The MAX509/MAX510 are quad, serial-input, 8-bit voltage-output digital-to-analog converters (DACs). They
operate with a single +5V supply or dual ±5V supplies.
Internal, precision buffers swing rail-to-rail. The reference input range includes both supply rails.
The MAX509 has four separate reference inputs, allowing each DAC's full-scale range to be set independently.
20-pin DIP, SSOP, and SO packages are available. The
MAX510 is identical to the MAX509 except it has two reference inputs, each shared by two DACs. The MAX510
is housed in space-saving 16-pin DIP and SO packages.
The serial interface is double-buffered: A 12-bit input
shift register is followed by four 8-bit buffer registers and
four 8-bit DAC registers. A 12-bit serial word is used to
____________________________Features
♦ Single +5V or Dual ±5V Supply Operation
♦ Output Buffer Amplifiers Swing Rail-to-Rail
♦ Reference Input Range Includes Both Supply Rails
♦ Calibrated Offset, Gain, and Linearity (1LSB TUE)
♦ 10MHz Serial Interface, Compatible with SPI, QSPI
(CPOL = CPHA = 0) and Microwire
♦ Double-Buffered Registers for Synchronous
Updating
♦ Serial Data Output for Daisy-Chaining
♦ Power-On Reset Clears Serial Interface and Sets
All Registers to Zero
______________Ordering Information
load data into each register. Both input and DAC registers can be updated independently or simultaneously
with single software commands. Two additional asynchronous control pins provide simultaneous updating
(LDAC) or clearing (CLR) of input and DAC registers.
The interface is compatible with MicrowireTMand SPI/
QSPITM. All digital inputs and outputs are TTL/CMOS
compatible. A buffered data output provides for readback or daisy-chaining of serial devices.
_______________Functional Diagrams
CLR
DOUT
LDAC
12-BIT
SHIFT
REGISTER
SR
CONTROL
CS DIN
Functional Diagrams continued at end of data sheet.
Microwire is a trademark of National Semiconductor. SPI and QSPI are trademarks of Motorola.
DGND
INPUT
REG A
INPUT
REG B
INPUT
REG C
INPUT
REG D
V
SS
MAX509
V
DD
DAC
REG A
DAC
REG B
DAC
REG C
DAC
REG D
AGND
DECODE
CONTROL
SCLKREFC
REFAREFB
OUTA
DAC A
OUTB
DAC B
OUTC
DAC C
OUTD
DAC D
REFD
PARTTEMP. RANGE PIN-PACKAGE
MAX509ACPP
0°C to +70°C20 Plastic DIP
MAX509BCPP0°C to +70°C20 Plastic DIP
MAX509ACWP0°C to +70°C20 Wide SO
MAX509BCWP20 Wide SO±1 1/2
0°C to +70°C
MAX509ACAP0°C to +70°C20 SSOP±1
MAX509BCAP0°C to +70°C20 SSOP±1 1/2
MAX509BC/D0°C to +70°CDice*±1 1/2
Ordering Information continued on last page.
* Dice are specified at +25°C, DC parameters only.
**Contact factory for availability and processing to MIL-STD-883.
_________________Pin Configurations
TOP VIEW
OUTB
1
OUTA
2
V
SS
3
REFB
4
REFA
5
AGND
6
N.C.
7
DGND
8
LDAC
9
DOUT
10
Pin Configurations continued at end of data sheet.
Note: The outputs may be shorted to VDD, VSS, or AGND if the package power dissipation is not exceeded. Typical short-circuitcurrent
MAX509/MAX510
to AGND is 50mA. Do not bias AGND more than +1V above DGND, or more than 2.5V below DGND.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
A
- 0.3V), (VDD+ 0.3V)
SS
= +70°C)
DD
+ 0.3V)
, V
DD
SS
ELECTRICAL CHARACTERISTICS
(VDD= +5V ±10%, VSS= 0V to -5.5V, V
unless otherwise noted.)
(VDD= +5V ±10%, VSS= 0V to -5.5V, V
unless otherwise noted.)
