Rainbow Electronics MAX5961 User Manual

General Description
The MAX5961 0 to 16V, quad, hot-swap controller pro­vides complete protection for systems with up to four distinct supply voltages. The device allows the safe insertion and removal of circuit cards into live back­planes. The MAX5961 is an advanced hot-swap con­troller that monitors voltage and current with an internal 10-bit ADC. The device provides two levels of overcur­rent circuit-breaker protection; a fast-trip threshold for a fast turn-off, and a lower slow-trip threshold for a delayed turn-off. The maximum overcurrent circuit­breaker threshold range is set independently for each channel with a trilevel input (ILIM_) or by programming though an I2C interface.
The internal 10-bit ADC is multiplexed to monitor the output voltage and current of each hot-swap channel. The total time to cycle through all the eight measure­ments is 100µs (typ). Each 10-bit value is stored in an internal circular buffer so that 50 past samples of each signal can be read back through the I2C interface at any time or after a fault condition.
The MAX5961 can be configured as four independent hot-swap controllers, hot-swap controllers operating in pairs, or as a group of four hot-swap controllers.
The device also includes five digital comparators per hot-swap channel to implement overcurrent warning, two levels of overvoltage detection, and two levels of undervoltage detection. The limits for overcurrent, over­voltage, and undervoltage are user-programmable. When any of the measured values violates the program­mable limits, an external ALERT signal is asserted. In addition to the ALERT signal, depending on the select­ed operating mode, the MAX5961 can deassert a power-good signal and/or turn-off the external MOSFET.
The MAX5961 is available in a 48-pin thin QFN pack­age and operates over the -40°C to +85°C extended temperature range.
Applications
PCI Express®Hot Plug
Servers
Disk Drives
Storage Systems
ASICs
Features
o Four Independent Hot-Swap Controllers Protect
from 0 to 16V (Provided IN 2.7V)
o 10-Bit ADC Monitors Voltage and Current of Each
Channel
o Circular Buffer Stores 5ms of Current and Voltage
Measurements
o Four Independent Internal Charge Pumps
Generate n-Channel MOSFET Gate Drives
o Internal 500mA Gate Pulldown Current for Fast
Shutdown
o VariableSpeed/BiLevel™ Circuit-Breaker Protection o Alert Output Indicates Undervoltage Warning,
Undervoltage Critical, Overvoltage Warning, Overvoltage Critical, and Overcurrent Warning for Each Channel
o Independent Power-Good Outputs o Autoretry or Latched Fault Management o 400kHz I
2
C Interface
o 7mm x 7mm 48-Pin TQFN Package
MAX5961
0 to 16V, Quad, Hot-Swap Controller
with 10-Bit Current and Voltage Monitor
________________________________________________________________
Maxim Integrated Products
1
Pin Configuration
Ordering Information
19-4167; Rev 0; 6/08
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
PART
PIN-PACKAGE
MAX5961ETM+
48 Thi n QFN–E P *
PCI Express is a registered trademark of PCI-SIG Corp. VariableSpeed/BiLevel is a trademark of Maxim Integrated
Products, Inc.
+Denotes a lead-free/RoHS-compliant package. *EP = Exposed pad.
TEMP RANGE
-40°C to +85°C
TOP VIEW
ILIM4
ILIM3
ILIM2
ILIM1
IN
AGND
REG
A1
A0
PROT
MODE
HWEN
MON2
GATE2
SENSE2
35
34 33 32 31 30 29 28 27
36
37
38
39
40
41
42
43
44
45
46
+
47
48
2
345678910
1
MON1
GATE1
SENSE1
GATE4
GND4
GND2
MAX5961
GND3
GND1
GATE3
THIN QFN
7mm x 7mm
MON4
MON3
SENSE4
SENSE3
I.C.
