Rainbow Electronics MAX17036 User Manual

General Description
The MAX17030/MAX17036 are 3/2-phase interleaved Quick-PWM™ step-down VID power-supply controllers for IMVP-6.5 notebook CPUs. Two integrated drivers and the option to drive a third phase using an external driver such as the MAX8791 allow for a flexible 3/2-phase con­figuration depending on the CPU being supported.
True out-of-phase operation reduces input ripple-current requirements and output-voltage ripple while easing component selection and layout difficulties. The Quick­PWM control provides instantaneous response to fast load-current steps. Active voltage positioning reduces power dissipation and bulk output capacitance require­ments and allows ideal positioning compensation for tan­talum, polymer, or ceramic bulk output capacitors.
The MAX17030/MAX17036 are intended for bucking down the battery directly to create the core voltage. The single-stage conversion method allows this device to directly step down high-voltage batteries for the highest possible efficiency.
A slew-rate controller allows controlled transitions between VID codes. A thermistor-based temperature sensor provides programmable thermal protection. An output current monitor provides an analog current out­put proportional to the sum of the inductor currents, which in steady state is the same as the current con­sumed by the CPU.
Applications
IMVP-6.5 SV and XE Core Power Supplies
High-Current Voltage-Positioned Step-Down Converters
3 to 4 Li+ Cells Battery to CPU Core Supply Converters
Notebooks/Desktops/Servers
Features
o Triple/Dual-Phase Quick-PWM Controllers o 2 Internal Drivers + 1 External Driver o ±0.5% V
OUT
Accuracy Over Line, Load, and
Temperature
o 7-Bit IMVP-6.5 DAC o Dynamic Phase Selection Optimizes Active/Sleep
Efficiency
o Transient Phase Overlap Reduces Output
Capacitance
o Transient Suppression Feature (MAX17036 Only) o Integrated Boost Switches o Active Voltage Positioning with Adjustable Gain o Accurate Lossless Current Balance and
Current Limit
o Remote Output and Ground Sense o Adjustable Output Slew-Rate Control o Power-Good (IMVPOK), Clock Enable (CLKEN),
and Thermal-Fault (VRHOT) Outputs
o IMVP-6.5 Power Sequencing and Timing
Compliant
o Output Current Monitor (IMON) o Drives Large Synchronous Rectifier FETs o 7V to 26V Battery Input Range o Adjustable Switching Frequency (600kHz max) o Undervoltage, Overvoltage, and Thermal-Fault
Protection
MAX17030/MAX17036
1/2/3-Phase Quick-PWM
IMVP-6.5 VID Controllers
________________________________________________________________
Maxim Integrated Products
1
Pin Configuration
Ordering Information
19-4577; Rev 0; 4/09
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
PART TEMP RANGE PIN-PACKAGE
MAX17030GTL+ -40°C to +105°C 40 TQFN-EP*
MAX17036GTL+ -40°C to +105°C 40 TQFN-EP*
+
Denotes a lead-free(Pb)/RoHS-compliant package.
*
EP = Exposed pad.
Quick-PWM is a trademark of Maxim Integrated Products, Inc.
