Rainbow Electronics MAX723 User Manual

19-0113; Rev. 2; 1/95
EVALUATION KIT MANUAL
FOLLOWS DATA SHEET
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
The MAX756/MAX757 are CMOS step-up DC-DC switch­ing regulators for small, low input voltage or battery-pow­ered systems. The MAX756 accepts a positive input voltage down to 0.7V and converts it to a higher pin­selectable output voltage of 3.3V or 5V. The MAX757 is an adjustable version that accepts an input voltage down to 0.7V and generates a higher adjustable output voltage in the range from 2.7V to 5.5V. Typical full-load efficiencies for the MAX756/MAX757 are greater than 87%.
The MAX756/MAX757 provide three improvements over previous devices. Physical size is reduced—the high switching frequencies (up to 0.5MHz) made possible by MOSFET power transistors allow for tiny (<5mm diameter) surface-mount magnetics. Efficiency is improved to 87% (10% better than with low-voltage regulators fabricated in bipolar technology). Supply current is reduced to 60µA by CMOS construction and a unique constant-off-time pulse-frequency modulation control scheme.
________________________Applications
3.3V to 5V Step-Up Conversion Palmtop Computers Portable Data-Collection Equipment Personal Data Communicators/Computers Medical Instrumentation 2-Cell & 3-Cell Battery-Operated Equipment Glucose Meters
____________________________Features
Operates Down to 0.7V Input Supply Voltage87% Efficiency at 200mA60µA Quiescent Current20µA Shutdown Mode with Active Reference and
LBI Detector
500kHz Maximum Switching Frequency±1.5% Reference Tolerance Over TemperatureLow-Battery Detector (LBI/LBO)8-Pin DIP and SO Packages
______________Ordering Information
PART TEMP. RANGE PIN-PACKAGE
MAX756CPA
MAX756CSA 0°C to +70°C 8 SO MAX756C/D 0°C to +70°C Dice* MAX756EPA -40°C to +85°C 8 Plastic DIP MAX756ESA -40°C to +85°C 8 SO MAX757CPA MAX757CSA 0°C to +70°C 8 SO MAX757C/D 0°C to +70°C Dice* MAX757EPA -40°C to +85°C 8 Plastic DIP MAX757ESA -40°C to +85°C 8 SO
* Dice are tested at TA= +25°C only.
0°C to +70°C 8 Plastic DIP
0°C to +70°C 8 Plastic DIP
MAX756/MAX757
__________Typical Operating Circuit
INPUT
2V to V
OUT
0.1µF
150µF
8
6
4
22µH
LOW-BATTERY DETECTOR OUTPUT
5
1
2
3
LBI
SHDN
MAX756
3/5
REF
________________________________________________________________
LX
OUT
LBO
GND
7
1N5817
OUTPUT
5V at 200mA
or
3.3V at 300mA
100µF
_________________Pin Configurations
TOP VIEW
1
SHDN
2
3/5
REF
LBO
SHDN
REF
LBO
MAX756
3 4
DIP/SO
1 2
FB
MAX757
3 4
DIP/SO
Maxim Integrated Products
Call toll free 1-800-998-8800 for free samples or literature.
8
LX
7
GND
6
OUT
5
LBI
8
LX
7
GND
6
OUT
5
LBI
1
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (OUT to GND) ....................................-0.3V, +7V
Switch Voltage (LX to GND)........................................-0.3V, +7V
Auxiliary Pin Voltages (SHDN
3/5
, FB to GND)........................................-0.3V, (V
Reference Current (I Continuous Power Dissipation (T
Plastic DIP (derate 9.09mW/°C above +70°C) .............727mW
, LBI, LBO, REF,
) ....................................................2.5mA
REF
= +70°C)
A
OUT
+ 0.3V)
SO (derate 5.88mW/°C above +70°C)..........................471mW
Stresses beyond those listed under “Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Operating Temperature Ranges:
MAX75_C_ _ ........................................................0°C to +70°C
MAX75_E_ _......................................................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................... -65°to +160°C
Lead Temperature (soldering, 10sec)........................... +300°C
ELECTRICAL CHARACTERISTICS
(Circuits of Figure 1 and Typical Operating Circuit, VIN= 2.5V, I
= 0mA, TA= T
LOAD
MIN
to T
, unless otherwise noted.)
