MI3
Miniature Infrared Sensor
Operating Instructions
Rev. G4 Aug/2022
4652494
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WARRANTY
The manufacturer warrants this product to be free from defects in material and workmanship under normal use
and service for the period of two years from date of purchase, except as hereinafter provided. This warranty extends
only to the original purchaser (a purchase from the manufacturer or a licensed distributor of the manufacturer is
an original purchase). This warranty shall not apply to fuses, batteries, or any product which has been subject to
misuse, neglect, accident, or abnormal conditions of operation.
In the event of failure of a product covered by this warranty, the manufacturer will repair the instrument when it
is returned by the purchaser, freight prepaid, to an authorized Service Facility within the applicable warranty
period, provided manufacturer’s examination discloses to its satisfaction that the product was defective. The
manufacturer may, at its option, replace the product in lieu of repair. With regard to any covered product returned
within the applicable warranty period, repairs or replacement will be made without charge and with return freight
paid by the manufacturer, unless the failure was caused by misuse, neglect, accident, or abnormal conditions of
operation or storage, in which case repairs will be billed at a reasonable cost. In such a case, an estimate will be
submitted before work is started, if requested.
THE FOREGOING WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED,
INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS, OR
ADEQUACY FOR ANY PARTICULAR PURPOSE OR USE. THE MANUFACTURER SHALL NOT BE LIABLE
FOR ANY SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER IN CONTRACT, TORT,
OR OTHERWISE.
SOFTWARE WARRANTY
The manufacturer does not warrant that the software described herein will function properly in every hardware
and software environment. This software may not work in combination with modified or emulated versions of
Windows operating environments, memory-resident software, or on computers with inadequate memory. The
manufacturer warrants that the program disk is free from defects in material and workmanship, assuming normal
use, for a period of one year. Except for this warranty, the manufacturer makes no warranty or representation,
either expressed or implied, with respect to this software or documentation, including its quality, performance,
merchantability, or fitness for a particular purpose. As a result, this software and documentation are licensed “as
is,” and the licensee (i.e., the user) assumes the entire risk as to its quality and performance. The liability of the
manufacturer under this warranty shall be limited to the amount paid by the User. In no event shall the
manufacturer be liable for any costs including but not limited to those incurred as a result of lost profits or revenue,
loss of use of the computer software, loss of data, the cost of substitute software, claims by third parties, or for other
similar costs. The manufacturer’s software and documentation are copyrighted with all rights reserved. It is illegal
to make copies for another person.
Specifications subject to change without notice.
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COMPLIANCE STATEMENT
The device complies with the requirements of the European Directives:
EC – Directive 2014/30/EU – EMC
EC – Directive 2014/35/EU – low voltage
valid for device: Ex Power Supply xxxMI3ACIS
EC – Directive 2011/65/EU – RoHS Compliance
amended by Directive (EU) 2015/863
EC – Directive 2014/34/EU – ATEX
valid for device: xxxMI3xxxISx, xxxMI330xxxISx, xxxMI3100xxxISx,
xxxMI3xxLTHISx, xxxMI3ACIS
EC – Directive Nr. 1907/2006 – REACH
amended by Directive (EU) 2020/2096
EN 61326-1: 2013 Electrical measurement, control and laboratory devices -
Electromagnetic susceptibility (EMC)
EN 61558-1: 2006 Safety Requirements for power transformers, power supplies, reactors and
similar products (low voltage)
EN 61558-2-6: 2010 Safety Requirements for power transformers, power supplies, reactors and
similar products for use up to 1.1 kV (low voltage)
EN 50581: 2012 Technical documentation for the evaluation of electrical products with respect
to restriction of hazardous substances (RoHS)
EN 60079-0: 2019 Risk of explosion – part 0: general requirements (ATEX)
EN 60079-11: 2012 Risk of explosion – part 11: device protection by intrinsic safety “I” (ATEX)
Conforms to UK Conformity. Except for units with intrinsically-safe rating.
Electromagnetic Compatibility Applies to use in Korea only. Class A
Equipment (Industrial Broadcasting & Communication Equipment)
This product meets requirements for industrial (Class A) electromagnetic wave equipment and
the seller or user should take notice of it. This equipment is intended for use in business
environments and is not to be used in homes.
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Content
COMPLIANCE STATEMENT .....................................................................................................................5
CONTENT ......................................................................................................................................................6
1 SAFETY INSTRUCTIONS ...................................................................................................................... 11
2 DESCRIPTION ......................................................................................................................................... 12
2.1OVERVIEW COMM BOXES ······················································································································ 13
3 TECHNICAL DATA ................................................................................................................................. 14
3.1MEASUREMENT SPECIFICATION ············································································································ 14
3.1.1 Sensing Heads .............................................................................................................................. 14
3.1.2 Comm Box .................................................................................................................................... 15
3.1.2.1 Comm Box (metal) .............................................................................................................................. 15
3.1.2.2 Comm Box (DIN) ................................................................................................................................ 15
3.2OPTICAL CHARTS·································································································································· 16
3.3ELECTRICAL SPECIFICATION ················································································································· 17
3.3.1 Comm Box, all models ................................................................................................................... 17
3.3.2 Comm Box (metal) ........................................................................................................................ 17
3.3.3 Comm Box (DIN 6TE, analog) ...................................................................................................... 17
3.4ENVIRONMENTAL SPECIFICATION········································································································· 18
3.4.1 Sensing Head ................................................................................................................................ 18
3.4.2 Comm Box (metal) ........................................................................................................................ 18
3.4.3 Comm Box (DIN) ......................................................................................................................... 19
3.4.4 LTH Electronics............................................................................................................................ 19
3.5DIMENSIONS ········································································································································· 19
3.5.1 Sensing Head LT, G5 .................................................................................................................... 19
3.5.2 Sensing Head LTH ....................................................................................................................... 19
3.5.3 Sensing Head 1M, 2M .................................................................................................................. 20
3.5.4 Comm Box (metal) ........................................................................................................................ 20
3.5.5 Comm Box (DIN) ......................................................................................................................... 21
3.6SCOPE OF DELIVERY ······························································································································ 21
3.6.1 Sensing Head ................................................................................................................................ 21
3.6.2 Comm Box .................................................................................................................................... 21
4 BASICS ...................................................................................................................................................... 22
4.1MEASUREMENT OF INFRARED TEMPERATURE ······················································································· 22
4.2EMISSIVITY OF TARGET OBJECT ············································································································· 22
4.3AMBIENT TEMPERATURE······················································································································· 22
4.4ATMOSPHERIC QUALITY ······················································································································· 22
4.5ELECTRICAL INTERFERENCE ·················································································································· 23
5 INSTALLATION ...................................................................................................................................... 25
5.1POSITIONING········································································································································· 25
5.1.1 Distance to Object ........................................................................................................................ 25
5.2INSTALLATION SCHEMES ······················································································································ 25
5.2.1 Comm Box (metal) ........................................................................................................................ 25
5.2.2 Comm Box (DIN) ......................................................................................................................... 26
5.3WIRING, HEAD CABLE ·························································································································· 26
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5.3.1 Comm Box (metal) ........................................................................................................................ 27
5.3.2 Comm Box (DIN) .......................................................................................................................... 27
5.4WIRING, TERMINAL ······························································································································ 28
5.4.1 Comm Box (metal) ........................................................................................................................ 28
5.4.2 Comm Box (DIN 3TE) .................................................................................................................. 29
5.4.3 Comm Box (DIN 4 TE) ................................................................................................................. 30
5.4.4 Comm Box (DIN 6 TE) ................................................................................................................. 31
5.4.5 EMI Resistance for Comm Box (DIN) ........................................................................................... 34
5.5POWER ON PROCEDURE ······················································································································· 35
5.5.1 One Head System .......................................................................................................................... 35
5.5.2 Multiple Heads – Random Address Assignment ............................................................................ 35
5.5.3 Multiple Heads – User Controlled Address Assignment ................................................................ 35
5.6USB ······················································································································································ 36
5.7FIELDBUS ·············································································································································· 38
5.7.1 Addressing .................................................................................................................................... 38
5.7.2 RS485 based Installations .............................................................................................................. 38
6 OUTPUTS ................................................................................................................................................. 39
6.1ANALOG OUTPUT OUT1 ······················································································································ 39
6.2ANALOG OUTPUT OUT2 ······················································································································ 39
6.3ANALOG OUTPUTS OUT1 - OUT4 ······································································································· 40
6.4ALARM OUTPUT RELAY ····················································································································· 40
6.5THERMOCOUPLE OUTPUT TC ··············································································································· 41
7 INPUTS ..................................................................................................................................................... 42
7.1EMISSIVITY (ANALOG) ·························································································································· 42
7.2EMISSIVITY (DIGITAL) ··························································································································· 43
7.3BACKGROUND TEMPERATURE COMPENSATION ··················································································· 43
7.4TRIGGER/HOLD ···································································································································· 45
7.5LASER SWITCHING································································································································ 46
8 OPERATION ............................................................................................................................................ 47
8.1CONTROL PANEL·································································································································· 47
8.2<HEAD> PAGE ······································································································································ 49
8.3<BOX SETUP> PAGE ······························································································································ 50
8.4<BOX INFO> PAGE ································································································································ 52
8.5POST PROCESSING ································································································································ 52
8.5.1 Averaging ..................................................................................................................................... 52
8.5.2 Peak Hold ...................................................................................................................................... 53
8.5.3 Valley Hold ................................................................................................................................... 53
8.5.4 Advanced Peak Hold ..................................................................................................................... 54
8.5.5 Advanced Valley Hold ................................................................................................................... 55
8.5.6 Advanced Peak Hold with Averaging ............................................................................................ 55
8.5.7 Advanced Valley Hold with Averaging .......................................................................................... 55
9 OPTIONS .................................................................................................................................................. 56
9.1WATER COOLED HOUSING (1M, 2M HEADS) ······················································································· 56
9.1.1 Avoidance of Condensation............................................................................................................ 57
9.2INTRINSIC SAFETY ································································································································ 58
9.2.1 Sensing Heads ............................................................................................................................... 58
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9.2.2 Ex Power Supply .......................................................................................................................... 59
9.2.2.1 Ex Power Supply for non-hazardous areas........................................................................................ 59
9.2.3 Installation ................................................................................................................................... 60
9.2.4 Mains Supply ............................................................................................................................... 62
10 ACCESSORIES ....................................................................................................................................... 64
10.1 ACCESSORIES (ALL MODELS) ··············································································································· 64
10.1.1 Multi-Channel Box ..................................................................................................................... 64
10.1.2 USB/RS485 Adapter ................................................................................................................... 67
10.2 ACCESSORIES (LT, G5 HEADS) ············································································································ 68
10.2.1 Adjustable Mounting Bracket ..................................................................................................... 69
10.2.2 Fixed Mounting Bracket ............................................................................................................. 70
10.2.3 Air Purge Jacket .......................................................................................................................... 70
10.2.4 Air Cooling System ..................................................................................................................... 71
10.2.5 Right Angle Mirror .................................................................................................................... 75
10.2.6 Protective Windows .................................................................................................................... 76
10.2.7 Close Focus Lens ......................................................................................................................... 76
10.3 ACCESSORIES (1M, 2M HEADS) ·········································································································· 78
10.3.1 Fixed Mounting Bracket ............................................................................................................. 79
10.3.2 Adjustable Mounting Bracket ..................................................................................................... 80
10.3.3 Isolation Kit ................................................................................................................................ 81
10.3.4 Air Purge Collar ......................................................................................................................... 82
10.3.5 Right Angle Mirror .................................................................................................................... 82
10.3.6 Protective Window...................................................................................................................... 83
11 MAINTENANCE .................................................................................................................................... 84
11.1 TROUBLESHOOTING MINORPROBLEMS······························································································· 84
11.2 FAIL-SAFE OPERATION ······················································································································· 84
11.3 CLEANING THE LENS ·························································································································· 85
11.4 SENSING HEAD EXCHANGE ················································································································ 86
12 DATATEMP MULTIDROP SOFTWARE ............................................................................................ 87
12.1 SOFTWARE FEATURES ·························································································································· 87
12.2 PC REQUIREMENTS ····························································································································· 87
12.3 USB DRIVER INSTALLATION ··············································································································· 87
12.4 SOFTWARE LAUNCH ··························································································································· 87
13 RS485 ........................................................................................................................................................ 88
13.1 WIRING ··············································································································································· 88
13.1.1 Comm Box (metal) ...................................................................................................................... 88
13.1.2 Comm Box (DIN) ....................................................................................................................... 89
13.2 ASCII PROGRAMMING ························································································································ 89
14 PROFIBUS ............................................................................................................................................... 90
14.1 WIRING ··············································································································································· 90
14.1.1 Comm Box (metal) ...................................................................................................................... 90
14.1.2 Comm Box (DIN) ....................................................................................................................... 92
14.2 PROGRAMMING··································································································································· 93
14.2.1 Parameter Data ........................................................................................................................... 93
14.2.2 Input Data .................................................................................................................................. 94
14.2.3 Output Data ............................................................................................................................... 95
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14.2.4 Diagnose Data............................................................................................................................. 95
15 MODBUS ................................................................................................................................................ 98
15.1 WIRING ·············································································································································· 98
15.1.1 Comm Box (metal)....................................................................................................................... 98
15.1.2 Comm Box (DIN) ........................................................................................................................ 99
15.2 PROGRAMMING ································································································································ 100
15.2.1 Supported Functions ................................................................................................................. 100
15.2.2 Parameter Data ......................................................................................................................... 100
15.2.2.1 Box Parameter .................................................................................................................................. 100
15.2.2.2 Head Parameter ............................................................................................................................... 102
16 ETHERNET ........................................................................................................................................... 104
16.1 WIRING ············································································································································ 104
16.1.1 Comm Box (metal)..................................................................................................................... 104
16.1.2 Comm Box (DIN) ...................................................................................................................... 104
16.2 ADDRESSING ···································································································································· 105
16.2.1 MI3 ........................................................................................................................................... 105
16.2.2 PC Network Adapter .............................................................................................................. 106
16.3 ASCII PROGRAMMING ····················································································································· 107
16.4 HTTP SERVER ···································································································································· 108
16.4.1 Data Logging ............................................................................................................................ 108
17 PROFINET ............................................................................................................................................ 110
17.1 WIRING ············································································································································ 110
17.1.1 Status LED ............................................................................................................................... 110
17.2 PROGRAMMING ································································································································ 111
17.2.1 I/O Device Configuration .......................................................................................................... 111
17.2.1.1 GSD File ........................................................................................................................................... 111
17.2.1.2 Configuration................................................................................................................................... 111
17.2.2 Parameter Setting...................................................................................................................... 111
17.2.2.1 Parameters of the Fieldbus Communicator .................................................................................... 112
17.2.2.2 Parameters of the Pyrometer Module............................................................................................. 114
17.2.3 Input Data Structure................................................................................................................. 115
17.2.3.1 Input Data of Fieldbus Communicator .......................................................................................... 115
17.2.3.2 Input Data of Pyrometer Module ................................................................................................... 115
17.2.4 Output Data Structure.............................................................................................................. 115
17.2.5 Diagnostics ............................................................................................................................... 115
18 ASCII PROGRAMMING .................................................................................................................... 117
18.1 TRANSFER MODES ···························································································································· 117
18.2 COMMAND STRUCTURE ···················································································································· 117
18.3 ADDRESSING ···································································································································· 118
18.4DEVICE INFORMATION ····················································································································· 119
18.5DEVICE SETUP ·································································································································· 119
18.5.1 Temperature Calculation ........................................................................................................... 119
18.5.2 Temperature Pre-Processing ...................................................................................................... 119
18.5.3 Emissivity Setting and Alarm Set points ................................................................................... 120
18.5.4 Post Processing ......................................................................................................................... 120
18.6DYNAMIC DATA ······························································································································· 121
18.7DEVICE CONTROL····························································································································· 121
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18.7.1 Output for the Target Temperature ............................................................................................ 121
18.7.2 Analog Output, Scaling ............................................................................................................. 121
18.7.3 Alarm Output............................................................................................................................ 121
18.7.4 Factory default values ................................................................................................................ 122
18.7.5 Lock Mode ................................................................................................................................. 122
18.7.6 Mode Setting for the Digital Input FTC3 ................................................................................... 122
18.7.7 Ambient Background Temperature Compensation ...................................................................... 122
18.8 COMMAND SET ································································································································· 122
18.8.1 ASCII Commands for Ethernet and Profinet............................................................................... 128
19 APPENDIX............................................................................................................................................. 129
19.1DETERMINATION OF EMISSIVITY ······································································································· 129
19.2 TYPICAL EMISSIVITY VALUES ············································································································ 129
19.3 ATEX CERTIFICATE OF CONFORMITY FOR SENSING HEADS ······························································ 133
19.4 ATEX CERTIFICATE OF CONFORMITY FOR EX POWER SUPPLY ·························································· 136
19.5 IECEX CERTIFICATE OF CONFORMITY FOR SENSINGHEADS ····························································· 139
19.6 IECEX CERTIFICATE OF CONFORMITY FOR EX POWER SUPPLY ·························································· 143
20 NOTES ................................................................................................................................................... 147
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Safety Instructions
The instrument can be equipped with a Class 2 laser. Class
2 lasers shine only within the visible
1 Safety Instructions
This document contains important information, which should be kept at all times with the instrument during its
operational life. Other users of this instrument should be given these instructions with the instrument. Eventual
updates to this information must be added to the original document. The instrument should only be operated by
trained personnel in accordance with these instructions and local safety regulations.
