The MAX2042 single, high-linearity upconversion/downconversion mixer provides +36dBm IIP3, 7.3dB noise figure, and 7.2dB conversion loss for 2000MHz to 3000MHz
WCS, LTE, WiMAXK, and MMDS wireless infrastructure
applications. With a wide LO frequency range of 1800MHz
to 2800MHz, this particular mixer is ideal for low-side LO
injection receiver and transmitter architectures. High-side
LO injection is supported by the MAX2042A, which is pinpin and functionally compatible with the MAX2042.
In addition to offering excellent linearity and noise
performance, the MAX2042 also yields a high level of
component integration. This device includes a doublebalanced passive mixer core, an LO buffer, and on-chip
baluns that allow for single-ended RF and LO inputs.
The MAX2042 requires a nominal LO drive of 0dBm,
and supply current is typically 138mA at VCC = +5.0V or
120mA at VCC = +3.3V.
The MAX2042 is pin compatible with the MAX2042A
2000MHz to 3900MHz mixer. The device is also pin similar with the MAX2029/MAX2031 650MHz to 1000MHz
mixers, the MAX2039/MAX2041 1700MHz to 3000MHz
mixers, and the MAX2044/MAX2044A 3000MHz to
4000MHz mixers, making this entire family of up/downconverters ideal for applications where a common PCB
layout is used for multiple frequency bands.
The MAX2042 is available in a compact 20-pin thin QFN
(5mm x 5mm) package with an exposed pad. Electrical
performance is guaranteed over the extended -40NC to
+85NC temperature range.
Applications
2.3GHz WCS Base Stations
2.5GHz WiMAX and LTE Base Stations
2.7GHz MMDS Base Stations
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Ordering Information
PARTTEMP RANGEPIN-PACKAGE
MAX2042ETP+-40NC to +85NC20 Thin QFN-EP*
MAX2042ETP+T-40NC to +85NC20 Thin QFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
Features
S2000MHz to 3000MHz RF Frequency Range
S1800MHz to 2800MHz LO Frequency Range
S50MHz to 500MHz IF Frequency Range
S7.2dB Conversion Loss
S7.3dB Noise Figure
S+36dBm Typical IIP3
S+23.4dBm Typical Input 1dB Compression Point
S70dBc Typical 2RF-2LO Spurious Rejection at PRF
= -10dBm
SIntegrated LO Buffer
SIntegrated RF and LO Baluns for Single-Ended
Inputs
SLow -3dBm to +3dBm LO Drive
SPin Compatible with the MAX2042A 2000MHz to
3900MHz High-Side LO Injection Mixer
SPin Similar with the MAX2029/MAX2031 650MHz
to 1000MHz Mixers, MAX2039/MAX2041 1700MHz
to 3000MHz Mixers, and MAX2044/MAX2044A
3000MHz to 4000MHz Mixers
SSingle +5.0V or +3.3V Supply
SExternal Current-Setting Resistor Provides Option
for Operating Device in Reduced-Power/ReducedPerformance Mode
(Note 4) ........................................................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
MAX2042
Note 1: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 2: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = +4.75V to +5.25V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical
values are at VCC = +5.0V, TC = +25NC, all parameters are production tested.)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Supply VoltageV
Supply CurrentI
CC
CC
4.755.05.25V
138150mA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = +3.0V to +3.6V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical values
are at VCC = +3.3V, TC = +25NC, all parameters are production tested.)
