Rainbow Electronics MAX16834 User Manual

General Description
The MAX16834 is a current-mode high-brightness LED (HB LED) driver for boost, buck-boost, SEPIC, and high­side buck topologies. In addition to driving an n-channel power MOSFET switch controlled by the switching con­troller, it also drives an n-channel PWM dimming switch to achieve LED PWM dimming. The MAX16834 integrates all the building blocks necessary to implement a fixed-fre­quency HB LED driver with wide-range dimming control. The MAX16834 features constant-frequency peak cur­rent-mode control with programmable slope compensa­tion to control the duty cycle of the PWM controller.
A dimming driver designed to drive an external n-chan­nel MOSFET in series with the LED string provides wide-range dimming control up to 20kHz. In addition to PWM dimming, the MAX16834 provides analog dim­ming using a DC input at REFI. The programmable switching frequency (100kHz to 1MHz) allows design optimization for efficiency and board space reduction. A single resistor from RT/SYNC to ground sets the switching frequency from 100kHz to 1MHz while an external clock signal at RT/SYNC disables the internal oscillator and allows the MAX16834 to synchronize to an external clock. The MAX16834’s integrated high­side current-sense amplifier eliminates the need for a separate high-side LED current-sense amplifier in buck-boost applications.
The MAX16834 operates over a wide supply range of
4.75V to 28V and includes a 3A sink/source gate driver for driving a power MOSFET in high-power LED driver applications. The MAX16834 is also suitable for DC-DC converter applications such as boost or buck-boost. Additional features include external enable/disable input, an on-chip oscillator, fault indicator output (FLT) for LED open/short or overtemperature conditions, and an overvoltage protection sense input (OVP+) for true overvoltage protection.
The MAX16834 is available in a thermally enhanced 4mm x 4mm, 20-pin TQFN-EP package and is specified over the automotive -40°C to +125°C temperature range.
Applications
Single-String LED LCD Backlighting
Automotive Rear and Front Lighting
Projection System RGB LED Light Sources
Architectural and Decorative Lighting (MR16, M111)
Spot and Ambient Lights
DC-DC Boost/Buck-Boost Converters
Features
o Wide Input Operating Voltage Range (4.75V to
28V)
o 3000:1 PWM Dimming
o Analog Dimming
o Integrated PWM Dimming MOSFET Driver
o Integrated High-Side Current-Sense Amplifier for
LED Current Sense in Buck-Boost Converter
o 100kHz to 1MHz Programmable High-Frequency
Operation
o External Clock Synchronization Input
o Programmable UVLO
o Internal 7V Low-Dropout Regulator o Fault Output (FLT) for Overvoltage, Overcurrent,
and Thermal Warning Faults
o Programmable True Differential Overvoltage
Protection
o 20-Pin TQFN-EP Package
MAX16834
High-Power LED Driver with Integrated High-Side LED
Current Sense and PWM Dimming MOSFET Driver
________________________________________________________________
Maxim Integrated Products
1
Simplified Application Circuit
Ordering Information
19-4235; Rev 0; 8/08
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
+
Denotes a lead-free/RoHS-compliant package.
*
EP = Exposed pad.
PART TEMP RANGE
PIN-PACKAGE
MAX16834ATP+
-40°C to +125°C 20 TQFN-EP*
Pin Configuration appears at end of data sheet.
IN
MAX16834
PWMDIM
REFI
PGND
BOOST LED DRIVER
NDRV
CS
DIMOUT
SENSE+
LED+
LEDs
LED-
V
OFF
IN
ANALOG
ON
DIM
MAX16834
High-Power LED Driver with Integrated High-Side LED Current Sense and PWM Dimming MOSFET Driver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN= VHV= 12V, V
UVEN
= 5V, VLV= V
PWMDIM
= SGND, C
VCC
= 4.7µF, C
LCV
= 100nF, C
REF
= 100nF, R
SENSE+
= 0.1Ω,
R
RT
= 10k, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
IN, HV, LV to SGND................................................-0.3V to +30V
OVP+, SENSE+, DIMOUT, CLV to SGND ..............-0.3V to +30V
SENSE+ to LV........................................................-0.3V to +0.3V
HV, IN to LV ............................................................-0.3V to +30V
OVP+, CLV, DIMOUT to LV ......................................-0.3V to +6V
PGND to SGND .....................................................-0.3V to +0.3V
V
CC
to SGND..........................................................-0.3V to +12V
NDRV to PGND...........................................-0.3V to (V
CC
+ 0.3V)
All Other Pins to SGND.............................................-0.3V to +6V
NDRV Continuous Current................................................±50mA
DIMOUT Continuous Current..............................................±2mA
V
CC
Short-Circuit Current to SGND Duration ...........................1s
Continuous Power Dissipation (T
A
= +70°C) 20-Pin TQFN 4mm x 4mm
(derate 25.6mW/°C* above +70°C) ............................2051mW
Junction-to-Ambient Thermal Resistance (
θ
JA
) (Note 1).....39°C/W
Junction-to-Case Thermal Resistance (
θ
JC
) (Note 1) ........6°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
*
As per JEDEC51 standard (multilayer board).