TOP VIEW
PGD_IN
CSP1
CSN1
BST1
LX1
31
32
D0
33
D1
34
D2
35
D3
36
D4
37
D5
38
D6
39
40
+
12 4 567
3
CSP3
CSN3
DD
DL1
V
VRHOT
ILIM
DL2
25
CC
V
TIME
DH1
27282930 26 24 23 22
MAX17030 MAX17036
IMON
THRM
THIN QFN
5mm x 5mm
DH2
LX2
BST2
21
8910
FB
FBAC
GNDS
20
19
18
17
16
15
14
13
12
11
PWM3
DRSKP
PWRGD
CLKEN
TON
PSI
DPRSLPVR
SHDN
CSP2
CSN2
MAX17030/MAX17036
1/2/3-Phase Quick-PWM IMVP-6.5 VID Controllers
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(Note 1)
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kfrom FBAC to CSN_, [D6–D0] = [0101000]; TA= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VCC, VDDto GND .....................................................-0.3V to +6V
D0–D6, PGD_IN, PSI, DPRSLPVR to GND ...............-0.3V to +6V
CSP_, CSN_, THRM, ILIM to GND............................-0.3V to +6V
PWRGD, CLKEN, VR_HOT to GND..........................-0.3V to +6V
FB, FBAC, IMON, TIME to GND .................-0.3V to (V
CC
+ 0.3V)
SHDN to GND (Note 2)...........................................-0.3V to +30V
TON to GND ...........................................................-0.3V to +30V
GNDS to GND .......................................................-0.3V to +0.3V
DL1, DL2, PWM3, DRSKP to GND .............-0.3V to (V
DD
+ 0.3V)
BST1, BST2 to GND ...............................................-0.3V to +36V
BST1, BST2 to V
DD
.................................................-0.3V to +30V
LX1 to BST1..............................................................-6V to +0.3V
LX2 to BST2..............................................................-6V to +0.3V
DH1 to LX1 ..............................................-0.3V to (V
BST1
+ 0.3V)
DH2 to LX2 ..............................................-0.3V to (V
BST2
+ 0.3V)
Continuous Power Dissipation (40-pin, 5mm x 5mm TQFN)
Up to +70°C ..............................................................1778mW
Derating above +70°C ..........................................22.2mW/°C
Operating Temperature Range .........................-40°C to +105°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +165°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Absolute Maximum Ratings valid using 20MHz bandwidth limit. Note 2: SHDN might be forced to 12V for the purpose of debugging prototype breadboards using the no-fault test mode. Internal
BST switches are disabled as well. Use external BST diodes when SHDN is forced to 12V.
PWM CONTROLLER
Input Voltage Range
FB Output Voltage Accuracy V
Boot Voltage V
Line Regulation Error VCC = 4.5V to 5.5V, VIN = 4.5V to 26V 0.1 %
FB Input Bias Current TA = +25°C -0.1 +0.1 µA
GNDS Input Range -200 +200 mV
GNDS Gain A
GNDS Input Bia s Current I
TIME Regulation Voltage V
TIME Slew-Rate Accurac y
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
FB
BOOT
GNDS
TA = +25°C -0.5 +0.5 µA
GNDS
R
TIME
VCC, V
V
Measured at FB with respect to GNDS; includes load­regulation error (Note 3)
1.094 1.100 1.106 V
V
R
R 178k (5mV/µs nominal)
Soft-start and soft-shutdown: R 178k (1.25mV/µs nominal)
DD
7 26
IN
/V
OUT
GNDS
= 147k 1.985 2.000 2.015 V
TIME
= 147k (6.08mV/µs nominal) -10 +10
TIME
= 35.7k (25mV/µs nominal) to
TIME
= 35.7k (6.25mV/µs nominal) to
TIME
DAC codes from
0.8125V to 1.5000V
DAC codes from
0.3750V to 0.8000V
DAC codes from 0 to 0.3625V
0.97 1.00 1.03 V/V
4.5 5.5
-0.5 +0.5 %
-7 +7
-20 +20
-15 +15
-20 +20
V
mV
%
MAX17030/MAX17036
1/2/3-Phase Quick-PWM
IMVP-6.5 VID Controllers
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kfrom FBAC to CSN_, [D6–D0] = [0101000]; TA= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
On-Time Accuracy t
Minimum Off-Time t
TON Shutdown Input Current I
BIAS CURRENTS
Quie sc ent Supply Current (VCC) I
Quie sc ent Supply Current (VDD) I
Shutdown Supply C urrent (VCC) I
