Rainbow Electronics LM99 User Manual

LM99
±
1˚C Accurate, High Temperature, Remote Diode
Temperature Sensor with Two-Wire Interface

General Description

The LM99 is an 11-bit remote diode temperature sensor with a 2-wire System Management Bus (SMBus) serial interface. The LM99 accurately measures: (1) its own temperature and (2) the temperature of a remote diode-connected transistor such as the 2N3904 or a thermal diode commonly found on Graphics Processor Units (GPU), Computer Processor Units (CPU or other ASICs. The LM99 remote diode temperature sensor shifts the temperature from the remote sensor down 16˚C and operates on that shifted temperature:
T
ACTUAL DIODE JUNCTION
The local temperature reading requires no offset. The LM99 has an Offset Register which provides a means
for precise matching to various thermal diodes. Contact hardware.monitor
The LM99 and LM99-1 have the same functions but different SMBus slave addresses. This allows for one of each to be on the same bus at the same time.
Activation of the ALERT output occurs when any tempera­ture goes outside a preprogrammed window set by the HIGH and LOW temperature limit registers or exceeds the T_CRIT temperature limit. Activation of the T_CRIT_A occurs when any temperature exceeds the T_CRIT programmed limit.
@
nsc.com for the latest details.
=T
LM99
+ 16˚C

Features

n Accurately senses the temperature of remote diodes n Offset register allows use of a variety of thermal diodes
n On-board local temperature sensing n 10 bit plus sign remote diode temperature data format,
0.125 ˚C resolution
n T_CRIT_A output useful for system shutdown n ALERT output supports SMBus 2.0 protocol n SMBus 2.0 compatible interface, supports TIMEOUT n 8-pin MSOP package

Key Specifications

j
Supply Voltage 3.0 V to 3.6 V
j
Supply Current 0.8 mA (typ)
j
Local Temp Accuracy (includes quantization error)
T
= 25˚C to 125˚C
A
j
Remote Diode Temp Accuracy (includes quantization
error)
= 30˚C to 50˚C, TD= 120˚C to 140˚C
T
A
T
= 0˚C to 85˚C, TD= 25˚C to 140˚C
A

Applications

n Graphics Processor Thermal Management n Computer Processor Thermal Management n Electronic Test Equipment n Office Electronics
July 2003
±
3.0˚C (max)
±
1.0˚C (max)
±
3.0˚C (max)
Interface
LM99
±
1˚C Accurate, High Temperature, Remote Diode Temperature Sensor with Two-Wire

Simplified Block Diagram

20053801
NVIDIA®is a registered trademark of NVIDIA Corporation.
GeForce
is a trademark of NVIDIA Corporation.
®
Intel
and Pentium®are registered trademarks of Intel Corporation.
© 2003 National Semiconductor Corporation DS200538 www.national.com

Connection Diagram

LM99
MSOP-8
TOP VIEW
20053802

Ordering Information

Part Number
LM99CIMM T17C
LM99-1CIMM T20C
LM99CIMMX T17C
LM99-1CIMMX T20C
Package
Marking
NS Package
Number
MUA08A
(MSOP-8)
MUA08A
(MSOP-8)
MUA08A
(MSOP-8)
MUA08A
(MSOP-8)

Pin Descriptions

Label Pin
V
DD
D+ 2 Diode Current Source
D− 3 Diode Return Current Sink
T_CRIT_A
GND 5 Power Supply Ground Ground
ALERT
SMBData 7
SMBCLK 8 SMBus Input From Controller, Pull-Up Resistor
#
1 Positive Supply Voltage Input
4
6
T_CRIT Alarm Output, Open-Drain, Active-Low
Interrupt Output, Open-Drain, Active-Low
SMBus Bi-Directional Data Line, Open-Drain Output
Function Typical Connection
DC Voltage from 3.0 V to 3.6 V. V with a 0.1 µF capacitor in parallel with 100 pF to ground. The 100 pF capacitor should be placed as close as possible to the power supply pin. A bulk capacitance of approximately 10 µF needs to be in the vicinity of the LM99
.
V
DD
To Diode Anode. Connected to the collector and base of the remote discrete diode-connected transistor. Connect a
2.2 nF capacitor between pins 2 and 3.
To Diode Cathode. Connects to the emitter of the remote diode-connected transistor. Connect a 2.2 nF capacitor between pins 2 and 3.
Pull-Up Resistor, Controller Interrupt or Power Supply Shutdown Control
Pull-Up Resistor, Controller Interrupt or Alert Line
From and to Controller, Pull-Up Resistor
Transport
Media
1000 Units on Tape and Reel
1000 Units on Tape and Reel
3500 Units on Tape and Reel
3500 Units on Tape and Reel
should be bypassed
DD
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Typical Application

LM99
20053803
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Absolute Maximum Ratings (Note 1)

LM99
Supply Voltage −0.3 V to 6.0 V
Voltage at SMBData, SMBCLK, ALERT, T_CRIT_A
Voltage at Other Pins −0.3 V to
D− Input Current
Input Current at All Other Pins (Note 2)
Package Input Current (Note 2)
SMBData, ALERT, T_CRIT_A Output Sink Current 10 mA
Storage Temperature −65˚C to
−0.5 V to 6.0 V
+ 0.3 V)
(V
DD
±
1mA
±
5mA
30 mA
+150˚C
MSOP-8 Packages (Note 3)
Vapor Phase (60 seconds) 215˚C
Infrared (15 seconds) 220˚C
ESD Susceptibility (Note 4)
Human Body Model 2000 V
Machine Model 200 V

Operating Ratings

(Notes 1, 5)
Operating Temperature Range 0˚C to +125˚C
Electrical Characteristics Temperature Range T
LM99 0˚C TA≤ +85˚C
Supply Voltage Range (V
) +3.0 V to +3.6 V
DD
MIN
Soldering Information, Lead Temperature

