Rainbow Electronics ISD1700 User Manual

PRELIMINARY

ISD1700

Series

Multi-Message

Single-Chip

Voice Record & Playback Devices

Publication Release Date: January 23, 2007 Revision 1.3-S2

ISD1700 SERIES

TABLE OF CONTENTS

1 GENERAL DESCRIPTION ..............................................................................................................3

2 FEATURES......................................................................................................................................4

3 BLOCK DIAGRAM...........................................................................................................................5

4 PINOUT CONFIGURATION............................................................................................................6

5 PIN DESCRIPTION .........................................................................................................................7

6 MODES OF OPERATIONS.............................................................................................................8

6.1 Standalone (Push-Button) Mode .............................................................................................8

6.2 SPI Mode .................................................................................................................................8

7 TIMING DIAGRAMS ........................................................................................................................8

7.1 Standalone Operation ..............................................................................................................8

7.2 SPI Operation.........................................................................................................................12

8 ABSOLUTE MAXIMUM RATINGS ................................................................................................13

8.1 Operating Conditions .............................................................................................................13

9 ELECTRICAL CHARACTERISTICS .............................................................................................14

9.1 DC Parameters ......................................................................................................................14

9.2 AC Parameters.......................................................................................................................15

10 TYPICAL APPLICATION CIRCUITS.............................................................................................16

10.1 Good Audio Design Practices................................................................................................18

11 PACKAGING .................................................................................................................................19

11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19

11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20

11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21

11.4 Die Information.......................................................................................................................21

12 ORDERING INFORMATION .........................................................................................................22

13 VERSION HISTORY......................................................................................................................23

- 2 -

ISD1700 SERIES

1 GENERAL DESCRIPTION

The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multimessage voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications.

The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device incorporates a proprietary message management system that allows the chip to self-manage address locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a simple push-button environment. The devices include an on-chip oscillator (with external resistor control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, antialiasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation (PWM) Class D speaker driver, and current/voltage output.

The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new message indicator. With vAlert, the device flashes an external LED to indicate that a new message is present. Besides, four special sound effects are reserved for audio confirmation of operations, such as “Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.

Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Audio data are stored directly in solid-state memory without digital compression, providing superior quality voice and music reproduction.

Voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM) Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a single-ended current or voltage output to drive an external amplifier.

While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed.

In the SPI mode, the user has full control via the serial interface in operating the device. This includes random access to any location inside the memory array by specifying the start address and end address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register. This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default configuration for standalone mode can also be modified by storing the APC data into a non-volatile register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products.

Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or Representatives to verify current or future specifications. Also refer to the website for any related application notes.

Publication Release Date: January 23, 2007

- 3 - Revision 1.3-S2

ISD1700 SERIES

Y

2 FEATURES

y Integrated message management systems for single-chip, push-button applications

o

REC : level-trigger for recording

o o o o o

o o Automatic power-down after each operation cycle

y Selectable sampling frequency controlled by an external oscillator resistor

duration

o A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosen

Sample Freq. ISD1730 ISD1740 ISD1750 ISD1760 ISD1790 ISD17120 ISD17150 ISD17180 ISD17210 ISD17240

y Message and operation indicators

o Four customizable Sound Effects (SEs) for audible indication o Optional vAlert (voiceAlert) to indicate the presence of new messages

o LED: stay on during recording, blink during playback, forward and erase operations

y Dual operating modes

o Standalone mode:

o SPI mode:

y Two individual input channels

o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) o AnaIn: single-ended auxiliary analog input for recording or feed-through

y Dual output channels

o Differential PWM Class D speaker outputs directly drives an 8  speaker or a typical buzzer o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier

y ChipCorder standard features

o High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltage o 100-year message retention (typical)

o 100,000 record cycles (typical)

: edge-trigger for individual message or level-trigger for looping playback sequentially

PLA

ERASE

FWD

VOL : 8 levels output volume control

RESET : return to the default state

Sampling Frequency 12 kHz 8 kHz 6.4 kHz 5.3 kHz 4 kHz Rosc

: edge-triggered erase for first or last message or level-triggered erase for all messages