POL
RETRY
26
11
DREG
ON2
ON1
ON4
25
DGND
24
PG4
23
22
PG3
21
PG2
PG1
20
ALERT
19
18
SCL
17
SDA
16
FAULT4
FAULT3
15
FAULT2
14
13
FAULT1
12
ON3
MAX5961
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN= 2.7V to 16V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VIN= 3.3V and TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
IN, SENSE_, MON_, GATE_ to AGND ....................-0.3V to +30V
PG_, ON_, FAULT_, SDA, SCL, ALERT,
REG, DREG, POL, RETRY, HWEN .........................-0.3V to +6V
DREG to REG ........................................................-0.3V to +0.3V
ILIM_, MODE, PROT, A0, A1 ....................-0.3V to (V
REG
+ 0.3V)
GATE_ to MON_ (same channel) .............................-0.3V to +6V
SENSE_ to MON_ (same channel) ...........................-0.3V to +6V
GND1, GND2, GND3, GND4, DGND to AGND.....-0.3V to +0.3V
SDA, ALERT Current ...........................................-20mA to 50mA
GATE_, MON_, GND_ Current ..........................................500mA
Input/Output Current (all other pins) ...................................20mA
Continuous Power Dissipation (T
A
= +70°C)
For Single-Layer Board
48-Pin Thin QFN (derate 27.8mW/°C above +70°C)...2222.2mW
For Multilayer Board
48-Pin Thin QFN (derate 40mW/°C above +70°C) ......3200mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range V
Hot-Swap Voltage Range V
Undervoltage Lockout V
Undervoltage Lockout Hysteresis V
Supply Current I
Internal LDO Output Voltage V
ADC PERFORMANCE
Resolution 10 Bits
Maximum Differential Nonlinearity DNL 1 LSB
Maximum Integral Nonlinearity INL 1 LSB
ADC Total Monitoring Cycle Time
MON_ LSB Voltage
MON_ Code 000H to 001H Transition Voltage
CURRENT MONITORING FUNCTION
MON_, SENSE_ Input Range 0 16 V
SENSE_ Input Current V
MON_ Input Current V
Current Measurement Offset LSB Voltage
IN
S
UVLO
UVLO,HYSTVIN
CC
REG
VIN rising 2.7 V
f
SCL
2.7V < VIN < 16V 2.49 2.9 V
Four voltage and four current–sense conversions
16V range 15.25 15.43 15.60
8V range 7.655 7.735 7.805
4V range 3.835 3.870 3.905
2V range 1.915 1.935 1.955
16V range 13 28 41
8V range 7 16 22
4V range 5 9 13
2V range 2 5 9
25mV range
50mV range 48.39
100mV range 96.77
falling 100 mV
= 400kHz, all 4 channels enabled 4 8 mA
, V
SENSE_
, V
SENSE_
= 16V 32 75 µA
MON_
= 16V 180 280 µA
MON_
2.7 16 V
016V
95 100 112 µs
24.34
mV
mV
mV
MAX5961
0 to 16V, Quad, Hot-Swap Controller
with 10-Bit Current and Voltage Monitor
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VIN= 2.7V to 16V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VIN= 3.3V and TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Current Measurement Error, 25mV Range
Current Measurement Error, 50mV Range (Note 2)
Current Measurement Error, 100mV Range (Note 2)
Fast Current-Limit Threshold Error, 25mV Range