Acceptable Operation
This instrument is intended only for the measurement of temperature. The instrument is appropriate for continuous
use. The instrument operates reliably in demanding conditions, such as in high environmental temperatures, as
long as the documented technical specifications for all instrument components are adhered to. Compliance with
the operating instructions is necessary to ensure the expected results.
Unacceptable Operation
The instrument should not be used for medical diagnosis.
Replacement Parts and Accessories
Use only original parts and accessories approved by the manufacturer. The use of other products can compromise
the operational safety and functionality of the instrument.
Instrument Disposal
Disposal of old instruments should be handled according to professional and environmental
regulations as electronic waste.
Operating Instructions
The following symbols are used to highlight essential safety information in the operation instructions:
Helpful information regarding the optimal use of the instrument.
Warnings concerning operation to avoid instrument damage and personal injury.
spectrum at an intensity of 1 mW. Looking directly into the laser beam can produce a slight, temporary
blinding effect, but does not result in physical injury or damage to the eyes, even when the beam is
magnified by optical aids. At any rate, closing the eye lids is encouraged when eye contact is made
with the laser beam. Pay attention to possible reflections of the laser beam. The laser functions only to
locate and mark surface measurement targets. Do not aim the laser at people or animals.
Pay particular attention to the following safety instructions.
Use in 110/230 V~ electrical systems can result in electrical hazards and personal injury, if not properly
protected. All instrument parts supplied by electricity must be covered to prevent physical contact
and other hazards at all times.
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Description
2 Description
The MI3 sensor series is the next generation of the well-established “MI class” sensor platform. It will
be capable of covering a broad range of applications. The MI3 sensor series introduces various network
communications, an externally accessible user interface, improved temperature measurement
specifications and capabilities at an economic price.
The MI3 series comes with the following highlights:
Rugged sensing heads survive ambient temperatures to 120°C (248°F) including optimized
performance due to ambient temperature calibration across full ambient temperature range
Special high ambient temperature heads available withstanding up to 180°C (356°F) without any
cooling (LTH models)
Multi head system architecture to allow multiple sensing heads to be multiplexed from a single
communication box
Stand-alone OEM sensing head operation
Intrinsically safe sensing head with Ex Power Supply for installation in hazardous areas (ATEX)
Precision high resolution optics up to 100:1
Up to 10 ms response time
Alarm status indicator
Standard USB 2.0 digital interface
Analog outputs with galvanic isolation
Alarm relay output
Serial RS485 communication interface with the protocols: ASCII, Profibus, Modbus
Ethernet communication interface with the protocols: ASCII, http, Profinet IO
Automatic sensing head identification
Includes DataTemp® Multidrop software for sensor configuration and monitoring
Field calibration software
®1
1
Modbus is a registered trademark of Modbus Organization, Inc.
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2.1 Overview Comm Boxes
MI3COMM
MI3MCOMMN
MI3MCOMM
MI3MCOMM…
Part number
MI3COMM
…
MI3MCOMMN
MI3MCOMM
MI3MCOMM…
Spectral Head
s1LT,
G5,
1M,2MLT,
G5,
1M,2MLT,
G5,
1M,2MLT,
G5,
1M,2MHead Support
Control panel
Outputs
Inputs
Interfaces
Description
by firmware
by terminal
Display
Buttons
mA/V
TC
Relay
Emissivity (analog)
Emissivity (digital)
Ambient Temp. Compensation
Trigger/Hold Function
Laser Switching
metal box
8 heads
1 head
1
1
1
DIN 3TE
8 heads
4 heads
–
–
–
–
1
–
–
–
DIN 4TE
8 heads
4 heads
–
–
1
–
–
–
DIN 6TE
8 heads
4 heads
4x (optional …A)
–
1
–
–
–
USB
RS485
Protocols
ASCII
Profibus
Modbus
Profinet
Ethernet
Standard
Option (…4)
Standard
Option (…P1, …P2)
Option (…M)
Option (…PN)
Option (…E)
Table 1: Capabilities of Communication Boxes
Standard
–
Standard
–
–
–
–
Standard
Standard
Standard
Standard
–
Standard
–
–
–
–
Option (…P)
Option (…M)
Option (…PN)
Option (…E)
1
1M, 2M spectral heads require box firmware revision 2.11 or higher
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Technical Data
3 Technical Data
3.1 Measurement Specification
3.1.1 Sensing Heads
Temperature Range
02LTS, 10LTS, 10LTH -40 to 600°C (-40 to 1112°F)
20LTS, LTF, 20LTH 0 to 1000°C (32 to 1832°F)
G5 250 to 1650°C (482 to 3002°F)
2M 250 to 1400°C (482 to 2552°F)
1M 500 to 1800°C (932 to 3272°F)
Spectral Response
LTS, LTH, LTF 8 to 14 µm
G5 5 µm
2M 1.6 µm
1M 1 µm
Optical Resolution D:S
1
LTS 2:1, 10:1, 22:1 typ. (21:1 guaranteed)
LTF 10:1
LTH 10:1, 22:1 typ. (21:1 guaranteed)
G5 10:1
1M, 2M 100:1
SF1 optics: 2 mm spot @ 200 mm distance (0.08 in @ 7.9 in)
SF3 optics: 22 mm spot @ 2200 mm distance (0.87 in @ (8.7 in)
Response Time
2
LTS, LTH 130 ms
LTF 20 ms
G5 130 ms
1M, 2M 10 ms
Accuracy
4
3
LTS, LTH, LTF, G5 ± (1% of reading or 1°C), whichever is greater
± 2°C (± 4°F) for target temp. < 20°C (68°F)
1M, 2M ± (0.5% of reading + 2°C)
To maintain the specified accuracy, it is recommended to calibrate the instrument annually.
Repeatability
LTS, LTH, LTF, G5 ± 0.5% of reading or ± 0.5°C, whichever is greater
1M, 2M ± 0.25% of reading + 1°C
1
at 90% energy in minimum and distance 400 mm (15.7 in.)
2
90% response
3
30 ms – if more than one sensing head drives an analog output of the communication box
4
at ambient temperature 23°C ±5°C (73°F ±9°F), ε = 1.0, and calibration geometry
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Technical Data
Temperature Coefficient
1
LTS, LTH, LTF, G5 ± 0.05 K / K or ± 0.05% of reading / K, whichever is greater
1M, 2M 0.01% of reading / K
3.1.2 Comm Box
Accuracy
mA/V output ± 1°C
(corresponds to ± 0.015 mA for the current output at 0-20 mA
or ± 0.015 mA for the current output at 4-20 mA
or ± 4 mV for the voltage output at 0-5 V
or ± 8 mV for the voltage output at 0-10 V)
TC output ± 1.5°C
Temperature Resolution
mA/V Output ± 0.1°C (± 0.2°F)2 / 12 bit, for Comm Box (metal)
mA/V Output ± 0.02°C (± 0.04°F) / 16 bit, for Comm Box (DIN 6TE, analog)
Temperature Coefficient
mA/V Output ± 0.02 K / K
TC Output ± 0.05 K / K
Emissivity
All models 0.100 to 1.100
Transmission
All models 0.100 to 1.000
3.1.2.1 Comm Box (metal) Loop Time
mA/V Output
LTS, LTH, G5 8 ms
LTF, 1M, 2M 4 ms
digital 16 ms * number of connected heads
3.1.2.2 Comm Box (DIN) Loop Time
digital
LTS, LTH, G5 8 ms3 * number of connected heads
LTF, 1M, 2M 4 ms4 * number of connected heads
1
ambient temperature deviations related to 23°C
2
for a zoomed temperature span of < 500°C (932°F)
3
per bus channel
4
per bus channel
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Technical Data
3.2 Optical Charts
Figure 1: Spot Size Charts
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Technical Data
3.3 Electrical Specification
For an overview to the capabilities of the communication boxes, see section 2.1 Overview Comm Boxes,
page 13.
3.3.1 Comm Box, all models
Voltage Supply 8 to 32 VDC
Residual Ripple ≤ 100 mV (peak-to-peak)
Power Consumption max. 6 W
Alarm Output
1 potential-free relay output, 48 V / 300 mA
Relay with wear-free contacts (solid state relay) for target temperature or head ambient
temperature, electrically isolated from power supply
USB Interface
Version: 2.0
Connector on the board: type Mini-B
3.3.2 Comm Box (metal)
Analog Outputs
Output 1 0 to 5/10 V output for head ambient temperature and object temperature
electrically not isolated from power supply
Thermocouple J: -40 to 600°C (-40 to 1112°F)
K: -40 to 800°C (-40 to 1472°F)
R/S: 250 to 1800°C (482 to 3272°F)
Output 2 0 to 20 mA (active), or
4 to 20 mA (active), or
0 to 5 V, or
0 to 10 V
electrically not isolated from power supply
External Inputs
3 inputs are available useable in different modes:
FTC1-3 Emissivity control: 3 bit digital coded, 0 to VSS
FTC1 Emissivity control: analog, 0 to 5 VDC
FTC2 Ambient temperature compensation analog: 0 to 5 VDC
FTC3 for trigger/hold/laser functions, 0 to VSS
3.3.3 Comm Box (DIN 6TE, analog)
Analog Outputs
Output 1 to 4 0 to 20 mA (active), or
4 to 20 mA (active), or
0 to 5 V, or
0 to 10 V
Each output is galvanically isolated from the other and from power supply!
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Technical Data
3.4 Environmental Specification
3.4.1 Sensing Head
Ambient Temperature
LTS, LTF, G5 -10 to 120°C (14 to 248°F)
LTH -10 to 180°C (14 to 356°F)
1M, 2M 0 to 120°C (32 to 248°F)
Laser (1M, 2M) automatic switch off at 65°C (149°F)
Storage Temperature
LTH -20 to 180°C (-4 to 356°F)
all other models -20 to 120°C (-4 to 248°F)
Rating IP65 (NEMA-4) / IEC 60529
Relative Humidity 10% to 95% non-condensing
Vibration 11 to 200 Hz, 3 g above 25 Hz operating, 3 axes / IEC 60068-2-6
Shock 50 g, 11 ms, operating, 3 axes / IEC 60068-2-27
Weight
LT, G5 50 g (1.8 oz)
1M, 2M 233 g (8.2 oz)
Material
Head Stainless steel
Head Cable
LTH Teflon
all other models PUR (Polyurethane), Halogen free, Silicone free
Teflon develops poisonous gasses when it comes into contact with flames!
®
maximal ambient temperature 180°C (356°F)
maximal ambient temperature 120°C (248°F)
3.4.2 Comm Box (metal)
Ambient Temperature -10 to 65°C (14 to 149°F)
Storage Temperature -20 to 85°C (-4 to 185°F)
Rating IP65 (NEMA-4) / IEC 60529
Relative Humidity 10% to 95% non-condensing
Vibration 11 to 200 Hz, 3 g above 25 Hz operating, 3 axes / IEC 60068-2-6
Shock 50 g, 11 ms, operating, 3 axes / IEC 60068-2-27
Weight 370 g (13 oz)
Material die-cast zinc enclosure
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Technical Data
Standard
cable length
3.4.3 Comm Box (DIN)
Ambient Temperature -10 to 65°C (14 to 149°F)
Storage Temperature -20 to 85°C (-4 to 185°F)
Relative Humidity 10% to 95% non-condensing
Vibration 11 to 200 Hz, 3 g above 25 Hz operating, 3 axes / IEC 60068-2-6
Shock 50 g, 11 ms, operating, 3 axes / IEC 60068-2-27
Weight 125 g (4.4 oz)
Material molded plastic
3.4.4 LTH Electronics
Ambient Temperature -10 to 65°C (14 to 149°F)
Storage Temperature -20 to 85°C (-4 to 185°F)
Rating IP65 (NEMA-4) / IEC 60529
3.5 Dimensions
3.5.1 Sensing Head LT, G5
ft.)
