Rainbow Electronics MAX13047E User Manual

General Description

The MAX13046E/MAX13047E ±15kV ESD-protected
bidirectional level translators provide level shifting for
data transfer in a multivoltage system. The MAX13046E
is a single-channel translator, and the MAX13047E is a
dual-channel translator. Externally applied voltages,
VCCand VL, set the logic level on either side of the
device. The MAX13046E/MAX13047E utilize a transmis­sion-gate-based design to allow data translation in
either direction (V

LVCC

) on any single data line. The
MAX13046E/MAX13047E accept VLfrom +1.1V to the
minimum of either +3.6V or (V

CC

+ 0.3V), and VCCfrom
+1.65V to +5.5V, making these devices ideal for data
transfer between low-voltage ASICs/PLDs and higher
voltage systems.

The MAX13046E/MAX13047E feature a shutdown mode
that reduces supply current to less than 1µA thermal
short-circuit protection, and ±15kV ESD protection on the
VCCside for enhanced protection in applications that
route signals externally. The MAX13046E/MAX13047E
operate at a guaranteed data rate of 8Mbps when push­pull driving is used.

The MAX13046E is available in a 6-pin µDFN package,
and the MAX13047E is available in a 10-pin UTQFN.
Both devices are specified over the extended -40°C to
+85°C operating temperature range.

Applications

I2C and 1-Wire®Level Translation

CMOS Logic-Level Translation

Cell Phones

Portable Devices

Features

 Bidirectional Level Translation
 Operation Down to +1.1V on V

L

 Ultra-Low Supply Current in Shutdown Mode

1µA (max)

 Guaranteed Push-Pull Driving Data Rate

8Mbps (+1.2V

≤≤

V

L

≤≤

+3.6V, V

CC

≤≤

+5.5V)

16Mbps (+1.8V

≤≤

V

L

≤≤

V

CC

≤≤

+3.3V)

 Extended ESD Protection on the I/O VCCLines

±15kV Human Body Model
±15kV IEC61000-4-2 Air-Gap Discharge Method
±8kV IEC61000-4-2 Contact Discharge

 Low Supply Current
 Short-Circuit Protection
 Space-Saving µDFN and UTQFN Packages

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

________________________________________________________________

Maxim Integrated Products

1

Ordering Information/Selector Guide

19-4149; Rev 1; 8/08

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

Note: All devices are specified over the extended -40°C to +85°C operating temperature range.

+

Denotes a lead-free/RoHS-compliant package.

EP = Exposed pad.

Pin Configurations

TOP VIEW

MAX13046E

µDFN

1mm × 1.5mm

2

5

SHDN

GND

1

6

V

CC

V

L1

3

4

I/O V

CC

I/O V

L

+

UTQFN

1.4mm × 1.8mm

MAX13047E

+

V

CC

N.C.

I/O V

L2VL

1 2

7

6

3

N.C.

4

SHDN

I/O V

CC2

I/O V

L1

GND

I/O V

CC1

5

10

9

8

Typical Application Circuits appear at end of data sheet.

1-Wire is a registered trademark of Maxim Integrated Products, Inc.

MAX13046EELT+ 6 µDFN (1mm x 1.5mm) 1 OC

MAX13047EEVB+ 10 UTQFN (1.4mm x 1.8mm) 2 AAC

PART PIN-PACKAGE NUMBER OF CHANNELS TOP MARK

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC= +1.65V to +5.5V, VL= +1.1V to minimum of either +3.6V or ((VCC+ 0.3V)), I/O VL and I/O VCCare unconnected, TA= -40°C to
+85°C, unless otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)
V

CC

...........................................................................-0.3V to +6V

V

L

..............................................................................-0.3V to +4V

I/O V

CC

.......................................................-0.3V to (VCC+ 0.3V)

I/O V

L

............................................................-0.3V to (VL+ 0.3V)

SHDN........................................................................-0.3V to +6V