Shutdown Supply C urrent (VDD) I
FAULT PROTECTION
Output Overvoltage-Protection Threshold
Output Overvoltage­Propagation Dela y
Output Undervoltage­Protection Threshold
Output Undervoltage­Propagation Dela y
CLKEN Startup Delay and Boot Time Period
ON
OFF(MIN)
TON,SDN
CC
DD
CC, SDN
DD, SDN
V
OVP
t
OVP
V
UVP
t
UVP
t
BOOT
VIN = 10V,
= 1.0V,
V
FB
measured at DH1, DH2, and PWM3 (Note 4)
Measured at DH1, DH2, and PWM3 (Note 4) 300 375 ns
SHDN = GND, VIN = 26V, VCC = VDD = 0 or 5V, T
A
Measured at VCC, V forced above the regulation point
Mea sured at VDD, V above the regulation point, T
Mea sured at VCC, SHDN = GND, TA = +25°C 0.01 1 µA
Mea sured at VDD, SHDN = GND, TA = +25°C 0.01 1 µA
Skip mode after output reache s the regulation voltage or PWM mode; measured at FB with respect to the voltage target set by the VID code (see Table 4)
Soft-start, soft-shutdown, skip mode, and output have not reached the regulation voltage; measured at FB
Min imum OVP threshold; measured at FB 0.8
FB forced 25mV above trip thresho ld 10 µs
Measured at FB with respect to the voltage target set by the VID code (see Table 4)
FB forced 25mV below trip threshold 10 µs
Measured from the time when FB reaches the boot target vo ltage (Note 3)
= +25°C
R per phase), 167ns nominal
R per phase), 333ns nominal
R per phase), 500ns nominal
= 96.75k (600kHz
TON
= 200k (300kHz
TON
= 303.25k (200kHz
TON
DPRSLPVR
DPRSLPVR
= 5V, FB
= 0, FB forced = +25°C
A
-15 +15
-10 +10
-15 +15
0.01 0.1 µA
3.5 7 mA
0.02 1 µA
250 300 350 mV
1.45 1.50 1.55
-450 -400 -350 mV
20 60 100 µs
%
V
MAX17030/MAX17036
1/2/3-Phase Quick-PWM IMVP-6.5 VID Controllers
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kfrom FBAC to CSN_, [D6–D0] = [0101000]; TA= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
PWRGD Startup Dela y
CLKEN and PWRGD Threshold
CLKEN and PWRGD Delay
CLKEN and PWRGD Transition
Blank ing Time (VID Transitions)
t
BLANK
CLKEN, PWRGD Output Low Voltage
CLKEN, PWRGD Leakage Current
CSN1 Pulldown Resi stance in UVLO and Shutdown
VCC Undervoltage-Lockout Threshold
V
UVLO(VCC)
THERMAL PROTECTION
VRHOT Trip Threshold
VRHOT Delay t
VRHOT Output On-Resistance R
VRHOT
ON(VRHOT)
VRHOT Leakage Current High-Z state, VRHOT forced to 5V, TA = +25°C 1 µA
THRM Input Leakage I
Thermal-Shutdown Threshold T
THRM
SHDN
V
VALLEY CURRENT LIMIT, DROOP, CURRENT BALANCE, AND CURRENT MONITOR
Current-Limit Threshold Voltage (Positive)
Current-Limit Threshold Voltage (Negative) Accuracy
Current-Limit Threshold Voltage (Zero Crossing)
V
LIMIT
V
LIMIT(NEG) VCSP_
V
ZX
CSP_, CSN_ Common-Mode Input Range
Measured at startup from the time when CLKEN goes low
Measured at FB with respect to the voltage target set by the VID code (see Table 4), 20mV hysteresis (typ)
FB forced 25mV out side the PWRGD trip thresholds
Measured from the time when FB reaches the target voltage (Note 3)
Low state, I
High-Z state, pin forced to 5V, T
SHDN = GND, measured after soft­shutdown completed (DL = low)
Rising edge, 65mV typical hy steresi s, controller disabled below this level
Measured at THRM with respect to V falling edge, typical hysteresis = 75mV
THRM forced 25mV below the VRHOT trip threshold, fall ing edge
SINK
3 6.5 10 m s
Lower threshold, falling edge
-350 -300 -250
(undervolt age)
Upper threshold, rising edge
+150 +200 +250
(overvoltage)
10 µs
20 µs
= 3mA 0.4 V
= +25°C 1 µA
A
8
4.05 4.27 4.48 V
;
CC
29 30 31 %
10 µs
Low state 2 8
= 0 to 5V, TA = +25°C -0.1 +0.1 µA
THRM
Typical hysteresis = 15°C +160 ° C
V
- V
= 100mV 7 10 13
ILIM
- V
= 500mV 45 50 55
ILIM
20 22.5 25
CC
LIMIT
-4 +4 mV
V
V
CSP_
GND
- V
- V
- V
TIME
CSN_
V
TIME
ILIM = V
, nominally -125% of V
CSN_
, V
LX_
DPRSLPVR
= 5V 0 mV
0 2 V
mV
mV
MAX17030/MAX17036
1/2/3-Phase Quick-PWM
IMVP-6.5 VID Controllers