Temperature-to-Digital Converter Characteristics

Unless otherwise noted, these specifications apply for VDD= +3.0 Vdc to +3.6 Vdc. Boldface limits apply for TA=TJ=T TA≤ T
Temperature Error Using Local Diode T
Temperature Error Using Remote Diode Connected Transistor (TDis the Remote Diode Junction Temperature)
T
D=TLM99
Remote Diode Measurement Resolution 11 Bits
Local Diode Measurement Resolution 8 Bits
Conversion Time of All Temperatures at the Fastest Setting
Quiescent Current (Note 9) SMBus Inactive, 16 Hz
D− Source Voltage 0.7 V
Diode Source Current (V
ALERT and T_CRIT_A Output Saturation Voltage
Power-On-Reset (POR) Threshold Measure on VDDinput, falling
Local and Remote HIGH Default Temperature settings
Local and Remote LOW Default Temperature settings
Local T_CRIT Default Temperature Setting (Note 11) +85 ˚C
Remote T_CRIT Default Temperature Setting (Note 11) Add 16˚C for 126˚C
; all other limits TA=TJ= +25˚C, unless otherwise noted.
MAX
Parameter Conditions Typical Limits Units
(Note 6) (Note 7) (Limit)
+ 16˚C
= +25˚C to +125˚C, (Note 8)
A
= +30˚C to +50˚C and TD=
T
A
+120˚C to +140˚C
T
= +0˚C to +85˚C and TD=
A
+25˚C to +140˚C
±
1
±
3 ˚C (max)
±
1 ˚C (max)
±
3
0.125 ˚C
C
(Note 10) 31.25 34.4 ms (max)
0.8 1.7 mA (max)
conversion rate
Shutdown 315 µA
D+−VD−
level
) = + 0.65 V; high
160 315 µA (max)
110 µA (min)
Low level 13 20 µA (max)
7 µA (min)
I
= 6.0 mA 0.4
OUT
2.4
edge
(Note 11) Add 16˚C for true
+70 ˚C
1.8
Remote Temperature.
(Note 11) Add 16˚C for true
C
Remote Temperature.
+110 ˚C
true Remote T_CRIT Setting
TA≤ T
˚C (max)
V (max)
V (max)
V (min)
MAX
MIN
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Logic Electrical Characteristics

DIGITAL DC CHARACTERISTICS Unless otherwise noted, these specifications apply for VDD= +3.0 to 3.6 Vdc. Boldface
to T
limits apply for T
A=TJ=TMIN
; all other limits TA=TJ= +25˚C, unless otherwise noted.
MAX
Symbol Parameter Conditions Typical Limits Units
(Note 6) (Note 7) (Limit)
SMBData, SMBCLK INPUTS
V
V
IN(1)
IN(0)
V
IN(HYST)
Logical “1” Input Voltage 2.1 V (min)
Logical “0”Input Voltage 0.8 V (max)
SMBData and SMBCLK Digital
400 mV
Input Hysteresis
I
I
C
IN(1)
IN(0)
IN
Logical “1” Input Current VIN=V
DD
0.005
Logical “0” Input Current VIN= 0 V −0.005
Input Capacitance 5 pF
±
10 µA (max)
±
10 µA (max)
ALL DIGITAL OUTPUTS
I
OH
V
OL
High Level Output Current VOH=V
DD
SMBus Low Level Output Voltage IOL=4mA
=6mA
I
OL
10 µA (max)
0.4
V (max)
0.6

SMBus Digital Switching Characteristics

Unless otherwise noted, these specifications apply for VDD= +3.0 Vdc to +3.6 Vdc, CL(load capacitance) on output lines = 80
to T
pF. Boldface limits apply for T
A=TJ=TMIN
ing characteristics of the LM99 fully meet or exceed the published specifications of the SMBus version 2.0. The following pa­rameters are the timing relationships between SMBCLK and SMBData signals related to the LM99. They adhere to but are not necessarily the SMBus bus specifications.
Symbol Parameter Conditions Typical Limits Units
f
SMB
t
LOW
t
HIGH
t
R,SMB
t
F,SMB
t
OF
t
TIMEOUT
SMBus Clock Frequency 100
SMBus Clock Low Time from V
SMBus Clock High Time from V
SMBus Rise Time (Note 12) 1 µs (max)
SMBus Fall Time (Note 13) 0.3 µs (max)
Output Fall Time CL= 400 pF,
SMBData and SMBCLK Time Low for Reset of Serial Interface (Note 14)
t
SU;DAT
t
HD;DAT
t
HD;STA
Data In Setup Time to SMBCLK High 250 ns (min)
Data Out Stable after SMBCLK Low 300
Start Condition SMBData Low to SMBCLK Low (Start condition hold before the first clock falling edge)
t
SU;STO
Stop Condition SMBCLK High to SMBData Low (Stop Condition Setup)
t
SU;STA
SMBus Repeated Start-Condition Setup Time, SMBCLK High to SMBData Low
t
BUF
SMBus Free Time Between Stop and Start Conditions
; all other limits TA=TJ= +25˚C, unless otherwise noted. The switch-
MAX
(Note 6) (Note 7) (Limit)
kHz (max)
10
max to
IN(0)
max
V
IN(0)
IN(1)
min to V
min 4.0 µs (min)
IN(1)
4.7 25
kHz (min)
ms (max)
250 ns (max)
= 3 mA, (Note 13)
I
O
25 35
ms (max)
900
100 ns (min)
100 ns (min)
0.6 µs (min)
1.3 µs (min)
µs (min)
ms (min)
ns (min)
ns (max)
LM99
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SMBus Communication