Short-Circuit Duration I/O V

L

, I/O VCCto GND...........Continuous

Power Dissipation (T

A

= +70°C)

6-Pin µDFN (derate 2.1mW/°C above +70°C) .............168mW

10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW

Junction-to-Ambient Thermal Resistance (

θ

JA

) (Note 1)

6-Pin µDFN.................................................................477°C/W

10-Pin UTQFN ...........................................................20.1°C/W

Junction-to-Ambient Thermal Resistance (

θ

JC

) (Note 1)

6-Pin µDFN................................................................20.1°C/W

10-Pin UTQFN .........................................................143.1°C/W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial

.

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

POWER SUPPLY

VL Supply Range V

VCC Supply Range V

Supply Current from V

Supply Current from V

VCC Shutdown-Mode Supply Current I

CC

L

I

SD-VCCTA

VCC > 3.3V 1.1 3.6V

L

VCC ≤ 3.3V 1.1 V

CC

QVCC

I

QVL

= +25°C, SHDN = GND 0.03 1 µA

1.65 5.5 V

CC

+ 0.3V

10 µA

15 µA

V

VL Shutdown-Mode Supply Current I

I/O VL and I/O VCC Shutdown-Mode
Leakage Current

SHDN Input Leakage TA = +25°C 0.02 0.1 µA

ESD PROTECTION

I/O VCC (Note 4)

All Other Pins Human Body Model ±2 kV

LOGIC-LEVEL THRESHOLDS

I/O VL Input-Voltage High V

I/O VL Input-Voltage Low V

SD-VL

I

SD-LKGTA

IHL

ILL

TA = +25°C, SHDN = GND 0.03 1 µA

= +25°C, SHDN = GND 0.02 0.5 µA

Human Body Model ±15V

IEC 61000-4-2 Air-Gap Discharge ±15V

IEC 61000-4-2 Contact Discharge ±8V

VL -

0.2

0.15 V

kV

V

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(VCC= +1.65V to +5.5V, VL= +1.1V to minimum of either +3.6V or ((VCC+ 0.3V)), I/O VL and I/O VCCare unconnected, TA= -40°C to
+85°C, unless otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

I/O VCC Input-Voltage High V

I/O VCC Input-Voltage Low V

I/O VL Output-Voltage High V

I/O VL Output-Voltage Low V

I/O VCC Output-Voltage High V

I/O VCC Output-Voltage Low V

SHDN Input-Voltage High V

SHDN Input-Voltage Low V

I/O VL-to-I/O V

V

Shutdown Threshold Low V

CC

V

Shutdown Threshold High V

CC

VL Shutdown Threshold V

Pullup Resistance V

RISE/FALL-TIME ACCELERATOR STAGE

Accelerator Pulse Duration 20 ns

I/O VL Output-Accelerator Source
Impedance

I/O VCC Output-Accelerator Source
Impedance

I/O VL Output-Accelerator Source
Impedance

I/O VCC Output-Accelerator Source
Impedance

Resistance 80 250 Ω

CC

IH-SHDN

IL-SHDN

TH_L_VCCVCC

TH_H_VCCVCC

TH_VL

IHC

ILC

OHL

OLL

OHC

OLC

I/O VL source current = 20µA,
V

I/O VL sink current = 1mA,
V

I/O VCC source current = 20µA,
V

I/O VCC sink current = 1mA,
V

VL > 1.2 VL - 0.2

1.1 ≤ VL < 1.2 VL - 0.1

V

V

V

V

> VCC - 0.4V

I/O VCC

< 0.15V

I/O VCC

> VL - 0.2V

I/O VL

< 0.15V

I/O VL

falling, VL = +3.3V 0.5 0.8 1.1 V

rising, VL = +3.3V 0.3 0.6 0.9 V

= VL = +3.3V 6 10 15.5 kΩ

CC

= 1.7V 13 Ω

L

= 2.2V 17 Ω

CC

= 3.2V 6 Ω

L

= 3.6V 10 Ω

CC

VCC -

0.4

0.15 V

0.67 x
V

L

0.4 V

0.67 x

V

CC

0.4 V

0.15 V

0.35 0.75 1.06 V

V

V

V

V

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

4 _______________________________________________________________________________________

