Rainbow Electronics MAXQ613 User Manual
19-5320; Rev 2; 8/10
16-Bit Microcontroller with Infrared Module
General Description
The MAXQ613 is a low-power, 16-bit MAXQ® microcontroller designed for low-power applications including universal remote controls, consumer electronics, and white
goods. The device combines a powerful 16-bit RISC
microcontroller and integrated peripherals including a
universal synchronous/asynchronous receiver-transmitter (USART) and an SPI™ master/slave communications
port, along with an IR module with carrier frequency
generation and flexible port I/O capable of multiplexed
keypad control.
The device includes 48KB of flash program memory and
1.5KB of data SRAM. Intellectual property (IP) protection is provided by a secure MMU that supports multiple
application privilege levels and protects code against
copying and reverse engineering. Privilege levels enable
vendors to provide libraries and applications to execute
on the device, while limiting access to only data and
code allowed by their privilege level.
For the ultimate in low-power battery-operated performance, the device includes an ultra-low-power stop
mode (0.2µA typ). In this mode, the minimum amount of
circuitry is powered. Wake-up sources include external
interrupts, the power-fail interrupt, and a timer interrupt.
The microcontroller runs from a wide 1.70V to 3.6V operating voltage.
Applications
Remote Controls
Battery-Powered
Portable Equipment
Consumer Electronics
Home Appliances
White Goods
MAXQ613
Features
S High-Performance, Low-Power, 16-Bit RISC Core
S DC to 12MHz Operation Across Entire Operating Range
S 1.70V to 3.6V Operating Voltage
S 33 Total Instructions for Simplified Programming
S Three Independent Data Pointers Accelerate Data
Movement with Automatic Increment/Decrement
S Dedicated Pointer for Direct Read from Code Space
S 16-Bit Instruction Word, 16-Bit Data Bus
S 16 x 16-Bit General-Purpose Working Registers
S Secure MMU for Application Partitioning and IP
Protection
S Memory Features
48KB Program Flash Memory
512-Byte Sectors
20,000 Erase/Write Cycles per Sector
Masked ROM Available
1.5KB Data SRAM
S Additional Peripherals
Power-Fail Warning
Power-On Reset (POR)/Brownout Reset
Automatic IR Carrier Frequency Generation and
Modulation
Two 16-Bit Programmable Timers/Counters with
Prescaler and Capture/Compare
One SPI and One USART Port
Programmable Watchdog Timer
8kHz Nanopower Ring Oscillator Wake-Up Timer
Up to 24 General-Purpose I/Os
S Low Power Consumption
0.2µA (typ), 2.0µA (max) in Stop Mode,
TA = +25NC, Power-Fail Monitor Disabled
3.25mA (typ) at 12MHz in Active Mode
Ordering Information/Selector Guide
PART TEMP RANGE
MAXQ613A-0000+
MAXQ613E-0000+
MAXQ613J-0000+
MAXQ613K-0000+
MAXQ613X-0000+
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
MAXQ is a registered trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata.
0NC to +70NC
0NC to +70NC
0NC to +70NC
0NC to +70NC
0NC to +70NC
_______________________________________________________________ Maxim Integrated Products 1
OPERATING
VOLTAGE (V)
1.7 to 3.6 48 Flash 1.5 20 32 TQFN-EP*
1.7 to 3.6 48 Flash 1.5 20 32 LQFP
1.7 to 3.6 48 Flash 1.5 24 44 TQFN-EP*
1.7 to 3.6 48 Flash 1.5 24 44 TQFP
1.7 to 3.6 48 Flash 1.5 24 Bare die
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
PROGRAM
MEMORY (KB)
DATA
MEMORY (KB)
GPIO PIN-PACKAGE
16-Bit Microcontroller with Infrared Module
TABLE OF CONTENTS
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended Operating Conditions
SPI Electrical Characteristics
Pin Configurations
Pin Description
MAXQ613
Block Diagram
Detailed Description
Microprocessor
Memory
Watchdog Timer