PARAMETERCONDITIONSMINTYPMAX UNITS
POWER SUPPLIES
Positive Supply Voltage
Negative Supply Voltage-5.50VFor specified performanceV
Positive Supply Current
Negative Supply CurrentmAI
Note 1: Input resistance is code dependent. The lowest input resistance occurs at code = 55 hex.
Note 2: Input capacitance is code dependent. The highest input capacitance occurs at code = 00 hex.
Note 3: VREF = 4V
MAX509/MAX510
code of all other DACs to 00 hex.
Note 4: VREF = 4V
Note 5: Guaranteed by design.
Note 6: Output settling time is measured by taking the code from 00 hex to FF hex, and from FF hex to 00 hex.
, 10kHz. Channel-to-channel isolation is measured by setting the code of one DAC to FF hex and setting the
p-p
, 10kHz. DAC code = 00 hex.
p-p
TIMING CHARACTERISTICS
(VDD= +5V ±10%, VSS= 0V to -5V, V
PARAMETER
LDAC Pulse Width Low
CS Rise to LDAC Fall Setup Time
CLR Pulse Width Low
SERIAL INTERFACE TIMING
CS Fall to SCLK Setup Time
SCLK Fall to CS Rise Hold Time
SCLK Rise to CS Rise Hold Time
SCLK Fall to CS Fall Hold Time
DIN to SCLK Rise Setup Time
DIN to SCLK Rise Hold Time0nst
SCLK Clock Frequency
SCLK Pulse Width High
SCLK Pulse Width Low
SCLK to DOUT Valid
Note 7: Guaranteed by design.
Note 8: If LDAC is activated prior to CS's rising edge, it must stay low for t
Note 9: Minimum delay from 12th clock cycle to CS rise.
2OUTADAC A Voltage Output
3V
4REFBReference Voltage Input for DAC B
–REFABReference Voltage Input for DACs A and B
5REFAReference Voltage Input for DAC A
6AGNDAnalog Ground
MAX509/MAX510
7, 14N.C.Not Internally Connected
8DGNDDigital Ground
9
10DOUT8
11
12DIN10
13SCLK11
15
16REFDReference Voltage Input for DAC D–
–REFCDReference Voltage Input for DACs C and D13
17REFCReference Voltage Input for DAC C–
18V
19OUTDDAC D Output Voltage15
20OUTCDAC C Output Voltage16
1
2
3
–
4
–
5
–
6
7
9
12
NAMEFUNCTION
OUTBDAC B Voltage Output
SS
LDAC
CLR
CS
DD
Negative Power Supply, 0V to -5V ±10%. Connect to AGND for single-supply operation.
Load DAC Input (active low). Driving this asynchronous input low (level sensitive)
transfers the contents of each input latch to its respective DAC latch.
Serial Data Output. Can sink and source current. Data at DOUT is adjustable to be
clocked out on rising or falling edge of SCLK.
Clear DAC input (active low). Driving CLR low causes an asynchronous clear of input
and DAC registers and sets all DAC outputs to zero.
Serial Data Input. TTL/CMOS-compatible input. Data is clocked into DIN on the
rising edge of SCLK. CS must be low for data to be clocked in.
Serial Clock Input. Data is clocked in on the rising edge and clocked out on either the
rising (default) or the falling edge.
Chip-Select Input (active low). Data is shifted in and out when CS is low. Programming
commands are executed when CS rises.
At power-on, the serial interface and all DACs are
cleared and set to code zero. The serial data output
(DOUT) is set to transition on SCLK's rising edge.
The MAX509/MAX510 communicate with microprocessors through a synchronous, full-duplex, 3-wire interface (Figure 1). Data is sent MSB first and can be
transmitted in one 4-bit and one 8-bit (byte) packet or
in one 12-bit word. If a 16-bit control word is used, the
first four bits are ignored. A 4-wire interface adds a line
for LDAC and allows asynchronous updating. The serial
clock (SCLK) synchronizes the data transfer. Data is
transmitted and received simultaneously.
Figure 2 shows a detailed serial interface timing.
Please note that the clock should be low if it is stopped
CS
SCLK
between updates. DOUT does not go into a highimpedance state if the clock or CS is high.
