Rainbow Electronics MAX13047E User Manual

General Description

The MAX13046E/MAX13047E ±15kV ESD-protected
bidirectional level translators provide level shifting for
data transfer in a multivoltage system. The MAX13046E
is a single-channel translator, and the MAX13047E is a
dual-channel translator. Externally applied voltages,
VCCand VL, set the logic level on either side of the
device. The MAX13046E/MAX13047E utilize a transmis­sion-gate-based design to allow data translation in
either direction (V

LVCC

) on any single data line. The
MAX13046E/MAX13047E accept VLfrom +1.1V to the
minimum of either +3.6V or (V

CC

+ 0.3V), and VCCfrom
+1.65V to +5.5V, making these devices ideal for data
transfer between low-voltage ASICs/PLDs and higher
voltage systems.

The MAX13046E/MAX13047E feature a shutdown mode
that reduces supply current to less than 1µA thermal
short-circuit protection, and ±15kV ESD protection on the
VCCside for enhanced protection in applications that
route signals externally. The MAX13046E/MAX13047E
operate at a guaranteed data rate of 8Mbps when push­pull driving is used.

The MAX13046E is available in a 6-pin µDFN package,
and the MAX13047E is available in a 10-pin UTQFN.
Both devices are specified over the extended -40°C to
+85°C operating temperature range.

Applications

I2C and 1-Wire®Level Translation

CMOS Logic-Level Translation

Cell Phones

Portable Devices

Features

 Bidirectional Level Translation
 Operation Down to +1.1V on V

L

 Ultra-Low Supply Current in Shutdown Mode

1µA (max)

 Guaranteed Push-Pull Driving Data Rate

8Mbps (+1.2V

≤≤

V

L

≤≤

+3.6V, V

CC

≤≤

+5.5V)

16Mbps (+1.8V

≤≤

V

L

≤≤

V

CC

≤≤

+3.3V)

 Extended ESD Protection on the I/O VCCLines

±15kV Human Body Model
±15kV IEC61000-4-2 Air-Gap Discharge Method
±8kV IEC61000-4-2 Contact Discharge

 Low Supply Current
 Short-Circuit Protection
 Space-Saving µDFN and UTQFN Packages

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

________________________________________________________________

Maxim Integrated Products

1

Ordering Information/Selector Guide

19-4149; Rev 1; 8/08

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

Note: All devices are specified over the extended -40°C to +85°C operating temperature range.

+

Denotes a lead-free/RoHS-compliant package.

EP = Exposed pad.

Pin Configurations

TOP VIEW

MAX13046E

µDFN

1mm × 1.5mm

2

5

SHDN

GND

1

6

V

CC

V

L1

3

4

I/O V

CC

I/O V

L

+

UTQFN

1.4mm × 1.8mm

MAX13047E

+

V

CC

N.C.

I/O V

L2VL

1 2

7

6

3

N.C.

4

SHDN

I/O V

CC2

I/O V

L1

GND

I/O V

CC1

5

10

9

8

Typical Application Circuits appear at end of data sheet.

1-Wire is a registered trademark of Maxim Integrated Products, Inc.

MAX13046EELT+ 6 µDFN (1mm x 1.5mm) 1 OC

MAX13047EEVB+ 10 UTQFN (1.4mm x 1.8mm) 2 AAC

PART PIN-PACKAGE NUMBER OF CHANNELS TOP MARK

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC= +1.65V to +5.5V, VL= +1.1V to minimum of either +3.6V or ((VCC+ 0.3V)), I/O VL and I/O VCCare unconnected, TA= -40°C to
+85°C, unless otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)
V

CC

...........................................................................-0.3V to +6V

V

L

..............................................................................-0.3V to +4V

I/O V

CC

.......................................................-0.3V to (VCC+ 0.3V)

I/O V

L

............................................................-0.3V to (VL+ 0.3V)

SHDN........................................................................-0.3V to +6V

Short-Circuit Duration I/O V

L

, I/O VCCto GND...........Continuous

Power Dissipation (T

A

= +70°C)

6-Pin µDFN (derate 2.1mW/°C above +70°C) .............168mW

10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW

Junction-to-Ambient Thermal Resistance (

θ

JA

) (Note 1)

6-Pin µDFN.................................................................477°C/W

10-Pin UTQFN ...........................................................20.1°C/W

Junction-to-Ambient Thermal Resistance (

θ

JC

) (Note 1)

6-Pin µDFN................................................................20.1°C/W

10-Pin UTQFN .........................................................143.1°C/W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial

.

