The MAX19996 single, high-linearity downconversion
mixer provides 8.7dB conversion gain, +24.5dBm IIP3,
and 9.6dB noise figure for 2000MHz to 3000MHz WCS,
LTE, WiMAX™, and MMDS wireless infrastructure applications. With an 1800MHz to 2550MHz LO frequency
range, this particular mixer is ideal for low-side LO
injection receiver architectures. High-side LO injection
is supported by the MAX19996A, which is pin-for-pin
and functionally compatible with the MAX19996.
In addition to offering excellent linearity and noise performance, the MAX19996 also yields a high level of component integration. This device includes a double-balanced
passive mixer core, an IF amplifier, and an LO buffer.
On-chip baluns are also integrated to allow for singleended RF and LO inputs. The MAX19996 requires a
nominal LO drive of 0dBm, and supply current is typically 230mA at V
CC
= +5.0V or 149.5mA at VCC= +3.3V.
The MAX19996 is pin compatible with the MAX19996A
2300MHz to 3900MHz mixer. The device is also pin similar with the MAX9984/MAX9986 400MHz to 1000MHz
mixers and the MAX9993/MAX9994/MAX9996 1700MHz
to 2200MHz mixers, making this entire family of downconverters ideal for applications where a common PCB
layout is used for multiple frequency bands.
The MAX19996 is available in a compact 5mm x 5mm,
20-pin thin QFN lead-free package with an exposed
pad. Electrical performance is guaranteed over the
extended -40°C to +85°C temperature range.
Applications
2.3GHz WCS Base Stations
2.5GHz WiMAX and LTE Base Stations
2.7GHz MMDS Base Stations
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Features
♦ 2000MHz to 3000MHz RF Frequency Range
♦ 1800MHz to 2550MHz LO Frequency Range
♦ 50MHz to 500MHz IF Frequency Range
♦ 8.7dB Typical Conversion Gain
♦ 9.6dB Typical Noise Figure
♦ +24.5dBm Typical Input IP3
♦ +11dBm Typical Input 1dB Compression Point
♦ 69dBc Typical 2RF-2LO Spurious Rejection at
P
RF
= -10dBm
♦ Integrated LO Buffer
♦ Integrated RF and LO Baluns for Single-Ended
Inputs
♦ Low -3dBm to +3dBm LO Drive
♦ Pin Compatible with the MAX19996A 2300MHz to
3900MHz Mixer
♦ Pin Similar with the MAX9993/MAX9994/
MAX9996 1700MHz to 2200MHz Mixers and
MAX9984/MAX9986 400MHz to 1000MHz Mixers
♦ Single +5.0V or +3.3V Supply
♦ External Current-Setting Resistors Provide Option
for Operating Device in Reduced-Power/ReducedPerformance Mode
, VCC= +3.0V to +3.6V, no input AC signals. TC= -40°C to +85°C, unless otherwise noted. Typical values
are at V
CC
= +3.3V, TC= +25°C, parameters are guaranteed by design and not production tested, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, LO, IFBIAS,
LEXT to GND ..........................................-0.3V to (V
CC
+ 0.3V)
RF, LO Input Power ........................................................+12dBm
RF, LO Current
(RF and LO is DC shorted to GND through a balun) ......50mA
Continuous Power Dissipation (Note 1) ..............................5.0W
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, VCC= +4.75V to +5.25V, no input AC signals. TC= -40°C to +85°C, unless otherwise noted. Typical val-
ues are at V
CC
= +5.0V, TC= +25°C, all parameters are production tested.) (Note 6)
RECOMMENDED AC OPERATING CONDITIONS
Note 1: Based on junction temperature TJ= TC+ (θJCx VCCx ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T
J
= TA+ (θJAx VCCx ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
Note 4: T
C
is the temperature on the exposed pad of the package. TAis the ambient temperature of the device and PCB.
Supply VoltageV
Supply CurrentI
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
CC
CC
4.7555.25V
230245mA
Supply VoltageV
Supply CurrentI
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
CC
CC
Total supply current, VCC = +3.3V149.5mA
3.03.33.6V
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
RF Frequencyf
LO Frequencyf
IF Frequencyf
LO Drive LevelP
RF
LO
IF
LO
(Note 7)20003000MHz
(Note 7)18002550MHz
U si ng M i ni - C i r cui ts TC 4- 1W- 17 4:1 tr ansfor m er
as d efi ned i n the Typ i cal Ap p l i cati on C i r cui t, IF
m atchi ng com p onents affect the IF fr eq uency
r ang e ( N ote 7)
U si ng al ter nati ve M i ni - C i r cui ts TC 4- 1W- 7A
4:1 transformer, IF matching components
affect the IF frequency range (Note 7)
Maximum LO Leakage at RF PortfLO = 1900MHz to 2500MHz, PLO = +3dBm-22.7dBm
M axi m um 2LO Leakag e at RF P or tf
Maximum LO Leakage at IF Port
RF terminated into 50Ω,
LO driven by 50Ω
source, IF transformed
to 50Ω using external
components shown in
the Typical ApplicationCircuit. See the IF Port
Return Loss vs. IF
Frequency graph in the
Typical Operating
Characteristics for
performance vs.
inductor values
f
= 2300MHz to 2700MHz, PLO = +3dBm
RF
(Note 5)
= 1900MHz to 2500MHz, P
LO
f
= 1900MHz to 2500MHz, P
LO
(Note 5)
fIF = 450MHz,
L1 = L2 = 120nH
fIF = 350MHz,
L1 = L2 = 270nH
= 300MHz,
f
IF
L1 = L2 = 470nH
= +3dBm-21dBm
LO
= +3dBm
LO
25
25
25
34dB
-27.5dBm
Conversion Power GainG
Conversion Power Gain Variation
vs. Frequency
Gain Variation Over TemperatureTC
Input 1dB Compression PointIP
Third-Order Input Intercept PointIIP3
Third-Order Input Intercept
Variation Over Temperature
Noise FigureNF
Noise Figure Temperature
Coefficient
2RF-2LO Spur Rejection2 x 2
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
8.6dB
0.1dB
19.8dBm
±0.5dB
0.017dB/°C
∆G
TC
C
C
G
1dB
SSB
NF
fRF = 2300MHz to 2800MHz for any
100MHz band
TC = -40°C to +85°C-0.012dB/°C
(Note 8)7.5dBm
f
= 2500MHz, f
RF1
2200MHz, P
f
= 2500M H z, f
RF1
2200M H z, P
S i ng l e si d eb and , no b l ocker s p r esent ( N ote 9) 9.6dB
Note 5:100% production tested for functional performance.
Note 6:All limits reflect losses of external components, including a 0.8dB loss at f
IF
= 300MHz due to the 4:1 impedance trans-
former. Output measurements were taken at IF outputs of the
Typical Application Circuit
.
Note 7:Not production tested. Operation outside this range is possible, but with degraded performance of some parameters. See
the
Typical Operating Characteristics
.
Note 8:Maximum reliable continuous input power applied to the RF or IF port of this device is +12dBm from a 50Ω source.
Note 9:Measured with external LO source noise filtered so that the noise floor is -174dBm/Hz. This specification reflects the
effects of all SNR degradations in the mixer including the LO noise, as defined in Application Note 2021:
Specifications
and Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers
.
+3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(
Typical Application Circuit
, RF and LO ports are driven from 50Ω sources, Typical values are at VCC= +3.3V, PRF= -5dBm,