Rainbow Electronics MAX6900 User Manual

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General Description
The MAX6900, I2C™-bus-compatible real-time clock (RTC) in a 6-pin TDFN package contains a real-time clock/calendar and 31-byte
8-bit wide of static ran­dom access memory (SRAM). The real-time clock/cal­endar provides seconds, minutes, hours, day, date, month, and year information. The end of the month date is automatically adjusted for months with fewer than 31 days, including corrections for leap year up to the year
2100. The clock operates in either the 24hr or 12hr for­mat with an AM/PM indicator.
Applications
Portable Instruments
Point-of-Sale Equipment
Intelligent Instruments
Battery-Powered Products
Features
Real-Time Clock Counts Seconds, Minutes,
Hours, Date, Month, Day, and Year
Leap Year Compensation Valid up to Year 2100
Fast (400kHz) I
2
C-Bus-Compatible Interface from
2.0V to 5.5V
31
8 SRAM for Scratchpad Data Storage
Uses Standard 32.768kHz, 12.5pF Load, Watch
Crystal
Ultra-Low 225nA (typ) Timekeeping Current
Single-Byte or Multiple-Byte (Burst Mode) Data
Transfer for Read or Write of Clock Registers or SRAM
6-Pin 3mm x 3mm x 0.8mm TDFN Surface-Mount
Package
No External Crystal Bias Resistors or Capacitors
Required
MAX6900
I2C-Compatible RTC in a TDFN
________________________________________________________________ Maxim Integrated Products 1
19-1942; Rev 3; 6/03
Typical Operating Circuit
X1
GNDX2
1 6 SDA
5 SCL
V
CC
MAX6900
TDFN
TOP VIEW
2
34
Pin Configuration
Ordering Information
Related Real-Time Clock Products
I2C is a trademark of Philips Corp. Purchase of I2C components of Maxim Integrated Products, Inc., or one of its sublicensed Associated Companies, conveys a license under the Philips I
2
C Patent Rights to use these components in an I2C system, provid­ed that the system conforms to the I2C Standard Specification as defined by Philips.
SPI is a trademark of Motorola, Inc.
PART TEMP RANGE
MAX6900ETT-T -40°C to +85°C 6 TDFN AEU
PIN­PACKAGE
TOP
MARK
PART SERIAL BUS SRAM
ALARM
FUNCTION
OUTPUT
FREQUENCY
PIN-PACKAGE
MAX6900 I2C compatible 31 ✕ 8 ——6 TDFN
MAX6901 3-wire 31 ✕ 8 Polled 32kHz 8 TDFN
MAX6902 SPI compatible 31 ✕ 8 Polled 8 TDFN
V
CC
V
CC
V
CC
µC
RPU RPU
RPU = t
r/Cbus
0.01µF
5
6
SCL
SDA
1
V
CC
MAX6900
GND
4
X1
X2
2
CRYSTAL
3
MAX6900
I2C-Compatible RTC in a TDFN
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND..............................................................-0.3V to +6V
All Other Pins to GND ................................-0.3V to (V
CC
+ 0.3V)
Input Current
All Pins ............................................................................20mA
Output Current
All Outputs .......................................................................20mA
Rate of Rise, V
CC
............................................................100V/µs
Continuous Power Dissipation (T
A
= +70°C)
6-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951.0mW
Operating Temperature Range ...............................T
MIN
to T
MAX
MAX6900 ETT-T .......................T
MIN
= -40°C, T
MAX
= +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
ESD Protection (all pins, Human Body model) ..................2000V
Lead Temperature (soldering, 10s) ...…………………….+300°C
DC ELECTRICAL CHARACTERISTICS
(VCC= +2.0V to +5.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at VCC= +3.3V, TA= +25°C.) (Note 1)
AC ELECTRICAL CHARACTERISTICS
(VCC= +2.0V to +5.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at VCC= +3.3V, TA= +25°C.) (Notes 1, 6)
Operating Voltage Range V
Active Supply Current (Note 2) I
Timekeeping Supply Current (Note 3)
2-WIRE DIGITAL INPUTS SCL, SDA
Input High Voltage V
Input Low Voltage V
Input Hysteresis (Note 5) V
Input Leakage Current (Note 4) 0 < VIN < V
Input Capacitance (Note 5) 10 pF
2-WIRE DIGITAL OUTPUT SDA
Output Low Voltage V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CC
CC
I
TK
IH
IL
HYS
OL
VCC = +2.0V 30
VCC = +5.0V 110
VCC = +2.0V 0.225 0.630
VCC = +5.0V 1.2 1.7
CC
I
= 4mA 0.4 V
SINK
2 5.5 V
0.7 x V
CC
0.05 x V
CC
-10 10 nA
0.3 x V
CC
µA
µA
V
V
V
OSCILLATOR
X1 to Ground Capacitance 25 pF
X2 to Ground Capacitance 25 pF
FAST I2C-BUS-COMPATIBLE TIMING
SCL Clock Frequency f
Bus Free Time Between STOP and START Condition (Note 4)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SCL
t
BUF
0 400 kHz
1.3 µs
MAX6900
I2C-Compatible RTC in a TDFN
_______________________________________________________________________________________ 3
AC ELECTRICAL CHARACTERISTICS (continued)
(VCC= +2.0V to +5.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at VCC= +3.3V, TA= +25°C.) (Notes 1, 6)
Note 1: All parameters are 100% tested at TA= +25°C. Limits over temperature are guaranteed by design and not production tested. Note 2: I
CC
is specified with SCL = 400kHz and SDA = 400kHz.