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

POWER SUPPLY

VL Supply Range V

VCC Supply Range V

Supply Current from V

Supply Current from V

VCC Shutdown-Mode Supply Current I

CC

L

I

SD-VCCTA

VCC > 3.3V 1.1 3.6V

L

VCC ≤ 3.3V 1.1 V

CC

QVCC

I

QVL

= +25°C, SHDN = GND 0.03 1 µA

1.65 5.5 V

CC

+ 0.3V

10 µA

15 µA

V

VL Shutdown-Mode Supply Current I

I/O VL and I/O VCC Shutdown-Mode
Leakage Current

SHDN Input Leakage TA = +25°C 0.02 0.1 µA

ESD PROTECTION

I/O VCC (Note 4)

All Other Pins Human Body Model ±2 kV

LOGIC-LEVEL THRESHOLDS

I/O VL Input-Voltage High V

I/O VL Input-Voltage Low V

SD-VL

I

SD-LKGTA

IHL

ILL

TA = +25°C, SHDN = GND 0.03 1 µA

= +25°C, SHDN = GND 0.02 0.5 µA

Human Body Model ±15V

IEC 61000-4-2 Air-Gap Discharge ±15V

IEC 61000-4-2 Contact Discharge ±8V

VL -

0.2

0.15 V

kV

V

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(VCC= +1.65V to +5.5V, VL= +1.1V to minimum of either +3.6V or ((VCC+ 0.3V)), I/O VL and I/O VCCare unconnected, TA= -40°C to
+85°C, unless otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

I/O VCC Input-Voltage High V

I/O VCC Input-Voltage Low V

I/O VL Output-Voltage High V

I/O VL Output-Voltage Low V

I/O VCC Output-Voltage High V

I/O VCC Output-Voltage Low V

SHDN Input-Voltage High V

SHDN Input-Voltage Low V

I/O VL-to-I/O V

V

Shutdown Threshold Low V

CC

V

Shutdown Threshold High V

CC

VL Shutdown Threshold V

Pullup Resistance V

RISE/FALL-TIME ACCELERATOR STAGE

Accelerator Pulse Duration 20 ns

I/O VL Output-Accelerator Source
Impedance

I/O VCC Output-Accelerator Source
Impedance

I/O VL Output-Accelerator Source
Impedance

I/O VCC Output-Accelerator Source
Impedance

Resistance 80 250 Ω

CC

IH-SHDN

IL-SHDN

TH_L_VCCVCC

TH_H_VCCVCC

TH_VL

IHC

ILC

OHL

OLL

OHC

OLC

I/O VL source current = 20µA,
V

I/O VL sink current = 1mA,
V

I/O VCC source current = 20µA,
V

I/O VCC sink current = 1mA,
V

VL > 1.2 VL - 0.2

1.1 ≤ VL < 1.2 VL - 0.1

V

V

V

V

> VCC - 0.4V

I/O VCC

< 0.15V

I/O VCC

> VL - 0.2V

I/O VL

< 0.15V

I/O VL

falling, VL = +3.3V 0.5 0.8 1.1 V

rising, VL = +3.3V 0.3 0.6 0.9 V

= VL = +3.3V 6 10 15.5 kΩ

CC

= 1.7V 13 Ω

L

= 2.2V 17 Ω

CC

= 3.2V 6 Ω

L

= 3.6V 10 Ω

CC

VCC -

0.4

0.15 V

0.67 x
V

L

0.4 V

0.67 x

V

CC

0.4 V

0.15 V

0.35 0.75 1.06 V

V

V

V

V

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

4 _______________________________________________________________________________________

