Rainbow Electronics MAX1231 User Manual

General Description
The MAX1227/MAX1229/MAX1231 are serial 12-bit ana­log-to-digital converters (ADCs) with an internal reference and an internal temperature sensor. These devices fea­ture on-chip FIFO, scan mode, internal clock mode, inter­nal averaging, and AutoShutdown™. The maximum sampling rate is 300ksps using an external clock. The MAX1231 has 16 input channels, the MAX1229 has 12 input channels, and the MAX1227 has 8 input channels. All input channels are configurable for single-ended or differential inputs in unipolar or bipolar mode. All three devices operate from a +3V supply and contain a 10MHz SPI™/QSPI™/MICROWIRE™-compatible serial port.
The MAX1231 is available in 28-pin 5mm x 5mm QFN with exposed pad and 24-pin QSOP packages. The MAX1227/MAX1229 are only available in QSOP pack­ages. All three devices are specified over the extended
-40°C to +85°C temperature range.
________________________Applications
System Supervision
Data-Acquisition Systems
Industrial Control Systems
Patient Monitoring
Data Logging
Instrumentation
Features
Internal Temperature Sensor (±1°C Accuracy)16-Entry First-In/First-Out (FIFO)Analog Multiplexer with True Differential
Track/Hold
16-, 12-, 8-Channel Single Ended 8-, 6-, 4-Channel True Differential (Unipolar or Bipolar)
Accuracy: ±1 LSB INL, ±1 LSB DNL, No Missing
Codes Over Temperature
Scan Mode, Internal Averaging, and Internal ClockLow-Power Single +3V Operation
0.62mA at 300ksps
Internal 2.5V Reference or External Differential
Reference
10MHz 3-Wire SPI/QSPI/MICROWIRE-Compatible
Interface
Space-Saving 28-Pin 5mm x 5mm QFN Package
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO,
Temp Sensor, Internal Reference
________________________________________________________________ Maxim Integrated Products 1
Pin Configurations
19-2851; Rev 1; 7/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
Ordering Information
*Future product—contact factory for availability.
Pin Configurations continued at end of data sheet.
Ordering Information continued at end of data sheet.
AutoShutdown is a trademark of Maxim Integrated Products, Inc. SPI/QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp.
PART TEMP RANGE PIN-PACKAGE
MAX1227ACEE-T* 0°C to +70°C 16 QSOP
MAX1227AEEE-T* -40°C to +85°C 16 QSOP
1
TOP VIEW
AIN0
1
AIN1
2
AIN2
3
MAX1227
4
AIN3
AIN4
5
AIN5
6
REF-/AIN6
CNVST/AIN7
7
8
QSOP
16
15
14
13
12
11
10
9
EOC
DOUT
DIN
CS
SCLK
V
DD
GND
REF+
AIN0
AIN1
AIN2
AIN4
AIN5
AIN6
AIN8
2
3
4
MAX1229
5
6
7
8
9
10
QSOP
20
EOC
19
DOUT
18
DIN
17
CSAIN3
16
SCLK
15
V
14
GND
REF+AIN7
13
12
CNVST/AIN11
11
REF-/AIN10AIN9
DD
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD= +2.7V to +3.6V, f
SAMPLE
= 300kHz, f
SCLK
= 4.8MHz (50% duty cycle), V
REF
= 2.5V, TA= T
MIN
to T
MAX
, unless otherwise
noted. Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VDDto GND..............................................................-0.3V to +6V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (V
DD
+ 0.3V)
AIN0–AIN13, REF-/AIN_, CNVST/AIN_,
REF+ to GND.........................................-0.3V to (V
DD
+ 0.3V)
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (T
A
= +70°C)
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW
20-Pin QSOP (derate 9.1mW/°C above +70°C)...........727mW
24-Pin QSOP (derate 9.5mW/°C above +70°C)...........762mW
28-Pin QFN 5mm x 5mm
(derate 20.8mW/°C above +70°C)........................1667mW
Operating Temperature Ranges
MAX12__C__.......................................................0°C to +70°C
MAX12__E__....................................................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
DC ACCURACY (NOTE 1)
Resolution RES 12 Bits
Integral Nonlinearity INL ±1.0 LSB
Differential Nonlinearity DNL No missing codes over temperature ±1.0 LSB
Offset Error ±0.5 ±4.0 LSB
Gain Error (Note 2) ±0.5 ±4.0 LSB
Offset Error Temperature Coefficient
Gain Temperature Coefficient ±0.8 ppm/°C
Channel-to-Channel Offset Matching
DYNAMIC SPECIFICATIONS (10kHz sine wave input, 2.5V
Signal-to-Noise Plus Distortion SINAD 70 dB
Total Harmonic Distortion THD Up to the 5th harmonic -82 dBc
Spurious-Free Dynamic Range SFDR 80 dBc
Intermodulation Distortion IMD f
Full-Power Bandwidth -3dB point 1 MHz
Full-Linear Bandwidth S / (N + D) > 68dB 25 kHz
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
= 9.9kHz, f
in1
, 300ksps, f
P-P
= 10.2kHz 76 dBc
in2
SCLK
= 4.8MHz)
±2
±0.1 LSB
ppm/°C
FSR
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO,
Temp Sensor, Internal Reference
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +2.7V to +3.6V, f
SAMPLE
= 300kHz, f
SCLK
= 4.8MHz (50% duty cycle), V
REF
= 2.5V, TA= T
MIN
to T
MAX
, unless otherwise
noted. Typical values are at T
A
= +25°C.)