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kΩ from FBAC to CSN_, [D6–D0] = [0101000]; TA= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Phase s 2, 3 Di sable Thresho ld Measured at CSP2, CSP3 3
V
CC
- 1VCC -
0.4
V
CSP_, CSN_ Input Current I
CSP
, I
CSN TA
= +25°C -0.2 +0.2 μA
ILIM Input Current I
ILIM
TA = +25°C -0.1 +0.1 μA
TA = +25°C -0.5 +0.5
Droop Amplifier Offset
(1/N) x (V
CSP_
-
V
CSN_
) at I
FBAC
= 0; indicates summation over all power-up enabled phases from 1 to N, N = 3
T
A
= 0°C to +85°C -0.75 +0.75
mV/
phase
Droop Amplifier Transconductance
G
m(FBAC)
I
FBAC
/[(V
CSP_
- V
CSN_
)]; indicates summation over all power-up enabled phases from 1 to N, N = 3, V
FBAC
= V
CSN_
= 0.45V to 1.5V
393 400 406 μS
Current-Monitor Offset
(1/N) x (V
CSP_
- V
CSN_
) at I
IMON
= 0, indicates summation over all power-up enabled phases from 1 to N, N = 3
-1.1 +1
mV/
phase
Current-Monitor Transconductance
G
m(IMON)
I
IMON
/[(V
CSP_
- V
CSN_
)]; indicates summation over all power-up enabled phases from 1 to N, N = 3, V
CSN_
= 0.45V to 1.5V
1.552 1.6 1.648 mS
GATE DRIVERS
High state (pullup) 0.9 2.5
DH_ Gate-Driver On-Resistance R
ON(DH)
BST_ - LX_ forced to 5V
Low state (pulldown) 0.7 2
High state (pullup) 0.7 2
DL_ Gate-Driver On-Resistance R
ON(DL)
Low state (pulldown) 0.25 0.7
DH_ Gate-Driver Source Current I
DH(S OURCE)
DH_ forced to 2.5V, BST_ - LX_ forced to 5V
2.2 A
DH_ Gate-Driver Sink Current I
DH(S INK)
DH_ forced to 2.5V, BST_ - LX_ forced to 5V
2.7 A
DL_ Gate-Driver Source Current I
DL(S OURCE)
DL_ forced to 2.5V 2.7 A
DL_ Gate-Driver Sink Current I
DL(S INK)
DL_ forced to 2.5V 8 A
DL_ falling, C
DL_
= 3nF 20
DL_ Transition Time
DL ris ing, C
DL_
= 3nF 20
ns
DH_ falling, C
DH_
= 3nF 20
DH_ Transition Time
DH_ ri sing, C
DH_
= 3nF 20
ns
Internal BST_ Switch On-Resistance
R
ON(BST) IBST_
= 10mA 10 20
MAX17030/MAX17036
1/2/3-Phase Quick-PWM IMVP-6.5 VID Controllers
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kfrom FBAC to CSN_, [D6–D0] = [0101000]; TA= 0°C to +85°C, unless otherwise noted.
Typical values are at T
A
= +25°C.)
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kfrom FBAC to CSN_, [D6–D0] = [0101000]; TA= -40oC to +105°C, unless otherwise noted.)
(Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
PWM3, DRSKP OUTPUTS
PWM3, DRSKP Output High Voltages
PWM3, DRSKP Output Low Voltages
LOGIC AND I/O
Logic-Input High Voltage V
Logic-Input Low Voltage V
Low-Voltage Logic-Input High Voltage
Low-Voltage Logic-Input Low Voltage
Logic Input Current
V
V
IH
IL
IHLV
ILLV
I
I
= 3mA
SOURCE
= 3mA 0.4 V
SINK
SHDN, PGD_IN 2.3 V SHDN, PGD_IN 1.0 V
PSI, D0–D6, DPRSLPVR 0.67 V
PSI, D0–D6, DPRSLPVR 0.33 V
T
= +25°C; SHDN, DPRSLPVR, PGD_IN,
A
PSI, D0–D6 = 0 or 5V
V
DD
0.4V
­ V
-1 +1 µA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
PWM CONTROLLER
Input Voltage Range
FB Output-Voltage Accuracy
Boot Voltage V
V
FB
BOOT
GNDS Input Range -200 +200 mV
GNDS Gain A
TIME Regulation Voltage V
GNDS
TIME
R
TIME Slew-Rate Accurac y
VCC, V
DD
7 26
V
IN
Measured at FB with respect to GNDS, includes load­regulation error (Note 3)
DAC codes from
0.8125V to 1.5000V
DAC codes from
0.3750V to 0.8000V
DAC codes from 0 to 0.3625V
4.5 5.5
-0.75 +0.75 %
-10 +10
-25 +25
1.085 1.115 V
V
/V
OUT
= 147k 1.985 2.015 V
TIME
R
= 147k (6.08mV/µs nominal) -10 +10
TIME
R
= 35.7k (25mV/µs nominal) to
TIME
178k (5mV/µs nominal)
0.95 1.05 V/V
GNDS
-15 +15
Soft-start and soft-shutdown: R
= 35.7k (6.25mV/µs nominal) to
TIME
-20 +20
178k (1.25mV/µs nominal)
V
mV
%
MAX17030/MAX17036
1/2/3-Phase Quick-PWM
IMVP-6.5 VID Controllers
_______________________________________________________________________________________ 7
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kfrom FBAC to CSN_, [D6–D0] = [0101000]; TA= -40oC to +105°C, unless otherwise noted.)
(Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
On-Time Accuracy t
Minimum Off-Time t
BIAS CURRENTS
Quie sc ent Supply Current (VCC) I
FAULT PROTECTION
Output Overvoltage-Protection Threshold
Output Undervoltage-Protection Threshold
CLKEN Startup Delay and Boot Time Period
PWRGD Startup Dela y
CLKEN and PWRGD Threshold
CLKEN, PWRGD Output
Low Voltage
VCC Undervoltage-Lockout Threshold
THERMAL PROTECTION
VRHOT Trip Threshold
VRHOT Output On-Resistance R
ON
OFF(MIN)
CC
V
OVP
V
UVP
t
BOOT
V
UVLO(VCC)
ON(VRHOT)
VIN = 10V,
= 1.0V,
V
FB
measured at DH1, DH2, and PWM3 (Note 4)
Measured at DH1, DH2, and PWM3 (Note 4) 400 ns
Measured at VCC, DPRSLPVR = 5V, FB forced above the regulation point
Skip mode after output reache s the regulation voltage or PWM mode; measured at FB with respect to the voltage target set by the VID code (see Table 4)
Soft-start, soft-shutdown, skip mode, and output have not reached the regulation voltage; measured at FB
Measured at FB with respect to the voltage target set by the VID code (see Table 4)
Measured from the time when FB reaches the boot target vo ltage (Note 3)
Measured at startup from the time when CLKEN goes low
Mea sured at FB with respect to the vo ltage target set by the VID code (see Table 4), 20mV hysteresi s (typ)
Low state, I
Rising edge, 65mV typical hy steresi s, controller disabled below this level
Measured at THRM with respect to V falling edge, typical hysteresis = 75mV
Low state 8
SINK
R per phase), 167ns nominal
R per phase), 333ns nominal
R per phase), 500ns nominal
= 3mA 0.4 V
= 96.75k (600kHz
TON
= 200k (300kHz
TON
= 303.25k (200kHz
TON
Lower threshold, falling edge (undervolt age)
Upper threshold, rising edge (overvoltage)
,
CC
-15 +15
-10 +10
-15 +15
7 mA
250 350 mV
1.45 1.55 V
-450 -350 mV
20 100 µs
3 10 m s
-350 -250
+150 +250
4.05 4.5 V
29 31 %
%
mV
MAX17030/MAX17036
1/2/3-Phase Quick-PWM IMVP-6.5 VID Controllers
8 _______________________________________________________________________________________
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VALLEY CURRENT LIMIT, DROOP, CURRENT BALANCE, AND CURRENT MONITOR
V
TIME
- V
ILIM
= 100mV 7 13
V
TIME
- V
ILIM
= 500mV 45 55
Current-Limit Threshold Voltage (Positive)
V
LIMIT
V
CSP_
- V
CSN_
ILIM = V
CC
20 25
mV
Current-Limit Threshold Voltage (Negative) Accuracy
V
LIMIT(NEG) VCSP_
- V
CSN_
, nominally -125% of V
LIMIT
-4 +4 mV
CSP_, CSN_ Common-Mode Input Range
0 2 V
Phase s 2, 3 Di sable Thresho ld Measured at CSP2, CSP3 3
V
CC
-
0.4
V
Droop Amplifier Offset
(1/N) x (V
CSP_
- V
CSN_
) at I
FBAC
= 0; indicates summation over all power-up enabled phases from 1 to N, N = 3
