The MAX2042 single, high-linearity upconversion/downconversion mixer provides +36dBm IIP3, 7.3dB noise figure, and 7.2dB conversion loss for 2000MHz to 3000MHz
WCS, LTE, WiMAXK, and MMDS wireless infrastructure
applications. With a wide LO frequency range of 1800MHz
to 2800MHz, this particular mixer is ideal for low-side LO
injection receiver and transmitter architectures. High-side
LO injection is supported by the MAX2042A, which is pinpin and functionally compatible with the MAX2042.
In addition to offering excellent linearity and noise
performance, the MAX2042 also yields a high level of
component integration. This device includes a doublebalanced passive mixer core, an LO buffer, and on-chip
baluns that allow for single-ended RF and LO inputs.
The MAX2042 requires a nominal LO drive of 0dBm,
and supply current is typically 138mA at VCC = +5.0V or
120mA at VCC = +3.3V.
The MAX2042 is pin compatible with the MAX2042A
2000MHz to 3900MHz mixer. The device is also pin similar with the MAX2029/MAX2031 650MHz to 1000MHz
mixers, the MAX2039/MAX2041 1700MHz to 3000MHz
mixers, and the MAX2044/MAX2044A 3000MHz to
4000MHz mixers, making this entire family of up/downconverters ideal for applications where a common PCB
layout is used for multiple frequency bands.
The MAX2042 is available in a compact 20-pin thin QFN
(5mm x 5mm) package with an exposed pad. Electrical
performance is guaranteed over the extended -40NC to
+85NC temperature range.
Applications
2.3GHz WCS Base Stations
2.5GHz WiMAX and LTE Base Stations
2.7GHz MMDS Base Stations
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Ordering Information
PARTTEMP RANGEPIN-PACKAGE
MAX2042ETP+-40NC to +85NC20 Thin QFN-EP*
MAX2042ETP+T-40NC to +85NC20 Thin QFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
Features
S2000MHz to 3000MHz RF Frequency Range
S1800MHz to 2800MHz LO Frequency Range
S50MHz to 500MHz IF Frequency Range
S7.2dB Conversion Loss
S7.3dB Noise Figure
S+36dBm Typical IIP3
S+23.4dBm Typical Input 1dB Compression Point
S70dBc Typical 2RF-2LO Spurious Rejection at PRF
= -10dBm
SIntegrated LO Buffer
SIntegrated RF and LO Baluns for Single-Ended
Inputs
SLow -3dBm to +3dBm LO Drive
SPin Compatible with the MAX2042A 2000MHz to
3900MHz High-Side LO Injection Mixer
SPin Similar with the MAX2029/MAX2031 650MHz
to 1000MHz Mixers, MAX2039/MAX2041 1700MHz
to 3000MHz Mixers, and MAX2044/MAX2044A
3000MHz to 4000MHz Mixers
SSingle +5.0V or +3.3V Supply
SExternal Current-Setting Resistor Provides Option
for Operating Device in Reduced-Power/ReducedPerformance Mode
(Note 4) ........................................................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
MAX2042
Note 1: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 2: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = +4.75V to +5.25V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical
values are at VCC = +5.0V, TC = +25NC, all parameters are production tested.)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Supply VoltageV
Supply CurrentI
CC
CC
4.755.05.25V
138150mA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = +3.0V to +3.6V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical values
are at VCC = +3.3V, TC = +25NC, all parameters are production tested.)