LM99
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its rated operating conditions.
Note 2: When the input voltage (V
Parasitic components and or ESD protection circuitry are shown in the figure below for the LM99’s pins. The nominal breakdown voltage of D3 is 6.5 V. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D+, D−. Doing so by more than 50 mV may corrupt a temperature measurement.
) at any pin exceeds the power supplies (V
I
<
GND or V
I
>
VDD), the current at that pin should be limited to 5 mA.
I
20053840
Pin Name PIN
V
DD
#
D1 D2 D3 D4 D5 D6 D7 R1 SNP ESD CLAMP
1 x
D+ 2 xx xxx x
D− 3 xx xxx x
T_CRIT_A
ALERT
4xxx
6xxx
SMBData 7 x x x
SMBCLK 8 x
Note: An “x” indicates that the diode exists.
20053813

FIGURE 1. ESD Protection Input Structure

Note 3: See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices.
Note 4: Human body model, 100 pF discharged through a 1.5 kresistor. Machine model, 200 pF discharged directly into each pin.
Note 5: Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil:
– MSOP-8 = 210˚C/W
Note 6: Typicals are at T
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power
dissipation of the LM99 and the thermal resistance. See (Note 5) for the thermal resistance to be used in the self-heating calculation.
Note 9: Quiescent current will not increase substantially with an SMBus.
Note 10: This specification is provided only to indicate how often temperature data is updated. The LM99 can be read at any time without regard to conversion state
(and will yield last conversion result).
Note 11: Default values set at power up.
Note 12: The output rise time is measured from (V
Note 13: The output fall time is measured from (V
Note 14: Holding the SMBData and/or SMBCLK lines Low for a time interval greater than t
SMBData and SMBCLK pins to a high impedance state.
= 25˚C and represent most likely parametric norm.
A
max + 0.15 V) to (V
IN(0)
min - 0.15 V) to (V
IN(1)
min − 0.15 V).
IN(1)
min + 0.15 V).
IN(1)
will reset the LM99’s SMBus state machine, therefore setting
TIMEOUT
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1.0 Functional Description

The LM99 temperature sensor incorporates a delta V based temperature sensor using a Local or Remote diode and a 10-bit plus sign ∆Σ ADC (Delta-Sigma Analog-to­Digital Converter). The LM99 is compatible with the serial SMBus version 2.0 two-wire interface. Digital comparators compare the measured Local Temperature (LT) to the Local High (LHS), Local Low (LLS) and Local T_CRIT (LCS) user­programmable temperature limit registers. The measured Remote Temperature (RT) is digitally compared to the Re­mote High (RHS), Remote Low (RLS) and Remote T_CRIT (RCS) user-programmable temperature limit registers. Acti­vation of the ALERT output indicates that a comparison is greater than the limit preset in a T_CRIT or HIGH limit register or less than the limit preset in a LOW limit register. The T_CRIT_A output responds as a true comparator with built in hysteresis. The hysteresis is set by the value placed in the Hysteresis register (TH). Activation of T_CRIT_A oc­curs when the temperature is above the T_CRIT setpoint. T_CRIT_A remains activated until the temperature goes be­low the setpoint calculated by T_CRIT − TH. The hysteresis register impacts both the remote temperature and local tem­perature readings.
The LM99 may be placed in a low power consumption (Shutdown) mode by setting the RUN/STOP bit found in the Configuration register. In the Shutdown mode, the LM99’s SMBus interface remains while all circuitry not required is turned off.
The Local temperature reading and setpoint data registers are 8-bits wide. The format of the 11-bit remote temperature data is a 16-bit left justified word. Two 8-bit registers, high and low bytes, are provided for each setpoint as well as the temperature reading. Two offset registers (RTOLB and RTOHB) can be used to compensate for non–ideality error, discussed further in Section 4.1 DIODE NON-IDEALITY. The remote temperature reading reported is adjusted by subtracting from, or adding to, the actual temperature read­ing the value placed in the offset register.

1.1 CONVERSION SEQUENCE

The LM99 takes approximately 31.25 ms to convert the Local Temperature (LT), Remote Temperature (RT), and to update all of its registers. Only during the conversion pro­cess the busy bit (D7) in the Status register (02h) is high. These conversions are addressed in a round–robin se­quence. The conversion rate may be modified by the Con­version Rate Register (04h). When the conversion rate is modified a delay is inserted between conversions; however, the actual conversion time remains at 31.25 ms. Different conversion rates will cause the LM99 to draw different amounts of supply current as shown in Figure 2.
BE
LM99
20053839
FIGURE 2. Conversion Rate Effect on Power Supply
Current

1.2 THE ALERT OUTPUT

The LM99’s ALERT pin is an active-low open-drain output that is triggered by a temperature conversion that is outside the limits defined by the temperature setpoint registers. Re­set of the ALERT output is dependent upon the selected method of use. The LM99’s ALERT pin is versatile and will accommodate three different methods of use to best serve the system designer: as a temperature comparator, as a temperature–based interrupt flag, and as part of an SMBus ALERT system. The three methods of use are further de­scribed below. The ALERT and interrupt methods are differ­ent only in how the user interacts with the LM99.
Each temperature reading (LT and RT) is associated with a T_CRIT setpoint register (LCS, RCS), a HIGH setpoint reg­ister (LHS and RHS) and a LOW setpoint register (LLS and RLS). At the end of every temperature reading, a digital comparison determines whether that reading is above its HIGH or T_CRIT setpoint or below its LOW setpoint. If so, the corresponding bit in the STATUS REGISTER is set. If the ALERT mask bit is not high, any bit set in the STATUS REGISTER, with the exception of Busy (D7) and OPEN (D2), will cause the ALERT output to be pulled low. Any temperature conversion that is out of the limits defined by the temperature setpoint registers will trigger an ALERT. Addi­tionally, the ALERT mask bit in the Configuration register must be cleared to trigger an ALERT in all modes.

