Rainbow Electronics MAX3028 User Manual

General Description

The MAX13013–MAX13017/MAX3023–MAX3028 single-/
dual-/quad-level translators provide the level shifting
necessary to allow 100Mbps data transfer in a multivolt­age system. Externally applied voltages, VCCand VL, set
the logic levels on either side of the device. Logic signals
present on the VLside of the device appear as a higher
voltage logic signal on the VCCside of the device, and
vice-versa.

The MAX13013 single-, the MAX13014–MAX13017
dual-, and the MAX3023–MAX3028 (UCSP™ package)
quad-level translators feature an enable (EN) input. The
MAX3023–MAX3028 (TSSOP package) quad-level
translators feature EN and EN inputs. When disabled,
each device places all inputs/outputs on both sides in
tri-state and reduces the VCCsupply current to 0.03µA,
and the VLsupply current to 0.1µA. These devices oper­ate at a guaranteed 100Mbps data rate for VL> 1.8V.

The MAX13013–MAX13017/MAX3023–MAX3028 accept
a +1.65V to +3.6V VCCvoltage and a +1.2V to (V

CC

-

0.4V) VLvoltage, making them ideal for data transfer
between low-voltage ASICs/programmable logic
devices (PLDs) and higher voltage systems. The
MAX13013 is available in 3 x 2 UCSP and 6-pin SC70
packages. The MAX13014–MAX13017 are available in
3 x 3 UCSP and 8-pin SOT23 packages. The
MAX3023–MAX3028 are available in 4 x 3 UCSP and
14-pin TSSOP packages. All devices operate over the
extended -40°C to +85°C temperature range.

Applications

CMOS Logic-Level Translation

Low-Voltage ASIC Level Translation

Cell Phones

SPI™, MICROWIRE™ Level Translation

Portable POS Systems

Portable Communication Devices

GPS

Telecommunications Equipment

Features

♦ 100Mbps Guaranteed Data Rate
♦ Bidirectional Level Translation

MAX13013 (Single)
MAX13014 (Dual)
MAX3023 (Quad)

♦ Unidirectional Level Translation

MAX13015/MAX13016/MAX13017 (Dual)
MAX3024–MAX3028 (Quad)

♦ VLOperation Down to +1.2V
♦ Ultra-Low 0.1µA Supply Current When Disabled
♦ Low-Quiescent Current (0.1µA)
♦ UCSP, SC70, SOT23, and TSSOP Packages

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

________________________________________________________________ Maxim Integrated Products 1

MAX13014

+1.8V +3.3V

I/O V

CC

1

I/O V

CC

2

I/O V

L

1

I/O V

L

2

CLK

V

L

V

CC

DATA

CLK

DATA

GND

GND

GND

0.1µF 0.1µF

+1.8V

SYSTEM

CONTROLLER

+3.3V

SYSTEM

Typical Operating Circuit

GND

I/O V

L

1I/O VCC1

16EN

5V

L

V

CC

MAX13013

SC70

2

34

MAX13013

3 x 2 UCSP

TOP VIEW

(BUMPS ON BOTTOM OF DIE)

I/O VCC1V

CC

GND

I/O V

L

1V

L

EN

TOP VIEW

A

123

B

Pin Configurations

19-3266; Rev 1; 8/04

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MICROWIRE is a trademark of National Semiconductor Corp.
SPI is a trademark of Motorola, Inc.
UCSP is a trademark of Maxim Integrated Products, Inc.

Pin Configurations continued at end of data sheet.
Ordering Information/Selector Guide continued at end of

data sheet.

Ordering Information/Selector Guide

PART

TEMP RANGE

PIN-PACKAGE

PACKAGE

CODE

TOP

NUMBER OF

V

L

→ V

CC

Number of

V

CC

→ V

L

EN

EN

MAX13013EXT

6 SC70 —

11

—

-40°C to +85°C

MARK

ACD

TRANSLATORS

TRANSLATORS

✓

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC= +1.65V to +3.6V, VL= +1.2V to (V

CC

- 0.4V), EN = VL, EN = open (MAX3023–MAX3028 TSSOP package only), C

IOVL

≤ 15pF,

C

IOVCC

≤ 40pF, TA= T

MIN

to T

MAX

. Typical values are at TA= +25°C.) (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

All voltages are referenced to GND.
V

CC

...........................................................................-0.3V to +4V

V

L...........................................................................................