MAX
MAX756/MAX757
Output Voltage
Minimum Start-Up Supply Voltage Minimum Operating Supply
Voltage (once started)
Quiescent Supply Current in
3.3V Mode (Note 1)
Battery Quiescent Current Measured at V
in Figure 1
IN
Shutdown Quiescent Current
(Note 1) Reference Voltage Reference-Voltage Regulation
LBO Output Voltage Low
LBO Output Leakage Current
SHDN, 3/5, FB, LBI Input Current
Output Voltage Range
MAX756, 3/5 = 0V, 0mA < I
2V < VIN< 3V
I
LOAD
I
LOAD
I
= 0mA, 3/5 = 3V, LBI = 1.25V, V
LOAD
FB = 1.3V (MAX757 only)
SHDN = 0V, LBI = 1.25V, 3/5 = 3V, V FB = 1.3V (MAX757 only)
MAX756, 3/5 = 3V, 0mA < I MAX757, V
= 10mA = 20mA
= 0.1µF
REF
= 5V, 0mA < I
OUT
OUT
OUT
3/5 = 3V, -20µA < REF load < 250µA, C
I
= 2mA
SINK
LBI = 1.25V, FB = 1.25V, SHDN = 0V or 3V, 3/5 = 0V or 3V
MAX757, I
= 0mA (Note 2)
LOAD
LOAD LOAD
LOAD
= 3.47V,
= 3.47V,
= 0.22µF
REF
< 200mA < 300mA
< 200mA
4.8 5.0 5.2
3.17 3.30 3.43 V
4.8 5.0 5.2
1.1 1.8
60
60Output set for 3.3V
UNITSMIN TYP MAXCONDITIONSPARAMETER
V V0.7
µA
µA
µA20 40
V1.23 1.25 1.27No REF load, C
%0.8 2.0
V1.22 1.25 1.28With falling edgeLBI Input Threshold
mV25LBI Input Hysteresis
V0.4
µA1LBO = 5V
V0.4SHDN, 3/5 Input Voltage Low V1.6SHDN, 3/5 Input Voltage High
nA±100
V1.22 1.25 1.28MAX757FB Voltage V2.7 5.5
Note 1: Supply current from the 3.3V output is measured with an ammeter between the 3.3V output and OUT pin. This current
correlates directly with actual battery supply current, but is reduced in value according to the step-up ratio and efficiency.
Note 2: Minimum value is production tested. Maximum value is guaranteed by design and is not production tested.
2 _______________________________________________________________________________________
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
__________________________________________Typical Operating Characteristics
(Circuit of Figure 1, TA= +25°C, unless otherwise noted.)
EFFICIENCY vs. LOAD CURRENT
90
80
70
60
EFFICIENCY (%)
50
40
1M
100k
10k
1k
SWITCHING FREQUENCY (Hz)
100
10
3.3V OUTPUT MODE
VIN = 2.0V
VIN = 1.2V
0.1 10 1000
1 100
LOAD CURRENT (mA)
SWITCHING FREQUENCY
vs. LOAD CURRENT
5V MODE
10µ 10m 1
100µ 1m 100m
LOAD CURRENT (A)
MINIMUM START-UP INPUT VOLTAGE
1.8
1.6
3.3V MODE
V
= 2.5V
IN
vs. LOAD CURRENT
MAX756-1
EFFICIENCY (%)
MAX756-4
EFFICIENCY vs. LOAD CURRENT
90
80
70
60
50
40
500
400
300
200
QUIESCENT CURRENT (µA)
100
0
5V OUTPUT MODE
VIN = 3.3V
VIN = 1.25V
0.1 10 1000
1 100
LOAD CURRENT (mA)
QUIESCENT CURRENT
vs. INPUT VOLTAGE
CURRENT MEASURED AT V
V
= 5V
OUT
V
1
2
3
INPUT VOLTAGE (V)
MAX756-7
OUT
VIN = 2.5V
IN
= 3.3V
4
10
8
MAX756-2
MAXIMUM OUTPUT CURRENT (mA)
MAX756-5
SHUTDOWN QUIESCENT CURRENT (µA)
5
REFERENCE VOLTAGE
LOAD REGULATION
MAXIMUM OUTPUT CURRENT
800 700
600 500 400 300 200 100
0
50
40
30
20
10
0
vs. INPUT VOLTAGE
3.3V MODE
02
13
INPUT VOLTAGE (V)
SHUTDOWN QUIESCENT CURRENT
vs. INPUT VOLTAGE
CURRENT MEASURED AT V
12 5
3
INPUT VOLTAGE (V)
5V MODE
4
IN
4
MAX756-8
MAX756/MAX757
MAX756-3
5
MAX756-6
1.4
1.2
START-UP INPUT VOLTAGE (V)
1.0
0.8 1
10 100
LOAD CURRENT (mA)
3.3V MODE
1000
6
4
VREF LOAD REGULATION (mV)
2
0
0
50 100 150 200
LOAD CURRENT (µA)
V
= 3.3V
OUT
250
_________________________________________________________________________________________________
3
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
_____________________________Typical Operating Characteristics (continued)
(Circuit of Figure 1, TA= +25°C, unless otherwise noted.)
