Rainbow Electronics MAX1531 User Manual

General Description
The MAX1530/MAX1531 multiple-output power-supply controllers generate all the supply rails for thin-film tran­sistor (TFT) liquid-crystal display (LCD) monitors. Both devices include a high-efficiency, fixed-frequency, step-down regulator. The low-cost, all N-channel, syn­chronous topology enables operation with efficiency as high as 93%. High-frequency operation allows the use of small inductors and capacitors, resulting in a com­pact solution. The MAX1530 includes three linear regu­lator controllers and the MAX1531 includes five linear regulator controllers for supplying logic and LCD bias voltages. A programmable startup sequence enables easy control of the regulators.
The MAX1530/MAX1531 include soft-start functions to limit inrush current during startup. An internal step­down converter current-limit function and a versatile overcurrent shutdown protect the power supplies against fault conditions. The MAX1530/MAX1531 use a current­mode control architecture, providing fast load transient response and easy compensation. An internal linear regulator provides MOSFET gate drive and can be used to power small external loads.
The MAX1530/MAX1531 can operate from inputs as high as 28V and are well suited for LCD monitor and TV applications running directly from AC/DC wall adapters. Both devices are available in a small (5mm x 5mm), ultra-thin (0.8mm), 32-pin QFN package and operate over the -40°C to +85°C temperature range.
Applications
LCD Monitors and TVs
Automotive LCDs
Features
4.5V to 28V Input Voltage Range250kHz/500kHz Current-Mode Step-Down Converter
Small Inductor/Capacitors No Sense Resistor
Three Positive Linear Regulator Controllers
One Positive and One Negative Additional Controller (MAX1531) Small Input and Output Capacitors
Timed Reset OutputUncommitted Overcurrent Protection (MAX1531)Soft-Start for All RegulatorsProgrammable Input Undervoltage ComparatorProgrammable Startup Sequencing
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
RESET
V
IN
V
GON
25V
V
GOFF
-9V
V
IN
= 12V
ONL2
V
SOURCE
10V/500mA
V
GAMMA
9.7V
V
N
ONL5
ONL4
ONL3
SEQ
VL
RSTIN
V
OUT
3.3V/1.5A
V
LOGIC
2.5V/500mA
V
OUT
V
L
V
L
V
P
V
N
V
IN
V
IN
V
P
V
L
DRV3
FBL3
FBL1
DRV1
BST
IN
DH
LX
DL
PGND
FB
COMP
FBL2
DRV2
FBL5
DRV5
DRV4
FBL4
CSH
CSL
FREQ
ILIM
VL
EN
AGND
MAX1530
Minimal Operating Circuit
19-2866; Rev 0; 5/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Pin Configuration appears at end of data sheet.
PART TEMP RANGE PIN-PACKAGE
MAX1530ETJ -40°C to +85°C 32 Thin QFN
MAX1531ETJ -40°C to +85°C 32 Thin QFN
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, VIN= 12V, VEN= V
SEQ
= 5V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
IN, DRV1, DRV2, DRV3, DRV4, CSH,
CSL to AGND .....................................................-0.3V to +30V
DRV5 to VL .............................................................-28V to +0.3V
CSH to CSL ..............................................................-0.3V to +6V
VL to AGND ..............................................................-0.3V to +6V
PGND to AGND...................................................................±0.3V
LX to BST..................................................................-6V to +0.3V
BST to AGND..........................................................-0.3V to +36V
DH to LX .....................................................-0.3V to (BST + 0.3V)
DL to PGND ..................................................-0.3V to (VL + 0.3V)
SEQ, ONL2, ONL3, ONL4, ONL5, COMP,
ILIM to AGND............................................-0.3V to (VL + 0.3V)
RSTIN, RESET, EN, FB, FBL1, FBL2, FBL3, FBL4, FBL5,
FREQ to AGND.....................................................-0.3V to +6V
VL Short Circuit to AGND ...........................................Momentary
Continuous Power Dissipation (T
A
= +70°C)
32-Pin Thin QFN (derate 21.3mW/°C above +70°C) ...1702mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
GENERAL
PARAMETER CONDITIONS MIN TYP MAX UNITS
Operating Input Voltage Range (Note 1) 4.5 28.0 V Quiescent Supply Current V
FB
= V
FBL1
= V
FBL2
= V
IC Disable Supply Current EN = AGND 200 400 µA VL REGULATOR VL Output Voltage 5.5V < V
VL Undervoltage Lockout
Threshold
VL rising, 3% hysteresis 3.2 3.5 3.8 V
< 28V, 0 < IVL < 30mA 4.75 5 5.25 V
IN
CONTROL AND SEQUENCE SEQ, FREQ Input Logic High
Level
SEQ, FREQ Input Logic Low
Level
SEQ, FREQ Input Leakage
Current
2.0 V
0.6 V
-1 +1 µA
ONL_ Input Threshold ONL_ rising, 25mV hysteresis 1.201 1.238 1.275 V ONL_ Source Current SEQ = EN = VL, V
_ = 0 to 1.24V 1.8 2.0 2.2 µA
ONL
ONL_ Input Leakage Current SEQ = EN = VL, ONL_ = VL -500 +500 nA ONL_ Input Discharge Clamp
Resistance
SEQ = 0 800 1500 3000
EN Input Threshold EN rising, 5% hysteresis 1.201 1.238 1.275 V EN Input Leakage Current -50 +50 nA FAULT DETECTION
FB, FBL1, FBL2, FBL3, FBL4
Undervoltage Fault Trip Level
FBL5 Undervoltage Fault
Trip Level
FB, FBL1, FBL2, FBL3, FBL4 falling, 25mV hysteresis 1.081 1.114 1.147 V
FBL5 rising, 25mV hysteresis 300 400 500 mV
FBL3
= V
FBL4
= 1.5V, V
= 0 1.7 3.0 mA
FBL5
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 12V, VEN= V
SEQ
= 5V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
Dual Mode is a trademark of Maxim Integrated Products, Inc.
PARAMETER CONDITIONS MIN TYP MAX UNITS Comparator Bandwidth For EN, FB, FBL_ 10 kHz Duration to Trigger Fault Latch For FB, FBL_ 51 64 77 ms Overcurrent Protection Threshold (V Overcurrent Sense Common-
Mode Range
CSH Input Current V CSL Input Current V
Overcurrent Sense Filter RC Time
Constant
- V
) 270 300 330 mV
CSL
, V
CSL
= 2.7V to 28V 100 µA
= V
= 12V -50 +50 nA
CSH
2.7 28.0 V
V
CSH
CSH
CSH
CSL
50 µs
THERMAL PROTECTION Thermal Shutdown Temperature rising, 15°C hysteresis 160 °C RESET FUNCTION RSTIN Reset Trip Level RSTIN falling, 25mV hysteresis 1.081 1.114 1.147 V RSTIN Input Leakage Current V
= 1.5V -50 +50 nA
RSTIN
Comparator Bandwidth 10 kHz Reset Timeout Period 102 128 154 ms RESET Output Low Level I RESET Output High Leakage V
= -1mA 0.4 V
RESET
= 5V 1 µA
RESET
STEP-DOWN CONTROLLER ERROR AMPLIFIER FB Regulation Voltage 1.223 1.238 1.253 V
Transconductance FB to COMP 70 100 140 µS
Voltage Gain FB to COMP 200 V/V Minimum Duty Cycle 15 % FB Input Leakage Current V
= 1.5V -50 +50 nA
FB
FB Input Common-Mode Range (Note 2) -0.1 +1.5 V COMP Output Minimum Voltage V COMP Output Maximum Voltage V
Current-Sense Amplifier Voltage
Gain
Current-Limit Threshold
(Default Mode)
Current-Limit Threshold
(Adjustable Mode)
= 1.5V 1 V
FB
= 1.175V 3 V
FB
V
IN
- V
LX
2.75 3.5 4.0 V/V
PGND - LX, ILIM = VL 190 250 310 mV
PGND - LX, V
= 1.25V 190 250 310 mV
ILIM
ILIM Inp ut D ual M od e Thr eshol d 3.0 3.5 4.00 V OSCILLATOR
Switching Frequency
Maximum Duty Cycle
FREQ = AGND 200 250 300 FREQ = VL 425 500 575 FREQ = AGND 75 80 88 FREQ = VL 75 80 88
kHz
%
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 12V, VEN= V
SEQ
= 5V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
PARAMETER CONDITIONS MIN TYP MAX UNITS SOFT-START Step Size Measured at FB 1.238 / 32 V
Period
FET DRIVERS DH, DL On-Resistance 3 10 DH, DL Output Drive Current Sourcing or sinking, V LX, BST Leakage Current V
POSITIVE LINEAR REGULATOR (LR1) FBL1 Regulation Voltage V FBL1 Input Bias Current V
FBL1 Effective Load Regulation
Error (Transconductance)
FBL1 Line Regulation Error I DRV1 Sink Current V DRV1 Off-Leakage Current V
FBL1 Input Common-Mode
Range
Soft-Start Step Size Measured at FBL1 1.238 / 32 V
Soft-Start Period
POSITIVE LINEAR REGULATORS (LR2 AND LR3) FBL_ Regulation Voltage V FBL_ Input Bias Current V
FBL_ Effective Load Regulation
Error (Transconductance)
FBL_ Line Regulation Error I DRV_ Sink Current V DRV_ Off-Leakage Current V
FBL_ Input Common-Mode
Range
Soft-Start Step Size Measured at FBL_ 1.238 / 32 V
FREQ = GND 1024 / f FREQ = VL 2048 / f
BST
= V
LX
or VDL = V
DH
= V
= 28V 20 µA
IN
/ 2 0.5 A
VL
OSC
OSC
LINEAR REGULATOR CONTROLLERS
= 5V, I
DRV1
= 1.5V -50 +50 nA
FBL1
V
= 5V, I
DRV1
= 100µA, 5.5V < VIN < 28V 5 mV
DRV1
= 1.175V, V
FBL1
= 1.5V, V
FBL1
= 100µA 1.226 1.245 1.264 V
DRV1
= 100µA to 2mA -1.5 -2 %
DRV1
= 5V 3 10 mA
DRV1
= 28V 0.1 10 µA
DRV1
(Note 2) -0.1 +1.5 V
FREQ = GND 1024 / f FREQ = VL 2048 / f
_ = 5V, I
DRV
_ = 1.5V -50 +50 nA
FBL
V
_ = 5V, I
DRV
_ = 100µA, 5.5V < VIN < 28V 5 mV
DRV
= 1.175V, V
FBL_
_ = 1.5V, V
FBL
_ = 100µA 1.226 1.245 1.264 V
DRV
_ = 50µA to 1mA -1.5 -2 %
DRV
= 5V 2 4 mA
DRV_
_ = 28V 0.1 10 µA
DRV
OSC
OSC
(Note 2) -0.1 +1.5 V
s
s
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 12V, VEN= V
SEQ
= 5V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, VIN= 12V, VEN= V
SEQ
= 5V, TA = -40°C to +85°C, unless otherwise noted.) (Note 3)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Soft-Start Period
POSITIVE LINEAR REGULATOR (LR4) FBL4 Regulation Voltage V FBL4 Input Bias Current V
FBL4 Effective Load Regulation
Error (Transconductance)
FBL4 Line Regulation Error I DRV4 Sink Current V DRV4_Off-Leakage Current V
FBL4 Input Common-Mode
Range
Soft-Start Step Size Measured at FBL4 1.238 / 32 V
Soft-Start Period
NEGATIVE LINEAR REGULATOR (LR5) FBL5 Regulation Voltage V FBL5 Input Bias Current V
FBL5 Effective Load Regulation
Error (Transconductance)
FBL5 Line Regulation Error I DRV5 Source Current V DRV5 Off-Leakage Current V
FBL5 Input Common-Mode
Range
Soft-Start Step Size Measured at FBL5 1.238 / 32 V
Soft-Start Period
FREQ = GND 1024 / f FREQ = VL 2048 / f
= 5V, I
DRV4
= 1.5V -50 +50 nA
FBL4
V
= 5V, I
DRV4
= 500µA, 5.5V < VIN < 28V 5 mV
DRV4
= 1.175V, V
FBL4
= 1.5V, V
FBL4
= 500µA 1.226 1.245 1.264 V
DRV4
= 500µA to 10mA -1.5 -2 %
DRV4
= 5V 10 28 mA
DRV4
= 28V 0.1 10 µA
DRV4
OSC
OSC
(Note 2) -0.1 +1.5 V
FREQ = GND 1024 / f FREQ = VL 2048 / f
= -10V, I
DRV5
= 0 -50 +50 nA
FBL5
V
= -10V, I
DRV5
= 100µA, 5.5V < VIN < 28V 5 mV
DRV5
= 200mV, V
FBL5
= 0, V
FBL5
DRV5
= 100µA 100 125 150 mV
DRV5
= 50µA to 1mA -1.5 -2 %
DRV5
= -10V 2 9 mA
DRV5
= -20V 0.1 10 µA
OSC
OSC
(Note 2) -0.1 +1.5 V
FREQ = AGND 1024 / f FREQ = VL 2048 / f
OSC
OSC
s
s
s
PARAMETER CONDITIONS MIN TYP MAX UNITS GENERAL Operating Input Voltage Range (Note 1) 4.5 28.0 V VL REGULATOR VL Output Voltage 5.5V < V
VL Undervoltage Lockout
Threshold
VL rising, 3% hysteresis 3.2 3.8 V
< 28V, 0 < IVL < 30mA 4.75 5.25 V
IN
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, VIN= 12V, VEN= V
SEQ
= 5V, TA = -40°C to +85°C, unless otherwise noted.) (Note 3)
Note 1: Operating supply range is guaranteed by VL line regulation test for the range of 5.5V to 28V. Between 4.5V and 5.5V, the V
L
regulator might be in dropout; however, the part continues to operate properly.