Serial data is clocked into the data registers in MSBfirst format, with the address and configuration information preceding the actual DAC data. Data is
clocked in on SCLK's rising edge while CS is low. Data
at DOUT is clocked out 12 clock cycles later, either at
SCLK's rising edge (default or mode 1) or falling edge
(mode 0).
Chip select (CS) must be low to enable the DAC. If CS
is high, the interface is disabled and DOUT remains
unchanged. CS must go low at least 40ns before the
first rising edge of the clock pulse to properly clock in
the first bit. With CS low, data is clocked into the
MAX509/MAX510's internal shift register on the rising
edge of the external serial clock. SCLK can be driven
at rates up to 12.5MHz.
The 12-bit serial input format shown in Figure 3 com-
Serial Input Data Format and Control Codes
prises two DAC address bits (A1, A0), two control bits
(C1, C0) and eight bits of data (D0...D7).
The 4-bit address/control code configures the DAC as
shown in Table 1.
DOUT
This is the first bit shifted in
MSB
A1 A0C1 C0 D7D6
Control and
8-bit DAC data
● ● ●
D1 D0
LSB
DIN
Address bits
Figure 3. Serial Input Format
Load Input Register, DAC Registers Unchanged
(Single Update Operation)
A1
A0
(LDAC = H)
C1
C0
8-Bit Data0 1Address
D1D2D3D4D5D6D7
D0
When performing a single update operation, A1 and A0
select the respective input register. At the rising edge
of CS, the selected input register is loaded with the cur-
rent shift-register data. All DAC outputs remain
unchanged. This preloads individual data in the input
register without changing the DAC outputs.
Load Input and DAC Registers
A1
A0
(LDAC = H)
C1
C0
8-Bit Data1 1Address
D1D2D3D4D5D6D7
D0
This command directly loads the selected DAC register
at CS's rising edge. A1 and A0 set the DAC address.
Current shift-register data is placed in the selected
input and DAC registers.
For example, to load all four DAC registers simultaneously
with individual settings (DAC A = 1V, DAC B = 2V, D AC
C = 3V and DAC D = 4V), five commands are required.
First, perform four single input register update operations. Next, perform an “LDAC” command as a fifth
command. All DACs will be updated from their respective input registers at the rising edge of CS.
Update All DACs from Shift Registers
A1
A0
(LDAC = x)
C1
C0
8-Bit DAC Data0 0x 0
D1D2D3D4D5D6D7
D0
All four DAC registers are updated with shift-register
data. This command allows all DACs to be set to any
analog value within the reference range. This command
can be used to substitute CLR if code 00 hex is programmed, which clears all DACs.
No Operation (NOP)
A0
C1
D0D1D2D3D4D5D6D7C0
xxx xxxxx0 0x 1
A1
(LDAC = x)
The NOP command (no operation) allows data to be shifted through the MAX509/MAX510 shift register without
affecting the input or DAC registers. This is useful in daisy
chaining (also see the
Daisy-Chaining Devices
section).
For this command, the data bits are "Don't Cares." As an
example, three MAX509/MAX510s are daisy-chained (A, B
and C), and DAC A and DAC C need to be updated. The
36-bit-wide command would consist of one 12-bit word for
device C, followed by an NOP instruction for device B and
a third 12-bit word with data for device A. At CS's rising
edge, only device B is not updated.
“LDAC” Command (Software)
A1
(LDAC = x)
C1
A0
1 00 xxxx xxx xx
D0D1D2D3D4D5D6D7C0
All DAC registers are updated with the contents of their
respective input registers at CS's rising edge. With the
exception of using CS to execute, this performs the
same function as the asynchronous LDAC.
Set DOUT Phase – SCLK Rising (Mode 1, Default)
A1
(LDAC = x)
C1
A0
1 01 1xxxxxxxx
D0D1D2D3D4D5D6D7C0
Mode 1 resets the serial output DOUT to transition at
SCLK's rising edge. This is the MAX509/MAX510’s
default setting after the supply voltage has been
applied.
The command also loads all DAC registers with the contents of their respective input registers, and is identical to
the “LDAC” command.
This command resets DOUT to transition at SCLK's falling
edge. Once this command is issued, the phase of DOUT is
latched and will not change except on power-up or if the
specific command is issued that sets the phase to rising
edge.
