General Description
The MAX5550 dual, 10-bit, digital-to-analog converter
(DAC) features high-output-current capability. The
MAX5550 sources up to 30mA per DAC, making it ideal
for PIN diode biasing applications. Outputs can also be
paralleled for high-current applications (up to 60mA
typ). Operating from a single +2.7V to +5.25V supply,
the MAX5550 typically consumes 1.5mA per DAC in
normal operation and less than 1µA (max) in shutdown
mode. The MAX5550 also features low output leakage
current in shutdown mode (±1µA max) that is essential
to ensure that the external PIN diodes are off.
Additional features include an integrated +1.25V
bandgap reference, and a control amplifier to ensure
high accuracy and low-noise performance. A separate
reference input (REFIN) allows for the use of an external
reference source, such as the MAX6126, for improved
gain accuracy. A pin-selectable I
2
C*-/SPI™-compatible
serial interface provides optimum flexibility for the
MAX5550. The maximum programmable output current
value is set using software and an adjustment resistor.
The MAX5550 is available in a (3mm x 3mm) 16-pin thin
QFN package, and is specified over the extended
(-40°C to +85°C) temperature range.
Applications
PIN Diode Biasing
RF Attenuator Control
VCO Tuning
Features
♦ Pin-Selectable I2C- or SPI-Compatible Interface
♦ Guaranteed Low Output Leakage Current in
Shutdown (±1µA max)
♦ Guaranteed Monotonic over Extended
Temperature Range
♦ Dual Outputs for Balanced Systems
♦ Current Outputs Source Up to 30mA per DAC
♦ Parallelable Outputs for 60mA Applications
♦ Output Stable with RF Filters
♦ Internal or External Reference Capability
♦ Digital Output (DOUT) Available for Daisy
Chaining in SPI Mode
♦ +2.7V to +5.25V Single-Supply Operation
♦ 16-Pin (3mm x 3mm) Thin QFN Package
♦ Programmable Output Current Range Set by
Software and Adjustment Resistor
MAX5550
Dual, 10-Bit, Programmable, 30mA
High-Output-Current DAC
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-3871; Rev 0; 10/05
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
*Purchase of I2C components from Maxim Integrated Products,
Inc., or one of its sublicensed Associated Companies, conveys
a license under the Philips I
2
C Patent Rights to use these com-
ponents in an I
2
C system, provided that the system conforms
to the I
2
C Standard Specification as defined by Philips.
SPI is a trademark of Motorola, Inc.
+1.25V
REF
REFIN
BUFFER
10-BIT CURRENT-STEERING
DAC A
P
OUTA
V
DD
FSADJA
V
DD
OUTB
FSADJB
GND
DOUT/A1
CS/A0
DIN/SDASCLK/SCL
SPI/I2C
16-BIT INPUT REGISTER
DAC REGISTER A
DAC REGISTER B
10-BIT CURRENT-STEERING
DAC B
MAX5550
P
Functional Diagram
Pin Configuration appears at end of data sheet.
PART
MAX5550ETE
TEMP
RANGE
-40°C to
+85°C
PINPACKAGE
16 Thin QFN T1633F-3 ACZ
PKG
CODE
MARK
TOP
MAX5550
Dual, 10-Bit, Programmable, 30mA
High-Output-Current DAC
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDDto GND .............................................................-0.3V to +6V
OUTA, OUTB to GND.................................-0.3V to (V
DD
+ 0.3V)
REFIN, CS/AO, DOUT/AI, SPI/I2C, FSADJA,
FSADJB to GND ......................................-0.3V to (V
DD
+ 0.3V)
SCLK/SCL, DIN/SDA ................................................-0.3V to +6V
Continuous Power Dissipation (T
A
= +85°C)
16-Pin Thin QFN (derate 17.5mW/°C above +70°C) ..1398.6mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
ELECTRICAL CHARACTERISTICS