Using M/A-Com MABAES0029 1:1
transformer as defined in the Typical Application Circuit, IF matching components
affect the IF frequency range (Notes 5, 6)
20003000MHz
50500MHz
SiGe High-Linearity, 2000MHz to 3000MHz
Upconversion/Downconversion Mixer with LO Buffer
+5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION)
(Typical Application Circuit with tuning elements outlined in Table 1, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50I
sources, PLO = -3dBm to +3dBm, PRF = 0dBm, fRF = 2300MHz to 2900MHz, fIF = 300MHz, fLO = 2000MHz to 2600MHz, fRF > fLO,
TC = -40NC to +85NC. Typical values are for TC = +25NC, VCC = +5.0V, PRF = 0dBm, PLO = 0dBm, fRF = 2300MHz, fLO = 2300MHz,
fIF = 300MHz. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Small-Signal Conversion LossLC
Loss Variation vs. FrequencyDLC
Conversion Loss Temperature
Coefficient
Single Sideband Noise FigureNFSSBNo blockers present7.3dB
Noise Figure Temperature
Coefficient
Noise Figure Under BlockingNFB
Input 1dB Compression PointIP1dB
Third-Order Input Intercept PointIIP3
IIP3 Variation with TC
2RF - 2LO Spur Rejection2 x 2
3RF - 3LO Spur Rejection3 x 3
RF Input Return LossRLRF
LO Input Return LossRLLO
TCCLTC = -40NC to +85NC0.0071dB/NC
TCNF
fRF = 2300MHz to 2900MHz, TC = +25NC
(Note 8)
fRF = 2305MHz to 2360MHz0.15
fRF = 2500MHz to 2570MHz0.15
fRF = 2570MHz to 2620MHz0.15
fRF = 2500MHz to 2690MHz0.15
fRF = 2700MHz to 2900MHz0.20
fRF = 2300MHz to 2900MHz, single sideband, no blockers present,
TC = -40NC to +85NC
+3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) (continued)
(Typical Application Circuit with tuning elements outlined in Table 1, RF and LO ports are driven from 50I sources. Typical values
are for TC = +25NC, VCC = +3.3V, PRF = 0dBm, PLO = 0dBm, fRF = 2600MHz, fLO = 2300MHz, fIF = 300MHz, unless otherwise
noted.) (Note 7)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
RF Input Return LossRLRF
LO Input Return LossRLLO
IF Output ImpedanceZIF
IF Output Return LossRLIF
Minimum RF-to-IF IsolationfRF = 2300MHz to 2900MHz, PLO = +3dBm36dB
Maximum LO Leakage at RF PortfLO = 1800MHz to 2800MHz, PLO = +3dBm-24.5dBm
Maximum 2LO Leakage at RF PortfLO = 1800MHz to 2800MHz, PLO = +3dBm-24dBm
Maximum LO Leakage at IF PortfLO = 1800MHz to 2800MHz, PLO = +3dBm-20dBm
LO on and IF terminated into a matched
impedance
RF and IF terminated into a matched
impedance
Nominal differential impedance at the IC’s
IF outputs
RF terminated into 50I, LO driven by
50I source, IF transformed to 50I using
external components shown in the Typical Application Circuit
15dB
12dB
50
18dB
I
MAX2042
+5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS
(UPCONVERTER OPERATION)
(Typical Application Circuit with tuning elements outlined in Table 2, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50I
sources, PLO = -3dBm to +3dBm, PIF = 0dBm, fRF = 2300MHz to 2900MHz, fIF =200MHz, fLO = 2100MHz to 2700MHz, fRF > fLO,
TC = -40NC to +85NC. Typical values are for TC = +25NC, VCC = +5.0V, PIF = 0dBm, PLO = 0dBm, fRF = 2600MHz, fLO = 2400MHz,
fIF = 200MHz. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7)
Note 5: Not production tested.
Note 6: Operation outside this range is possible, but with degraded performance of some parameters. See the Typical Operating
Characteristics.
Note 7: All limits reflect losses of external components, including a 0.5dB loss at fIF = 300MHz due to the 1:1 impedance trans-
former. Output measurements were taken at IF outputs of the Typical Application Circuit.
Note 8: 100% production tested for functional performance.
Note 9: Measured with external LO source noise filtered so that the noise floor is -174dBm/Hz. This specification reflects the effects
of all SNR degradations in the mixer including the LO noise, as defined in Application Note 2021: Specifications and
Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers.
Note 10: Maximum reliable continuous input power applied to the RF port of this device is +20dBm from a 50I source.