Using M/A-Com MABAES0029 1:1
transformer as defined in the Typical Application Circuit, IF matching components
affect the IF frequency range (Notes 5, 6)
20003000MHz
50500MHz
SiGe High-Linearity, 2000MHz to 3000MHz
Upconversion/Downconversion Mixer with LO Buffer
+5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION)
(Typical Application Circuit with tuning elements outlined in Table 1, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50I
sources, PLO = -3dBm to +3dBm, PRF = 0dBm, fRF = 2300MHz to 2900MHz, fIF = 300MHz, fLO = 2000MHz to 2600MHz, fRF > fLO,
TC = -40NC to +85NC. Typical values are for TC = +25NC, VCC = +5.0V, PRF = 0dBm, PLO = 0dBm, fRF = 2300MHz, fLO = 2300MHz,
fIF = 300MHz. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Small-Signal Conversion LossLC
Loss Variation vs. FrequencyDLC
Conversion Loss Temperature
Coefficient
Single Sideband Noise FigureNFSSBNo blockers present7.3dB
Noise Figure Temperature
Coefficient
Noise Figure Under BlockingNFB
Input 1dB Compression PointIP1dB
Third-Order Input Intercept PointIIP3
IIP3 Variation with TC
2RF - 2LO Spur Rejection2 x 2
3RF - 3LO Spur Rejection3 x 3
RF Input Return LossRLRF
LO Input Return LossRLLO
TCCLTC = -40NC to +85NC0.0071dB/NC
TCNF
fRF = 2300MHz to 2900MHz, TC = +25NC
(Note 8)
fRF = 2305MHz to 2360MHz0.15
fRF = 2500MHz to 2570MHz0.15
fRF = 2570MHz to 2620MHz0.15
fRF = 2500MHz to 2690MHz0.15
fRF = 2700MHz to 2900MHz0.20
fRF = 2300MHz to 2900MHz, single sideband, no blockers present,
TC = -40NC to +85NC
+3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) (continued)
(Typical Application Circuit with tuning elements outlined in Table 1, RF and LO ports are driven from 50I sources. Typical values
are for TC = +25NC, VCC = +3.3V, PRF = 0dBm, PLO = 0dBm, fRF = 2600MHz, fLO = 2300MHz, fIF = 300MHz, unless otherwise
noted.) (Note 7)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
RF Input Return LossRLRF
LO Input Return LossRLLO
IF Output ImpedanceZIF
IF Output Return LossRLIF
Minimum RF-to-IF IsolationfRF = 2300MHz to 2900MHz, PLO = +3dBm36dB
Maximum LO Leakage at RF PortfLO = 1800MHz to 2800MHz, PLO = +3dBm-24.5dBm
Maximum 2LO Leakage at RF PortfLO = 1800MHz to 2800MHz, PLO = +3dBm-24dBm
Maximum LO Leakage at IF PortfLO = 1800MHz to 2800MHz, PLO = +3dBm-20dBm
LO on and IF terminated into a matched
impedance
RF and IF terminated into a matched
impedance
Nominal differential impedance at the IC’s
IF outputs
RF terminated into 50I, LO driven by
50I source, IF transformed to 50I using
external components shown in the Typical Application Circuit
15dB
12dB
50
18dB
I
MAX2042
+5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS
(UPCONVERTER OPERATION)
(Typical Application Circuit with tuning elements outlined in Table 2, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50I
sources, PLO = -3dBm to +3dBm, PIF = 0dBm, fRF = 2300MHz to 2900MHz, fIF =200MHz, fLO = 2100MHz to 2700MHz, fRF > fLO,
TC = -40NC to +85NC. Typical values are for TC = +25NC, VCC = +5.0V, PIF = 0dBm, PLO = 0dBm, fRF = 2600MHz, fLO = 2400MHz,
fIF = 200MHz. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7)
Note 5: Not production tested.
Note 6: Operation outside this range is possible, but with degraded performance of some parameters. See the Typical Operating
Characteristics.
Note 7: All limits reflect losses of external components, including a 0.5dB loss at fIF = 300MHz due to the 1:1 impedance trans-
former. Output measurements were taken at IF outputs of the Typical Application Circuit.
Note 8: 100% production tested for functional performance.
Note 9: Measured with external LO source noise filtered so that the noise floor is -174dBm/Hz. This specification reflects the effects
of all SNR degradations in the mixer including the LO noise, as defined in Application Note 2021: Specifications and
Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers.