1 m (3
Ø 5 mm (0.
3.5.2 Sensing Head LTH
2 in)
Figure 2: Dimensions of LT, G5 Sensing Heads
Figure 3: Dimensions of LTH Sensing Head with separated Electronics
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Technical Data
Standard
cable l
ength
Ø 5 mm
(0.2 in)
3.5.3 Sensing Head 1M, 2M
1 m (3
ft)
Figure 4: Dimensions of 1M, 2M Sensing Heads
3.5.4 Comm Box (metal)
The box is equipped with three cable feed-through ports – two with IP65 compatible sealing glands, a
third sealing gland comes for boxes with fieldbu s communications (RS485, Profibus etc.). Boxes without
fieldbus have a plugged expansion feed-through port instead (M12x1.5 thread).
Figure 5: Dimensions of Communication Box
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Technical Data
Width
MI3MCOMMN
MI3MCOMM
MI3MCOMM…
X
DIN 3TE:
DIN 4TE:
DIN 6TE:
3.5.5 Comm Box (DIN)
The boxes come in a standard DIN rail size in accordance to EN 50022-35x7.5 (DIN 43880).
53.6 mm (2.1 in)
Figure 6: Dimensions for Comm Boxes (DIN)
71.6 mm (2.8 in)
107.6 mm (4.2 in)
3.6 Scope of Delivery
3.6.1 Sensing Head
Sensing head with 1 m (3 ft.) cable
Laser (1M, 2M heads only)
2x mounting nuts
3.6.2 Comm Box
Communication box
XXXMI3MCOMMSET: ferrite cores (4 pcs), shield tapes (4 pcs) – for Comm Box (DIN) only
Software DVD
Quickstart guide
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Basics
4 Basics
4.1 Measurement of Infrared Temperature
All surfaces emit infrared radiation. The intensity of this infrared radiation changes according to the
temperature of the object. Depending on the material and surface properties, the emitted radiation lies
in a wavelength spectrum of approximately 1 to 20 µm. The intensity of the infrared radiation (heat
radiation) is dependent on the material. For many substances, this material-dependent constant is
known. This constant is referred to as the ”emissivity value”.
Infrared thermometers are optical-electronic sensors. These sensors are sensitive to the emitted
radiation. Infrared thermometers are made up of a lens, a spectral filter, a sensor, and an electronic
signal processing unit. The task of the spectral filter is to select the wavelength spectrum of interest. The
sensor converts the infrared radiation into an electrical signal. The signal processing electronics analyze
the electrical signal and convert it into a temperature measurement. As the intensity of the emitted
infrared radiation is dependent on the material, the required emissivity can be selected on the sensor.
The biggest advantage of the infrared thermometer is its ability to measure temperature without
touching an object. Consequently, surface temperatures of moving or hard to reach objects can easily be
measured.
4.2 Emissivity of Target Object
To determine the emissivity of the target object see section 19.1 Determination of Emissivity, page 129.
If emissivity is low, measured results could be falsified by interfering infrared radiation from
background objects (such as heating systems, flames, fireclay bricks, etc. located close beside or behind
the target object). This type of problem can occur when measuring reflective surfaces and very thin
materials, such as plastic film and glass.
This measurement error can be reduced to a minimum, if particular care is taken during installation and
the sensing head is shielded from these reflecting radiation sources.
4.3 Ambient Temperature
In many cases there is a poor understanding of the actual temperatures at the site where the sensor is
mounted. While process temperatures are typically very well monitored and controlled, there is
ambient conditions around the process have no bearing on product throughput or quality and therefore
remain unknown. In all cases it is recommended to perform considerable testing. The external
temperature can be measured at the surface of the instrument. For automated monitoring, the sensor
also provides its internal temperatures via the PC software or via the digital interface. Alternatively, the
sensor-internal alarm relay (if present) can be switched if the maximum permissible internal
temperature is threatened to be exceeded.
The sensing head is suited for the ambient temperatures up to 120°C (248°F) for the standard heads and
up to 180°C (356°F) for the LTH heads. The sensing head can operate in ambient temperatures up to
200°C (392°F) with the air-cooling accessory.
4.4 Atmospheric Quality
If the lens gets dirty, infrared energy will be blocked and the instrument will not measure accurately. It
is good practice to always keep the lens clean. The Air Purge Jacket helps keep contaminants from
building up on the lens. If you use air purging, make sure a filtered air supply with clean dry air at the
correct air pressure is installed before proceeding with the sensor installation.
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Basics
4.5 Electrical Interference
To minimize electrical or electromagnetic interference or “noise”, please be aware of the following:
Mount the unit as far away as possible from potential sources of electrical interference, such as
motorized equipment, which can produce large step load changes.
Use shielded wire for all input and output connections.
To avoid current equalizations, make sure that a sufficient potential equalization is realized
between the sensing head and metal housing of the co mmunication box.
To avoid ground loops, make sure that only one point is earth grounded, either via the sensing
head, the Comm Box, or power.
Please note that:
The metal housings of the sensing head and the MI3 communication box are electrically
connected to the shield of the head cable.
All inputs and outputs (except the alarm output and the outputs of the Comm Box (DIN 6TE,
analog)) use the same ground and are electrically connected to the power supply.
Figure 7: Shield Run for Comm Box (metal)
Figure 8: Shield Run for Comm Box (DIN)
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Basics
Head Box Power
Shield Shield
Figure 9: Only one point is earth grounded either via sensing head, via Comm Box, or via Power
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Installation
Back
-
Target equal to spot
incorrect
Sensor
5 Installation
5.1 Positioning
Sensor location depends on the application. Before deciding on a location, you need to be aware of the
ambient temperature of the location, the atmospheric quality of the location, and the possible
electromagnetic interference in that location. If you plan to use air purging, you need to have an air
connection available. Wiring and conduit runs must be considered, including computer wiring and
connections, if used.
5.1.1 Distance to Object
The desired spot size on the target will determine the maximum measurement distance. To avoid
erroneous readings, the target spot size must completely fill the entire field of view of the sensor.
Consequently, the sensor must be positioned so the field of view is the same as or smaller than the
desired target size. For a list indicating the available optics, see section 3.2 Optical Charts, page 16.
The actual spot size for any distance can be calculated by using the following formula. Divide the
distance D by your model’s D:S number. For example, for a unit with D:S = 10:1, if the sensor is 400 mm
(15.7 in.) from the target, divide 400 by 10 (15.7 by 10), which gives you a target spot size of
approximately 40 mm (1.57 in.).
best critical
ground
Target greater than spot size
get smaller than spot size
Tar
Figure 10: Proper Sensor Placement
5.2 Installation Schemes
5.2.1 Comm Box (metal)
The basic stand-alone configuration consists of one sensing head interfaced to one metallic
communications box. The sensing head provides all IR measurement functionality. The
communications box provides an externally accessibly user interface and display, advanced signal
processing capability, field wiring terminations and fieldbus functionality with optional RS485
communication interface.
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Installation
Comm Box
Power supply,
Fieldbus
DIN Rail
Comm Box
Power supply
Total length:
max. 30 m (98
ft)
Total length:
max. 30 m (98
ft)
(RAY
2 analog
outputs,
3 inputs
Fieldbus
Figure 11: Single Head Configuration with Comm Box
To increase the number of supported sensing heads, you can use a dedicated accessory, see section
10.1.1 Multi-Channel Box, page 64.
5.2.2 Comm Box (DIN)
The multiple sensing head configuration consists of a modular communication box provided in a DIN
rail mountable plastic enclosure for supporting 4 sensing heads simultaneously. The DIN rail
communication box provides an externally accessibly user interface. The terminal strip connectors are
used to simplify the field wiring.
MI3COMM)
Head 1
(RAYMI3…)
MI3MCOMM)
(RAY
rm output,
1 ala
1 trigger
input
Max. 8 Sensing Heads
(RAYMI3…)
or
4x analog
Figure 12: Multiple Head Configuration with DIN Rail Comm Box
5.3 Wiring, Head Cable
The user has to install the sensor cable on the communication box. It may be shortened, if necessary, but
keep a minimal length of 20 cm (7.9 in).
Do not bend the sensing head cable tighter than a radius of 40 mm (1.6 in) for the standard heads (PUR
cable) and 25 mm (0.98 in) for the high ambient temperature heads (Teflon cable) respectively!
To prevent possible fluctuating temperature readings or damages to the device make
sure that the sensor head is grounded before use!
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Installation
Cabl
e and sensing head
The total sensing head cable length for all networked sensing heads must not exceed
30 m (98 ft) for MI3 and 2x30 m (2x98 ft) for MI3M!
Do not add a third party cable to extend the length of the sensing head cable!
5.3.1 Comm Box (metal)
1. Cut about 40 mm (1.5 in) of the cable sheath from the end of the sensing head cable ⑦. Caution:
Do not cut into the shield!
2. Cut the shield ⑤ so about 5 mm (0.2 in) remains exposed from under the cable sheath. Separate
the shield and spread the strands out.
3. Strip 3 mm (0.12 in) of insulation from the wires ⑥!
4. Open the communication bo x by removing the four Phillips head screws and pulling off the lid.
Unscrew the pressure screw ①, and remove the first metal washer ④, the rubber washer ③,
and the second and the third metal washers ④.
5. Put the following on the cable: the pressure screw ①, the first metal washer ④, the rubber
washer ③ and the second metal washers ④, see the following figure.
6. Spread the cable shield ⑤ and then slip the third metal washer ④ onto the cable. Note that the
shield must make good contact to both metal washers.
7. Slip the wires ⑥ into the communication box far enough to connect to the terminal.
8. Screw the pressure screw ① into the communication box. Tighten snuggly. Do not over tighten.
9. Connect the wires ⑥ to the terminal on the printed circuit board.
Figure 13: Sensing Head Cable to the Comm Box
5.3.2 Comm Box (DIN)
The wiring of the sensing head cable is color coded, see section 5.4.3 Comm Box (DIN 4 TE), page 30.
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Installation
5.4 Wiring, Terminal
You need to connect the power supply and possibly the signal input/output wires. Use only cable with
outside diameter from 4 to 6 mm (0.16 to 0.24 in), wire size: 0.14 to 0.75 mm² (AWG 19 to 26).
The cable must include shielded wires. It should not be used as a strain relief!
5.4.1 Comm Box (metal)
Sensing Head
Emissivity Control
Ambient Compensation
Trigger/Hold
T
objThead
Alarm: T
Power Supply
Figure 14: Terminal Wiring for the Comm Box
/ T
obj
head
T
obj/Thead
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5.4.2 Comm Box (DIN 3TE)
RELAY
Sensing
S
GND
FTC3
8
-
32 V
Shield
GND
RELAY
shield
green
white
yellow
brown
shield
green
white
yellow
brown
Installation
Heads
USB Connector, Mini-B
Figure 15: Terminal Wiring for the Comm Box DIN 3TE
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Installation
RELAY
Sensing Heads
S
GND
FTC3
8
-
32 V
Shield
A (RS485)
B (RS485)
GND
RELAY
shield
green
white
yellow
brown
Shunt
, deactived
shield
green
white
yellow
brown
USB Connector, Mini
-
B
5.4.3 Comm Box (DIN 4 TE)
Figure 16: Terminal Wiring for the Comm Box DIN 4 TE
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5.4.4 Comm Box (DIN 6 TE)
Wiring
Pro
fibus or
Modbus
RELAY
S
GND
FTC3
8
-
32 V
Shield
GND
RELAY
shield
green
white
yellow
brown
shield
green
white
yellow
brown
USB Connector, Mini
-
B
Installation
Sensing
Heads
Figure 17: Terminal Wiring for the Comm Box DIN 6 TE
for Profibus and Modbus
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Installation
USB Connector, Mini
-
B
RJ45 connec
tor
RELAY
Sensing
S
GND
FTC3
8
shield
GND
RELAY
shield
n
w
hite
yellow
br
own
shield
gr
ee
n
w
hite
yellow
br
own
Heads
gree
Profine
t or Ethernet
- 32 V
Figure 18: Terminal Wiring for the Comm Box DIN 6 TE
for Profinet and Modbus
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RELAY
Sensing
Heads
S
GND
FTC3
8
-
32 V
Shield
GND
RELAY
shield
green
white
yellow
brown
shield
green
white
yellow
brown
USB Connector, Mini
-
B
Installation
see section
6.3Analog Outputs OUT1 - OUT4,
page 40.
Analog Outputs
Figure 19: Terminal Wiring for the Comm Box DIN 6 TE, analog
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Installation
self
-
adhe
sive sh
ield tape
Shield wire connected to
<Shield>
5.4.5 EMI Resistance for Comm Box (DIN)
To maintain EMI compliance to CE standards the attached Ferrite cores need to be placed
on all wires! Make sure that the cable shields will be connected to the terminal pin
<Shield>!
terminal pin
Figure 20: Mounting of Shield Wire and Ferrite Core
wrap round
to
the cable
Ferrite Core placed on all wires
except the shield wire
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Installation
5.5 Power On Procedure
To power the system, the following procedures are required.
5.5.1 One Head System
1. Disconnect power to the box.
2. Connect the wires for the head to the box terminal.
3. Power the box.
4. The box now assigns address 1 to the head.
5.5.2 Multiple Heads – Random Address Assignment
1. Disconnect power to the box.
2. Connect the wires for all heads to the box terminal.
3. Power the box.
4. The box automatically assigns a unique address to each of the heads – the mapping of physical
head and head address is randomly.
5.5.3 Multiple Heads – User Controlled Address Assignment
1. Disconnect power to the box.
2. Connect the wires for the first head to the box terminal.
3. Power the box.
4. The box now assigns address 1 to the first head.
5. Follow the instructions 1 to 4 to add the next head. With each new head detected, the box
increases the head address by 1.