Fast Current-Limit Threshold Error, 50mV Range
Fast Current-Limit Threshold Error, 100mV Range
Slow Current-Limit Threshold Error, 25mV Range
Slow Current-Limit Threshold Error, 50mV Range
Slow Current-Limit Threshold Error, 100mV Range
Fast Circuit-Breaker Response Time
t
FCD
V
= 0mV
MON_
V
= 2.5V to
MON_
16V
V
= 0mV
MON_
= 2.5V to
V
MON_
16V
V
= 0mV
MON_
V
= 2.5V to
MON_
16V
V
= 0mV
MON_
V
= 2.5V to
MON_
16V
V
= 0mV
MON_
V
= 2.5V to
MON_
16V
V
= 0mV
MON_
V
= 2.5V to
MON_
16V
V
= 0mV,
MON_
fast/slow 200%
= 2.5V to 16V ,
V
M ON_
fast/slow 200%
V
= 0mV,
MON_
fast/slow 200%
= 2.5V to
V
MON_
16V, fast/slow 200%
V
= 0mV,
MON_
fast/slow 200%
V
= 2.5V to
MON_
16V, fast/slow 200%
V
V
V
V
V
V
V
V
V
V
V
V
Circuit-breaker DAC = 102 -2.3 +1.6
Circuit-breaker DAC = 255 -3 +1.9
Circuit-breaker DAC = 102 -2.5 +1.6
Circuit-breaker DAC = 255 -3 +1.8
Circuit-breaker DAC = 102 -3.4 +2
Circuit-breaker DAC = 255 -5.3 +2.6
Circuit-breaker DAC = 102 -3.2 +1.5
Circuit-breaker DAC = 255 -4.5 +1.6
Circuit-breaker DAC = 102 -6.3 +2.7
Circuit-breaker DAC = 255 -10.7 +4.7
Circuit-breaker DAC = 102 -4.9 +1.6
Circuit-breaker DAC = 255 -7.9 +1.5
Circuit-breaker DAC = 102 -1.2 +2.3
Circuit-breaker DAC = 255 -1.2 +2.7
Circuit-breaker DAC = 102 -1.4 +2.4
Circuit-breaker DAC = 255 -1.2 +2.9
Circuit-breaker DAC = 102 -1.2 +3
Circuit-breaker DAC = 255 -1.4 +3.9
Circuit-breaker DAC = 102 -1.2 +3.1
Circuit-breaker DAC = 255 -1.1 +3.8
Circuit-breaker DAC = 102 -1.5 +4.6
Circuit-breaker DAC = 255 -2.1 +6.6
Circuit-breaker DAC = 102 -0.7 +4.5
Circuit-breaker DAC = 255 -0.9 +6
Overdrive = 10% of current-sense range 2 µs
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
SENSE_
- V
- V
- V
- V
- V
- V
- V
- V
- V
- V
- V
- V
= 5mV -6.8 +6.8
MON_
= 20mV -7.6 +8
MON_
= 5mV -8 +7.2
MON_
= 20mV -7.6 +7.6
MON
= 10mV -3.8 +4
MON_
= 40mV -5.5 +5.4
MON_
= 10mV -4.2 +3.9
MON_
= 40mV -4 +4.3
MON_
= 20mV -2.9 +2.6
MON_
= 80mV -5.1 +4.7
MON_
= 20mV -2.3 +2
MON_
= 80mV -2.7 +2.4
MON_
% Full
Scale
% Full
Scale
% Full
Scale
mV
mV
mV
mV
mV
mV
MAX5961
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VIN= 2.7V to 16V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VIN= 3.3V and TA= +25°C.) (Note 1)
Slow Current-Limit Response Time
THREE-STATE INPUTS
A0, A1, ILIM_, MODE, PROT Low Current
A0, A1, ILIM_, MODE, PROT High Current
A0, A1, ILIM_, MODE, PROT Unconnected Current
A0, A1, ILIM_, MODE, PROT Low Voltage
A0, A1, ILIM_, MODE, PROT High Voltage
TWO-STATE INPUTS
RETRY, HWEN, POL Input Logic Low Voltage
RETRY, HWEN, POL Input Logic High Voltage
RETRY, HWEN, POL Input Current
ON_ Input Threshold Rising 0.586 0.596 0.606 V
ON_ Input Hysteresis Falling 4 %
ON_ Input Current -100 +100 nA
TIMING
MON_ to PG_ Delay
CHARGE PUMPS (GATE_)
Charge-Pump Output Voltage Relative to V
Charge-Pump Output Source Current