1.2.1 ALERT Output as a Temperature Comparator

When the LM99 is implemented in a system in which it is not serviced by an interrupt routine, the ALERT output could be used as a temperature comparator. Under this method of use, once the condition that triggered the ALERT to go low is no longer present, the ALERT is de-asserted (Figure 3). For example, if the ALERT output was activated by the compari­son of LT>LHS, when this condition is no longer true the ALERT will return HIGH. This mode allows operation without software intervention, once all registers are configured dur­ing set-up. In order for the ALERT to be used as a tempera­ture comparator, bit D0 (the ALERT configure bit) in the FILTER and ALERT CONFIGURE REGISTER (xBF) must be set high. This is not the power on default default state.
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1.0 Functional Description (Continued)
LM99
20053828
20053831
FIGURE 3. ALERT Comparator Temperature Response
Diagram

1.2.2 ALERT Output as an Interrupt

The following sequence describes the response of a system that uses the ALERT output pin as a interrupt flag:
1. Master Senses ALERT low
2. Master reads the LM99 STATUS REGISTER to deter­mine what caused the ALERT
3. LM99 clears STATUS REGISTER, resets the ALERT HIGH and sets the ALERT mask bit (D7 in the Configu­ration register).
4. Master attends to conditions that caused the ALERT to be triggered. The fan is started, setpoint limits are ad­justed, etc.
5. Master resets the ALERT mask (D7 in the Configuration register).
FIGURE 4. ALERT Output as an Interrupt Temperature
Response Diagram

1.2.3 ALERT Output as an SMBus ALERT

When the ALERT output is connected to one or more ALERT outputs of other SMBus compatible devices and to a master, an SMBus alert line is created. Under this implementation, the LM99’s ALERT should be operated using the ARA (Alert Response Address) protocol. The SMBus 2.0 ARA protocol, defined in the SMBus specification 2.0, is a procedure de­signed to assist the master in resolving which part generated an interrupt and service that interrupt while impeding system operation as little as possible.
The SMBus 1.1 and 2.0 specification state that in response to an ARA (Alert Response Address) “after acknowledging the slave address the device must disengage its SMBALERT pulldown”. Furthermore, “if the host still sees SMBALERT low when the message transfer is complete, it knows to read the ARA again”. This SMBus “disengaging of SMBALERT” requirement prevents locking up the SMBus alert line. Com­petitive parts may address this “disengaging of SMBALERT” requirement differently than the LM99 or not at all. SMBus systems that implement the ARA protocol as suggested for the LM99 will be fully compatible with all competitive parts.
The LM99 fulfills “disengaging of SMBALERT” by setting the ALERT mask bit (bit D7 in the Configuration register, at address 09h) after successfully sending out its address in response to an ARA and releasing the ALERT output pin. Once the ALERT mask bit is activated, the ALERT output pin will be disabled until enabled by software. In order to enable the ALERT the master must read the STATUS REGISTER, at address 02h, during the interrupt service routine and then reset the ALERT mask bit in the Configuration register to 0 at the end of the interrupt service routine.
The following sequence describes the ARA response proto­col.
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1.0 Functional Description (Continued)
1. Master Senses SMBus alert line low
2. Master sends a START followed by the Alert Response Address (ARA) with a Read Command.
3. Alerting Device(s) send ACK.
4. Alerting Device(s) send their Address. While transmitting their address, alerting devices sense whether their ad­dress has been transmitted correctly. (The LM99 will reset its ALERT output and set the ALERT mask bit once its complete address has been transmitted successfully.)
5. Master/slave NoACK
6. Master sends STOP
7. Master attends to conditions that caused the ALERT to be triggered. The STATUS REGISTER is read and fan started, setpoint limits adjusted, etc.
8. Master resets the ALERT mask (D7 in the Configuration register).
The ARA, 000 1100, is a general call address. No device should ever be assigned this address.
Bit D0 (the ALERT configure bit) in the FILTER and ALERT CONFIGURE REGISTER (xBF) must be set low in order for the LM99 to respond to the ARA command.
The ALERT output can be disabled by setting the ALERT mask bit, D7, of the Configuration register. The power on default is to have the ALERT mask bit and the ALERT configure bit low.
LM99
reset only after the Status Register is read and if a tempera­ture conversion(s) is/are below the T_CRIT setpoint, as shown in Figure 6.
20053806

FIGURE 6. T_CRIT_A Temperature Response Diagram

1.4 POWER ON RESET DEFAULT STATES

LM99 always powers up to these known default states. The LM99 remains in these states until after the first conversion.
1. Command Register set to 00h
2. Local Temperature set to 0˚C
3. Remote Diode Temperature set to 0˚C until the end of the first conversion.
4. Status Register set to 00h.
5. Configuration register set to 00h; ALERT enabled, Re­mote T_CRIT alarm enabled and Local T_CRIT alarm enabled
6. 85˚C Local T_CRIT temperature setpoint
8. 70˚C Local and Remote HIGH temperature setpoints
9. 0˚C Local and Remote LOW temperature setpoints
10. Filter and Alert Configure Register set to 00h; filter dis-
abled, ALERT output set as an SMBus ALERT
11. Conversion Rate Register set to 8h; conversion rate set to 16 conv./sec.
20053829
FIGURE 5. ALERT Output as an SMBus ALERT
Temperature Response Diagram

1.3 T_CRIT_A OUTPUT and T_CRIT LIMIT

T_CRIT_A is activated when any temperature reading is greater than the limit preset in the critical temperature set­point register (T_CRIT), as shown in Figure 6. The Status Register can be read to determine which event caused the alarm. A bit in the Status Register is set high to indicate which temperature reading exceeded the T_CRIT setpoint temperature and caused the alarm, see Section 2.3.
Local and remote temperature diodes are sampled in se­quence by the A/D converter. The T_CRIT_A output and the Status Register flags are updated after every Local and Remote temperature conversion. T_CRIT_A follows the state of the comparison, it is reset when the temperature falls below the setpoint RCS-TH. The Status Register flags are