Note 2: Guaranteed by design and not production tested. Note 3: Specifications to -40°C are guaranteed by design and not production tested.
PARAMETER CONDITIONS MIN TYP MAX UNITS
CONTROL AND SEQUENCE ONL_ Input Threshold ONL_ rising, 25mV hysteresis 1.201 1.275 V EN Input Threshold EN rising, 5% hysteresis 1.201 1.275 V FAULT DETECTION
FB, FBL1, FBL2, FBL3, FBL4
Fault Trip Level
FBL5 Fault Trip Level FBL5 rising, 25mV hysteresis 300 500 mV Overcurrent Protection Threshold (V RESET FUNCTION RSTIN Reset Trip Level RSTIN falling, 25mV hysteresis 1.081 1.147 V
ERROR AMPLIFIER FB Regulation Voltage 1.215 1.260 V
Current-Limit Threshold
(Default Mode)
Current-Limit Threshold
(Adjustable Mode)
POSITIVE LINEAR REGULATOR (LR1) FBL1 Regulation Voltage V FBL1 Input Bias Current V POSITIVE LINEAR REGULATORS (LR2 AND LR3) FBL_ Regulation Voltage V FBL_ Input Bias Current V POSITIVE LINEAR REGULATOR (LR4) FBL4 Regulation Voltage V FBL4 Input Bias Current V NEGATIVE LINEAR REGULATOR (LR5) FBL5 Regulation Voltage V FBL5 Input Bias Current V DRV5 Source Current V
FB, FBL1, FBL2, FBL3, FBL4 falling, 25mV hysteresis 1.081 1.147 V
- V
CSH
) 270 330 mV
CSL
STEP-DOWN CONTROLLER
PGND - LX, ILIM = VL 170 330 mV
PGND - LX, V
= 1.25V 170 330 mV
ILIM
LINEAR REGULATOR CONTROLLERS
= 5V, I
DRV1
= 1.5V
FBL1
_ = 5V, I
DRV
_ = 1.5V -50 +50 nA
FBL
= 5V, I
DRV4
= 1.5V -50 +50 nA
FBL4
= -10V, I
DRV5
= 0 -50 +50 nA
FBL5
= 200mV, V
FBL5
= 100µA 1.220 1.270 V
DRV1
-50 +50 nA
_ = 100µA 1.220 1.270 V
DRV
= 500µA 1.220 1.270 V
DRV4
= 100µA 100 150 mV
DRV5
= -10V 2 mA
DRV5
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
_______________________________________________________________________________________ 7
Typical Operating Characteristics
(Circuit of Figure 1; including R5, R6, and D2; TA= +25°C, unless otherwise noted.)
STEP-DOWN EFFICIENCY vs. LOAD CURRENT
MAX1530 toc01
LOAD CURRENT (mA)
EFFICIENCY (%)
1200900600300
60
70
80
90
100
50
0 1500
VIN = 12V
VIN = 20V
fSW = 500kHz
STEP-DOWN LOAD REGULATION
MAX1530 toc02
LOAD CURRENT (mA)
OUTPUT-VOLTAGE ERROR (%)
1200900600300
-0.12
-0.08
-0.04
0
-0.16 0 1500
SWITCHING FREQUENCY vs. LOAD CURRENT
FREQUENCY (kHz)
485
490
495
500
510
505
515
520
480
MAX1530 toc03
LOAD CURRENT (mA)
12009006003000 1500
STEP-DOWN REGULATOR LOAD TRANSIENT
MAX1530 toc04
40µs/div A: LOAD CURRENT, 1A/div B: OUTPUT VOLTAGE, 200mV/div, AC-COUPLED C: INDUCTOR CURRENT, 1A/div
A
0A
B
3.3V
0A
C
STEP-DOWN REGULATOR
SWITCHING WAVEFORM
MAX1530 toc05
2µs/div
A
B
C
A: LX, 10V/div B: OUTPUT VOLTAGE, 20 mV/div, AC-COUPLED C: INDUCTOR CURRENT, 1A/div
0V
3.3V
0A
STEP-DOWN REGULATOR
SOFT-START
MAX1530 toc06
1ms/div
A
C
A: EN, 2V/div B: OUTPUT VOLTAGE, 2V/div C: INDUCTOR CURRENT, 1A/div
0V
0V
B
0A
VL LOAD REGULATION
MAX1530 toc07
LOAD CURRENT (mA)
VL OUTPUT ERROR (%)
252015105
-0.4
-0.3
-0.2
-0.1
0
-0.5 030
STARTUP SEQUENCE
MAX1530 toc08
4ms/div
A: V
L
, 10V/div
B: V
OUT
, 5V/div
C: V
LOGIC
, 5V/div
D: V
SOURCE
, 20V/div
E: V
GAMMA
, 20V/div
F: V
GOFF
, 20V/div
G: V
GON
, 40V/div
A
B
C
D
E
F
G
LR1 BASE CURRENT
vs. DRV1 VOLTAGE
MAX1530 toc09
DRV1 VOLTAGE (V)
BASE CURRENT (mA)
8642
3
6
9
12
15
0
010
V
FBL1
= 1.175V
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
8 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Circuit of Figure 1; including R5, R6, and D2; TA= +25°C, unless otherwise noted.)
LR1 NORMALIZED LOAD REGULATION
0
LR1 NORMALIZED LINE REGULATION
0.2
LR1 LOAD TRANSIENT
MAX1530 toc12
-0.5
-1.0
VOLTAGE ERROR (%)
-1.5
-2.0 0 500
LOAD CURRENT (mA)
400300200100
MAX1530 toc10
OUTPUT-VOLTAGE ERROR (%)
LR2/LR3 BASE CURRENT
5
4
3
2
BASE CURRENT (mA)
1
0
vs. DRV2/DRV3 VOLTAGE
V
= V
FBL2
05
= 1.175V
FBL3
DRV2/DRV3 VOLTAGE (V)
MAX1530 toc13
VOLTAGE ERROR (%)
4321
0
-0.2
-0.4
-0.6
-0.8
-1.0 26
200mA LOAD CURRENT
543
INPUT VOLTAGE (V)
LR2 NORMALIZED LOAD REGULATION
0
-0.3
-0.6
-0.9
-1.2
-1.5 050
LOAD CURRENT (mA)
40302010
MAX1530 toc11
A: LR1 OUTPUT VOLTAGE, 100mV/div, AC-COUPLED B: LR1 LOAD CURRENT, 500mA/div
LR2 NORMALIZED LINE REGULATION
0.2
0
MAX1530 toc14
-0.2
-0.4
-0.6
OUTPUT-VOLTAGE ERROR (%)
-0.8
-1.0 925
INPUT VOLTAGE (V)
A
2.5V
B
0mA
40µs/div
MAX1530 toc15
20mA LOAD CURRENT
211713
LR3 NORMALIZED LOAD REGULATION
0
-0.5
-1.0
VOLTAGE ERROR (%)
-1.5
-2.0 020
LOAD CURRENT (mA)
161284
MAX1530 toc16
LR3 NORMALIZED LINE REGULATION
0.2
0
-0.2
-0.4
-0.6
OUTPUT-VOLTAGE ERROR (%)
-0.8
-1.0 24 40
20mA LOAD CURRENT
INPUT VOLTAGE (V)
vs. DRV VOLTAGE
30
V
= 1.175V
FBL4
25
MAX1530 toc17
20
15
10
BASE CURRENT (mA)
5
363228
0
010
DRV4 VOLTAGE (V)
LR4 BASE CURRENT
MAX1530 toc18
8642
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
_______________________________________________________________________________________ 9
Typical Operating Characteristics (continued)
(Circuit of Figure 1; including R5, R6, and D2; TA= +25°C, unless otherwise noted.)
LR4 NORMALIZED LOAD REGULATION
MAX1530 toc19
LOAD CURRENT (mA)
VOLTAGE ERROR (%)
400300200100
-0.5
-0.4
-0.3
-0.2
-0.1
0
-0.6 0 500
LR4 NORMALIZED LINE REGULATION
MAX1530 toc20
INPUT VOLTAGE (V)
OUTPUT-VOLTAGE ERROR (%)
211713
-0.8
-0.6
-0.4
-0.2
0
0.2
-1.0 925
200mA LOAD CURRENT
LR4 LOAD TRANSIENT
MAX1530 toc21
40µs/div
A
B
A: LR4 OUTPUT VOLTAGE, 100mV/div, AC-COUPLED B: LR4 LOAD CURRENT, 500mA/div
10V
0mA
LR4 PULSED LOAD TRANSIENT
MAX1530 toc22
10µs/div
A
B
A: LR4 OUTPUT VOLTAGE, 100mV/div, AC-COUPLED B: LR4 LOAD CURRENT, 1A/div
10V
0A
MAX1531
OVERCURRENT PROTECTION (CSH, CSL)
MAX1530 toc23
20µs/div
A: V
LX
, 10V/div
B: V
OUT
, 5V/div
B
C
D
A
C: V
RESET
, 5V/div
D: V
CSH
- V
CSL
, 500mV/div
LR5 BASE CURRENT
vs. DRV5 VOLTAGE
MAX1530 toc24
DRV5 VOLTAGE (V)
BASE CURRENT (mA)
4321
2
4
6
8
10
0
05
V
FBL5
= 0V
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
10 ______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Circuit of Figure 1; including R5, R6, and D2; TA= +25°C, unless otherwise noted.)
Pin Description
LR5 NORMALIZED LOAD REGULATION
0
-0.2
-0.4
-0.6
VOLTAGE ERROR (%)
-0.8
-1.0 050
LOAD CURRENT (mA)
40302010
PIN
MAX1530 MAX1531
1 1 DRV2
2 2 FBL2
NAME FUNCTION
Gamma Linear Regulator (LR2) Base Drive. Open drain of an internal N-channel MOSFET. Connect DRV2 to the base of an external PNP pass transistor to form a positive linear regulator. (See the Pass Transistor Selection section.)
Gamma Linear Regulator (LR2) Feedback Input. FBL2 regulates at 1.245V nominal. Connect FBL2 to the center tap of a resistive voltage-divider between the LR2 output and AGND to set the output voltage. Place the divider close to the FBL2 pin.
MAX1530 toc25
LR5 NORMALIZED LINE REGULATION
1.0
20mA LOAD CURRENT
0.8
0.6
0.4
0.2
OUTPUT-VOLTAGE ERROR (%)
0
-0.2
-25 -9 INPUT VOLTAGE (V)
MAX1530 toc26
-13-17-21
Gate-On Linear Regulator (LR3) Feedback Input. FBL3 regulates at 1.245V nominal.
3 3 FBL3
4 4 DRV3
Connect FBL3 to the center tap of a resistive voltage-divider between the LR3 output and AGND to set the output voltage. Place the divider close to the FBL3 pin.