IR Carrier Generation and Modulation Timer
16-Bit Timers/Counters
USART
Serial Peripheral Interface (SPI)
General-Purpose I/O
On-Chip Oscillator
ROM Loader
Loading Flash Memory
In-Application Flash Programming
In-Circuit Debug and JTAG Interface
Operating Modes
Applications Information
Additional Documentation
Development and Technical Support
Package Information
Revision History
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Memory Protection
Stack Memory
Utility ROM
Carrier Generation Module
IR Transmission
IR Transmit—Independent External Carrier and Modulator Outputs
IR Receive
Carrier Burst-Count Mode
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Power-Fail Detection
Grounds and Bypassing
Deviations from the MAXQ610 User’s Guide for the MAXQ613
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2 ______________________________________________________________________________________
16-Bit Microcontroller with Infrared Module
LIST OF FIGURES
Figure 1. IR Transmit Frequency Shifting Example (IRCFME = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 2. IR Transmit Carrier Generation and Carrier Modulator Control
Figure 3. IR Transmission Waveform (IRCFME = 0)
Figure 4. External IRTXM (Modulator) Output
Figure 5. IR Capture
Figure 6. Receive Burst-Count Example
Figure 7. SPI Master Communication Timing
Figure 8. SPI Slave Communication Timing
Figure 9. On-Chip Oscillator
Figure 10. In-Circuit Debugger
Figure 11. Power-Fail Detection During Normal Operation
Figure 12. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled
Figure 13. Stop Mode Power-Fail Detection with Power-Fail Monitor Disabled
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
LIST OF TABLES
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
. . . . . . . . . . . . . . . . . . . . . . . . . 25
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
MAXQ613
Table 1. Memory Areas and Associated Maximum Privilege Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 2. Watchdog Interrupt Timeout (Sysclk = 12MHz, CD[1:0] = 00)
Table 3. USART Mode Details
Table 4. Power-Fail Detection States During Normal Operation
Table 5. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled
Table 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
. . . . . . . . . . . . . . . . . . . . . . . . . . 25
. . . . . . . . . . . . . . . . . . . . . . . . . . 26
_______________________________________________________________________________________ 3
16-Bit Microcontroller with Infrared Module
ABSOLUTE MAXIMUM RATINGS
Voltage Range on VDD with Respect to GND .....-0.3V to +3.6V
Voltage Range on Any Lead with
Respect to GND Except V
Continuous Power Dissipation (T
............... -0.3V to (VDD + 0.5V)
DD
= +70NC)
A
32-Pin TQFN (single-layer board)
(derate 21.3mW/NC above +70NC)..........................1702.1mW
32-Pin TQFN (multilayer board)
(derate 34.5mW/NC above +70NC)..........................2758.6mW
MAXQ613
32-Pin LQFP (multilayer board)
(derate 20.7mW/NC above +70NC)..........................1652.9mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(VDD = V
Supply Voltage V
1.8V Internal Regulator V
Power-Fail Warning Voltage for
Supply
Power-Fail Reset Voltage V
POR Voltage V
RAM Data-Retention Voltage V
Active Current I
Stop-Mode Current
Current Consumption During
Power-Fail
Power Consumption During
POR
Stop-Mode Resume Time t
Power-Fail Monitor Startup
Time
Power-Fail Warning Detection
Time
Input Low Voltage for IRTX,
IRRX, RESET, and All Port Pins
Input High Voltage for IRTX,
IRRX, RESET, and All Port Pins
to 3.6V, TA = 0NC to +70NC, unless otherwise noted.) (Note 1)
RST
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DD
