Rainbow Electronics MAX4889C User Manual

General Description
The MAX4889B/MAX4889C high-speed passive switch­es route PCI Express
®
(PCIe) data between two possi­ble destinations in desktop or notebook PCs. The MAX4889B/MAX4889C are quad double-pole/double­throw (4 x DPDT) switches ideal for switching four half lanes of PCIe data between two destinations. The MAX4889B/MAX4889C feature a single digital control input (SEL) to switch signal paths.
The MAX4889C is intended for use in systems (e.g., SAS) where both the input and output are capacitively coupled, and provides a 10µA (typ) source current and a 60kΩ (typ) internal biasing resistor to GND at the _OUT_ terminals.
The MAX4889B/MAX4889C are fully specified to oper­ate from a single +3.3V (typ) power supply. Both devices are available in an industry-standard 3.5mm x
9.0mm, 42-pin TQFN package. These devices operate over the -40°C to +85°C extended temperature range.
Applications
Desktop PCs
Notebook PCs
Servers
Video Graphics Cards—SLI™ (Scaled Link Interface) and CrossFire™
Features
o Single +3.3V Power-Supply Voltage
o Support PCIe Gen I, Gen II Data Rates
o Supports SAS I, SAS II, and SAS 6.0Gbps
(MAX4889C)
o Superior Return Loss
Better than -14dB at 2.8GHz
o Small 3.5mm x 9.0mm, 42-Pin TQFN Package
o Industry-Standard Pinouts
MAX4889B/MAX4889C
2.5/5.0Gbps PCIe Passive Switches
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-4148; Rev 1; 8/08
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Note: All devices are specified over the -40°C to +85°C temperature
range.
+
Denotes a lead-free package.
*
EP = Exposed pad.
Pin Configuration
TOP VIEW
MAX4889B/
MAX4889C
TQFN
18
19
20
21
GND
V
CC
GND
V
CC
42
+
41
40
39
GND
V
CC
GND
V
CC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22
COUTB+
COUTB-
DIN+
DIN-
DOUTB+
DOUTB-
CIN-
CIN+
V
CC
BOUTB-
BOUTB+
BIN-
BIN+
AOUTB-
AOUTB+
AIN-
AIN+
COUTA-
VCCGND
DOUTA+
DOUTA-
GND
COUTA+
GND
SEL
VCCBOUTA-
BOUTA+
VCCGND
AOUTA-
AOUTA+
GND
*CONNECT EXPOSED PAD TO GROUND.
*EP
PCI Express is a registered trademark of PCI-SIG Corp.
SLI is a trademark of NVIDIA Corp.
CrossFire is a trademark of ATI Technologies, Inc.
Typical Operating Circuit appears at end of data sheet.
PART PIN-PACKAGE PKG CODE
MAX4889BETO+ 42 TQFN-EP* T423590M-1
MAX4889CETO+ 42 TQFN-EP* T423590M-1
MAX4889B/MAX4889C
2.5/5.0Gbps PCIe Passive Switches
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC= +3.3V ±10%, TA=T
MIN
to T
MAX,
unless otherwise noted. Typical values are at VCC= +3.3V, TA= +25°C, unless otherwise
noted.) (Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND, unless otherwise noted.) V
CC
...........................................................................-0.3V to +4V
SEL, _IN_, _OUTA_, _OUTB_ (Note 1) .......-0.3V to (V
CC
+ 0.3V)
Continuous Current (AIN_ to AOUTA_/AOUTB_, BIN_ to
BOUTA_/BOUTB_, CIN_ to COUTA_/COUTB_, DIN_ to
DOUTA_/DOUTB_)........................................................±70mA
Peak Current (AIN_ to AOUTA_/AOUTB_, BIN_ to
BOUTA_/BOUTB_, CIN_ to COUTA_/COUTB_, DIN_ to
DOUTA_/DOUTB_)
(pulsed at 1ms, 10% duty cycle)..............................±70mA
Continuous Current (SEL).................................................±10mA
Peak Current (SEL)
(pulsed at 1ms, 10% duty cycle)..................................±10mA
Continuous Power Dissipation (T
A
= +70°C) for multilayer board:
42-Pin TQFN (derate 35.7mW/°C above +70°C) .......2857mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Package Junction-to-Ambient Thermal Resistance
(θ
JA
) (Note 2) ............................................................28.0°C/W