-1 +1
mV/
phase
Droop Amplifier Transconductance
G
m(FBAC)
I
FBAC
/[(V
CSP_
- V
CSN_
)]; indicates summation over all power-up enabled phase s from 1 to N, N = 3, V
FBAC
= V
CSN_
= 0.45V to 1.5V
390 407 μS
Current-Monitor Offset
(1/N) x (V
CSP_
- V
CSN_
) at I
FBAC
= 0; indicates summation over all power-up enabled phases from 1 to N, N = 3
-1.5 +1.5
mV/
phase
Current-Monitor Transconductance
G
m(IMON)
I
IMON
/[(V
CSP_
- V
CSN_
)]; indicates summation over all power-up enabled phase s from 1 to N, N = 3, V
CSN_
= 0.45V to 1.5V
1.536 1.664 mS
GATE DRIVERS
High state (pullup) 2.5
DH_ Gate-Driver On-Resistance R
ON(DH)
BST_ – LX_ forced to 5V
Low state (pulldown) 2
High state (pullup) 2
DL_ Gate-Driver On-Resistance R
ON(DL)
Low state (pulldown) 0.7
Internal BST_ Switch On-Resistance
R
ON(BST) IBST-
= 10mA 20
PWM3, DRSKP OUTPUTS
PWM3, DRSKP Output High Voltages
I
SOURCE
= 3mA
V
DD
-
0.4V
V
PWM3, DRSKP Output Low Voltages
I
SINK
= 3mA 0.4 V
LOGIC AND I/O
Logic-Input High Voltage V
IH
SHDN, PGD_IN 2.3 V
Logic-Input Low Voltage V
IL
SHDN, PGD_IN 1.0 V
Low-Voltage Logic-Input High Voltage
V
IHLV
PSI, D0–D6, DPRSLPVR 0.67 V
Low-Voltage Logic-Input Low Voltage
V
ILLV
PSI, D0–D6, DPRSLPVR 0.33 V
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 10V, VCC= VDD= V
SHDN
= V
PGD_IN
= V
PSI
= V
ILIM
= 5V, V
DPRSLPVR
= V
GNDS
= 0, V
CSP_
= V
CSN_
=
1.0000V, FB = FBAC, R
FBAC
= 3.57kΩ from FBAC to CSN_, [D6–D0] = [0101000]; TA= -40oC to +105°C, unless otherwise noted.)
(Note 5)
Note 3: The equation for the target voltage V
TARGET
is:
V
TARGET
= The slew-rate-controlled version of V
DAC
, where V
DAC
= 0 for shutdown
V
DAC
= V
BOOT
during IMVP-6.5 startup
V
DAC
= V
VID
otherwise (the V
VID
voltages for all possible VID codes are given in Table 4).
In pulse-skipping mode, the output rises by approximately 1.5% when transitioning from continuous conduction to no load.
Note 4: On-time and minimum off-time specifications are measured from 50% to 50% at the DH_ pin, with LX_ forced to 0V, BST_
forced to 5V, and a 500pF capacitor from DH_ to LX_ to simulate external MOSFET gate capacitance. Actual in-circuit times might be different due to MOSFET switching speeds.
Note 5: Specifications to -40°C and +105°C are guaranteed by design, not production tested.
MAX17030/MAX17036
1/2/3-Phase Quick-PWM
IMVP-6.5 VID Controllers
_______________________________________________________________________________________ 9
Typical Operating Characteristics
(Circuit of Figure 1. VIN= 12V, VCC= VDD= 5V, SHDN = VCC, D0–D6 set for 0.95V, TA= +25°C, unless otherwise specified.)