-0.3V to +4V

I/O V

CC_

......................................................-0.3V to (VCC+ 0.3V)

I/O V

L_

...........................................................-0.3V to (VL+ 0.3V)

EN, EN...........................................................-0.3V to (V

L

+ 0.3V)

Short-Circuit Duration I/O V

L_

,

I/O V

CC_

to GND ....................................................Continuous

Continuous Power Dissipation (T

A

= +70°C)

6-Pin SC70 (derate 3.1mW/°C above +70°C)..............245mW

6-Bump UCSP (derate 3.9mW/°C above +70°C).........308mW

8-Bump UCSP (derate 4.7mW/°C above +70°C).........379mW

8-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW

12-Bump UCSP (derate 6.5mW/°C above +70°C) ...518.8mW

14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range ............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

VL Supply Range V

L

1.2

V

VCC Supply Range V

CC

V

Supply Current from V

CC

IQV

CC

I/O V CC_ = 0, I/O V L_ = 0
or I/O V

CC

_ = VCC, I/O V L_ = V

L

0.1 1 µA

I/O V CC_ = 0, I/O V L_ = 0
or I/O V

CC

_ = VCC, I/O V L_ = V

L

0.2 2

Supply Current from V

L

IQV

L

I/O V CC_ = 0, I/O V L_ = 0
or I/O V

CC

_ = VCC, I/O V L_ = VL,

V

L

< VCC - 0.2V

10

µA

V

CC

Tri-state Output-Mode

Supply Current

TA = +25°C, EN = 0

1µA

TA = +25°C, EN = 0 0.1 0.2

V

L

Tri-state Output-Mode Supply

Current (MAX13013–MAX13017)

I

TS-VL

TA = +25°C, EN = 0, VL = VCC - 0.2V 1 2

µA

TA = +25°C, EN = 0 50 70

V

L

Tri-state Output-Mode Supply
Current (MAX3023–MAX3028
TSSOP Package Only)

I

TS-VL

TA = +25°C, EN = 0, VL = V

CC

- 0.2V 55 74

µA

TA = +25°C, EN = 0

I/O Tri-state Output-Mode
Leakage Current

T

A

= +25°C, EN = 0, VL = V

CC

- 0.2V 20

µA

VCC - 0.4

1.65 3.60

I

TS-VCC

100

0.03

0.15

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(VCC= +1.65V to +3.6V, VL= +1.2V to (V

CC

- 0.4V), EN = VL, EN = open (MAX3023–MAX3028 TSSOP package only), C

IOVL

≤ 15pF,

C

IOVCC

≤ 40pF, TA= T

MIN

to T

MAX

. Typical values are at TA= +25°C.) (Notes 1, 2)

PARAMETER

CONDITIONS

UNITS

LOGIC-LEVEL THRESHOLDS

I/O V L_ Input-Voltage High V

IHL

2/3 x V

L

V

I/O V L_ Input-Voltage Low V

ILL

V

Pullup Resistance on I/O VL_

Ω

Pulldown Resistance on I/O VL_75Ω

I/O V CC_ Input-Voltage High V

IHC

2/3 x V

CC

V

I/O V CC_ Input-Voltage Low V

ILC

V

Pullup Resistance on I/O VCC_ 2.5 kΩ

2.5 kΩ

EN, EN Input-Voltage High V

IH

2/3 x V

L

V

EN, EN Input-Voltage Low V

IL

V

EN Input Current MAX13013–MAX13017 -5 +5 µA

Pullup Resistance on EN MAX3023–MAX3028 46 62 81 kΩ

Pulldown Resistance on EN

46 62 81 kΩ

I/O V L_ Output-Voltage High V

OHL

I/O V

L

source current = 20µA

2/3 x V

L

V

I/O V L_ Output-Voltage Low V

OLL

I/O V

L

sink current = 20µA

V

I/O V CC_ Output-Voltage High V

OHC

I/O V

CC

source current = 20µA

2/3 x V

CC

V

I/O V CC_ Output-Voltage Low V

OLC

I/O V

CC

sink current = 20µA

V

Pulldown Resistance on I/O VCC_

SYMBOL

MAX3023–MAX3028, TSSOP package only

MIN TYP MAX

1/3 x V

120

1/3 x V

1/3 x V

1/3 x V

1/3 x V

L

CC

L

L

CC

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

4 _______________________________________________________________________________________

Note 1: VLmust be less than or equal to VCC- 0.4V during normal operation. However, VLcan be greater than VCCduring startup

and shutdown conditions.

Note 2: All units are 100% production tested at T

A

= +25°C. Limits over the operating temperature range are guaranteed by design

and not production tested.

Note 3: Not production tested. Guaranteed by design.