TIMING CHARACTERISTICS FOR +1.2V ≤ VL≤ MINIMUM OF EITHER +3.6V OR (V

CC

+ 0.3V)

(VCC≤ ±5.5V, +1.2V ≤ VL≤ minimum of either +3.6V or ((VCC+ 0.3V)), RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless
otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

TIMING CHARACTERISTICS FOR +1.1V ≤ VL≤ +1.2V

(VCC≤ ±5.5V, +1.1V ≤ VL≤ +1.2V, RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are
V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

I/O VCC Rise Time t

I/O VCC Fall Time t

I/O VL Rise Time t

I/O VL Fall Time t

Propagation Delay

Channel-to-Channel Skew t

Maximum Data Rate

RVCC

FVCC

RVL

FVL

t

PD-VL-VCC

t

PD-VCC-VL

SKEW

Push-pull driving, Figure 1a 7 25

Open-drain driving, Figure 1c 170 400

Push-pull driving, Figure 1a 6 37

Open-drain driving, Figure 1c 20 50

Push-pull driving, Figure 1b 8 30

Open-drain driving, Figure 1d 180 400

Push-pull driving, Figure 1 3 56

Open-drain driving, Figure 1d 30 60

Driving I/O V

Driving I/O V

Each translator
equally loaded

Push-pull driving 8 Mbps

Open-drain driving 500 kbps

Push-pull driving 5 30

L

Open-drain driving 210 1000

Push-pull driving 4 30

CC

Open-drain driving 190 1000

Push-pull driving 20

Open-drain driving 50

ns

ns

ns

ns

ns

ns

I/O VCC Rise Time t

I/O VCC Fall Time t

I/O VL Rise Time t

I/O VL Fall Time t

Propagation Delay

Channel-to-Channel Skew t

Maximum Data Rate

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

RVCC

FVCC

RVL

FVL

t

PD-VL-VCC

t

PD-VCC-VL

SKEW

Push-pull driving, Figure 1a 7 200

Open-drain driving, Figure 1c 170 400

Push-pull driving, Figure 1a 6 37

Open-drain driving, Figure 1c 20 50

Push-pull driving, Figure 1b 8 30

Open-drain driving, Figure 1d 180 400

Push-pull driving, Figure 1 3 30

Open-drain driving, Figure 1d 30 60

Driving I/O V

Driving I/O V

Each translator
equally loaded

Push-pull driving 1.2 Mbps

Open-drain driving 500 kbps

Push-pull driving 5 200

L

Open-drain driving 210 1000

Push-pull driving 4 200

CC

Open-drain driving 190 1000

Push-pull driving 20

Open-drain driving 50

ns

ns

ns

ns

ns

ns

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 5

TIMING CHARACTERISTICS FOR +1.8V ≤ VL≤ VCC≤ +3.3V

(+1.8V ≤ VL≤ VCC≤ +3.3V, RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are VCC= +3.3V,
V

L

= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

Note 2: All units are 100% production tested at TA= +25°C. Limits over the operating temperature range are guaranteed by design

and not production tested.

Note 3: For normal operation, ensure V

L

< (VCC+ 0.3V). During power-up, VL> (VCC+ 0.3V) does not damage the device.

Note 4: ESD protection is guaranteed by design. To ensure maximum ESD protection, place a 1µF ceramic capacitor between V

CC

and GND. See

Typical Application Circuits

.

Note 5: Timing is measured using 10% of input to 90% of output.