Note 10: Maximum reliable continuous input power applied to the RF port of this device is +20dBm from a 50I source.
9, 15GNDGround. Not internally connected. Ground these pins or leave unconnected.
11LO
16, 20GNDGround. Connect all ground pins and the exposed pad (EP) together.
18, 19IF-, IF+Mixer Differential IF Output/Input
—EP
GND
Power Supply. Bypass to GND with 0.01FF capacitors as close as possible to the pin.
Single-Ended 50I RF Input. Internally matched and DC shorted to GND through a balun. Provide
a DC-blocking capacitor if required. Capacitor also provides some RF match tuning.
Ground. Internally connected to the exposed pad. Connect all ground pins and the exposed pad
(EP) together.
LO Amplifier Bias Control. Output bias resistor for the LO buffer. Connect a 698IQ1% resistor (nominal bias condition) from LOBIAS to ground. The maximum current seen by this resistor is 3mA.
Local Oscillator Input. This input is internally matched to 50I. Requires an input DC-blocking
capacitor. Capacitor also provides some LO match tuning.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses
multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These
multiple via grounds are also required to achieve the noted RF performance.
SiGe High-Linearity, 2000MHz to 3000MHz
Upconversion/Downconversion Mixer with LO Buffer
Detailed Description
When used as a low-side LO injection mixer in the
2300MHz to 2900MHz band, the MAX2042 provides
+36dBm of IIP3, with typical noise figure and conversion loss values of only 7.3dB and 7.2dB, respectively.
The integrated baluns and matching circuitry allow for
50I single-ended interfaces to the RF and the LO ports.
The integrated LO buffer provides a high drive level to
MAX2042
the mixer core, reducing the LO drive required at the
MAX2042’s input to a -3dBm to +3dBm range. The IF
port incorporates a differential interface, which is ideal
for providing enhanced 2RF-2LO performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in WCS, LTE, WiMAX, and MMDS
base stations. The MAX2042 is specified to operate over
an RF input range of 2000MHz to 3000MHz, an LO range
of 1800MHz to 2800MHz, and an IF range of 50MHz to
500MHz. The external IF transformer sets the lower frequency range (see the Typical Operating Characteristics
for details). Operation beyond these ranges is possible
(see the Typical Operating Characteristics for additional
information).
RF Interface and Balun
The MAX2042 RF input provides a 50I match when
combined with a series DC-blocking capacitor. This
DC-blocking capacitor required as the input is internally
DC shorted to ground through the on-chip balun. When
using an 8.2pF DC-blocking capacitor, the RF port input
return loss is typically 15dB over the RF frequency range
of 2500MHz to 2900MHz.
LO Inputs, Buffer, and Balun
The MAX2042 is optimized for low-side LO injection
applications with an 1800MHz to 2800MHz LO frequency
range. The LO input is internally matched to 50I, requiring only a 2pF DC-blocking capacitor. A two-stage
internal LO buffer allows for a -3dBm to +3dBm LO input
power range. The on-chip low-loss balun, along with an
LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the
IF outputs are integrated on-chip.
High-Linearity Mixer
The core of the MAX2042 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer.
IIP3, 2RF-2LO rejection, and noise-figure performance
are typically +36dBm, 70dBc, and 7.3dB, respectively.
Differential IF Interface
The MAX2042 has an IF frequency range of 50MHz to
500MHz, where the low-end frequency depends on the
frequency response of the external IF components.
The MAX2042’s differential ports are ideal for providing enhanced 2RF-2LO performance. The user can use
a differential IF amplifier or SAW filter on the mixer IF
port, but a DC block is required on both IF+/IF- ports to
keep external DC from entering the IF ports of the mixer.