CONVERSION RATE
Power-Up Time t
Acquisition Time t
Conversion Time t
External Clock Frequency f
SCLK Duty Cycle 40 60 %
Aperture Delay 30 ns
Aperture Jitter <50 ps
ANALOG INPUT
Input Voltage Range
Input Leakage Current V
Input Capacitance During acquisition time (Note 6) 24 pF
INTERNAL TEMPERATURE SENSOR
Measurement Error (Note 7)
Tem p er atur e M easur em ent N oi se 0.4 °C
Temperature Resolution 1/8 °C
Power-Supply Rejection 0.3 °C/V
INTERNAL REFERENCE
REF Output Voltage 2.48 2.50 2.52 V
REF Temperature Coefficient TC
Output Resistance 6.5 k
REF Output Noise 200 µV
REF Power-Supply Rejection PSRR -70 dB
EXTERNAL REFERENCE INPUT
REF- Input Voltage Range V
REF+ Input Voltage Range V
REF+ Input Current I
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
PU
ACQ
CONV
SCLK
REF
REF-
REF+
REF+
External reference 0.8
Internal reference (Note 3) 65
Internally clocked 3.5
Externally clocked (Note 4) 2.7
Externally clocked conversion 0.1 4.8
Data I/O 10
Unipolar 0 V
Bipolar (Note 5) - V
= V
IN
DD
Grade A, TA = +25°C ±0.3
Grade A, TA = -20°C to +85°C ±0.5 ±1
Grade A, TA = T
Grade B, TA = +25°C ±0.7
Grade B, T
Grade A ±8
Grade B ±30
V
REF+
V
REF+
A
= 2.5V, f
= 2.5V, f
= T
to T
MIN
MAX
to T
MIN
MAX
= 300ksps 40 100
SAMPLE
= 0 ±0.1 ±5
SAMPLE
/ 2 V
RE F
±0.01 ±1 µA
±0.75 ±1.5
±1.2 ±2.5
0 500 mV
1.0 VDD + 50mV V
0.6 µs
REF
/ 2
RE F
MHz
p p m /° C
µs
µs
V
°C
RMS
RMS
µA
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
4 _______________________________________________________________________________________
Note 1: Tested at VDD= +2.7V, unipolar input mode. Note 2: Offset nulled. Note 3: Time for reference to power up and settle to within 1 LSB. Note 4: Conversion time is defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle. Note 5: The operational input voltage range for each individual input of a differentially configured pair is from GND to V
DD
. The
operational input voltage difference is from -V
REF
/ 2 to +V
REF
/ 2.
Note 6: See Figure 3 (Input Equivalent Circuit) and the Sampling Error vs. Source Impedance curve in the Typical Operating
Characteristics section.
Note 7: Fast automated test, excludes self-heating effects. Note 8: Supply current is specified depending on whether an internal or external reference is used for voltage conversions.
Temperature measurements always use the internal reference.
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +2.7V to +3.6V, f
SAMPLE
= 300kHz, f
SCLK
= 4.8MHz (50% duty cycle), V
REF
= 2.5V, TA= T
MIN
to T
MAX
, unless otherwise
noted. Typical values are at T
A
= +25°C.)