TIMING CHARACTERISTICS

(VCC= +1.65V to +3.6V, VL= +1.2V to (VCC- 0.4V), EN = VL, EN = open (MAX3023–MAX3028 TSSOP package only), C

IOVL

≤ 15pF,

C

IOVCC

≤ 40pF, TA= T

MIN

to T

MAX

. Typical values are at TA= +25°C.) (Notes 1, 2)

PARAMETER

CONDITIONS

UNITS

C

IOVCC

= 15pF, Figure 1 2.5

C

IOVCC

= 20pF, Figure 1 3

I/O V CC_ Rise Time t

RVCC

C

IOVCC

= 40pF, Figure 1 4

ns

C

IOVCC

= 15pF, Figure 1 2.5

C

IOVCC

= 20pF, Figure 1 3I/O V CC_ Fall Time t

FVCC

C

IOVCC

= 40pF, Figure 1 4

ns

I/O V CC_ One- S hot Outp ut Im p ed ance

Ω

I/O V L_ Rise Time t

RVL

C

IOVL

= 15pF, Figure 2 2.5 ns

I/O V L_ Fall Time t

FVL

C

IOVL

= 15pF, Figure 2 2.5 ns

I/O V L_ One- S hot Outp ut Im p ed ance

Ω

Propagation Delay, Driving I/O VL_

C

IOVCC

= 15pF, Figure 1 6.5 ns

Propagation Delay, Driving I/O V CC_

C

IOVL

= 15pF, Figure 2 6 ns

Part-to-Part Skew ( N ote 3)

C

IOVCC

= 15pF, C

IOVL

= 15pF,

V

CC

= 2.5V, VL = 1.8V

4ns

Propagation Delay from
I/O V

L

_ to I/O V CC_ after Enable

C

IOVCC

= 15pF, Figure 3

ns

Propagation Delay from
I/O V

CC

_ to I/O V L_ after Enable

t

EN-VLCIOVL

= 15pF, Figure 4

ns

C

IOVCC

= 15p F, C

IOVL

= 15p F, V L > 1.8V

Maximum Data Rate

C

IOVCC

= 15p F, C

IOVL

= 15p F, V L > 1.2V 80

Mbps

SYM B O L

I/O

VL-VCC

I/O

VCC-VL

t

PPSKEW

MIN TYP MAX

18.5

12.5

t

EN-VCC

100

1000

1000

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

_______________________________________________________________________________________ 5

VL SUPPLY CURRENT
vs. SUPPLY VOLTAGE

MAX13013 toc01

VCC SUPPLY VOLTAGE (V)

V

L

SUPPLY CURRENT (mA)

3.53.02.5

0.2

0.4

0.6

0.8

1.0

0

2.0 4.0

DRIVING I/O V

L_

VL = 1.8V
C

IOVCC

= 15pF

VL SUPPLY CURRENT
vs. SUPPLY VOLTAGE

MAX13013 toc02

VCC SUPPLY VOLTAGE (V)

V

L

SUPPLY CURRENT (mA)

3.53.02.52.0

0.1

0.2

0.3

0.4

0.5

0.6

0

1.5 4.0

DRIVING I/O V

L_

VL = 1.2V
C

IOVCC

= 15pF

VCC SUPPLY CURRENT

vs. SUPPLY VOLTAGE

MAX13013 toc03

VCC SUPPLY VOLTAGE (V)

V

CC

SUPPLY CURRENT (mA)

3.53.02.5

5

10

15

20

25

0

2.0 4.0

DRIVING I/O V

L_

VL = 1.8V
C

IOVCC

= 15pF

VCC SUPPLY CURRENT

vs. SUPPLY VOLTAGE

MAX13013 toc04

VCC SUPPLY VOLTAGE (V)

V

CC

SUPPLY CURRENT (mA)

3.53.02.52.0

5

10

15

20

25

0

1.5 4.0

DRIVING I/O V

L_

VL = 1.2V
C

IOVCC

= 15pF

VL SUPPLY CURRENT

vs. TEMPERATURE

MAX13013 toc05

TEMPERATURE (°C)

V

L

SUPPLY CURRENT (mA)

603510-15

2.4

2.8

3.2

3.6

4.0

2.0

-40 85

DRIVING I/O V

CC_

C

IOVL

= 15pF

VCC SUPPLY CURRENT

vs. TEMPERATURE

MAX13013 toc06

TEMPERATURE (°C)

V

CC

SUPPLY CURRENT (mA)

603510-15

11

12

13

14

15

16

10

-40 85

DRIVING I/O V

CC_

C

IOVL

= 15pF

VL SUPPLY CURRENT

vs. CAPACITIVE LOAD ON I/O V

CC_

MAX13013 toc07

CAPACITIVE LOAD (pF)

V

L

SUPPLY CURRENT (mA)

302010

0.2

0.4

0.6

0.8

1.0

0

040

DRIVING I/O V

L_

VCC SUPPLY CURRENT

vs. CAPACITIVE LOAD ON I/O V

CC_

MAX13013 toc08

CAPACITIVE LOAD (pF)

V

CC

SUPPLY CURRENT (mA)

302010

13

16

19

22

25

10

040

DRIVING I/O V

L_

RISE/FALL TIME

vs. CAPACITIVE LOAD ON I/O V

CC_

MAX13013 toc09

CAPACITIVE LOAD (pF)

RISE/FALL TIME (ns)

302010

0.3

0.6

0.9

1.2

1.5

0

040

DRIVING I/O V

L_

t

RISE

t

FALL

Typical Operating Characteristics

(Data rate = 100Mbps, VCC= 3.3V, VL= 1.8V, TA= +25°C, unless otherwise noted.)