The same command also updates all DAC registers with
the contents of their respective input registers, identical to
the “LDAC” command.
MAX509/MAX510
LDAC is typically used in 4-wire interfaces (Figure 7).
LDAC allows asynchronous hardware control of the DAC
outputs and is level-sensitive. With LDAC low, the DAC registers are transparent and any time an input register is
updated, the DAC output immediately follows.
Strobing the CLR pin low causes an asynchronous clear of
input and DAC registers and sets all DAC outputs to zero.
Similar to the LDAC pin, CLR can be invoked at any time,
typically when the device is not selected (CS = H). When
the DAC data is all zeros, this function is equivalent to the
"Update all DACs from Shift Registers" command.
Digital inputs and outputs are compatible with both TTL and
5V CMOS logic. The power-supply current (IDD) depends
on the input logic levels. Using CMOS logic to drive CS,
SCLK, DIN, CLR and LDAC turns off the internal level translators and minimizes supply currents.
DOUT is the output of the internal shift register. DOUT can be
programmed to clock out data on SCLK's falling edge (mode
0) or rising edge (mode 1). In mode 0, output data lags the
input data by 12.5 clock cycles, maintaining compatibility with
Microwire, SPI, and QSPI. In mode 1, output data lags the input
by 12 clock cycles. On power-up, DOUT defaults to mode 1
timing. DOUT never three-states; it always actively drives either
high or low and remains unchanged when CS is high.
The MAX509/MAX510 are Microwire, SPI, and QSPI compatible. For SPI and QSPI, clear the CPOL and CPHA configuration bits (CPOL = CPHA = 0). The SPI/QSPI CPOL = CPHA
= 1 configuration can also be used if the DOUT output is
ignored.
LDAC Operation (Hardware)
Clear DACs with CLR
Digital Inputs and Outputs
Serial Data Output
Interfacing to the Microprocessor
SCLK
MAX509
DIN
MAX510
DOUT
CS
THE DOUT-SI CONNECTION IS NOT REQUIRED FOR WRITING TO THE
MAX509/MAX510, BUT MAY BE USED FOR READ-BACK PURPOSES.
Figure 4. Connections for Microwire
MAX509
MAX510
THE DOUT-MISO CONNECTION IS NOT REQUIRED FOR WRITING TO THE
MAX509/MAX510, BUT MAY BE USED FOR READ-BACK PURPOSES.
Figure 5. Connections for SPI
DOUT
DIN
SCLK
CS
SK
SO
MICROWIRE
PORT
SI
I/0
MISO
MOSI
SPI
PORT
SCK
I/0
CPOL = 0, CPHA = 0
The MAX509/MAX510 can interface with Intel's
80C5X/80C3X family in mode 0 if the SCLK clock polarity is
inverted. More universally, if a serial port is not available,
three lines from one of the parallel ports can be used for bit
manipulation.
Digital feedthrough at the voltage outputs is greatly minimized by operating the serial clock only to update the registers. Also see the Clock Feedthrough photo in the
Operating Characteristics
section. The clock idle state is low.
Typical
Daisy-Chaining Devices
Any number of MAX509/MAX510s can be daisy-chained by
connecting the DOUT pin of one device to the DIN pin of the
following device in the chain. The NOP instruction (Table 1)
allows data to be passed from DIN to DOUT without changing the input or DAC registers of the passing device. A threewire interface updates daisy-chained or individual
MAX509/MAX510s simultaneously by bringing CS high.
If multiple devices share a common DIN line, Figure 7's
configuration provides simultaneous update by strobing LDAC low. CS1, CS2, CS3... are driven separately,
thus controlling which data are written to devices 1, 2, 3....
The MAX509/MAX510 contain four matched voltageoutput DACs. The DACs are inverted R-2R ladder networks that convert 8-bit digital words into equivalent
analog output voltages in proportion to the applied reference voltages. Each DAC in the MAX509 has a separate reference input, while the two reference inputs in
the MAX510 each share a pair of DACs. The two reference inputs permit different full-scale output voltage
ranges for each pair of DACs. A simplified diagram of
one of the four DACs is shown in Figure 8.