I/O VCC Rise Time t

I/O VCC Fall Time t

I/O VL Rise Time t

I/O VL Fall Time t

Propagation Delay

Channel-to-Channel Skew t

Maximum Data Rate Push-pull driving 16 Mbps

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Push-pull driving, Figure 1a 15 ns

Push-pull driving, Figure 1a 15 ns

Push-pull driving, Figure 1b 15 ns

Push-pull driving, Figure 1b 15 ns

Push-pull driving, driving I/O V

Push-pull driving, driving I/O V

Push-pull driving, each translator
equally loaded

L

CC

15

15

10 ns

RVCC

FVCC

RVL

FVL

t

PD-VL-VCC

t

PD-VCC-VL

SKEW

ns

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

6 _______________________________________________________________________________________

Typical Operating Characteristics

(VCC= +3.3V, VL= +1.8V, RL= 1MΩ, CL= 15pF, push-pull driving data rate = 8Mbps, TA= +25°C, unless otherwise noted.)

VL DYNAMIC SUPPLY CURRENT

vs. V

CC

SUPPLY VOLTAGE

(PUSH-PULL DRIVING ONE I/O V

L

)

VCC SUPPLY VOLTAGE (V)

V

L

SUPPLY CURRENT (μA)

MAX13046E/7E toc01

1.65 2.20 2.75 3.30 3.85 4.40 4.95 5.50

0

50

100

150

200

250

300

350

VL DYNAMIC SUPPLY CURRENT

vs. V

CC

SUPPLY VOLTAGE

(PUSH-PULL DRIVING ONE I/O V

CC

)

VCC SUPPLY VOLTAGE (V)

V

L

SUPPLY CURRENT (μA)

MAX13046E/7E toc02

1.65 2.20 2.75 3.30 3.85 4.40 4.95 5.50

0

50

100

150

200

250

VCC DYNAMIC SUPPLY CURRENT

vs. V

L

SUPPLY VOLTAGE

(PUSH-PULL DRIVING ONE I/O V

L

)

VL SUPPLY VOLTAGE (V)

V

CC

SUPPLY CURRENT (μA)

MAX13046E/7E toc03

1.2 1.9 2.6 3.3

0

100

200

300

400

500

600

VCC DYNAMIC SUPPLY CURRENT

vs. V

L

SUPPLY VOLTAGE

(PUSH-PULL DRIVING ONE I/O V

CC

)

VL SUPPLY VOLTAGE (V)

V

CC

SUPPLY CURRENT (μA)

MAX13046E/7E toc04

1.2 1.9 2.6 3.3

0

10

20

30

40

50

60

70

80

VL DYNAMIC SUPPLY CURRENT

vs. TEMPERATURE

(PUSH-PULL DRIVING ONE I/O V

L

)

TEMPERATURE (°C)

V

L

SUPPLY CURRENT (μA)

MAX13046E/7E toc05

-40 -15 10 35 60 85

0

20

40

60

80

100

120

140

160

180

200

VL DYNAMIC SUPPLY CURRENT

vs. TEMPERATURE

(PUSH-PULL DRIVING ONE I/O V

CC

)

TEMPERATURE (°C)

V

L

SUPPLY CURRENT (μA)

MAX13046E/7E toc06

-40 -15 10 35 60 85

0

50

100

150

200

250

300

350

VL DYNAMIC SUPPLY CURRENT

vs. CAPACITIVE LOAD

(PUSH-PULL DRIVING ONE I/O V

L

)

CAPACITIVE LOAD (pF)

V

L

SUPPLY CURRENT (μA)

MAX13046E/7E toc07

0 1020304050

0

20

40

60

80

100

120

VCC DYNAMIC SUPPLY CURRENT

vs. CAPACITIVE LOAD

(PUSH-PULL DRIVING ONE I/O V

L

)

CAPACITIVE LOAD (pF)

V

CC

SUPPLY CURRENT (μA)

MAX13046E/7E toc08

0 1020304050

0

200

400

600

800

1000

1200

RISE/FALL TIME vs. CAPACITIVE LOAD

(PUSH-PULL DRIVING ONE I/O V

L

)

CAPACITIVE LOAD (pF)

RISE/FALL TIME (ns)

MAX13046E/7E toc09

0 1020304050

0

5

10

15

20

25

t

FVCC

t

RVCC

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 7

Typical Operating Characteristics (continued)

(VCC= +3.3V, VL= +1.8V, RL= 1MΩ, CL= 15pF, push-pull driving data rate = 8Mbps, TA= +25°C, unless otherwise noted.)