1.5 SMBus INTERFACE

The LM99 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBData line is bi­directional. The LM99 never drives the SMBCLK line and it does not support clock stretching. According to SMBus specifications, the LM99 has a 7-bit slave address. All bits A6 through A0 are internally programmed and can not be changed by software or hardware. The LM99 and LM99-1 have the following slave addresses:
Version A6 A5 A4 A3 A2 A1 A0
LM99 1001100
LM99-1 1001101

1.6 TEMPERATURE DATA FORMAT

Temperature data can only be read from the Local and Remote Temperature registers; the setpoint registers (T_CRIT, LOW, HIGH) are read/write.
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1.0 Functional Description (Continued)
LM99
Remote temperature data is represented by an 11-bit, two’s complement word with an LSB (Least Significant Bit) equal

Actual vs. LM99 Remote Temperature Conversion

Actual Remote Diode
Temperature,˚C
120 +104 0110 1000 0000 0000 6800h
125 +109 0110 1101 0000 0000 6D00h
126 +110 0110 1110 0000 0000 7100h
130 +114 0111 0010 0010 0000 7200h
135 +119 0111 0111 0000 0000 7700h
140 +124 0111 1100 0000 0000 7200h
Output is 11-bit two’s complement word. LSB = 0.125 ˚C.
Actual Remote Diode
T_Crit Setpoint,˚C
126 +110 0110 1110 71h
LM99 Remote Diode
Temperature Register, ˚C

Actual vs. Remote T_Crit Setpoint

Factory-Programmed
Remote T_CRIT High
Setpoint, ˚C
to 0.125˚C. The data format is a left justified 16-bit word available in two 8-bit registers:
Binary Results in LM99
Remote Temperature Register
Binary Remote T_CRIT High
Setpoint Value
Hex Remote Temperature
Register
Hex Remote T_CRIT
High Setpoint Value
Local Temperature data is represented by an 8-bit, two’s complement byte with an LSB (Least Significant Bit) equal to 1˚C:
Local
Temperature
+125˚C 0111 1101 7Dh
+25˚C 0001 1001 19h
+1˚C 0000 0001 01h
0˚C 0000 0000 00h
−1˚C 1111 1111 F F h
−25˚C 1110 0111 E7h
−55˚C 1100 1001 C9h

1.7 OPEN-DRAIN OUTPUTS

The SMBData, ALERT and T_CRIT_A outputs are open­drain outputs and do not have internal pull-ups. A “high” level will not be observed on these pins until pull-up current is provided by some external source, typically a pull-up resis­tor. Choice of resistor value depends on many system fac­tors but, in general, the pull-up resistor should be as large as possible. This will minimize any internal temperature reading errors due to internal heating of the LM99. The maximum resistance of the pull-up to provide a 2.1V high level, based on LM99 specification for High Level Output Current with the supply voltage at 3.0V, is 82 k(5%) or 88.7 k(1%).
Digital Output
Binary Hex

1.8 DIODE FAULT DETECTION

The LM99 is equipped with operational circuitry designed to detect fault conditions concerning the remote diode. In the event that the D+ pin is detected as shorted to V floating, the Remote Temperature High Byte (RTHB) register is loaded with +127˚C, the Remote Temperature Low Byte (RTLB) register is loaded with 0, and the OPEN bit (D2) in the status register is set. As a result, if the Remote T_CRIT setpoint register (RCS) is set to a value less than +127˚C the ALERT and T_Crit output pins will be pulled low, if the Alert Mask and T_Crit Mask are disabled. If the Remote HIGH Setpoint High Byte Register (RHSHB) is set to a value less than +127˚C then ALERT will be pulled low, if the Alert Mask is disabled. The OPEN bit itself will not trigger and ALERT.
In the event that the D+ pin is shorted to ground or D−, the Remote Temperature High Byte (RTHB) register is loaded with −128˚C (1000 0000) and the OPEN bit (D2) in the status register will not be set. Since operating the LM99 at −128˚C is beyond it’s operational limits, this temperature reading represents this shorted fault condition. If the value in the Remote Low Setpoint High Byte Register (RLSHB) is more than −128˚C and the Alert Mask is disabled, ALERT will be pulled low.
Remote diode temperature sensors that have been previ­ously released and are competitive with the LM99 output a code of 0˚C if the external diode is short-circuited. This change is an improvement that allows a reading of 0˚C to be truly interpreted as a genuine 0˚C reading and not a fault condition.
DD
or
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1.0 Functional Description (Continued)

1.9 COMMUNICATING WITH THE LM99

The data registers in the LM99 are selected by the Com­mand Register. At power-up the Command Register is set to “00”, the location for the Read Local Temperature Register. The Command Register latches the last location it was set to. Each data register in the LM99 falls into one of four types of user accessibility:
1. Read only
2. Write only
3. Read/Write same address
4. Read/Write different address A Write to the LM99 will always include the address byte and
the command byte. A write to any register requires one data byte.
Reading the LM99 can take place either of two ways:
1. If the location latched in the Command Register is cor­rect (most of the time it is expected that the Command
LM99
Register will point to one of the Read Temperature Reg­isters because that will be the data most frequently read from the LM99), then the read can simply consist of an address byte, followed by retrieving the data byte.
2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another address byte will accomplish a read.
The data byte has the most significant bit first. At the end of a read, the LM99 can accept either Acknowledge or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master has read its last byte). It takes the LM99 31.25 ms to measure the temperature of the remote diode and internal diode. When retrieving all 10 bits from a previous remote diode tempera­ture measurement, the master must insure that all 10 bits are from the same temperature conversion. This may be achieved by using one-shot mode or by setting the conver­sion rate and monitoring the busy bit such that no conversion occurs in between reading the MSB and LSB of the last temperature conversion.
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1.0 Functional Description (Continued)
LM99

1.9.1 SMBus Timing Diagrams LM99 Timing Diagram

(a) Serial Bus Write to the internal Command Register followed by a the Data Byte
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(b) Serial Bus Write to the Internal Command Register
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(c) Serial Bus Read from a Register with the Internal Command Register preset to desired value.
20053812
FIGURE 7. SMBus Timing Diagrams

