
Features
• Single 3-V Supply Voltage
• High Power-added Efficient Power Amplifier (P
• Ramp-controlled Output Power
• Low-noise Preamplifier (NF Typically 2.1 dB)
• Biasing for External PIN Diode T/R Switch
• Current-saving Standby Mode
• Few External Components
• PSSO20 Plastic Package with Down-set Padd le Heat Slug or HP-VFQFP-N20 with
Extended Performance and Flipchip Version
Electrostatic sensiti ve device.
Observe precautions for handling.
Typically 23 dBm)
out
Bluetooth™/ISM
2.4-GHz FrontEnd IC
T7024
Description
The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier,
low-noise amplifier and T/R switch driver. It is especially designed for operation in
TDMA systems like Bluetooth
™
, DECT, and many other IS M app li ca tio ns acc ordi ng to
FCC part 15.
Due to the ramp-control feature and a very low quiescent current, an exter nal switch
transistor for V
is not required.
S
Figure 1. Block Diagram
T
U
N
U
P
TX/RX/
standby
control
TX
O
_
O
_
X
R
D
A
N
N
L
G
LNA
A
N
I
P
_
_
A
1
P
V
A
A
P
D
_
N
2
G
V
PA
P
P
M
_
A
2
R
V
SiGe Front End
T7024
Preliminary
H
C
T
I
W
S
_
R
D
T
N
U
G
O
_
H
C
T
I
W
S
A
N
I
N
_
L
A
_
N
S
L
V
T
D
U
N
O
G
_
A
P
_
3
V
T
T
U
O
_
A
P
_
3
V
D
U
N
O
G
_
A
P
_
3
V
Rev. 4533A–BLURF–09/02
1

Pin Configuration
Figure 2. Pinning PSSO20 Figure 3. Pinning HP-VFQFP-N20
20
19
18
17
16
15
14
13
12
11
RX_ON
LNA_OUT
GND
PA_IN
V1_PA
GND
V2_PA
V2_PA
RAMP
GND
GND
GND
10
1
2
3
4
5
T7024
6
7
8
9
R_SWITCH PU
SWITCH_OUT
LNA_IN
VS_LNA
V3_PA_OUT
V3_PA_OUT
V3_PA_OUT
Pin Description
Pins PSSO20 Pins N20 Symbol Function
1 4 R_SWITCH Resistor to GND sets the PIN diode current
2 5 SWITCH_OUT Switched current output for PIN diode
36GNDGround
4 7 LNA_IN Low-noise am plifier input
5 9 VS_LNA Supply voltage input for low-noise amplifier
68GNDGround
7 11 V3_PA_OUT Inductor to power supply and matching network for power amplifier output
8 12 V3_PA_OUT Inductor to power supply and matching network for power amplifier output
9 13 V3_PA_OUT Inductor to power supply and matching network for power amplifier output
10 10 GND Ground
11 15 RAMP Power ramping control input
12 16 V2_PA Inductor t o power supply for power amplifie r
13 17 V2_PA Inductor t o power supply for power amplifie r
14 14 GND Ground
15 19 V1_PA Supply voltage for power amplifier
16 20 PA_IN Power amplifier input
17 18 gnd Ground
18 1 LNA_OUT Low-noise amplifier output
19 2 RX_ON RX ac tive high
20 3 PU Power-up active high
Slug Slug GND Ground
V3_PA_OUT
V3_PA_OUT
V3_PA_OUT
GND
RAMP
D
N
G
10 6789
11
12
13
T7024
14
15
16 2019
17
A
P
_
2
V
A
N
I
N
_
L
_
S
V
A
P
_
2
V
D
D
A
N
N
N
G
L
G
5
SWITCH_OUT
4
R_SWITCH
3
PU
2
RX_ON
1
A
P
_
1
V
N
I
_
A
P
LNA_OUT
18
D
N
G
2
T7024
4533A–BLURF–09/02