Gate-On Linear Regulator (LR3) Base Drive. Open drain of an internal N-channel MOSFET. Connect DRV3 to the base of an external PNP pass transistor to form a positive linear regulator. (See the Pass Transistor Selection section.)
5–10, 18, 19 N. C. No Connection. Not internally connected.
Adjustable Reset Input. RESET asserts low when the monitored voltage is less than the reset trip threshold. RESET goes to a high-impedance state only after the monitored voltage remains above the reset trip threshold for the duration of the reset timeout period.
11 11 RSTIN
Connect RSTIN to the center tap of a resistive voltage-divider between the monitored output voltage and AGND to set the reset trip threshold. The internal RSTIN threshold of 90% of 1.238V allows direct connection of RSTIN to any of the devices positive feedback pins.
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 11
Pin Description (continued)
PIN
MAX1530 MAX1531
12 12 RESET
13 13 COMP
14 14 FB
15 15 ILIM
16 16 ONL2
NAME FUNCTION
Open-Drain Reset Output. RESET asserts low when the monitored voltage is less than the reset trip threshold. RESET goes to a high-impedance state only after the monitored voltage remains above the reset trip threshold for the duration of the reset timeout period. RESET also asserts low when VL is less than the VL undervoltage lockout threshold, EN is low, or the thermal, overcurrent or undervoltage fault latches are set.
Step-Down Regulator Compensation Input. A pole-zero pair must be added to
compensate the control loop by connecting a series resistor and capacitor from COMP to AGND. (See the Compensation Design section.)
Step-Down Regulator Feedback Input. FB regulates at 1.238V nominal. Connect FB to the center tap of a resistive voltage-divider between the step-down regulator output and AGND to set the output voltage. Place the divider close to the FB pin.
Step-Down Regulator Current-Limit Control Input. Connect this dual-mode input to VL to
set the current-limit threshold to its default value of 250mV. The overcurrent comparator compares the voltage across the low-side N-channel MOSFET with the current-limit threshold. Connect ILIM to the center tap of a resistive voltage-divider between VL and AGND to adjust the current-limit threshold to other values. In adjustable mode, the actual current-limit threshold is 1/5th of the voltage at ILIM over a 0.25V to 3.0V range. The dual­mode threshold for switchover to the 250mV default value is approximately 3.5V.
Gamma Linear Regulator (LR2) Enable Input. When EN is above its enable threshold, VL is above its UVLO threshold, and ONL2 is greater than the internal reference, LR2 is enabled. Drive ONL2 with a logic signal or, for automatic sequencing, connect a capacitor from ONL2 to AGND. If SEQ is high, EN is above its threshold, and VL is above its UVLO threshold, an internal 2µA (typ) current source charges the capacitor. Otherwise, an internal switch discharges the capacitor. Connecting various capacitors to each ONL_ pin allows the programming of the startup sequence.
Gate-On Linear Regulator (LR3) Enable Input. When EN is above its enable threshold, VL is above its UVLO threshold, and ONL3 is greater than the internal reference, LR3 is enabled. Drive ONL3 with a logic signal or, for automatic sequencing, connect a capacitor
17 17 ONL3
from ONL3 to AGND. If SEQ is high, EN is above its threshold, and VL is above its UVLO threshold, an internal 2µA (typ) current source charges the capacitor. Otherwise, an internal switch discharges the capacitor. Connecting various capacitors to each ONL_ pin allows the programming of the startup sequence.
20 20 PGND Power Ground
Low-Side Gate Driver Output. DL drives the synchronous rectifier of the step-down
21 21 DL
22 22 LX
regulator. DL swings from PGND to VL. DL remains low until VL rises above the UVLO threshold.
Step-Down Regulator Current-Sense Input. The ICs current-sense amplifier inputs for current-mode control connect to IN and LX. Connect IN and LX directly to the high-side N­channel MOSFET drain and source, respectively. The low-side current-limit comparator inputs connect to LX and PGND to sense voltage across a low-side N-channel MOSFET.
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
12 ______________________________________________________________________________________
Pin Description (continued)
PIN
MAX1530 MAX1531
23 23 DH
24 24 BST
25 25 SEQ
26 26 FREQ
NAME FUNCTION
High-Side Gate Driver Output. DH drives the main switch of the step-down regulator. DH
swings from LX to BST.
Step-Down Regulator Boostrap Capacitor Connection for High-Side Gate Driver. Connect
a 0.1µF ceramic capacitor from BST to LX.
Sequence Control Input for LR2, LR3, LR4, and LR5. Controls the current sources and
switches that charge and discharge the capacitors connected to the ONL_ pins.
Oscillator Frequency Select Input. Connect FREQ to VL for 500kHz operation. Connect
FREQ to AGND for 250kHz operation.
Main Input Voltage (+4.5V to 28V). Bypass IN to AGND with a 1µF ceramic capacitor
27 27 IN
close to the pins. IN powers the VL linear regulator. Connect IN to the drain of the high­side MOSFET (for current sense) through a 1Ω resistor.
Internal 5V Linear Regulator Output. Connect a minimum 1µF ceramic capacitor from VL
28 28 VL
to AGND. Place the capacitor close to the pins. VL can supply up to 30mA for gate drive and external loads. VL remains active when EN is low.
29 29 AGND Analog Ground
Enable Input. This general-purpose on/off control input has an accurate 1.238V (typ) rising threshold with 5% hysteresis. This allows EN to monitor an input voltage level or other analog parameter. If EN is less than its threshold, then the main step-down and all linear
30 30 EN
regulators are turned off. VL and the internal reference remain active when EN is low. The rising edge of EN clears any latched faults except for a thermal fault, which is cleared only by cycling the input power. An internal filter with a 10µs time constant prevents short glitches from accidentally clearing the fault latch.
Low-Voltage Logic Linear Regulator (LR1) Feedback Input. FBL1 regulates at 1.245V
31 31 FBL1
32 32 DRV1
5 CSH
nominal. Connect FBL1 to the center tap of a resistive voltage-divider between LR1 output AGND to set the output voltage. Place the divider close to the FBL1 pin. LR1 starts automatically after the step-down converter soft-start ends.
Low-Voltage Logic Linear Regulator (LR1) Base Drive. Open drain of an internal N-channel MOSFET. Connect DRV1 to the base of an external PNP pass transistor. (See the Pass Transistor Selection section.)
Overcurrent Protection Positive Input. CSH is also the supply input for the overcurrent sense block. CSH and CSL can be used to sense any current in the application circuit and to shut the device down in an overcurrent condition. This feature is typically used to protect the main input or the input to one of the linear regulators since they do not have their own current limits. Insert an appropriate sense resistor in series with the protected input and connect CSH and CSL to its positive and negative terminals. The controller sets the fault latch when V internal lowpass filter prevents large currents of short duration (less than 50µs) or noise glitches from setting the latch. If the overcurrent protection is not used, connect CSH and CSL to VL.
CSH
- V
exceeds the 300mV (typ) overcurrent threshold. An
CSL
6 CSL Overcurrent Protection Negative Input. See CSH above.
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 13
Pin Description (continued)
PIN
MAX1530 MAX1531
7 FBL4
8 DRV4
9 FBL5
10 DRV5
18 ONL4
NAME FUNCTION
Source Drive Linear Regulator (LR4) Feedback Input. FBL4 regulates at 1.245V nominal. Connect FBL4 to the center tap of a resistive voltage-divider between the LR4 output and AGND to set the output voltage. Place the divider close to the FBL4 pin.
Source Drive Linear Regulator (LR4) Base Drive. Open drain of an internal N-channel MOSFET. Connect DRV4 to the base of an external PNP pass transistor to form a positive linear regulator. (See the Pass Transistor Selection section.)
Gate-Off Linear Regulator (LR5) Feedback Input. FBL5 regulates at 125mV nominal. Connect FBL5 to the center tap of a resistive voltage-divider between the LR5 output and the internal 5V linear regulator output (VL) to set the output voltage. Place the divider close to the FBL5 pin.
Gate-Off Linear Regulator (LR5) Base Drive. Open drain of an internal P-channel MOSFET. Connect DRV5 to the base of an external NPN pass transistor to form a negative linear voltage regulator. (See the Pass Transistor Selection section.)
Source Drive Linear Regulator (LR4) Enable Input. When EN is above its enable threshold, VL is above its UVLO threshold, and ONL4 is greater than the internal reference, LR4 is enabled. Drive ONL4 with a logic signal or, for automatic sequencing, connect a capacitor from ONL4 to AGND. If SEQ is high, EN is above its threshold, and VL is above its UVLO threshold, an internal 2µA (typ) current source charges the capacitor. Otherwise, an internal switch discharges the capacitor. Connecting various capacitors to each ONL_ pin allows the programming of the startup sequence.
19 ONL5
Gate-Off Linear Regulator (LR5) Enable Input. When EN is above its enable threshold, VL is above its UVLO threshold, and ONL5 is greater than the internal reference, LR5 is enabled. Drive ONL5 with a logic signal or, for automatic sequencing, connect a capacitor from ONL5 to AGND. If SEQ is high, EN is above its threshold, and VL is above its UVLO threshold, an internal 2µA (typ) current source charges the capacitor. Otherwise, an internal switch discharges the capacitor. Connecting various capacitors to each ONL_ pin allows the programming of the startup sequence.
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
14 ______________________________________________________________________________________
Figure 1. MAX1531 Standard Application Circuit
= 12V
V
IN
C3
4.7µF
25V
20.0k
V
L
5V/30mA
C20
0.1µF
V
GAMMA
9.7V/50mA
2.2µF
V
SOURCE
10V/500mA
C21
C13
4.7µF
16V
Q2
Q4
R3 124k 1%
R4
1%
C4
1µF
R7
100k
R14 121k 1%
R15
68.1k 1%
R16
43.2k 1%
C11
0.1µF
R17
V
IN
6.8k
R18
68.1k
1%
C12
0.47µF
R20
0.5
1%
75k
R22
1%
R21
1.5k
R19 10k 1%
V
IN
R23
10.7k 1%
D1
R5*
10
24
30
EN IN
28
VL
26
FREQ
25
SEQ
12
RESET
16
ONL2
17
ONL3
18
ONL4
19
ONL5
1
DRV2
2
FBL2
6
CSL
5
CSH
8
DRV4
7
BST
MAX1531
PGND
AGND
DRV1
FBL1
RSTIN
COMP
ILIM
DRV3
FBL3
DRV5
FBL5FBL4
C5
0.1µF
IN
R12
IN
0.1µF
Q6
C14
LX
C1 1µF
10
D2*
R6*
1
N1-A
L1
10µH
C7 22µF
N1-B
R8
6.8k
R26
1%
D4
C6
0.1µF
D5
R28
90.9k
1%
*OPTIONAL
R9
10k
1%
C10
470pF
C2, OPEN
R25
200k
1%
D6
R24
6.8k
R27
6.8k
R10
10k
1%
R11
100k
D3
C8
0.1µF
IN
10.5k
C17
0.1µF
LX
R29
48.7k
1%
VL
6.3V
C22
2.2µF
Q1
C9 10µF
6.3V
C15
0.1µF
Q3
C16
0.47µF
C18
0.1µF
Q5
C19
0.47µF
27
23
DH
22
LX
21
DL
20
29
32
31
11
14
FB
13
15
V
4
3
10
9
C23 150pF
VL
R12 300k
R13 150k
V
OUT
3.3V/1.5A
R1
17.8k 1%
R2
10.7k 1%
V
LOGIC
2.5V/500mA
V
GON
25V/20mA
V
GOFF
-9V/50mA
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 15
Figure 2. MAX1530 Standard Application Circuit
V
= 12V
IN
C3
V
L
5V/30mA
C20
0.1µF
V
GAMMA
9.7V/50mA
4.7µF
25V
R4
20.0k
1%
V
Q2
R3 124k 1%
C4
1µF
R7
100k
R14
121k
1%
C11
0.1µF
R17
IN
6.8k
R18
68.1k
1%
C12
0.47µF
R19 10k 1%
D1
R5*
10
24
30
EN IN
28
VL
26
FREQ
25
SEQ
12
RESET
16
ONL2
17
ONL3
5
N.C.
6
N.C.
7
N.C.