ELECTRICAL CHARACTERISTICS (continued)
EFFICIENCY vs. LOAD CURRENT
100
(V
90
80
70
60
50
EFFICIENCY (%)
40
30
20
0.1 100
= 0.95V)
OUT(HFM)
7V
LOAD CURRENT (A)
20V
101
MAX17030 toc01
12V
OUTPUT VOLTAGE vs. LOAD CURRENT
1.00
(V
0.95
0.90
OUTPUT VOLTAGE (V)
0.85
0.80 010 70
= 0.95V)
OUT(HFM)
LOAD CURRENT (A)
50 6020 30 40
MAX17030 toc02
EFFICIENCY (%)
EFFICIENCY vs. LOAD CURRENT
90
(V
7V
80
70
60
50
0.1 100
= 0.875V)
OUT(LFM)
20V
LOAD CURRENT (A)
12V
SKIP MODE PWM MODE
101
MAX17030 toc03
OUTPUT VOLTAGE vs. LOAD CURRENT
0.90
(V
0.89
0.88
0.87
0.86
OUTPUT VOLTAGE (V)
0.85
0.84
0.83
1-PHASE SKIP MODE
2-PHASE PWM MODE
020
= 0.875V)
OUT(LFM)
LOAD CURRENT (A)
400
350
MAX17030 toc04
300
250
200
150
100
SWITCHING FREQUENCY (kHz)
50
15510
0
SWITCHING FREQUENCY
V
OUT(LFM)
05040
vs. LOAD CURRENT
= 0.875V
V
OUT(HFM)
DPRSLPVR = V DPRSLPVR = GND
3010 20
LOAD CURRENT (A)
= 0.95V
CC
1000
100
MAX17030 toc05
10
1
SUPPLY CURRENT (mA)
0.1
0.01
V
OUT(HFM)
= 0.95V NO-LOAD
SUPPLY CURRENT vs. INPUT VOLTAGE
DPRSLPVR = V
DD
DPRSLPVR = GND
ICC + I
DD
I
IN
15912
I
IN
ICC + I
62118
INPUT VOLTAGE (V)
CC
MAX17030 toc06
MAX17030/MAX17036
1/2/3-Phase-Quick-PWM IMVP-6.5 VID Controllers
10 ______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Circuit of Figure 1. VIN= 12V, VCC= VDD= 5V, SHDN = VCC, D0–D6 set for 0.95V, TA= +25°C, unless otherwise specified.)
CURRENT BALANCE vs. LOAD CURRENT
MAX17030 toc07
LOAD CURRENT (A)
SENSE VOLTAGE (mV)
SENSE VOLTAGE DIFFERENCE (mV)
30 4010 20
5
10
15
20
0
-0.1
0
0.1
0.2
-0.2
0706050
V
OUT
= 0.95V
V
CSP1
- V
CSN1
V
CSP2
- V
CSN2
V
CS3
- V
CS1
V
CS2
- V
CS1
V
CSP3
-
V
CSN3
0.8125V OUTPUT
VOLTAGE DISTRIBUTION
MAX17030 toc09
OUTPUT VOLTAGE (V)
SAMPLE PERCENTAGE (%)
0.8085
0.8095
0.8105
0.8115
0.8125
0.8135
0.8145
0.8155
0.8165
0.8175
0.8075
20
10
30
40
50
60
70
0
+85°C +25°C
SAMPLE SIZE = 100
G
m(FB)
TRANSCONDUCTANCE
DISTRIBUTION
MAX17030 toc10
TRANCONDUCTANCE (µs)
SAMPLE PERCENTAGE (%)
392
394
396
398
400
402
404
406
408
410
390
20
10
30
40
50
60
70
0
+85°C +25°C
SAMPLE SIZE = 100
G
m(IMON)
TRANSCONDUCTANCE
DISTRIBUTION
MAX17030 toc11
TRANCONDUCTANCE (µs)
SAMPLE PERCENTAGE (%)
1560
1570
1580
1590
1600
1610
1620
1630
1640
1650
1550
15
5
10
20
25
30
35
40
0
+85°C +25°C
SAMPLE SIZE = 100
I
IMON
100
80
60
IMON (µA)
40
20
0
0605040
vs. LOAD CURRENT
V
= 0.95V
OUT
V
3010 20
CSP - CSN
DPRSLPVR = GND
(mV)
MAX17030 toc08
MAX17030/MAX17036
1/2/3-Phase-Quick-PWM
IMVP-6.5 VID Controllers
______________________________________________________________________________________
11
Typical Operating Characteristics (continued)
(Circuit of Figure 1. VIN= 12V, VCC= VDD= 5V, SHDN = VCC, D0–D6 set for 0.95V, TA= +25°C, unless otherwise specified.)