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

6 _______________________________________________________________________________________

Typical Operating Characteristics (continued)

(Data rate = 100Mbps, VCC= 3.3V, VL= 1.8V, TA= +25°C, unless otherwise noted.)

RISE/FALL TIME

vs. CAPACITIVE LOAD ON I/O V

L_

MAX13013 toc10

CAPACITIVE LOAD (pF)

RISE/FALL TIME (ns)

15105

0.2

0.4

0.6

0.8

1.0

1.2

0

020

DRIVING I/O V

CC_

t

RISE

t

FALL

PROPAGATION DELAY

vs. CAPACITIVE LOAD ON I/O V

CC_

MAX13013 toc11

CAPACITIVE LOAD (pF)

PROPAGATION DELAY (ns)

302010

1

2

3

4

5

0

040

DRIVING I/O V

L_

t

PLH

t

PHL

PROPAGATION DELAY

vs. CAPACITIVE LOAD ON I/O V

L_

MAX13013 toc12

CAPACITIVE LOAD (pF)

PROPAGATION DELAY (ns)

15105

1

2

3

4

5

0

020

DRIVING I/O V

CC_

t

PLH

t

PHL

t

EN-VCC

vs. TEMPERATURE

(C

IOVCC

= 15pF)

MAX13013 toc13

TEMPERATURE (°C)

t

EN-VCC

(ns)

603510-15

170

190

210

230

250

150

-40 85

t

EN-VL

vs. TEMPERATURE

(C

IOVL

= 15pF)

MAX13013 toc14

TEMPERATURE (°C)

t

EN-VL

(ns)

603510-15

20

40

60

80

100

0

-40 85

TYPICAL I/O VL_ DRIVING

(C

IOVCC

= 40pF)

MAX13013 toc15

4ns/div

2V/div

2V/div

TYPICAL I/O V

CC_

DRIVING

(C

IOVL

= 15pF)

MAX13013 toc16

4ns/div

2V/div

2V/div

TYPICAL I/O VL_ DRIVING

(V

CC

= 1.65V, VL = 1.2V, C

IOVCC

= 40pF)

MAX13013 toc17

4ns/div

1V/div

1V/div

TYPICAL I/O V

CC_

DRIVING

(V

CC

= 1.65V, VL = 1.2V, C

IOVL

= 15pF)

MAX13013 toc18

4ns/div

1V/div

1V/div

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

_______________________________________________________________________________________ 7

Pin Description—MAX13013/MAX13014/

MAX3023 (Bidirectional Devices)

PIN

MAX3023 MAX13013 MAX13014

TSSOP

4 x 3

3 x 2

3 x 3

FUNCTION

1 A1 4 B2 7 A2

Input/Output 1, Referenced to V

L

2 B2 — — 6 A3

Input/Output 2, Referenced to V

L

3 A2 5 B1 8 A1 V

L

VL Input Voltage, +1.2V ≤ VL ≤ VCC - 0.4V. Bypass VL to GND
with a 0.1µF capacitor.

4 — — — — — N.C. No Connection

5 B3 — — — —

Input/Output 3, Referenced to V

L

6 A3 — — — —

Input/Output 4, Referenced to V

L

7 A4 6 B3 5 B1 EN

Active-High Enable Input. If EN is pulled low, all inputs/outputs
are in tristate. Drive EN high (VL) for normal operation.

8 — — — — — EN

Active-Low Enable Input. If EN is pulled high (VL), all inputs/
outputs are in tri-state. Drive EN low for normal operation
(MAX3023 TSSOP package only).

9 B4 — — — —

Input/Output 4, Referenced to V

CC

10 C4 — — — —

Input/Output 3, Referenced to V

CC

11 C3 2 A3 4 B3 GND Ground

12 C2 1 A1 1 C1 V

CC

VCC Input Voltage, +1.65V ≤ V

CC

≤ +3.6V. Bypass VCC to GND

with a 0.1µF capacitor.

13 C1 — — 3 C3

Input/Output 2, Referenced to V

CC

14 B1 3 A2 2 C2

Input/Output 1, Referenced to V

CC

Pin Description—MAX13015/MAX13016/MAX13017/

MAX3024–MAX3028 (Unidirectional Devices)

NAME FUNCTION (Note 4)

V

CC

V

CC

Input Voltage, +1.65V ≤ VCC ≤ +3.6V. Bypass VCC to GND with a 0.1µF capacitor.

V

L

VL Input Voltage, +1.2V ≤ VL ≤ V

CC

- 0.4V. Bypass VL to GND with a 0.1µF capacitor.

GND Ground

EN

Active-High Enable Input. If EN is pulled low, all inputs/outputs are in tri-state. Drive EN high (V

L

) for normal

operation.

EN

Active-Low Enable Input (MAX3024–MAX3028 TSSOP Package Only). If EN is pulled high (V

L

), all

inputs/outputs are in tri-state. Drive EN low for normal operation.