TIMING CHARACTERISTICS FOR +1.2V ≤ VL≤ MINIMUM OF EITHER +3.6V OR (V

CC

+ 0.3V)

(VCC≤ ±5.5V, +1.2V ≤ VL≤ minimum of either +3.6V or ((VCC+ 0.3V)), RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless
otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

TIMING CHARACTERISTICS FOR +1.1V ≤ VL≤ +1.2V

(VCC≤ ±5.5V, +1.1V ≤ VL≤ +1.2V, RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are
V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

I/O VCC Rise Time t

I/O VCC Fall Time t

I/O VL Rise Time t

I/O VL Fall Time t

Propagation Delay

Channel-to-Channel Skew t

Maximum Data Rate

RVCC

FVCC

RVL

FVL

t

PD-VL-VCC

t

PD-VCC-VL

SKEW

Push-pull driving, Figure 1a 7 25

Open-drain driving, Figure 1c 170 400

Push-pull driving, Figure 1a 6 37

Open-drain driving, Figure 1c 20 50

Push-pull driving, Figure 1b 8 30

Open-drain driving, Figure 1d 180 400

Push-pull driving, Figure 1 3 56

Open-drain driving, Figure 1d 30 60

Driving I/O V

Driving I/O V

Each translator
equally loaded

Push-pull driving 8 Mbps

Open-drain driving 500 kbps

Push-pull driving 5 30

L

Open-drain driving 210 1000

Push-pull driving 4 30

CC

Open-drain driving 190 1000

Push-pull driving 20

Open-drain driving 50

ns

ns

ns

ns

ns

ns

I/O VCC Rise Time t

I/O VCC Fall Time t

I/O VL Rise Time t

I/O VL Fall Time t

Propagation Delay

Channel-to-Channel Skew t

Maximum Data Rate

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

RVCC

FVCC

RVL

FVL

t

PD-VL-VCC

t

PD-VCC-VL

SKEW

Push-pull driving, Figure 1a 7 200

Open-drain driving, Figure 1c 170 400

Push-pull driving, Figure 1a 6 37

Open-drain driving, Figure 1c 20 50

Push-pull driving, Figure 1b 8 30

Open-drain driving, Figure 1d 180 400

Push-pull driving, Figure 1 3 30

Open-drain driving, Figure 1d 30 60

Driving I/O V

Driving I/O V

Each translator
equally loaded

Push-pull driving 1.2 Mbps

Open-drain driving 500 kbps

Push-pull driving 5 200

L

Open-drain driving 210 1000

Push-pull driving 4 200

CC

Open-drain driving 190 1000

Push-pull driving 20

Open-drain driving 50

ns

ns

ns

ns

ns

ns

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 5

TIMING CHARACTERISTICS FOR +1.8V ≤ VL≤ VCC≤ +3.3V

(+1.8V ≤ VL≤ VCC≤ +3.3V, RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are VCC= +3.3V,
V

L

= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

Note 2: All units are 100% production tested at TA= +25°C. Limits over the operating temperature range are guaranteed by design

and not production tested.

Note 3: For normal operation, ensure V

L

< (VCC+ 0.3V). During power-up, VL> (VCC+ 0.3V) does not damage the device.

Note 4: ESD protection is guaranteed by design. To ensure maximum ESD protection, place a 1µF ceramic capacitor between V

CC

and GND. See

Typical Application Circuits

.

Note 5: Timing is measured using 10% of input to 90% of output.

I/O VCC Rise Time t

I/O VCC Fall Time t

I/O VL Rise Time t

I/O VL Fall Time t

Propagation Delay

Channel-to-Channel Skew t

Maximum Data Rate Push-pull driving 16 Mbps

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Push-pull driving, Figure 1a 15 ns

Push-pull driving, Figure 1a 15 ns

Push-pull driving, Figure 1b 15 ns

Push-pull driving, Figure 1b 15 ns

Push-pull driving, driving I/O V

Push-pull driving, driving I/O V

Push-pull driving, each translator
equally loaded

L

CC

15

15

10 ns

RVCC

FVCC

RVL

FVL

t

PD-VL-VCC

t

PD-VCC-VL

SKEW

ns