PROPAGATION DELAY vs. CAPACITIVE LOAD

(PUSH-PULL DRIVING ONE I/O V

L

)

CAPACITIVE LOAD (pF)

PROPAGATION DELAY (ns)

MAX13046E/7E toc10

0 1020304050

0

1

2

3

4

5

6

7

RISE/FALL TIME vs. CAPACITIVE LOAD

(PUSH-PULL DRIVING ONE I/O V

CC

)

CAPACITIVE LOAD (pF)

RISE/FALL TIME (ns)

MAX13046E/7E toc11

0 1020304050

0

2

4

6

8

10

12

t

RVL

t

FVL

PROPAGATION DELAY vs. CAPACITIVE LOAD

(PUSH-PULL DRIVING ONE I/O V

CC

)

CAPACITIVE LOAD (pF)

PROPAGATION DELAY (ns)

MAX13046E/7E toc12

0 1020304050

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

RAIL-TO-RAIL DRIVING

(DRIVING ONE I/O V

L

)

MAX13046E/7E toc13

25ns/div

I/O V

L

I/O V

CC

1V/div

1V/div

EXISTING SHUTDOWN MODE

MAX13046E/7E toc14

250ns/div

I/O V

L

I/O V

CC

1V/div

2V/div

1V/div

SHDN

MAX13046E/MAX13047E

Detailed Description

The MAX13046E/MAX13047E ±15kV ESD-protected
bidirectional level translators provide level shifting for
data transfer in a multivoltage system. The MAX13046E
is a single-channel translator and the MAX13047E is a
dual-channel translator. Externally applied voltages,
VCCand VL, set the logic level on either side of the
device. The MAX13046E/MAX13047E utilize a transmis­sion-gate-based design to allow data translation in
either direction (VL VCC) on any single data line. The
MAX13046E/MAX13047E accept VLfrom +1.1V to the
minimum of either +3.6V or (V

CC

+ 0.3V) and VCCfrom

+1.65V to +5.5V, making these devices ideal for data
transfer between low-voltage ASICs/PLDs and higher
voltage systems.

The MAX13046E/MAX13047E feature a shutdown mode
that reduces supply current to less than 1µA thermal
short-circuit protection, and ±15kV ESD protection on the
VCCside for enhanced protection in applications that
route signals externally. The MAX13046E/MAX13047E
operate at a guaranteed data rate of 8Mbps when push­pull driving is used. See the

Functional Diagram

.

Single- and Dual-Bidirectional
Low-Level Translator

8 _______________________________________________________________________________________

MAX13046E Pin Description

MAX13047E Pin Description

MAX13046E FUNCTION

µDFN NAME

1VLV L Inp ut S up p l y V ol tag e. Byp ass V L w i th a 0.1µF cer am i c cap aci tor l ocated as cl ose as p ossi b l e to the i np ut.

2 GND Ground

3 I/O VLInput/Output. Referenced to VL.

4 I/O V
5 SHDN S hutd ow n Inp ut. D r i ve S HD N hi g h to enab l e the d evi ce. D r i ve S HD N l ow to p ut the d evi ce i n shutd ow n m od e.

6V

MAX13047E FUNCTION

UTQFN NAME

1 I/O V

2V

3, 7 N.C. Not Connected. Internally not connected.

4 SHDN Enable Input. Drive SHDN high to enable the device. Drive SHDN low to put the device in shutdown mode.

5 I/O V

6V

8 I/O V

9 GND Ground

10 I/O V

— EP Exposed Pad. Connect EP to GND.

Input/Output. Referenced to VCC.