8
N.C.
1
DRV2
2
FBL2
9
N.C.
10
N.C.
BST
MAX1530
PGND
AGND
DRV1
FBL1
RSTIN
COMP
ILIM
DRV3
FBL3
N.C.
N.C.
C5
0.1µF
IN
R12
C1 1µF
R6*
10
D2*
1
N1-A
L1
10µH
C7
C23
22µF
150pF
6.3V
C22
2.2µF
Q1
C9 10µF
6.3V
VL
R12 300k
R13
C21
2.2µF
Q4
C13
4.7µF
150k
R11
100k
R23
10.7k
N1-B
R8
6.8k
R10
R9
10k
10k
1%
1%
C10
470pF
C2, OPEN
V
IN
R24
6.8k
R22
75k
1%
1%
27
23
DH
22
LX
21
DL
20
29
32
31
11
14
FB
13
15
4
3
19
18
3.3V/1.5A
R1
17.8k 1%
R2
10.7k 1%
2.5V/500mA
V
10V/500mA
V
OUT
V
LOGIC
SOURCE
*OPTIONAL
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
16 ______________________________________________________________________________________
Standard Application Circuit
The standard application circuit (Figure 1) of the MAX1531 is a complete power-supply system for TFT LCD monitors. The circuit generates a 3.3V/1.5A main output, a 2.5V/500mA output for the timing controller and digital sections of source/gate drive ICs, a 10V/500mA source drive supply voltage, a 9.7V/50mA gamma reference, a 25V/20mA gate-on voltage, and a
-10V/50mA gate-off voltage. The input voltage is 12V ±10%. Table 1 lists the selected components and Table 2 lists the component suppliers. The standard applica­tion circuit (Figure 2) of the MAX1530 is similar to the MAX1531 application circuit except that gate-on and gate-off voltages are eliminated.
Detailed Description
The MAX1530/MAX1531 power-supply controllers pro­vide logic and bias power for LCD monitors. Figure 3 shows the IC functional diagram. The main step-down controller employs a current-mode PWM control method to ease compensation requirements and provide excel­lent load- and line-transient response. The use of syn­chronous rectification yields excellent efficiency.
The MAX1530 includes three analog gain blocks to control three auxiliary positive linear regulators, and the MAX1531 includes five analog gain blocks to control four positive and one negative linear regulators. Use the positive gain blocks to generate low-voltage rails directly from the input voltage or the main step-down converter output, or higher voltages using charge
Table 1. Selected Component List
Table 2. Component Suppliers
*For MAX1531 only.
DESIGNATION DESCRIPTION
C3
C7
C9
C12, C19*
C13
C21, C22
D1, D6*
D2
SUPPLIER PHONE FAX WEBSITE
Central Semi 516-435-1110 516-435-1824 www.centralsemi.com
Fairchild 888-522-5372 972-910-8036 www.fairchildsemi.com
Sumida 847-956-0666 847-956-0702 www.sumida.com
TDK 847-803-6100 847-390-4405 www.components.tdk.com
4.7µF, 25V X7R ceramic capacitor (1210) TDK C3225X7R1E475K
22µF, 6.3V X7R ceramic capacitor TDK C3216X7R0J226M
10µF, 6.3V X5R ceramic capacitor TDK C2012X5R0J106M
0.47µF, 16V X7R ceramic capacitors (0805) TDK C2012X7R1C474K
4.7µF, 16V X7R ceramic capacitor TDK C3216X7R1C475K
2.2µF, 25V X7R ceramic capacitors (1206) TDK C3216X7R1C475M
100mA, 30V Schottky diodes (SOD523) Central Semiconductor CMOSH-3
100mA, 75V, small-signal switching diode, SOT23 Fairchild Semiconductor MMBD4148
DESIGNATION DESCRIPTION
D3*, D4*, D5*
L1
N1
Q1, Q4
Q2, Q3*
Q5*, Q6*
200mA, 25V dual Schottky diodes (SOT23) Fairchild BAT54S
10µH, 2.3A (DC) inductor Sumida CDR7D28MN-100
2.5A, 30V dual N-channel MOSFET (6-pin Super SOT) Fairchild FDC6561AN
3A, 60V l ow - satur ati on P N P b i p ol ar tr ansi stor s ( S O T- 223) Fai r chi l d N Z T660A
200mA, 40V PNP bipolar transistors (SOT23) Fairchild MMBT3906
200m A, 40V N P N b i p ol ar tr ansi st or s ( S OT23) Fai r chi l d M M BT3904
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 17
Figure 3. IC Functional Diagram
FREQ
EN RSTIN RESET
GND
COMP
FB
ILIM
ONL2 ONL3 ONL4 ONL5
SEQ
DRV1
V
REF
FBL1
CSH
CSL
DRV2 DRV5
300mV
VLOK
TIMER
COMP
FB
ILIM
PGND
SEQUENCE
SOFT­START
LR1
0.9VREF
OSC REF
SLOPECLOCK
STEP-DOWN
CONTROLLER
SS DONE FLTMDC-DC EN
ON2
ON3
ON4
ON5
SEQ
EN
FLT1
FLTCS
IN
FAULT LOGIC
DH
LX
DL
FLTM
FLT3
LDO3EN
LDO4EN
FLT4
V
REF
HIGH-SIDE
DRIVER
LOW-SIDE
DRIVER
THERMAL
VL
VL
MAX1531
SOFT­START
LR3
0.9VREF
SOFT-
START
LR4
0.9VREF
IN
VL
BST
DH
LX
DL
PGND
DRV3
V
REF
FBL3
DRV4
V
REF
FBL4
V
REF
FBL2 FBL5
SOFT­START
LR2
0.9VREF
LDO2EN LDO5EN
FLT5FLT2
VLOKEN
SOFT-
START
400mV
LR5
V
REF
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
18 ______________________________________________________________________________________
pumps attached to the switching node or extra wind­ings coupled to the step-down converter inductor. The negative gain block (MAX1531) can be used in con­junction with a charge pump or coupled winding to generate the LCD gate-off voltage or other negative supplies.
Step-Down Controller
The MAX1530/MAX1531 include step-down controllers that use a fixed-frequency current-mode PWM control scheme (Figure 4). An internal transconductance amplifier establishes an integrated error voltage at the COMP pin. The heart of the current-mode PWM con­troller is an open-loop comparator that compares an integrated voltage-feedback signal with an amplified current-sense signal plus a slope-compensation ramp. At each rising edge of the internal clock, the high-side MOSFET turns on until the PWM comparator trips or the maximum duty cycle is reached. During this on-time, current ramps up through the inductor, sourcing cur­rent to the output and storing energy in a magnetic field. The current-mode feedback system regulates the peak inductor current as a function of the output volt­age error signal. Since the average inductor current is nearly the same as the peak inductor current (assum­ing that the inductor value is relatively high to minimize ripple current), the circuit acts as a switch-mode transconductance amplifier. That pushes the output LC filter pole, normally found in a voltage-mode PWM, to a higher frequency. To preserve loop stability, the slope­compensation ramp is summed into the main PWM comparator.
During the second half of the cycle, the high-side MOS­FET turns off and the low-side N-channel MOSFET turns on. Now the inductor releases the stored energy as its current ramps down, providing current to the output. The output capacitor stores charge when the inductor current exceeds the load current and discharges when the inductor current is lower, smoothing the voltage across the load. Under overload conditions, when the inductor current exceeds the selected current limit (see Current Limit Circuit), the high-side MOSFET is not turned on at the rising edge of the clock and the low­side MOSFET remains on to let the inductor current ramp down.
Under light-load conditions, the MAX1530/MAX1531 maintain a constant switching frequency to minimize cross-regulation errors in applications that use a trans­former. The low-side gate-drive waveform is the comple­ment of the high-side gate-drive waveform, which causes the inductor current to reverse under light loads.
Current-Sense Amplifier
The MAX1530/MAX1531s current-sense circuit ampli­fies the current-sense voltage generated by the high­side MOSFETs on-resistance. This amplified current-sense signal and the internal slope compensa­tion signal are summed together and fed into the PWM comparators inverting input. Place the high-side MOS­FET near the controller, and connect IN and LX to the MOSFET using Kelvin-sense connections to guarantee current-sense accuracy and improve stability.
Current-Limit Circuit
The MAX1530/MAX1531 include two current-limit cir­cuits that use the two MOSFETs on-resistances as cur­rent-sensing elements (Figure 4). The high-side MOSFETs voltage is used with a fixed 400mV (typ) cur­rent-limit threshold during the high-side on-times. The low-side MOSFETs voltage is used with an adjustable current-limit threshold during the low-side on-times. Using both circuits together ensures that the current is always measured and controlled.
The high-side MOSFET current limit employs a peak current limit. If the voltage across the high-side MOS­FET, measured from IN to LX, exceeds the 400mV threshold during an on-time, the high-side MOSFET turns off and the low-side MOSFET turns on.
The low-side MOSFET current-limit circuit employs a valley current limit. If the voltage across the low-side MOSFET, measured from LX to PGND, exceeds the low-side threshold at the end of a low-side on-time, the low-side MOSFET remains on and the high-side MOS­FET stays off for the entire next cycle.
Figure 4. Step-Down Controller Block Diagram
CURRENT
SLOPE
SS DONE
DC-DC EN
V
REF
COMP
CLOCK
ILIM
SOFT­START
FB
GM
0.9VREF
CURRENT
SENSE
AND
CURRENT
LIMIT
PWM COMP
LIMIT
FAULT COMPARATOR
RSQ
Q
IN
DH
DL
LX
PGND
FLTM
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 19
The ILIM pin is a dual-mode input. When ILIM is con­nected to VL, a default low-side current limit of 250mV (typ) is used. If ILIM is connected to a voltage between 250mV and 3V, the low-side current limit is typically 1/5th the ILIM voltage.
The MAX1530/MAX1531s current limits are compara­tively inaccurate, since the maximum load current is a function of the MOSFETs on-resistances and the induc­tor value, as well as the accuracy of the two thresholds. However, using MOSFET current sensing reduces both cost and circuit size and increases efficiency, since sense resistors are not needed.
MOSFET Gate Drivers (DH, DL)
The DH and DL drivers are optimized for driving mod­erate-size high-side and low-side MOSFETs. Adaptive dead-time circuits monitor the DL and DH drivers and prevent either FET from turning on until the other is fully off. This algorithm allows operation without shoot­through with a wide range of MOSFETs, minimizing delays and maintaining efficiency. When the gates are turning off, there must be low-resistance, low-induc­tance paths from the gate drivers to the MOSFET gates for the adaptive dead-time circuit to work properly. Otherwise, the sense circuitry in the MAX1530/ MAX1531 interpret the MOSFET gate as "off" while gate charge actually remains. Use short, wide traces mea­suring less than 50 squares (at least 20 mil wide if the MOSFET is 1in from the device).
It is advantageous to slow down the turn-on of both gate drivers if there is noise coupling between the switching regulator and the linear regulators. The noise coupling can result in excessive switching ripple on the linear regulator outputs. Slowing down the turn-on of the gate drivers proves to be an effective way of reduc­ing the output ripple. Take care to ensure that the turn­off times are not affected at the same time. As explained above, slowing down the turn-off times may result in shoot-through problems. In Figure 1, a 10 resistor (R5) is inserted in series with the BST pin to slow down the turn-on of the high-side MOSFET (N1-B) without affecting the turn-off. A 10resistor (R6) is also inserted between DL and the gate of the low-side MOS­FET (N1-A) to slow its turn-on. Because the gate resis­tor would slow down the turn-off time, connect a switching diode (D2) (such as 1N4148) in parallel with the gate resistor as shown in Figure 1 to prevent poten­tial shoot-through.
High-Side Gate-Drive Supply (BST)
A flying-capacitor bootstrap circuit generates gate­drive voltage for the high-side N-channel switch (Figure
1). The capacitor C5 between BST and LX is alternately
charged from the VL supply and placed parallel to the high-side MOSFETs gate-source terminals.
On startup, the synchronous rectifier (low-side MOS­FET) forces LX to ground and charges the boost capacitor from VL through diode D1. On the second half-cycle, the switch-mode power supply turns on the high-side MOSFET by closing an internal switch between BST and DH. This provides the necessary gate-to-source voltage to turn on the high-side switch, an action that boosts the 5V gate-drive signal above the input voltage.
