MAX1338
14-Bit, 4-Channel, Software-Programmable,
Multiranging, Simultaneous-Sampling ADC
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDDto AGND .........................................................-0.3V to +6V
DV
DD
to DGND.........................................................-0.3V to +6V
DRV
DD
to DRGND....................................................-0.3V to +6V
AV
DD
to DVDD.......................................................-0.3V to +0.3V
DGND to DRGND..................................................-0.3V to +0.3V
AGND to DGND.....................................................-0.3V to +0.3V
AGND to DRGND ..................................................-0.3V to +0.3V
AIN0+, AIN0-, AIN1+, AIN1-, AIN2+, AIN2-, AIN3+,
AIN3- to AGND.....................................................-17V to +17V
D0–D13 to DRGND................................-0.3V to (DRV
DD
+ 0.3V)
REFADC, REFP1, REFP2, REFN1, REFN2, COM1, COM2 to
AGND....................................................-0.3V to (AV
DD
+ 0.3V)
INTCLK/
EXTCLK to AGND.......................-0.3V to (AVDD+ 0.3V)
CS, RD, WR, CONVST, to DRGND........-0.3V to (DRV
DD
+ 0.3V)
SHDN, STANDBY, CLK, EOC,
EOLC to DRGND................................-0.3V to (DRV
DD
+ 0.3V)
Maximum Current into Any Pin .........................................±50mA
Continuous Power Dissipation (T
A
= +70°C)
56-Pin Thin QFN (derate 31.3mW /°C above +70°C)....2500mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Maximum Junction Temperature .....................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Junction to Ambient Thermal Resistance θ
JA
..................32°C/W
Junction to Case Thermal Resistance θ
JC
.........................2°C/W
ELECTRICAL CHARACTERISTICS
(AVDD= DVDD= +5.0V, DRVDD= +3.0V, AGND = DGND = DRGND = 0, INTCLK/EXTCLK = AGND, f
CLK
= 5MHz, input range =
±10V, REFP2 = REFP1, REFN2 = REFN1, COM1 = COM2, 1.0nF from REFADC to AGND, 1.0µF and 0.1µF from COM1 to AGND,
0.1µF from REFP1 to AGND, 0.1µF from REFN1 to AGND, 1.0µF from REFP1 to REFN1. Typical values are at T
A
= +25°C. TA= T
MIN
to T
MAX
, unless otherwise noted.)