CC

V CC Inp ut S up p l y V ol tag e. Byp ass V CC w i th a 1µF cer am i c cap aci tor l ocated as cl ose as p ossi b l e to the i np ut

CC

for ful l E S D p r otecti on. If ful l E S D p r otecti on i s not r eq ui r ed , b yp ass V

Input/Output 2. Referenced to VL.

L2

VL Input Supply Voltage. Bypass VL with a 0.1µF ceramic capacitor located as close as possible to the

L

input.

Input/Output 2. Referenced to VCC.

CC2

VCC Input Supply Voltage. Bypass VCC with a 1µF ceramic capacitor located as close as possible to the
input for full ESD protection. If full ESD protection is not required, bypass V

CC

capacitor.

Input/Output 1. Referenced to VCC.

CC1

Input/Output 1. Referenced to VL.

L1

w i th a 0.1µF cer am i c cap aci tor .

CC

with a 0.1µF ceramic

CC

Level Translation

For proper operation, ensure that +1.65V ≤ VCC≤
+5.5V and +1.1V ≤ VL≤ the minimum of either +3.6V or
(V

CC

+ 0.3V). During power-up sequencing, VL≥ (V

CC

+ 0.3V) does not damage the device. The speed of the
rise time accelerator circuitry limits the maximum data
rate for the MAX13046E/MAX13047E to 16Mbps.

Rise-Time Accelerators

The MAX13046E/MAX13047E have an internal rise-time
accelerator, allowing operation up to 16Mbps. The rise­time accelerators are present on both sides of the
device and act to speed up the rise time of the input
and output of the device, regardless of the direction of
the data. The triggering mechanism for these accelera­tors is both level and edge sensitive. To guarantee
operation of the rise time accelerators the maximum
parasitic capacitance should be less than 200pF on the
I/O lines.

Shutdown Mode

Drive SHDN low to place the MAX13046E/MAX13047E
in shutdown mode and drive SHDN high for normal
operation. Activating the shutdown mode disconnects
the internal 10kΩ pullup resistors on the I/O VCCand I/O
VLlines. This forces the I/O lines to a high-impedance

state, and decreases the supply current to less than
1µA. The high-impedance I/O lines in shutdown mode
allow for use in a multidrop network. The MAX13046E/
MAX13047E have a diode from each I/O to the corre­sponding supply rail and GND. Therefore, when in shut­down mode, do not allow the voltage at I/O VLto
exceed (VL + 0.3V), or the voltage at I/O V

CC

to exceed

(V

CC

+ 0.3V).

Operation with One Supply Disconnected

Certain applications require sections of circuitry to be
disconnected to save power. When VLis connected and
VCCis disconnected or connected to ground, the device
enters shutdown mode. In this mode, I/O VLcan still be
driven without damage to the device; however, data
does not translate from I/O VLto I/O VCC. If VCCfalls
more than V

TH_L_VCC

below VL, the device disconnects
the pullup resistors at I/O VLand I/O VCC. To achieve the
lowest possible supply current from VLwhen VCCis dis­connected, it is recommended that the voltage at the
VCCsupply input be approximately equal to GND.

When VCCis connected and VLis less than V

TH_VL

, the

device enters shutdown mode. In this mode, I/O V

CC

can still be driven without damage to the device; howev­er, data does not translate from I/O V

CC

to I/O VL.

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 9

Functional Diagram

V

L

ONE-SHOT
RISE-TIME

ACCELERATOR

10kΩ 10kΩ

I/O V

L

SHDN

V

CC

ONE-SHOT
RISE-TIME

ACCELERATOR

GATE BIAS

N

GND

PU2PU1

I/O V

CC

MAX13046E/MAX13047E

When VCCis disconnected or connected to ground, I/O
VCCmust not be driven more than VCC+ 0.3V. When V

L

is disconnected or connected to ground, I/O VLmust
not be driven more than VL+ 0.3V.

