Rainbow Electronics MX7535 User Manual

19-1116; Rev 1; 11/96
Microprocessor-Compatible,
14-Bit DACs
_______________General Description
The MX7534/MX7535 are high-performance, CMOS, monolithic, 14-bit digital-to-analog converters (DACs). Wafer-level, laser-trimmed, thin-film resistors and tempera­ture-compensated NMOS switches assure operation over the full operating temperature range with exceptional lin­ear and gain stability.
The MX7534 accepts right-justified data in two bytes from an 8-bit bus, while the MX7535 operates with a 14-bit data bus with separate MS-byte and LS-byte select controls. In addition, all digital inputs are compatible with both TTL and 5V CMOS-logic levels. The MX7534/MX7535 are intended for unipolar operation, but may be operated as bipolar DACs with additional external components. Both devices are protected against CMOS latchup, and neither requires the use of external Schottky protection diodes.
The MX7534 is available in 20-pin narrow (0.3") DIP, wide SO, or PLCC packages. The MX7535 is available in 28-pin, 600 mil wide DIP, wide SO, or PLCC packages.
________________________Applications
Machine and Motion Control Systems Automatic Test Equipment Digital Audio µP-Controlled Calibration Circuitry Programmable-Gain Amplifiers Digitally Controlled Filters Programmable Power Supplies
____________________________Features
14-Bit Monotonic Over Full Temperature RangeFull 4-Quadrant MultiplicationµP-Compatible, Double-Buffered InputsExceptionally Low Gain Tempco (2.5ppm/°C)Low Output Leakage (<20nA) Over Temp.Low Power ConsumptionTTL and CMOS Compatible
______________Ordering Information
PART TEMP. RANGE PIN-PACKAGE INL (LSBs)
MX7534KN
MX7534JN 0°C to +70°C 20 Plastic DIP ±2 MX7534KCWP MX7534JCWP 0°C to +70°C 20 SO ±2 MX7534KP 0°C to +70°C 20 PLCC ±1 MX7534JP 0°C to +70°C 20 PLCC ±2 MX7534J/D 0°C to +70°C Dice* ±2 MX7534BQ -25°C to +85°C 20 CERDIP ±1 MX7534AQ -25°C to +85°C 20 CERDIP ±2 MX7534BD MX7534AD -25°C to +85°C 20 Ceramic SB ±2 MX7534KEWP -40°C to +85°C 20 SO ±1 MX7534JEWP -40°C to +85°C 20 SO ±2 MX7534TQ -55°C to +125°C 20 CERDIP ±1 MX7534SQ -55°C to +125°C 20 CERDIP ±2 MX7534TD -55°C to +125°C 20 Ceramic SB ±1 MX7534SD -55°C to +125°C 20 Ceramic SB ±2
Ordering Information continued at end of data sheet.
*
Dice are tested at +25°C, DC parameters only.
0°C to +70°C 20 Plastic DIP ±1
0°C to +70°C 20 SO ±1
-25°C to +85°C 20 Ceramic SB ±1
MX7534/MX7535
_________________Pin Configurations
_______________Functional Diagrams
TOP VIEW
REF RFB
IOUT AGNDS AGNDF
DGND
D7 D6 D5 D4
DIP/SO/PLCC/Ceramic SB
MX7535 at end of data sheet.
________________________________________________________________
1 2 3 4
MX7534
5 6 7 8 9
10
20
V
SS
V
19
DD
18
CS WR
17
A0
16
A1
15
D0
14
D1
13 12
D2 D3
11
1
REF
Functional diagrams continued at end of data sheet.