Figure 4. Pad Location, Thickness: 450 µm
T7024
3180 µm
19
LNA_OUT
m
µ
0
0
6
1
20
12
R_SWITCH SWITCH_OUT
3
GND LNA_IN GND
18
21
17
PURX_ON
16
15
14
GNDGNDV1_PAPA_INGND
Pad diameter 180 µm
Ball diameter 200 µm
4
56 7
VS_LNA
GND GND V3_PA_OUT
8
13
V2_PA
9
12
RAMP
11
GND
10
GND
Pad Description
X-Coordinate of
Pad Symbol Function
Pad
(1)
(µm)
1 R_SWITCH Resistor to GND sets the PIN diode current 0 400
2 SWITCH_OUT Switched current output for PIN diode 400 400
3 GND Ground 0 0
4 LNA_IN Low-noise amplifier input 400 0
5 GND Ground 800 0
6 VS_LN A Supply volta ge input for low-noise amplifier 1200 0
7 GND Ground 1600 0
8 GND Ground 2000 0
9 V3_PA_OUT Inductor to power supply and matching network for
2400 0
power amplifier output
10 GND Ground 2780 150
11 GND Ground 2780 550
12 RAMP Power ramping control input 2780 950
13 V2_PA Inductor to power supply for power amplifier 2450 1200
14 GND Ground 2050 1200
15 GND Ground 1650 1200
16 V1_PA Supply voltage for power amplifier 1250 1200
17 PA_IN Power amplifier input 850 1200
18 GND Ground 400 1200
19 LNA_OUT Low-noise amplifier output 0 1200
20 RX_ON RX active high 0 800
21 PU Power-up active high 400 800
Note: 1. Relative to center of Pad 3.
Y-Coordinate of
Pad
(1)
(µm)
4533A–BLURF–09/02
3

Absolute Maximum Ratings
Parameters Symbol Value Unit
Supply voltage
V
S
6V
Pins VS_LNA, V1_PA, V2_PA, V3_PA_OUT
Junction tem p erature T
Storage temperature T
RF input power LNA P
RF input power PA P
j
stg
inLNA
inPA
150 °C
-40 to +125 °C
5dBm
10 dBm
Thermal Resistance
Parameters Symbol Value Unit
Junction ambient PSSOP20, slug soldered on PCB R
Junction ambient HP-VFQFP-N20, slug soldered on PCB R
thJA
thJA
19 K/W
27 K/W
Operating Range
All voltages are referred to ground (Pins GND and slug). Power supply points are VS_LNA, V1_PA, V2_PA, V3_PA_OUT.
The table represents the sum of all supply currents depending on the TX/RX mode.
Parameters Symbol Min. Typ. Max. Unit
Supply voltage Pins V1_PA, V2_PA and
V3_PA_OUT
Supply voltage Pin VS_LNA V
Supply current TX PSSO20
N20
RX
Standby current PU = 0 I
Ambient temperature T
V
S
S
I
S
I
S
I
S
S_standby
amb
2.7 3.0 4.6 V
2.7 3.0 5.5 V
190
165
8
mA
mA
mA
10 µA
-25 +25 +70 °C
4
T7024
4533A–BLURF–09/02