I VL1–I VL4Inputs Referenced to VL, Numbers 1 to 4

O VL1–O VL4 Outputs Referenced to VL, Numbers 1 to 4

I VCC1–I VCC4Inputs Referenced to VCC, Numbers 1 to 4

O VCC1–O VCC4

Outputs Referenced to VCC, Numbers 1 to 4

Note 4: For specific pin numbers, see the Pin Configurations for more information.

UCSP

SC70

UCSP

SOT23

UCSP

NAME

I/O VL1

I/O VL2

I/O VL3

I/O VL4

I/O VCC4

I/O VCC3

I/O VCC2

I/O VCC1

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

8 _______________________________________________________________________________________

Test Circuits/Timing Diagrams

MAX13013

90%

50%

10%

I/O V

CC_

I/O V

L_

t

RISE/FALL ≤

3ns

I/O

VL-VCC

C

IOVCC

EN

I/O V

L_

SOURCE

V

L

V

CC

I/O V

CC_

I/O

VL-VCC

t

RVCC

t

FVCC

90%

50%

10%

Figure 1. Driving I/O VL_Test Circuit and Timing

Figure 2. Driving I/O V

CC_

Test Circuit and Timing

t

I/O V

CC_

I/O V

L_

90%

50%

10%

90%

50%

10%

V

L

V

CC

MAX13013

EN

I/O V

I/O V

L_

C

IOVL_

CC_

SOURCE

RISE/FALL ≤

I/O

3ns

VCC-VL

t

FVL

I/O

VCC-VL

t

RVL

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

_______________________________________________________________________________________ 9

Test Circuits/Timing Diagrams (continued)

MAX13013

SOURCE

I/O V

CC_

C

IOVCC

1MΩ

EN

V

L

0

V

L

V

CC

0

0

I/O V

L_

I/O V

CC_

V

CC

/ 2

EN

V

L

I/O V

L_

MAX13013

SOURCE

C

IOVCC

I/O V

CC_

EN

I/O V

L_

1MΩ

V

CC

t'

EN-VCC

EN

V

L

0

V

L

V

CC

0

0

I/O V

L_

t

EN-VCC

IS WHICH EVER IS LARGER BETWEEN t'

EN-VCC

AND t"

EN-VCC

.

I/O V

CC_

V

CC

/ 2

t"

EN-VCC

Figure 3. Propagation Delay from I/O VL_to I/O V

CC_

After EN

Figure 4. Propagation Delay from I/O V

CC_

to I/O VL_After EN

SOURCE

100kΩ

SOURCE

I/O V

100kΩ

L_

V

L

0

V

CC

I/O V

EN

I/O V

CC_

EN

t'

EN-VL

MAX13013

I/O V

L_

CC_

0

CC_

V

CC

V

EN-VCC

0

AND t"

L

V

0

V

0

V

0

L

CC

L

EN-VCC

.

I/O V

I/O V

I/O V

L_

EN

CC_

L_

VL / 2

t"

EN-VL

VL / 2

t

IS WHICH EVER IS LARGER BETWEEN t'

EN-VCC

C

IOVL

EN

V

L

C

IOVL

MAX13013

I/O V

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

10 ______________________________________________________________________________________

Detailed Description

The MAX13013–MAX13017/MAX3023–MAX3028 logic­level translators provide the level shifting necessary to
allow 100Mbps data transfer in a multivoltage system.
Externally applied voltages, V

CC

and VL, set the logic
levels on either side of the device. Logic signals pre­sent on the VLside of the device appear as a higher­voltage logic signal on the VCCside of the device, and
vice-versa. The MAX13013/MAX13014/MAX3023 bidi­rectional level translators allow data translation in either
direction (VL↔VCC) on any single data line. The
MAX13015/MAX13016/MAX13017/MAX3024–MAX3028
unidirectional level translators, level shift data in one
direction (VL→ VCCor VCC→VL) on any single data
line. The MAX13013–MAX13017/MAX3023–MAX3028
accept VLfrom +1.2V to (VCC- 0.4V) and operate with
VCCfrom +1.65V to +3.6V, making them ideal for data
transfer between low-voltage ASICs/PLDs and higher
voltage systems.

When in tri-state mode, the MAX13013–MAX13017/
MAX3023–MAX3028 reduce the VCCsupply current to

0.03µA, and the VLsupply current to 0.1µA. These
devices operate at a guaranteed data rate of 100Mbps
for VL> 1.8V.

Level Translation

For proper operation, ensure that +1.65V ≤ VCC≤ +3.6V,
and +1.2V ≤ VL≤ VCC- 0.4V. During power-up
sequencing, VL≥ VCCdoes not damage the device.