The MAX509/MAX510 can be used for multiplying
applications. The reference accepts both DC and AC
signals. The voltage at each REF input sets the fullscale output voltage for its respective DAC(s). If the reference voltage is positive, both the MAX509 and
MAX510 can be operated from a single supply. If dual
supplies are used, the reference input can vary from
VSSto VDD, but is always referred to AGND. The input
impedance at REF is code dependent, with the lowest
value (16kΩ for the MAX509 and 8kΩ for the MAX510)
occurring when the input code is 55 hex or 0101 0101.
The maximum value, practically infinity, occurs when
the input code is 00 hex. Since the REF input impedance is code dependent, the DAC's reference sources
must have a low output impedance (no more than 32Ω
for the MAX509 and 16Ω for the MAX510) to maintain
output linearity. The REF input capacitance is also code
RR
Analog Section
DAC Operation
Reference Input
OUT_
2R
dependent: 15pF typical for the MAX509 and 30pF
typical for the MAX510.
The output voltage for any DAC can be represented by
a digitally programmable voltage source as:
VOUT = (NB x VREF) / 256
where NB is the numerical value of the DAC's binary
input code.
Output Buffer Amplifiers
All MAX509/MAX510 voltage outputs are internally
buffered by precision unity-gain followers that slew at
up to 1V/µs. The outputs can swing from VSSto VDD.
With a 0V to +4V (or +4V to 0V) output transition, the
amplifier outputs will settle to 1/2LSB in typically 6µs
when loaded with 10kΩ in parallel with 100pF.
The buffer amplifiers are stable with any combination of
resistive loads ≥ 2kΩ and capacitive loads ≤ 300pF.
__________Applications Information
The MAX509/MAX510 are fully specified to operate with
Reference Operating Ranges
VDD= 5V ±10% and VSS= 0V to -5.5V. 8-bit performance is guaranteed for both single- and dual-supply
operation. The zero-code output error is less than 14mV
when operating from a single +5V supply.
The DACs work well with reference voltages from V
to VDD. The reference voltage is referred to AGND.
The preferred power-up sequence is to apply VSSand
then VDD, but bringing up both supplies at the same
time is also acceptable. In either case, the voltage
applied to REF should not exceed VDDduring powerup or at any other time. If proper power sequencing is
not possible, connect an external Schottky diode
between VSSand AGND to ensure compliance with the
Absolute Maximum Ratings
the digital inputs before the device is fully powered up.
Power-Supply Bypassing
and Ground Management
In single-supply operation (AGND = DGND = VSS=
0V), AGND, DGND and VSSshould be connected
together in a "star" ground at the chip. This ground
should then return to the highest quality ground available. Bypass VDDwith a 0.1µF capacitor, located as
close to VDDand DGND as possible. In dual-supply
operation, bypass VSSto AGND with 0.1µF.
Careful PC board layout minimizes crosstalk among
DAC outputs, reference inputs, and digital inputs.
Figures 9 and 10 show suggested circuit board layouts
to minimize crosstalk.
Figure 9. Suggested MAX509 PC Board Layout for Minimizing
Crosstalk (Bottom View)
Unipolar-Output, 2-Quadrant Multiplication
In unipolar operation, the output voltages and the reference input(s) are the same polarity. Figures 11 and 12
show the MAX509/MAX510 unipolar configurations.
Both devices can be operated from a single supply if
the reference inputs are positive. If dual supplies are
used, the reference input can vary from VSSto VDD.
Table 2 shows the unipolar code.
Table 2. Unipolar Code Table
DAC CONTENTS
MSBLSB
1 1 1 11 1 1 1
1 0 0 00 0 0 1
1 0 0 00 0 0 0
0 1 1 11 1 1 1
0 0 0 00 0 0 1
0 0 0 00 0 0 00V
+V
ANALOG
OUTPUT
+V
REF
+V
REF
(––––)= +
REF
+V
REF
+V
REF
255
(––––)
256
129
(––––)
256
V
128
256 2
127
(––––)
256
1
(––––)
256
REF
–
–––
Figure 10. Suggested MAX510 PC Board Layout for Minimizing
Crosstalk (Bottom View)
Bipolar-Output, 2-Quadrant Multiplication
Bipolar-output, 2-quadrant multiplication is achieved by
offsetting AGND positively or negatively. Table 3 shows
the bipolar code.
