MAX1497/MAX1499
3.5- and 4.5-Digit, Single-Chip ADCs with LED
Drivers and µC Interface
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDDto GND (MAX1499).........................................-0.3V to +6V
DV
DD
to GND (MAX1499) ........................................-0.3V to +6V
AIN+, AIN- to GND (MAX1499) ...........VNEG to (AV
DD
to +0.3V)
REF+, REF- to GND (MAX1499)......... VNEG to (AV
DD
to +0.3V)
LOWBATT to GND (MAX1499) ................-0.3V to (AV
DD
+ 0.3V)
CLK,
EOC, CS, DIN, SCLK,
DOUT to GND (MAX1499).......................-0.3V to (DV
DD
+ 0.3V)
VNEG to GND (MAX1499) .......................-2.6V to (AV
DD
+ 0.3V)
LED_EN to GND (MAX1499)....................-0.3V to (DV
DD
+ 0.3V)
ISET to GND (MAX1499)..........................-0.3V to (AV
DD
+ 0.3V)
V
DD
to GND (MAX1497)...........................................-0.3V to +6V
AIN+, AIN- to GND (MAX1497)..............VNEG to (V
DD
to +0.3V)
REF+, REF- to GND (MAX1497) ........... VNEG to (V
DD
to +0.3V)
CLK, EOC, CS, DIN, SCLK,
DOUT to GND (MAX1497)..........................-0.3V to (V
DD
+ 0.3V)
VNEG to GND (MAX1497)..........................-2.6V to (V
DD
+ 0.3V)
ISET to GND (MAX1497) ............................-0.3V to (V
DD
+ 0.3V)
VLED to GLED..........................................................-0.3V to +6V
GLED to GND........................................................-0.3V to +0.3V
SEG_ to GLED..........................................-0.3V to (VLED + 0.3V)
DIG_ to GLED ..........................................-0.3V to (VLED + 0.3V)
DIG_ Sink Current .............................................................300mA
DIG_ Source Current...........................................................50mA
SEG_ Sink Current ..............................................................50mA
SEG_ Source Current..........................................................50mA
Maximum Current Input into Any Other Pin ........................50mA
Continuous Power Dissipation (T
A
= +70°C)
32-Pin TQFP (derate 20.7mW/°C above +70°C).....1652.9mW
28-Pin SSOP (derate 9.5mW/°C above +70°C) ...........762mW
28-Pin PDIP (derate 14.3mW/°C above +70°C)......1142.9mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(AVDD= DVDD= VDD= +2.7V to +5.25V, GND = 0, GLED = 0, V
LED
= +2.7V to +5.25V, V
REF+
- V
REF-
= 2.048V (external reference)
C
REF+
= C
REF-
= 0.1µF, C
VNEG
= 0.1µF. Internal clock mode, unless otherwise noted. All specifications are at TA= T
MIN
to T
MAX
.
Typical values are at T
A
= +25°C, unless otherwise noted.)