During power-supply sequencing, when VCCis floating
and VLis powering up, up to 40mA current can be
sourced to each load on the VLside, without the device
latching up. The maximum data rate depends heavily on
the load capacitance (see the Typical Operating
Characteristics Rise/Fall Time graph), output impedance
of the driver, and the operating voltage range (Table 1).

Input Driver Requirements

The MAX13013–MAX13017/MAX3023–MAX3028 archi­tecture is based on a one-shot accelerator output stage
(see Figure 5). Accelerator output stages are in tri-state
mode except when there is a transition on any of the
translators on the input side, either I/O VL_or I/O V

CC_

.
A short pulse is then generated during which the accel­erator output stages become active and charge/dis­charge the capacitances at the I/Os. Due to the
architecture, both sides become active during the one­shot pulse. This can lead to some current feeding into
the external source that is driving the translator.
However, this behavior simply helps to speed up the
transition on the driven side.

Table 1. Data Rate

VL (V)

GUARANTEED DATA RATE (Mbps)

VL < 1.8 80

VL ≥ 1.8 100

Figure 5. Simplified Functional Diagram (One I/O Line)

V

I/O V

L

L

I/O V

TO I/O V

L_

P

ONE-SHOT

N

ONE-SHOT

CC_

PATH

4kΩ

P

ONE-SHOT

150Ω

I/O V

TO I/O V

PATH

L_

N

ONE-SHOT

CC_

V

CC

I/O V

CC

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

______________________________________________________________________________________ 11

For proper operation, the driver has to meet the follow­ing conditions: less than 25Ω output impedance and
greater than 20mA peak output current capability.
Figure 6 shows a graph of typical input current versus
input voltage.

Output Load Requirements

The MAX13013–MAX13017/MAX3023–MAX3028 I/O are
designed to drive CMOS inputs. Do not load the I/O lines
with a resistive load less than 25kΩ. Also, do not place an
RC circuit at the input of these devices to slow down the
edges. If a slower rise/fall time is required, refer to the
MAX3000E/MAX3001E logic-level-translators data sheet.

For I2C™ level translation, refer to the MAX3372E­MAX3379E/MAX3390E–MAX3393E data sheet.

Enable Inputs

The MAX13013 single-, the MAX13014–MAX13017 dual­and the MAX3023–MAX3028 (UCSP package) quad-level
translators feature an EN input. The MAX3023–MAX3028
(TSSOP package) quad-level translators feature both EN
and EN inputs (see Table 2 for operating mode). Note
that the MAX3023–MAX3028 (TSSOP package) have
internal pullup and pulldown circuitry on EN and EN,
respectively. If left unconnected, EN is pulled up to V

L

and EN is pulled down to GND.

Applications Information

Power-Supply Decoupling

To reduce ripple and the chance of introducing data
errors, bypass VLand VCCto ground with a 0.1µF
ceramic capacitor. Place all capacitors as close to the
power-supply inputs as possible.

Unidirectional vs. Bidirectional Level

Translator

The MAX13013/MAX13014/MAX3023 bidirectional
translators can operate as a unidirectional device to
translate signals without inversion. The MAX13015/
MAX13016/MAX13017/MAX3024–MAX3028 unidirec­tional level translators, level shift data in one direction
(VL→ VCCor VCC→VL) on any single data line (see the
Ordering Information). These devices provide the
smallest solution (UCSP package) for unidirectional
level translation without inversion.

UCSP Applications Information

For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech­niques, bump-pad layout, and recommended reflow tem­perature profiles, as well as the latest information on
reliability testing results, go to Maxim’s web site at
www.maxim-ic.com/ucsp to find the Application Note:
UCSP—A Wafer-Level Chip-Scale Package.

Table 2. MAX3023–MAX3028 (TSSOP

Package) Operating Mode

EN

O PER A T IN G M OD E

00Both I/O VL_ and I/O VCC_ are in tri-state.

V

L

0 Normal operation.

0V LBoth I/O VL_ and I/O VCC_ are in tri-state.

V

L

V LBoth I/O VL_ and I/O VCC_ are in tri-state.

I2C is a trademark of Philips Corp.

Purchase of I

2

C components from Maxim Integrated Products, Inc. or one of its sublicensed Associated Companies, conveys a license

under the Philips I

2

C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard

Specification as defined by Philips.

Figure 6. Typical I

IN

vs. V

IN

I

IN

V

/ RIN*

TH_IN

0

V

TH_IN

- V

-(V

) /

S

TH_IN

*

R

IN

*RIN = 4kΩ WHEN DRIVING VL SIDE; RIN = 150Ω WHEN DRIVING VCC SIDE.