AGND can be biased above DGND to provide an arbitrary nonzero output voltage for a 0 input code, as
shown in Figure 13. The output voltage at OUTA is:
AGND is common to all four DACs, all outputs will be
offset by V
more than +1V above DGND, or more than 2.5V below
in the same manner. Do not bias AGND
BIAS
DGND.
16
OUTC
Figures 14 and 15 illustrate the generation of negative
offsets with bipolar outputs. In these circuits, AGND is
biased negatively (up to -2.5V with respect to DGND) to
provide an arbitrary negative output voltage for a 0
input code. The output voltage at OUTA is:
15
OUTD
OUTA = -(R2/R1)(2.5V) + (NB/256)(2.5V)(R2/R1+1)
where NB represents the digital input word. Since
DGND
AGND is common to all four DACs, all outputs will be
offset by V
V
= 2.5V, shows the digital code vs. output voltage
REF
for Figure 14 and 15's circuits with R1 = R2. The
in the same manner. Table 3, with
BIAS
ICL7612 op amp is chosen because its common-mode
range extends to both supply rails.
___________________Chip Topography_Ordering Information (continued)
PARTTEMP. RANGE PIN-PACKAGE
MAX509AEPP-40°C to +85°C20 Plastic DIP
MAX509BEPP-40°C to +85°C20 Plastic DIP
MAX509AEWP-40°C to +85°C20 Wide SO
MAX509BEWP-40°C to +85°C20 Wide SO±1 1/2
MAX509AEAP-40°C to +85°C20 SSOP±1
MAX509BEAP-40°C to +85°C20 SSOP±1 1/2
MAX509AMJP-55°C to +125°C 20 CERDIP**±1
MAX509BMJP-55°C to +125°C 20 CERDIP**±1 1/2
MAX510ACPE
0°C to +70°C
16 Plastic DIP±1
TUE
(LSB)
±1
±1 1/2
±1
REFB
(REFAB)
REFA
(REFAB)
AGND
MAX510BCPE0°C to +70°C16 Plastic DIP±1 1/2
MAX509/MAX510
MAX510ACWE0°C to +70°C16 Wide SO±1
MAX510BCWE0°C to +70°C16 Wide SO±1 1/2
DGND
MAX510AEPE-40°C to +85°C16 Plastic DIP±1
MAX510BEPE-40°C to +85°C16 Plastic DIP±1 1/2
MAX510AEWE-40°C to +85°C16 Wide SO±1
MAX510BEWE-40°C to +85°C16 Wide SO±1 1/2
MAX510AMJE-55°C to +125°C 16 CERDIP**±1
MAX510BMJE-55°C to +125°C 16 CERDIP**±1 1/2
NOTE: LABELS IN ( ) ARE FOR MAX510 ONLY.
TRANSISTOR COUNT: 2235;
SUBSTRATE CONNECTED TO VDD.
**Contact factory for availability and processing to MIL-STD-883.
________________________________________________________Package Information
e
HE
V
SS
OUTA
DOUTLDAC
DIM
MAX509/MAX510
OUTB
OUTC
CLR
0.128"
(3.25mm)
INCHESMILLIMETERS
A
A1
B
C
D
E
e
H
L
α
MIN
0.068
0.002
0.010
0.005
0.278
0.205
0.301
0.022
0˚
MAX
0.078
0.008
0.015
0.009
0.289
0.212
0.311
0.037
8˚
OUTD
DIN
V
DD
MIN
1.73
0.05
0.25
0.13
7.07
5.20
7.65
0.55
0.65 BSC0.0256 BSC
0˚
REFC
(REFCD)
REFD
(REFCD)
CS
(3.07mm)
SCLK
MAX
1.99
0.21
0.38
0.22
7.33
5.38
7.90
0.95
8˚
21-0003A
0.121"
D
α
A
0.127mm
A1
B
0.004in.
C
L
20-PIN PLASTIC
SHRINK
SMALL-OUTLINE
PACKAGE
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20
__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600