MAX1211
65Msps, 12-Bit, IF Sampling ADC
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDDto GND...........................................................-0.3V to +3.6V
OV
DD
to GND........-0.3V to the lower of (VDD+ 0.3V) and +3.6V
INP, INN to GND...-0.3V to the lower of (V
DD
+ 0.3V) and +3.6V
REFIN, REFOUT, REFP, REFN,
COM to GND.....-0.3V to the lower of (V
DD
+ 0.3V) and +3.6V
CLKP, CLKN, CLKTYP, G/
T, DCE,
PD to GND ........-0.3V to the lower of (V
DD
+ 0.3V) and +3.6V
D11–D0, I.C., DAV, DOR to GND............-0.3V to (OV
DD
+ 0.3V)
Continuous Power Dissipation (TA= +70°C)
40-Pin Thin QFN 6mm x 6mm x 0.8mm
(derated 26.3mW/°C above +70°C)........................2105.3mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering 10s)..................................+300°C
ELECTRICAL CHARACTERISTICS
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), C
REFOUT
= 0.1µF, CL≈ 5pF at digital outputs, VIN= -
0.5dBFS, CLKTYP = high, DCE = high, PD = low, G/T = low, f
CLK
= 65MHz (50% duty cycle), C
REFP
= C
REFN
= 0.1µF, 1µF in parallel with
10µF between REFP and REFN, C
COM
= 0.1µF in parallel with 2.2µF to GND, TA= -40°C to +85°C, unless otherwise noted. Typical values
are at T
A
= +25°C.) (Note 1)