V

S

WHERE VS = VCC OR V

L

EN

V

IN

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

12 ______________________________________________________________________________________

Pin Configurations (continued)

TOP VIEW

MAX13014

UCSP

(BUMPS ON BOTTOM OF DIE)

23

I/O V

L

2I/O VL1

V

L

GND

EN

I/O V

CC

2I/O VCC1

V

CC

1

I/O VL2

ENGND

1

2

87V

L

I/O VL1I/O VCC1

I/O V

CC

2

V

CC

SOT23

3

4

6

5

MAX13014

A

B

C

MAX13015

UCSP

(BUMPS ON BOTTOM OF DIE)

23

I V

L

2I VL1

V

L

GND

EN

O V

CC

2O VCC1

V

CC

1

I VL2

ENGND

1

2

87V

L

I VL1O VCC1

O V

CC

2

V

CC

SOT23

3

4

6

5

MAX13015

A

B

C

MAX13016

UCSP

(BUMPS ON BOTTOM OF DIE)

23

O V

L

1I VL2

V

L

GND

EN

O V

CC

2I VCC1

V

CC

1

I VL2

ENGND

1

2

87V

L

O VL1I VCC1

O V

CC

2

V

CC

SOT23

3

4

6

5

MAX13016

A

B

C

MAX13017

UCSP

(BUMPS ON BOTTOM OF DIE)

23

O V

L

2O VL1

V

L

GND

EN

I V

CC

2I VCC1

V

CC

1

O VL2

ENGND

1

2

87V

L

O VL1I VCC1

I V

CC

2

V

CC

SOT23

3

4

6

5

MAX13017

A

B

C

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

______________________________________________________________________________________ 13

Pin Configurations (continued)

TOP VIEW

UCSP

(BUMPS ON BOTTOM OF DIE)

I/O VL4

EN

I/O VL1

1

A

B

C

234

V

L

I/O VL3

I/O V

CC

4

I/O V

CC

1

I/O VL2

GND

I/O V

CC

3

I/O V

CC

2

V

CC

14

13

12

11

10

9

8

1

2

3

4

5

6

7

I/O VCC1

I/O V

CC

2

V

CC

GNDN.C.

V

L

I/O VL2

I/O V

L

1

MAX3023

MAX3023

I/O VCC3

I/O V

CC

4

ENEN

I/O V

L

4

I/O V

L

3

TSSOP

UCSP

(BUMPS ON BOTTOM OF DIE)

I VL4

EN

I VL1

1

A

B

C

234

V

L

I VL3

O V

CC

4

O V

CC

1

I VL2

GND

O V

CC

3

O V

CC

2

V

CC

14

13

12

11

10

9

8

1

2

3

4

5

6

7

O VCC1

O V

CC

2

V

CC

GNDN.C.

V

L

I VL2

I V

L

1

MAX3024

MAX3024

O VCC3

O V

CC

4

ENEN

I V

L

4

I V

L

3

TSSOP

UCSP

(BUMPS ON BOTTOM OF DIE)

I VL4

EN

O VL1

1

A

B

C

234

V

L

I VL3

O V

CC

4

I V

CC

1

I VL2

GND

O V

CC

3

O V

CC

2

V

CC

14

13

12

11

10

9

8

1

2

3

4

5

6

7

I V

CC

1

O V

CC

2

V

CC

GNDN.C.

V

L

I VL2

O V

L

1

MAX3025

MAX3025

O VCC3

O V

CC

4

ENEN

I V

L

4

I V

L

3

TSSOP

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

14 ______________________________________________________________________________________

Pin Configurations (continued)

TOP VIEW

UCSP

(BUMPS ON BOTTOM OF DIE)

I VL4

EN

O VL1

1

A

B

C

234

V

L

I VL3

O V

CC

4

I V

CC

1

O VL2

GND

O V

CC

3

I V

CC

2

V

CC

14

13

12

11

10

9

8

1

2

3

4

5

6

7

I V

CC

1

I V

CC

2

V

CC

GNDN.C.

V

L

O VL2

O V

L

1

MAX3026

MAX3026

O VCC3

O V

CC

4

ENEN

I V

L

4

I V

L

3

TSSOP

UCSP

(BUMPS ON BOTTOM OF DIE)

I VL4

EN

O VL1

1

A

B

C

234

V

L

O VL3

O VCC4

I VCC1

O VL2

GND

I VCC3

I VCC2

V

CC

14

13

12

11

10

9

8

1

2

3

4

5

6

7

I V

CC

1

I V

CC

2

V

CC

GNDN.C.

V

L

O VL2

O V

L

1

MAX3027

MAX3027

I VCC3

O V

CC

4

ENEN

I V

L

4

O V

L

3

TSSOP

UCSP

(BUMPS ON BOTTOM OF DIE)

O VL4

EN

O VL1

1

A

B

C

234

V

L

O VL3

I VCC4

I VCC1

O VL2

GND

I VCC3

I VCC2

V

CC

14

13

12

11

10

9

8

1

2

3

4

5

6

7

I V

CC

1

I V

CC

2

V

CC

GNDN.C.

