MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
_______________________________________________________________________________________ 3
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
SUP
= +14V, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
(Voltages referenced to GND.)
SUP, EN..................................................................-0.3V to +42V
BST to LX..................................................................-0.3V to +6V
LX..............................................................-0.3V to (V
SUP
+ 0.3V)
BST .........................................................................-0.3V to +47V
OUTS ......................................................................-0.3V to +12V
SYNC, PGOOD, BIAS............................................-0.3V to +6.0V
PGND to GND .......................................................-0.3V to +0.3V
LX Continuous RMS Current .................................................1.0A
OUTS Short-Circuit Duration ......................................Continuous
ESD Protection
Human Body Model .........................................................±2kV
Machine Model ..............................................................±200V
Continuous Power Dissipation (T
A
= +70°C)
10-Pin TDFN (derate 24.4 mW/°C above +70°C) ..........1951mW
16-Pin TSSOP (derate 26.1 mW/°C above +70°C) ........2089mW
Junction-to-Case Thermal Resistance (θ
JC
) (Note 1)
10-Pin TDFN...................................................................9°C/W
16-Pin TSSOP.................................................................3°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 1)
10-Pin TDFN.................................................................41°C/W
16-Pin TSSOP............................................................38.3°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C