REEZ E 1100A User Manual

Software

◢ Standard Generic Attribute Profile (GATT) ◢ Android APP source code support ◢ Apple iOS APP source code support ◢ Control easily by AT commands ◢ Firmware upgrade over the UART interface

Certifications to Be Approved

◢ FCC CFR47 Part 15 (US)

Highlights

◢ Bluetooth v4.0 with Bluetooth Low Energy

(Bluetooth Smart)

◢ High-Performance and Low-Power TI CC2541

industry-standard chip

◢ Designed with PCB integrated antenna,

suitable for SMT

◢ Metal cover against EMI interference ◢ Transmitting, Receiving, Wake-up by only 2 UART pins ◢ Bluetooth Peer-to-Peer (P2P) Connection

Applications

◢ Smart phone/Tablet accessories ◢ Remote monitoring and control ◢ Indoor positioning

E-1100A

2.4GHz Bluetooth

Low Energy Module

with Integrated Antenna

Data Sheet

Specification

Item

Min.

Typical

Max.

Unit

Condition

Operation Voltage

2 3.6

V

VDD

RF Output Power

-23 0 0

dBm

Power Status A

8.5

mA

UART function is available BLE is broadcasting

Power Status B

8.4

mA

UART function is available No BLE broadcast

Power Status C

0.5

mA

UART function is sleeping BLE is broadcasting

Power Status D

1

uA

UART function is sleeping No BLE broadcast

Wake Up Time

30

ms

From Power Status C/D to A/B

Baud Rate

9600

57600

bps

RF Frequency Range

2379

2496

MHz

Communication Range

10 M

Open Space

Operating Temperature

-40

25

+85

˚C

Antenna

Embedded PCB Antenna

Dimensions

16.7mm*13mm*2.2mm

Weight

0.8 g

RYB070I RESET AT+PWMODE=1

Broadcast UART FUNCTION

POWER STATUS A 8.5mA

POWER STATUS B 8.4mA

POWER STATUS C 0.5mA

UART FUNCTION

Broadcast

UART FUNCTION

AT+PWMODE=3

AT+PWMODE=2

AT+CFUN=0

Broadcast

UART FUNCTION

AT+PWMODE=4,001,030

Broadcast

POWER STATUS D 1uA

Broadcast

30sec

1Sec

Broadcast

1Sec

30sec

Broadcast

circle

UART FUNCTION

AT+PWMODE=2

POWER STATUS A 8.5mA

POWER STATUS B 8.4mA

POWER STATUS C 0.5mA

POWER STATUS D 1uA

POWER STATUS A 8.5mA

POWER STATUS B 8.4mA

POWER STATUS C 0.5mA

POWER STATUS D 1uA

POWER STATUS A 8.5mA

POWER STATUS B 8.4mA

POWER STATUS C 0.5mA

POWER STATUS D 1uA

RXD TRIGGER

5sec

30sec

1Sec 1Sec

30sec

circle

5sec

1Sec

Function

Available Power Mode and Power Consumption Status

2

Wake Up UART Functions

Ux RYB070I

NC

5

NC

14

TXD

8

RESET_N

4

NC11NC12NC

13

VDD

29

GND

16

VDD

3

NC

6

GND

2

RXD

7

NC

10

NC

28

NC

9

GND

30

GND

15

NC17NC18NC19NC20NC

21

NC

27

NC

26

NC

25

NC

24

NC

23

NC

22

RF(External Antenna Version Used)

1

When E-1100A is on Power Status C or Power Status D, users could use pin7 RXD to wake up the UART function. It will need some time to work normally after leaving low energy mode. In the process of waking up the UART function, the AT command may not be recognized by E-1100A, so the data of former bytes may be garbled. Users just need to send the commands again.

When E-1100A is on PWMODE =2 / 3 / 4, the status will be as follows after trigger by the RXD (pin7)：

PWMODE =2 : E-1100A will become PWMODE =1 from PWMODE =2.

Send PWMODE =2 commands again to get back to power saving status.

PWMODE =3 : E-1100A will become Power Status A. It will return to Power Status C if there's no any

communication on UART after 5 seconds.

PWMODE =4 : E-1100A will become Power Status A, but will still do BLE broadcast and sleep on

schedule as the setting. When it is on Power Status A, it will leave PWMODE=4 after

sending PWMODE=1.

Pin Description

3

Name

I/O

Condition

1

RF External Antenna Version Used

2

GND

-

Ground

3

VDD

I

Power Supply

4

RESET_N

I

Low Reset

5

NC - Leave Unconnected.

6

NC - Leave Unconnected.

7

RXD

I

UART Data Input

8

TXD

O

UART Data Output

9

NC - Leave Unconnected.

10

NC - Leave Unconnected.

11

NC - Leave Unconnected.

12

NC - Leave Unconnected.

13

NC - Leave Unconnected.

14

NC - Leave Unconnected.

15

GND

-

Ground

16

GND

-

Ground

17

NC - Leave Unconnected.

18

NC - Leave Unconnected.

19

NC - Leave Unconnected.

20

NC - Leave Unconnected.

21

NC - Leave Unconnected.

22

NC - Leave Unconnected.

23

NC - Leave Unconnected.

24

NC - Leave Unconnected.

25

NC - Leave Unconnected.

26

NC - Leave Unconnected.

27

NC - Leave Unconnected.

28

NC - Leave Unconnected.

29

VDD

I

Power Supply

30

GND

-

Ground

4

Application Circuit

RESET_N

RXD

TXD

Processor

C4 1nF

U1 RYB070I

NC

5

NC

14

TXD

8

RESET_N

4

NC11NC12NC

13

VDD

29

GND

16

VDD

3

NC

6

GND

2

RXD

7

NC

10

NC

28

NC

9

GND

30

GND15NC17NC18NC19NC20NC

21

NC

27

NC

26

NC

25

NC

24

NC

23

NC

22

RF(External Antenna Version Used)

1

+

C2 22uF

R

VDD

R1 10K

C1

0.1uF

C3

0.1uF

TXD

VDD

TI CC2541

BLE SOC

32768Hz

Crystal

32MHz

Crystal

RF Match Schematic

RESET

TXD

RXD

19 GPIO

Block Diagram

5

Reflow Soldering

0

50

100

150

200

250

0 50 100 150 200 250 300

座標軸標題

Y 值

[°C]

217

Max 3°C/s

Liquidus temperature

60-120s

End Temp 150-200°C

40-60s

Max 4°C/s

Typical Leadfree Soldering Profile

Preheat

Heating

Cooling

Elapsed Time

Recommended soldering profile

Peak Temp245°C

Consider the "IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes, published 2001.

Preheat phase

Initial heating of component leads and balls. Residual humidity will be dried out. Please note that this preheat phase will not replace prior baking procedures.

◢ Temperature rise rate: max. 3 °C/s If the temperature rise is too rapid in the preheat phase it may

cause excessive slumping.

◢ Time: 60 - 120 s If the preheat is insufficient, rather large solder balls tend to be generated.

Conversely, if performed excessively, fine balls and large balls will be generated in clusters.

◢ End Temperature: 150 - 200 °C If the temperature is too low, non-melting tends to be caused in

areas containing large heat capacity.

Heating/ Reflow phase

The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump of the paste could become worse.

◢ Limit time above 217 °C liquidus temperature: 40 - 60 s ◢ Peak reflow temperature: 245 °C

Cooling phase

A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.

◢ Temperature fall rate: max 4 °C/s To avoid falling off, the REEZ E-1100A module should be placed

on the topside of the motherboard during soldering.

6

REEZ E 1100A User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual