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MAX17480
User Manual
48 pgs1.01 Mb0

Rainbow Electronics MAX17480 User Manual

General Description
The MAX17480 is a triple-output, step-down, fixed­frequency controller for AMD’s serial VID interface (SVI) CPU and northbridge (NB) core supplies. The MAX17480 consists of two high-current SMPSs for the CPU cores and one 4A internal switch SMPS for the NB core. The two CPU core SMPSs run 180° out-of-phase for true interleaved operation, minimizing input capacitance. The 4A internal switch SMPS runs at twice the switching frequency of the core SMPS, reducing the size of the external components.
The MAX17480 is fully AMD SVI compliant. Output volt­ages are dynamically changed through a 2-wire SVI, allowing the SMPSs to be individually programmed to different voltages. A slew-rate controller allows con­trolled transitions between VID codes and controlled soft-start. SVI also allows each SMPS to be individually set into a low-power pulse-skipping state.
Transient phase repeat improves the response of the fixed-frequency architecture, reducing the total output capacitance for the CPU core. A thermistor-based tem­perature sensor provides a programmable thermal-fault output (VRHOT).
The MAX17480 includes output overvoltage protection (OVP), undervoltage protection (UVP), and thermal pro­tection. When any of these protection features detect a fault, the controller shuts down. True differential current sensing improves current limit and load-line accuracy. The MAX17480 has an adjustable switching frequency, allowing 100kHz to 600kHz operation per core SMPS, and twice that for the NB SMPS.
Applications
Mobile AMD SVI Core Supplies
Multiphase CPU Core Supplies
Voltage-Positioned, Step-Down Converters
Notebook/Desktop Computers
Features
o Dual-Output Fixed-Frequency Core Supply
Controller
Split or Combinable Outputs Detected at Power-Up
Dynamic Phase Selection Optimizes Active/Sleep Efficiency
Transient Phase Repeat Reduces Output Capacitance
True Out-of-Phase Operation Reduces Input Capacitance
Programmable AC and DC Droop Accurate Current Balance and Current Limit Integrated Drivers for Large Synchronous-
Rectifier MOSFETs Programmable 100kHz to 600kHz Switching
Frequency 4V to 26V Battery Input Voltage Range
o 4A Internal Switch Northbridge SMPS
2.7V to 5.5V Input Voltage Range 2x Programmable Switching Frequency 75mΩ/40mΩ Power Switches
o ±0.5% V
OUT
Accuracy over Line, Load, and
Temperature
o AMD SVI-Compliant Serial Interface with
Switchable Address
o 7-Bit On-Board DAC: 0 to +1.550V Output Adjust
Range
o Integrated Boost Switches o Adjustable Slew-Rate Control o Power-Good (PWRGD) and Thermal-Fault
(VRHOT) Outputs
o System Power-OK (PGD_IN) Input o Overvoltage, Undervoltage, and Thermal-Fault
Protection
o Voltage Soft-Startup and Passive Shutdown o < 1µA Typical Shutdown Current
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-4443; Rev 0; 2/09
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
PART TEMP RANGE PIN-PACKAGE
MAX17480GTL+ -40°C to +105°C 40 TQFN-EP*
+
Denotes a lead(Pb)-free/RoHS-compliant package.
*
EP = Exposed pad.
Pin Configuration appears at end of data sheet.
MAX17480
AMD 2-/3-Output Mobile Serial VID Controller
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(Note 1)
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
V
DD,VIN3,VCC
, V
DDIO
to AGND ..............................-0.3V to +6V
PWRGD to AGND .....................................................-0.3V to +6V
SHDN to AGND ........................................................-0.3V to +6V
GNDS1, GNDS2, THRM, VRHOT to AGND..............-0.3V to +6V
CSP_, CSN_, ILIM12 to AGND .................................-0.3V to +6V
SVC, SVD, PGD_IN to AGND ...................................-0.3V to +6V
FBDC_, FBAC_, OUT3 to AGND ..............................-0.3V to +6V
OSC, TIME, OPTION, ILIM3 to AGND........-0.3V to (V
CC
+ 0.3V)
BST1, BST2 to AGND .............................................-0.3V to +36V
BST1, BST2 to V
DD
.................................................-0.3V to +30V
BST3 to AGND...................................(V
DD
- 0.3V) to (V
LX3
+ 6V)
LX1 to BST1..............................................................-6V to +0.3V
LX3 RMS Current (Note 2) .....................................................±4A
LX2 to BST2..............................................................-6V to +0.3V
LX3 to PGND (Note 2) ..............................................-0.6V to +6V
DH1 to LX1 ..............................................-0.3V to (V
BST1
+ 0.3V)
DH2 to LX2 ..............................................-0.3V to (V
BST2
+ 0.3V)
DL1 to PGND..............................................-0.3V to (V
DD
+ 0.3V)
DL2 to PGND..............................................-0.3V to (V
DD
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
40-Pin TQFN (derate 22.2mW/°C above +70°C) .......1778mW
Operating Temperature Range .........................-40°C to +105°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Absolute Maximum Ratings measured with 20MHz scope bandwidth. Note 2: LX3 has clamp diodes to PGND and IN3. If continuous current is applied through these diodes, thermal limits must be observed.
