MAX6641
SMBus-Compatible Temperature Monitor with
Automatic PWM Fan-Speed Controller
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The effects of the ideality factor and series resistance 
are additive. If the diode has an ideality factor of 1.002 
and series resistance of 3Ω, the total offset can be calculated by adding error due to series resistance with 
error due to ideality factor:
1.36°C - 2.13°C = -0.1477°C
for a diode temperature of +85°C.
In this example, the effect of the series resistance and 
the ideality factor partially cancel each other.
For best accuracy, the discrete transistor should be a 
small-signal device with its collector connected to GND 
and base connected to DXN. Table 6 lists examples of 
discrete transistors that are appropriate for use with 
the MAX6641.
The transistor must be a small-signal type with a relatively high forward voltage; otherwise, the A/D input 
voltage range can be violated. The forward voltage at 
the highest expected temperature must be greater than
0.25V at 10µA, and at the lowest expected temperature, the forward voltage must be less than 0.95V at 
100µA. Large power transistors must not be used. Also, 
ensure that the base resistance is less than 100Ω. Tight 
specifications for forward-current gain (50 < ß <150, for 
example) indicate that the manufacturer has good 
process controls and that the devices have consistent 
VBE characteristics.
ADC Noise Filtering
The integrating ADC used has good noise rejection for 
low-frequency signals such as 60Hz/120Hz power-supply hum. In noisy environments, high-frequency noise 
reduction is needed for high-accuracy remote measurements. The noise can be reduced with careful PC board 
layout and proper external noise filtering.
High-frequency EMI is best filtered at DXP and DXN with 
an external 2200pF capacitor. Larger capacitor values 
can be used for added filtering, but do not exceed 
3300pF because larger values can introduce errors due 
to the rise time of the switched current source.
PC Board Layout
Follow these guidelines to reduce the measurement 
error of the temperature sensors:
1) Place the MAX6641 as close as is practical to the 
remote diode. In noisy environments, such as a 
computer motherboard, this distance can be 4in to 
8in typically. This length can be increased if the 
worst noise sources are avoided. Noise sources 
include CRTs, clock generators, memory buses, 
and ISA/PCI buses.
2) Do not route the DXP-DXN lines next to the deflection coils of a CRT. Also, do not route the traces 
across fast digital signals, which can easily introduce 30°C error, even with good filtering.
3) Route the DXP and DXN traces in parallel and in 
close proximity to each other, away from any higher 
voltage traces, such as 12VDC. Leakage currents 
from PC board contamination must be dealt with 
carefully since a 20MΩ leakage path from DXP to 
ground causes about 1°C error. If high-voltage traces 
are unavoidable, connect guard traces to GND on 
either side of the DXP-DXN traces (Figure 9).
4) Route through as few vias and crossunders as possible to minimize copper/solder thermocouple 
effects.
5) When introducing a thermocouple, make sure that 
both the DXP and the DXN paths have matching 
thermocouples. A copper-solder thermocouple 
exhibits 3µV/°C, and takes about 200µV of voltage 
error at DXP-DXN to cause a 1°C measurement 
error. Adding a few thermocouples causes a negligible error.
6) Use wide traces. Narrow traces are more inductive 
and tend to pick up radiated noise. The 10-mil 
widths and spacing recommended in Figure 9 are 
not absolutely necessary, as they offer only a minor 
improvement in leakage and noise over narrow 
traces. Use wider traces when practical.
7) Add a 200Ω resistor in series with VCCfor best 
noise filtering (see the Typical Application Circuit).
8) Copper cannot be used as an EMI shield; only ferrous materials such as steel work well. Placing a 
copper ground plane between the DXP-DXN traces 
and traces carrying high-frequency noise signals 
does not help reduce EMI.