The MAX17409 is a 1-phase Quick-PWM™ step-down
VID power-supply controller for high-performance graphics processors. The Quick-PWM control provides instantaneous response to fast-load current steps. Active
voltage positioning reduces power dissipation and bulk
output capacitance requirements and allows ideal positioning compensation for tantalum, polymer, or ceramic
bulk output capacitors.
The MAX17409 is intended for two different notebook
processor core applications: either bucking down the battery directly to create the core voltage, or bucking down
the +5V system supply. The single-stage conversion
method allows this device to directly step down high-voltage batteries for the highest possible efficiency.
Alternatively, 2-stage conversion (stepping down the +5V
system supply instead of the battery) at higher switching
frequency provides the minimum possible physical size.
A slew-rate controller allows controlled transitions
between VID codes. A thermistor-based temperature
sensor provides programmable thermal protection.
The MAX17409 is available in a 28-pin, 4mm x 4mm
TQFN package.
Applications
Graphics Core (GPU) Power Supplies
Voltage-Positioned Step-Down Converters
2-to-4 Li+ Cells Battery to Processor Core
Supply Converters
= 0°C to +85°C, unless otherwise specified. Typical values are at TA= +25°C.) (Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC, VDDto GND .....................................................-0.3V to +6V
G0–G5 to GND .........................................................-0.3V to +6V
CSP, CSN to GND ....................................................-0.3V to +6V
ILIM, THRM, VRHOT, PWRGD to GND ....................-0.3V to +6V
SKIP to GND.............................................................-0.3V to +6V
CCV, FB, IMON, REF to GND.....................-0.3V to (V
CC
+ 0.3V)
SHDN to GND (Note 1)...........................................-0.3V to +30V
TON to GND ...........................................................-0.3V to +30V
GNDS/OFSP, PGND to GND (Note 2) ...................-0.3V to +0.3V
Internal Driver (Note 2)
DL to PGND.............................................-0.3V to (V
DD
+ 0.3V)
BST to GND .........................................................-0.3V to +36V
LX to BST...............................................................-6V to +0.3V
BST to V
DD
..........................................................-0.3V to +30V
DH to LX .................................................-0.3V to (V
= -40°C to +105°C, unless otherwise specified.) (Note 3)
Note 3: Limits are 100% production tested at TA= +25°C. Maximum and minimum limits over temperature are guaranteed by design
and characterization.
Note 4: The equation for the target voltage V
TARGET
is:
V
TARGET
= the slew-rate-controlled version of V
DAC
, where V
DAC
= 0 for shutdown, V
DAC
= V
VID
otherwise (the V
VID
voltages for all possible VID codes are given in Table 4).
In pulse-skipping mode, the output rises by approximately 1.5% when transitioning from continuous conduction to no load.
Note 5: On-time and minimum off-time specifications are measured from 50% to 50% at the DH pin, with LX forced to 0V, BST forced
to 5V, and a 500pF capacitor from DH to LX to simulate external MOSFET gate capacitance. Actual in-circuit times might be
different due to MOSFET switching speeds.
Current Monitor Output. The MAX17409 IMON output sources a current that is directl y proportional
to the current-sen se vo ltage as defined by:
I
1 IMON
2 GNDS/OFSP
3 FB
4 CSN
5 CSP
6 SKIP
= G
IMON
where G
The IMON current is unidirectional (sources current out of IMON only) for positive current-sense
values. For negative current-sense vo ltages, the IMON current is zero.
Connect an e xternal resistor between IMON and GNDS to create the desired IMON gain based on
the following equation:
where I
LOAD(MAX)
The IMON voltage is internall y clamped to 1.1V. The transconductance amplifier and voltage
clamp are internally compensated, so IMON cannot drive large external capacitance values. To
filter the IMON signal, use an RC filter as shown in Figure 1.
Remote Ground-Sense Input/Positi ve Offset Input. Connect directl y to the ground-sense pin or
ground connect ion of the load. GNDS internally connects to a transconductance amplifier that
adjusts the feedback vo ltage—compen sating for voltage drops between the regulator’s ground and
the processor’s ground.
Remote-Sense Feedback Input and Voltage-Position ing Transconductance Amplifier Output.
Connect resistor R
pin of the load) for best accurac y and to set the steady-state droop based on the voltagepositioning gain requirement:
where R
current-sen se resi stance w ith respect to CSP to CSN current-sen se inputs. See the Current Sense
section for details on designing with sense resistors or inductor DCR sensi ng.
Shorting FB directly to the output effectively disab les voltage posit ioning, but impacts the stability
requirement s. Designs that disable vo ltage positioning require a h igher minimum output
capacitance ESR to maintain stabil ity (see the Output Capacitor Selection section).
FB enters a high-impedance state in shutdown.
Negative Inductor Current-Sense Input. Connect CSN to the negative terminal of the inductor
current-sen sing resistor or directly to the negati ve terminal of the inductor if the loss less DCR
sen si ng method is used (see Figure 3).
Positive Inductor Current-Sense Input. Connect CSP to the positive terminal of the inductor currentsen si ng resistor or direct ly to the pos itive terminal of the filtering capacitor used when the
loss less DCR sensing method is used (see Figure 3).
Pulse-Skipping Control Input. The SKIP signal indicate s the power usage and sets the operating
mode of the MAX17409. When the system forces SKIP high, the MAX17409 immediately enters
automatic pulse-skipping mode. The controller returns to continuous forced-PWM mode when SKIP
is pulled low and the output is in regulat ion. SKIP determines the operating mode and outputvoltage transition slew rate as shown in the truth table below:
SKIP
0 Normal slew rate, forced-PWM mode
1 Normal slew rate, s kip mode
The SKIP state is ignored during soft-start and shutdown. The MAX17409 alway s uses pulsesk ipping mode during startup to ensure a monotonic power-up. During shutdown, the controller
always uses forced-PWM mode so the output can be actively discharged.
DROOP_DC
Functionality
m(IMON)
= 5mS (typ).
= 1.0V/(I
R
IMON
is the maximum load current, and R
between FB and the output remote-sense pin (or Kelvi n-sensed to the supply
FB
is the desired voltage-positioning slope, GMD = 600µS (typ), and R
R
FB
LOAD(MAX)
= R
DROO P
m(IMON)
/(R
x (V
x R
SENSE
CSP
SENSE
SENSE
- V
)
CSN
x G
is the current-sense voltage.
x GMD)
m(IMON)
)
SENSE
is the
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