INPUT SUPPLIES
Input Voltage Range
VCC Undervoltage-Lockout Threshold
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VIN Drain of external high-side MOSFET 4 26
V
BIAS
V
IN3
V
DDIO
V
UVLO
VCC, VDD 4.5 5.5
2.7 5.5
1.0 2.7
VCC rising, 50mV typical hysteresis, latched, UV fault
4.10 4.25 4.45 V
V
Fal ling edge, typica l h ysteresis = 1.1V,
VCC Power-On Reset Thresho ld
V
Undervoltage-Lockout
DDIO
Threshold
V
Undervoltage-Lockout
IN3
Threshold
Quie sc ent Supply Current (VCC) I
Quiescent Supply Currents (VDD) I
Quiescent Supply Current (V
Quiescent Supply Current (IN3) I
Shutdown Supply C urrent (VCC) SHDN = GND, TA = +25°C 0.01 1 µA
DDI O
) I
CC
DD
DDI O
IN3
faults cleared and DL_ forced high when
falls be low th is le vel
V
CC
V
rising, 100mV typical hysteresis,
DDIO
latched, UV fault
V
rising, 100mV typical hystere sis 2.5 2.6 2.7 V
IN3
Skip mode, FBDC_ and OUT3 forced above their regulation points
Skip mode, FBDC_ and OUT3 forced above their regulation points, T
10 25 µA
Skip mode, OUT3 forced above its regulation point
= +25°C
A
1.8 V
0.7 0.8 0.9 V
5 10 mA
0.01 1 µA
50 200 µA
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Shutdown Supply Currents (VDD) SHDN = GND, TA = +25°C 0.01 1 µA
Shutdown Supply C urrent (V
) SHDN = GND, TA = +25°C 0.01 1 µA
DDIO
Shutdown Supply C urrent (IN3) SHDN = GND, TA = +25°C 0.01 1 µA
INTERNAL DACs, SLEW RATE, PHAS E SHIFT
Measured at FBDC_ for the core SMPSs;
DAC codes from
0.8375V to 1.5500V
-0.5 +0.5 %
measured at OUT3 DC Output Voltage Accuracy (Note 1)
V
OUT
for the NB SMPS;
30% duty cycle, no
load, ILIM3 = V
= V
V
OUT3
DAC3
CC
+
,
12.5mV (Note 3)
DAC codes from
0.5000V to 0.8250V
DAC codes from
12.5mV to 0.4875V
-5 +5
mV
-10 +10
OUT3 Offset 12.5 mV
SMPS1 to SMPS2 Phase Shift SMPS2 starts after SMPS1
SMPS3 to SMPS1 and SMPS2 Phase Shift
Slew-Rate Accuracy
SMPS3 starts after SMPS1 or SMPS2 25 %
R
= 143k, SR = 6.25mV/µs -10 +10
During
transition
TIME
= 35.7k to 357k,
R
TIME
SR = 25mV/µs to 2.5mV/µs
50 %
180 Degrees
-15 +15
%
Startup 1 mV/µs
FBAC_ Input Bias Current I
FBDC_ Input Bias Current I
Switching Frequenc y Accuracy
_CSP_ = CSN_, TA = +25°C -3 +3 µA
FBAC
_TA = +25°C -250 +250 nA
FBDC
R
f
OSC1,
f
OSC2,
f
OSC3
= 143k (f
OSC
nominal, f
R
OSC
nominal, f
432k (f
f
OSC3
OSC3
= 71.4k (f
OSC3
OSC1
= 199kHz nominal)
= f
OSC1
= f
OSC2
= 300kHz
= 600kHz nominal)
OSC1
= f
OSC2
= 600kHz
= 1.2MHz nominal) to
= 99kHz nominal,
OSC2
-7 +7
-9 +9
%
SMPS1 AND SMPS2 CONTROLLERS
DC Load Regulation
Either SMPS, PWM mode, droop disabled;
zero to full load
-0.1 %
Line Regulation Error Either SMPS, 4V < VIN < 26V 0.03 %/V
GNDS_ Input Range V
GNDS_ Gain A
GNDS_ Input B ia s Current I
GNDS_
GNDS_
GNDS
Separate mode -200 +200 mV
Separate: V
+200mV; combined: V
-200mV V
OUT
GNDS_
_/V
GNDS_,
+200mV
-200mV V /V
OUT
GNDS _,
GNDS
_
0.95 1.00 1.05 V/V
_TA = +25°C -2 +2 µA
MAX17480
AMD 2-/3-Output Mobile Serial VID Controller
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
Idle Mode is a trademark of Maxim Integrated Products, Inc.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Combined-Mode Detection Threshold
Maximum Duty Factor D
Minimum On-Time t
SMPS1 AND SMPS2 CURRENT LIMIT
Current-Limit Threshold Tolerance
Zero-Crossing Threshold V
Idle Mode™ Threshold
CS_ Input Leakage Current CSP_ and CSN_, TA = +25°C -0.2 +0.2 µA
CS_ Common-Mode Input Range CSP_ and CSN_ 0 2 V
SMPS1 AND SMPS2 DROOP, CURRENT BALANCE, AND TRANSIENT RESPONSE
AC Droop and Current Balance Ampl ifier Transconductance
AC Droop and Current Balance Amplifier Offset
No-Load Positive Offset OPTION = 2V or GND +12.5 mV
Transient Detection Threshold
SMPS3 INTERNAL 4A STEP-DOWN CONVERTER
OUT3 Load Regulat ion R
OUT3 Line Regulation 0 to 100% duty cycle 5 mV
OUT3 Input Current I
LX3 Leakage Current I
Internal MOSFET On-Resistance
LX3 Peak C urrent Lim it I
LX3 Idle-Mode Trip Level I
LX3 Zero-Crossing Trip Level I
Maximum Duty Factor D
Minimum On-Time t
MAX
ONMIN
V
LIMIT
ZX
V
IMIN
G
m(FBAC_)
I
GNDS1, GNDS2, detection after REFOK, latched, cleared by cycling SHDN
90 92 %
V
CSP
(V
REF
V
GND
V
CSP
I
FBAC
V
CSP
FBAC
_ - V
_ - VLX_, skip mode 1 mV
_ - V
_ - V
_/G
_ = 0.052 x (V
CSN
- V
) = 0.2V to 1.0V
ILM
_, skip mode, 0.15 x V
CSN
_/( VCS_), V
_ = 0 to +40mV
CSN
m(FBAC_)
-1.5 +1.5 mV
FBAC
_ = V
0.7 0.8 0.9 V
150 ns
- V
REF
CSN
),
ILIM
LIMIT
_ = 1.2V,
-3 +3 mV
-2 +2 mV
1.94 2.00 2.06 mS
Measured at FBDC_ with respect to steady-state FBDC_ regulation voltage,
-47 -41 -33 mV
10mV hysteresis (typ)
4 5.5 7 mV/A
DROOP3
TA = +25°C -100 -5 +100 nA
OUT3
LX3
R
ON(NH3)
R
ON(NL3)
LX3PK
LX3MIN
ZX3
MAX
ONMIN
SHDN = GND, V V
= 5.5V, TA = +25°C
IN3
High-side n-channe l 75 150
Low-side n-channel 40 75
ILIM3 = VCC 4.75 5.25 6
ILIM3 = GND 3.75 4.25 5
Percentage of I
Skip mode 20 mA
84 87 %
= GND or 5.5V,
LX3
25 %
LX3PK
-20 +20 µA
150 ns
m
A
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
FAULT DETECTION
Output Overvoltage Tr ip Threshold (SMPS1 and SMPS2 Only)
Output Overvoltage Fault Propagation Delay (SMPS1 and SMPS2 Only)
Output Undervoltage Protection Trip Threshold
Output Undervoltage Fault Propagation Dela y
PWRGD Threshold
PWRGD Propagat ion Delay t
PWRGD, Output Low Voltage I
PWRGD Leakage Current I
PWRGD Startup Dela y and Transition B lan king Time
VRHOT Trip Threshold
VRHOT Delay t
VRHOT, Output Low Voltage I VRHOT Leakage Current High state, VRHOT forced to 5V, TA = +25°C 1 µA
THRM Input Leakage TA = +25°C -100 +100 nA
Thermal-Shutdown Threshold T
GATE DRIVERS
DH_ Gate-Driver On-Resistance R
DL_ Gate-Driver On-Resistance R
V
OVP_
t
OVP
V
UVP
t
UVP
PWRGD
PWRGD
t
BLANK
VRHOT
SHDN
ON(DH_)
ON(DL_)
PWM mode 250 300 350 mV
Measured at FBDC_, rising edge
FBDC_ forced 25mV above trip threshold 10 µs
Measured at FBDC_ or OUT3 with respect to unloaded output vo ltage
FBDC_ forced 25mV below trip threshold 10 µs
Measured at FBDC_ or OUT3 with respect to unloaded output voltage,15mV hysteresis (typ)
FBDC_ or OUT3 forced 25mV outside the PWRGD trip thresholds
= 4mA 0.4 V
SINK
High state, PWRGD forced to 5.5V, T
= +25°C
A
Measured from the time when FBDC_ and OUT3 reach the target voltage
Measured at THRM, with respect to V falling edge, 115mV hysteresis (typ)
THRM forced 25mV below the VRHOT trip threshold, fall ing edge
= 4mA 0.4 V
SINK
Hysteresis = 15°C +160 °C
BST_ - LX_ forced to 5V (Note 4)
DL_, high state 0.7 2.0
DL_, low state 0.25 0.6
Skip mode and output has not reached the regulation voltage
Minimum OVP threshold
Lower threshold, falling edge (undervolt age)
Upper threshold, rising edge (overvoltage)
High state (pullup) 0.9 2.5
Low state (pulldown) 0.7 2.5
1.80 1.85 1.90
0.8
-450 -400 -350 mV
-350 -300 -250
+150 +200 +250
10 µs
1 µA
20 µs
,
CC
29.5 30 30.5 %
10 µ
V
mV
S
MAX17480
AMD 2-/3-Output Mobile Serial VID Controller
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DH_ Gate-Driver Source/Sink Current
DL_ Gate-Driver Source Current
DL_ Gate-Driver Sink Current IDL_
Dead Time
Internal BST1, BST2 Switch R
Internal BST3 Switch R
2-WIRE I2C BUS LOGIC INTERFACE
SVI Logic-Input Current SVC, SVD, TA = +25°C -1 +1 µA
SVI Logic-Input Threshold
SVC Clock Frequenc y f
START Condit ion Hold Time t
Repeated START Condition Setup Time
STOP Condition Setup Time t
Data Hold t
Data Setup Time t
SVC Low Period t
SVC High Period t
SVC/SVD Rise and Fall Time tR, t
Pulse Width of Spike Suppression 20 ns
INPUTS AND OUTPUTS
Logic-Input Current
Logic-Input Leve ls SHDN, rising edge, hysteresis = 225mV 0.8 2.0 V
Input Logic Leve ls
PGD_IN Logic-Input Threshold PGD_IN, rising edge, hysteresis = 65mV
ON
ON
I
DH
I
DL
(SINK)
tDH_
t
DL_DH
_ DH_ forced to 2.5V, BST_ - LX_ forced to 5V 2.2 A
_
DL_ forced to 2.5V 2.7 A
DL_ forced to 2.5V 8 A
DH_ low to DL_ high 9 20 35
DL
DL_ low to DH_ high 9 20 35
BST1, BST2 to VDD, I
BST3 to VDD, I
BST3
= I
BST1
= 10mA 10 20
SVC, SVD, rising edge, hysteresis 0.14 x V
(V)
DDIO
SVC
HD; STA
t
SU;STA
SU;STO
3.4 MHz
160 ns
160 ns
160 ns
= 10mA 10 20
BST2
0.3 x
V
DDIO
A master device must internally provide a hold time of at least 300ns for the SVD
HD;DAT
signal (referred to the V
of SVC signa l)
IHMIN
70 ns to bridge the undefined region of SVC’s falling edge
SU;DAT
LOW
HIGH
10 ns
160 ns
Measured from 10% to 90% of V
Input filter s o n SVD and SVC suppress
F
noise spike less than 50ns
60 ns
DDIO
40 ns
SHDN, PGD_IN, TA = +25°C -1 +1 µA
ILIM3, OPTION, T
High, OPTION, ILIM3
= +25°C -200 +200 nA
A
V
-
CC
0.4
3.3V, OPTION 2.75 3.85
2V, OPTION 1.65 2.35
Low, OPTION, ILIM3 0.4
0.3 x
V
DDIO
0.7 x
V
DDIO
0.7 x
V
DDIO
ns
V
V
V
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
_______________________________________________________________________________________ 7
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= -40°C to +105°C, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INPUT SUPPLIES
VIN Drain of external high-side MOSFET 4 26
Input Voltage Range
VCC Undervoltage-Lockout Threshold
V
Undervoltage-Lockout
DDIO
Threshold
V
Undervoltage-Lockout
IN3
Threshold
Quie sc ent Supply Current (VCC) I
Quiescent Supply Current
Quiescent Supply Current (IN3) I
BIAS
V
2.7 5.5
IN3
1.0 2.7
V
DDIO
V
UVLO
CC
I
DDI O
IN3
VCC rising, 50mV typical hysteresis, latched, UV fault
V
rising, 100mV typical hysteresis,
DDIO
latched, UV fault
V
rising, 100mV typical hystere sis 2.5 2.7 V
IN3
Skip mode, FBDC_ and OUT3 forced above their regulation points
4.10 4.45 V
0.7 0.9 V
10 mA
25 µA
Skip mode, OUT3 forced above its regulation point
200 µA
V
V
VCC, VDD 4.5 5.5
INTERNAL DACs, SLEW RATE, PHAS E SHIFT
Measured at FBDC_ for the core SMPSs;
DAC codes from
0.8375V to 1.5500V
-0.7 +0.7 %
measured at OUT3
DC Output Voltage Accuracy V
OUT
for the NB SMPS; 30% duty cycle, no load, ILIM3 = V
, V
OUT3
= V
CC
+ 12.5mV (Note 3)
DAC codes from
0.5000V to 0.8250V
DAC codes from
DAC3
12.5mV to 0.4875V
-7.5 +7.5
mV
-15 +15
Slew-Rate Accuracy During transit ion
R
= 143k (f
OSC
Switching Frequenc y Accuracy
f
OSC1,
f
OSC2,
f
OSC3
nominal, f
R
= 71.4k (f
OSC
nominal, f 432k (f f
= 199kHz nominal)
OSC3
= 600kHz nominal)
OSC3
= 1.2MHz nominal) to
OSC3
= f
OSC1
R
= 143k,
TIME
SR = 6.25mV/µs
R
= 35.7k to
TIME
357k, SR = 25mV/µs to 2.5mV/µs
= f
OSC1
OSC1
= 99kHz nominal,
OSC2
= f
OSC2
OSC2
= 300 kHz
= 600 kHz
-10 +10
%
-15 +15
-9 +9
%
-12 +12
MAX17480
AMD 2-/3-Output Mobile Serial VID Controller
8 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= -40°C to +105°C, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SMPS1 AND SMPS2 CONTROLLERS
GNDS_ Input Range V
GNDS_ Gain A
Combined-Mode Detection Threshold
Maximum Duty Factor D
Minimum On-Time t
SMPS1 AND SMPS2 CURRENT LIMIT
Current-Limit Threshold Tolerance
Idle-Mode Threshold Tolerance V
CS_ Common-Mode Input Range CSP_ and CSN_ 0 2 V
SMPS1 AND SMPS2 DROOP, CURRENT BALANCE, AND TRANSIENT RESPONSE
AC Droop and Current Balance Ampl ifier Transconductance
AC Droop and Current Balance Amplifier Offset
Transient Detection Threshold
SMPS3 INTERNAL 4A STEP-DOWN CONVERTER
OUT3 Load Regulat ion R
Internal MOSFET On-Resistance