Package Junction-to-Case Thermal Resistance
(θ
JC
) (Note 2) ..............................................................2.0°C/W
Lead Temperature (soldering, 10s) .................................+300°C
)
)
Note 1: Signals on SEL, _IN_, _OUTA_, _OUTB_ exceeding VCCor GND are clamped by internal diodes. Limit forward-diode current
to maximum current rating.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC PERFORMANCE
Analog Signal Range
On-Resistance R
On-Resistance Match Between Pairs of Same Channel
On-Resistance Match Between Channels
On-Resistance Flatness R
_OUTA_ or _OUTB_ Off-Leakage Current
_IN_ On-Leakage Current I
Output Short-Circuit Current
Output Open-Circuit Voltage
_IN_,
_OUTA_,
_OUTB_
ON
ΔR
ON
ΔR
ON
FLAT (ON
I
_ OU TA _ ( OF F)
I
_ OU TB _ ( OF F)
_IN_ (ON
VCC = +3.0V, I
_OUTB_
= 0V, 1.2V
V
VCC = +3.0V, I V
= 0V (Notes 4, 5)
_OUTB_
VCC = +3.0V, I V
= 0V (Notes 4, 5)
_OUTB_
VCC = +3.0V, I V
,
VCC = +3.6V , V or V
= 0V, 1.2V (Notes 5, 6)
_OUTB_
_OUTB_
VCC = +3.6V , V or V
_OUTB_
= 15mA, V
_IN_
= 15mA, V
_IN_
= 15mA, V
_IN_
= 15mA, V
_IN_
= 0V, 1.2V, V
_IN_
= 1.2V, 0V (MAX4889B)
= 0V, 1.2V, V
_IN_
= V
or unconnected
_IN_
(MAX4889B)
All other ports are unconnected (MAX4889C)
All other ports are unconnected (MAX4889C)
_OUTA_
_OUTA_
_OUTA_
_OUTA_
_OUTA_
_OUTA_
V
-
-0.3
,
,
,
,
6.4 8.4 Ω
0.1 0.5 Ω
0.2 Ω
0.3 Ω
CC
1.8
V
-1 +1 µA
-1 +1 µA
515µA
0.2 0.6 0.9 V
FREQUENCY RANGE
(GHz)
MAXIMUM INSERTION
LOSS (dB)
0–2.5
2.5–5
5 or greater
MAX4889B/MAX4889C
2.5/5.0Gbps PCIe Passive Switches
_______________________________________________________________________________________ 3
Note 3: All units are 100% production tested at TA= +85°C. Limits over the operating temperature range are guaranteed by design
and characterization and are not production tested.
Note 4: ΔR
ON
= R
ON (MAX)
- R
ON (MIN)
.
Note 5: Guaranteed by design, not production tested. Note 6: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified
analog signal range.
ELECTRICAL CHARACTERISTICS (continued)
(VCC= +3.3V ±10%, TA=T
MIN
to T
MAX,
unless otherwise noted. Typical values are at VCC= +3.3V, TA= +25°C, unless otherwise
noted.) (Note 3)
Table 1. Insertion Loss Mask
1
5
f + 0.6
GHz
4
2
×
5
f - 1.0
GHz
6
×
5
f - 3.0
GHz
8
×
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
AC PERFORMANCE
SEL-to-Switch Turn-On Time t
SEL-to-Switch Turn-Off Time t
Propagation Delay t
Output Skew Between Pairs t
Output Skew Between Same Pair t
Differential Return Loss (Note 5) S
Differential Insertion Loss (Note 5) S
Differential Crosstalk (Note 5) S
Differential Off-Isolation (Note 5) S
CONTROL INPUT (SEL)
Input Logic High V
Input Logic Low V
Input Logic Hysteresis V
POWER SUPPLY
Power-Supply Range V
VCC Supply Current I
ON_SEL
OFF_SEL
PD
SKEW1
SKEW2
ZS = ZL = 50Ω 80 ns
ZS = ZL = 50Ω, Figure 1 15 ns
ZS = ZL = 50Ω, Figure 2 50 ps
ZS = ZL = 50Ω, Figure2 50 ps
ZS = ZL = 50Ω, Figure 2 10 ps
0Hz < f 2.8GHz -14
DD11
2.8GHz < f 5.0GHz -8
f > 5.0GHz -3
DD21
See Table 1 dB
0Hz < f 2.5GHz -40
DDCTK
2.5GHz < f 5.0GHz -30
f > 5.0GHz -25
0Hz < f 2.5GHz -15
DD21_OFF
2.5GHz < f 5.0GHz -12
f > 5.0GHz -12
IH
IL
HYST
CC
V
CC
SEL
= 0 or V
CC
dB
dB
dB
1.4 V
0.6 V
130 mV
3.0 3.6 V
1mA
MAX4889B/MAX4889C
2.5/5.0Gbps PCIe Passive Switches
4 _______________________________________________________________________________________
Test Circuits/Timing Diagrams
LOAD
SOURCE
V
OUT
Z
L
MAX4889B/
MAX4889C
SEL
Z
S
Σ
10%
90%
50%
50%
t
ON_SEL
t
OFF_SEL
V
OUT
SEL
THE FREQUENCY OF THE SIGNAL SHOULD BE ABOVE THE HIGHPASS FILTER CORNER OF THE COUPLING CAPACITORS.
Figure 1. Switching Time
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