The head address may be changed later by the user under the dedicated head page. See
section 8.2 <Head> Page, page 49.
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Installation
The computer’s USB port
USB connector,
The computer’s USB port
5.6 USB
The USB interface comes with each box (USB connector, Mini-B). Connect a single unit to a USB
computer port by using an appropriate USB cable.
type
Mini-B
Figure 21: USB Connection via the Comm Box (metal)
Figure 22: USB Connection via the Comm Box (DIN Rail)
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Installation
communicating
with the DTMD Software.
Consider the following sequence for the installation:
1. Disconnect/reconnect the USB interface cable to the computer!
2. Ignore the Windows Wizard <Found New Hardware>!
3. Navigate manually to the dedicated USB driver <RaytekMIcomport.inf> on the support media
and execute it.
It is strongly recommended to check the correct driver installation under the Windows
Operating System <Start> <Settings> <Control Panel> <System> <Hardware> <Device
Manager> <Ports (COM & LPT)>. Go there also to get the virtual COM port number for
Driver correctly installed!
COM port number
for DTMD Software!
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Installation
Master
Slave 1
Last
Slave 2
Termination <on>
5.7 Fieldbus
A simultaneous communication via USB and fieldbus is not allowed!
5.7.1 Addressing
Each slave in the network must have a unique address and must run at the same baud rate!
For setting the fieldbus configurations through the control panel, see section 8.3 <Box Setup> Page,
page 50.
5.7.2 RS485 based Installations
The recommended way to add more devices into a network is connecting each device in series to the
next in a linear topology (daisy chain).
Use only one power supply for all boxes in the network to avoid ground loops!
It is strongly recommended to use shielded and pair twisted cables (e.g. CAT.5)!
Make sure the network line is terminated!
Slave
Figure 23: Network in Linear Topology (daisy chain)
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6 Outputs
Output
Setup 1
Setup 2
Setup 3
Setup 4
Setup 5
OUT1
head temperature
head
temperature
object temperature
object
temperature
OUT2
object
temperature
object
temperature
object
temperature
object
temperature
head
temperature
TC
object
temperature
Comm Box:
Source:
Signal:
Terminal:
Comm Box:
Source:
Signal:
Terminal:
For the outputs the following groupings (setups) are possible:
Outputs
V
mA
V
V
V
mA
V
V
V
6.1 Analog Output OUT1
metal
object temperature / head ambient temperature
0 to 5/10 V
OUT1, SGND
This output can be configured for the object or the head ambient temperature. E.g. the output range for
the head ambient temperature is 0 to 5 VDC corresponding to 0 to 500°C (32 to 932°F). The minimum
load impedance for the voltage output must be 10 kΩ.
The output is short circuit resistant.
The outputs <OUT1> and <TC> are not available at the same time!
6.2 Analog Output OUT2
metal
object temperature / head ambient temperature
0/4 to 20 mA or 0 to 5/10 V
OUT2, SGND
The signal output can be configured as either current or voltage output. The minimum load impedance
for the voltage output must be 10 kΩ. The maximum current loop impedance for the mA output is
500 Ω.
The output is short circuit resistant.
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Outputs
Comm Box:
Source:
Signal:
Terminal:
Comm Box:
Source:
Signal:
Terminal:
outputs
by using an additional external power supply
!
RELAY
RELAY
≤ 48 V
6.3 Analog Outputs OUT1 - OUT4
DIN 6TE, analog (4 channels)
object temperature / head ambient temperature
0/4 to 20 mA or 0 to 5/10 V
I1-4, U1-4, GND1-4
Each signal output can be configured as either current or voltage output, whereby each sensing head
can be assigned to each output. The minimum load impedance for the voltage output must be 10 kΩ.
The maximum current loop impedance for the mA output is 500 Ω. All outputs are short circuit
resistant.
Each output is galvanically isolated from the other and from the power supply!
Powering the communication box (DIN, 6TE), analog, only via USB will disable all
analog outputs! The configuration of the box under the control panel is furthermore
possible. Under the DataTemp Multidrop you can only drive and configure the analog
6.4 Alarm Output RELAY
all models
object temperature / head ambient temperature
potential-free contacts
RELAY, RELAY
The alarm output is controlled by the target object temperature or the head ambient temperature. In
case of an alarm, the output switches the potential free contacts from a solid state relay. The maximum
load for this output is 48 V / 300 mA.
If a spike voltage exceeding the absolute maximum rated value is generated between the output
terminals, insert a clamping diode in parallel to the inductive load as shown in the following circuit
diagram to limit the spike voltage.
Figure 24: Spike Voltage Limitation for the Alarm Relay
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Outputs
Comm Box:
Source:
Signal:
Terminal:
6.5 Thermocouple Output TC
metal
object temperature
TCJ, TCK, TCR, or TCS
TC, SGND
This output can be configured as thermocouple output type J, K, R, or S. For that output, you must
install a dedicated compensation cable. The output impedance is 20 Ω. The output is short circuit
resistant.
The outputs <OUT1> and <TC> are not available at the same time!
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Inputs
FTC1
FTC2
FTC3
Emissivity (analog control)
x
Emissivity (digital control)
xxx
Ambient Background Temperature Compensation
x
Trigger/Hold Function
x
Laser Switching
x
Function:
Signal:
Terminal:
U in V
0.00.5…4.5
5.0
Emissivity
0.1
0.2…1.0
1.1
7 Inputs
Three external inputs FTC1, FTC2, and FTC3 are used for the external control of the unit.
You cannot enable the input functions through the control panel!
Table 2: Overview for FTC Inputs
7.1 Emissivity (analog)
emissivity (analog control)
0 to 5 VDC
FTC1, SGND
The FTC1 input can be configured to accept an analog voltage signal (0 to 5 VDC) to provide real time
emissivity setting. Each input can support one head. The following table shows the relationship between
input voltage and emissivity:
Table 3: Ratio between Analog Input Voltage and Emissivity
Example:
This process requires setting the emissivity:
for product 1: 0.90
for product 2: 0.40
Following the example below, the operator needs only to switch to position “product 1” or “product 2”.
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Inputs
Function:
Signal:
Terminal:
Table entry
Emissivity
FTC3
FTC2
FTC1
0
1.100
0
0
0
Function:
Signal:
Terminal:
“product 1”
“product
2”
4.0 V (ε=
0.9
)
1.5 V (ε=
0.4
)
R1 =
200
Ω
+ 5 VDC
R2 = 500 Ω
R3 = 300 Ω
Figure 25: Adjustment of Emissivity at FTC Input (Example)
To the FTC input
of the box
7.2 Emissivity (digital)
emissivity (digital control)
digital low/high
FTC1-3, SGND
The box electronics contains a table with 8 pre-installed settings for emissivity. To activate these
emissivity settings, you need to have the inputs FTC1, FTC2, and FTC3 connected. According to the
voltage level on the FTC inputs, one of the table entries will be activated.
0 = Low signal (0 V)
1 = High signal (from 5 V to VDC)
A non-wired input is considered as not defined!
(Examples)
1
2
3
4
5
6
7
Figure 26: Digital Selection of Emissivity with FTC Inputs
The values in the table cannot be changed through the control panel.
0.500
0.600
0.700
0.800
0.970
1.000
0.950
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
7.3 Background Temperature Compensation
Background Temperature Compensation
0 to 5 VDC
FTC2, SGND
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Inputs
the target!
Sensor 2
to ambient
to object
0
–
5
VDC
analog
output
at
FTC2 input
Target object
The sensor is capable of improving the accuracy of target temperature measurements by taking into
account the ambient or background temperature. This feature is useful when the target emissivity is
below 1.0 and the background temperature is significantly hotter than the target temperature. For
instance, the higher temperature of a furnace wall could lead to hotter temperatures being measured
especially for low emissivity targets.
Ambient background temperature compensation allows for the impact of reflected radiation in
accordance with the reflective behavior of the target. Due to the surface structure of the target, some
amount of ambient radiation will be reflected and therefore, added to the thermal radiation that is
collected by the sensor. The ambient background temperature compensation adjusts the final result by
subtracting the amount of ambient radiation measured from the sum of thermal radiation the sensor is
exposed to.
The ambient background temperature compensation should always be activated in case
of low emissivity targets measured in hot environments or when heat sources are near
Three possibilities for ambient background temperature compensation are available:
The internal sensing head temperature is utilized for compensation assuming that the ambient
background temperature is more or less represented by the internal sensing head temperature. This
is the default setting.
If the background ambient temperature is known and constant, the user may give the known
ambient temperature as a constant temperature value.
Ambient background temperature compensation from a second temperature sensor (infrared or
contact temperature sensor) ensures extremely accurate results. For example, a second IR sensor,
configured to provide a 0 to 5 volt output scaled for the same temperature range as the target can be
connected to input FTC2 to provide real-time ambient background compensation.
tar
ted
ge
nace wall
Fur
Sensor 1
targeted
Thermal radiation of ambient
Thermal radiation of target
Figure 27: Principle of Ambient Background Temperature Compensation
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Inputs
Function:
Signal:
Terminal:
object temperature
output temperature
FTC3
Temp
Time
7.4 Trigger/Hold
Trigger/Hold
digital low/high
FTC3, SGND
The FTC3 input can be used as an external trigger functioning as “Trigger” or “Hold”. All sensing heads
are affected by the FTC3 input at the same time.
Figure 28: Wiring of FTC3 as Trigger/Hold
Trigger: A logical low signal at the input FTC3 will reset the peak or valley hold function. As long as
the input is kept at logical low level, the software will transfer the actual object temperatures toward
the output. At the next logical high level, the hold function will be restarted.
Figure 29: FTC for Resetting the Peak Hold Function
Hold: This mode acts as an externally generated hold function. A transition at the input FTC3 from
logical high level toward logical low level will transfer the current temperature toward the output. This
temperature will be written to the output until a new transition from high to low occurs at the input
FTC3.
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Inputs
Function:
Signal:
Terminal:
object temperature
output temperature
Tr
igger
Temp
Time
Figure 30: FTC3 for Holding the Output Temperature
7.5 Laser Switching
Laser switching on/off
digital low/high
FTC3, SGND
The FTC3 input can also be used as an external trigger to switch the laser (only available for selected
sensing head models). A transition at the input from logical high level toward logical low level will
switch the laser. All sensing heads are effected by the FTC3 input at the same time.
Figure 31: Wiring of FTC3 as Laser Switching
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Operation
Signal Processing
Head number
Parameters
LCD Display
Alarm Indicator
Enter Button
LCD Display
Page Button
Down Button
Up Button
Alarm Indicator
8 Operation
Once you have the sensor positioned and connected properly, the system is ready for continuous
operation.
The control panel is accessible on the outside of the box. Push buttons provide positive tactile feedback
to the user. User interface includes a backlit LCD, displaying sensor set up parameters and temperature
outputs. Alternatively, the operation of the sensor can be done by means of the software that came with
your sensor.
8.1 Control Panel
The sensor system is equipped with a control panel integrated in the box lid, which has
setting/controlling buttons and an LCD display.
Down ButtonUp Button
Page Button
Enter Button
Figure 32: Control Panel for the Comm Box (metal)
Figure 33: Control Panel for the Comm Box (DIN)
Object Temperature
Figure 34: Elements of the LCD Display
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Operation
Symbol/Message
Meaning
Remark
AVG
Average
PH
Peak Hold
VH
Valley Hold
HOLD
Trigger set to HOLD fun
c
tion
APH
Advanced Peak Hold
Software controlled
APHA
Advanced Peak Hold with Averaging
Software controlled
AVH
Advanced
Valley Hold
Software controlled
AVHA
Advanced Valley Hold with Averaging
Software controlled
<Power Fault> & alarm
Power via USB not sufficient to drive all analog outputs of
Configuration of th
e box is possible
The head number is shown only if two or more sensing heads are connected to the communication box.
indicator are blinking
Pushing the keys of the control panel will cause the following actions:
enters the menu or save parameters
enters the next page
No action for 10 s forces the unit to leave the menu without saving of parameters.
Communication box (DIN, 6TE), analog
Table 4: Symbols and Messages in the Display
but outputs are set to disabled
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#1 (Head)
#2 (Head)
...
BOX SETUP
BOX INFO
Relay Mode
OUT1 low te
mp.*
OUT1 high temp.*
OUT2 Mode*
OUT2
Source*
OUT2 Value*
OUT2 high temp.*
Interface
Display Backlight
Tambient
Emissivity
Average
Val. Hold
Trigger
Set Point
Lo Limit
Type
Serial No.
Peak Hold
SN
Laser*
OUT1 Mode*
Operation
Rev.
Tbox
Transmiss.
Alarm Mode
Hi Limit
Fact. default
OUT1 Source*
OUT1 Value*
OUT2 low temp.*
Factory default
Temperature
Key Enter Lock
* not available for all models
4 output channels for Comm Box DIN 6 TE, analog
Unit
8.2 <Head> Page
<Tambient> current head ambient temperature
<Emissivity> changes the emissivity value for the selected head. The emissivity is a
calculated ratio of infrared energy emitted by an object to the energy emitted by
a blackbody at the same temperature (a perfect radiator has an emissivity of
1.00). For information on determining an unknown emissivity and for sample
emissivities, see section 19.2 Typical Emissivity Values, page 129.
<Transmiss.> changes the transmission value when using protective windows. For example,
if a protective window is used with the sensor, set the transmission to the
appropriate value.
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Operation
<Laser> handles the laser in the following modes:
<off> switches the laser off
<flash> forces the laser to blink at 8 Hz
<on> switches the laser permanently on
<external> switches the laser via external input FTC3
An activated laser will be switched off automatically after 10 minutes.
The laser is available for 1M and 2M heads only. The laser can be activated at
the same time for maximal 4 heads.
<Average> AVG signal post processing set to averaging, parameter given in seconds. Once
<Average> is set above 0 s, it automatically activates. Note that other hold
functions (like Peak Hold or Valley Hold) cannot be used concurrently. Value
range: 0.0 to 998.9 sec, ∞
See section 8.5.1 Averaging, page 52.
<Peak Hold> PH signal post processing set to Peak Hold, parameter given in seconds. Once
<Peak Hold> is set above 0 s, it automatically activates. Note that other hold
functions (like Valley Hold or Averaging) cannot be used concurrently. Value
range: 0.0 to 998.9 sec, ∞
See section 8.5.2 Peak Hold, page 53.