Electrical Characteristics
T7024
Test conditions (unless otherwise specified): VS = 3.0 V, T
Parameters Test Condit ions
Power Amplifier
Supply voltage Pins V1_PA, V2_PA, V3_PA_OUT V
Supply current TX PSSO20
Standby curren t Standby I
(1)
N20
RX (PA off), V
£ 0.1 V I
RAMP
amb
= 25°C
Symbol Min. Typ. Max. Unit
S
I
S_TX
I
S_TX
S_RX
S_standby
2.7 3.0 4.6 V
190
165
mA
mA
10 µA
10 µA
Frequency range TX f 2.4 2.5 GHz
Gain-control ra nge TX
DGp 60 42 dB
Power gain maximum TX, Pin PA_IN to V3_PA_OUT Gp 28 30 33 dB
Power gain minimum TX, Pin PA_IN to V3_PA_OUT Gp -40 -17 dB
Ramping voltage maximum TX, power gain (maximum)
Pin RAMP
Ramping v o ltage minimum TX, power gain (minimum)
Pin RAMP
Ramping current maximum TX, V
= 1.75 V, Pin RAMP I
RAMP
Power-added efficiency TX PSSO20
N20
Saturated output power TX, input power = 0 dBm referred to
Pins V3_PA_OUT
Input matching
Output matching
(2)
(2)
TX, Pin PA_IN Load
TX, Pins V3_PA_OUT Load
V
RAMP max
V
RAMP min
RAMP max
PAE
PAE
P
sat
VSWR
VSWR
1.7 1.75 1.83 V
0.1 V
0.5 mA
30
35
35
40
22.0 23 24.0 dBm
<1.5:1
<1.5:1
Harmonics at P 1dBCP TX, Pins V3_P A_OUT 2 fo -30 dBc
TX, Pins V3_PA_OUT 3 fo -30 dBc
T/R Switch Driver (Current Programming by External Resistor from R_SWITCH to GND)
Switch-out current output Standby, Pin SWITCH_OUT I
RX I
W I
W I
W I
¥ I
Low-noise Amplifier
TX at 100
TX at 1.2 k
TX at 33 k
TX at
(3)
S_O_standby
S_O_RX
S_O_100
S_O_1k2
S_O_33k
S_O_R
Supply voltage All, Pin VS_LNA V
Supply current RX I
Supply current
(LNA and control logic)
TX (control logic active)
Pin VS_LNA
1.7 mA
7mA
17 mA
19 mA
S
S
I
S
2.7 3.0 5.5 V
89mA
1µA
1µA
0.5 mA
Notes: 1. Power amplifier shall be unconditionally stable, maximum duty cycle 100%, true CW operation, maximum load mismatch
and duration: load VSWR = 10:1 (all phases) 10 s, Z
2. With external matching network, load impedance 50
= 50 W.
C
W.
3. Low-noise amplifier shall be unconditionally stable.
4. With external matching components.
%
%
4533A–BLURF–09/02
5

Electrical Characteristics (Continued)
Test conditions (unless otherwise specified): VS = 3.0 V, T
Parameters Test Condit ions
Standby curren t Standby, Pin VS_LNA I
amb
= 25°C
Symbol Min. Typ. Max. Unit
S_standby
110µA
Frequency range RX f 2.4 2.5 GHz
Power gain RX, Pin LNA_IN to LNA_OUT Gp 15 16 19 dB
Noise figure RX, PSSO20
N20
Gain compression RX,
referred to PinLNA_OUT
rd
-order input interception point RX IIP3 -16 -14 -13 dBm
3
Input matching
Output matching
(4)
(4)
RX, Pin LNA_IN VSWRin 2:1
RX Pin LNA_OUT VSWRout 2:1
NF
NF
2.5
2.1
2.8
2.3
dB
O1dB -9 -7 -6 dBm
Logic input levels (RX_ON, PU)
High input level = ‘1’ Pins RX_ON and PU V
Low input level = ‘0’ V
High input current = ‘1’ V
= 2.4 V I
iH
Low input current = ‘0’ I
iH
iL
iH
iL
2.4 V
S, LNA
00.5V
40 60 µA
0.2 µA
Notes: 1. Power amplifier shall be unconditionally stable, maximum duty cycle 100%, true CW operation, maximum load mismatch
and duration: load VSWR = 10:1 (all phases) 10 s, Z
2. With external matching network, load impedance 50
= 50 W.
C
W.
3. Low-noise amplifier shall be unconditionally stable.
4. With external matching components.
V
Control Logic for LNA and T/R Switch Driver
Operation Mode PU RX_ON
Standby 0 0
TX 1 0
RX 1 1
6
T7024
4533A–BLURF–09/02