GATE_ Discharge Current I
OUTPUTS (FAULT_, PG_, ALERT)
Output Voltage Low I
Output Leakage (Open-Drain) A
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Overdrive = 4% of current-sense range 2.4
t
SCD
I
IN,LOW
I
IN,HIGH
I
FLOAT
I
G(UP)
G(DN)VGATE_
Overdrive = 8% of current-sense range 1.2
Overdrive = 16% of current-sense range 0.6
Input voltage = 0.4V -40 µA
Input voltage = V
Maximum source/sink current for unconnected state
Relative to GND_ 0.4 V
Relative to V
Register configurable (see Tables 31a and 31b)
SINK
REG
MON_
- V
MON_
= 3.2mA 0.2 V
- 0.2V 40 µA
REG
-4 +4 µA
-0.24 V
0.4 V
V
-
REG
0.4
-1 +1 µA
50
100
200
400
4.5 5.3 5.5 V
456µA
= 2V 500 mA
ms
V
ms
MAX5961
0 to 16V, Quad, Hot-Swap Controller
with 10-Bit Current and Voltage Monitor
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(VIN= 2.7V to 16V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VIN= 3.3V and TA= +25°C.) (Note 1)
Note 1: All devices 100% production tested at TA= +25°C and TA= +85°C. Limits over the temperature range are guaranteed by
design.
Note 2: Guaranteed by design characterization, not production tested.
SUPPLY CURRENT
vs. IN VOLTAGE
MAX5961 toc01
VIN (V)
I
IN
(mA)
14128 1064
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
4.0 216
I
IN
(NORMAL OPERATION)
I
IN
(STANDBY)
STANDBY OPERATION ALL CHANNELS OFF
SUPPLY CURRENT
vs. TEMPERATURE
MAX5961 toc02
TEMPERATURE (°C)
I
IN
(mA)
603510-15
2.4
2.8
3.2
3.6
4.0
4.4
4.8
5.2
5.6
6.0
2.0
-40 85
STANDBY OPERATION ALL CHANNELS OFF
I
IN
(NORMAL OPERATION)
I
IN
(STANDBY)
GATE_ DRIVE VOLTAGE
vs. MON_ VOLTAGE
MAX5961 toc03
V
MON_
(V)
(V
GATE_
- V
MON_
) (V)
14128 104 62
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
4.0 016
GATE_ DRIVE VOLTAGE REFERRED TO MON_ INPUT VOLTAGE
Typical Operating Characteristics
(VS_= 12V, VIN= 3.3V, TA= +25°C, unless otherwise noted. See the
Typical Application Circuit
.)
I2C INTERFACE
Serial-Clock Frequency f
Bus Free Time Between STOP and START Condition
START Condition Setup Time t
START Condition Hold Time t
STOP Condition Setup Time t
Clock Low Period t
Clock High Period t
Data Setup Time t
Data Hold Time t
Receive SCL/SDA Rise Time t
Receive SCL/SDA Fall Time t
Pulse Width of Spike Suppressed t
SDA, SCL Input High Voltage V
SDA, SCL Input Low Voltage V
SDA, SCL Input Hysteresis V
SDA, SCL Input Current ±1 µA
SDA, SCL Input Capacitance 15 pF
SDA Output Low Voltage V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SCL
t
BUF
SU:STA
HD:STA
SU:STO
LOW
HIGH
SU:DAT
HD:DAT
R
FP
SP
IH
IL
HYST
OL
1.3 µs
0.6 µs
0.6 µs
0.6 µs
1.3 µs
0.6 µs
100 ns
0.3 0.9 ns
50 ns
1.6 V
0.22 V
0.4 V
400 kHz
s
300 ns
0.8 V
MAX5961
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(VS_= 12V, VIN= 3.3V, TA= +25°C, unless otherwise noted. See the
Typical Application Circuit
.)