Note 3: I
TK
is specified with SCL = Logic High (4.7kpullup resistor) and SDA = Logic High (4.7kpullup resistor);
I
2
C-compatible bus inactive.
Note 4: MAX6900 I/O pins do not obstruct the SDA and SCL lines if V
CC
is switched off.
Note 5: Guaranteed by design. Not subject to production testing. Note 6: All values referred to V
IH
min
and V
IL
max
levels.
Note 7: The MAX6900 internally provides a hold time of at least 300ns for the SDA signal (referred to the V
IH
min
of the SCL signal)
in order to bridge the undefined region of the falling edge of SCL.
Note 8: C
B
= total capacitance of one bus line in pF.
Note 9: The maximum t
f
for the SDA and SCL bus lines is specified at 300ns. The maximum fall time for the SDA output stage tfis specified at 250ns. This allows series protection resistors to be connected between the SDA/SCL pins and the SDA/SCL bus lines without exceeding the maximum specified t
f
.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Hold Time After (Repeated) START Condition (After this Period, the First Clock Is Generated)
Repeated START Condition Setup Time
STOP Condition Setup Time t
Data Hold Time (Note 7) t
Data Setup Time t
SCL Low Period t
SCL High Period t
Minimum SCL/SDA Rise Time (Note 8)
Maximum SCL/SDA Rise Time (Note 8)
Minimum SCL/SDA Fall Time (Receiving) (Notes 8, 9)
Maximum SCL/SDA Fall Time (Receiving) (Notes 8, 9)
Minimum SDA Fall Time (Transmitting) (Notes 8, 9)
Maximum SDA Fall Time (Transmitting) (Notes 8, 9)
Pulse Width of Spike Suppressed t
Capacitive Load for Each Bus Line
t
HD:STA
t
SU:STA
SU:STO
HD:DAT
SU:DAT
LOW
HIGH
t
r
t
r
t
f
t
f
t
f
t
f
SP
C
B
0.6 µs
0.6 µs
0.6 µs 0 0.9 µs
100 ns
1.3 µs
0.6 µs
20 +
0.1C
B
ns
300 ns
20 +
0.1C
B
ns
300 ns
20 +
0.1C
B
ns
250 ns
50 ns
400 pF
Detailed Description
The MAX6900 contains eight timekeeping registers, burst address registers, a control register, an on-chip
32.768kHz oscillator circuit, and a serial 2-wire, I2C­compatible interface. There are also 31 bytes, 8 bits wide of SRAM on board. Time and calendar data are stored in the registers in a binary-coded decimal (BCD) format. Figure 1 shows an I2C-bus-compatible timing diagram. Figure 2 shows the MAX6900 functional dia­gram.