REG18
V
PFW
RST
POR
DRV
DD_1
I
S1
I
S2
I
PFR
I
POR
ON
t
PFM_ON
t
PFW
V
V
Monitors V
Monitors V
Monitors V
DD
DD
DD
(Note 4) 1.0 V
Sysclk = 12MHz (Note 5) 3.25 4 mA
Power-Fail Off
Power-Fail On
(Note 6)
(Note 7) 100 nA
(Note 4) 150
(Note 8) 10
IL
IH
44-Pin TQFN (single-layer board)
(derate 27mW/NC above +70NC).............................2162.2mW
44-Pin TQFN (multilayer board)
(derate 37mW/NC above +70NC)................................2963mW
44-Pin TQFP (multilayer board)
(derate 19mW/NC above +70NC)................................1504mW
Operating Temperature Range
Storage Temperature Range
Lead Temperature (excluding dice; soldering, 10s)
Soldering Temperature (reflow)
V
RST
............................. 0NC to +70NC
............................ -65NC to +150NC
......+300NC
......................................+260NC
3.6 V
1.62 1.8 1.98 V
(Note 2) 1.75 1.8 1.85 V
(Note 3) 1.64 1.67 1.70 V
1 1.42 V
= +25NC
T
A
T
= 0°C to +70NC
A
= +25NC
T
A
= 0°C to +70NC
T
A
0.2 2.0
0.2 8
22 29.5
27.6 42
[(3 x I
S2
((PCI - 3) x (I
I
))]/PCI
NANO
) +
S1
+
375 + (8192 x
t
HFXIN)
V
GND
0.7 x V
DD
0.3 x V
V
DD
DD
FA
FA
Fs
Fs
Fs
V
V
4 ______________________________________________________________________________________
16-Bit Microcontroller with Infrared Module
RECOMMENDED OPERATING CONDITIONS (continued)
(VDD = V
Input Hysteresis (Schmitt) V
Input Low Voltage for HFXIN V
Input High Voltage for HFXIN V
IRRX Input Filter Pulse-Width
Reject
IRRX Input Filter Pulse-Width
Accept
Output Low Voltage for IRTX V
Output Low Voltage for RESET
and All Port Pins (Note 9)
Output High Voltage for IRTX
and All Port Pins
Input/Output Pin Capacitance
for All Port Pins
Input Leakage Current I
Input Pullup Resistor for
RESET, IRTX, IRRX, P0, P1, P2
EXTERNAL CRYSTAL/RESONATOR
Crystal/Resonator f
Crystal/Resonator Period t
Crystal/Resonator Warmup
Time
Oscillator Feedback Resistor R
EXTERNAL CLOCK INPUT
External Clock Frequency f
External Clock Period t
External Clock Duty Cycle t
System Clock Frequency f
System Clock Period t
NANOPOWER RING
Nanopower Ring Frequency f
Nanopower Ring Duty Cycle t
Nanopower Ring Current I
to 3.6V, TA = 0NC to +70NC, unless otherwise noted.) (Note 1)
RST
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IHYS
IL_HFXIN
IH_HFXIN
t
IRRX_R
t
IRRX_A
VDD = 3.3V, TA = +25NC
VDD = 3.6V, IOL = 25mA (Note 3) 1.0
OL_IRTX
= 2.35V, IOL = 10mA (Note 3) 1.0
DD
= 1.85V, IOL = 4.5mA 1.0
V
DD
VDD = 3.6V, IOL = 11mA (Note 3) 0.4 0.5
V
OL
V
OH
C
IO
L
R
PU
HFXIN
HFXIN
t
XTAL_RDY
OSCF
XCLK
XCLK
XCLK_DUTY
CK
CK
= 2.35V, IOL = 8mA (Note 3) 0.4 0.5
DD
= 1.85V, IOL = 4.5mA 0.4 0.5
V
DD
IOH = -2mA VDD - 0.5 V
(Note 4) 15 pF
Internal pullup disabled -100 +100 nA
VDD = 3.0V, VOL = 0.4V (Note 4) 16 28 39
V
= 2.0V, VOL = 0.4V 17 30 41
DD
From initial oscillation
(Note 4) 0.5 1.0 1.5
(Note 4) 45 55 %
HFXOUT = GND f
TA = +25NC
NANO
T
= +25NC, VDD = POR voltage
A
(Note 4)
NANO
NANO
(Note 4) 40 60 %
Typical at VDD = 1.64V,
T
= +25°C (Note 4)
A
300 mV
V
GND
0.7 x V
DD
0.3 x V
V
DD
DD
50 ns
300 ns
DD
1 12 MHz
1/f
HFXIN
8192 x
t
HFXIN
DC 12 MHz
1/f
XCLK
f
HFXIN
XCLK
1/f
CK
3.0 8.0 20.0
1.7 2.4
40 400 nA
MAXQ613
V
V
VV
VV
V
kW
ns
ms
MW
ns
MHz
ns
kHz
_______________________________________________________________________________________ 5
16-Bit Microcontroller with Infrared Module
RECOMMENDED OPERATING CONDITIONS (continued)
(VDD = V
WAKE-UP TIMER
Wake-Up Timer Interval t
FLASH MEMORY
MAXQ613
System Clock During Flash
Programming/Erase
Flash Erase Time
Flash Programming Time per
Word
Write/Erase Cycles 20,000 Cycles
Data Retention
IR
Carrier Frequency f
SPI ELECTRICAL CHARACTERISTICS
(VDD = V