START OF WAVEFORM
MAX5961 toc10
10ms/div
V
ON_
V
GATE_
,
V
MON_
V
PG_
I
LOAD_
V
GATE_
V
MON_
TURN-OFF WAVEFORM
(SLOW-COMPARATOR FAULT)
MAX5961 toc11
200μs/div
I
LOAD_
V
GATE_
,
V
MON_
V
FAULT_
DEFAULT RESISTOR SETTINGS 25mV SENSE RANGE
GATE_ DRIVE VOLTAGE
vs. IN VOLTAGE
6.0
5.8
5.6
) (V)
MON_
- V
GATE_
(V
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
V
V
MON_
SLOW-COMPARATOR TURN-OFF TIME
vs. SENSE VOLTAGE OVERDRIVE
2.0
1.8
1.6
1.4
1.2
1.0
0.8
TURN-OFF TIME (ms)
0.6
0.4
0.2
0
0
[(V
SENSE_
= 3.3V
MON_
= 12V
GATE_ DRIVE VOLTAGE REFERRED TO MON_ INPUT VOLTAGE
VIN (V)
25mV SENSE RANGE;
DAC = 191, V
- V
) - V
MON_
TH,ST
GATE_ DRIVE CURRENT
10
9
MAX5961 toc04
14128 1064216
8
7
6
(μA)
5
GATE_
I
4
3
2
1
0
05.0
SLOW-COMPARATOR THRESHOLD
VOLTAGE ERROR vs. TEMPERATURE
14
TH,ST
= 9.36mV
986 72 3 4 51
] (V)
12 10
MAX5961 toc07
8 6 4 2 0
-2
-4
-6
-8
-10
-12
SLOW-COMPARATOR THRESHOLD VOLTAGE ERROR (%)
50mV SENSE RANGE
-40 85
vs. (V
25mV SENSE RANGE
- V
GATE_
(V
- V
GATE_
MON_
100mV SENSE RANGE
TEMPERATURE (°C)
MON_
) (V)
GATE_ DISCHARGE CURRENT
- V
MON_
MON_
) (V)
)
MAX5961 toc06
4.54.03.0 3.51.0 1.5 2.0 2.50.5
)
650 600 550
MAX5961 toc05
500 450 400
(mA)
350 300
GATE_
I
250 200 150 100
50
0
4.54.03.0 3.51.0 1.5 2.0 2.50.5
0 5.0
vs. (V
(V
GATE_
GATE_
- V
ON_ INPUT THRESHOLD VOLTAGE
vs. TEMPERATURE
0.615
0.610
MAX5961 toc08
0.605
0.600
0.595
0.590
0.585
ON_ INPUT THRESHOLD VOLTAGE (V)
0.580
0.575
603510-15
-40 85 TEMPERATURE (°C)
6035-15 10
MAX5961 toc09
MAX5961
0 to 16V, Quad, Hot-Swap Controller
with 10-Bit Current and Voltage Monitor
_______________________________________________________________________________________
7
Typical Operating Characteristics (continued)
(VS_= 12V, VIN= 3.3V, TA= +25°C, unless otherwise noted. See the
Typical Application Circuit
.)