<Val. Hold> VH signal post processing set to Valley Hold, parameter given in seconds. Once
<Valley Hold> is set above 0 s, it automatically activates. Note that other hold
functions (like Peak Hold or Averaging) cannot be used concurrently. Value
range: 0.0 to 998.9 sec, ∞
See section 8.5.3 Valley Hold, page 53.
<Trigger> defines the trigger mode for the selected head:
<trig>: … to reset the peak or valley hold function
<hold>: activates the hold function
See section 7.4 Trigger/Hold, page 45.
<Alarm Mode> defines the alarm mode for the selected head:
<Tobj>: object temperature as alarm source
<Tamb>: head ambient temperature as alarm source
<Set Point> defines a temperature threshold for an alarm
<Lo Limit> low end of temperature measurement range (read only)
<Hi Limit> high end of temperature measurement range (read only)
<Fact. default> sets the selected head back to factory default.
The factory default values are to be found in section 18.8 Command Set,
page 122.
<Type> provides the head model, e.g. MI3LT
<SN> provides the serial number for the selected head and allows to reassign a new
head address
8.3 <Box Setup> Page
<Relay Mode> defines the switching behavior for the box internal alarm relay:
<normally open>: open contact in non-alarm status
<normally closed>: closed contact in non-alarm status
<permanently OFF>: permanently open contacts
<permanently ON>: permanently closed contacts
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Operation
<OUT1 Mode> defines the mode for the analog output:
<TCJ>, <TCK>, <TCR>, <TCS>
<0-5V>
<0-10V>
<disable> output goes to high-resistance
<OUT1 Source> assigns the selected head to the analog output:
<#1>, <#2>, …, <Headmax>
<OUT1 Value> defines the basis for the output value:
<Tobject>: object temperature to be output
<Tambient>: head ambient temperature to be output
<OUT1 low temp.> defines the temperature for the low end of the analog output range (scaling)
<OUT1 high temp.> defines the temperature for the high end of the analog output range (scaling)
<OUT2 Mode> defines the mode for the analog output 2:
<0-20mA>
<4-20mA>
<0-5V>
<0-10V>
<disable> output goes to high-resistance
<OUT2 Source> assigns the selected head to the analog output:
<#1>, <#2>, …, <Headmax>
<OUT2 Value> defines the basis for the output value:
<Tobject>: object temperature to be output
<Tambient>: head ambient temperature to be output
<OUT2 low temp.> defines the temperature for the low end of the analog output range (scaling)
<OUT2 high temp.> defines the temperature for the high end of the analog output range (scaling)
<Interface> RS485/Profibus/Modbus:
<address>: unique address of the box in the network.
<baudrate>: baud rate for the box. Each device in the network must be set to the
same baud rate. The baud rate for Profibus is automatically negotiated between
master and slave.
Profinet/Ethernet:
<DHCP>: on/off – network protocol to configure a device in a network. DHCP
is switched off for Profinet communications.
<IP address>: a unique address of the box in the network, only changeable at
DHCP = off
<SubNetMask>: the subnet mask defines the interpretation of the IP address,
only changeable at DHCP = off
<Gateway>: a gateway connects two subnets at different subnet addresses, only
changeable at DHCP = off
<Port>: communication port, only changeable at DHCP = off, read-onlyfor
Profinet communications
<MAC>: MAC address, read-only
<Factory default> sets the box back to factory default.
The factory default values are to be found in section 18.8 Command Set,
page 122.
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Operation
output te
mperature
object temperatur
e
tempe
rature jump
average t
ime
Temp
Time
90% of
tem
per
ature
jump
<Temperature Unit> the temperature unit can be set to °C or °F. Note that this setting influences the
digital interfaces like RS485 for both object and head ambient temperature.
<Key Enter Lock> the box has a user interface lockout feature that keeps the box from being
accidentally changed from the control panel (locked by default under
DataTemp Multidrop Software and Profinet communications). This lockout
mode denies access to the button to avoid the saving of adjustable
parameters. The unit can be unlocked by pressing the button and the
button simultaneously for 3 seconds or alternatively by pressing the button
for 5 seconds.
<Display Backlight> defines the switching behavior for the display:
<ON>: switches the backlight on
<OFF>: switches the backlight off
<60sec.OFF>: switches the backlight off after the giving time
To preserve the display’s longevity, the backlight should be turned off in case of
not using it!
8.4 <Box Info> Page
<Serial No.>: serial number of the box.
<Rev>: firmware revision
Tbox: current box ambient temperature
8.5 Post Processing
8.5.1 Averaging
Averaging is used to smooth the output signal. The signal is smoothed depending on the defined time
basis. The output signal tracks the detector signal with significant time delay but noise and short peaks
are damped. Use a longer average time for more accurate damping behavior. The average time is the
amount of time the output signal needs to reach 90% magnitude of an object temperature jump.
Figure 35: Averaging
A low level input (GND) at external input FT C3 will promptly interrupt the averaging and will start the
calculation again.
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Operation
output temperature
object temperature
hold time
hold time
Temp
Time
Attention: The disadvantage of averaging is the time delay of the output signal. If the temperature
jumps at the input (hot object), the output signal reaches only 90% magnitude of the actual object
temperature after the defined average time.
8.5.2 Peak Hold
The output signal follows the object temperature until a maximum is reached. The output will „hold“
the maximum value for the selected duration of the hold time. Once the hold time is exceeded, the peak
hold function will reset and the output will resume tracking the object temperature until a new peak is
reached. The range for the hold time is 0.1 to 998.9 s.
Figure 36: Peak Hold
A defined hold time of 999 s (symbol “∞” in the display) will put the device into continuous peak
detection mode.
A low level input (GND) at external input FTC3 will promptly interrupt the hold time and will start the
maximum detection again.
8.5.3 Valley Hold
The output signal follows the object temperature until a minimum is reached. The output will „hold“
the minimum value for the selected duration of the hold time. Once the hold time is exceeded, the valley
hold function will reset and the output will resume tracking the object temperature until a new valley
is reached. The range for the hold time is 0.1 to 998.9 s
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Operation
output temperature
object temperatur
e
hold time
Temp
output te
mperature
object temperatur
e
threshold
Temp
hold time
Figure 37: Valley Hold
A defined hold time of 999 s (symbol “∞” in the display) will put the device into continuous valley
detection mode.
A low level input (GND) at external input FTC3 will promptly interrupt the hold time and will start the
minimum detection again.
Time
8.5.4 Advanced Peak Hold
This function searches the sensor signal for a local maximum (peak) and writes this value to the output
until a new local maximum is found. Before the algorithm restarts its search for a local maximum, the
object temperature has to drop below a predefined threshold. If the object temperature rises above the
held value, which has been written to the output so far, the output signal follows the object temperature
again. If the algorithm detects a local maximum while the object temperature is currently below the
predefined threshold, the output signal jumps to the new maximum temperature of this local maximum.
Once the actual temperature has passed a maximum above a certain magnitude, a new local maximum
is found. This magnitude is called hysteresis.
hyster
esis
Time
Figure 38: Advanced Peak Hold
The advanced peak hold function is only adjustable by means of the DataTemp Multidrop Software.
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Operation
output temperature
object temperatur
e
Temp
without ave
raging
8.5.5 Advanced Valley Hold
This function works similar to the advanced peak hold function, except that it will search the signal for
a local minimum.
8.5.6 Advanced Peak Hold with Averaging
The output signal delivered by the advanced peak hold functions tends to jump up and down. This is
due to the fact, that only maximum points of the otherwise homogenous trace will be shown. The user
may combine the functionality of the peak hold function with the averaging function by choosing an
average time, thus, smoothing the output signal for convenient tracing.
Figure 39: Advanced Peak Hold with Averaging
The advanced peak hold function with averaging is only adjustable by means of the DataTemp
Multidrop Software.
Time
8.5.7 Advanced Valley Hold with Averaging
This function works similar to the advanced peak hold function with averaging, except it will search
the signal for a local minimum.
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Options
9 Options
Options are items that are factory installed and must be specified at time of order. The following are
available:
Longer head cables in the lengths:
3 m / 9.8 ft. (…CB3)
8 m / 26 ft. (…CB8)
15 m / 49 ft. (…CB15)
30 m / 98 ft. (…CB30) – for LT, G5 heads only
Network communication interfaces:
RS485, Profibus DP, Modbus RTU, Profinet IO, Ethernet
All available models are listed under section 2.1 Overview Comm Boxes, page 13.
9.1 Water Cooled Housing (1M, 2M Heads)
The Water Cooled Housing option (…WS) allows the sensor to be used in ambient temperatures up to
180°C (356°F). The cooling water should be connected using 1/8” NPT stainless steel fittings. The flow
rate should be approximately 1.0 to 2.0 l/min at a temperature between 10 and 27°C (50 to 80.6°F).
Chilled water below 10°C (50°F) is not recommended, see section 9.1.1 Avoidance of Condensation,
page 57.
The Water Cooled Housing is made from stainless steel. The scope of delivery contains the air purge
collar (XXXMI3100AP). The sensing head cable is made from Teflon and limited to 15 m (49 ft).
Figure 40: Water Cooled Housing
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Options
9.1.1 Avoidance of Condensation
If environmental conditions make water cooling necessary, it is strictly recommended to check whether
condensation will be a real problem or not. Water cooling also causes a cooling of the air in the inner
part of the sensor, thereby decreasing the capability of the air to hold water. The relative humidity
increases and can reach 100% very quickly. In case of a further cooling, the surplus water vapor will
condense out as water. The water will condense on the lenses and the electronics resulting in possible
damage to the sensor. Condensation can even happen on an IP65 sealed housing.
There is no warranty repair possible in case of condensation within the housing!
To avoid condensation, the temperature of the cooling media and the flow rate must be selected to
ensure a minimum device temperature. The minimum sensor temperature depends on the ambient
temperature and the relative humidity. Please consider the following table.
Relative Humidity [%]
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
0/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/
5/410/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/320/325/
10/500/320/320/320/320/320/320/320/320/320/320/320/320/325/415/415/415/415/4110/
15/590/320/320/320/320/320/320/320/320/325/415/415/415/4110/5010/5010/5010/5010/5015/
20/680/320/320/320/320/320/325/415/415/4110/5010/5010/5010/5015/5915/5915/5915/5915/5920/
25/770/320/320/320/325/415/4110/5010/5010/5010/5015/5915/5915/5920/6820/6820/6820/6820/6825/
30/860/320/320/325/415/4110/5010/5015/5915/5915/5920/6820/6820/6820/6825/7725/7725/7725/7730/
35/950/320/325/4110/5010/5015/5915/5920/6820/6820/6825/7725/7725/7725/7730/8630/8630/8630/8635/
40/
1040/325/41
45/
1130/32
50/
1225/41
Ambient Temperature [°C/°F]
60/
15/5920/6825/7730/8630/8635/9540/
140
70/
20/6825/7735/9535/9540/
158
80/
25/7735/9540/
176
90/
35/9540/
194
100/
40/
212
104
10/5010/5015/5920/6820/6820/6825/7725/7725/7730/8630/8630/8635/9535/9535/9535/9540/
10/5015/5915/5920/6825/7725/7725/7730/8630/8635/9535/9535/9535/9540/
10/5015/5920/6825/7725/7730/8630/8635/9535/9535/9540/
40/
40/
45/
113
50/
122
60/
140
45/
113
50/
122
60/
140
104
50/
122
104
50/
122
50/
122
45/
113
50/
122
60/
140
104
50/
122
50/
122
60/
140
45/
113
50/
122
60/
140
104
45/
113
50/
122
60/
140
104
50/
122
60/
140
60/
140
104
50/
122
60/
140
104
50/
122
50/
122
60/
140
40/
104
50/
122
60/
140
40/
104
50/
122
60/
140
104
45/
113
50/
122
60/
140
40/
104
45/
113
50/
122
60/
140
40/
104
45/
113
50/
122
60/
140
40/
104
45/
113
50/
122
60/
140
32
41
50
59
68
77
86
95
104
45/
113
50/
122
60/
140
Tab. 5: Minimum device temperatures [°C/°F]
Example:
Ambient temperature = 50 °C
Relative humidity = 40 %
Minimum device temperature = 30 °C
Temperatures higher than 60°C
(140°F) are not recommended due to
the temperature limitation of the
sensor.
The use of lower temperatures is at your own risk!
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9.2 Intrinsic Safety
Attention! Important note on the approval of the ATEX system!
Due to the classification of the Ex Power Supply for the gas explosion group IIB, the infrared
sensing heads may only be used in IIB. No use in hydrogen, acetylene or carbon disulphide
atmosphere allowed!
9.2.1 Sensing Heads
The sensing heads for the MI3, MI3xxLTH, and MI3100 series are available as intrinsic safety rated
sensing heads (…IS) intended for use in explosive atmospheres.
The sensing heads xxMI3xxxISx and xxxMI3100xxxISx follow the ATEX / IECEx certification in
accordance to:
Certificate:
The ambient temperature range for these sensing heads is specified as follows:
LT, G5 -10 to 120°C (14 to 248°F)
1M, 2M 0 to 120°C (32 to 248°F)
The intrinsically safe sensing heads 1M/2M are available with water cooled housing. The water cooled
housing can provide a cooler, more stable operating environment for the sensing head but does not
allow for approved intrinsically safe operation when external ambient conditions are exceeding the
ambient temperature ranges.
The sensing heads xxxMI3xxLTHISx follow the ATEX / IECEx certification in accordance to:
Certificate:
The ambient temperature range for these sensing heads is specified as follows:
LTH sensing head -10 to 180°C (14 to 356°F)
Detached electronic unit -10 to 120°C (14 to 248°F)
BVS 12 ATEX E 140 IECEx BVS 15.0051
II 2G Ex ib IIC T4 Gb Ex ib IIC T4 Gb
II 2D Ex ib IIIC T135°C Db Ex ib IIIC T135°C Db
BVS 12 ATEX E 140 IECEx BVS 15.0051
II 2G Ex ib IIC T4/T3 Gb Ex ib IIC T4/T3 Gb
II 2D Ex ib IIIC T135°C/185°C Db Ex ib IIIC T135°C/185°C Db
For further information to relevant standards and the examination certificate, see section 19.3 ATEX
Certificate of Conformity for Sensing Heads, page 133 and section 19.5 IECEx Certificate of
Conformity for Sensing Heads, page 139.