LX3 Peak C urrent Lim it I
Maximum Duty Factor D
Minimum On-Time t
GNDS_
GNDS_
MAX
ONMIN
V
LIMIT
IMIN
G
m(FBAC_)
I
DROOP3
R
ON(NH3)
R
ON(NL3)
LX3PK
MAX
ONMIN
Separate mode -200 +200 mV
Separate: V V
_  +200mV; combined;
GNDS
/ V
V
OUT
GNDS1, GNDS2, detection after REFOK, latched, cleared by cycling SHDN
OUT
GNDS _,
_/V
GNDS_,
-200mV  V
-200mV
GNDS _
0.95 1.05 V/V
+200mV
0.7 0.9 V
90 %
150 ns
V
CSP
(V
REF
V
CSP
I
FBAC
V
CSP
FBAC
_ - V
_ - V
_ - V
_/G
_ = 0.052 x (V
CSN
- V
) = 0.2V to 1.0V
ILM
_, skip mode, 0.15 x V
CSN
_/(VCS_), V
CSN
m(FBAC_)
FBAC
_ = 0 to +40mV
-1.5 +2.0 mV
_ = V
REF
CSN
- V
ILIM
LIMIT
_ = 1.2V,
),
-3 +3 mV
-2 +2 mV
1.94 2.06 mS
Measured at FBDC_ with respect to steady-state FBDC_ regulation voltage,
-47 -33 mV
10mV hysteresis (typ)
4 7 mV/A
High-side n-channel 150
Low-side n-channel 75
ILIM3 = V
skip mode 4.75 6 A
CC,
m
84 %
150 ns
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
_______________________________________________________________________________________ 9
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= -40°C to +105°C, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
FAULT DETECTION
Output Overvoltage Tr ip Threshold (SMPS1 and SMPS2 Only)
Output Undervoltage Protection Trip Threshold
PWRGD Threshold
PWRGD, Output Low Voltage I
VRHOT Trip Threshold
VRHOT, Output Low Voltage I
GATE DRIVERS
DH_ Gate-Driver On-Resistance R
DL_ Gate-Driver On-Resistance R
Dead Time
Internal BST1, BST2 Switch R
Internal BST3 Switch R
2-WIRE I2C BUS LOGIC INTERFACE
SVI Logic-Input Threshold
SVC Clock Frequenc y f
START Condit ion Hold Time t
Repeated START Condition Setup Time
STOP Condition Setup Time t
Data Hold t
ON
V
OVP_
V
UVP
ON(DH_)
ON(DL_)
tDH_
t
DL_DH
ON
SVC
SU;STA
t
SU;STA
SU;STO
HD;DAT
PWM mode 250 350 mV
Measured at FBDC_, rising edge
Measured at FBDC_ or OUT3 with respect to unloaded output vo ltage
Measured at FBDC_ or OUT3 with respect to unloaded output voltage, 15mV hysteresis (typ)
= 4mA 0.4 V
SINK
Measured at THRM, with respect to V falling edge, 115mV hysteresis (typ)
= 4mA 0.4 V
SINK
BST_ - LX_ forced to 5V (Note 4)
DL_, high state 2.0
DL_, low state 0.6
DH_ low to DL_ high 9 35
DL
DL_ low to DH_ high 9 35
BST1, BST2 to VDD, I
BST3 to VDD, I
SVC, SVD, rising edge, hy steresis = 0.14 x
(V)
V
DDIO
3.4 MHz
160 ns
160 ns
160 ns
A master device must internally provide a hold time of at least 300ns for the SVD signal (referred to the V the undefined region of SVC’s falling edge
BST3
Skip mode and output ha ve not reached the regulation voltage
Lower threshold, falling edge (undervolt age)
Upper threshold, rising edge (overvoltage)
High state (pullup) 2.5
Low state (pulldown) 2.5
= I
BST1
= 10mA 20
of SVC signal) to bridge
IHMIN
= 10mA 20
BST2
1.80 1.90 V
-450 -350 mV
-350 -250
+150 +250
CC,
29.5 30.5 %
0.3 x
V
DDIO
70 ns
0.7 x
V
DDIO
mV
ns
V
MAX17480
AMD 2-/3-Output Mobile Serial VID Controller
10 ______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 2, V
IN
= 12V, V
CC
= V
DD
= V
IN3
= SHDN = PGD_IN = 5V, V
DDIO
= 1.8V, OPTION = GNDS_ = AGND = PGND,
FBDC_ = FBAC_ = OUT3 = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, T
A
= -40°C to +105°C, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 5)
Note 3: When the inductor is in continuous conduction, the output voltage has a DC regulation level lower than the error-comparator
threshold by 50% of the ripple. In discontinuous conduction, the output voltage has a DC regulation level higher than the error-comparator threshold by 50% of the ripple. The core SMPSs have an integrator that corrects for this error. The NB SMPS has an offset determined by the ILIM3 pin, and a -6.5mV/A load line.