SPI Master Operating
Frequency
SPI Slave Operating
Frequency
SPI I/O Rise/Fall Time t
SCLK Output Pulse-Width
High/Low
MOSI Output Hold Time After
SCLK Sample Edge
MOSI Output Valid to Sample
Edge
MISO Input Valid to SCLK
Sample Edge Rise/Fall Setup
MISO Input to SCLK Sample
Edge Rise/Fall Hold
SCLK Inactive to MOSI
Inactive
SCLK Input Pulse-Width High/
Low
SSEL Active to First Shift
Edge
MOSI Input to SCLK Sample
Edge Rise/Fall Setup
to 3.6V, TA = 0NC to +70NC, unless otherwise noted.) (Note 1)
RST
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
WAKEUP
f
FPSYSCLK
t
ME
t
ERASE
t
PROG
IR
to 3.6V, TA = 0NC to +70NC, unless otherwise noted.) (Note 11)
RST
Mass erase 20 40
Page erase 20 40
(Note 10) 20 100
= +25NC
T
A
(Note 4) fCK/2 Hz
1/f
NANO
6 MHz
100 Years
65,535/
f
NANO
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
t
MCH
t
SCH
1/t
MCK
1/t
SCK
SPI_RF
, t
t
MOH
t
MOV
t
MIS
t
MIH
t
MLH
, t
t
SSE
t
SIS
CL = 15pF, pullup = 560W
MCL
SCL
8.3 23.6 ns
t
/2 -
MCK
t
SPI_RF
t
/2 -
MCK
t
SPI_RF
t
/2 -
MCK
t
SPI_RF
25 ns
0 ns
t
/2 -
MCK
t
SPI_RF
t
/2 ns
SCK
t
SPI_RF
t
SPI_RF
fCK/2 MHz
fCK/4 MHz
s
ms
Fs
ns
ns
ns
ns
ns
ns
6 ______________________________________________________________________________________
16-Bit Microcontroller with Infrared Module
SPI ELECTRICAL CHARACTERISTICS (continued)
(VDD = V
MOSI Input from SCLK
Sample Edge Transition Hold
MISO Output Valid After SCLK
Shift Edge Transition
SSEL Inactive
SCLK Inactive to SSEL Rising
MISO Output Disabled After
SSEL Edge Rise
Note 1:
Note 2: V
Note 3: The power-fail reset and POR detectors are designed to operate in tandem to ensure that one or both of these signals
Note 4: Guaranteed by design and not production tested.
Note 5: Measured on the VDD pin and the device not in reset. All inputs are connected to GND or VDD. Outputs do not source/
Note 6: The power-check interval (PCI) can be set to always on, or to 1024, 2048, or 4096 nanopower ring clock cycles.
Note 7: Current consumption during POR when powering up while VDD is less than the POR release voltage.
Note 8: The minimum amount of time that VDD must be below V
Note 9: The maximum total current, I
Note 10: Programming time does not include overhead associated with utility ROM interface.
Note 11: AC electrical specifications are guaranteed by design and are not production tested.
to 3.6V, TA = 0NC to +70NC, unless otherwise noted.) (Note 11)
RST
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
t
SIH
t
SOV
t
SSH
t
SD
t
SLH
Specifications to 0NC are guaranteed by design and are not production tested. Typical = +25NC, VDD = +3.3V, unless
otherwise noted.
can be programmed to the following nominal voltage trip points: 1.8V, 1.9V, 2.55V, and 2.75V ±3%. The values
PFW
listed in the Recommended Operating Conditions table are for the default configuration of 1.8V nominal.
is active at all times when VDD < V
achieved.
sink any current. The device is executing code from flash memory.
User’s Guide for details.
OH(MAX)
maximum specified voltage drop. This does not include the IRTX output.
, ensuring the device maintains the reset state until minimum operating voltage is
RST
before a power-fail event is detected; refer to the MAXQ610
PFW
and I
OL(MAX)
, for all listed outputs combined should not exceed 32mA to satisfy the
t
SPI_RF
tCK +
t
SPI_RF
t
SPI_RF
2t
SPI_RF
2tCK +
2t
SPI_RF
ns
ns
ns
ns
ns
MAXQ613
_______________________________________________________________________________________ 7
16-Bit Microcontroller with Infrared Module
Pin Configurations
TOP VIEW
P2.4/TCK
MAXQ613
P2.5/TDI
P2.6/TMS
P2.7/TDO
RESET
V
GND
IRTX
IRRX
25
26
27
28
29
DD
30
31
+
32
1 2
P0.0/IRTXM/INT8
N.C.
