Rainbow Electronics MAX15025 User Manual

General Description

The MAX15024/MAX15025 single/dual, high-speed
MOSFET gate drivers are capable of operating at fre­quencies up to 1MHz with large capacitive loads. The
MAX15024 includes internal source-and-sink output
transistors with independent outputs allowing for control
of the external MOSFET’s rise and fall time. The
MAX15024 is a single gate driver capable of sinking an
8A peak current and sourcing a 4A peak current. The
MAX15025 is a dual gate driver capable of sinking a 4A
peak current and sourcing a 2A peak current. An inte­grated adjustable LDO voltage regulator provides gate­drive amplitude control and optimization.

The MAX15024A/C and MAX15025A/C/E/G accept tran­sistor-to-transistor (TTL) input logic levels while the
MAX15024B/D and MAX15025B/D/F/H accept CMOS­input logic levels. High sourcing/sinking peak currents, a
low propagation delay, and thermally enhanced pack­ages make the MAX15024/MAX15025 ideal for high-fre­quency and high-power circuits. The MAX15024/
MAX15025 operate from a 4.5V to 28V supply. A sepa­rate output driver supply input enhances flexibility and
permits a soft-start of the power MOSFETs used in syn­chronous rectifiers.

The MAX15024/MAX15025 are available in 10-pin
TDFN packages and are specified over the -40°C to
+125°C automotive temperature range.

Applications

Synchronous Rectifier Drivers

Power-Supply Modules

Switching Power Supply

Features

o 8A Peak Sink Current/4A Peak Source Current

(MAX15024)

o 4A Peak Sink Current/2A Peak Source Current

(MAX15025)

o Low 16ns Propagation Delay

o 4.5V to 28V Supply Voltage Range

o On-Board Adjustable LDO for Gate-Drive

Amplitude Control and Optimization

o Separate Output Driver Supply

o Independent Source and Sink Outputs (MAX15024)

o Matched Delays Between Inverting and

Noninverting Inputs (MAX15024)

o Matched Delays Between Channels (MAX15025)

o CMOS or TTL Logic-Level Inputs with Hysteresis

for Noise Immunity

o -40°C to +125°C Operating Temperature Range

o Thermal-Shutdown Protection

o 1.95W Thermally Enhanced TDFN Power Packages

MAX15024/MAX15025

Single/Dual, 16ns, High Sink/Source

Current Gate Drivers

________________________________________________________________

Maxim Integrated Products

1

Pin Configurations

Ordering Information

19-1053; Rev 1; 3/08

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

Note: All devices are specified over the -40°C to +125°C operating

temperature range.

+

Denotes a lead-free package.

*

Future product—contact factory for availability.

**

EP = Exposed pad. T = Tape and reel.

See the Selector Guide at the end of the data sheet.

Pin Configurations continued at end of data sheet.

Block Diagrams appear at end of data sheet.

PART

PKG

CODE

TOP

MARK

ATX

ATY

—

—

ATZ

AUA

AUB

AUC

—

—

—

—

TOP VIEW

REG

10 87

1

FB/SET

*EP = EXPOSED PAD.

P_OUT

DRVV

9

MAX15024

EP*

CC

N_OUT

3425

IN+

GND

TDFN

PGNDIN-

6

PIN-PACKAGE

MAX15024AATB+T 10 TDFN-EP** T1033-1

MAX15024BATB+T 10 TDFN-EP** T1033-1

MAX15024CATB+T* 10 TDFN-EP** T1033-1

MAX15024DATB+T* 10 TDFN-EP** T1033-1

MAX15025AATB+T 10 TDFN-EP** T1033-1

MAX15025BATB+T 10 TDFN-EP** T1033-1

MAX15025CATB+T 10 TDFN-EP** T1033-1

MAX15025DATB+T 10 TDFN-EP** T1033-1

MAX15025EATB+T* 10 TDFN-EP** T1033-1

MAX15025FATB+T* 10 TDFN-EP** T1033-1

MAX15025GATB+T* 10 TDFN-EP** T1033-1

MAX15025HATB+T* 10 TDFN-EP** T1033-1

MAX15024/MAX15025

Single/Dual, 16ns, High Sink/Source
Current Gate Drivers

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

MAX15024 ELECTRICAL CHARACTERISTICS

(VCC= V

DRV

= V

REG

= 10V, FB/SET = GND, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= TJ=

+ 25°C). (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

VCCto GND............................................................-0.3V to +30V