Oscillator Frequency Selection (FREQ)
The FREQ pin can be used to select the switching fre­quency of the step-down regulator. Connect FREQ to VL for 500kHz operation. Connect FREQ to AGND for 250kHz operation. The 500kHz operation minimizes the size of the inductor and capacitors. The 250kHz opera­tion improves efficiency by 2% to 3%.
Linear Regulator Controllers
The MAX1530/MAX1531 include three positive linear regulator controllers, LR1, LR2, and LR3. These linear regulator controllers can be used with external pass transistors to regulate supplies for TFT LCDs. The MAX1531 includes an additional positive linear regula­tor controller (LR4) and a negative linear regulator con­troller (LR5).
Low-Voltage Logic Regulator Controller (LR1)
LR1 is an analog gain block with an open-drain N­channel output. It drives an external PNP pass transis­tor with a 6.8kbase-to-emitter resistor. Its guaranteed base drive sink current is at least 3mA. The regulator including transistor Q1 in Figure 1 uses a 10µF output capacitor and is designed to deliver 500mA at 2.5V.
LR1 is typically used to generate low-voltage logic sup­plies for the timing controller and the digital sections of the TFT LCD source/gate driver ICs.
LR1 is enabled when the soft-start of the main step­down regulator is complete. (See the Startup Sequence (ONL_,SEQ) section.) Each time it is enabled, the con­troller goes through a soft-start routine that ramps up its internal reference DAC. (See the Soft-Start section.)
Gamma Regulator Controller (LR2)
LR2 is an analog gain block with an open-drain N­channel output. It drives an external PNP pass transis­tor with a 6.8kbase-to-emitter resistor. Its guaranteed base drive sink current is at least 2mA. The regulator including transistor Q2 in Figure 1 uses a 0.47µF output capacitor and is designed to deliver 50mA at 9.7V.
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
20 ______________________________________________________________________________________
LR2 is typically used to generate the TFT LCD gamma reference voltage, which is usually 0.3V below the source drive supply voltage.
LR2 is enabled when the step-down regulator is enabled and the voltage on ONL2 exceeds ONL2 input threshold (1.238V typ). (See the Startup Sequence (ONL_,SEQ) section.) Each time it is enabled, the con­troller goes through a soft-start routine that ramps up its internal reference DAC. (See the Soft-Start section).
Linear Regulator Controller (LR3)
LR3 is an analog gain block with an open-drain N­channel output. It drives an external PNP pass transis­tor with a 6.8kbase-to-emitter resistor. Its guaranteed base drive sink current is at least 2mA. The regulator, including Q3 in Figure 1, uses a 0.47µF output capaci­tor and is designed to deliver 20mA at 25V. The regula­tor including Q3 in Figure 2 uses a 4.7µF output capacitor and is designed to deliver 500mA at 10V.
For the MAX1531 (Figure 1), LR3 is typically used to gen­erate the TFT LCD gate drivers gate-on voltage. A suffi­cient input voltage can be produced using a charge-pump circuit as shown in Figure 1. Note that the voltage rating of the DRV3 output is 28V. If higher volt­ages are present, an external cascode NPN transistor (Q6) should be used with the emitter connected to DRV3, the base to VIN(which is the connection point of C1 and R12 in Figure 1), and the collector to the base of the PNP pass transistor (Figure 1). For the MAX1530 (Figure 2), LR3 is typically used to generate the TFT LCD source drive supply voltage. The input for this regulator can come directly from the input supply, be produced from an external step-up regulator, or from an extra wind­ing coupled to the main step-down regulator inductor.
LR3 is enabled when the step-down regulator is enabled and the voltage on ONL3 exceeds the ONL3 input threshold (1.238V typ). (See the Startup Sequence (ONL_,SEQ) section.) Each time it is enabled, the con­troller goes through a soft-start routine that ramps up its internal reference DAC. (See the Soft-Start section.)
Source Drive Regulator Controller (LR4)
(MAX1531 Only)
LR4 is an analog gain block with an open-drain N­channel output. It drives an external PNP pass transis­tor with a 1.5kbase-to-emitter resistor. Its guaranteed base drive sink current is at least 10mA. The regulator including Q4 in Figure 1 uses a 4.7µF output capacitor and is designed to deliver 500mA at 10V. The regula­tors fast transient response allows it to handle brief peak currents up to 2A.
LR4 is typically used to generate the TFT LCD source drive supply voltage. The input for this regulator can come directly from the input supply, be produced from an external step-up regulator, or from an extra winding coupled to the main step-down regulator inductor.
LR4 is enabled when the step-down regulator is enabled and the voltage on ONL4 exceeds the ONL4 input threshold (1.238V typ). (See the Startup Sequence (ONL_,SEQ) section.) Each time it is enabled, the regulator goes through a soft-start routine that ramps up its internal reference DAC from 0V to
1.238V (typ). (See the Soft-Start section.)
The standard application circuit in Figure 1 powers the LR4 regulator directly from the input supply and uses the MAX1531s general-purpose overcurrent protection function to protect the input supply from excessive load currents. (See the Overcurrent Protection section.)
Gate-Off Regulator Controller (LR5) (MAX1531 Only)
LR5 is an analog gain block with an open-drain P-chan­nel output. It drives an external NPN pass transistor with a 6.8kbase-to-emitter resistor. Its guaranteed base drive sink current is at least 2mA. The regulator including Q5 in Figure 1 uses a 0.47µF output capacitor and is designed to deliver 10mA at -10V.
LR5 is typically used to generate the TFT LCD gate dri­vers gate-off voltage. A negative input voltage can be produced using a charge-pump circuit as shown in Figure 1. Use as many stages as necessary to obtain the required output voltage.
LR5 is enabled when the step-down regulator is enabled and the voltage on ONL5 exceeds the ONL5 input threshold (1.238V typ). (See the Startup Sequence (ONL_,SEQ) section.) Each time it is enabled, the regulator goes through a soft-start routine that ramps down its internal reference DAC from VL to 125mV (typ). (See the Soft-Start section.)
Internal 5V Linear Regulator (VL)
All MAX1530/MAX1531 functions, except the thermal sensor, are internally powered from the on-chip, low­dropout 5V regulator. The maximum regulator input voltage (VIN) is 28V. Bypass the regulators output (VL) with at least a 1µF ceramic capacitor to AGND. The VIN-to-VL dropout voltage is typically 200mV, so when V
IN
is less than 5.2V, VL is typically VIN- 200mV. The internal linear regulator can source up to 30mA to sup­ply the device, power the low-side gate driver, charge the external boost capacitor, and supply small external loads. When driving particularly large MOSFETs, little or no regulator current may be available for external
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 21
loads. For example, when switched at 500kHz, large MOSFETs with a total of 40nC total gate charge would require 40nC × 500kHz, which is approximately 20mA.
On/Off Control (EN)
The EN pin has an accurate 1.238V (typ) rising thresh­old with 5% hysteresis. The accurate threshold allows it to be used to monitor the input voltage or other analog signals of interest. If VENvoltage is less than its thresh­old, then the step-down regulator and all linear regula­tors are turned off. VL and the internal reference remain active when EN is low to allow an accurate EN thresh­old. A rising edge on the pin clears any latched faults except for a thermal fault, which is cleared only by cycling the input power.
Undervoltage Lockout
If VL drops below 3.4V (typ), the MAX1530/MAX1531 assume that the supply voltage is too low to make valid decisions. Therefore, the undervoltage lockout (UVLO) circuitry turns off all the internal bias supplies. Switching is inhibited, and the DL and DH gate drivers are forced low. After VL rises above 3.5V (typ), the fault and thermal shutdown latches are cleared and startup begins if EN is above its threshold.
Startup Sequence (ONL_, SEQ)
The MAX1530/MAX1531 are not enabled unless all four of the following conditions are met: 1) VL exceeds the UVLO threshold, 2) EN is above 1.238V, 3) the fault latch is not set, and 4) the thermal shutdown latch is not set. After all four conditions are met, the step-down con­troller starts switching and enables soft-start (Figure 5). After the step-down regulator soft-start is done, the low­voltage logic linear regulator controller (LR1) soft-starts.
The remaining linear regulator controllers and the sequence block that can be used to control them are enabled at the same time as the step-down regulator. The SEQ logic input is used in combination with the ONL_ pins to control the startup sequence. When SEQ is high and the sequence block is enabled, each ONL_ pin sources 2µA (typ). When the voltage on an ONL_ pin reaches 1.238V (typ), its respective linear regulator controller (LR_) is enabled. When SEQ is low or the sequence block is not enabled, each ONL_ pin is con­nected to ground through a 1.5kinternal MOSFET.
The sequence block allows the user to program the startup of LR2 to LR5 in any desired sequence. If no capacitor is placed on an ONL_ pin, its LR_ controller starts immediately after the sequence block is enabled and SEQ goes high. Placing a 1.5nF capacitor on an ONL_ pin provides about 1ms delay for the respective
LR_ controller. Placing different size capacitors on each ONL_ pin allows any arbitrary startup sequence.
An arbitrary startup sequence can also be created with a single capacitor (Figure 6). Capacitor C1, together with the 8µA current (2µA per ONL_ pin), is chosen to provide the desired delay for the controller that starts last (ONLd). Using 0.1µF for C1 provides about 16ms
Figure 6. Single-Capacitor Sequence Configuration
Figure 5. Startup Conditions
EN > 1.24V
AND
STEP-DOWN
REGULATOR
STARTUP
STEP-DOWN SOFT-START
LR1
STARTUP
DONE
VL > 3.5V
LR2
STARTUP
SEQUENCE
BLOCK
ENABLED
ONL3 > 1.24V
LR3
STARTUP
SEQ = HIGH
LR4
STARTUP
ONL_
CURRENT
SOURCES ON
ONL5 > 1.24VONL2 > 1.24V ONL4 > 1.24V
LR5
STARTUP
SEQ
1.238V
LRa
LRb
LRc
LRd
ONLa ONLb ONLc ONLd
R3
150k
5V
ONL_
0V
OFF
OFF
OFF
OFF
16ms
R2
75k
ONLa ONLb ONLc ONLd
R1
51k
ON
ON
ON
ON
C1
0.1µF
OFF
OFF
OFF
OFF
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
22 ______________________________________________________________________________________
total delay. Because of the 6µA current flowing through R1 (51k), the voltage on ONLc is 0.31V greater than the voltage on ONLd and it crosses the 1.238V thresh­old and enables its LR_ controller about 4ms before ONLds controller. Similarly, the 4µA current through R2 (75k) and the 2µA current through R3 (150k) cause their LR_ controllers to each start about 4ms before the next one. Any desired sequence and delay can be pro­grammed by calculating the charge rate of C1 and volt­age drops across R1 through R3.
Soft-Start
The soft-start function controls the slew rate of the out­put voltages and reduces inrush currents during start­up. Each regulator (step-down, LR1 to LR5) goes through a soft-start routine after it is enabled. During soft-start, the reference voltage for each positive regu­lator gradually ramps up from 0V to the internal refer­ence in 32 steps. The reference voltage of the negative regulator ramps down from VL to 125mV in 32 steps. The total soft-start period for each regulator is 1024 clock cycles for 250kHz switching frequency and 2048 clock cycles for 500kHz switching frequency.
Reset
The MAX1530/MAX1531 include an open-drain timed microprocessor supervisor function to ensure proper startup of digital circuits. The RESET output asserts low whenever RSTIN is less than the RSTIN trip threshold. RESET also asserts low when VL is less than the VL UVLO threshold, EN is low, or the thermal, undervolt­age or overcurrent fault latches are set. RESET enters the high-impedance state only after RSTIN remains above the trip threshold for the duration of the reset timeout period. The state of RESET has no effect on other portions of the IC.
The RSTIN threshold (1.114V typ) is designed to allow RSTIN to directly connect to any of the MAX1530/ MAX1531s feedback input pins, eliminating the need for an additional resistive divider. Typically, RSTIN is connected to FB or FBL1 to monitor the supply voltage for digital logic ICs, but it can be used to monitor any desired output voltage or it can even be used as a gen­eral-purpose comparator.