P1.7/INT7
P1.6/INT6
P0.3/INT11
P0.4/INT12
HFXOUT
EP
P0.5/TBA0/TBA1/INT13
GND
21
2324 22 20 19 18
MAXQ613
4 5 6 7
3
P0.1/RX/INT9
P0.2/TX/INT10
TQFN
(5mm × 5mm)
TOP VIEW
P1.5/INT5
HFXIN
17
16
15
14
13
12
11
10
9
8
P0.7/TBB1/INT15
P0.6/TBB0/INT14
TOP VIEW
P2.5/TDI
25 16 P1.4/INT4
P1.4/INT4
V
DD
REGOUT
GND
P1.3/INT3
P1.2/INT2
P1.1/INT1
P1.0/INT0
P2.6/TMS
P2.7/TDO
26 15 V
27
28
RESET
29
V
DD
GND
30
31 10IRTX P1.1/INT1
32 9IRRX P1.0/INT0
+
N.C.
N.C.
P2.1/MISO
GND
P2.0/MOSI
P1.7/INT7
P1.6/INT6
P2.2/SCLK
P2.3/SSEL
3332313029282726252423
HFXOUT
N.C.
P2.4/TCK
2324 22 20 19 18
1 2
P0.1/RX/INT9
P0.0/IRTXM/INT8
P1.7/INT7
GND
21
MAXQ613
4 5 6 7
3
P0.3/INT11
P0.2/TX/INT10
LQFP
(7mm × 7mm)
HFXIN
P1.6/INT6
HFXOUT
P0.4/INT12
P0.5/TBA0/TBA1/INT13
P1.5/INT5
HFXIN
17
8
P0.7/TBB1/INT15
P0.6/TBB0/INT14
14
13
12
11
DD
REGOUT
GND
P1.3/INT3
P1.2/INT2
P2.4/TCK
P2.5/TDI
N.C.
N.C.
P2.6/TMS
P2.7/TDO
RESET
V
GND
IRTX
IRRX
34
35
36
37
38
39
40
41
DD
42
43
+
44
123456789
P0.0/IRTXM/INT8
N.C.
P0.1/RX/INT9
MAXQ613
N.C.
P0.2/TX/INT10
TQFN
P0.3/INT11
P0.4/INT12
P0.5/TBA0/TBA1/INT13
P0.6/TBB0/INT14
EP
10
11
P1.0/INT0
P0.7/TBB1/INT15
22
21
20
19
18
17
16
15
14
13
12
P1.5/INT5
P1.4/INT4
GND
V
DD
REGOUT
GND
N.C.
N.C.
P1.3/INT3
P1.2/INT2
P1.1/INT1
(7mm × 7mm)
8 ______________________________________________________________________________________
16-Bit Microcontroller with Infrared Module
Pin Configurations (continued)
MAXQ613
TOP VIEW
P2.4/TCK
P2.5/TDI
P2.6/TMS
P2.7/TDO
N.C.
N.C.
RESET
V
GND
IRTX
IRRX
P2.3/SSEL
P2.2/SCLK
33
32
34
35
36
37
38
39
40
41
DD
42
43
44
+
1
2
N.C.
P0.0/IRTXM/INT8
N.C.
30
31
3
4
P0.1/RX/INT9
N.C.
N.C.
GND
P2.1/MISO
28
29
MAXQ613
5
P0.3/INT116P0.4/INT12
P0.2/TX/INT10
TQFP
(10mm × 10mm)
NOTE: CONTACT FACTORY FOR BARE DIE PAD CONFIGURATION.
P1.7/INT7
P2.0/MOSI
26
27
7
8
P0.5/TBA0/TBA1/INT13
HFXOUT24HFXIN
P1.6/INT6
23
25
9
11
10
P0.6/TBB0/INT14
P0.7/TBB1/INT15
P1.0/INT0
22 P1.5/INT5
21 P1.4/INT4
20 GND
19 V
DD
18 REGOUT
17 GND
16 N.C.
15 N.C.
14 P1.3/INT3
13 P1.2/INT2
12 P1.1/INT1
Pin Description
PIN
BARE DIE
32 TQFNEP/LQFP
44 TQFN-
EP/TQFP
15, 36 15, 29 19, 41 V
13, 16, 25,
37
13, 22, 30
17, 20, 28,
42
14 14 18 REGOUT
— — — EP Exposed Pad (TQFN Only). Connect EP directly to the ground plane.
_______________________________________________________________________________________ 9
NAME FUNCTION
POWER PINS
DD
Supply Voltage
GND Ground. Connect directly to the ground plane.
1.8V Regulator Output. This pin must be connected to ground through
a 1.0FF (ESR: 2W–10W) external ceramic-chip capacitor. The capacitor
must be placed as close to this pin as possible. No devices other than
the capacitor should be connected to this pin.
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