1 (external
1 1 OSC2 OSC1
0: External clock backup disabled
1: External clock backup enabled
The external oscillation detecting circuit is enabled when this bit is 1. When the external oscillator halt is detected while this LSI operates on the external input signal, the system clock source is automatically switched to the on­chip oscillator regardless of the value of bit 4 in this register.
Note: The external oscillation detecting circuit operates
on the on-chip oscillator clock. When this bit is set to 1, do not set the on-chip oscillator to the standby mode by the RCSTP bit in RCCR.
clock input)
Rev. 1.00 Aug. 28, 2006 Page 68 of 400
REJ09B0268-0100
Section 5 Clock Pulse Generators
Initial
Bit Bit Name
Value R/W Description
4 OSCSEL 0 R/W LSI Operating Clock Select
When OSCBAKE = 0
This bit is used to forcibly select the system clock of this LSI.
0: The on-chip oscillator clock selected as the system
clock source
1: The external input selected as the system clock source
When OSCBAKE = 1
This bit is used to switch the on-chip oscillator clock to the external clock. While this LSI is operating on the on-chip oscillator clock, setting this bit to 1 switches the system clocks to the external clock.
[Setting condition]
When 1 is written to this bit while CKSWIF = 0
[Clearing conditions]
When 0 is written to this bit
When the external oscillator halt is detected while
OSCBAKE = 1
3 CKSWIE 0 R/W Clock Switching Interrupt Enable
Setting this bit to 1 enables the clock switching interrupt request.
2 CKSWIF 0 R/W Clock Switching Interrupt Request Flag
[Setting condition]
When the external clock is switched to the on-chip
oscillator clock as the system clock source
[Clearing condition]
When writing 0 after reading as 1
1 OSCHLT 1 R External Oscillator Halt Detecting Flag
When OSCBAKE = 1
This bit indicates the checking result of the external oscillator state.
0: External oscillator is running
1: External oscillator is halted.
When OSCBAKE = 0
This bit is non-deterministic; always read as 1.
Rev. 1.00 Aug. 28, 2006 Page 69 of 400
REJ09B0268-0100
Section 5 Clock Pulse Generators
Initial
Bit Bit Name
Value R/W Description
0 CKSTA 0 R LSI Operating Clock Status
0: This LSI operates on the on-chip oscillator clock.
1: This LSI operates on the external clock.

5.3 System Clock Select Operation

Figure 5.2 shows the state transition of the system clock.
LSI operates on on-chip oscillator clock
Reset state
On-chip oscillator: Halted External oscillator: Operated
Note: * Conditions for the state transition are as follows:
When the external oscillator halt is detected while the backup function is enabled
• When the external clock is switched to the on-chip oscillator clock by user software while the backup function is disabled
Reset release
Oscillator halted
Oscillator operated
On-chip oscillator: Operated External oscillator: Halted
*
On-chip oscillator: Operated External oscillator: Operated
LSI operates on external oscillator
Switching to external clock
Figure 5.2 State Transition of System Clock
Rev. 1.00 Aug. 28, 2006 Page 70 of 400
REJ09B0268-0100
Loading...