Fault Protection
Undervoltage Protection
After its soft-start is done, if the output of the main step­down regulator or any of the linear-regulator outputs (LR1 to LR5) are below 90% of their normal regulation point, the MAX1530/MAX1531 activate an internal fault timer. If the fault condition remains continuously for the
entire fault timer duration, the MAX1530/MAX1531 set the fault latch, shutting down all the regulator outputs. Undervoltage faults do not turn off VL. Once the fault condition is removed, cycling the input voltage or applying a rising edge on SEQ or EN clears the fault latch and reactivates the device.
Thermal Protection
The thermal protection limits total power dissipation in the MAX1530/MAX1531. If the junction temperature exceeds +160°C, a thermal sensor immediately sets the thermal fault latch, shutting off all the ICs outputs including VL, allowing the device to cool down. The only way to clear the thermal fault latch is to cycle the input voltage after the device cools down by at least 15°C.
Overcurrent Protection Block (CSH, CSL)
(MAX1531 Only)
The MAX1531 includes an uncommitted overcurrent protection block that can be used to measure any input or output current, using a current-sense resistor or other sense element. If the measured current exceeds the overcurrent protection threshold (300mV typ), the MAX1531 immediately sets the undervoltage fault latch, shutting down all the regulator outputs. Overcurrent faults do not turn off VL. An internal lowpass filter pre­vents large current transients of short duration (less than 50µs) from setting the latch. Once the overcurrent condition is removed, cycling the input voltage clears the fault latch and reactivates the device. A rising edge on SEQ or EN also clears the fault latch.
In Figure 1s circuit, the overcurrent protection is used with the LR4 source driver regulator since that regulator is powered directly from the input supply and has no current limit of its own. The current-sense resistor is placed in series with the input supply, before the linear regulators external PNP pass transistor. CSH and CSL are connected to the positive and negative sides of the sense resistor.
Design Procedures
Main Step-Down Regulator
Inductor Selection
Three key inductor parameters must be specified: inductance value (L), peak current (I
PEAK
), and DC
resistance (R
DC
). The following equation includes a constant, LIR, which is the ratio of peak-to-peak induc­tor ripple current to DC load current. A higher LIR value allows smaller inductance, but results in higher losses and higher ripple. A good compromise between size and losses is typically found at a 30% ripple current to
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 23
load current ratio (LIR = 0.3), which corresponds to a peak inductor current 1.15 times the DC load current:
where I
LOAD(MAX)
is the maximum DC load current, and the switching frequency fSWis 500kHz when FREQ is tied to VL, and 250kHz when FREQ is tied to AGND. The exact inductor value is not critical and can be adjusted to make trade-offs among size, cost, and effi­ciency. Lower inductor values minimize size and cost, but they also increase the output ripple and reduce the efficiency due to higher peak currents. On the other hand, higher inductor values increase efficiency, but at some point increased resistive losses due to extra turns of wire will exceed the benefit gained from lower AC current levels.
The inductors saturation current must exceed the peak inductor current. The peak current can be calculated by:
The inductors DC resistance should be low for good efficiency. Find a low-loss inductor having the lowest possible DC resistance that fits in the allotted dimen­sions. Ferrite cores are often the best choice, though powdered iron is inexpensive and can work well at 250kHz. Shielded-core geometries help keep noise, EMI, and switching waveform jitter low.
MOSFET Selection and Current-Limit Setting
The MAX1530/MAX1531s step-down controller drives two external logic-level N-channel MOSFETs. Since the R
DS(ON)
of each MOSFET is used as a sense resistor to provide current-sense signals to the PWM, their R
DS(ON)
values are important considerations in compo­nent selection.
The R
DS(ON)
of the high-side MOSFET (N1) provides an inductor current-sense signal for current-mode opera­tion and also provides a crude maximum current limit during the high-side on-time that prevents runaway cur­rents if the inductor saturates. The MOSFET voltage is measured across the high-side MOSFET from V
IN
to LX and is limited to 400mV (typ). To ensure the desired output current with sufficient margin, choose a MOSFET with R
DS(ON)
low enough that the peak current does not generate more than 340mV across the MOSFET, even when the MOSFET is hot. If the MOSFET’s
R
DS(ON)
is not specified at a suitable temperature, use
the maximum room temperature specification and add
0.5% per °C for the R
DS(ON)
increase with temperature:
To ensure stable operation of the current-mode PWM, the minimum current-sense ripple signal should exceed 12mV. Since this value depends on the minimum R
DS(ON)
of the high-side MOSFET, which is not typical­ly a specified parameter, a good rule of thumb is to choose the typical room temperature R
DS(ON)
about 2
times the amount needed for this:
For example, Figure 1s circuit is designed for 1.5A and uses a dual MOSFET (N1) for both the high-side and low-side MOSFETs. Its maximum R
DS(ON)
at room tem-
perature is 145mand an estimate of its maximum R
DS(ON)
at our chosen maximum temperature of +85°C
is 188m. Since the inductor ripple current is 0.5A, the peak current through the MOSFET is 1.75A. So the maxi­mum peak current-sense signal is 330mV, which is less than 340mV. Using the typical R
DS(ON)
of 113mand
the ripple current of 0.5A, the current ripple signal for the PWM is 56mV, much greater than the required 24mV.
The R
DS(ON)
of the low-side MOSFET (also N1) pro­vides current-limit information during the low-side on­time that inhibits a high-side on-time if the MOSFET voltage is too high. The voltage is measured across the low-side MOSFET from PGND to LX and the threshold is set by ILIM. To use the preset 250mV (typ) threshold, connect ILIM to VL and choose a MOSFET with R
DS(ON)
low enough that the valley current does not generate more than 190mV across the MOSFET, even when the MOSFET is hot. If the MOSFETs R
DS(ON)
is not specified at a suitable temperature, use the maxi­mum room temperature specification and add 0.5% per °C for the R
DS(ON)
increase with temperature:
If the MOSFETs R
DS(ON)
is lower than necessary, there is no need to adjust the current-limit threshold using ILIM. If the MOSFETs R
DS(ON)
is too high, adjust the
current-limit threshold using a resistive-divider between
VVV
×−
()
OUT IN OUT
=
V f I LIR
×× ×
IN SW LOAD MAX
()
L
I
RIPPLE
II
PEAK LOAD MAX
VVV
×−
()
OUT IN OUT
=
fLV
××
SW IN
I
=+
()
RIPPLE
2
IR mV
×<
PEAK DS ON HOT
()_
340
IR mV
RIPPLE DS ON TYP
×>
()_
24
IR mV
VALLEY DS ON HOT
III
VALLEY OUT RIPPLE
=−
×<
()_
/
190
2
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
24 ______________________________________________________________________________________
VL and AGND at ILIM. The threshold is approximately 1/5th the voltage on ILIM over a range of 0.25V to 3V:
K is the accuracy of the current-limit threshold, which is 20% when the threshold is 250mV.
For example, Figure 1s N1 MOSFET has a maximum R
DS(ON)
at room temperature of 145mand an esti-
mate of its maximum at our chosen maximum tempera­ture of +85°C is 188m. Since the inductor ripple current is 0.5A, the valley current through the MOSFET is 1.25A. So the maximum valley current-sense signal is 235mV, which is too high to work with the 190mV mini­mum of the default current-limit threshold. Adding a divider at ILIM (R12 and R13) adjusts the ILIM voltage to
1.7V and the current-limit threshold to 340mV, providing more than adequate margin for threshold accuracy.
Input Capacitor
The input filter capacitor reduces peak currents drawn from the power source and reduce noise and voltage ripple on the input caused by the regulators switching. It is usually selected according to input ripple current requirements and voltage rating, rather than capaci­tance value. The input voltage and load current deter­mine the RMS input ripple current (I
RMS
):
The worst case is I
RMS
= 0.5 × I
LOAD
, which occurs at
VIN= 2 × V
OUT
.
For most applications, ceramic capacitors are used because of their high ripple current and surge current capabilities. For long-term reliability, choose an input capacitor that exhibits less than +10°C temperature rise at the RMS input current corresponding to the max­imum load current.
Output Capacitor
The output capacitor and its equivalent series resis­tance (ESR) affect the regulators loop stability, output ripple voltage, and transient response. The Compensation Design section discusses the output capacitance requirement based on the loop stability. This section deals with how to determine the output capacitance and ESR needs according to the ripple voltage and load transient requirements.
The output voltage ripple has two components: varia­tions in the charge stored in the output capacitor, and
the voltage drop across the capacitors ESR caused by the current into and out of the capacitor:
where C
OUT
is the output capacitance, and R
ESR
is the ESR of the output capacitor. In Figure 1s circuit, the inductor ripple current is 0.5A. Assume the voltage-rip­ple requirement is 2% (peak-to-peak) of the 3.3V out­put, which corresponds to 66mV total peak-to-peak ripple. Assuming that the ESR ripple component and the capacitive ripple component each should be less than 50% of the 66mV total peak-to-peak ripple, then the ESR should be less than 66mand the output capacitance should be more than 7.6µF to meet the total ripple requirement. A 22µF ceramic capacitor with ESR (including PC board trace resistance) of 10mis selected for the standard application circuit in Figure 1, which easily meets the voltage ripple requirement.
The step-down regulators output capacitance and ESR also affect the voltage undershoot and overshoot when the load steps up and down abruptly. The undershoot and overshoot have three components: the voltage steps caused by ESR, the voltage undershoot and overshoot due to the current-mode controls AC load regulation, and the voltage sag and soar due to the finite capacitance and inductor slew rate.
The amplitude of the ESR steps is a function of the load step and the ESR of the output capacitor:
The amplitude of the sag due to the finite output capac­itance and inductor slew rate is a function of the load step, the output capacitor value, the inductor value, the input-to-output voltage differential, and the maximum duty cycle:
The amplitude of the undershoot due to the AC load regulation is a function of the high-side MOSFET R
DS(ON)
, the gain of the current-sense amplifier A
VCS
,
the change of the slope compensation during the under­shoot (∆SC
UNDER
), the transconductance of the error
IR VK
VALLEY DS ON HOT ILIM
. ( )
×<××02 1
()_
VVV
×−()
II
RMS LOAD
OUT IN OUT
V
IN
VV V
RIPPLE RIPPLE ESR RIPPLE C
=+
VIR
RIPPLE ESR RIPPLE ESR
()
V
RIPPLE C
() ()
I
RIPPLE
=
()
××
Cf
8
OUT SW
VIR
ESR STEP LOAD ESR_
V
SAG LC
()
LI
×
=
_
2-
CV DV
×× ×
OUT IN MIN MAX OUT
()
()
LOAD
2
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 25
amplifier gm, the compensation resistor R
COMP
, the FB
regulation VFB, and the output voltage set point V
OUT
:
Use the following to calculate the slope compensation change during the sag:
where D
UNDER
is the duty cycle at the valley of the sag,
which is usually 50%.
The actual undershoot is always equal to or bigger than the worst of V
ESR_STEP
, V
SAG_LC
, and V
UNDER_AC
.
The amplitude of the soar due to the finite output capacitance and inductor slew rate is a function of the load step, the output capacitor value, the inductor value, and the output voltage:
The amplitude of the overshoot due to the AC load reg­ulation is:
where SC
OVER
is the change of the slope compensa-
tion during the overshoot, given by:
where D
OVER
is the duty cycle at the peak of the over-
shoot, which is typically 0%.
Similarly, the actual overshoot is always equal to or big­ger than the worst of V
ESR_STEP
, V
SOAR_LC
, and
V
OVER_AC
.
Given the component values in the circuit of Figure 1, during a 1.5A step load transient, the voltage step due to capacitor ESR is negligible. The voltage sag due to finite capacitance and inductor slew rate is 81mV, and the voltage undershoot due to the AC load regulation is 170mV. The total undershoot seen in the Typical
Operating Characteristics is 170mV. The voltage soar due to finite capacitance and inductor slew rate is 155mV, and the voltage overshoot due to the AC load regulation is 167mV. The total overshoot seen the in the Typical Operating Characteristics is 200mV.
Compensation Design
The step-down controller of the MAX1530/MAX1531 uses a peak current-mode control scheme that regu­lates the output voltage by forcing the required current through the inductor. The MAX1530/MAX1531 use the voltage across the high-side MOSFETs R
DS(ON)
to sense the inductor current. Using the current-sense amplifiers output signal and the amplified feedback voltage sensed at FB, the control loop sets the peak inductor current by:
where VFB= 1.238V is the FB regulation voltage, A
VCS
is the gain of the current-sense amplifier (3.5 typical), A
VEA
is the DC gain of the error amplifier (2000 typ),
V
OUT(SET)
is the output voltage set point, and R
DS(ON)
is the on-resistance of the high-side MOSFET.