Short-Circuit Protection

Thermal-overload detection protects the MAX13046E/
MAX13047E from short-circuit fault conditions. In the
event of a short-circuit fault, when the junction tempera­ture (TJ) exceeds +150°C, the device enters shutdown
mode. When the device has cooled to below +140°C,
normal operation resumes.

±15kV ESD Protection

ESD protection structures are incorporated on all pins
to protect against electrostatic discharges encountered
during handling and assembly. The ESD structures
withstand electrostatic discharge in all states: normal

operation, shutdown mode, and powered down. The
I/O VCClines of the MAX13046E/MAX13047E are char­acterized for protection to the following limit:

• ±15kV using the Human Body Model

ESD Test Conditions

ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.

Human Body Model

Figure 2a shows the Human Body Model, and Figure
2b shows the current waveform it generates when dis­charged into a low-impedance state. This model con­sists of a 100pF capacitor charged to the ESD voltage
of interest that is then discharged into the test device
through a 1.5kΩ resistor.

Single- and Dual-Bidirectional
Low-Level Translator

10 ______________________________________________________________________________________

Figure 1a. Rail-to-Rail Driving I/O V

L

Figure 1b. Rail-to-Rail Driving I/O V

CC

V

CC

DATA

CC

R

L

t

PD-VL-VCC

C

L

I/O V
(t

RISE

t

FALL

V

L

L

,

< 10ns)

R

50Ω

V

V

CC

L

SHDN

MAX13046E/

I/O V

L

t

PD-VL-VCC

MAX13047E

I/O V

GND

S

I/O V

CC

t

RVCC

t

FVCC

I/O V
(t

RISE

t

FALL

I/O V

C

L

CC

,

< 10ns)

L

CC

t

PD-VCC-VL

t

V

50Ω

FVL

CC

R

S

V

L

V

V

CC

L

SHDN

MAX13046E/

MAX13047E

DATA

I/O V

L

R

L

t

PD-VCC-VL

t

RVL

I/O V

GND

IEC 61000-4-2

The IEC 61000-4-2 standard covers ESD testing and per­formance of finished equipment; it does not specifically
refer to integrated circuits. The MAX13046E/MAX13047E
help to design equipment that meets Level 4 of IEC
61000-4-2 without the need for additional ESD-protection
components. The major difference between tests done
using the Human Body Model and IEC 61000-4-2 is high­er peak current in IEC 61000-4-2 because series resis­tance is lower in the IEC 61000-4-2 model. Hence, the
ESD withstand voltage measured to IEC 61000-4-2 can
be lower than that measured using the Human Body
Model. Figure 3a shows the IEC 61000-4-2 model, and
Figure 3b shows the current waveform for the ±8kV, IEC
61000-4-2, Level 4, ESD contact-discharge test. The Air­Gap test involves approaching the device with a charged
probe. The contact-discharge method connects the
probe to the device before the probe is energized.

Applications Information

Power-Supply Decoupling

To reduce ripple and the chance of transmitting incor­rect data, bypass VLand VCCto ground with a 0.1µF
ceramic capacitor. To ensure full ±15kV ESD protec­tion, bypass VCCto ground with a 1µF ceramic capaci­tor. Place all capacitors as close as possible to the
power-supply inputs.

I2C Level Translation

The MAX13046E/MAX13047E level shifts the data pre­sent on the I/O lines between +1.1V and +5.5V, making
them ideal for level translation between a low-voltage
ASIC and an I2C device. A typical application involves
interfacing a low-voltage microprocessor to a +3V or
+5V D/A converter, such as the MAX517.