1.10 SERIAL INTERFACE RESET

In the event that the SMBus Master is RESET while the LM99 is transmitting on the SMBData line, the LM99 must be returned to a known state in the communication protocol. This may be done in one of two ways:
1. When SMBData is LOW, the LM99 SMBus state ma­chine resets to the SMBus idle state if either SMBData or SMBCLK are held low for more than 35 ms (t
). Note that according to SMBus specification 2.0 all
EOUT
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TIM
-
devices are to timeout when either the SMBCLK or SMBData lines are held low for 25-35 ms. Therefore, to insure a timeout of all devices on the bus the SMBCLK or SMBData lines must be held low for at least 35 ms.
2. When SMBData is HIGH, have the master initiate an SMBus start. The LM99 will respond properly to an SMBus start condition at any point during the communi­cation. After the start the LM99 will expect an SMBus Address address byte.
1.0 Functional Description (Continued)

1.11 DIGITAL FILTER

D2 D1 Filter
0 0 No Filter
0 1 Level 1
1 0 Level 1
1 1 Level 2
LM99
filter. The filter is accessed in the FILTER and ALERT CON­FIGURE REGISTER at BFh. The filter can be set according to the table shown.
Level 2 sets maximum filtering. Figure 8 depict the filter output to in response to a step input
and an impulse input. Figure 9 depicts the digital filter in use in a Pentium 4 processor system. Note that the two curves, with filter and without, have been purposely offset so that both responses can be clearly seen. Inserting the filter does not induce an offset as shown.
a) Step Response
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b) Impulse Response
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FIGURE 8. Filter Output Response to a Step Input

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FIGURE 9. Digital Filter Response in a Pentium 4 processor System. The filter on and off curves were purposely
offset to better show noise performance.
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1.0 Functional Description (Continued)
LM99

1.12 FAULT QUEUE

In order to suppress erroneous ALERT or T_CRIT triggering the LM99 incorporates a Fault Queue. The Fault Queue acts to insure a remote temperature measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint by not triggering until three consecutive out of limit measurements have been made, see Figure 10. The fault queue defaults off upon power-on and may be activated by setting bit D0 in the Configuration register (09h) to “1”.

1.13 ONE-SHOT REGISTER

The One-Shot register is used to initiate a single conversion and comparison cycle when the device is in standby mode, after which the device returns to standby. This is not a data register and it is the write operation that causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will always be read from this register.
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FIGURE 10. Fault Queue Temperature Response Diagram

2.0 LM99 Registers

2.1 COMMAND REGISTER

Selects which registers will be read from or written to. Data for this register should be transmitted during the Command Byte of the SMBus write communication.
P7 P6 P5 P4 P3 P2 P1 P0
Command Select
P0-P7: Command Select
Command Select Address Power On Default State Register
Read Address
<
P7:P0>hex
00h NA 0000 0000 0 LT Local Temperature
01h NA 0000 0000 0 RTHB Remote Temperature High Byte
02h NA 0000 0000 0 SR Status Register
03h 09h 0000 0000 0 C Configuration
04h 0Ah 0000 1000 8 (16
05h 0Bh 0100 0110 70 LHS Local HIGH Setpoint
06h 0Ch 0000 0000 0 LLS Local LOW Setpoint
07h 0Dh 0100 0110 70 RHSHB Remote HIGH Setpoint High
08h 0Eh 0000 0000 0 RLSHB Remote LOW Setpoint High
NA 0Fh One Shot Writing to this register will
Write Address
<
P7:P0>hex
<
D7:D0>binary
<
D7:D0
decimal
conv./sec)
Name
>
CR Conversion Rate
Register Function
Byte
Byte
initiate a one shot conversion
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2.0 LM99 Registers (Continued)
LM99
Command Select Address Power On Default State Register
Read Address
<
P7:P0>hex
10h NA 0000 0000 0 RTLB Remote Temperature Low Byte
11h 11h 0000 0000 0 RTOHB Remote Temperature Offset
12h 12h 0000 0000 0 RTOLB Remote Temperature Offset
13h 13h 0000 0000 0 RHSLB Remote HIGH Setpoint Low
14h 14h 0000 0000 0 RLSLB Remote LOW Setpoint Low
19h 19h 0110 1110 110 RCS Remote T_CRIT Setpoint
20h 20h 0101 0101 85 LCS Local T_CRIT Setpoint
21h 21h 0000 1010 10 TH T_CRIT Hysteresis
B0h-BEh B0h-BEh Manufacturers Test Registers
BFh BFh 0000 0000 0 RDTF Remote Diode Temperature
FEh NA 0000 0001 1 RMID Read Manufacturer’s ID
FFh NA LM99 0011 0001

2.2 LOCAL and REMOTE TEMPERATURE REGISTERS (LT, RTHB, RTLB)

Write Address
<
P7:P0>hex
(Read Only Address 00h, 01h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1
<
D7:D0>binary
LM99-1 0011 0100
<
D7:D0
decimal
49 52
Name
>
RDR Read Stepping or Die Revision
Register Function
High Byte
Low Byte
Byte
Byte
Filter
Code
For LT and RTHB D7–D0: Temperature Data. LSB = 1˚C. Two’s complement format.
(Read Only Address 10h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 00000
For RTLB D7–D5: Temperature Data. LSB = 0.125˚C. Two’s complement format. The maximum value available from the Local Temperature register is 127; the minimum value available from the Local
Temperature register is -128. The maximum value available from the Remote Temperature register is 127.875; the minimum value available from the Remote Temperature registers is −128.875.
Note that the remote diode junction temperature is actually 16˚C higher than the Remote Temperature Register value.