3.3V 0
3.3V 0
0.95V
0
0
0
0
A. SHDN, 5V/div B. CLKEN, 10V/div C. V
3.3V 0
3.3V 0
3.3V 0
0.95V
0
0
0
0
A. SHDN, 5V/div B. PWRGD, 10V/div C. CLKEN, 10V/div D. V
SOFT-START WAVEFORM
(UP TO CLKEN)
200µs/div
, 500mV/div
OUT
SHUTDOWN WAVEFORM
200µs/div
, 500mV/div
OUT
MAX17030 toc12
D. I
, 10A/div
LX1
, 10A/div
E. I
LX2
, 10A/div
F. I
LX3
, 15A
I
OUT
MAX17030 toc14
E. DL1, 10V/div F. DL2, 10V/div G. DL3, 10V/div
3.3V A B
C
D
E
F
A
B C
D
E
F
G
3.3V
3.3V
0.95V
59A
0.935V
0.84V
0
0
0
0
0
0
0
7A
SOFT-START WAVEFORM
(UP TO PWRGD)
A. SHDN, 5V/div B. CLKEN, 6.6V/div C. PWRGD, 10V/div
, 1V/div
D. V
OUT
1ms/div
LOAD-TRANSIENT RESPONSE
(HFM MODE)
A. I B. V
= 7A - 59A
OUT
OUT
, 50mV/div
20µs/div
MAX17030 toc13
E. DL1, 10V/div F. DL2, 10V/div G. DL3, 10V/div
, 15A
I
OUT
MAX17030 toc15
C. I
, 20A/div
LX1
, 20A/div
D. I
LX2
, 20A/div
E. I
LX3
A
B
C
D
E
F
G
A
B
C
D
E
MAX17030/MAX17036
1/2/3-Phase Quick-PWM IMVP-6.5 VID Controllers
12 ______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
Negative Input of the Output Current Sense of Phase 3. This pin should be connected to the
1 CSN3
2 CSP3
3 THRM
4 IMON
5 ILIM
6 TIME
7 VCC Controller Supply Voltage. Connect to a 4.5V to 5.5V source. Bypa ss to GND with 1µF minimum.
8 FB
negative side of the output current-sensing resistor or the filtering capacitor if the DC resistance of the output inductor is utilized for current sensing.
Positive Input of the Output Current Sense of Phase 3. This pin should be connected to the positive side of the output current-sensing resistor or the filtering capacitor if the DC resistance of the output inductor is utilized for current sensing. To disable phase 3, connect CSP3 to VCC and CSN3 to GND.
Input of Internal Comparator. Connect the output of a resistor- and thermistor-divider (between V and GND) to THRM. Select the component s such that the voltage at THRM fall s below 1.5V (30% of V
) at the desired high temperature.
CC
Current Monitor Output Pin. The output current at this pin is:
where G An external resistor R
where R Choose R IMON is high impedance when the MAX17030/MAX17036 are in shutdown.
Current-Limit Adju st Input. The va lley positive current-lim it threshold voltages at V(CSP_,CSN_) are precise ly 1/10 the different ial voltage V(TIME,ILIM) over a 0.1V to 0.5V range of V(TIME,ILIM). The valley negative current-limit thresholds are typically -125% of the corresponding valley positive current-limit thresholds. Connect ILIM to V
22.5mV typ.
Slew-Rate Adjustment Pin. The total resistance R
where R Thi s “normal” slew rate applies to transitions into and out of the low-power pulse-skipping modes and to the transition from boot mode to VID. The slew rate for startup and for entering shutdown is always 1/4 of normal. If the VID DAC inputs are clocked, the slew rate for all other VID transitions is set by the rate at which they are clocked, up to a maximum slew rate equal to the normal slew rate defined above.
Feedback Voltage Input. The voltage at the FB pin i s compared with the sle w-rate-controlled target voltage by the error comparator (fast regulation loop), as well as by the internal voltage integrator (slow, accurate regulation loop). Having sufficient ripple signal at FB that is in phase with the sum of the inductor currents is e ss ential for cycle-by-cycle stability. The external connection s and compensation at FB depend on the desired DC and transient (AC) droop values. If DC droop = AC droop, then short FB to FBAC. To d isable DC droop, connect FB to the remote-sensed output voltage through a resistor R and feed forward the FBAC ripple to FB through capacitor C, where the R x C time constant should be at least 3x the switching period per phase.
M(IMON)
SENSE
TIME
= 1.6mS typical and  denotes summation over al l enabled phases.
IMON
is the value of the effective current-sense res istance.
such that V
IMON
is between 35.7 k and 178k.
IMON
I
= G
IMON
between IMON and GNDS sets the current-monitor output voltage:
= I
V
IMON
does not exceed 900mV at the maximum expected load current I
Slew rate = (12.5mV/µs) x (71.5k/R
LOAD
x R
x V(CSP_,CSN_)
M(IMON)
x G
SENSE
to get the default current-lim it threshold setting of
CC
from TIME to GND sets the internal slew rate:
TIME
M(IMON)
x R
TIME
IMON
)
CC
MAX
.
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