TURN-OFF WAVEFORM (FAST COMPARATOR
FAULT/SHORT-CIRCUIT RESPONSE)
DEFAULT RESISTOR SETTINGS 25mV SENSE RANGE
100μs/div
VOLTAGE BUFFER vs. TIME
16
CIRCULAR BUFFER CONTENT AT SLOW-TRIP FAULT
12
8
VOLTAGE BUFFER (V)
4
MAX5961 toc12
I
LOAD_
V
GATE_
V
MON_
V
FAULT_
MAX5961 toc13b
4.0
CURRENT BUFFER vs. TIME
CIRCULAR BUFFER CONTENT AT SLOW-TRIP FAULT
3.5
3.0
2.5
,
2.0
1.5
CURRENT BUFFER (A)
1.0
0.5
0
-2.5 2.5 TIME (ms)
SLOW-COMPARATOR FAULT EVENT
2.01.5-2.0 -1.5 -1.0 0 0.5-0.5 1.0
MAX5961 toc14
MAX5961 toc13a
I
LOAD_
V
GATE_
V
MON_
V
FAULT_
,
0
-2.5 2.5 TIME (ms)
2.01.51.00.50-0.5-1.0-1.5-2.0
VOLTAGE ADC ACCURACY
vs. MON_ VOLTAGE
1.0
4V MON_ RANGE
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
VOLTAGE ADC ACCURACY (% FS)
-0.8
-1.0
04.0 V
(V)
MON_
MAX5961 toc15
3.53.02.0 2.51.0 1.50.5
200μs/div
CURRENT ADC ACCURACY
- V
vs. (V
(V
SENSE_
SENSE_
- V
MON_
5
4
3
2
1
0
-1
-2
-3
CURRENT ADC ACCURACY (% FS)
-4
-5 025
MON_
) (mV)
)
MAX5961 toc16
2015105
MAX5961
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
8 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(VS_= 12V, VIN= 3.3V, TA= +25°C, unless otherwise noted. See the
Typical Application Circuit
.)
CURRENT BUFFER vs. TIME
MAX5961 toc17a
TIME (ms)
CURRENT BUFFER (A)
2.01.51.00.50-0.5-1.0-1.5-2.0
-2
-1
0
1
2
3
4
-3
-2.5 2.5
CURRENT DATA AT SHORT CIRCUIT ON POWER-UP
VOLTAGE BUFFER vs. TIME
MAX5961 toc17b
TIME (ms)
VOLTAGE BUFFER (V)
2.01.50.5 1.0-1.5 -1.0 -0.5 0-2.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
-2.5 2.5
VOLTAGE DATA AT SHORT CIRCUIT ON POWER-UP
STARTUP INTO SHORT LOAD
MAX5961 toc18
4ms/div
V
ON_
V
GATE_
,
V
MON_
V
FAULT_
I
LOAD_
INPUT LEAKAGE CURRENT
vs. MON_ VOLTAGE
MAX5961 toc19
V
MON_
(V)
INPUT LEAKAGE CURRENT (μA)
1412108642
50
100
150
200
250
0
016
I
MON_
I
SEN
MAX5961
0 to 16V, Quad, Hot-Swap Controller
with 10-Bit Current and Voltage Monitor
_______________________________________________________________________________________ 9
Pin Description
PIN NAME FUNCTION
1 SENSE1
2 MON1 Channel 1 Voltage Monitoring Input
3 GATE1 Channel 1 Gate-Drive Output. Connect to gate of an external n-channel MOSFET.
4 GND1
5 GND3
6 GATE3 Channel 3 Gate-Drive Output. Connect to the gate of an external n-channel MOSFET.
7 MON3 Channel 3 Voltage Monitoring Input
8 SENSE3
9 POL
10 DREG
11 ON1 Channel 1 Precision Turn-On Input
12 ON3 Channel 3 Precision Turn-On Input
13 FAULT1
14 FAULT2
15 FAULT3
16 FAULT4
17 SDA I2C Serial-Data Input/Output
18 SCL I2C Serial-Clock Input 19 ALERT Open-Drain Alert Output. ALERT goes low during a fault to notify the system of an impending failure.
20 PG1 Channel 1 Open-Drain Power-Good Output
21 PG2 Channel 2 Open-Drain Power-Good Output
22 PG3 Channel 3 Open-Drain Power-Good Output
23 PG4 Channel 4 Open-Drain Power-Good Output
24 DGND Digital Ground. Connect all GND_ and DGND to AGND externally using a star connection.
25 ON4 Channel 4 Precision Turn-On Input
26 ON2 Channel 2 Precision Turn-On Input
27 RETRY
28 I.C. Internally Connected. Connect to AGND only.
Channel 1 Current-Sense Input. Connect SENSE1 to the source of an external MOSFET and to one end of R
Channel 1 Gate Discharge Current Ground Return. Connect all GND_ and DGND to AGND externally using a star connection.