2.3 STATUS REGISTER (SR)

(Read Only Address 02h):
D7 D6 D5 D4 D3 D2 D1 D0
Busy LHIGH LLOW RHIGH RLOW OPEN RCRIT LCRIT
Power up default is with all bits “0” (zero). D0: LCRIT: When set to “1” indicates a Local Critical Temperature alarm. D1: RCRIT: When set to “1” indicates a Remote Diode Critical Temperature alarm. D2: OPEN: When set to “1” indicates a Remote Diode disconnect. D3: RLOW: When set to “1” indicates a Remote Diode LOW Temperature alarm D4: RHIGH: When set to “1” indicates a Remote Diode HIGH Temperature alarm. D5: LLOW: When set to “1” indicates a Local LOW Temperature alarm. D6: LHIGH: When set to “1” indicates a Local HIGH Temperature alarm. D7: Busy: When set to “1” ADC is busy converting.
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2.0 LM99 Registers (Continued)
LM99

2.4 CONFIGURATION REGISTER

(Read Address 03h / Write Address 09h):
D7 D6 D5 D4 D3 D2 D1 D0
ALERT mask
Power up default is with all bits “0” (zero) D7: ALERT mask: When set to “1” ALERT interrupts are masked. D6: RUN/STOP: When set to “1” SHUTDOWN is enabled. D5: is not defined and defaults to “0”. D4: Remote T_CRIT_A mask: When set to “1” a diode temperature reading that exceeds T_CRIT_A setpoint will not activate the
T_CRIT_A pin. D3: is not defined and defaults to “0”. D2: Local T_CRIT_A mask: When set to “1” a Local temperature reading that exceeds T_CRIT_A setpoint will not activate the
T_CRIT_A pin. D1: is not defined and defaults to “0”. D0: Fault Queue: when set to “1” three consecutive remote temperature measurements outside the HIGH, LOW, or T_CRIT
setpoints will trigger an “Outside Limit” condition resulting in setting of status bits and associated output pins..

2.5 CONVERSION RATE REGISTER

(Read Address 04h / Write Address 0Ah)
Value Conversion Rate
RUN/STOP 0
00 62.5 mHz
01 125 mHz
02 250 mHz
03 500 mHz
04 1 Hz
05 2 Hz
Remote T_CRIT_A
mask
0
Local T_CRIT_A
mask
(Read Address 04h / Write Address 0Ah)
Value Conversion Rate
06 4 Hz
07 8 Hz
08 16 Hz
09 32 Hz
10-255 Undefined
0 Fault Queue

2.6 LOCAL and REMOTE HIGH SETPOINT REGISTERS (LHS, RHSHB, and RHSLB)

(Read Address 05h, 07h / Write Address 0Bh, 0Dh):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1
For LHS and RHSHB: HIGH setpoint temperature data. Power-on default is LHIGH = RHIGH = 70˚C. 1 LSB = 1˚C. Two’s complement format.
(Read / Write Address 13h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 00000
For RHSLB: Remote HIGH Setpoint Low Byte temperature data. Power– on default is 0˚C. 1 LSB = 0.125˚C. Two’s complement format.

2.7 LOCAL and REMOTE LOW SETPOINT REGISTERS (LLS, RLSHB, and RLSLB)

(Read Address 06h, 08h, / Write Address 0Ch, 0Eh):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1
For LLS and RLSHB: HIGH setpoint temperature data. Power-on default is LHIGH = RHIGH = 0˚C. 1 LSB = 1˚C. Two’s complement format.
(Read / Write Address 14h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 00000
For RLSLB: Remote HIGH Setpoint Low Byte temperature data. Power-on default is 0˚C. 1 LSB = 0.125˚C. Two’s complement format.
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2.0 LM99 Registers (Continued)

2.8 REMOTE TEMPERATURE OFFSET REGISTERS (RTOHB and RTOLB)

(Read / Write Address 11h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1
For RTOHB: Remote Temperature Offset High Byte. Power-on default is LHIGH = RHIGH = 0˚C. 1 LSB = 1˚C. Two’s complement format.
(Read / Write Address 12h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 00000
For RTOLB: Remote Temperature Offset High Byte. Power-on default is 0˚C. 1 LSB = 0.125˚C. Two’s complement format. The offset value written to these registers will automatically be added to or subtracted from the remote temperature measurement
that will be reported in the Remote Temperature registers.

2.9 LOCAL and REMOTE T_CRIT REGISTERS (RCS and LCS)

(Read / Write Address 20h, 19h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1
D7–D0: T_CRIT setpoint temperature data. Local power-on default is T_CRIT = 85˚C. Remote power-on default is T_CRIT = 110˚C (+126˚C actual remote diode temperature). 1 LSB = 1˚C, two’s complement format.
LM99

2.10 T_CRIT HYSTERESIS REGISTER (TH)

(Read and Write Address 21h):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 168421
D7–D0: T_CRIT Hysteresis temperature. Power-on default is TH = 10˚C. 1 LSB = 1˚C, maximum value = 31.

2.11 FILTER and ALERT CONFIGURE REGISTER

(Read and Write Address BFh):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 00000 Filter Level
D7-D3: is not defined defaults to "0". D2-D1: input filter setting as defined the table below:
D2 D1 Filter Level
0 0 No Filter
0 1 Level 1
1 0 Level 1
1 1 Level 2
Level 2 sets maximum filtering. D0: when set to "1" comparator mode is enabled.

2.12 MANUFACTURERS ID REGISTER

(Read Address FEh) Default value 01h.
ALERT
Configure

2.13 DIE REVISION CODE REGISTER

(Read Address FFh) The LM99 version has a default value 31h or 49 decimal. The LM99-1 version has a default value of 34h or 52 decimal. This register will increment by 1 every time there is a revision to the die by National Semiconductor.
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3.0 Application Hints

LM99
The LM99 can be applied easily in the same way as other integrated-circuit temperature sensors, and its remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit board, and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively be that of the printed circuit board lands and traces soldered to the LM99’s pins. This presumes that the ambient air temperature is almost the same as the surface temperature of the printed circuit board; if the air temperature is much higher or lower than the surface temperature, the actual temperature of the of the LM99 die will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much more strongly than will the air temperature.
To measure temperature external to the LM99’s die, use a remote diode. This diode can be located on the die of a target IC, allowing measurement of the IC’s temperature, independent of the LM99’s temperature. The LM99 has been
®
optimized to measure the NVIDIA
GeForce™FX family thermal diode. Remember that a discrete diode’s tempera­ture will be affected, and often dominated, by the tempera­ture of its leads.

