Rainbow Electronics MAXQ1004 User Manual

19-5258; Rev 0; 4/10
1-Wire and SPI Authentication Microcontroller
The MAXQ1004 is a low-power microcontroller that integrates a 10-bit ADC, 1-WireM slave interface, SPIK, AES encryption, random-number generator (RNG), and temperature sensor with a 16-bit MAXQM pipelined CPU. Performance bandwidth is sufficient to handle master or slave challenge-response authentication in portable devices.
The device incorporates 16KB of flash memory and 640B of RAM. Factory programming of a customer secret key is available upon request. The microcontroller runs within a wide 1.7V to 3.6V operating range.
For the ultimate in low-power performance, an ultra-low­power stop mode (300nA typ) is available. In this mode, only a minimum amount of circuitry is powered to sup­port detection of the start of a 1-Wire transaction. When 1-Wire activity is detected, the microcontroller is turned on and the command is executed in an atomic fashion. This allows for stateless operation between commands, providing the highest reliability and lowest power con­sumption.
Applications
Portable Electronics
Battery Chargers
Battery Packs
Ordering Information
PART
MAXQ1004-B01+
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
TEMP
RANGE
-40°C to +85°C
AES
ENCRYPTION
Yes
PIN-
PACKAGE
16 TQFN-
EP*
Features
S High-Performance, Low-Power, 16-Bit MAXQ20
RISC Core
S 6MHz Operation from an Internal Oscillator,
Approaching 1MIPS per MHz
S 1.7V to 3.6V Wide Operating Voltage
S Three Independent Data Pointers Accelerate Data
Movement with Automatic Increment/Decrement
S Up to Eight General-Purpose I/O Pins
S 16-Level Hardware Stack
S Optimized for C-Compiler (High-Speed/Density Code)
S Memory
16KB Flash Memory, In-Application Programmable 640B of Data RAM 4KB of ROM JTAG/TAP Bootloader Mode for In-System
Programming
S Peripheral Features
10-Bit Delta-Sigma ADC, Internal Reference 1-Wire Slave Interface On-Chip Power-On Reset (POR)/Power-Fail Reset Overvoltage Detection Programmable Watchdog Timer Built-In Temperature Sensor, ±6NC
S Secure Programming Interface
Flash Programming Through Secure ROM Loader Secret Key Destruction on Mass Erase Permanent Loader Lockout Option Code and Secret Scrambling
S Unique 64-Bit Serial Number
S Low-Power Consumption
300nA (typ) in Stop Mode
3.75mA (typ) at 6MHz, 0.8mA (typ) at 1MHz Low-Power Divide-by Modes (2, 4, 8, 256) 1-Wire/Interrupt Activity Detector
MAXQ1004
1-Wire and MAXQ are registered trademarks of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata.
_______________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1-Wire and SPI Authentication Microcontroller

TABLE OF CONTENTS

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
10-Bit ADC Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SPI Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SPI Master Communications Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SPI Slave Communications Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
MAXQ1004
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
MAXQ Core Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Memory Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Utility ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Loading Flash Memory with the Bootstrap Loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
In-Application Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Code Scrambling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Nanopower Ring Wake-Up Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Serial Number/Device ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Hardware AES Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
16-Bit Timer/Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Serial Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1-Wire Bus System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Hardware Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Slave Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
In-Circuit Debug. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Applications Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Grounds and Bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Design Guidelines for ESD Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Development and Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2
1-Wire and SPI Authentication Microcontroller

LIST OF FIGURES

Figure 1. ADC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 2. In-Circuit Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 3. I/O Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 4. Typical Application Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

LIST OF TABLES

Table 1. Watchdog Interrupt Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
MAXQ1004
3
1-Wire and SPI Authentication Microcontroller

ABSOLUTE MAXIMUM RATINGS

Voltage Range on All Pins (including VDD),
except DQ to GND ............................................-0.5V to +3.6V
Voltage Range on DQ Relative to GND ...............-0.5V to +6.0V
Continuous Output Current
Any Single I/O Pin ...........................................................35mA
All I/O Pins Combined .....................................................35mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
MAXQ1004
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