14-BIT DAC
14
DAC REGISTER
6
MS
INPUT
REGISTER
7–14
D7–D0 DGND V
V
DD
19
8
LS
INPUT
REGISTER
CONTROL
LOGIC
6
20
SS
Maxim Integrated Products
2 3
4 5
15 16 18 17
MX7534
RFB IOUT
AGNDS AGNOF
A1 A0
CS WR
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800
Microprocessor-Compatible, 14-Bit DACs
ABSOLUTE MAXIMUM RATINGS
VDDto DGND ............................................................-0.3V, +17V
to AGND.............................................................-15V, +0.3V
V
SS
REF to AGND (MX7534) ......................................................±25V
REFS to AGND (MX7535)....................................................±25V
REFF to AGND (MX7535) ....................................................±25V
RFB to AGND.......................................................................±25V
Digital Input Voltage to DGND.........................-0.3V, V
IOUT to DGND.................................................-0.3V, V
AGND to DGND...............................................-0.3V, V
Continuous Power Dissipation (T
20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW
28-Pin Plastic DIP (derate 14.29mW/°C above +70°C)......1.14W
20-Pin SO (derate 10.00mW/°C above +70°C)..............800mW
28-Pin SO (derate 12.50mW/°C above +70°C).....................1W
20-Pin PLCC (derate 10.00mW/°C above +70°C) .........800mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
MX7534/MX7535
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
= +70°C)
A
DD DD DD
+ 0.3V + 0.3V + 0.3V
ELECTRICAL CHARACTERISTICS
(VDD= +11.4V to +15.75V (Note 1), V
DC ACCURACY
Full-Scale Error
Gain Temperature Coefficient (Note 2)
Output Leakage Current
REFERENCE INPUT
Reference Voltage Input Resistance (Note 3)
DIGITAL INPUTS
Input High Voltage Input Low Voltage V0.8
Input Leakage Current µA Input Capacitance (Note 2)
= 10V, V
REF
INLRelative Accuracy
I
OUT
V
REF
INH INL
IN
IOUT
MX753_K/B/T MX753_J/A/S
Measured with internal RFB, includes effects of leakage current and gain TC
MX753_K/B/T MX753_J/A/S
All digital inputs at 0V
All digital inputs at 0V, VSS= 0V
Digital inputs at 0V or V
= V
AGNDS
DD
28-Pin PLCC (derate 10.53mW/°C above +70°C) .........842mW
20-Pin CERDIP (derate 11.11mW/°C above +70°C)......889mW
28-Pin CERDIP (derate 16.67mW/°C above +70°C)........1.33W
20-Pin Ceramic SB
(derate 11.76mW/°C above +70°C).............................941mW
28-Pin Ceramic SB
(derate 20.00mW/°C above +70°C)................................1.6W
Operating Temperature Ranges
MX753_J/K............................................................0°C to +70°C
MX753_A/B........................................................-25°C to +85°C
MX753_EW_.......................................................-40°C to +85°C
MX753_S/T.......................................................-55°C to +125°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10sec).............................+300°C
= VSS= 0V, TA= T
CONDITIONS
MX753_K/B/T MX753_J/A/S
TA= +25°C
MIN
MAX
MIN
MX753_J/K/A/B MX753_S/T
to T
TA= T to T
TA= +25°C TA= T
MAX
MIN
to T
, unless otherwise noted.)
MAX
±1 ±2
±4 ±8
±0.5 ±2.5 ±0.5 ±5
±5
±25
±150
±1
±10
UNITSMIN TYP MAXSYMBOLPARAMETER
ppm/°C
Bits14Resolution LSB LSB±1Guaranteed MonotonicDifferential Nonlinearity
LSB
nA
k3.5 6 10R
V2.4V
pF7C
2 _______________________________________________________________________________________
Microprocessor-Compatible,
14-Bit DACs
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +11.4V to +15.75V (Note 1), V
POWER REQUIREMENTS
Positive Supply-Voltage Range Negative Supply-Voltage Range
Positive Supply Current Negative Supply Current
Note 1: Specifications are guaranteed for VDDof +11.4V to +15.75V. At VDD= +5V, device is still functional with degraded specifications. Note 2: Guaranteed by design, not tested. Note 3: Resistors have a typical -300ppm/°C tempco.
= 10V, V
REF
I
DD
SS
DD
SS
IOUT
For specific performance For specific performance
Digital inputs at V
INH
Digital inputs at 0V or V
or V
= V
AGNDS
INL
= VSS= 0V, TA= T
CONDITIONS
MX7534 MX7535
DD
MIN
to T
, unless otherwise noted.)
MAX
UNITSMIN TYP MAXSYMBOLPARAMETER
V11.4 15.75V
mV-200 -500V
3
mA
4
µA500I
AC PERFORMANCE CHARACTERISTICS (Note 4)
(VDD= +11.4V to +15.75V, V
= T
to T
T
A
MIN
Digital-to-Analog Glitch Impulse
Multiplying Feedthrough Error (Note 5)
Power-Supply Rejection
Output Capacitance (IOUT Pin) Output Noise Voltage Density
(10Hz–100kHz)
Note 4: These characteristics are included for design guidance only, and are not subject to test. Note 5: Feedthrough can be further reduced by connecting the metal lid on the ceramic package to DGND.
, unless otherwise noted.)
MAX
REF
= 10V, V
C
OUT
= V
IOUT
AGND(VAGNDS
TA= +25°C, to 0.003% of full-scale range, IOUT load = 100 alternately loaded with all 1s and all 0s
Measured with V IOUT loads = 100 alternately loaded with all 1s and all 0s
V
= ±10V, 10kHz
REF
sine wave, DAC register loaded with all 0s
VDD= ±5%
DAC register loaded with all 1s DAC register loaded with all 0s
Measured between RFBand I
for MX7535) = VSS= 0V, output amplifier is AD544*,
CONDITIONS
13pF, DAC register
II
= 0V,
REF
13pF, DAC register
II
TA= +25°C TA= T
TA= +25°C TA= T
OUT
MIN
MIN
to T
to T
MAX
MAX
UNITSMIN TYP MAXSYMBOLPARAMETER
µs0.8 1.5Output Current Setting Time
nV-sec50
3 5
±0.01 ±0.02
260 130
mVp-p
%/%
pF
nV/Hz15
MX7534/MX7535
* AD544 is an Analog Devices part.
