Rainbow Electronics LM61 User Manual

LM61
2.7V, SOT-23 or TO-92 Temperature Sensor
LM61 2.7V, SOT-23 or TO-92 Temperature Sensor
February 2004

General Description

The LM61 is a precision integrated-circuit temperature sen­sor that can sense a −30˚C to +100˚C temperature range while operating from a single +2.7V supply. The LM61’s output voltage is linearly proportional to Celsius (Centigrade) temperature (+10 mV/˚C) and has a DC offset of +600 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the LM61 ranges from +300 mV to +1600 mV for a −30˚C to +100˚C temperature range. The LM61 is calibrated to pro­vide accuracies of over the full −25˚C to +85˚C temperature range.
The LM61’s linear output, +600 mV offset, and factory cali­bration simplify external circuitry required in a single supply environment where reading negative temperatures is re­quired. Because the LM61’s quiescent current is less than 125 µA, self-heating is limited to a very low 0.2˚C in still air. Shutdown capability for the LM61 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates.
±
2.0˚C at room temperature and±3˚C

Features

n Calibrated linear scale factor of +10 mV/˚C n Rated for full −30˚ to +100˚C range n Suitable for remote applications n UL Recognized Component

Applications

n Cellular Phones n Computers n Power Supply Modules n Battery Management n FAX Machines n Printers n HVAC n Disk Drives n Appliances

Key Specifications

j
Accuracy at 25˚C
j
Accuracy for −30˚C to +100˚C
j
Accuracy for −25˚C to +85˚C
j
Temperature Slope +10 mV/˚C
j
Power Supply Voltage Range +2.7V to +10V
j
Current Drain@25˚C 125 µA (max)
j
Nonlinearity
j
Output Impedance 800 (max)
±
2.0 or±3.0˚C
±
4.0˚C (max)
±
3.0˚C (max)
±
0.8˚C (max)
(max)

Typical Application

FIGURE 1. Full-Range Centigrade Temperature Sensor (−30˚C to +100˚C)
01289702
VO= (+10 mV/˚C x T ˚C) + 600 mV
Temperature (T) Typical V
+100˚C +1600 mV
+85˚C +1450 mV
+25˚C +850 mV
0˚C +600 mV
−25˚C +350 mV
−30˚C +300 mV
Operating from a Single Li-Ion Battery Cell
O
© 2004 National Semiconductor Corporation DS012897 www.national.com

Connection Diagrams

LM61
SOT-23
TO-92
Top View
See NS Package Number MA03B
01289701

Ordering Information

Order
Number
LM61BIM3 T1B 1000 Units on Tape and Reel
LM61BIM3X T1B 3000 Units on Tape and Reel
LM61CIM3 T1C 1000 Units on Tape and Reel
LM61CIM3X T1C 3000 Units on Tape and Reel
LM61BIZ LM61BIZ Bulk
LM61CIZ LM61CIZ Bulk
Device
Marking
Supplied In
See NS Package Number Z03A
Accuracy
Over
Specified
Temperature
Range (˚C)
±
3 −25˚C to +85˚C
±
4 −30˚C to +100˚C
±
3 −25˚C to +85˚C
±
4 −30˚C to +100˚C
Specified
Temperature
Range
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Package
Type
SOT-23
TO-92
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LM61

Absolute Maximum Ratings (Note 1)

Supply Voltage +12V to −0.2V
Output Voltage (+V
+ 0.6V) to
S
−0.6V
Soldering (10 seconds) +260˚C
SOT-23 Package (Note 4):
Vapor Phase (60 seconds) +215˚C
Infrared (15 seconds) +220˚C
Output Current 10 mA
Input Current at any pin (Note 2) 5 mA
Storage Temperature −65˚C to +150˚C
Maximum Junction Temperature
(T
) +125˚C
JMAX
ESD Susceptibility (Note 3) :
Human Body Model 2500V
Machine Model 250V
Lead Temperature:

Operating Ratings(Note 1)

Specified Temperature Range: T
LM61C −30˚C TA≤ +100˚C
LM61B −25˚C T
Supply Voltage Range (+V
Thermal Resistance, θ
) +2.7V to +10V
S
(Note 5)
JA
SOT-23 TO-92
MIN
TA≤ T
+85˚C
A
450˚C/W 180˚C/W
MAX
TO-92 Package:

Electrical Characteristics

Unless otherwise noted, these specifications apply for +VS= +3.0 VDC. Boldface limits apply for TA=TJ=T other limits T
Parameter Conditions Typical
A=TJ
= 25˚C.
(Note 6)
LM61B LM61C Units
Limits Limits
(Note 7) (Note 7)
Accuracy (Note 8)
±
2.0
±
3.0
±
3.0 ˚C (max)
±
4.0 ˚C (max)
Output Voltage at 0˚C +600 mV
Nonlinearity (Note 9)
±
0.6
±
0.8 ˚C (max)
Sensor Gain +10 +9.7 +9.6 mV/˚C (min)
(Average Slope) +10.3 +10.4 mV/˚C (max)
Output Impedance +3.0V +V
−30˚C T +85˚C T
Line Regulation (Note 10) +3.0V +V
+2.7V +V
Quiescent Current +2.7V +V
+10V
S
+85˚C, +VS= +2.7V
A
+100˚C, +VS= +2.7V
A
+10V
S
+3.3V
S
+10V 82 125 125 µA (max)
S
± ±
0.8
2.3 5
0.7
5.7
0.8
2.3 5
±
0.7 mV/V (max)
±
5.7 mV (max)
155 155 µA (max)
Change of Quiescent Current +2.7V +V
+10V
S
±
A
Temperature Coefficient of 0.2 µA/˚C
Quiescent Current
Long Term Stability (Note 11) T
for 1000 hours
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: When the input voltage (V
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 4: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any post 1986 National Semiconductor Linear Data Book for other methods of soldering surface mount devices.
Note 5: The junction to ambient thermal resistance (θ
Note 6: Typicals are at T
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Accuracy is defined as the error between the output voltage and +10 mV/˚C times the device’s case temperature plus 600 mV, at specified conditions of
voltage, current, and temperature (expressed in ˚C).
Note 9: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device’s rated temperature range.
) at any pin exceeds power supplies (V
I
= 25˚C and represent most likely parametric norm.
J=TA
J=TMAX
=+100˚C,
<
GND or V
I
) is specified without a heat sink in still air.
JA
±
0.2 ˚C
>
+VS), the current at that pin should be limited to 5 mA.
I
MIN
to T
MAX
(Limit)
k(max) k(max) k(max)
; all
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Electrical Characteristics (Continued)
LM61
Note 10: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be
computed by multiplying the internal dissipation by the thermal resistance.
Note 11: For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.

Typical Performance Characteristics The LM61 in the SOT-23 package mounted to a printed cir-

cuit board as shown in Figure 2 was used to generate the following thermal curves.
Thermal Resistance
Junction to Air
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Thermal Time Constant Thermal Response in
Still Air with Heat Sink
Thermal Response
in Stirred Oil Bath
Thermal Response in Still
Air without a Heat Sink
Quiescent Current
vs. Temperature
with Heat Sink
01289706
01289708
Accuracy vs Temperature Noise Voltage Supply Voltage
vs Supply Current
01289709
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Typical Performance Characteristics The LM61 in the SOT-23 package mounted to a printed circuit
board as shown in Figure 2 was used to generate the following thermal curves. (Continued)
Start-Up Response
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LM61
FIGURE 2. Printed Circuit Board Used
for Heat Sink to Generate All Curves.
1
⁄2" Square Printed Circuit Board
with 2 oz. Copper Foil or Similar.

1.0 Mounting

The LM61 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM61 is sensing will be within about +0.2˚C of the surface tempera­ture that LM61’s leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM61 die is directly attached to the GND pin. The lands and traces to the LM61 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured.
Alternatively, the LM61 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM61 and
01289714
accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where conden­sation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM61 or its connec­tions.
The thermal resistance junction to ambient (θ
) is the pa-
JA
rameter used to calculate the rise of a device junction tem­perature due to its power dissipation. For the LM61 the equation used to calculate the rise in the die temperature is as follows:
T
where I
+ θJA[(+VSIQ) + (+VS−VO)IL]
J=TA
is the quiescent current and ILis the load current on
Q
the output. Since the LM61’s junction temperature is the actual temperature being measured care should be taken to minimize the load current that the LM61 is required to drive.
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1.0 Mounting (Continued)
LM61
SOT-23* SOT-23** TO-92* TO-92***
no heat sink small heat fin no heat sink small heat fin
θ
JA
TJ−T
θ
A
JA
TJ−T
θ
A
JA
(˚C/W) (˚C) (˚C/W) (˚C) (˚C/W) (˚C) (˚C/W) (˚C)
Still air 450 0.26 260 0.13 180 0.09 140 0.07
Moving air 180 0.09 90 0.05 70 0.03
*Part soldered to 30 gauge wire. **Heat sink used is
1
⁄2" square printed circuit board with 2 oz. foil with part attached as shown in Figure 2.
***Part glued and leads soldered to 1" square of 1/16" printed circuit board with 2oz. foil or similar.
FIGURE 3. Temperature Rise of LM61 Due to
Self-Heating and Thermal Resistance (θ
JA

2.0 Capacitive Loads

The LM61 handles capacitive loading well. Without any spe­cial precautions, the LM61 can drive any capacitive load as shown in Figure 4. Over the specified temperature range the LM61 has a maximum output impedance of 5 k.Inan extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 µF be added from +V supply voltage, as shown in Figure 5. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 µF output capacitor with the 5 kmaximum output impedance will form a 32 Hz lowpass filter. Since the thermal time constant of the LM61 is much slower than the 5 ms time constant formed by the RC, the overall response time of the LM61 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM61.
to GND to bypass the power
S

FIGURE 5. LM61 with Filter for Noisy Environment

TJ−T
)
θ
A
JA
TJ−T
A
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01289715
FIGURE 4. LM61 No Decoupling Required for
Capacitive Load
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2.0 Capacitive Loads (Continued)

FIGURE 6. Simplified Schematic

LM61
01289717

3.0 Applications Circuits

01289718

FIGURE 7. Centigrade Thermostat

01289719

FIGURE 8. Conserving Power Dissipation with Shutdown

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LM61

4.0 Recommended Solder Pads for SOT-23 Package

01289720
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Physical Dimensions inches (millimeters)

unless otherwise noted
LM61
SOT-23 Molded Small Outline Transistor Package (M3)
Order Number LM61BIM3, LM61BIM3X, LM61CIM3 or LM61CIM3X
NS Package Number MA03B
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LM61 2.7V, SOT-23 or TO-92 Temperature Sensor
TO-92 Plastic Package (Z)
Order Number LM61BIZ or LM61CIZ
NS Package Number Z03A
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
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2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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Email: new.feedback@nsc.com Tel: 1-800-272-9959
www.national.com
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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