Typical applications typically use a 1:1 transformer such
as the MABAES0029 to transform the 50I differential
interface to a 50I single-ended interface. The loss of
this transformer is included in the data presented in this
data sheet. In addition, the IF interface directly supports
single-ended AC-coupled signals into or out of IF+ by
shorting IF- to ground, and a 1kI resistor from IF+ to
ground.
Applications Information
Input and Output Matching
The RF input provides a 50I match when combined with
a series DC-blocking capacitor. Use an 8.2pF capacitor value for RF frequencies ranging from 2000MHz to
3000MHz. The LO input is internally matched to 50I;
use a 2pF DC-blocking capacitor to cover operations
spanning the 1800MHz to 2800MHz range. The IF output
impedance is 50I (differential). For evaluation, an external low-loss 1:1 (impedance ratio) balun transforms this
impedance down to a 50I single-ended output (see the
Typical Application Circuit).
Reduced-Power Mode
The MAX2042 has one pin (LOBIAS) that allows an external resistor to set the internal bias current. A nominal
value for this resistor is shown in Tables 1 and 2. Larger
value resistors can be used to reduce power dissipation at the expense of some performance loss. See the
Typical Operating Characteristics to evaluate the power
vs. performance tradeoff. If Q1% resistors are not readily
available, substitute with Q5% resistors.
Significant reductions in power consumption can also be
realized by operating the mixer with an optional supply
voltage of +3.3V. Doing so reduces the overall power
consumption by up to 43%. See the +3.3V Supply AC Electrical Characteristics table and the relevant +3.3V
curves in the Typical Operating Characteristics section
to evaluate the power vs. performance tradeoffs.
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground pin traces
directly to the exposed pad under the package. The PCB
exposed pad MUST be connected to the ground plane
of the PCB. It is suggested that multiple vias be used to
connect this pad to the lower-level ground planes. This
method provides a good RF/thermal conduction path for
the device. Solder the exposed pad on the bottom of the
device package to the PCB. The MAX2042 evaluation
kit can be used as a reference for board layout. Gerber
files are available upon request at www.maxim-ic.com.
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin with the
capacitors shown in the Typical Application Circuit and
see Tables 1 and 2.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX2042’s 20-pin thin QFN
package provides a low thermal-resistance path to the
die. It is important that the PCB on which the MAX2042
is mounted be designed to conduct heat from the EP. In
addition, provide the EP with a low-inductance path to
electrical ground. The EP MUST be soldered to a ground
plane on the PCB, either directly or through an array of
plated via holes.
Table 1. Downconverter Mode Component Values
DESIGNATIONQTYDESCRIPTIONCOMPONENT SUPPLIER
C118.2pF microwave capacitor (0402)Murata Electronics North America, Inc.
C2, C6, C8, C114
C3, C90Not installed, capacitors—
C50Not installed, capacitor—
C1012pF microwave capacitor (0402)Murata Electronics North America, Inc.
R11
T111:1 IF balun MABAES0029M/A-Com, Inc.
U11MAX2042 IC (20 TQFN)Maxim Integrated Products, Inc.
0.01FF microwave capacitors (0402)
698IQ1% resistor (0402)
Murata Electronics North America, Inc.
Digi-Key Corp.
Power-Supply Bypassing
MAX2042
Table 2. Upconverter Mode Component Values
DESIGNATIONQTYDESCRIPTIONCOMPONENT SUPPLIER
C118.2pF microwave capacitor (0402)Murata Electronics North America, Inc.
C2, C6, C8, C114
C3, C90Not installed, capacitors—
C50Not installed, capacitor—
C1012pF microwave capacitor (0402)Murata Electronics North America, Inc.
R11
T111:1 IF balun MABAES0029M/A-Com, Inc.
U11MAX2042 IC (20 TQFN)Maxim Integrated Products, Inc.
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
PACKAGE TYPEPACKAGE CODEDOCUMENT NO.
20 TQFN-EPT2055+3
21-0140
MAX2042
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 27