LOAD-TRANSIENT RESPONSE
OUTPUT VOLTAGE 50mV/div
OUTPUT
CURRENT
0mA to 200mA
MAX756/MAX757
= 2.5V
V
IN
HORIZONTAL = 50µs/div 5V Mode
V
SHDN
2V/div
V
OUT
2V/div
VIN = 2.5V HORIZONTAL = 5ms/div 5V Mode
START-UP DELAY
3V
0V
5V
0V
______________________________________________________________Pin Description
PIN
MAX756 MAX757
1
2 3/5 Selects the main output voltage setting; 5V when low, 3.3V when high.
FB
1
2
NAME FUNCTION
SHDN
Shutdown Input disables SMPS when low, but the voltage reference and low-battery com­parator remain active.
Feedback Input for adjustable output operation. Connect to an external voltage divider between OUT and GND.
3 REF
4 LBO
5 LBI
6 OUT
7 GND Power Ground. Must be low impedance; solder directly to ground plane. 8 LX 1A, 0.5N-Channel Power MOSFET Drain
4 _______________________________________________________________________________________
3
4
5
6
7 8
1.25V Reference Voltage Output. Bypass with 0.22µF to GND (0.1µF if there is no external reference load). Maximum load capability is 250µA source, 20µA sink.
Low-Battery Output. An open-drain N-channel MOSFET sinks current when the voltage at LBI drops below +1.25V.
Low-Battery Input. When the voltage on LBI drops below +1.25V, LBO sinks current. Connect to VINif not used.
Connect OUT to the regulator output. It provides bootstrapped power to both devices, and also senses the output voltage for the MAX756.
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
_______________Detailed Description
Operating Principle
The MAX756/MAX757 combine a switch-mode regulator with an N-channel MOSFET, precision voltage reference, and power-fail detector in a single monolithic device. The MOSFET is a “sense-FET” type for best efficiency, and has a very low gate threshold voltage to ensure start-up under low-battery voltage conditions (1.1V typ).
Pulse-Frequency
Modulation Control Scheme
A unique minimum off time, current-limited, pulse-frequen­cy modulation (PFM) control scheme is a key feature of the MAX756/MAX757. This PFM scheme combines the advantages of pulse-width modulation (PWM) (high output power and efficiency) with those of a traditional PFM pulse-skipper (ultra-low quiescent currents). There is no oscillator; at heavy loads, switching is accomplished through a constant peak-current limit in the switch, which allows the inductor current to self-oscillate between this peak limit and some lesser value. At light loads, switching frequency is governed by a pair of one-shots, which set a minimum off-time (1µs) and a maximum on-time (4µs). The switching frequency depends on the load and the input voltage, and can range as high as 500kHz.
The peak switch current of the internal MOSFET power switch is fixed at 1A ±0.2A. The switch's on resistance is typically 0.5, resulting in a switch voltage drop (VSW) of about 500mV under high output loads. The value of VSWdecreases with light current loads.
Conventional PWM converters generate constant-fre­quency switching noise, whereas this architecture pro­duces variable-frequency switching noise. However, the noise does not exceed the switch current limit times the filter-capacitor equivalent series resistance (ESR), unlike conventional pulse-skippers.
Voltage Reference
The precision voltage reference is suitable for driving external loads such as an analog-to-digital converter. It has guaranteed 250µA source-current and 20µA sink-current capability. The reference is kept alive even in shutdown mode. If the reference drives an external load, bypass it with 0.22µF to GND. If the ref­erence is unloaded, bypass it with at least 0.1µF.
Control-Logic Inputs
The control inputs (3/5, SHDN) are high-impedance MOS gates protected against ESD damage by normally reverse-biased clamp diodes. If these inputs are dri­ven from signal sources that exceed the main supply
voltage, the diode current should be limited by a series resistor (1Msuggested). The logic input threshold level is the same (approximately 1V) in both 3.3V and 5V modes. Do not leave the control inputs floating.
