The MAXQ1004 is a low-power microcontroller that
integrates a 10-bit ADC, 1-WireM slave interface, SPIK,
AES encryption, random-number generator (RNG), and
temperature sensor with a 16-bit MAXQM pipelined CPU.
Performance bandwidth is sufficient to handle master
or slave challenge-response authentication in portable
devices.
The device incorporates 16KB of flash memory and 640B
of RAM. Factory programming of a customer secret key
is available upon request. The microcontroller runs within
a wide 1.7V to 3.6V operating range.
For the ultimate in low-power performance, an ultra-lowpower stop mode (300nA typ) is available. In this mode,
only a minimum amount of circuitry is powered to support detection of the start of a 1-Wire transaction. When
1-Wire activity is detected, the microcontroller is turned
on and the command is executed in an atomic fashion.
This allows for stateless operation between commands,
providing the highest reliability and lowest power consumption.
Applications
Portable Electronics
Battery Chargers
Battery Packs
Ordering Information
PART
MAXQ1004-B01+
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
TEMP
RANGE
-40°C to
+85°C
AES
ENCRYPTION
Yes
PIN-
PACKAGE
16 TQFN-
EP*
Features
SHigh-Performance, Low-Power, 16-Bit MAXQ20
RISC Core
S 6MHz Operation from an Internal Oscillator,
Approaching 1MIPS per MHz
S 1.7V to 3.6V Wide Operating Voltage
S Three Independent Data Pointers Accelerate Data
Movement with Automatic Increment/Decrement
S Up to Eight General-Purpose I/O Pins
S 16-Level Hardware Stack
S Optimized for C-Compiler (High-Speed/Density Code)
S Memory
16KB Flash Memory, In-Application Programmable640B of Data RAM4KB of ROMJTAG/TAP Bootloader Mode for In-System
Flash Programming Through Secure ROM LoaderSecret Key Destruction on Mass ErasePermanent Loader Lockout OptionCode and Secret Scrambling
S Unique 64-Bit Serial Number
S Low-Power Consumption
300nA (typ) in Stop Mode
3.75mA (typ) at 6MHz, 0.8mA (typ) at 1MHzLow-Power Divide-by Modes (2, 4, 8, 256)1-Wire/Interrupt Activity Detector
MAXQ1004
1-Wire and MAXQ are registered trademarks of Maxim
Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata.
except DQ to GND ............................................-0.5V to +3.6V
Voltage Range on DQ Relative to GND ...............-0.5V to +6.0V
Continuous Output Current
Any Single I/O Pin ...........................................................35mA
All I/O Pins Combined .....................................................35mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
MAXQ1004
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(VDD = 1.7V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC and VDD = 3.3V, unless otherwise noted.) (Note 1)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Supply VoltageV
1.8V Internal RegulatorV
Power-On Reset VoltageV
Power-Fail Reset VoltageV
Power-Fail Warning VoltageV
Digital Overvoltage Detect V
Supply Current (Note 5)
Stop-Mode Current (Note 5)
DIGITAL I/O
Input High Voltage (P0, RST)
Input Hysteresis V
Input Low Voltage (P0, RST)
Output Low Voltage (P0, RST)
(Note 7)
Output High Voltage (P0, RST)
Input Leakage CurrentI
Input/Output Pin CapacitanceC
Input Low Current for All PinsI
RST Pullup Resistor
DD
REG18
POR
RST
PFW
HV
I
DD1
I
DD2
I
STOP1
I
STOP2
I
STOP3
I
STOP4
V
IH
IHYS
V
IL
V
OL
V
OH
L
IO
IL
R
RST
(Note 2)1.641.695V
(Notes 3, 4)1.751.85V
Monitors V
Device is executing
from flash
TA = +25NC, CPU not backed up
TA = +85NC, CPU not backed up
TA = +25NC, CPU backed up
TA = +85NC, CPU backed up
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
V
RST
3.33.6V
1.621.81.98V
1.01.42V
REG18
f
= 6MHz3.5
SYS
f
= 1MHz0.8
SYS
2.42.8V
5
7.5
6.5
9
0.7 x
V
DD
V
GND
VDD -
0.4
65
V
DD
0.3 x
V
DD
V
DD
Q20%kI
mA
FA
V
V
V
V
FA
4
1-Wire and SPI Authentication Microcontroller
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD = 1.7V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC and VDD = 3.3V, unless otherwise noted.) (Note 1)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
INTERNAL OSCILLATOR
Oscillator Frequencyf
Oscillator Startup Timet
OSC
OSC_RDYVREG18
= 1.8V (Note 6)350
Oscillator Duty Cycle (Note 6)4555%
NANOPOWER RING OSCILLATOR
Nanopower Ring Frequencyf
Nanopower Ring CurrentI
Wakeup Timer Interval t
NANO
NANO
WAKEUP
TA = +25NC
Typical at VDD = 3.0V, active
during wake-up (Note 6)
1/f
NANO
FLASH MEMORY
Flash Erase Time
Flash Programming Time per Wordt
PROG
Mass erase2040
Page erase2040
Write/Erase Cycles1000Cycles
Data Retention
Analog Supply VoltageV
AVDD
TA = +25NC
567MHz
31122kHz
120400nA
t
NANO
65,535
x t
NANO
2040
100Years
V
DD
Fs
s
ms
Fs
V
MAXQ1004
10-BIT ADC PERFORMANCE
(VDD = 1.7V to 3.6V, V
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Resolution10Bits
ADC Clock Frequencyf
ADC Clock Periodt
AN0 Input Voltage Range V
Analog Input Capacitance C
Integral NonlinearityINL(Note 6)
Differential NonlinearityDNLNo missing codes over temperature
Offset ErrorV
ADC Active Current ConsumptionI
ADC Setup Timet
ADC Output Latencyt
ADC Settling Timet
ADC Throughputf
TEMPERATURE SENSOR
Temperature Sensor Setup Timet
Temperature Sensor Error
= 1.845V, TA = -40NC to +85NC, unless otherwise noted.)
Note 1: Specifications to -40NC are guaranteed by design and are not production tested.
Note 2: The power-fail reset and POR detectors operate in tandem so one or both of these signals are active at all times when
VDD < V
Note 3: The power-fail warning monitor and the power-fail reset monitor track each other with a typical delta between the two of 0.13V.
MAXQ1004
Note 4: Writes to flash memory must not be performed when the supply voltage drops below the power-fail warning levels, as
RST
there is uncertainty in the duration of continuous power supply. The user application should check the status of the powerfail warning flag before writing to flash to ensure valid write operations.
Note 5: Measured on the combined AVDD and VDD pins and the part not in reset. All inputs are connected to GND or VDD.
Outputs do not source/sink any current.
Note 6: Guaranteed by design and not production tested.
Note 7: The maximum total current, I
mum specified voltage drop.
SPI ELECTRICAL CHARACTERISTICS
(VDD = 1.7V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. AC electrical specifications are guaranteed by design and are
not production tested.)