Real-Time Clock
The RTC provides seconds, minutes, hours, day, date, month, and year information. The end of the month is automatically adjusted for months with fewer than 31
MAX6900
I2C-Compatible RTC in a TDFN
4 _______________________________________________________________________________________
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
0
0.3
0.4
0.1
0.2
0.6
0.5
1.0
0.7
0.8
0.9
1.1
1.4
1.5
1.2
1.3
1.6
1.0 2.0 2.5 3.01.5 3.5 4.0 4.5 5.55.0 6.0
TIMEKEEPING CURRENT vs. V
CC
MAX6900 toc01
VCC (V)
TIMEKEEPING CURRENT (µA)
Pin Description
Figure 1. Detailed
I
2
C-Bus Timing Diagrams
PIN NAME FUNCTION
1VCCPower Supply
2 X1 32.768kHz External Crystal
3 X2 32.768kHz External Crystal
4 GND Ground
5 SCL I2C-Bus-Compatible Clock Input
6 SDA
PAD Ground
PROTOCOL
SCL
SDA
2
I
C-Bus-Compatible Data
Input/Output
START
CONDITION
(S)
t
t
LOW
r
t
SU:STA
t
BUF
t
HD:STA
BIT 7 MSB (A7)
t
HIGH
t
HD:DAT
BIT 6
(A6)
1/f
SCL
t
f
t
HD:DAT
BIT 0
LSB
(R/W)
ACKNOWLEDGE
(A)
t
SU:STO
STOP
CONDITION
(P)
days, including corrections for leap year up to the year
2100.
Crystal Oscillator
The MAX6900 uses an external, standard 12.5pF load watch crystal. No other external components are required for this timekeeping oscillator. Power-up oscil­lator start-time is dependent mainly upon applied V
CC
and ambient temperature. The MAX6900, because of its low timekeeping current, exhibits a typical startup time between 5s to 10s.
I2C-Compatible Interface
Interfacing the MAX6900 with a microprocessor or other I2C master is made easier by using the serial, I2C­bus-compatible or other I2C master interface. Only 2 wires are required to communicate with the clock and SRAM: SCL (serial clock) and SDA (data line). Data is transferred to and from the MAX6900 over the I/O data line, SDA. The MAX6900 uses 7-bit slave ID address­ing. The MAX6900 does not respond to general call address commands.
Applications Information
I2C-Bus-Compatible Interface
The I2C-bus-compatible serial interface allows bidirec­tional, 2-wire communication between multiple ICs. The two lines are SDA and SCL. Connect both lines to a positive supply through individual pullup resistors. A device on the I2C-compatible bus that generates a message is called a transmitter and a device that receives the message is a receiver. The device that controls the message is the master and the devices that are controlled by the master are called slaves (Figure 3). The word message refers to data in the form of three 8-bit bytes for a Single Read or Write. The first byte is the Slave ID byte, the second byte is the Address/Command byte, and the third is the data.
Data transfer can only be initiated when the bus is not busy (both SDA and SCL are high). A high-to-low tran­sition of SDA while SCL is high is defined as the Start (S) condition; low-to-high transition of the data line while SCL is high is defined as the Stop (P) condition (Figure 4).
MAX6900
I2C-Compatible RTC in a TDFN
_______________________________________________________________________________________ 5
Figure 2. Functional Diagram
VCC
GND
SCL
SDA
ADDRESS REGISTER
31 X 8
SRAM
1Hz
SECONDS
MINUTES
HOURS
DATE
MONTH
DAY
YEAR
CONTROL
CENTURY
CLOCK BURST
X1
X2
OSCILLATOR
32.768kHz
2
C BUS
I
INTERFACE
DIVIDER
CONTROL
LOGIC
MAX6900
I2C-Compatible RTC in a TDFN
6 _______________________________________________________________________________________
After the Start condition occurs, 1 bit of data is trans­ferred for each clock pulse. The data on SDA must remain stable during the high portion of the clock pulse as changes in data during this time are interpreted as a control signal (Figure 5). Any time a start condition occurs, the Slave ID must follow immediately, regard­less of completion of the previous data transfer.
Before any data is transmitted on the I
2
C-bus-compati­ble serial interface, the device that is expected to respond is addressed first. The first byte sent after the start (S) procedure is the Address byte or 7-bit Slave
ID. The MAX6900 acts as a slave transmitter/receiver. Therefore, SCL is only an input clock signal and SDA is a bidirectional data line. The Slave Address for the MAX6900 is shown in Figure 6.
Figure 5. I2C Bus Bit Transfer
Figure 6. I2C Bus Slave Address or 7-Bit Slave ID
Figure 3. I2C Bus System Configuration
Figure 4. I2C Bus Start and Stop Conditions
SDA
SCL
SDA
SCL
S
START CONDITION STOP CONDITION
SDA
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
SDA
SCL
P
SCL
DATA LINE
STABLE;
DATA VALID
CHANGE OF DATA
ALLOWED
RD/W
0000101
BIT 0BIT 7
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