__________________Design Procedure
Output Voltage Selection
The MAX756 output voltage can be selected to 3.3V or 5V under logic control, or it can be left in one mode or the other by tying 3/5 to GND or OUT. Efficiency varies depending upon the battery and the load, and is typi­cally better than 80% over a 2mA to 200mA load range. The device is internally bootstrapped, with power derived from the output voltage (via OUT). When the output is set at 5V instead of 3.3V, the higher internal supply voltage results in lower switch-transistor on resistance and slightly greater output power. Bootstrapping allows the battery voltage to sag to less than 1V once the system is started. Therefore, the bat­tery voltage range is from V (where VDis the forward drop of the Schottky rectifier). If the battery voltage exceeds the programmed output voltage, the output will follow the battery voltage. In many systems this is acceptable; however, the output voltage must not be forced above 7V.
The output voltage of the MAX757 is set by two resis­tors, R1 and R2 (Figure 1), which form a voltage divider between the output and the FB pin. The output voltage is set by the equation:
V
= (V
OUT
where V To simplify resistor selection:
Since the input bias current at FB has a maximum value of 100nA, large values (10kto 200k) can be used for R1 and R2 with no significant loss of accuracy. For 1% error, the current through R1 should be at least 100 times FB’s bias current.
The MAX756/MAX757 contain on-chip circuitry for low­battery detection. If the voltage at LBI falls below the reg­ulator’s internal reference voltage (1.25V), LBO (an open­drain output) sinks current to GND. The low-battery mon­itor's threshold is set by two resistors, R3 and R4 (Figure
1), which forms a voltage divider between the input volt­age and the LBI pin. The threshold voltage is set by R3 and R4 using the following equation:
= 1.25V.
REF
R1 = (R2) [(V
R3 = [(V
) [(R2 + R1) / R2]
REF
OUT
/ V
IN
REF
+ VDto less than 1V
OUT
/ V
) - 1]
REF
Low-Battery Detection
) - 1] (R4)
MAX756/MAX757
_______________________________________________________________________________________ 5
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
V
IN
C1
R3
R4
C3
0.1µF
MAX756/MAX757
Figure 1. Standard Application Circuit
150µF
5
LBI
MAX757
1
SHDN
3
REF
LX
OUT
FB
LBO
GND
7
L1 22µH
D1
1N5817
8
6
2
4
R1
R2
where VINis the desired threshold of the low-battery detector, R3 and R4 are the input divider resistors at LBI, and V
is the internal 1.25V reference.
REF
Since the LBI current is less than 100nA, large resistor values (typically 10kto 200k) can be used for R3 and R4 to minimize loading of the input supply.
When the voltage at LBI is below the internal threshold, LBO sinks current to GND. A pull-up resistor of 10k or more connected from LBO to V when driving CMOS circuits. Any pull-up resistor con-
can be used
OUT
nected to LBO should not be returned to a voltage source greater than V threshold, the LBO output is off. The low-battery com-
. When LBI is above the
OUT
parator and reference voltage remain active when the MAX756/MAX757 is in shutdown mode.
If the low-battery comparator is not used, connect LBI to VINand leave LBO open.
Inductor Selection
The inductors should have a saturation (incremental) current rating equal to or greater than the peak switch­current limit, which is 1.2A worst-case. However, it’s generally acceptable to bias the inductor into satura­tion by 20%, although this will reduce the efficiency.
The 22µH inductor shown in the typical applications cir­cuit is sufficient for most MAX756/MAX757 application circuits. Higher input voltages increase the energy transferred with each cycle, due to the reduced input/output differential. Minimize excess ripple due to increased energy transfer by reducing the inductor value (10µH suggested).
V
OUT
C2 100µF
The inductor’s DC resistance significantly affects effi­ciency. For highest efficiency, limit L1’s DC resistance to 0.03or less. See Table 1 for a list of suggested inductor suppliers.
Table 1. Component Suppliers
PRODUCTION
METHOD
Surface-Mount AVX
Miniature Through-Hole
Low-Cost Through-Hole
AVX USA: (207) 282-5111, FAX (207) 283-1941
CoilCraft USA: (708) 639-6400, FAX (708) 639-1969 Coiltronics USA: (407) 241-7876, FAX (407) 241-9339 Collmer
Semiconductor USA: (214) 233-1589 Motorola USA: (602) 244-3576, FAX (602) 244-4015 Nichicon USA: (708) 843-7500, FAX (708) 843-2798
Nihon USA: (805) 867-2555, FAX (805) 867-2556
Sanyo OS-CON USA: (619) 661-6835
Sprague USA: (603) 224-1961, FAX (603) 224-1430 Sumida USA: (708) 956-0666
United Chemi-Con USA: (708) 696-2000, FAX (708) 640-6311
A 100µF, 10V surface-mount (SMT) tantalum capacitor typically provides 50mV output ripple when stepping up from 2V to 5V at 200mA. Smaller capacitors, down to 10µF, are acceptable for light loads or in applica­tions that can tolerate higher output ripple.