Channel 3 Gate Discharge Current Ground Return. Connect all GND_ and DGND to AGND externally using a star connection.
Channel 3 Current-Sense Input. Connect SENSE3 to the source of an external MOSFET and to one end of R
Polarity Select Input. Connect to DREG for active-high power-good outputs (PG_). Connect to GND_ for active-low power-good outputs.
Logic Power-Supply Input. Connect to REG externally through a 10Ω resistor and to DGND with a 1µF ceramic capacitor.
Channel 1 Active-Low Open-Drain Fault Output. FAULT1 goes low if an overcurrent shutdown occurs on channel 1.
Channel 2 Active-Low Open-Drain Fault Output. FAULT2 goes low if an overcurrent shutdown occurs on channel 2.
Channel 3 Active-Low Open-Drain Fault Output. FAULT3 goes low if an overcurrent shutdown occurs on channel 3.
Channel 4 Active-Low Open-Drain Fault Output. FAULT4 goes low if an overcurrent shutdown occurs on channel 4.
Autoretry Fault Management Input. Connect to DREG to enable autoretry operation. Connect to DGND to enable latched-off operation.
(see the Typical Application Circuit).
SENSE1
(see the Typical Application Circuit).
SENSE3
MAX5961
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
10 ______________________________________________________________________________________
Pin Description (continued)
PIN NAME FUNCTION
29 SENSE4
30 MON4 Channel 4 Voltage Monitoring Input
31 GATE4 Channel 4 Gate-Drive Output. Connect to gate of an external n-channel MOSFET.
32 GND4
33 GND2
34 GATE2 Channel 2 Gate-Drive Output. Connect to gate of an external n-channel MOSFET.
35 MON2 Channel 2 Voltage Monitoring Input
36 SENSE2
37 ILIM4
38 ILIM3
39 ILIM2
40 ILIM1
41 IN Power-Supply Input. Connect to a voltage from 2.7V to 16V. Bypass to AGND with a 1µF capacitor.
42 AGND Analog Ground. Connect all GND_ and DGND to AGND externally using a star connection.
43 REG
44 A1 Three-State I2C Address Input 1
45 A0 Three-State I2C Address Input 0
46 PROT
47 MODE
48 HWEN
EP Exposed Pad. EP is internally grounded. Connect externally to AGND.
Channel 4 Current-Sense Input. Connect SENSE4 to the source of an external MOSFET and to one end of R
Channel 4 Gate Discharge Current Ground Return. Connect all GND_ and DGND to AGND externally using a star connection.
Channel 2 Gate Discharge Current Ground Return. Connect all GND_ and DGND to AGND externally using a star connection.
Channel 2 Current-Sense Input. Connect SENSE2 to the source of an external MOSFET and to one end of R
Channel 4 Three-State Current-Sense Range Selection Input. Set the circuit-breaker threshold range by connecting to DGND, DREG, or leave unconnected (see Table 7b).
Channel 3 Three-State Current-Sense Range Selection Input. Set the circuit-breaker threshold range by connecting to DGND, DREG, or leave unconnected (see Table 7b).
Channel 2 Three-State Current-Sense Range Selection Input. Set the circuit-breaker threshold range by connecting to DGND, DREG, or leave unconnected (see Table 7b).
Channel 1 Three-State Current-Sense Range Selection Input. Set the circuit-breaker threshold range by connecting to DGND, DREG, or leave unconnected (see Table 7b).
Internal Regulator Output. Bypass to ground with a 1µF capacitor. Connect only to DREG and logic-input pullup resistors. Do not use to power external circuitry.
Protection Behavior Input. Three-state input sets one of three different response options for undervoltage and overvoltage events (see Table 29).
Hot-Swap Three-State Mode Select Input. Connect MODE to DGND, DREG, or leave it unconnected to operate the hot-swap channels independently, in pairs, or as a group of four, respectively (see Table 2).