DIGITAL INPUTS (SCLK, DIN, CS, CNVST)
Input Voltage Low V
Input Voltage High V
Input Hysteresis V
Input Leakage Current I
Input Capacitance C DIGITAL OUTPUTS (DOUT, EOC)
Output Voltage Low V
Output Voltage High V
Tri-State Leakage Current I
Tri-State Output Capacitance C
POWER REQUIREMENTS
Supply Voltage V
Supply Current (Note 8) I
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Power-Supply Rejection PSR VDD = 2.7V to 3.6V; full-scale input ±0.2 ±1 mV
IL
IH
HYST
IN
IN
OL
OH
L
OUT
DD
DD
VIN = 0 or V
I
SINK
I
SINK
I
SOURCE
CS = V CS = V
Internal reference
External reference
DD
= 2mA 0.4
= 4mA 0.8
= 1.5mA VDD - 0.5 V
DD
DD
VDD x 0.7 V
2.7 3.6 V
During temp sense 2200 2700
f
f
Shutdown 0.2 5
During temp sense 1550 2000
f
Shutdown 0.2 5
= 300ksps 1550 1800
SAMPLE
= 0, REF on 1000 1200
SAMPLE
= 300ksps 880 1100
SAMPLE
200 mV
±0.01 ±1.0 µA
±0.05 ±1 µA
VDD x 0.3 V
15 pF
15 pF
V
µA
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO,
Temp Sensor, Internal Reference
_______________________________________________________________________________________ 5
TIMING CHARACTERISTICS (Figure 1)
-1.0
-0.4
-0.6
-0.8
-0.2
0
0.2
0.4
0.6
0.8
1.0
0 1024 2048 3072 4096
INTEGRAL NONLINEARITY
vs. OUTPUT CODE
MAX1227/29/31 toc01
OUTPUT CODE
INTEGRAL NONLINEARITY (LSB)
-1.0
-0.4
-0.6
-0.8
-0.2
0
0.2
0.4
0.6
0.8
1.0
0 1024 2048 3072 4096
DIFFERENTIAL NONLINEARITY
vs. OUTPUT CODE
MAX1227/29/31 toc02
OUTPUT CODE
DIFFERENTIAL NONLINEARITY (LSB)
SINAD vs. FREQUENCY
MAX1227/29/31 toc03
FREQUENCY (kHz)
AMPLITUDE (dB)
100101
10
20
40
30
60
50
90
80
70
100
0
0.1 1000
Typical Operating Characteristics
(VDD= +3V, V
REF
= +2.5V, f
SCLK
= 4.8MHz, C
LOAD
= 30pF, TA= +25°C, unless otherwise noted.)
Note 9: This time is defined as the number of clock cycles needed for conversion multiplied by the clock period. If the internal refer-
ence needs to be powered up, the total time is additive. The internal reference is always used for temperature measure­ments.
SCLK Clock Period t
SCLK Duty Cycle t
SCLK Fall to DOUT Transition t
CS Rise to DOUT Disable t CS Fall to DOUT Enable t
DIN to SCLK Rise Setup t
SCLK Rise to DIN Hold t CS to SCLK Rise Setup t SCLK Rise to CS Hold t
CNVST Pulse Width
CS or CNVST Rise to EOC
Low (Note 9)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CP
CH
DOT
DOD
DOE
DS
DH
CSS
CSH
t
CSW
Externally clocked conversion 208
Data I/O 100
40 60 %
C
= 30pF 40 ns
LOAD
= 30pF 40 ns
C
LOAD
C
= 30pF 40 ns
LOAD
40 ns
0ns
40 ns
0ns
CKSEL = 00, CKSEL = 01 (temp sense) 40 ns
ns
CKSEL = 01 (voltage conversion) 1.4 µs
t
T S
Temp sense 55
Voltage conversion 7
µs
Reference power-up 65
2.4970
2.4974
2.4982
2.4978
2.4986
2.4990
2.7 3.0 3.3 3.6
INTERNAL REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
MAX1227/29/31 toc10
SUPPLY VOLTAGE (V)
INTERNAL REFERENCE VOLTAGE (V)
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(VDD= +3V, V
REF
= +2.5V, f
SCLK
= 4.8MHz, C
LOAD
= 30pF, TA= +25°C, unless otherwise noted.)
120
SFDR vs. FREQUENCY
SUPPLY CURRENT vs. SAMPLING RATE
700
SUPPLY CURRENT vs. SUPPLY VOLTAGE
700
100
80
60
AMPLITUDE (dB)
40
20
0
0.1 1000 FREQUENCY (kHz)
100101
MAX1227/29/31 toc04
SUPPLY CURRENT (µA)
600
500
400
300
200
1 1000
SAMPLING RATE (ksps)
10010
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
0.5
0.4
0.3
0.2
0.1
SHUTDOWN SUPPLY CURRENT (µA)
MAX1227/29/31 toc07
650
MAX1227/29/31 toc05
600
SUPPLY CURRENT (µA)
550
500
2.7 3.6
SUPPLY CURRENT vs. TEMPERATURE
625
fS = 300ksps
620
615
SUPPLY CURRENT (µA)
610
MAX1227/29/31 toc06
3.33.0
SUPPLY VOLTAGE (V)
MAX1227/29/31 toc08
SHUTDOWN SUPPLY CURRENT (µA)
0
2.7 3.0 3.3 3.6 SUPPLY VOLTAGE (V)
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
0.5
0.4
0.3
0.2
0.1
0
-40 10-15 35 60 85
TEMPERATURE (°C)
MAX1227/29/31 toc09
605
-40 10-15 35 60 85 TEMPERATURE (°C)
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO,
Temp Sensor, Internal Reference
_______________________________________________________________________________________ 7
Typical Operating Characteristics (continued)
(VDD= +3V, V
REF
= +2.5V, f
SCLK
= 4.8MHz, C
LOAD
= 30pF, TA= +25°C, unless otherwise noted.)
