The MAX1610/MAX1611 are fully integrated, highefficiency drivers for cold-cathode fluorescent lamps
(CCFLs). They operate from a 4.5V to 26V power
source. An on-board, high-switching-frequency power
MOSFET reduces external component count and magnetics size. The MAX1610/MAX1611 protect against
open or shorted lamps. The CCFL can be driven from
an isolated transformer secondary winding to improve
efficiency and avoid flicker at dim tube settings.
Brightness is adjusted by scaling the lamp current, or
by operating with a fixed lamp current and chopping
the CCFL on and off at a rate faster than the eye can
detect.
The MAX1610’s digital inputs increment, decrement, or
clear an internal, 5-bit up/down counter, which sets
CCFL brightness. The MAX1611 uses a System
Management Bus (SMBus) 2-wire serial interface to
directly set CCFL brightness. Both devices include
micropower shutdown and a linear regulator that eliminates the need for a separate logic supply. The digital
interface remains active in shutdown, preserving the
brightness setting.
________________________Applications
Notebook/Laptop Computers
Point-of-Sale Terminals
Portable Medical Equipment
Instrument Displays
____________________________Features
Direct Digital Control of CCFL Brightness
Low Supply Current: 3mA Max Operating
20µA Max Shutdown
Low-Voltage Operation, Down to 4.5V
Internal 26V, 0.7WPower Switch
Protection Against Open or Shorted Lamps
Supports Isolated Transformer Secondary
Winding
SMBus Serial Interface (MAX1611)
No Flicker at Low Brightness (internal 280Hz
current chopping)
High Power-to-Light Efficiency
Selectable 290kHz/145kHz Switching Frequency
Oscillator SYNC Input
16-Pin Narrow SO Package
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800
Digitally Controlled CCFL Backlight
Power Supplies
ABSOLUTE MAXIMUM RATINGS
BATT to GND............................................................-0.3V to 28V
BST to GND ..............................................................-0.3V to 30V
BST to LX....................................................................-0.3V to 6V
LX to GND................................................-0.6V to (BATT + 0.3V)
VL to GND...................................................................-0.3V to 6V
CS, CSAV, CC, SYNC, REF, MINDAC,
SS, OTP to GND............................................-0.3V to (VL + 0.3V)
SHDN, UP, DN to GND...............................................-0.3V to 6V
SMBSUS, SDA, SCL to GND ......................................-0.3V to 6V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(TA= 0°C to +70°C, BATT = 8.2V, MINDAC = 0V, unless otherwise noted. Typical values are at TA= +25°C.)
MAX1610/MAX1611
SUPPLY AND REFERENCE
BATT Input Voltage RangeV
BATT Quiescent Supply Current,
Logic-Level Input. A rising edge on UP increments the 5-bit counter for the 5-bit DAC.
UP = DN = 1 presets the counter to mid-scale.
System Management Bus Serial Data Input and Open-Drain Output
Logic-Level Input. A rising edge on DN decrements the 5-bit counter for the 5-bit DAC.
UP = DN = 1 presets the counter to mid-scale.
System Management Bus Serial Clock Input
Logic-Level Shutdown Input Pin. Applying a logic low to SHDN places the chip in a low-
supply-current shutdown mode.
System Management Bus Suspend Mode Input. SMBSUS Selects one of two chip-
configuration settings, which are preprogrammed serially.
Oscillator Synchronization Input. Tying SYNC to REF sets the oscillator frequency to 290kHz.
Tying SYNC to GND or VL lowers the oscillator frequency to 145kHz.
Soft-Start Pin. A 4µA current source feeds the capacitor placed on SS. The voltage on this
pin limits the peak current in the switch. When the lamp is turned off, SS pulls to GND.
Output of the Voltage-to-Current Converter; Input to the PWM Comparator, which sets the
current limit. A capacitor placed at CC sets the current-regulator-loop bandwidth.
Input to the Voltage-to-Current Converter, which averages the voltage on CSAV using the
capacitor on CC.
The voltage at MINDAC sets the DAC’s minimum-scale output voltage. Tying MINDAC to
VL enables the internal 280Hz current-chopping mode.
2.0V Reference Output. Bypass with 0.1µF to GND.
Open-Tube Protection Comparator. As long as OTP exceeds the reference voltage, the
N-channel BATT-to-LX switch is forced off.
Low-Side Current-Sense Input. The current-mode regulator terminates the switch cycle
when the voltage at CS exceeds REF - CC.
Output of the Internal Linear Regulator. VL can be overdriven by a voltage greater than 4.75V
to operate the chip from +5V ± 5%, and to conserve power. Bypass with 0.1µF to GND.
System Ground
Power Input to the High-Side Gate Driver, which switches the internal N-channel MOSFET
on and off.
Ground Connection for the Internal High-Side Gate Driver; source-connection point for the
internal N-channel MOSFET
4.5V to 25V Battery-Voltage Input Point. Connects to the internal N-channel power MOSFET’s
drain, and to the input of the internal linear regulator that powers the chip.