RECOMMENDED DC OPERATING CONDITIONS

(VDD = 1.7V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC and VDD = 3.3V, unless oth­erwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
1.8V Internal Regulator V Power-On Reset Voltage V Power-Fail Reset Voltage V Power-Fail Warning Voltage V Digital Overvoltage Detect V
Supply Current (Note 5)
Stop-Mode Current (Note 5)
DIGITAL I/O
Input High Voltage (P0, RST)
Input Hysteresis V
Input Low Voltage (P0, RST)
Output Low Voltage (P0, RST) (Note 7)
Output High Voltage (P0, RST)
Input Leakage Current I Input/Output Pin Capacitance C Input Low Current for All Pins I RST Pullup Resistor
DD
REG18
POR
RST
PFW
HV
I
DD1
I
DD2
I
STOP1
I
STOP2
I
STOP3
I
STOP4
V
IH
IHYS
V
IL
V
OL
V
OH
L
IO
IL
R
RST
(Note 2) 1.64 1.695 V (Notes 3, 4) 1.75 1.85 V Monitors V
Device is executing from flash
TA = +25NC, CPU not backed up TA = +85NC, CPU not backed up TA = +25NC, CPU backed up TA = +85NC, CPU backed up
(Note 6) 0.3 V
VDD = 3.6V, IOL = 4mA (Note 6) 0.4 VDD = 1.85V, IOL = 4mA 0.4
IOH = -2mA
Internal pullup disabled -100 +100 nA (Note 6) 15 pF V
= 0.4V, pullup enabled -70
IN
Continuous Power Dissipation (TA = +70NC) Single-Layer Board (derate 16.9mW/NC above +70NC) .. 1349.1mW
Multilayer Board (derate 25mW/NC above +70NC) ....2000mW
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
V
RST
3.3 3.6 V
1.62 1.8 1.98 V
1.0 1.42 V
REG18
f
= 6MHz 3.5
SYS
f
= 1MHz 0.8
SYS
2.4 2.8 V
5
7.5
6.5 9
0.7 x V
DD
V
GND
VDD -
0.4
65
V
DD
0.3 x V
DD
V
DD
Q20% kI
mA
FA
V
V
V
V
FA
4
1-Wire and SPI Authentication Microcontroller
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD = 1.7V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC and VDD = 3.3V, unless oth­erwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INTERNAL OSCILLATOR
Oscillator Frequency f Oscillator Startup Time t
OSC
OSC_RDYVREG18
= 1.8V (Note 6) 350
Oscillator Duty Cycle (Note 6) 45 55 %
NANOPOWER RING OSCILLATOR
Nanopower Ring Frequency f
Nanopower Ring Current I
Wakeup Timer Interval t
NANO
NANO
WAKEUP
TA = +25NC
Typical at VDD = 3.0V, active during wake-up (Note 6)
1/f
NANO
FLASH MEMORY
Flash Erase Time
Flash Programming Time per Word t
PROG
Mass erase 20 40 Page erase 20 40
Write/Erase Cycles 1000 Cycles Data Retention Analog Supply Voltage V
AVDD
TA = +25NC
5 6 7 MHz
3 11 22 kHz
120 400 nA
t
NANO
65,535
x t
NANO
20 40
100 Years
V
DD
Fs
s
ms
Fs
V
MAXQ1004