3.1 DIODE NON-IDEALITY

3.1.1 Diode Non-Ideality Factor Effect on Accuracy

When a transistor is connected as a diode, the following relationship holds for variables V
, T and If:
BE
In the above equation, η and ISare dependant upon the process that was used in the fabrication of the particular diode. By forcing two currents with a very controlled ratio (N) and measuring the resulting voltage difference, it is possible to eliminate the I
term. Solving for the forward voltage
S
difference yields the relationship:
The voltage seen by the LM99 also includes the IFRSvoltage drop of the series resistance. The non-ideality factor, η,is the only other parameter not accounted for and depends on the diode that is used for measurement. Since V
is
BE
proportional to both η and T, the variations in η cannot be distinguished from variations in temperature. Since the non­ideality factor is not controlled by the temperature sensor, it will directly add to the inaccuracy of the sensor. As an example, assume a temperature sensor has an accuracy
±
specification of
1˚C at room temperature of 25 ˚C and the
process used to manufacture the diode has a non-ideality
±
variation of
0.1%. The resulting accuracy of the tempera-
ture sensor at room temperature will be:
=±1˚C+(±0.1% of 298 ˚K) =±1.4 ˚C
T
ACC
The additional inaccuracy in the temperature measurement caused by η, can be eliminated if each temperature sensor is calibrated with the remote diode that it will be paired with.

3.1.2 Compensating for Diode Non-Ideality

In order to compensate for the errors introduced by non­ideality, the temperature sensor is calibrated for a particular
where:
processor. National Semiconductor temperature sensors are always calibrated to the typical non-ideality of a given pro­cessor type. The LM99 is calibrated for the non-ideality of the NVIDIA GeForceFX family thermal diode. When a tem­perature sensor calibrated for a particular processor type is
q = 1.6x10
T = Absolute Temperature in Kelvin
k = 1.38x10
η is the non-ideality factor of the process the diode is
−19
Coulombs (the electron charge),
−23
joules/K (Boltzmann’s constant),
manufactured on, IS= Saturation Current and is process dependent,
If= Forward Current through the base-emitter junction
VBE= Base-Emitter Voltage drop
used with a different processor type or a given processor type has a non-ideality that strays from the typical, errors are introduced.
Temperature errors associated with non-ideality may be re­duced in a specific temperature range of concern through use of the offset registers (11h and 12h). See Offset Register table below.
Please send an email to hardware.monitor.team requesting further information on our recommended setting of the offset register for different processor types.
In the active region, the -1 term is negligible and may be eliminated, yielding the following equation
Offset Register Settings for Specific Devices
Processor Family Offset Register Settings
T, ˚C Register 11h Register 12h
NVIDIA GeForceFX Graphics Processor default default default
®
Intel
Pentium®4 Processor +2.625 0000 0010 1010 0000
Intel Pentium 3 Processor +2.375 0000 0010 0110 0000
@
nsc.com
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3.0 Application Hints (Continued)

3.2 PCB LAYOUT FOR MINIMIZING NOISE

20053817

FIGURE 11. Ideal Diode Trace Layout

In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced on traces running between the remote temperature diode sen­sor and the LM99 can cause temperature conversion errors. Keep in mind that the signal level the LM99 is trying to measure is in microvolts. The following guidelines should be followed:
2. Ideally, the LM99 should be placed within 10 cm of the Processor diode pins with the traces being as straight, short and identical as possible. Trace resistance of 1 can cause as much as 1˚C of error. This error can be compensated by using the Remote Temperature Offset Registers, since the value placed in these registers will automatically be subtracted from or added to the remote temperature reading.
3. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This GND
pin and the recommended 2.2 nF
DD
LM99
guard should not be between the D+ and D− lines. In the event that noise does couple to the diode lines it would be ideal if it is coupled common mode. That is equally to the D+ and D− lines.
4. Avoid routing diode traces in close proximity to power supply switching or filtering inductors.
5. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be kept at least 2 cm apart from the high speed digital traces.
6. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should cross at a 90 degree angle.
7. The ideal place to connect the LM99’s GND pin is as close as possible to the Processors GND associated with the sense diode.
8. Leakage current between D+ and GND should be kept to a minimum. One nano-ampere of leakage can cause as much as 1˚C of error in the diode temperature read­ing. Keeping the printed circuit board as clean as pos­sible will minimize leakage current.
Noise coupling into the digital lines greater than 400 mVp-p (typical hysteresis) and undershoot less than 500 mV below GND, may prevent successful SMBus communication with the LM99. SMBus no acknowledge is the most common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of communication is rather low (100 kHz max), care still needs to be taken to ensure proper termination within a system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter witha3dBcorner frequency of about 40 MHz is included on the LM99’s SMBCLK input. Additional resistance can be added in series with the SMBData and SMBCLK lines to further help filter noise and ringing. Minimize noise cou­pling by keeping digital traces out of switching power supply areas as well as ensuring that digital lines containing high speed data communications cross at right angles to the SMBData and SMBCLK lines.
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Physical Dimensions inches (millimeters) unless otherwise noted

Interface
8-Lead Molded Mini-Small-Outline Package (MSOP),
JEDEC Registration Number MO-187
Order Number LM99CIMM or LM99CIMMX
NS Package Number MUA08A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
1˚C Accurate, High Temperature, Remote Diode Temperature Sensor with Two-Wire
±
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
National Semiconductor
LM99
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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