REG to GND..............-0.3V to the lower of +22V or (V

CC

+ 0.3V)

DRV to PGND .........................................................-0.3V to +22V

IN_ ..........................................................................-0.3V to +22V

FB/SET to GND.........................................................-0.3V to +6V

P_OUT to DRV ........................................................-22V to +0.3V

N_OUT to PGND.....................................................-0.3V to +22V

OUT1, OUT2 to PGND ..............................-0.3V to (V

DRV

+ 0.3V)

PGND to GND .......................................................-0.3V to +0.3V

P_OUT, N_OUT Continuous Source/Sink Current* .......... 200mA

OUT1, OUT2 Continuous Source/Sink Current*................200mA

Continuous Power Dissipation (T

A

= +70°C)
10-Pin TDFN, Single-Layer Board

(derate 18.5mW/°C above +70°C)...........................1481.5mW

Junction-to-Case Thermal Resistance (Note 1) ..............8.5°C/W

10-Pin TDFN, Multilayer Board

(derate 24.4mW/°C above +70°C)...........................1951.2mW

Junction-to-Case Thermal Resistance (Note 1) ..............8.5°C/W

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

*

Continuous output current is limited by the power dissipation of the package.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, see www.maxim-ic.com/thermal.tutorial

.

SYSTEM SPECIFICATIONS

Input Voltage Range V

V

DRV

Quiescent Supply Current IN_ = VCC or GND 700 1350 µA

Quiescent Supply Current
Under UVLO Condition

Switching Supply Current Switching at 250kHz, CL = 0 1.5 3.0 mA

VCC Undervoltage Lockout UVLO_ VCCV

VCC Undervoltage-Lockout
Hysteresis

VCC Undervoltage Lockout to
Output Delay

REG REGULATOR (VCC = 12V, REG = V

Output Voltage V

Dropout Voltage VR_

Load Regulation VCC = 12V, I

Line Regulation 12V < VCC < 28V 10 mV

FB/SET Reference Voltage

FB/SET Threshold VFB falling 220 mV

FB/SET Input Leakage Current VFB = 4.5V (Note 3) -125 +125 nA

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Turn-On Voltage V

VCC powered only, V
V

DRV

CC

DRV_ONVCC

REG

minimum 1µF to GND

VCC = V

V

CC

IN_ = V

CC

V

CC

V

CC

, CL = 1µF, FB/SET = GND)

DRV

12V < VCC < 28V, 0 < I

VCC = 6.5V, I

DO

VCC = 4.5V, I

External resistive divider connected at
FB/SET

decoupled with

= V

REG

DRV

= V

= V

REG

DRV

= V

= 10V, IN+ = VCC, IN- = GND 1.7 2.3 V

REG

or GND 250 µA

CC

rising 3.0 3.4 3.8 V

rising 100

falling 2

LOAD

LOAD

LOAD

=

REG

(MAX15024D) 6.5 18.0

(MAX15024C) 4.5 18.0

= 100mA 0.4 0.9

= 50mA 0.2 0.5

= 0 to 100mA 1 %

MAX15024B/D 6.5 28.0

MAX15024A/C 4.5 28.0

< 10mA

LOAD

300 mV

91011 V

1.10 1.23 1.35 V

V

µs

V

MAX15024/MAX15025

Single/Dual, 16ns, High Sink/Source

Current Gate Drivers

_______________________________________________________________________________________ 3

MAX15024 ELECTRICAL CHARACTERISTICS (continued)

(VCC= V

DRV

= V

REG

= 10V, FB/SET = GND, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= TJ=

+ 25°C). (Note 2)

DRIVER OUTPUT (SINK)