The total DC loop gain (ADC) is approximately:
RLEis the equivalent load resistance, given by:
In the above equation, D = 1 - D, n is a factor deter­mined by the slope compensation mcand the inductor current ramp m1, as shown below:
The slope compensation of the MAX1530/MAX1531 is 219mV/µs. The inductor current ramp is a function of the input voltage, output voltage, inductance, high-side MOSFET on-resistance R
DS(ON)
, and the gain of the
current-sense amplifier A
VCS
, and is:
V
OUT
V
UNDER AC
_
AR I
 
××
VCS DS ON LOAD
SC
+
××
VR g
FB COMP m
()
UNDER
 
SC mV D
UNDER UNDER
. 437 5 -
 
V
OUT
V
IN
 
V
SOAR LC
()
×
LI
=
_
2
××
CV
OUT OUT
LOAD
2
AR I
V
OVER AC
 
V
OUT
_
××
VCS DS ON LOAD
SC
+
OVER
VR g
××
FB COMP m
()
 
VV VA
()
-
I
PEAK
OUT OUT SET FB VEA
=
VRA
OUT SET DS ON VCS
() ()
××
()
××
VRA
××
A
DC
R
LE
FB LE VEA
=
VRA
OUT SET DS ON VCS
=
I
LOAD MAX
××
() ()
V
OUT
||
 
()
Lf
 
nDD
×
'
×
SW
-
 
SC mV
OVER
. 437 5 -
V
OUT
V
IN
D
OVER
 
m
n
=+1
C
m
1
VV
-
m
IN OUT
×
L
RA
()
DS ON VCS1
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
26 ______________________________________________________________________________________
Current-mode control has the effect of splitting the complex pole pair of the output LC filter into a single low-frequency pole and a single high-frequency pole. The low-frequency current-mode pole depends on out­put capacitor C
OUT
and the equivalent load resistance
RLE, given by the following:
The high-frequency current-mode pole is given by:
The COMP pin, which is the output of the ICs internal transconductance error amplifier, is used to stabilize the control loop. A series resistor (R11) and capacitor (C10) are connected between COMP and AGND to form a pole-zero pair. Another pole-zero pair can be added by connecting a feed-forward capacitor (C23) in parallel with feedback resistor R1. The compensation resistor and capacitors are selected to optimize the loop stability.
The compensation capacitor (C10) creates a dominant pole at very low frequency (a few hertz). The zero formed by R11 and C10 cancels the low-frequency cur­rent-mode pole. The zero formed by R1 and C23 can­cels the high-frequency current-mode pole and introduces a preferable higher frequency pole. In appli­cations where ceramic capacitors are used, the ESR zero is usually not a concern because the ESR zero occurs at very high frequency. If the ESR zero does not occur at a frequency at least one decade above the crossover, connect a second parallel capacitor (C2) between COMP and AGND to cancel the ESR zero. The component values shown in the standard application circuits (Figure 1 and 2) yield stable operation and fast transient response over a broad range of input-to-out­put voltages.
To design a compensation network for other compo­nents or applications, use the following procedure to achieve stable operation:
1) Select the crossover frequency f
CROSSOVER
(bandwidth) to be 1/5th the switching frequency fSWor less:
Unnecessarily high bandwidth can increase noise sensitivity while providing little benefit. Good tran­sient response with low amounts of output capaci­tance is achieved with a crossover frequency between 20kHz and 100kHz. The series compensa­tion capacitor (C10) generates a dominant pole that sets the desired crossover frequency. Determine C10 using the following expression:
where g
m
is the error amplifiers transconductance
(100µS typ).
2) The compensation resistor R11, together with capac-
itor C10, provides a zero that is used to cancel the low-frequency current-mode pole. Determine R11 using the following expression:
3) Because the error amplifier has limited output cur-
rent (16µA typ), small values of R11 can prevent the error amplifier from providing an immediate COMP voltage change required for good transient response with minimal output capacitance. If the calculated R11 value is less than 100k, use 100kand recal­culate C10 using the following formula:
Changing C10 also changes the crossover frequen­cy; the new crossover frequency is:
The calculated crossover frequency should be less than 1/5th the switching frequency. There are two ways to lower the crossover frequency if the calculat­ed value is greater than 1/5th the switching frequen­cy: increase the high-side MOSFET R
DS(ON
), or
increase the output capacitance. Increasing R
DS(ON)
reduces the DC loop gain, which results in lower crossover frequency. Increasing output capacitance reduces the frequency of the lower low-frequency current-mode pole, which also results in lower crossover frequency. The following formula gives the
f
POLE LOW
()
f
POLE HIGH
()
f
CROSSOVER
=
2π
1
RC
××
LE OUT
f
SW
'=
××2π
nD
f
SW
5
C
102≈
R
11
C
10
f
CROSSOVER
gA
×
mDC
fA
××
π
CROSSOVER VEA
1
fC
210
××π
POLE LOW
()
1
fk
2 100
××π
POLE LOW
()
gA
×
mDC
=
CA
××
210π
VEA
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 27
crossover frequency as a function the MOSFET R
DS(ON)
and the output capacitance:
Change one or both of these circuit parameters to obtain the desired crossover. Recalculate ADC and repeat steps 1 to 3 after making the changes.
4) If f
POLE(HIGH)
is less than the crossover frequency, cancel the pole with a feed-forward zero. Determine the value of C23 (feedback capacitor) using the following:
C23 also forms a secondary pole with R1 and R2 given by the following:
The frequency of this pole should be above the crossover frequency for loop stability. The position of this pole is related to the high-frequency current­mode pole, which is determined by the inductor cur­rent ramp signal. The inductor current ramp signal must satisfy the following condition to ensure the pole occurs above the crossover frequency:
If the frequency of the secondary pole is below the crossover frequency, the frequency of the secondary pole must be moved higher, or the crossover fre­quency must be moved lower. There are two ways to increase the frequency of the secondary pole: increase the high-side MOSFET R
DS(ON
), or reduce the step-down inductance, L. As explained before, for given input and output voltages, the current ramp sig­nal is proportional to the high-side MOSFET R
DS(ON)
, and inversely proportional to the inductance. If the pole occurs below the crossover frequency, the cur­rent feedback signal is too small. Increasing R
DS(ON)
or reducing the inductance can increase the current feedback signal. To lower the crossover frequency, use the methods described in step 3. Repeat steps 1 to 4 after making the changes.
5) For most applications using tantalum or polymer capacitors, the output capacitors ESR forms a sec­ond zero that occurs either below or close to the crossover frequency. The zero must be cancelled with a pole. Verify the frequency of the output capac­itors ESR zero, which is:
where R
ESR
is the ESR of the output capacitor C
OUT
. If the output capacitors ESR zero does not occur well after the crossover, add the parallel compensa­tion capacitor (C2) to form another pole to cancel the ESR zero. Calculate the value of C2 using:
Applications using ceramic capacitors usually have ESR zeros that occur at least one decade above the crossover. Since the ESR zero of ceramic capacitors has little effect on the loop stability, it does not need to be cancelled.
The following is an example. In the circuit of Figure 1, the input voltage is 12V, the output voltage is set to
3.3V, the maximum load current is 1.5A, the typical on­resistance of the high-side MOSFET is 100m, and the inductor is 10µH. The calculated equivalent load resis­tance is 1.67. The DC loop gain is:
If the chosen crossover frequency is 20kHz (step 1):
With a 22µF output capacitor, the output pole of the step-down regulator is (step 2):
Calculate R11 using:
f
CROSSOVER
=
2π
×× ××
f
POLE SEC_
m
1
>
RR f DR f
()
C
23
21
ππ'
DR f m
22
×× × ×
××××
12 2 2
+
gV R
mFB
AV CR
VCS OUT SET OUT DS ON
fR
××π
POLE HIGH
=
||
×
21223π
()
CROSSOVER C
'
-
SW CROSSOVER
××
() ()
1
()
1
RR C
11
×
f
ZERO ESR
()
A
C
2
π -
211101
1 238 1 67 2000
DC
=
2π
fRC
×××
ZERO ESR
()
V
××
. .
Vm
××
. .
33 100 35
1
CR
××
OUT ESR
C
10
=
4180
S
C
f
POLE OUT()
R
100 4180
2 20 2000
π
243 17
. . π
×
µ
kHz
××
1
.
222 167
πµ Ω
××
F
××
1
kHz nF
17
.
=
22
=
nF10
.=
43
k11
kHz
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
28 ______________________________________________________________________________________
Because R11 is less than 100k, use 100kfor R11 and recalculate C10 as (step 3):
Use the standard value of 470pF for C10 and recalcu­late the crossover frequency as:
Since the crossover frequency is less than 1/5th the switch­ing frequency, 470pF is an acceptable value for C10.
Because the high-frequency pole of the current-mode control is at 64kHz, the feed-forward capacitor is (step 4):
Use a standard value of 150pF for C23. The pole formed by C23, R1 and R2 occur at 159kHz, above the
70.8kHz crossover frequency.
Because a ceramic output capacitor is used in the cir­cuit of Figure1, the ESR zero occurs well above the crossover frequency, so no additional compensation capacitor (C2) is needed (step 5).
Output Voltage Selection
The MAX1530/MAX1531 step-down regulators output voltage can be adjusted by connecting a resistive volt­age-divider from the output to AGND with the center tap connected to FB (Figure 1). Select R2 in the 5kΩ to 50krange. Calculate R1 with the following equation:
where VFB= 1.238V, and V
OUT
may vary from 1.238V
to approximately 0.6 × VIN(VINis up to 28V).
Boost-Supply Diode
A signal diode, such as the 1N4148, works well in most applications. If the input voltage goes below 6V, use a small 100mA Schottky diode for slightly improved effi­ciency and dropout characteristics. Do not use power diodes, such as the 1N5817 or 1N4001, since high junction capacitance can charge up VL to excessive voltages.
Charge Pumps
Selecting the Number of Charge-Pump Stages
For highest efficiency, always choose the lowest num­ber of charge-pump stages that meet the output requirement. The number of positive charge-pump stages is given by:
where N
POS
is the number of positive charge-pump
stages, V
POS
is the positive charge-pump output, VINis the input voltage of the step-down regulator, VDis the forward voltage drop of the charge-pump diode, and V
DROPOUT
is the dropout margin for the linear regula-
tor. Use V
DROPOUT
= 0.3V.
The number of negative charge-pump stages is given by:
where N
NEG
is the number of negative charge-pump stages, V
NEG
is the negative charge-pump output, V
IN
is the input voltage of the step-down regulator, VDis the forward voltage drop of the charge-pump diode, and V
DROPOUT
is the dropout margin for the linear reg-
ulator. Use V
DROPOUT
= 0.3V.
The above equations are derived based on the assumption that the first stage of the positive charge pump is connected to VINand the first stage of the negative charge pump is connected to ground. Sometimes fractional stages are more desirable for bet­ter efficiency. This can be done by connecting the first stage to V
OUT
or another available supply. If the first stage of the positive charger pump is powered from the output of the step-down regulator V
OUT
, then the equa-
tion becomes:
If the first stage of the negative charge pump is pow­ered from the output of the step-down regulator V
OUT
,
then the equation becomes:
C
2 4 3 100
. πΩ
1
kHz k
××
pF10
370
=
S
×
100 4180
f
CROSSOVER
µ
pF
××
2 470 2000
π
=
.
70 8
C
264 178
. πΩ
1
kHz k
××
pF23
140
=
RR
12 1
V
OUT
V
 
FB
kHz
N
VV V
+−
POS DROPOUT IN
=
POS
VV
−×2
IN D
VV
−+
N
NEG
NEG DROPOUT
=
VV
−×2
IN D
VV V
−+
N
POS
POS DROPOUT OUT
=
VV
−×2
IN D
VV V
−+ +
N
NEG
NEG DROPOUT OUT
=
VV
−×2
IN D
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 29
Flying Capacitors
Increasing the flying capacitor value lowers the effec­tive source impedance and increases the output cur­rent capability. Increasing the capacitance indefinitely has a negligible effect on output current capability because the internal switch resistance and the diode impedance place a lower limit on the source imped­ance. A 0.1µF ceramic capacitor works well in most low-current applications. The voltage rating for a given flying capacitor (CX) must exceed the following:
VCX> N x V
IN
where N is the stage number in which the flying capaci­tor appears, and VINis the input voltage of the step­down regulator.