-1.00
-0.50
0.50
0.25
-0.25
-0.75
0
1.00
0.75
TEMPERATURE SENSOR ERROR
vs. TEMPERATURE
MAX1227/29/31 toc16
TEMPERATURE (°C)
TEMPERATURE SENSOR ERROR (°C)
-40 -15 35 85
6010
GRADE A
GRADE B
-5
-3
-4
-1
-2
0
1
0426810
SAMPLING ERROR
vs. SOURCE IMPEDANCE
MAX1227/29/31 toc17
SOURCE IMPEDANCE (kΩ)
SAMPLING ERROR (LSB)
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
2.510
2.506
2.502
2.498
2.494
INTERNAL REFERENCE VOLTAGE (V)
2.490
-40 10-15 35 60 85 TEMPERATURE (°C)
2.0
1.5
GAIN ERROR vs. SUPPLY VOLTAGE
MAX1227/29/31 toc11
-0.1
OFFSET ERROR (LSB)
-0.2
-0.3
OFFSET ERROR
vs. SUPPLY VOLTAGE
0.3
0.2
0.1
0
2.7 3.0 3.3 3.6 SUPPLY VOLTAGE (V)
MAX1227/29/31 toc12
GAIN ERROR vs. TEMPERATURE
2.0
MAX1227/29/31 toc14
1.5
OFFSET ERROR
vs. TEMPERATURE
0.4
0.3
0.2
0.1
0
OFFSET ERROR (LSB)
-0.1
-0.2
-0.3
-40 10-15 35 60 85 TEMPERATURE (°C)
MAX1227/29/31 toc15
MAX1227/29/31 toc13
1.0
GAIN ERROR (LSB)
0.5
0
2.7 3.6 SUPPLY VOLTAGE (V)
1.0
GAIN ERROR (LSB)
0.5
0
3.33.0
-40 -15 35 85 TEMPERATURE (°C)
6010
MAX1227/MAX1229/MAX1231
12-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
8 _______________________________________________________________________________________
Pin Description
MAX1231
QFN
2–12, 26,
27, 28,
——1–10 AIN0–9 Analog Inputs
———1–6AIN05 Analog Inputs
13 15 ——REF-/AIN14
——11 REF-/AIN10
——— 7 REF-/AIN6
14 16 ——
——12
——— 8
15 17 13 9 REF+ Positive Reference Input. Bypass to GND with a 0.1µF capacitor.
16 18 14 10 GND Ground
18 19 15 11 V
20 20 16 12 SCLK
MAX1231
QSOP
1–14 ——AIN0–13 Analog Inputs
MAX1229 MAX1227 NAME FUNCTION
Negative Input for External Differential Reference/Analog Input 14. See Table 3 for details on programming the setup register.
Negative Input for External Differential Reference/Analog Input 10. See Table 3 for details on programming the setup register.
Negative Input for External Differential Reference/Analog Input 6. See Table 3 for details on programming the setup register.
CNVST/
AIN15
CNVST/
AIN11
CNVST/
AIN7
DD
Active-Low Conversion Start Input/Analog Input 15. See Table 3 for details on programming the setup register.
Active-Low Conversion Start Input/Analog Input 11. See Table 3 for details on programming the setup register.
Active-Low Conversion Start Input/Analog Input 7. See Table 3 for details on programming the setup register.
Power Input. Bypass to GND with a 0.1µF capacitor.
Serial Clock Input. Clocks data in and out of the serial interface. (Duty cycle must be 40% to 60%.) See Table 3 for details on programming the clock mode.
21 21 17 13 CS
22 22 18 14 DIN
23 23 19 15 DOUT
24 24 20 16 EOC End of Conversion Output. Data is valid after EOC pulls low.
1, 17, 19,
25
———N.C. No Connection. Not internally connected.
Active-Low Chip Select Input. When CS is low, the serial interface is enabled. When CS is high, DOUT is high impedance.
Serial Data Input. DIN data is latched into the serial interface on the rising edge of SCLK.
Serial Data Output. Data is clocked out on the falling edge of SCLK. High impedance when CS is connected to V
DD
.
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