Hardware Enable Input. Connect to DREG or DGND. State is read upon power-up as V UVLO threshold and sets Chx_EN2 bits with this value. After UVLO, this input becomes inactive until power is cycled.
(see the Typical Application Circuit).
SENSE4
(see the Typical Application Circuit).
SENSE2
crosses the
IN
MAX5961
Functional Diagram
0 to 16V, Quad, Hot-Swap Controller
with 10-Bit Current and Voltage Monitor
______________________________________________________________________________________ 11
SENSE_
MON_
GATE_
ILIM_
REG
DREG
MAX5961
FROM
CONFIGURATION
REGISTERS
RATIO
CIRCUIT­BREAKER
DAC
4
4
500mA
4
4
IN
CHARGE
PUMP
UVLO
LDO
VOLTAGE SCALER AND
MULTIPLEXER
REF/BIAS
SLOW
FAST
10-BIT ADC
DEVICE
CONTROL
LOGIC
REGISTER
BANK
I2C
CIRCULAR
BUFFER
4
FAULT_
4
PG_
4
ON_
HWEN
RETRY
MODE POL PROT
ALERT
SDA
SCL
A0
A1
AGND DGND GND1, GND2, GND3, GND4
MAX5961
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
12 ______________________________________________________________________________________
Typical Operating Circuit
V
VS3*
VS1*
2.7V to 16V
DD
V
DD
I/O
INT
μC
V
DD
I/O
SDA
SCL
44
SCL
SDA
PG_
ALERT
ON2
ON1
ID
SETTING
IN
A0
A1
FAULT_
VS2*
VS4*
TO LOAD
R
SENSE3
TO LOAD
R
SENSE1
ON4
**
R
SENSE2
TO LOAD
**
GATE1
SENSE1
MON1
ON3
GATE2
SENSE2
MON2
MAX5961
**
**
GATE3
SENSE3
MON3
GND1
GND3
ILIM1
ILIM2
ILIM3
ILIM4
REG
1μF
DREG
1μF
DGND
AGND
HWEN
MODE
POL
CONFIGURATION
SETTING
PROT
RETRY
GATE4
SENSE4
MON4
GND2
GND4
R
SENSE4
TO LOAD
*HOT-SWAPPABLE SUPPLY RANGE, VS_ = 0 TO 16V. **OPTIONAL COMPONENTS.
MAX5961
0 to 16V, Quad, Hot-Swap Controller
with 10-Bit Current and Voltage Monitor
______________________________________________________________________________________ 13
Typical Application Circuit
VS3*
R
SENSE1
5MΩ
VS1*
1μF
1kΩ
4700pF
2.7V TO 16V
SETTING
IN
ON1
GATE1
SENSE1
MON1
V
DD
V
DD
100kΩ
100kΩ
ID
A0
100kΩ
A1
MAX5961
I/O
INT
4
ALERT
FAULT_
μC
I/O
4
PG_
SDA
SDA
SCL
SCL
3.9kΩ
3.9kΩ
V
DD
ON2
GATE2
SENSE2
MON2
1kΩ
4700pF
VS2* VS4*
R
SENSE2
5MΩ
TO LOAD
1kΩ
4700pF
R
SENSE3
5MΩ
TO LOAD
*HOT-SWAPPABLE SUPPLY RANGE, VS_ = 0 TO 16V
ON3
GATE3
SENSE3
MON3 GND1 GND3
ILIM1
ILIM2
ILIM3
1μF
ILIM4
REG
10Ω
DREG
1μF
AGND
DGND
CONFIGURATION
HWEN
SETTING
POL
MODE
ON4
GATE4
SENSE4
MON4
GND2 GND4
PROT
RETRY
1kΩ
4700pF
TO LOAD
TO LOAD
R
SENSE4
5MΩ
Loading...
+ 29 hidden pages