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

______________________________________________________________________________________ 11

Figure 1c. Open-Drain Driving I/O V

L

Figure 1d. Open-Drain Driving I/O V

CC

I/O V

I/O V

CC

t

PD-VL-VCC

DATA

t

FVCC

V

CC

R

L

C

L

C

L

I/O V

I/O V

V

L

V

V

CC

L

SHDN

MAX13046E/

MAX13047E

DATA

I/O V

L

R

L

CC

t

PD-VCC-VL

L

t

RVL

I/O V

GND

CC

V

t

PD-VCC-VL

t

CC

FVL

V

L

V

V

CC

L

SHDN

MAX13046E/
MAX13047E

I/O V

L

L

t

PD-VL-VCC

CC

t

RVCC

I/O V

GND

MAX13046E/MAX13047E

1-Wire Interface Translation

The MAX13046E/MAX13047E are ideal for level transla­tion between a low-voltage ASIC and 1-Wire device. A
typical application involves interfacing a low-voltage
microprocessor to an external memory, such as the
DS2502. The maximum data rate depends on the
1-Wire device. For the DS2502, the maximum data rate
is 16.3kbps. A 5kΩ pullup resistor is recommended
when interfacing with the DS2502.

Push-Pull vs. Open-Drain Driving

The MAX13046E/MAX13047E can be driven in a push­pull or open-drain configurations. For open-drain con­figuration, internal 10kΩ resistors pull up I/O VLand I/O
VCCto their respective power supplies. See the

Timing

Characteristics

table for maximum data rates when

using open-drain drivers.

PCB Layout

The MAX13046E/MAX13047E require good PCB layout
for proper operation and optimal rise/fall time perfor­mance. Ensure proper high-frequency PCB layout even
when operating at low data rates.

Driving High-Capacitive Load

Capacitive loading on the I/O lines impacts the rise time
(and fall time) of the MAX13046E/MAX13047E when dri­ving the signal lines. The actual rise time is a function of
the load capacitance, parasitic capacitance, the supply
voltage, and the drive impedance of the MAX13046E/
MAX13047E.

Operating the MAX13046E/MAX13047E at a low data rate
does NOT increase capacitive load driving capability.

Single- and Dual-Bidirectional
Low-Level Translator

12 ______________________________________________________________________________________

Figure 2b. Human Body Current Waveform

Figure 2a. Human Body ESD Test Model

Figure 3b. IEC 61000-4-2 ESD Generator Current Waveform

Figure 3a. IEC 61000-4-2 ESD Test Model

R

D

1500Ω

DISCHARGE

RESISTANCE

STORAGE
CAPACITOR

DEVICE
UNDER

TEST

HIGH-

VOLTAGE

DC

SOURCE

R

C

1MΩ

CHARGE-CURRENT-

LIMIT RESISTOR

C

100pF

s

IP 100%

90%

AMPERES

36.8%

10%

0

0

t

RL

TIME

t

DL

CURRENT WAVEFORM

PEAK-TO-PEAK RINGING

I

r

(NOT DRAWN TO SCALE)

R

D

330Ω

DISCHARGE

RESISTANCE

STORAGE
CAPACITOR

HIGH-

VOLTAGE

DC

SOURCE

R

C

50MΩ TO 100MΩ

CHARGE-CURRENT-

LIMIT RESISTOR

C

s

150pF

I

100%

90%

PEAK

I

10%

tr = 0.7ns TO 1ns

30ns

60ns

DEVICE
UNDER

TEST

t

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

______________________________________________________________________________________ 13

Typical Application Circuits

MAX13047E

SHDN

I/O V

L2

DATADATA

I/O V

CC2

0.1μF 1μF

+3.3V+1.8V

V

CC

+3.3V

SYSTEM

+1.8V

SYSTEM

V

L

I/O V

L1

I/O V

CC1

+1.8V

SYSTEM

0.1μF 1μF

V

V

CC

L

SHDN

MAX13046E

I/O V

L

I/O V

CC

+3.3V+1.8V

+3.3V

SYSTEM

DATADATA

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

14

____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

© 2008 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.

SPRINGER

Chip Information

PROCESS: BiCMOS

Package Information

For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages

.

PACKAGE TYPE PACKAGE CODE DOCUMENT NO.

6 µDFN L611-1

21-0147

10 UTQFN V101A1CN-1

21-0028