Input Voltage Range V
Quiescent Supply Current I
Shutdown Supply Current I
INTERNAL LINEAR REGULATOR (VCC)
Output Voltage V
Dropout Voltage V
Short-Circuit Current VCC = 0V, VIN = 12V 80 300 mA
LINEAR REGULATOR (CLV)
Output Voltage (V
Dropout Voltage V
Short-Circuit Current V
REFERENCE VOLTAGE (REF)
Output Voltage V
REF Short-Circuit Current V
UNDERVOLTAGE LOCKOUT/ENABLE INPUT (UVEN)
UVEN On Threshold Voltage V
UVEN Threshold Voltage Hysteresis
Input Leakage Current I
PWMDIM
PWMDIM On Threshold Voltage V
PWMDIM Threshold Voltage Hysteresis
Input Leakage Current V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IN
Q
SHDN
CC
OD
CLV - VLV
DO
REF
UVEN_THUP
LEAK
PWMDIM
Excluding I
V
UVEN
0 ICC 50mA, 9.5V VIN 28V 6.3 7 7.7 V
ICC = 35mA (Note 2) 0.65 1.8 V
0 I
CLV
)
6V ≤ V
I
= 2mA, 0 ≤ VLV 23.3V (Note 3) 0.5 V
CLV
= 12V, VIN = 12V, VHV = 24V 2.2 10 mA
CLV
0 I
REF
= 0 30 mA
REF
V
UVEN
PWMDIM
LED
= 0 30 60 µA
2mA, 6V VHV 28V,
22V
(HV-LV)
1mA, 4.75V VIN 28V 3.625 3.70 3.775 V
= 0 I1I µA
= 0 I1I µA
4.75 28 V
4.7 5 5.3 V
1.395 1.435 1.475 V
200 mV
1.395 1.435 1.475 V
200 mV
610mA
MAX16834
High-Power LED Driver with Integrated High-Side LED
Current Sense and PWM Dimming MOSFET Driver
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VIN= VHV= 12V, V
UVEN
= 5V, VLV= V
PWMDIM
= SGND, C
VCC
= 4.7µF, C
LCV
= 100nF, C
REF
= 100nF, R
SENSE+
= 0.1Ω,
R
RT
= 10k, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= +25°C.)
OSCILLATOR
Oscillator Frequency f
Oscillator Frequency Range (Note 4) 100 1000 kHz
External Sync Input Clock High Threshold
External Sync Input Clock Low Threshold
External Sync Input High Pulse Width
Maximum External Sync Period 50 µs
SLOPE COMPENSATION (SC)
SC Pullup Current I
SC Discharge Resistance R
REFI
REFI Input Bias Current V
REFI Input Common-Mode Range (Note 4) 0 2 V
SENSE+
SENSE+ Input Bias Current (V
HIGH-SIDE LED CURRENT-SENSE AMPLIFIER (V
Input Offset Voltage VLV > 5V, (V
Voltage Gain A
3dB Bandwidth
LOW-SIDE LED CURRENT-SENSE AMPLIFIER
Input Offset Voltage VLV < 1V, (V
Voltage Gain A
3dB Bandwidth 600 kHz
CURRENT ERROR AMPLIFIER (TRANSCONDUCTANCE AMPLIFIER)
Transconductance g
Open-Loop DC Gain A
Input Offset Voltage -10 0 +10 mV
COMP Voltage Range V
PWM COMPARATOR
Input Offset Voltage 0.6 0.65 0.70 V
Propagation Delay t
Minimum On-Time t
Duty Cycle (Note 4) 90 99.5 %
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
OSC
SCPU
SCD
V
V
m
V
COMP
PD
ON(MIN)
R
RT/SYNC
R
RT/SYNC
(Note 4) 2 V
(Note 4) 0.4 V
(Note 4) 200 ns
VSC = 100mV 80 100 120 µA
VSC = 100mV 8
REFI
VLV > 5V, (V
(V
(V
VLV < 1V, (V
V
COMP
(Note 4) 0.4 2.5 V
50mV overdrive 40 ns
On-time includes blanking time 100 ns