(VDD= +2.7V to +5.25V, GND = 0, V
REFIN
= +1.25V, internal reference, R
FSADJ_
= 20kΩ; compliance voltage = (VDD- 0.6V),
V
SCLK/SCL
= 0, TA= -40°C to +85°C, unless otherwise noted. Typical values are at VDD= +3.0V and TA= +25°C.) (Note 1)
STATIC PERFORMANCE—ANALOG SECTION
Resolution 10 Bits
Integral Nonlinearity INL I
Differential Nonlinearity DNL Guaranteed monotonic ±1 LSB
Offset I
Zero-Scale Error I
Full-Scale Error
REFERENCE
Internal Reference Range 1.21 1.25 1.29 V
Internal Reference Tempco 30 ppm/°C
External Reference Range 0.5 1.5 V
External Reference Input Current 108 225 µA
DAC OUTPUTS
Full-Scale Current (Note 3) 1 30 mA
Output Current Leakage in
Shutdown
Output Capacitance 10 pF
Current Source Dropout Voltage
(V
Output Impedance at Full-Scale
Current
Capacitive Load to Ground C
Series Inductive Load L
Maximum FSADJ_ Capacitive
Load
DYNAMIC PERFORMANCE
Settling Time t
Digital Feedthrough 2 nVs
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
- V
OUT
_)
DD
_ = 1mA to 30mA (Note 2) ±2 LSB
OUT
OS
_ = 1mA to 30mA, code = 0x000 1 µA
OUT
I
_ = 1mA to 30mA, code = 0x3FF,
OUT
includes offset
I
_ = 30mA 1
OUT
I
_ = 20mA
OUT
LOAD
LOAD
C
FSADJ_
C
S
LOAD
= 24pF, L
-50 -16 LSB
-16 LSB
±1 µA
TA = +25°C 0.55
= -40°C to +85°C 0.6
T
A
100 kΩ
10 nF
100 nH
75 pF
= 27nH (Note 4) 30 µs
LOAD
V
MAX5550
Dual, 10-Bit, Programmable, 30mA
High-Output-Current DAC
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +2.7V to +5.25V, GND = 0, V
REFIN
= +1.25V, internal reference, R
FSADJ_
= 20kΩ; compliance voltage = (VDD- 0.6V),
V
SCLK/SCL
= 0, TA= -40°C to +85°C, unless otherwise noted. Typical values are at VDD= +3.0V and TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Digital-to-Analog Glitch Impulse 40 nVs
DAC-to-DAC Current Matching 2%
Wake-Up Time
VDD = +3V 400
= +5V 10
V
DD
µs
POWER SUPPLIES
Supply Voltage V
Supply Current I
DD
DD
VDD = +5.25V, no load 3 6 mA
+2.70 +5.25 V
Shutdown Current 1.2 µA
LOGIC AND CONTROL INPUTS
0.7 x
V
DD
V
Input High Voltage (Note 5) V
+2.7V ≤ V
IH
DD
≤ +3.4V
+3.4V < VDD ≤ +5.25V 2.4
Input Low Voltage V
Input Hysteresis V
Input Capacitance C
Input Leakage Current I
Output Low Voltage V
Output High Voltage V
HYS
IN
OL
OH
(Note 5) 0.8 V
IL
0.1 x
V
DD
IN
I
= 3mA 0.6 V
SINK
V
I
SOURCE
= 2mA
DD
0.5
10 pF
-
V
±1 µA
V
I2C TIMING CHARACTERISTICS (Figure 2)
SCL Clock Frequency f
Setup Time for START Condition t
Hold Time for START Condition t
SCL Pulse-Width Low t
SCL Pulse-Width High t
Data Setup Time t
Data Hold Time t
SCL Rise Time t
SCL Fall Time t
SDA Rise Time t
SDA Fall Time t
SCL
SU:STA
HD:STA
LOW
HIGH
SU:DAT
HD:DAT
RCL
FCL
RDA
FDA
600 ns
600 ns
130 ns
600 ns
100 ns
070ns
20 + 0.1
x C
B
20 + 0.1
x C
B
20 + 0.1
x C
B
20 + 0.1
x C
B
400 kHz
300 ns
300 ns
300 ns
300 ns
MAX5550
Dual, 10-Bit, Programmable, 30mA
High-Output-Current DAC
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +2.7V to +5.25V, GND = 0, V
REFIN
= +1.25V, internal reference, R
FSADJ_
= 20kΩ; compliance voltage = (VDD- 0.6V),
V
SCLK/SCL
= 0, TA= -40°C to +85°C, unless otherwise noted. Typical values are at VDD= +3.0V and TA= +25°C.) (Note 1)
Note 1: 100% production tested at TA= +25°C. Limits over temperature are guaranteed by design.
Note 2: INL linearity is guaranteed from code 60 to code 1024.
Note 3: Connect a resistor from FSADJ_ to GND to adjust the full-scale current. See the Reference Architecture and Operation section.
Note 4: Settling time is measured from (0.25 x full scale) to (0.75 x full scale).