Note 4: Production testing limitations due to package handling require relaxed maximum on-resistance specifications for the TQFN
package.
Note 5: Specifications to T
A
= -40°C to +105°C are guaranteed by design, not production tested.
SVC
t
HD;STA
t
HD;DAT
t
SU;DAT
t
SU;STO
t
BUF
t
LOW
t
HIGH
t
R
t
F
V
IH
V
IL
SVD
Figure 1. Timing Definitions Used in the Electrical Characteristics
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Data Setup Time t
SVC Low Period t
SVC High Period t
SVC/SVD Rise and Fall Time tR, t
INPUTS AND OUTPUTS Logic-Input Leve ls SHDN, rising edge, hysteresis = 225mV 0.8 2.0 V
Input Logic Leve ls
PGD_IN Logic-Input Threshold PGD_IN, rising edge, hysteresis = 65mV
SU;DAT
LOW
HIGH
10 ns
160 ns
Measured from 10% to 90% of V
Input filter s o n SVD and SVC suppress
F
noise spike less than 50ns
High, OPTION, ILIM3
3.3V, OPTION 2.75 3.85
60 ns
DDIO
40 ns
V
-
CC
0.4
V
2V, OPTION 1.65 2.35
Low, OPTION, ILIM3 0.4
0.3 x
V
DDIO
0.7 x
V
DDIO
V
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
______________________________________________________________________________________ 11
Typical Operating Characteristics
(Circuit of Figure 2, V
IN
= 12V, VDD= VCC= 5V, V
DDIO
= 2.5V, TA = +25°C, unless otherwise noted.)
CORE SMPS 1-PHASE EFFICIENCY
vs. LOAD CURRENT (V
OUT
= 1.2V)
MAX17480 toc01
LOAD CURRENT (A)
EFFICIENCY (%)
101
70
80
90
100
60
0.1 100
SKIP MODE PWM MODE
12V
7V
20V
CORE SMPS 2-PHASE EFFICIENCY
vs. LOAD CURRENT (V
OUT
= 1.2V)
MAX17480 toc02
LOAD CURRENT (A)
EFFICIENCY (%)
10
70
80
90
100
60
1100
12V
7V
20V
PWM MODE
CORE SMPS OUTPUT VOLTAGE
vs. LOAD CURRENT (V
OUT
= 1.2V)
MAX17480 toc03
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)
15105
1.195
1.200
1.205
1.190 020
SKIP MODE AND PWM MODE
VIN = 12V
CORE SMPS 1-PHASE EFFICIENCY
vs. LOAD CURRENT (V
OUT
= 0.8V)
MAX17480 toc04
LOAD CURRENT (A)
EFFICIENCY (%)
101
70
80
90
100
60
0.1 100
SKIP MODE PWM MODE
12V
7V
20V
CORE SMPS OUTPUT VOLTAGE
vs. LOAD CURRENT (V
OUT
= 0.8V)
MAX17480 toc05
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)
15105
0.795
0.800
0.805
0.790 020
SKIP MODE AND PWM MODE
VIN = 12V
NB SMPS EFFICIENCY
vs. LOAD CURRENT (1V)
MAX17480 toc06
LOAD CURRENT (A)
EFFICIENCY (%)
1
70
80
90
100
60
0.1 10
SKIP MODE PWM MODE
3.3V
5V
NB SMPS 1V OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX17480 toc07
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)
21
0.97
0.99
1.01
1.03
1.05
0.95 043
SKIP MODE PWM MODE
VIN = 3.3V
VIN = 5V
CORE SMPS 1-PHASE SWITCHING
FREQUENCY vs. LOAD CURRENT
MAX17480 toc08
LOAD CURRENT (A)
SWITCHING FREQUENCY (kHz)
101
150
200
250
300
350
100
0.1 100
VIN = 20V SKIP VIN = 20V PWM
VIN = 12V SKIP VIN = 12V PWM
VIN = 7V SKIP VIN = 7V PWM
V
OUT
= 1.2V
NB SMPS SWITCHING FREQUENCY
vs. LOAD CURRENT
MAX17480 toc09
LOAD CURRENT (A)
SWITCHING FREQUENCY (kHz)
3.0 3.52.52.00.5 1.0 1.5
450
500
550
600
650
700
750
400
04.0
VIN = 3.3V SKIP VIN = 5V PWM VIN = 3.3V SKIP VIN = 5V PWM
V
OUT
= 1V
MAX17480
AMD 2-/3-Output Mobile Serial VID Controller
12 ______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Circuit of Figure 2, V
IN
= 12V, VDD= VCC= 5V, V
DDIO
= 2.5V, TA = +25°C, unless otherwise noted.)