INDUCTORS CAPACITORS
Sumida CD54-220 (22µH) CoilCraft DT3316-223 Coiltronics CTX20-1
Sumida RCH654-220
CoilCraft PCH-27-223
(800) 282-9975
Japan: +81-7-5231-8461, FAX (+81-) 7-5256-4158
Japan: +81-3-3494-7411, FAX (+81-) 3-3494-7414
Japan: +81-720-70-1005, FAX (+81-720-) 70-1174
Japan: +81-3-3607-5111, FAX (+81-3-) 3607-5428
TPS series Sprague
595D series
Sanyo OS-CON
OS-CON series low-ESR organic semiconductor
Nichicon
PL series low-ESR electrolyic
United Chemi-Con
LXF series
Capacitor Selection
6 _______________________________________________________________________________________
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
The ESR of both bypass and filter capacitors affects efficiency. Best performance is obtained by using spe­cialized low-ESR capacitors, or connecting two or more filter capacitors in parallel. The smallest low-ESR SMT tantalum capacitors currently available are Sprague 595D series, which are about half the size of competing products. Sanyo OS-CON organic semiconductor through-hole capacitors also exhibit very low ESR, and are especially useful for operation at cold tempera­tures. Table 1 lists suggested capacitor suppliers.
MINIMUM
SHDN
OFF-TIME
ONE-SHOT
3/5
MAXIMUM
ON-TIME
ONE-SHOT
TRIG Q
ONE-SHOT
ONE-SHOT
F/F
S
R
Rectifier Diode
For optimum performance, a switching Schottky diode, such as the 1N5817, is recommended. 1N5817 equiv­alent diodes are also available in surface-mount pack­ages from Collmer Semiconductor in Dallas, TX, phone (214) 233-1589. The part numbers are SE014 or SE024. For low output power applications, a pn junc­tion switching diode, such as the 1N4148, will also work well, although efficiency will suffer due to the greater forward voltage drop of the pn junction diode.
V
IN
TRIGQ
LX
Q
N
GND
OUT
MAX756/MAX757
V
OUT
LBO
LBI
Figure 2. MAX756 Block Diagram
_______________________________________________________________________________________ 7
MAX756
N
REFERENCE
REF
3.3V/5V/Adjustable-Output
3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters
Step-Up DC-DC Converters
PC Layout and Grounding
The MAX756/MAX757 high peak currents and high-fre­quency operation make PC layout important for mini-
___________________Chip Topography
SHDN
LX
mizing ground bounce and noise. The distance between the MAX756/MAX757’s GND pin and the ground leads of C1 and C2 in Figure 1 must be kept to less than 0.2" (5mm). All connections to the FB and LX pins should also be kept as short as possible. To
3/5 (MAX756)
FB (MAX757)
obtain maximum output power and efficiency and mini­mum output ripple voltage, use a ground plane and
GND
solder the MAX756/MAX757 GND (pin 7) directly to the ground plane.
GND
OUT
LBI
MAX756/MAX757
REF
LBO
0.080"
(2.03mm)
TRANSISTOR COUNT: 758 SUBSTRATE CONNECTED TO OUT
________________________________________________________Package Information
INCHES MILLIMETERS
DIM
A
A1
B C
HE
D E e H h L
α
MIN
0.053
0.004
0.014
0.007
0.189
0.150
0.228
0.010
0.016 0˚
MAX
MIN
0.069
1.35
0.010
0.10
0.019
0.35
0.010
0.19
0.197
4.80
0.157
3.80
1.27 BSC0.050 BSC
0.244
0.020
0.050
5.80
0.25
0.40
0.122"
(3.10mm)
MAX
1.75
0.25
0.49
0.25
5.00
4.00
6.20
0.50
1.27
21-325A
D
A
0.127mm
e
A1
B
0.004in.
h x 45˚
α
8-PIN PLASTIC
C
L
SMALL-OUTLINE
PACKAGE
8 _______________________________________________________________________________________
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