= 5k 0.9 1 1.1 MHz = 25k 180 200 220 kHz
= 1V I1I µA
- VLV) = 100mV 250 µA
SENSE+
- VLV)
SENSE+
- VLV) = 0.1V, no load 1.8 MHz
SENSE+
- VLV) = 0.02V, no load 600 kHz
SENSE+
= 2V, V
- VLV) = 5mV -2.4 0 +2.4 mV
SENSE+
- VLV) = 0.2V 9.7 9.9 10.1 V/V
SENSE+
- VLV) = 0V -2 0 +2 mV
SENSE+
- VLV) = 0.2V 9.7 9.9 10.1 V/V
SENSE+
= 5V 400 500 600 µS
PWMDIM
60 dB
MAX16834
High-Power LED Driver with Integrated High-Side LED Current Sense and PWM Dimming MOSFET Driver
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VIN= VHV= 12V, V
UVEN
= 5V, VLV= V
PWMDIM
= SGND, C
VCC
= 4.7µF, C
LCV
= 100nF, C
REF
= 100nF, R
SENSE+
= 0.1Ω,
R
RT
= 10k, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= +25°C.)
Note 2: Dropout voltage is defined as VIN- VCC, when VCCis 100mV below the value of VCCfor VIN= 9.5V. Note 3: Dropout is defined as V
HV
- V
CLV
, when V
CLV
is 100mV below the value of V
CLV
for VHV= 8V.
Note 4: Not production tested. Guaranteed by design.
CURRENT PEAK LIMIT COMPARATOR
Trip Threshold Voltage 0.25 0.3 0.35 V
Propagation Delay 50mV overdrive with respect to NDRV 40 ns
OVERVOLTAGE PROTECTION INPUT (OVP+)
OVP+ On Threshold Voltage V
OVP+ Hysteresis 200 mV
OVP+ Input Leakage Current (V
HIGH-SIDE LED SHORT COMPARATOR
Off Threshold V
On Threshold V
Error Reject Blankout f
LOW-SIDE LED SHORT COMPARATOR
Off Threshold 0.27 0.30 0.33 V
Error Reject Blankout s
HICCUP TIMER
Hiccup Time f
GATE-DRIVER OUTPUT (NDRV)
NDRV Peak Pullup Current VCC = 7V 3 A
NDRV Peak Pulldown Current VCC = 7V 3 A
p-Channel MOSFET R
n-Channel MOSFET R
DIMOUT
DIMOUT Peak Pullup Current (V
DIMOUT Peak Pulldown Current (V
p-Channel MOSFET R
n-Channel MOSFET R
PWMDIM to DIMOUT Propagation Delay
FAULT FLAG (FLT)
FLT Pulldown Current V FLT Leakage Current V
Thermal Warning On Threshold +140 °C
Thermal Warning Threshold Hysteresis
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DSON
DSON
DSON
DSON
OVP_ON
- VLV) = 1.235V -1 +1 µA
OVP
- V
CLV
LV
- V
CLV
LV
= 500kHz 256 µs
OSC
= 500kHz 8.2 ms
OSC
(VCC - V
V
(V
(V
NDRV
= 0.1V 0.9 1.7
NDRV
- VLV) = 5V 25 50 mA
CLV
- VLV) = 5V 25 50 mA
CLV
- V
CLV
DIMOUT
- VLV) = 0.1V 25
DIMOUT
= 0.2V 2 5 10 mA
FLT
= 1.0V I1I µA
FLT
) = 0.1V 1.2 1.9
) = 0.1V 31
1.375 1.435 1.495 V
4.0 4.3 4.6 V
4.1 4.4 4.7 V
200 ns
20 °C
MAX16834
High-Power LED Driver with Integrated High-Side LED
Current Sense and PWM Dimming MOSFET Driver
_______________________________________________________________________________________ 5
V
(V)
Typical Operating Characteristics
(VIN= VHV= 12V, V
UVEN
= 5V, VLV= V
PWMDIM
= SGND, C
VCC
= 4.7µF, C
LCV
= 100nF, C
REF
= 100nF, R
SENSE+
= 0.1Ω,
R
RT
= 10k, TA= +25°C, unless otherwise noted.)