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Protective ground
(PE)
max. torque 3 Nm
(2.2lb
f ft)
9.2.2 Ex Power Supply
9.2.2.1 Ex Power Supply for non-hazardous areas
The Ex Power Supply RAYMI3ACISx must be used to operate ATEX / IECEx certified sensing heads in
hazardous environments. The Ex Power Supply is installed in a non-hazardous area to supply power
to intrinsically safe sensing heads. The Ex Power Supply is to be ordered separately (RAYMI3ACISx).
The Ex Power Supply follows the ATEX / IECEx certification in accordance to:
Certificate:
The Ex Power Supply is specified as follows:
Power supply 115 / 230 VAC, 50/60 Hz, 0.1 A, internal fuse 0.25 A (nonexchangeable)
Operating temperature -10 to 65°C (14 to 149°F)
Storage temperature -20 to 85°C (-4 to 185°F)
Rating IP65
Material Aluminum, die casted
BVS 12 ATEX E 140 IECEx BVS 15.0051
II (2)G [Ex ib Gb] IIB [Ex ib Gb] IIB
II (2)D [Ex ib Db] IIIC [Ex ib Db] IIIC
Figure 41: Dimensions of Housing for Ex Power Supply
For further information to relevant standards and the examination certificate, see section 19.4 ATEX
Certificate of Conformity for Ex Power Supply, page 136 and section 19.6 IECEx Certificate of
Conformity for Ex Power Supply, page 143.
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only shielded cable
with low capacitance about 100
pF/m (33
pF/ft).
Explosion
c
ritical area
Ex Powe
r
Supply
MI
3 Communication Box
Dat
a cable
8-32 V
DC
Explosion
c
ritical area
Ex Powe
r Supply
MI
3 Communication Box
9.2.3 Installation
The basic installation of sensing heads and the Ex Power Supply is shown in the following figure.
100 to 127 VAC
200 to 240 VAC
5 m
(16 ft)
Mains is selected by switch. Before installation please check local mains voltage to avoid damage!
Figure 42: Basic Installation in the Explosion Critical Area
The Ex Power Supply can drive a maximum of two sensing heads. For additional sensing heads in the
explosion-critical area, therefore, a further Ex Power Supply is to be used. Since the MI3 communication
box can control up to eight sensing heads, no further communication box is required for the entire
system, see the following figure.
Max. 30 m (98 ft)
head cable length
in total for both channels
Figure 43: Principle of multi-head installation in an explosion critical area
In areas with explosive environments, only intrinsically safe sensing heads must be used!
The total sensing head cable length per ex power supply must not exceed 30 m (98 ft)!
The standard data cable length to the communication box is 5 m (16 ft). In response to the
interference in the environment the length of the cable may be up to 30 m (98 ft). Use
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The following illustration shows the external wiring of the Ex Power Supply with the sensing heads,
the communication box and the mains supply.
Before Installation – select local mains voltage!
100 to 127 VAC
200 to 240 VAC
Sensing Head 1
MI3
Communication
Box
Sensing Head 2
Figure 44: External Wiring of the Ex Power Supply
To wire the mains supply, see the following section 9.2.4 Mains Supply, page 62.
For the installation of the sensing head cable and the cable for the communication box the color coding
for the individual wires needs to be considered. For the EMC compliant connection of the cable with
the grommet follow the implementation order illustrated in the figure below.
Make sure to implement
a 360° shield contact
Ex Power Supply Sensing Head /
with the contact socket!
Communication Box
1
Figure 45: EMC Compliant Connection for the Cables for Sensing Heads and Communication Box
1
© photo courtesy of HUGRO-Armaturen GmbH
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equipment.
S
witch
P
osition
Mains voltage range
115
100to127 VAC, 50/60 Hz
230200 to
240 VAC, 50/60 Hz
Terminal
X1LN
PE
240 VAC
240 VAC
E
arth
9.2.4 Mains Supply
The Ex Power Supply does not include a power switch. You must supply a mains disconnect switch.
This switch should be in close proximity to the operator and clearly marked as the power shutoff for
the equipment.
If you use a line conditioner or isolation transformer, connect it according to the manufacturer’s
instructions. Please observe grounding instructions and make sure earth ground is supplied to the
terminal block of the Ex Power Supply, see Figure 41.
All local electrical codes related to installation and grounding of electrical equipment should be
followed.
Before installation select the correct local mains voltage via the switch on the circuit
board of the Ex Power Supply, see Figure 46.
A ground wire must be connected to the (PE - protective earth) terminal on the
circuit board of the Ex Power Supply.
To prevent possible electrical shock, fire or personal injury, make sure that the
processor box is grounded before use.
Follow all local electrical codes related to installation and grounding of electrical
To prevent personal injury, make sure the mains disconnect switch is off before
opening the box lid.
The protective earth screw (marked with and found on the front side of the Ex
Power Supply) requires connection to the local ground by using a 6 mm² (AWG 10)
green/yellow wire.
Figure 46: Switch Positions for Selecting the Mains Voltage Range
live
100-
Figure 47: Connecting the Power Cord to the Terminal in the Ex Power Supply
100-
neutral
Protective
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The Earth Ground wire should be slightly longer than the two other wires, so if the cable is accidentally
pulled, the line and neutral wires are disconnected first.
You need to connect the AC mains. Only cable with 3 wires in a size of 1.5 to 2.5 mm² (AWG 14 to 16)
should be used.
An external 6 to 16 A line fuse (type B) or an equivalent circuit breaker is required for
the AC mains installation.
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Accessories
Comm Box
Head 1
Head 2
Head 8
Multi-Channel Box
10 Accessories
A full range of accessories for various applications and industrial environments are available.
Accessories include items that may be ordered at any time and added on-site.
10.1 Accessories (all models)
Multi-Channel Box (XXXMI3CONNBOX)
USB/RS485 Adapter for boxes with RS485 interface (XXXUSB485)
10.1.1 Multi-Channel Box
The Multi-Channel Box can be used for all communication boxes. The box includes 8 sets of fiel d wiring
terminals wired in parallel to one 5 m (16 ft) cable set to connect to the communication box.
5 m
(16 ft)
Figure 48: Multiple Head Configuration with Comm Box
Technical Data
Ambient Temperature -20 to 100°C (-4 to 212°F)
Storage Temperature -20 to 100°C (-4 to 212°F)
Rating IP65 (NEMA-4) / IEC 60529
Relative Humidity 10% to 95% non-condensing
Vibration 11 to 200 Hz, 3 g above 25 Hz operating, 3 axes / IEC 60068-2-6
Shock 50 g, 11 ms, operating, 3 axes / IEC 60068-2-27
The Multi-Channel Box must not be used with Ex power supply IS unit for wiring heads!
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Figure 49: Dimensions
to Comm Box
Accessories
(MI3COM
M or MI3MCOMM)
Figure 50: Wiring Diagram for 8 Heads
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Correct position of the
Shield with metallic
Please note the correct mounting of the cable shield requires a strong metallic contact to the grommet.
to the grommet
contact
shiel
d before mounting
Figure 51: Correct Mounting of the Cable Shield
The total sensing head cable length for all networked sensing heads must not exceed 30
m/98 ft (for MI3) and 2x30 m/2x98 ft (for MI3M)!
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10.1.2 USB/RS485 Adapter
Termination
The USB/RS485 adapter is self-powering via the USB connection.
Figure 52: USB/RS485 Adapter (XXXUSB485)
Accessories
Figure 53: Wiring the RS485 Interface of the Box (left)
and USB/RS485 Adapter (right)
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Accessories
Sensing Head
Adjustable
Bracket
Fi
xed Bracket
10.2 Accessories (LT, G5 Heads)
Adjustable Mounting Bracket (XXXMIACAB)
Fixed Mounting Bracket (XXXMIACFB)
Sensing head mounting nut (XXXMIACMN)
Air Purge Jacket (XXXMIACAJ)
Air Cooling System with 0.8 m (2.6 ft.) air hose (XXXMIACCJ) or with 2.8 m (9.2 ft.) air hose
(XXXMIACCJ1)
Right Angle Mirror (XXXMIACRAJ, XXXMIACRAJ1)
Protective Windows
Close Focus Lens (XXXMI3ACCFL)
Commun
Figure 54: Standard Accessories for LT, G5 Heads
ication Box
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10.2.1 Adjustable Mounting Bracket
Accessories
Figure 55: Adjustable Mounting Bracket (XXXMIACAB)
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10.2.2 Fixed Mounting Bracket
Figure 56: Fixed Mounting Bracket (XXXMIACFB)
10.2.3 Air Purge Jacket
For LTH sensing heads, the Air Purge Jacket is only available pre-mounted from the
factory (XXXMIACAJI)!
The air purge jacket is used to keep dust, moisture, airborne particles, and vapors away from the sensing
head. Clean, oil free air is recommended. The air purge jacket withstands ambient temperatures up to
180°C (356°F) and has limited use for cooling purposes. The recommended air flow rate is 30 to 60 l /
min (0.5 to 1 cfm). The max. pressure is 5 bar (73 PSI).
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Accessories
Fitting to M5
Hose with
inner
thread
inner
diam
(0.12 in), outside
5 mm (0.2 in)
Figure 57: Air Purge Jacket (XXXMIACAJ)
Figure 58: Mounting the Air Purge Jacket
1. Remove the sensor ① and cable from the communication box by disconnecting the wires from
the terminal.
2. Open the Air Purge Jacket ③ ④ and screw the white plastic fitting ② onto the sensor up to the
end of the threads. Do not over-tighten!
3. Slip the cable ⑥ through the backside ④ of the jacket.
4. Close the Air Purge Jacket ③ ④, reconnect the wires to the communication box and apply the
mounting nut ⑤.
eter
of
3 mm
10.2.4 Air Cooling System
For LTH heads, the Air Cooling System can only be ordered pre-assembled at the factory!
The sensing head can operate in ambient temperatures up to 200°C (392°F) with the air-cooling system.
The air-cooling system comes with a T-adapter including 0.8 m / 31.5 in (optional: 2.8 m / 110 in) air
hose and insulation. The T-adapter allows the air-cooling hose to be installed without interrupting the
connections to the box.
The air-cooling jacket may be combined with the right angle mirror.
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Accessories
max. ambient 200°C (392°F)
max. ambient 50°C (122°F)
Air Hose
Air cooling (max. 35°C / 95°F)
Hose to
T-Adapter
Fitting free for air
connection
Sensing Head
Figure 59: Air Cooling System (XXXMIACCJ)
sensing
head
T-
Adapter
Box
Hose:
inner Ø:
outer Ø: 12 mm (0.47 in)
Cable
Cable to box
9 mm (0.35 in)
Figure 60: Connecting the T-Adapter
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60 l / min (2.1 cubic feet per minute)
Air Flow:
50 l / min
(1.8 cfm)
40 l / min
(1.4 cfm)
Accessories
Hose Length
Figure 61: Maximum Ambient Temperature is dependent on Air Flow and Hose Length
Note: “Hose Length“ is the length of the hose exposed to high ambient temperature (not the overall
length of the hose).
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Figure 62: Air Cooling System: Purging Jacket and T-Adapter
The Air Cooling System consists of:
① sensing head
② inner plastic fitting (air purge jacket)
③ front part of the air-purging jacket
④ back part of the air-purging jacket
⑤ mounting nut
⑥ preinstalled cable between sensor and box, leading through the T-adapter
⑦ hose connecting nut
⑧ inner hose
⑨ outer hose
⑩ T-adapter
⑪ rubber washer
⑫ plastic compression fitting
⑬ cap
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Hose:
inner Ø: 9 mm (0.35 in)
outer Ø: 12 mm (0.47 in)
Figure 63: Dimensions of Air Cooling System
10.2.5 Right Angle Mirror
The right angle mirror comes in two different versions:
XXXMIACRAJ right angle mirror as accessory for air purge jacket or air cooling system
XXXMIACRAJ1 right angle mirror with integrated air purge (not available for LTH sensing heads)
Figure 64: Right Angle Mirror XXXMIACRAJ (left),
Right Angle Mirror with Air Purge XXXMIACRAJ1 (right)
The right angle mirror withstands ambient temperatures up to 180°C (356°F).
For mounting the right angle mirror (XXXMIACRAJ), see section 10.2.3 Air Purge Jacket, page 70.
However, instead of using the front part of the air purge jacket ③, mount the right angle mirror.
Figure 65: Right Angle Mirror (* with Air Purge)
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Accessories
Order number
Material
Transmission
T
holder:
stainless steel
holder:
stainless steel
Make sure the measuring head and
the
protection window are at the same temperature
!
Order number
Material
Transmission
T
holder:
stainless steel
The IR beam length within the right angle mirror is 18 mm (0.7 in.) which needs to be considered for
spot size calculations.
10.2.6 Protective Windows
Protective windows can be used to protect the sensing head from dust and other contamination.
The protective window can be directly screwed onto the sensing head. It has an outer diameter of 17 mm
(0.67 in).
The following table provides an overview of the available windows.
ambient
XXXMIACPW
XXXMI3ACPWP
For correct temperature readings, the transmission of the protective window must be set
via the control panel in the communication box. See section 8.2 <Head> Page, page 49!
window: Zinc Sulfide
(visually transparent, flat)
window: Polymer
(milky transparent, flat)
Table 6: Available Protective Windows
Figure 66: Protective Window
0.75 ±0.05
(for LT, G5 models)
0.7 ±0.02
(LT models only)
180°C (356°F)
65°C (149°F)
10.2.7 Close Focus Lens
The close focus lens is designed to get very small measurement spots down to 0.5 mm (0.02 in). The lens
should be used for LT models only.
The close focus lens has an outer diameter of 17 mm (0.67 in) and can be directly screwed onto the
sensing head.
ambient
XXXMI3ACCFL
window: Silicon
(visually opaque, curved)
Table 7: Close Focus Lens
0.75 ±0.05
(for LT models)
180°C (356°F)
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Accessories
For correct temperature readings, the transmission of the close focus lens must be set via
the control panel in the communication box. See section 8.2 <Head> Page, page 49!
Make sure the measuring head and the close focus lens are at the same temperature!