V

L

O VL2

O V

L

1

MAX3028

MAX3028

I VCC3

I V

CC

4

ENEN

O V

L

4

O V

L

3

TSSOP

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

______________________________________________________________________________________ 15

Ordering Information/Selector Guide (continued)

PART

TEMP RANGE

PIN-PACKAGE

PACKAGE

CODE

TOP

NUMBER OF

V

L

→ V

CC

Number of

V

CC

→ V

L

ENENMAX13013EBT-T

B6-1

11

—

MAX13014EKA

8 SOT23 —

22

—

MAX13014EBL-T

B9-2

22

—

MAX13015EKA*

8 SOT23 —

20

—

MAX13015EBL-T*

B9-2

20

—

MAX13016EKA*

8 SOT23 —

11

—

MAX13016EBL-T*

B9-2

11

—

MAX13017EKA*

8 SOT23 —

02

—

MAX13017EBL-T*

B9-2

02

—

MAX3023EUD

14 TSSOP — — 4 4

✓

MAX3023EBC-T

B12-1

44

—

MAX3024EUD*

14 TSSOP — — 4 0

✓

MAX3024EBC-T*

B12-1

40

—

MAX3025EUD*

14 TSSOP — — 3 1

✓

MAX3025EBC-T*

B12-1

31

—

MAX3026EUD*

14 TSSOP — — 2 2

✓

MAX3026EBC-T*

B12-1

22

—

MAX3027EUD*

14 TSSOP — — 1 3

✓

MAX3027EBC-T*

B12-1

13

—

MAX3028EUD*

14 TSSOP — — 0 4

✓

MAX3028EBC-T*

B12-1

04

—

Chip Information

TRANSISTOR COUNT:

MAX13013: 261

MAX13014–MAX13017: 444

MAX3023–MAX3028: 791

PROCESS: BiCMOS

*Future product—contact factory for availability.

-40°C to +85°C 3 x 2 UCSP-6

-40°C to +85°C

-40°C to +85°C 3 x 3 UCSP-9

-40°C to +85°C

-40°C to +85°C 3 x 3 UCSP-9

-40°C to +85°C

-40°C to +85°C 3 x 3 UCSP-9

-40°C to +85°C

-40°C to +85°C 3 x 3 UCSP-9

-40°C to +85°C

-40°C to +85°C 4 x 3 UCSP-12

-40°C to +85°C

-40°C to +85°C 4 x 3 UCSP-12

-40°C to +85°C

-40°C to +85°C 4 x 3 UCSP-12

-40°C to +85°C

-40°C to +85°C 4 x 3 UCSP-12

-40°C to +85°C

-40°C to +85°C 4 x 3 UCSP-12

-40°C to +85°C

-40°C to +85°C 4 x 3 UCSP-12

MARK

ADF

AEKB

AEN

AEKC

AEO

AEKD

AEP

AEKE

AEQ

ABW

ABX

ABY

ABZ

ACA

ACB

TRANSLATORS

TRANSLATORS

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

16 ______________________________________________________________________________________

Package Information

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

SC70, 6L.EPS

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

______________________________________________________________________________________ 17

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

6L, UCSP.EPS

G

1

1

21-0097

PACKAGE OUTLINE, 3x2 UCSP

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

18 ______________________________________________________________________________________

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

SOT23, 8L .EPS

REV.DOCUMENT CONTROL NO.APPROVAL

PROPRIETARY INFORMATION

TITLE:

3.002.60E

C

E1

E

BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.

8. MEETS JEDEC MO178.

8∞

0.60

1.75

0.30

L2

0∞

e1

e

L

1.50E1

0.65 BSC.

1.95 REF.

0.25 BSC.

GAUGE PLANE

SEATING PLANE C

C

L

PIN 1

I.D. DOT

(SEE NOTE 6)

L

C

L

C

A2

e1

D

DETAIL "A"

5. COPLANARITY 4 MILS. MAX.

NOTE:

7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD

6. PIN 1 I.D. DOT IS 0.3 MM ÿ MIN. LOCATED ABOVE PIN 1.

4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.

3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.

HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.

2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF

1. ALL DIMENSIONS ARE IN MILLIMETERS.

L2

L

A1

A

0.45

1.30

0.15

1.45

MAX

0.28b

0.90A2

0.00A1

0.90

A

MIN

SYMBOL

3.00

0.20

2.80D

0.09

C

SEE DETAIL "A"

L

C

b

e

D

1

21-0078

1

PACKAGE OUTLINE, SOT-23, 8L BODY

0

0

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

______________________________________________________________________________________ 19

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

9LUCSP, 3x3.EPS

I

1

1

21-0093

PACKAGE OUTLINE, 3x3 UCSP

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators

20 ______________________________________________________________________________________

TSSOP4.40mm.EPS

MAX13013–MAX13017/MAX3023–MAX3028

+1.2V to +3.6V, 0.1µA, 100Mbps,

Single-/Dual-/Quad-Level Translators

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21

© 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

12L, UCSP 4x3.EPS

F

1

1

21-0104

PACKAGE OUTLINE, 4x3 UCSP