V
vs. TEMPERATURE
REF
3.74
3.72
3.70
(V)
3.68
REF
V
3.66
3.64
3.62
3.60
-40 125 TEMPERATURE (°C)
VIN = 12V
11095-25 -10 5 35 50 6520 80
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
20
18
16
14
12
10
8
6
SUPPLY CURRENT (mA)
4
2
0
428
SUPPLY VOLTAGE (V)
PWMDIM = 0
242016128
3.80
3.75
MAX16834 toc01
3.70
(V)
3.65
REF
V
3.60
3.55
3.50
10
9
MAX16834 toc04
8
7
6
5
4
3
SUPPLY CURRENT (mA)
2
1
0
V
REF
428
vs. TEMPERATURE
-40 125
vs. SUPPLY VOLTAGE
SUPPLY VOLTAGE (V)
SUPPLY CURRENT
VIN = 12V PWMDIM = 0
TEMPERATURE (°C)
242016128
1109565 80-10 5 20 35 50-25
3.7020
3.7015
MAX16834 toc02
3.7010
3.7005
3.7000
REF
3.6995
3.6990
3.6985
3.6980
100
MAX16834 toc05
10
RT (kΩ)
1
V
vs. I
REF
010
I
(mA)
REF
RT vs. SWITCHING FREQUENCY
VIN = 12V
SWITCHING FREQUENCY (kHz)
REF
VIN = 12V
MAX16834 toc03
981 2 3 5 64 7
MAX16834 toc06
1000100
SWITCHING FREQUENCY
605 604 603 602 601 600 599 598 597 596 595 594
SWITCHING FREQUENCY (kHz)
593 592 591
590
-40 125
TEMPERATURE (°C)
VIN = 12V
1109565 80-10 5 20 35 50-25
MAX16834 toc07
7.16
7.14
7.12
7.10
7.08
7.06
(V)
7.04
CC
7.02
V
7.00
6.98
6.96
6.94
6.92
6.90 0100
vs. TEMPERATURE
VCC vs. I
ICC (mA)
CC
VIN = 12V
908060 7020 30 40 5010
MAX16834 toc08
7.2 TA = +125°C
7.1
(V)
7.0
TA = +25°C
CC
V
6.9
6.8
0100
VCC vs. I
TA = +100°C
TA = -40°C
ICC (mA)
CC
VIN = 12V
MAX16834 toc09
908070605040302010
Pin Description
MAX16834
High-Power LED Driver with Integrated High-Side LED Current Sense and PWM Dimming MOSFET Driver
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(VIN= VHV= 12V, V
UVEN
= 5V, VLV= V
PWMDIM
= SGND, C
VCC
= 4.7µF, C
LCV
= 100nF, C
REF
= 100nF, R
SENSE+
= 0.1Ω,
R
RT
= 10k, TA= +25°C, unless otherwise noted.)
VCC vs. V
IN
MAX16834 toc10
VIN (V)
V
CC
(V)
26
22
1814
10
7.02
7.04
7.06
7.08
7.10
7.12
7.14
7.16
7.18
7.20
7.00 6
TA = +125°C
TA = +25°C
TA = -40°C
NDRV RISE/FALL TIME
vs. CAPACITANCE
MAX16834 toc11
CAPACITANCE (nF)
NDRV RISE TIME (ns)
987654321
10
20
30
40
50
0
010
VIN = 12V
RISE TIME
FALL TIME
V
CLV
vs. V
HV
MAX16834 toc13
VHV (V)
V
CLV
(V)
26
22
18
14
10
5.01
5.02
5.03
5.04
5.05
5.06
5.07
5.08
5.09
5.10
5.00 6
VIN = 12V
V
CLV
vs. I
CLV
MAX16834 toc12
I
CLV
(mA)
V
CLV
(V)
4.54.03.0 3.51.0 1.5 2.0 2.50.5
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
0
05.0
VIN = 12V
PIN NAME FUNCTION
LED-String Overvoltage Protection Input. Connect a resistive voltage-divider between the positive
1 OVP+
2 SGND Signal Ground
3 COMP
4 REF 3.7V Reference Output Voltage. Bypass REF to SGND with a 0.1µF to 0.22µF ceramic capacitor.
5 REFI
6SC
output, OVP+, and LV to set the overvoltage threshold. OVP+ has a 1.435V threshold voltage with a 200mV hysteresis.