Figure 67: Sensing Head with Close Focus Lens (XXXMI3ACCFL)
Figure 68: Spot Size Charts for Close Focus Lens
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Accessories
Adjustable Mounting
Fixed Mounting
Air Purge
Collar
Pr
otective Window
Right Angle
Mirror
Mount
ing Nut
10.3 Accessories (1M, 2M Heads)
Fixed Mounting Bracket (XXXMI3100FB)
Adjustable Mounting Bracket (XXXMI3100ADJB)
Isolation Kit (MI3100ISOKIT)
Air Purge Collar (XXXMI3100AP)
Right Angle Mirror (XXXMI3100RAM)
Protective Window (XXXMI3100PW)
Sensing Head
Bracket
Bracket
Figure 69: Overview of available accessories
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10.3.1 Fixed Mounting Bracket
Accessories
Figure 70: Dimensions of Fixed Mounting Bracket (XXXMI3100FB)
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Accessories
10.3.2 Adjustable Mounting Bracket
Figure 71: Dimensions of Adjustable Mounting Bracket (XXXMI3100ADJB)
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Accessories
Isolation Kit
Extruded Lips facing each other
10.3.3 Isolation Kit
The isolation kit (MI3100ISOKIT) can be used likewise for the fixed mounting bracket (XXXMI3100FB)
and the adjustable mounting bracket (XXXMI3100ADJB). Two non-conductive rings insulate the
sensing head (1M, 2M) electrically from the mounting bracket. The isolation kit is used to implement
installations with one earth grounded point only, see section 4.5 Electrical Interference, page 23.
The maximal ambient temperature for the isolation kit is 250°C (482°F). The delivery for the isolation
kit consists of two insulating rings made of Teflon and a mounting nut made of stainless steel. The
desired mounting bracket needs to be ordered separately.
Make sure that the insulating rings are mounted so that both extruded lips facing each other. Use the
two mounting nuts to secure the arrangement.
Fixed Mounting Bracket
Figure 72: Installing the Isolation Kit (MI3100ISOKIT)
Exemplary shown for fixed mounting bracket
Figure 73: Fixed Mounting Bracket with Isolation Kit
Installing the Isolation Kit requires a mounting bracket in its latest version (inner
diameter of 20 mm (0.79 in) instead of 18.5 mm (0.73 in) for the previous version)!
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Accessories
10.3.4 Air Purge Collar
The Air Purge Collar is used to keep dust, moisture, airborne particles, and vapors away from the lens.
It can be mounted before or after the bracket. The Air Purge Collar comes with a 1/8” NPT stainless steel
fitting. Air flows into the fitting and out the front aperture. The pressure of air should be 0.6 to 1 bar (8.7
to 15 PSI). Clean, oil free air is recommended.
Figure 74: Dimensions of Air Purge Collar (XXXMI3100AP)
10.3.5 Right Angle Mirror
The Right Angle Mirror is used to turn the field of view by 90° against the sensor axis. It is recommended
when space limitations or excessive radiation do not allow for direct alignment of the sensor to the
target. The mirror must be installed after the bracket and after the Air Purge Collar and screwed in fully.
In dusty or contaminated environments, air purging is required to keep the mirror surface clean.
Figure 75: Dimension of Right Angle Mirror (XXXMI3100RAM)
When using the Right Angle Mirror, adjust the emissivity or transmissivity settings
downward by 5%. For example, for an object with an emissivity of 0.65, you adjust the value
down to 0.62. Or, you can keep the emissivity 0.65 and adjust the transmissivity from 1.0 to
0.95. This correction accounts for energy losses in the mirror.
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Accessories
Order number
Material
Transmission
T
holder:
stainless steel
0.93±0.05
120°C
Make sure the measuring head and
the
protection window are at the same temperature
!
10.3.6 Protective Window
Protective windows can be used to protect the sensing head from dust and other contamination. The
protective window can be directly screwed onto the sensing head.
The following table provides an overview of the available windows.
ambient
XXXMI3100PW
For correct temperature readings, the transmission of the protective window must be set
via the control panel in the communication box. See section 8.2 <Head> Page, page 49!
window: fused silica
Table 8: Available Protective Windows
Figure 76: Protective Window
(for 1M, 2M models)
(248°F)
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Maintenance
S
ymptom
Probable Cause
Solution
No output
No power to instrument
Check the power supply
Erroneous temperature
Faulty sensor cable
Verify cable continuity
Erroneous temperature
Field of view obstruction
Remove the obstruction
Erroneous
temperature
Window lens
Clean the lens
Erroneous temperature
Wrong emissivity
Correct the setting
Temperature fluctuates
Wrong signal processing
Correct Peak/Valley Hold or Average settings
Temperature fluctuates
No ground for the head
Check wiring / grounding
Symptom
0 to 5 V
0 to 10 V
0 to 20 mA
4 to 20 mA
Temperature over range*
5 V
10 V
21 to 24 mA
21 to 24 mA
Temperature under range*
0 V
0 V
0 mA
2 to 3 mA
Head ambient temperature out of range
5 V
10 V
21 to 24 mA
21 to 24 mA
Communication error between head and box
5 V
10 V
21 to 24 mA
21 to 24 mA
11 Maintenance
Our sales representatives are always at your disposal for questions regarding application assistance,
calibration, repair, and solutions to specific problems. Please contact your local sales representative, if
you need assistance. In many cases, problems can be solved over the telephone. If you need to return
equipment for servicing, calibration, or repair, please call our Service Department for authorization
prior to return. Phone numbers are listed at the beginning of this document.
11.1 Troubleshooting Minor Problems
Table 9: Troubleshooting
11.2 Fail-Safe Operation
The Fail-Safe system is designed to alert the operator and provide a safe output in case of any system
failure. The sensor is designed to shutdown the process in the event of a set-up error, system error, or a
failure in the sensor electronics.
The Fail-Safe circuit should never be relied on exclusively to protect critical processes.
Other safety devices should also be used to supplement this function!
When an error or failure does occur, the display indicates the possible failure area, and the output
circuits automatically adjust to their preset levels. See the following tables:
* related to zoomed temperature range
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Table 10: Error Codes for Analog Output
Symptom
JKRSTemperature over range
> 1200°C
> 1372°C
> 1768°C
> 1768°C
Temperature under range
-
210°C
-
210°C
-
50°C
-
50°C
Head ambient temperature out of range
> 1200°C
> 1372°C
> 1768°C
> 1768°C
Output
Error Code Description
T
−−−
Communication error between head and box
T>>>
Temperature over range
T<<<
Temperature under range
Display
Error Code Description
“No sensor”
No
sensing head detected
“Sensing head #n lost”
Communication error between head and box
“>”
Temperature over top range* e.g. “>600°C”
“<”
Temperature under bottom range* e.g. “<
−40°C”
Maintenance
Table 11: Error Codes for Thermocouple Output TC
Table 12: Error Codes via Field Bus
* related to full measurement range
Table 13: Error Codes for LCD Display
(2192°F)
(-346°F)
(2192°F)
(2502°F)
(-346°F)
(2502°F)
(3214°F)
(-58°F)
(3214°F)
(3214°F)
(-58°F)
(3214°F)
11.3 Cleaning the Lens
Keep the lens clean at all times. Care should be taken when cleaning the lens. To clean the window, do
the following:
1. Lightly blow off loose particles with “canned” air (used for cleaning computer equipment) or a
small squeeze bellows (used for cleaning camera lenses).
2. Gently brush off any remaining particles with a soft camel hair brush or a soft lens tissue
(available from camera supply stores).
3. Clean remaining “dirt” using a cotton swab or soft lens tissue dampened in distilled water. Do
not scratch the surface.
For finger prints or other grease, use any of the following:
Denatured alcohol
Ethanol
Kodak lens cleaner
Apply one of the above to the lens. Wipe gently with a soft, clean cloth until you see colors on the
surface, then allow to air dry. Do not wipe the surface dry, this may scratch the surface.
If silicones (used in hand creams) get on the window, gently wipe the surface with Hexane. Allow to air
dry.
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Maintenance
Do not use any ammonia or any cleaners containing ammonia to clean the lens. This
may result in permanent damage to the lens’ surface!
11.4 Sensing Head Exchange
To exchange a sensing head, the following procedure is required:
1. Disconnect power to the box.
2. Disconnect all head wires from the box terminal.
3. Power the box.
4. The alarm indicator of the box starts to blink indicating a lost sensing head.
5. Press the button to navigate to the head page indicating a lost sensing head.
6. Decide whether you want to select:
a) <Remove Yes>: to remove the head permanently from the box by loosing all head
parameters (head address de-allocated for other heads, alarm condition is reset) – the next
head connected later will be detected as a new head and automatically assigned to a free head
address.
or
b) <Remove No>: to keep the head assigned to the box by saving all head parameters for a
future use without the need to parameterize that head again (head address reserved for that
individual head, alarm condition is kept) – the same head connected later will be detected as a
known head by keeping the previous address.
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DataTemp Multidrop Software
12 DataTemp Multidrop Software
12.1 Software Features
DataTemp Multidrop DTMD provides sensor setup, remote monitoring, and simple data logging for
analysis or to meet quality record-keeping requirements. Additional features configurable with DTMD
Software:
Eight-position “recipe” table that can be easily interfaced to an external control system
External reset signal input FTC for signal processing
External inputs FTC for analog emissivity adjustment or background radiation compensation
Remote digital communication and control of up to 32 sensors in an RS485 multidrop
configuration
For more detailed information, see the comprehensive help feature in the DTMD software.
12.2 PC Requirements
PC with Windows 2000/XP/Vista/Win7, 64 MB RAM memory
about 10 Mb free memory on the hard disc for program files
USB port with recommended USB/RS485 adapter (available as accessory), see section
10.1.2 USB/RS485 Adapter, page 67.
12.3 USB Driver Installation
Before running the DTMD Software the installation of an adequate USB driver is required, see section
5.6 USB, page 36.
12.4 Software Launch
Make sure any sensor is turned on and the USB driver is installed before running DTMD software.
The Startup Wizard runs the first time you use the program. Please note:
The wizard shows active COM ports only!
The sensor requires the selection of <ASCII protocol>!
The DTMD software communicates to Comm Boxes only! A multidrop installation is related to a
network with multiple Comm Boxes and not to a multiple head system with one Comm box only!
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RS485
Terminal
RS485
A
positive
signal
(or RxA, or D+)
B
negative
signal
(or RxB, or D
-)S1
Switch for
termination
Internal shunt for termination
13 RS485
The RS485 serial interface is used for long distances up to 1200 m (4000 ft) or for networked
communication boxes.
To connect the RS485 interface to a standard computer you should use a dedicated adapter, see section
10.1.2 USB/RS485 Adapter, page 67. The RS485 interface allows the communication either via the
standard Multidrop Software or directly via dedicated ASCII commands, see section 18 ASCII
Programming, page 117.
Specification:
Physical layer: RS485, 2 wire, half-duplex, electrically isolated
Baud rate: 9.6, 19.2, 38.4, 57.6, 115.2 kBit/s
Settings: 8 data bits, 1 stop bit, no parity, flow control: none (half duplex mode)
Connection: terminal
Address range: 1 to 32
configurable via the control panel, see section 8.3 <Box Setup> Page, page 50
0 for stand-alone unit or broadcast transmission
13.1 Wiring
13.1.1 Comm Box (metal)
Figure 77: RS485 Terminal for Comm Box (metal)
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13.1.2 Comm Box (DIN)
Pin
RS485
8
Shield
9D-orB
(or RxB):
negative signal
10
D+ or
A
(or RxA):
positive signal
Termination
Figure 78: Terminal for Comm Box (DIN)
13.2 ASCII Programming
RS485
For the programming details, see section 18 ASCII Programming, page 117.
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Profibus
X1 Pin
Terminal
Profibus
14 Profibus
Profibus DP-V0 defines a cyclical data exchange between a master (e.g. a PLC) and a slave (MI3 sensor).
At start-up first an array of parameters (Profibus specific data) is sent from the master to the slave,
followed by an array with the configuration (sensor specific presetting’s taken from the GSD file) also
sent from the master to the slave.
After start-up the bus switches to the data exchange state. In this state in- and output data gets
exchanged cyclically between master and slave. The input data is sent from the slave to the master and
contains mainly the measured temperatures of the MI3 sensor, see section 14.2.2 Input Data, page 94.
The output data is sent from the master to the slave and contains a set of selected sensor parameters,
see section 14.2.3 Output Data, page 95. In case of an error in start-up phase or during data exchange
diagnostic data is sent to the master, see section 14.2.4 Diagnose Data, page 95.
Each Profibus device comes with a device description file (GSD file) which is read by the programming
software of the master to define the slave.
Specification:
Version: Profibus DP-V0
Physical layer: RS485, 2 wire, electrically isolated
Baud rate: 9.6 kBit/s to 12 MBit/s (automatic negotiated)
Connection terminal or Sub-D or M12
Address range: 1 to 125, for the Profibus device
configurable via the control panel, see section 8.3 <Box Setup> Page, page 50
ID 0D36
GSD Datei RAY_0D36.gsd
Head support up to 8 sensing heads (MI3 or MI3100)
14.1 Wiring
14.1.1 Comm Box (metal)
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Profibus
1
A
2
B
3
Shield
4
GND
5
n.a.6+ 5 V
LED,
redblinking
, no data communication
LED,
yellow
ON:
data-exchange
Profibus
Sub-D Pin
M12 Pin
A
8
(green)
2(white)B
3
(yellow)
4(black)Shield
GND5(white)
3
(blue)
n.a.
+ 5 V6(brown)
1
(brown)
(negative signal)
(positive signal)
(output, used for external termination)
(output, used for external termination)
Figure 79: Profibus Terminal for Comm Box (metal)
A Sub-D female connector or a M12 female connector can be ordered separately for Profibus. The M12
connector is B-coded. Please note the Sub-D connector is not IP rated!
1 5432
6 9
7 8
Figure 80: Sub-D Connector (…P2) and M12 Connector (…P1)
(cable color)
(negative signal)
(positive signal)
Figure 81: Profibus Pin Assignment for Sub-D / M12 Connector
The termination for Profibus networks must be realized externally by the user!