_______________________________________________________________________________________ 3
Microprocessor-Compatible, 14-Bit DACs
TIMING CHARACTERISTICS (MX7534)
(VDD= +11.4V to +15.75V, V timing diagram.)
Address Valid to Write Setup Time Address Valid to Write Hold Time
Data Setup Time
Data Hold Time
Chip-Select to Write-Setup Time Chip-Select to Write-Hold Time
MX7534/MX7535
Write Pulse Width
TIMING CHARACTERISTICS (MX7535)
(VDD= +11.4V to +15.75V, V timing diagram.)
CSMSB or CSLSB to WR Setup Time CSMSB or CSLSB to WR Hold Time
LDAC Pulse Width
Write Pulse Width
Data-Setup Time
Data-Hold Time
REF
REF
= 10V, V
= 10V, V
IOUT
IOUT
= V
= V
= VSS= 0V, TA= T
AGND
1 2
TA= +25°C
t
TA= -25°C to +85°C
3
TA= -55°C to +125°C TA= +25°C TA= -25°C to +85°C
t
4
TA= -55°C to +125°C
t
5
t
6
TA= +25°C
t
TA= -25°C to +85°C
7
TA= -55°C to +125°C
= VSS= 0V, TA= T
AGNDS
1 2
TA= +25°C
t
TA= -25°C to +85°C
3
TA= -55°C to +125°C TA= +25°C
t
TA= -25°C to +85°C
4
TA= -55°C to +125°C TA= +25°C
t
TA= -25°C to +85°C
5
TA= -55°C to +125°C TA= +25°C
t
TA= -25°C to +85°C
6
TA= -55°C to +125°C
to T
MIN
CONDITIONS
MIN
CONDITIONS
, unless otherwise noted. See Figure 1a for
MAX
60 70 80 20 20 30
0
0 170 200 240
to T
, unless otherwise noted. See Figure 1b for
MAX
170 200 240 170 200 240 140 160 180
20 20 30
UNITSMIN TYP MAXSYMBOLPARAMETER
ns0t ns0t
ns
ns
ns ns
ns
UNITSMIN TYP MAXSYMBOLPARAMETER
ns0t ns0t
ns
ns
ns
ns
4 _______________________________________________________________________________________
Microprocessor-Compatible,
14-Bit DACs
__________Pin Description (MX7534)
NAME FUNCTION
PIN
REF Reference Input to DAC
1
2 RFB 3 IOUT Current Output
4 AGNDS
5 AGNDF
6 DGND Digital Ground 7 D7 Data Bit 7 8 D6 Data Bit 6
9 D5 Data Bit 5 or Data Bit 13 (MSB) 10 D4 Data Bit 4 or Data Bit 12 11 D3 Data Bit 3 or Data Bit 11 12 D2 Data Bit 2 or Data Bit 10 13 D1 Data Bit 1 or Data Bit 9 14 D0 Data Bit 0 (LSB) or Data Bit 8 15 A1 Address Input 1 16 A0 Address Input 0 17 18 19 V
20 V
WR
Feedback Resistor. Used to close the loop around an external op amp.
Analog Ground Sense. Reference point for external circuitry. AGNDS should carry minimum current.
Analog Ground Force. Carries current from internal analog ground connec­tions. AGNDS and AGNDF are tied together internally.
Write Input. Active low. Chip-Select Input. Active low.
CS
+12V to +15V Supply-Voltage Input
DD
Bias pin for high-temperature,
SS
low-leakage configuration
__________Pin Description (MX7535)
NAME FUNCTION
PIN
REFS Reference Voltage Sense
1
2 REFF 3 RFB 4
IOUT Current Output
5 AGNDS
6 AGNDF
7 DGND Digital Ground 8 D13 Data Bit 13 (MSB)
9 D12 Data Bit 12 10 D11 Data Bit 11 11 D10 Data Bit 10 12 D9 Data Bit 9 13 D8 Data Bit 8 14 D7 Data Bit 7 15 D6 Data Bit 6 16 D5 Data Bit 5 17 D4 Data Bit 4 18 D3 Data Bit 3 19 D2 Data Bit 2 20 D1 Data Bit 1 21 D0 Data Bit 0 (LSB)
22
CSMSB
23
LDAC
24
CSLSB
25 26 V
27 V
28 N.C.
Reference Voltage Force Feedback Resistor. Used to close the
loop around an external op amp.
Analog Ground Sense. Reference point for external circuitry. This pin should carry minimum current.
Analog Ground Force. Carries current from internal analog ground connections. AGNDS and AGNDF are tied together internally.
Chip-Select Most Significant Byte. Active low.
Asynchronous Load DAC Input. Active low.
Chip-Select Least Significant Byte. Active low.
Write Input. Active low.
WR
+12V to +15V Supply-Voltage Input
DD
Bias pin for high-temperature,
SS
low-leakage configuration No Connection. Not internally connected.
MX7534/MX7535
_______________________________________________________________________________________ 5
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