Charge-Pump Output Capacitors
Increasing the output capacitance or decreasing the ESR reduces the charge pump output ripple voltage and the peak-to-peak transient voltage. With ceramic capacitors, the output voltage ripple is dominated by the capacitance value. Use the following equation to approximate the required capacitor value:
where V
RIPPLE
is the peak-to-peak value of the output
ripple.
Charge-Pump Rectifier Diodes
Use low-cost silicon switching diodes with a current rat­ing equal to or greater than 2 times the average charge-pump input current. If it helps avoid an extra stage, some or all of the diodes can be replaced with Schottky diodes with an equivalent current rating.
Linear Regulator Controllers
Output Voltage Selection
Adjust the positive linear regulator (LR1 to LR4) output voltages by connecting a resistive voltage-divider from the output to AGND with the center tap connected to FBL_ (Figure 1). Select the lower resistor of the divider in the 10kto 30krange. Calculate the upper resistor with the following equation:
where V
FBL
_ is 1.238V (typ).
Adjust the negative linear regulator (LR5) output volt­age by connecting a resistive voltage-divider from
V
GOFF
to VL with the center tap connected to FBL5
(Figure 1). Select R29 in the 10kto 30krange. Calculate R28 with the following equation:
where V
FBL5
= 125mV and VL= 5.0V.
Pass Transistor Selection
The pass transistor must meet specifications for DC current gain (hFE), collector-emitter saturation voltage, and power dissipation. The transistors current gain lim­its the guaranteed maximum output current to:
where I
DRV
is the minimum guaranteed base drive cur­rent, VBEis the base-emitter voltage of the pass transis­tor, and RBEis the pullup resistor connected between the transistors base and emitter. Furthermore, the tran­sistors current gain increases the linear regulators DC loop gain (see the Stability Requirements section), which may destabilize the output. Therefore, transistors with current gain over 300 at the maximum output cur­rent can be difficult to stabilize and are not recom­mended unless the high gain is needed to meet the load current requirements.
The transistors saturation voltage at the maximum out­put current determines the minimum input-to-output voltage differential that the linear regulator supports. Also, the packages power dissipation limits the usable maximum input-to-output voltage differential. The maxi­mum power dissipation capability of the transistor’s package and mounting must exceed the actual power dissipation in the device. The power dissipation equals the maximum load current (I
LOAD(MAX)
) times the maxi-
mum input-to-output voltage differential:
where V
LRIN(MAX)
is the maximum input voltage of the
linear regulator, and V
LROUT
is the output voltage of the
linear regulator.
Output Voltage Ripple
Ideally, the output voltage of a linear regulator should not contain any ripple. In the MAX1530/MAX1531, the step-down regulators switching noise can couple to the linear regulators, creating output voltage ripple. Following the PC board layout guidelines in the PC Board Layout and Grounding section can significantly reduce noise coupling. If there is still an unacceptable
C
OUT
2
fV
I
LOAD
OSC RIPPLE
RR VV
UPPER LOWER OUT FBL
()
[]
/1
__
RR V V VV
28 29
II
LOAD MAX DRV
PI V V
=× −
()
[]
FBL GOFF L FBL
55
=−
 
LOAD MAX LRIN MAX LROUT
() ()
()
)/(
V
BE
h
×
FE()
R
BE
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
30 ______________________________________________________________________________________
amount of ripple after the PC board layout has been optimized, consider increasing output capacitance. Adding more capacitance does not eliminate the ripple, but proportionally reduces the amplitude of the ripple. If increasing the output capacitance is not desirable because of space or cost concerns, then consider slowing the turn-on of the step-down DC-to-DC MOSFETs. Slower turn-on leads to smoother LX rising and falling edges and consequently reduces the switching noise. When slowing down MOSFET turn-on, ensure the turn-off time is not affected. Otherwise, the adaptive dead-time circuitry may not work properly and shoot-through may occur. See the MOSFET Gate Drivers section for details on how to slow down the turn-on of both DH and DL.
Stability Requirements
The MAX1530/MAX1531 linear-regulator controllers use an internal transconductance amplifier to drive an external pass transistor. The transconductance amplifi­er, the pass transistor, the base-emitter resistor, and the output capacitor determine loop stability. The fol­lowing applies equally to all linear regulators in the MAX1530 and MAX1531. Any differences are highlight­ed where appropriate.
The transconductance amplifier regulates the output voltage by controlling the pass transistors base cur­rent. The total DC loop gain is approximately:
where VTis 26mV at room temperature, I
LOAD
is the
output current of the linear regulator, V
REF
is the linear
regulators internal reference voltage, and I
BIAS
is the current through the base-to-emitter resistor (RBE). Each of the linear regulator controllers is designed for a dif­ferent maximum output current so they have different output drive currents and different bias currents (I
BIAS
). Each controllers bias current can be found in the Electrical Characteristics. The current listed in the Conditions column for the FBL_ regulation voltage specification is the individual controllers bias current. The base-to-emitter resistor for each controller should be chosen to set the correct I
BIAS
:
The output capacitor and the load resistance create the dominant pole in the system. However, the internal
amplifier delay, the pass transistors input capacitance, and the stray capacitance at the feedback node create additional poles in the system, and the output capacitor’s ESR generates a zero. For proper operation, use the fol­lowing steps to ensure the linear regulators stability:
1) First, calculate the dominant pole set by the linear regulators output capacitor and the load resistor:
where CLRis the output capacitance of the linear regulator and R
LOAD
is the load resistance corre-
sponding to the maximum load current.
The unity-gain crossover of the linear regulator is:
2) The pole created by the internal amplifier delay is about 1MHz:
3) Next, calculate the pole set by the transistors input capacitance, the transistors input resistance, and the base-to-emitter pullup resistor:
transconductance of the pass transistor, and fTis the transition frequency. Both parameters can be found in the transistors data sheet.
Because RBEis much greater than RIN, the above equation can be simplified:
The equation can be further simplified:
A
VLR
×+
1
Ih
BIAS FE
I
LOAD
4
V
T
×
 
×
V
REF()
R
=
BE
V
BE
I
BIAS
f
POLE LR
()
=
CR
2π
1
LR LOAD
fAf
CROSSOVER V LDO POLE LDO
=
() ()
f MHz
POLE AMP()
1
f
POLE C
where C
, , ===
IN
()
IN
g
m
2π
f
T
=
2π
RR
IN
1
CR R
(||)
IN BE IN
h
FE
g
m
g is the
π
m
f
POLE C
()
IN
f
POLE C
()
1
CR
2π
IN IN
f
T
=
IN
h
FE
4) Next, calculate the pole set by each linear regula­tors feedback resistance and the capacitance (C
FBL_
) between FBL_ and AGND (approximately
5pF including stray capacitance):
5) Next, calculate the zero caused by the output capacitors ESR:
where R
ESR
is the equivalent series resistance of CLR.
6) To ensure stability, choose CLRlarge enough so that the crossover occurs well before the poles and zero calculated in steps 2) to 5). The poles in steps 3) and 4) generally occur at several megahertz and using ceramic capacitors ensures the ESR zero occurs at several megahertz as well. Placing the crossover below 500kHz is sufficient to avoid the amplifier-delay pole and generally works well, unless unusual component choices or extra capacitances move the other poles or zero below 1MHz.
PC Board Layout and Grounding
Careful PC board layout is important for proper opera­tion. Use the following guidelines for good PC board layout:
1) Place the high-power components of the step-down
regulator (input capacitors, MOSFETs, inductor, and output capacitors) first, with any grounded connections adjacent. Connect these components with short, wide traces. Avoid using vias in the high-current paths. If vias are unavoidable, use many vias in parallel to reduce resistance and inductance.
2) Create islands for the analog ground (AGND),
power ground (PGND), and individual linear regula­tor grounds. Connect all these ground areas
(islands) together at only one location, which is a via connected to the backside pad of the device. All voltage-feedback dividers should be connected to the analog ground island. The step-down regula­tors input and output capacitors, and the charge pump components should be a wide power ground plane. The power ground plane should be connect­ed to the power ground pin (PGND) with a wide trace. Maximizing the width of the power ground traces improves efficiency, and reduces output voltage ripple and noise spikes. All other ground connections, such as the VL and IN pin bypass capacitor and the linear regulator output capaci­tors, should be star-connected to the backside of the device with wide traces. Make no other connec­tions between these separate ground planes.
3) Place the IN pin and VL pin bypass capacitors within 5mm from the IC and connect them to their respective pins with short, direct connections.
4) Since both MOSFETs are used for current sensing, care must be taken to ensure that noise and DC errors do not corrupt the sense signals. Place both MOSFETs close to the IC. Connect PGND to the source of the low-side MOSFET with a short, wide trace. Connect DL to the gate of the low-side MOS­FET with a short, wide trace. Ensure that the traces from DL to low-side MOSFET to PGND total no more than 50 squares. Connect LX close to the connection point between the low-side and high­side MOSFETs with a short, wide trace. Connect DH to the gate of the high-side MOSFET with a short, wide trace. Ensure that the traces from DH to high-side MOSFET to LX total no more than 50 squares (50 squares corresponds to 20 mils wide if the total trace is 1in long).
5) Place all feedback voltage-divider resistors as close to their respective feedback pins as possible. The dividers center trace should be kept short. Placing the resistors far away causes their FB traces to become antennas that can pick up switching noise. Care should be taken to avoid run­ning any feedback trace near LX or the switching nodes in the charge pumps.
6) Minimize the length and maximize the width of the traces between the output capacitors and the load for best transient responses.
7) Minimize the size of the LX node while keeping it wide and short. Keep the LX node away from feed­back nodes and analog ground. Use DC traces as shield if necessary.
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for
LCD Monitors
______________________________________________________________________________________ 31
f
()
POLE FBL
f
()
POLE FBL
f
()
POLE FBL
f
()
POLE FBL
f
()
POLE FBL
=
1
2910
=
2
21819
=
3
22526
=
4
22223
=
5
22829
1
CRR
π
(|| )
FBL
1
1
CRR
π
(||)
FBL
2
1
CRR
π
(||)
FBL
3
1
CRR
π
(||)
FBL
4
1
CRR
π
(||)
FBL
5
and
f
ESR ZERO
_
=
CR
2π
1
LR ESR
MAX1530/MAX1531
Multiple-Output Power-Supply Controllers for LCD Monitors
32 ______________________________________________________________________________________
Pin Configuration Chip Information
TRANSISTOR COUNT: 5600
PROCESS: BiCMOS
EN
AGND
VL
IN
DRV1
32
FBL1
31
30
29
FREQ
28
25 SEQ
27
26
1DRV2
2
FBL2
3
FBL3
4
DRV3
5
CSH*
6
CSL*
7
FBL4*
DRV4*
8
9
FBL5*
MAX1530 MAX1531
10
11
12
13
RSTIN
RESET
DRV5*
* = N.C. FOR MAX1530
COMP
16ONL2
14
15
FB
ILIM
THIN QFN
24 BST
DH
23
LX
22
DL
21
PGND
20
ONL5*
19
ONL4*
18
ONL3
17
Multiple-Output Power-Supply Controllers for
LCD Monitors
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 33
© 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
MAX1530/MAX1531
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages
.)
PIN # 1 I.D.
D
C
0.15 C A
D/2
0.15
C B
E/2
E
0.10
C
A
0.08 C
A3
A1
(NE-1) X e
DETAIL A
L
D2
b
C
L
D2/2
k
e
(ND-1) X e
L
e e
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
APPROVAL
0.10 M
E2/2
L
DOCUMENT CONTROL NO.
21-0140
C A B
PIN # 1 I.D.
0.35x45
C
E2
L
k
CC
QFN THIN.EPS
L
L
REV.
1
C
2
COMMON DIMENSIONS
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
EXPOSED PAD VARIATIONS
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
21-0140
REV.DOCUMENT CONTROL NO.APPROVAL
2
C
2
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