(cable color)
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Profibus
Pin
Profibus
1
n.a.2Shield
3
A2
4
B2
5
A1
6
B17Shield
8
n.a.9DE
LED,
yellow
ON: data
-
exchange
Slave
Slave
Slave
Slave
Termination
n
Figure 82: Exemplary Network with External Termination
14.1.2 Comm Box (DIN)
Slave
n+1
n
Termination
n-1
n-1
(negative signal)
(positive signal)
(negative signal)
(positive signal)
(not supported while termination “on”)
(not supported while termination “on”)
Figure 83: Terminal for Comm Box (DIN 6TE)
Indicator
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14.2 Programming
Byte
Address
Description
Format
Range
0 to 6
Fix7DP-V1 Status1
8DP-
V1 Status2
9DP-
V1 Status3
103Temp. unit
67=
°C, 70=°F
67 or70114Reserved
12, 13
5
Bottom temp. of output 1
in 0.1°C /°F
14, 15
7
Top temp. of output 1
in 0.1°C /°F
16, 17
9
Bottom temp. of output 2
in 0.1°C /°F
18,1911
Top temp. of output 2
in 0.1°C /°F
2013Source (head) for output
-1head
number
1…82114
Type of source for
output
-173 = I (internal temp.)
73 or 84
2215Analog output mode 1
5 = TCJ
5…10, 99
2316Source (head) for
output
-2head number
1…82417
Type of source for
output
-273 = I (internal temp.),
73 or 84
2518Analog output mode 2
0 = 0…20mA
0, 4, 9, 10, 99
26…39
reserved
40…43
reserved
44, 45
37
Emissivity Head_1
* 1000 (0.9
900)
100 … 1100
46, 47
39
Transmissivity Head_1
* 1000 (1.0
1000)
100 … 1000
48, 49
41
Averaging time Head_1
* 0.1s (1s
10)
0 …9990
50, 51
43
Peak hold time Head_1
* 0.1s (
1s10)
0 …9990
52, 53
45
Valley hold time Head_1
* 0.1s (1s
10)
0 …9990
54, 55
47
Ambient temp. Head_1
in °C /°F
dev. range min..
56, 57
49
Setpoint relay Head_1
in °C /°F
dev. range min..
5851Relay alarm output control Head_1
0 =
off
0, 1 or 2
14.2.1 Parameter Data
without
offset
Profibus
84 = T (object temp.)
6 = TCK
7 = TCR
8 = TCS
9 = 0…5V
10 = 0…10V
99 = tristate (disabled)
84 = T (object temp.)
4 = 4…20mA
9 = 0…5V
10 = 0…10V
99 = tristate (disabled)
default: 9
default: 4
max
max
1 = target temp.
2 = internal temp.
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Profibus
Byte
Address
Description
Format
Range
5952Laser Head_1
0 = off, 1 = on,
0 or 1
60…63
reserved, for future consideration
64 …
Head_2
84 …
Head_3
104 …
Head_4
124 …
Head_5
144 …
Head_6
164 …
Head_7
184 …
Head_8
Address
Description
0
Box data
: Trigger state
1, 2
Box data: Internal temperature
3, 4
Head 1: Object temperature
5, 6
Head 1: Head temperature
7, 8
Head 2: Object temperature
9, 10
Head 2: Head temperature
11, 12
Head 3: Object temperature
13, 14
Head 3: Head
temperature
15, 16
Head 4: Object temperature
17, 18
Head 4: Head temperature
19, 20
Head 5: Object temperature
21, 22
Head 5: Head temperature
23, 24
Head 6: Object temperature
25, 26
Head 6: Head temperature
27, 28
Head 7: Object
temperature
29, 30
Head 7: Head temperature
31, 32
Head 8: Object temperature
33, 34
Head 8: Head temperature
without
offset
2 = flashing
14.2.2 Input Data
The input data consists of modules that have a fixed position in the data field. There are two types of
modules: <Box data> and <Data for one head>.
Module<Box data> consists of one byte in which bit0 gives the trigger state (configuration 0x12).
Module<Head data> consists of two bytes object temperature and two bytes head temperature
(configuration 0x51). The format is 1/10 °C/°F.
The slave expects one <Box data> module configured at the first position, followed by <Head data>
modules. Any other configuration will cause a configuration error.
The input data length gets calculated from the count of configured modules. So, if only one head is
connected and configured then only seven bytes are transferred. If all heads (maximal eight) are
connected and configured then 35 bytes are transferred. If only one head is connected but eight heads
are configured then also 35 bytes are transferred.
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Profibus
Address
Description
0
Type of parameter
1, 2
Parameter for Head 1
3, 4
Parameter for Head 2
5, 6
Parameter for Head 3
7, 8
Parameter for
Head 4
9, 10
Parameter for Head 5
11, 12
Parameter for Head 6
13, 14
Parameter for Head 7
15, 16
Parameter for Head 8
Number of type
Description
0
do not change anything
1
emissivity
2
laser3background
temperature (
background
temperature compensation)
4
averaging time
5
peak hold time
6
valley hold time
7
set point for the relay
14.2.3 Output Data
The device does not have output data in the original meaning. But the output data may be used to
change the initialization of the device (which was set once at start-up) when the bus is in data exchange
mode.
To do so the following structure is defined:
The <Type of parameter> comes with the format described in section 14.2.1 Parameter Data, page 93,
and can be set to the following parameters:
If <Type of parameter> is set to 0 then the output data gets ignored. So it should be set to 0 as default.
Attention: You should be aware that always all heads are updated! So you have to set all eight (or as
much as heads are connected) parameters to the correct value!
14.2.4 Diagnose Data
The device uses the first 32 bytes of the Identifier Related Diagnosis.
The first 6 bytes consist of Standard Diagnosis dedicated to bus parameters. In this field byte 4 and 5
give the unit identifier (0D36 in our case).
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Profibus
Byte
Description
6
size of the diagnosis
7…9
reserved
10 (0x0A)
highest address of the connected heads
up to which index the user data is valid
11 (0x0B)
box error code
12 … 22
(0x0C …16)
last MI3
-
command which created an error as answer; ASCII
code
23 (0x17)
head_1 error code
24 (0x18)
head_2 error code
25 (0x19)
head_3 error code
26 (0x1A)
head_4 error code
27 (0x1B)
head_5 error code
28 (0x1C)
head_6 error code
29 (0x1D)
head_7 error code
30 (0x1E)
head_8 error code
Bit
Description
0
Self-test error
1
Box ambient temperature out of range
2
Sensing head communication error
3
Parameter error
4
Register write error
Bit
Description
0
Object temperature out of range
1
Ambient (internal) temperature out of range
2
Parameter error
3
Register write error
4
Self-test error
5
reserved
6
Head registered but not connected
cable break?
Table 14: Diagnose Data
Table 15: Error Bits of Box Diagnose
Table 16: Error Bits of Head Diagnose
Figure 84: Diagnose Data without Errors
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Head 8
Highest
Head 1
Last bad
Figure 85: Diagnose Data with Error “Cable Break at Head 1”
Profibus
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Modbus
X1 Pin
Terminal
Modbus
1
D0
2
D1
3
Shield
4
GND
5
n.a.6+ 5 V
LED,
yellow
ON while communicating
LED,
red
Error
15 Modbus
The Modbus protocol follows the master/slave model. One master controls one or more slaves.
Typically, the master sends a request to a slave, which in turn sends a response. The request/response
mechanism is called a transaction. Requests and responses are also referred to as messages.
Specification:
Version: Modbus serial line (RS485)
Mode: RTU (Remote Terminal Unit)
Physical layer: RS485, 2 wire, electrically isolated
Baud rate: 9.6, 19.2, 38.4, 57.6, 115.2 kBit/s
Connection terminal
Address range: 1 to 247, for the Modbus device
configurable via the control panel, see section 8.3 <Box Setup> Page, page 50
Parity even
The detailed Modbus specification can be found under http://www.modbus.org/.
15.1 Wiring
15.1.1 Comm Box (metal)
(negative signal)
(positive signal)
(output, used for external termination)
(output, used for external termination)
(ON for 2 s on initial power up)
(ON for 2 s on initial power up)
Figure 86: Modbus Terminal for Comm Box (metal)
The termination for Modbus networks must be realized externally by the user!
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15.1.2 Comm Box (DIN)
Pin
Modbus
1
GND
2
Shield
3
D0_2
4
D1_2
5
D0_1
6
D1_17Shield
8
GND
9
n.a.
LED,
yellow
Communication
LED,
red
Error
Termination
Modbus
Indicators
(output)
(negative signal)
(positive signal)
(negative signal)
(positive signal)
Figure 87: Terminal for Comm Box (DIN 6TE)
(not supported while termination “on”)
(not supported while termination “on”)
(output)
MI3 Rev. G4 Aug/2022 99
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Modbus
Function code
Modbus Function
Description
01
Read Coils
Read n bits
02
Read Discrete Inputs
Read n bits
03
Read Holding Registers
Read n 16 bit words
04
Read Input
Registers
Read n 16 bit words
06
Write Single Register
Write a 16 bit word
16
Write Multiple Registers
Write n 16 bit words
Start
Size
Modbus Access
Data
Content
Values
MI3[M]
116input register
short
error code for last
0: no error
-1064
input register
hex
Serial number
e.g. 98123
XV2064
input register
string
Unit identification
e.g. MI3COMM
XU3064
input register
string
Box Firmware Revision
e.g. 2.10
XR4016
input register
short
Modbus slave address
1 .. 247
XAS5032input register
string
Box special
e.g. RAY, LAS
DS6032
holding register
integer
Baud rate RS485
9600, 19200, 38400, 57600, 115200
BR7016
holding register
char
Temperature Unit
0x43 ('C'), 0x46 ('F')
U8032
input register
float
Box Temperature
XJ9016
holding register
short
Switch panel lock
0: unlocked, 1: locked
J
15.2 Programming
Functions codes and start addresses are listed in decimal.
15.2.1 Supported Functions
15.2.2 Parameter Data
32 bit registers are transmitted in full Big-Endian mode, meaning most significant word is transmitted
first, least significant word is transmitted last. The byte order within a word is Big-Endian as well.
While some registers hold integer values, there are some holding floating points. The interchange
formats of the IEEE-754 standard for Floating-Point Arithmetic is used for representing floating points.
The following table lists all parameters, its content, their formats and usage.
15.2.2.1 Box Parameter
<k> … number of output channel, depending on the number of physically installed output channels of
the Comm Box.
Items (registers, discretes or coils) are addressed starting at zero. Therefore items numbered 1-10000 are
addressed as 0-9999.
address
[bits]
Type
request
command
1: value out of range
2: illegal head number
3: illegal analog output number
4: illegal output mode
5: output disabled error
99: unspecified error
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Modbus
Start
Size
Modbus Access
Data
Content
Values
MI3[M]
1008discretes input
bit field
Get connected heads
bit 0: head 1 ..
HC
1108discretes input
bit field
Get registe
red heads
bit 0: head 1 ..
HCR
12016holding register
short
Laser control (only with
0: off, 1: on
XL
13016holding register
short
Relay alarm output
0: off
KB
41032input register
float
ana
log
input 1 value
0 .. 5 V
TV1I
42032input register
float
ana
log
input 2 value
0 .. 5 V
TV2I
43016input register
short
Trigger
0: off
XT51016holding register
short
ana
log
output
1 mode
5: TCJ
XO1O52016holding register
short
ana
log output
2 mode
0–0...20 mA
XO2O
5<k>1
16
holding register
short
ana
log
output k source
head number or 0:
O<k>O
5<k>2
16
holding register
short
ana
log
output k source
1: internal temp. of 5<k>1
O<k>O
5<k>3
32
holding register
float
ana
log
output k fixed
value within range set in address
-
5<k>5
32
holding register
float
ana
log
output k bottom
device bottom temp. .. device top temp.
L<k>O
5<k>7
32
holding register
float
ana
log
output k top
device bottom temp. .. device top temp.
H<k>O
address
[bits]
Type
laser)
control
command
bit 7: head 8
bit high: head connected
bit low: head disconnected
bit 7: head 8
bit high: head registered
bit low: head not registered
1: on
2: norm. open
3: norm. closed
1: on
6: TCK
7: TCR
8: TCS
9: 0...5 V
10: 0...10 V
99: disable (tristate)
parameter
temp. value
temp. value
temp. value
4 – 4...20 mA
9 – 0...5 V
10 – 0...10 V
99 – disable (tristate)
fixed value from 5<k>3
2: object temp. of 5<k>1
5<k>0
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Modbus
Starting
Size
Modbus
Data
Content
Values
MI3[M]
<n>005
8
discretes
bit field
Head Status
bit0: Temperature Unit
HEC
<n>010
64
input register
hex
Head serial number
e.g. 10C02752
HN
<n>020
64
input
register
string
Head identification
e.g. "MI310LTS"
HI
<n>030
64
input register
string
Firmware Rev. Head
e.g. 2.10
HV
<n>040
16
input register
short
Head Address
1 .. 9HA<n>050
32
input register
string
Head special
e.g. !99HSRAY (read only)
HS
<n>060
32
input register
float
Device Bottom range
-
40 .. 1300 [°C]
XB
<n>070
32
input register
float
Device High range
-
40 .. 1300 [°C]
XH
<n>080
32
input register
float
Target temperature
number within range
<n>060 .. <n>070
T
<n>090
32
input register
float
internal sensor temp.
I
<n>100
32
holding
float
Ambient background
A
<n>110
32
holding
float
Advanced hold with
0 .. 999.9 [s]
AA
<n>120
16
holding
short
Control ambient
0: sensor temp.
AC
<n>130
16
holding
short
Laser control (only with
0: OFF, 1: ON
HL
<n>140
16
holding
short
Relay alarm output
0: off
KH
<n>150
32
holding
float
Advanced hold threshold
number within range <n>060 .. <n>070
C
<n>160
32
input register
float
Currently calculated
0.1 .. 1.1
CE
<n>170
32
input register
float
Current calculation
number within range <n>060 .. <n>070
CS
<n>180
32
holding
float
Sensor Gain
0.8 .. 1.2
DG
<n>190
32
holding
float
Sensor Offset
-
200 C .. +200 C
DO
<n>200
32
holding
float
Emissivity internal
0.1 .. 1.1
E
<n>210
16
holding
short
Presel. Emissivity
0 .. 7
EP
15.2.2.2 Head Parameter
<n> … head number, depending on the registered heads
address
[bits]
Access
input
register
Type
command
(0: deg. C, 1: deg. F)
bit1: Object temperature out of range
bit2: Ambient temperature out of range
bit3: Parameter error
bit4: Register write error
bit5: Self-test error
bit7: Background temp. compensation
(0: off, 1: on)
temp. compensation
register
register
register
register
register
register
register
register
register
average
background temp.
compensation
laser device)
control
emissivity
setpoint / relay function
Pointer
1: via number
2: via ext. input
1: Target
2: Ambient
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