Note 5: The device draws higher supply current when the digital inputs are driven with voltages between (V
DD
- 0.5V) and (GND +
0.5V). See the Supply Current vs. Digital Input Voltage graph in the Typical Operating Characteristics.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Bus Free Time Between a STOP
and START Condition
Setup Time for STOP Condition t
Maximum Capacitive Load for
Each Bus Line
SPI TIMING CHARACTERISTICS (Figure 6)
SCLK Clock Period t
SCLK Pulse-Width High t
SCLK Pulse-Width Low t
CS Fall to SCLK Rise Setup Time t
SCLK Rise to CS Rise Hold Time t
DIN Setup Time t
DIN Hold Time t
SCLK Fall to DOUT Transition t
CS Fall to DOUT Enable t
CS Rise to DOUT Disable t
SCLK Rise to CS Fall Delay t
CS Rise to SCLK Rise Hold Time t
CS Pulse-Width High t
SPI TIMING CHARACTERISTICS FOR DAISY CHAINING (Figure 6)
SCLK Clock Period t
SCLK Pulse-Width High t
SCLK Pulse-Width Low t
CS Fall to SCLK Rise Setup Time t
SCLK Rise to CS Rise Hold Time t
DIN Setup Time t
DIN Hold Time t
SCLK Fall to DOUT Transition t
CS Fall to DOUT Enable t
CS Rise to DOUT Disable t
SCLK Rise to CS Fall Delay t
CS Rise to SCLK Rise Hold Time t
CS Pulse-Width High t
t
BUF
SU:STO
C
B
CP
CH
CL
CSS
CSH
DS
DH
C
DO1
CSE
CSD
CS0
CS1
CSW
CP
CH
CL
CSS
CSH
DS
DH
DO1
CSE
CSD
CS0
CS1
CSW
= 30pF 40 ns
LOAD
C
= 30pF 40 ns
LOAD
= 30pF 40 ns
C
LOAD
C
= 30pF 40 ns
LOAD
C
= 30pF 40 ns
LOAD
= 30pF 40 ns
C
LOAD
1.3 µs
160 ns
400 pF
100 ns
40 ns
40 ns
25 ns
50 ns
40 ns
0ns
50 ns
40 ns
100 ns
200 ns
80 ns
80 ns
25 ns
50 ns
40 ns
0ns
50 ns
40 ns
100 ns
MAX5550
Dual, 10-Bit, Programmable, 30mA
High-Output-Current DAC
_______________________________________________________________________________________ 5
Typical Operating Characteristics
(VDD= +3.0V, GND = 0, V
REFIN
= +1.25V, internal reference, R
FSADJ_
= 20kΩ, TA= +25°C. unless otherwise noted).
INL vs. CODE
2.0
1.5
1.0
0.5
0
INL (LSB)
-0.5
-1.0
-1.5
-2.0
0 128 384 640256 512 768 896 1024
CODE
DNL vs. TEMPERATURE
0.40
0.35
0.30
0.25
0.20
DNL (LSB)
0.15
0.10
0.05
0
-40 -15 10 35 60 85
TEMPERATURE (°C)
1.00
0.75
MAX5550 toc01
0.50
0.25
DNL (LSB)
-0.25
-0.50
-0.75
-1.00
MAX5550 toc04
INL (LSB)
DNL vs. CODE
0
0 128 384 640256 512 768 896 1024
CODE
MAXIMUM INL ERROR vs.
3.0
2.5
2.0
1.5
1.0
0.5
OUTPUT CURRENT RANGES
0
1–2
1.5–3 4.5–9
OUTPUT CURRENT RANGE (mA)
8–162–5
15–30
4.0
3.5
MAX5550 toc02
3.0
2.5
2.0
INL (LSB)
1.5
1.0
0.5
0
-40 -15 10 35 60 85
4.5
4.0
MAX5550 toc05
3.5
3.0
2.5
2.0
1.5
ZERO-SCALE CURRENT (nA)
1.0
0.5
0
-40 10-15 35 60 85
INL vs. TEMPERATURE
MAX5550 toc03
TEMPERATURE (°C)
ZERO-SCALE OUTPUT CURRENT
vs. TEMPERATURE
MAX5550 toc06
VDD = 5V
VDD = 3V
TEMPERATURE (°C)
FULL-SCALE CURRENT vs. TEMPERATURE
29.88
29.86
29.84
29.82
29.80
29.78
29.76
FULL-SCALE CURRENT (mA)
29.74
29.72
-40 -15 10 35 60 85
VDD = 3V
TEMPERATURE (°C)
VDD = 5V
MAX5550 toc07
SETTLING TIME
(FULL-SCALE POSITIVE STEP)
10µs/div
R
C
LOAD
LOAD
MAX5550 toc08
= 65Ω
= 24pF
CS
2V/div
V
OUT_
1V/div
SETTLING TIME
(FULL-SCALE NEGATIVE STEP)
10µs/div
R
C
LOAD
LOAD
MAX5550 toc09
= 65Ω
= 24pF
CS
2V/div
V
OUT_
1V/div