MAXIMUM INDUCTOR CURRENT
vs. INPUT VOLTAGE
MAX17480 toc10
INPUT VOLTAGE (V)
INDUCTOR CURRENT (A)
20.017.512.5 15.010.07.5
23
25
27
29
31
21
5.0
V
OUT
= 1.2V
PEAK CURRENT
DC CURRENT
NO-LOAD SUPPLY CURRENT
vs. INPUT VOLTAGE
MAX17480 toc11
INPUT VOLTAGE (V)
SUPPLY CURRENT (mA)
242118151296
0.1
1
10
100
0.01 3
SKIP MODE PWM MODE
I
IN
I
IN
I
CC
+ I
DD
I
CC
+ I
DD
V
OUT
= 1.2V
CORE SMPS VID = 1.2V
OUTPUT VOLTAGE DISTRIBUTION
MAX17480 toc12
OUTPUT VOLTAGE (V)
SAMPLE PERCENTAGE (%)
10
20
30
40
50
60
90
80
70
0
1.195
1.196
1.197
1.198
1.199
1.200
1.201
1.202
1.203
1.204
1.205
TA = +85°C TA = +25°C
SAMPLE SIZE = 100
NB SMPS VID = 1.2V
OUTPUT VOLTAGE DISTRIBUTION
MAX17480 toc13
OUTPUT VOLTAGE (V)
SAMPLE PERCENTAGE (%)
10
20
30
40
50
70
60
0
1.195
1.196
1.197
1.198
1.199
1.200
1.201
1.202
1.203
1.204
1.205
SAMPLE SIZE = 100
TA = +85°C TA = +25°C
G
m(FBAC)
TRANSCONDUCTANCE
DISTRIBUTION
MAX17480 toc14
TRANSCONDUCTANCE (µS)
SAMPLE PERCENTAGE (%)
5
10
15
20
25
30
0
1985
1988
1991
1994
1997
2000
2003
2006
2009
2012
2015
SAMPLE SIZE = 100
+85°C +25°C
NB SMPS PEAK
CURRENT-LIMIT DISTRIBUTION
MAX17480 toc15
PEAK CURRENT LIMIT (A)
SAMPLE PERCENTAGE (%)
5
15
10
20
25
30
0
5.00
5.05
5.10
5.15
5.20
5.25
5.30
5.40
5.35
5.45
5.50
SAMPLE SIZE = 100
ILIM3 = V
CC
TA = +85°C TA = +25°C
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
______________________________________________________________________________________ 13
Typical Operating Characteristics (continued)
(Circuit of Figure 2, V
IN
= 12V, VDD= VCC= 5V, V
DDIO
= 2.5V, TA = +25°C, unless otherwise noted.)