Driver Output Resistance R

Peak Output Current I

Maximum Load Capacitance

Latchup Robustness 500 mA

DRIVER OUTPUT (SOURCE)

Driver Output Resistance R

Peak Output Current I

Latchup Robustness 500 mA

LOGIC INPUTS

Logic 1 Input Voltage V

Logic 0 Input Voltage V

Logic Input Hysteresis

Logic Input Current Leakage VIN = 18V or GND -75 0.01 +75 µA

Input Capacitance 10 pF

SWITCHING CHARACTERISTICS FOR VCC = V
(see Figure 1)

Rise Time t

Turn-On Delay Time t

Turn-Off Delay Time t

Mismatch Propagation Delays
from Inverting and Noninverting
Inputs to Output

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

TA = +25°C 0.45 0.60

T

= +125°C 0.625 0.850

A

TA = +25°C 0.50 0.65

ON-N

VCC = V

REG

= V

sinking 100mA

VCC = V

REG

= V

DRV

DRV

= 10V,

= 4.5V,

sinking 100mA

T

= +125°C 0.7 0.9

A

2

≤ 20µJ,

200 nF

TA = +25°C 0.875 1.500

T

= +125°C 1.2 2.0

A

TA = +25°C 0.95 1.65

PK-N

ON-P

(MAX15024C/D)

V

= 10V 8 A

N_OUT

SOA condition: C
for V

VCC = V

DRV

= 10V

REG

= V

L

DRV

x V

= 10V,

DRV

sourcing 100mA

VCC = V

REG

= V

DRV

= 4.5V,

sourcing 100mA

T

= +125°C 1.25 2.20

A

PK-P

IH

IL

(MAX15024C/D)

V

= 0V 4 A

P_OUT

MAX15024A/C 2.0

MAX15024B/D 4.25

MAX15024A/C 0.8

MAX15024B/D 2

MAX15024A/C 0.4

MAX15024B/D 1

= 10V, P_OUT AND N_OUT ARE CONNECTED TOGETHER

REG

= 1nF 3

= 5nF 12

= 10nF 24

= 1nF 3

= 5nF 8Fall Time t

= 10nF 16

= 1nF (Note 3) 8 16 32 ns

= 1nF (Note 3) 8 16 32 ns

= 1nF 1 ns

R

F

D-ON

D-OFF

DRV

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

= V

Ω

Ω

V

V

V

ns

ns

MAX15024/MAX15025

Single/Dual, 16ns, High Sink/Source
Current Gate Drivers

4 _______________________________________________________________________________________

MAX15024 ELECTRICAL CHARACTERISTICS (continued)

(VCC= V

DRV

= V

REG

= 10V, FB/SET = GND, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= TJ=

+ 25°C). (Note 2)

MAX15025 ELECTRICAL CHARACTERISTICS

(VCC= V

DRV

= V

REG

= 10V, FB/SET = GND, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= TJ=

+25°C). (Note 2)

SWITCHING CHARACTERISTICS FOR VCC = V

Rise Time t

Fall Time t

Turn-On Delay Time t

Turn-Off Delay Time t

Mismatch Propagation Delays
from Inverting and Noninverting
Inputs to Output

Minimum Input Pulse Width that
Changes the Output

THERMAL CHARACTERISTICS

Thermal-Shutdown
Temperature

Thermal-Shutdown
Temperature Hysteresis

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

R

F

D-ON

D-OFF

t

PW

= V

DRV

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

C

LOAD

Temperature rising +160 °C

= 4.5V (see Figure 1) (MAX15024C/D)

REG

= 1nF 3

= 5nF 11

= 10nF 22

= 1nF 2.5

= 5nF 8

= 10nF 16

= 1nF 18 ns

= 1nF 18 ns

= 1nF 2 ns

ns

ns

15 ns

15 °C

SYSTEM SPECIFICATIONS

Input Voltage Range V

V

DRV

Quiescent Supply Current IN_ = VCC or GND 700 1350 µA

Quiescent Supply Current
Under UVLO Condition

Switching Supply Current Switching at 250kHz, CL = 0 1.5 3.0 mA

VCC Undervoltage Lockout UVLO_ VCCV

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Turn-On Voltage V

CC

DRV_ON

VCC powered only,
V

= V

REG

decoupled with
minimum 1µF
to GND

VCC = V

VCC = V

VCC = V
(M AX 15025A/B/E /F) or G N D for
( M AX 15025C /D /G/H )