10-BIT ADC PERFORMANCE

(VDD = 1.7V to 3.6V, V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Resolution 10 Bits ADC Clock Frequency f ADC Clock Period t AN0 Input Voltage Range V Analog Input Capacitance C Integral Nonlinearity INL (Note 6) Differential Nonlinearity DNL No missing codes over temperature Offset Error V
ADC Active Current Consumption I
ADC Setup Time t ADC Output Latency t
ADC Settling Time t
ADC Throughput f
TEMPERATURE SENSOR
Temperature Sensor Setup Time t Temperature Sensor Error
= 1.845V, TA = -40NC to +85NC, unless otherwise noted.)
REF
ACLK
ACLK
AN0
AIN
OS
ADC
ADC_SETUP
ADC
ACLK = 6MHz, internal reference on, ADEN = 1 (Note 6)
Settling time due to channel, refer-
ADC_SETTLE
ence or scale change (not produc­tion tested)
ADC
TSN_SETUP
D
TSN
V
GND
f
SYSCLK
1/f
ACLK
V
AVDD
1 pF
Q2 Q1 Q2
100 150
25
1025 t
10
f
ADC/tADC
25
Q6 NC
MHz
ACLK
ksps
Fs
V
LSB LSB LSB
FA
Fs
Fs
Fs
5
1-Wire and SPI Authentication Microcontroller
10-BIT ADC PERFORMANCE (continued)
(VDD = 1.7V to 3.6V, V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
10-BIT ADC REFERENCE VOLTAGE
Internal Reference Voltage V
Note 1: Specifications to -40NC are guaranteed by design and are not production tested. Note 2: The power-fail reset and POR detectors operate in tandem so one or both of these signals are active at all times when
VDD < V
Note 3: The power-fail warning monitor and the power-fail reset monitor track each other with a typical delta between the two of 0.13V.
MAXQ1004
Note 4: Writes to flash memory must not be performed when the supply voltage drops below the power-fail warning levels, as
RST
there is uncertainty in the duration of continuous power supply. The user application should check the status of the power­fail warning flag before writing to flash to ensure valid write operations.
Note 5: Measured on the combined AVDD and VDD pins and the part not in reset. All inputs are connected to GND or VDD.
Outputs do not source/sink any current.
Note 6: Guaranteed by design and not production tested. Note 7: The maximum total current, I
mum specified voltage drop.

SPI ELECTRICAL CHARACTERISTICS

(VDD = 1.7V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. AC electrical specifications are guaranteed by design and are not production tested.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SPI Master Operating Frequency 1/t SPI Slave Operating Frequency 1/t SPI I/O Rise/Fall Time t SCLK Output Pulse-Width High/Low t
MOSI Output Hold Time After SCLK Sample Edge
MOSI Output Valid to Sample Edge t
MISO Input Valid to SCLK Sample Edge Rise/Fall Setup
MISO Input to SCLK Sample Edge Rise/Fall Hold
SCLK Inactive to MOSI Inactive t SCLK Input Pulse-Width High/Low t SSEL Active to First Shift Edge MOSI Input to SCLK Sample Edge
Rise/Fall Setup
MOSI Input from SCLK Sample Edge Transition Hold
MISO Output Valid After SCLK Shift Edge Transition
SSEL Inactive SCLK Inactive to SSEL Rising MISO Output Disabled After SSEL
Edge Rise
= 1.845V, TA = -40NC to +85NC, unless otherwise noted.)
REF
IREF
1.845
, ensuring the device maintains the reset state until minimum operating voltage is achieved.
OH(MAX)
SPI_RF
MCH
t
SCH
and I
MCK
SCK
, t
MOH
MOV
t
MIS
t
MIH
MLH
, t
t
SSE
t
SIS
t
SIH
t
SOV
t
SSH
t
SD
t
SLH
OL(MAX)
MCL
SCL
, for all outputs combined should not exceed 35mA to satisfy the maxi-
CL = 15pF, pullup = 560W
8.3 23.6 ns
t
/2 - t
MCK
t
MCK
t
MCK
/2 - t
/2 - t
SPI_RF
SPI_RF
SPI_RF
25 ns
0 ns
t
/2 - t
MCK
tCK + t
t
SPI_RF
t
SPI_RF
t
SPI_RF
t
SPI_RF
SPI_RF
SPI_RF
t
/2 ns
SCK
2tCK + 2t
Q5%
f
SYSCLK
f
SYSCLK
2t
SPI_RF
SPI_RF
/2 MHz /4 MHz
V
ns
ns
ns
ns
ns
ns
ns
ns
ns ns
ns
6
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