Error-Amplifier Output. Connect an RC network from COMP to SGND for stable operation. See the Feedback Compensation section.
Current Reference Input. V
provides a reference voltage for the current-sense amplifier to set the
REFI
LED current.
Current-Mode Slope Compensation Setting. Connect to an appropriate external capacitor from SC to SGND to generate a ramp signal for stable operation.
MAX16834
High-Power LED Driver with Integrated High-Side LED
Current Sense and PWM Dimming MOSFET Driver
_______________________________________________________________________________________ 7
Pin Description (continued)
Detailed Description
The MAX16834 is a current-mode, high-brightness LED (HB LED) driver designed to control a single-string LED current regulator with two external n-channel MOSFETs.
The MAX16834 integrates all the building blocks nec­essary to implement a fixed-frequency HB LED driver with wide-range dimming control. The MAX16834 allows implementation of different converter topologies such as SEPIC, boost, buck-boost, or high-side buck current regulator.
The MAX16834 features a constant-frequency, peak-cur­rent-mode control with programmable slope compensa­tion to control the duty cycle of the PWM controller. A dimming driver offers a wide-range dimming control for the external n-channel MOSFET in series with the LED string. In addition to PWM dimming, the MAX16834 allows for analog dimming of LED current.
The MAX16834 switching frequency (100kHz to 1MHz) is adjustable using a single resistor from RT/SYNC. The
MAX16834 disables the internal oscillator and synchro­nizes if an external clock is applied to RT/SYNC. The switching MOSFET driver sinks and sources up to 3A, making it suitable for high-power MOSFETs driving in HB LED applications, and the dimming control allows for wide PWM dimming at frequencies up to 20kHz.
The MAX16834 is suitable for boost and buck-boost LED drivers (Figures 2 and 3).
The MAX16834 operates over a wide 4.75V to 28V sup­ply range. Additional features include external enable/disable input, an on-chip oscillator, fault indica­tor output (FLT) for LED open/short or overtemperature conditions, and an overvoltage protection circuit for true differential overvoltage protection (Figure 1).
The MAX16834 is also suitable for DC-DC converter applications such as boost or buck-boost (Figures 6 and 7). Other applications include boost LED drivers with automotive load dump protection (Figure 4) and high-side buck LED drivers (Figure 5).
PIN NAME FUNCTION
7 FLT Active-Low, Open-Drain Fault Indicator Output. See the Fault Indicator (
Resistor-Programmable Switching Frequency Setting/Sync Control Input. Connect a resistor from
8 RT/SYNC
9 UVEN
10 PWMDIM PWM Dimming Input. Connect to an external PWM signal for dimming operation.
11 CS
12 PGND Power Ground
13 NDRV External n-Channel Gate-Driver Output
14 V
15 IN Positive Power-Supply Input. Bypass to PGND with at least a 0.1µF ceramic capacitor.
16 HV High-Side Positive Supply Input Referred to LV. HV provides power to high-side linear regulator CLV.
17 CLV
18 DIMOUT External Dimming MOSFET Gate Driver. DIMOUT is capable of sinking/sourcing 50mA.
19 LV
20 SENSE+ LED Current-Sense Positive Input
—EP
CC
RT/SYNC to SGND to set the switching frequency. Drive RT/SYNC to synchronize the switching frequency with an external clock.
Undervoltage-Lockout (UVLO) Threshold/Enable Input. UVEN is a dual-function adjustable UVLO threshold input with an enable feature. Connect UVEN to VIN through a resistive voltage-divider to program the UVLO threshold. Observe the absolute maximum value for this pin.
Current-Sense Amplifier Positive Input. Connect a resistor from CS to PGND to set the inductor peak current limit.
7V Low-Dropout Voltage Regulator. Bypass to PGND with at least a 1µF low-ESR ceramic capacitor.
provides power to the n-channel gate driver (NDRV).
V
CC
5V High-Side Regulator Output. CLV provides power to the dimming MOSFET driver. Connect a 0.1µF to 1µF ceramic capacitor from CLV to LV for stable operation.
High-Side Reference Voltage Input. Connect to SGND for boost configuration. Connect to IN for buck­boost configuration.
Exposed Pad. Connect EP to a large-area contiguous copper ground plane for effective power dissipation. Do not use as the main IC ground connection. EP must be connected to SGND.
FLT
) section.
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