IN_ = V

DRV

= V

REG

DRV

= V

REG

DRV

= 10V, IN1 = VCC, IN2 = V

REG

or GND 250 µA

CC

rising 3.0 3.4 3.8 V

CC

MAX15025B/D/F/H 6.5 28

MAX15025A/C/E/G 4.5 28

(MAX15025F/H) 6.5 18.0

(MAX15025E/G) 4.5 18.0

CC

1.7 2.3 V

V

MAX15024/MAX15025

Single/Dual, 16ns, High Sink/Source

Current Gate Drivers

_______________________________________________________________________________________ 5

MAX15025 ELECTRICAL CHARACTERISTICS (continued)

(VCC= V

DRV

= V

REG

= 10V, FB/SET = GND, TA= TJ= -40°C to +125°C, unless otherwise noted. Typical values are at TA= TJ=

+25°C). (Note 2)

VCC Undervoltage-Lockout
Hysteresis

VCC Undervoltage Lockout to
Output Delay

REG REGULATOR (VCC = 12V, V

Output Voltage V

Dropout Voltage VR_

Load Regulation VCC = 12V, I

Line Regulation 12V < VCC < 28V 10 mV

FB/SET Reference Voltage

FB/SET Threshold VFB rising 220 mV

FB/SET Input Leakage Current VFB = 4.5V -125 +125 nA

DRIVER OUTPUT SINK

Driver Output Resistance R

Peak Output Current I

Maximum Load Capacitance

Latchup Robustness 500 mA

DRIVER OUTPUT SOURCE

Driver Output Resistance R

Peak Output Current I

Latchup Robustness 500 mA

LOGIC INPUTS

Logic 1 Input Voltage V

Logic 0 Input Voltage V

Logic Input Hysteresis

Logic Input Current Leakage VIN = 18V or GND -75 +0.01 +75 µA

Input Capacitance 10 pF

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

300 mV

V

rising 100

CC

falling 2

V

CC

REG

= V

, CL = 1µF, FB/SET = GND)

DRV

REG

12V < VCC < 28V, 0 < I

VCC = 6.5V, I

DO

VCC = 4.5V, I

External resistive divider connected at
FB/SET

VCC = V
sinking 100mA

ON-N

VCC = V

REG

REG

< 10mA 9 10 11 V

LOAD

= 100mA 0.4 0.9

LOAD

= 50mA 0.2 0.5

LOAD

= 0 to 100mA 1 %

LOAD

1.10 1.23 1.35 V

= V

= V

DRV

DRV

= 10V,

= 4.5V,

TA = +25°C 1.0 1.6

= +125°C 1.25 2.10

T

A

TA = +25°C 1.10 1.65

sinking 100mA

T

= +125°C 1.5 2.2

A

2

≤ 20µJ,

100 nF

TA = +25°C 1.75 2.50

T

= +125°C 2.25 3.50

A

TA = +25°C 1.85 2.60

PK-N

ON-P

(MAX15025E/F/G/H)

V

= 10V 4 A

OUT_

SOA condition: C

DRV

= 10V

REG

for V

VCC = V

= V

L

DRV

x V

= 10V,

DRV

sourcing 100mA

VCC = V

REG

= V

DRV

= 4.5V,

sourcing 100mA

T

= +125°C 2.50 3.75

A

PK-P

IH

IL

(MAX15025E/F/G/H)

V

= 0V 2 A

OUT_

MAX15025A/C/E/G 2.0

MAX15025B/D/F/H 4.25

MAX15025A/C/E/G 0.8

MAX15025B/D/F/H 2

MAX15025A/C/E/G 0.4

MAX15025B/D/F/H 1

µs

V

Ω

Ω

V

V

V