STARTUP WAVEFORMS
MAX17480 toc16
200µs/div
0
SHDN, 5V/div V
OUT1
, 0.5V/div
V
OUT2
, 0.5V/div
V
OUT3
, 0.5V/div
PWRGD, 5V/div
I
LX
, 5A/div
I
LX3
, 1A/div
V
IN
= 12V
V
BOOT
= 1V
I
LOAD1
= 3A
I
LOAD2
= 3A
I
LOAD3
= 0.5A
0 0
0
0
5A
0
1A
0
STARTUP SEQUENCE
MAX17480 toc17
400µs/div
0
SHDN, 5V/div V
OUT1
, 0.5V/div
V
OUT2
, 0.5V/div
V
OUT3
, 0.5V/div
PWRGD, 5V/div
PGD_IN, 2.5V/div
SVC, 2.5V/div
SVD, 2.5V/div
V
IN
= 12V
V
BOOT
= 1V
V
SVID
= 1.2V
0
0
0
0
0
0
0
SHUTDOWN WAVEFORMS
MAX17480 toc18
100µs/div
3.3V
1.2V
1.2V
1.2V
5V
5V
5V 5V
SHDN, 5V/div
V
OUT1
, 0.5V/div
V
OUT2
, 0.5V/div
V
OUT3
, 0.5V/div
DL1, 10V/div
DL2, 10V/div
LX3, 10V/div
PWRGD, 10V/div
V
IN
= 12V I
LOAD1
= 3A
V
SVID
= 1.2V I
LOAD2
= 3A
I
LOAD3
= 0.5A
CORE SMPS 1-PHASE LOAD-TRANSIENT
RESPONSE
MAX17480 toc19
20µs/div
1.2V
1.5A
13.5A
12V
0
V
OUT1
, 50mV/div
I
LX1
, 10A/div
LX1, 10V/div
V
IN
= 12V I
LOAD1
= 1.5A TO 13.5A TO 1.5A
V
OUT1
= 1.2V PWM MODE
CORE SMPS 1-PHASE TRANSIENT
PHASE REPEAT
MAX17480 toc20
2µs/div
1.2V
1.5A
13.5A
12V
0
V
OUT1
50mV/div
I
LX1
10A/div
LX1 10V/div
V
IN
= 12V I
LOAD1
= 1.5A TO 13.5A TO 1.5A
V
OUT1
= 1.2V PWM MODE
CORE SMPS 2-PHASE LOAD-TRANSIENT
RESPONSE
MAX17480 toc21
20µs/div
1.2V
1.5A
13.5A
13.5V
1.5A
V
OUT
50mV/div
I
LX1
10A/div
I
LX2
10A/div
V
IN
= 12V I
LOAD
= 3A TO 27A TO 3A
V
OUT1
= 1.2V PWM MODE
CORE SMPS 2-PHASE TRANSIENT
PHASE REPEAT
MAX17480 toc22
2µs/div
1.2V
1.5A
13.5A
13.5A
1.5A
V
OUT
50mV/div
I
LX1
10A/div
I
LX2
10A/div
V
IN
= 12V I
LOAD
= 3A TO 27A TO 3A
V
OUT1
= 1.2V PWM MODE
NB SMPS LOAD-TRANSIENT
RESPONSE
MAX17480 toc23
20µs/div
1V
0.4A
3.6A
5V
0
V
OUT3
50mV/div
I
LX3
2A/div
LX3 5V/div
V
IN3
= 5V I
LOAD3
= 0.4A TO 3.6A TO 0.4A
V
OUT3
= 1V PWM MODE
MAX17480
AMD 2-/3-Output Mobile Serial VID Controller
14 ______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Circuit of Figure 2, V
IN
= 12V, VDD= VCC= 5V, V
DDIO
= 2.5V, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(Circuit of Figure 2, V
IN
= 12V, VDD= VCC= 5V, V
DDIO
= 2.5V, TA = +25°C, unless otherwise noted.)
CORE SMPS OUTPUT OVERLOAD
WAVEFORM (SEPARATE MODE)
MAX17480 toc24
100µs/div
1.2V
1.2V
1.2V
5V
5V
5V
5V
0
0
0
V
IN
= 12V I
LOAD1
= 3A TO 40A
V
SVID
= 1.2V I
LOAD2
= 3A
I
LOAD3
= 0.5A
SHDN, 5V/div
V
OUT1
, 1V/div
DL1, 10V/div
V
OUT2
, 1V/div
V
OUT3
, 1V/div
DL2, 10V/div
LX3, 10V/div
CORE SMPS OUTPUT OVERVOLTAGE
WAVEFORM (SEPARATE MODE)
MAX17480 toc25
100µs/div
1.2V
1.2V
1.2V
5V
5V
5V
0
0
0
V
IN
= 12V I
LOAD1
= NO LOAD
V
SVID
= 1.2V I
LOAD2
= 3A
I
LOAD3
= 0.5A
SHDN, 5V/div
V
OUT1
, 1V/div
DL1, 10V/div
V
OUT2
, 1V/div
V
OUT3
, 1V/div
DL2, 10V/div
LX3, 10V/div
DYNAMIC OUTPUT-VOLTAGE
TRANSITIONS (LIGHT LOAD)
MAX17480 toc26
100µs/div
0.6V
0.6V
0.6V
1.3V
1.3V
2.5V
2.5V
1.3V
V
IN
= 12V
V
SVID
= 1.3V TO 0.6V TO 1.3V
V
OUT1
, 0.5V/div
V
OUT2
, 0.5V/div
V
OUT3
, 0.5V/div
SVC, 2.5V/div
SVD, 2.5V/div
PGD_IN TRANSITION (LIGHT LOAD)
MAX17480 toc27
10µs/div
0.8V
0
0
1.1V
1.1V
1.2V
5V
5V
0
0
0
0.9V
V
IN
= 12V
V
BOOT
= 1.1V
V
OUT1
= 0.8V
V
OUT2
= 1.2V
V
OUT3
= 0.9V
V
OUT
, 200mV/div,
V
OUT2
, 200mV/div
LX1, 20V/div
LX2, 20V/div
LX3, 5V/div
V
OUT3
, 200mV/div
PWRGD, 5V/div
PGD_IN, 5V/div
MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
______________________________________________________________________________________
15
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