: edge-trigger to advance to the next message or fast message scan during the playback

: ready or busy status indication

INTRDY

y

53 kΩ 80 kΩ 100 kΩ 120 kΩ 160 kΩ

Selectable message

12 kHz 8 kHz

6.4 kHz

5.3 kHz 4 kHz

20 secs

30 secs

37 secs

45 secs

60 secs

26 secs 33 secs 40 secs 60 secs 80 secs 100 secs 120 secs 140 secs 160 secs

40 secs 50 secs 60 secs 90 secs 120 secs 150 secs 180 secs 210 secs 240 secs

50 secs 62 secs 75 secs 112 secs 150 secs 187 secs 225 secs 262 secs 300 secs

60 secs 75 secs 90 secs 135 secs 181 secs 226 secs 271 secs 317 secs 362 secs

80 secs 100 secs 120 secs 180 secs 240 secs 300 secs 360 secs 420 secs 480 secs

 Integrated message management techniques  Automatic power-down after each operation cycle

 Fully user selectable and controllable options via APC register and various SPI commands

- 4 -

y Temperature options:

o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units) o Industrial: -40°C to +85°C (packaged units)

y Packaging types: available in die, PDIP, SOIC and TSOP

y Package option: Lead-free packaged units

3 BLOCK DIAGRAM

ISD1700 SERIES

R

OSC

AnaIn

MIC+ MIC-

AGC

Internal

Clock

AnaIn

Amp

AGC Amp

Power Conditioning

V

SSA

CCA

MUX

Automatic

Gain Control

V

SSP1

CCP

Aliasing

V

SSP2

Anti-

Filter

V

SSD

Timing

V

CCD

Sampling

Clock

Nonvolatile

Multi-Level Storage

Array

Device Control

FWD VOL LEDINT/RDYRESET

FT

Smoothing

Filter

Volume Control

Amp

SPI Interface

AUD / AUX

SP+

SP-

MISOMOSISCLKSSREC PLAY ERASE

Publication Release Date: January 23, 2007

- 5 - Revision 1.3-S2

ISD1700 SERIES

4 PINOUT CONFIGURATION

Refer to Design Guide for details before performing any design or PCB layout.

V

AnaIn

MIC+

MIC-

V

SSP2

SP-

V

CCP

Sp+

V

AUD/AUX

AGC

VOL R V

SSA

SSP1

OSC CCA

V

CCD

LED

RESET

MISO MOSI

SCLK

SS

V

SSA

AnaIn

MIC+

MIC-

V

SSP2

SP-

V

CCP

ISD1700

SOIC / PDIP

ISD 1 7 0 0

V

SSD

INT / RD Y FWD ERASE

REC

PLAY

FT

V

CCA

R

OSC

VOL AGC

AUD / AUX

V

SSP1

Sp+

SS SCLK MOSI MISO RESET LED V

CCD

V

SSD

INT / RDY

FWD

ERASE

REC PLAY FT

TSOP

- 6 -

ISD1700 SERIES

5 PIN DESCRIPTION

Refer to Design Guide for details before performing any design or PCB layout.

PIN NAME FUNCTIONS

V

CCD

LED

RESET

MISO

MOSI

SCLK

SS

V

SSA

AnaIn

MIC+

MIC-

V

SSP2

SP-

V

CCP

SP+

V

SSP1

AUD/AUX

AGC

VOL

R

OSC

V

CCA

FT

PLAY

REC

ERASE

FWD

INTRDY

Digital Power Supply: Power supply for digital circuitry. LED: An LED output.

RESET: When active, the device enters into a known state. Master In Slave Out: Data is shifted out on the falling edge of SCLK.

When the SPI is inactive (

SS = high), it’s tri-state.

Master Out Slave In: Data input of the SPI interface when ISD1700 is a

slave. Data is latched into the device on the rising edge of SCLK.

Serial Clock: Clock of the SPI interface. Slave Select: Selects as a slave device and enables the SPI interface.

Analog Ground: Ground path for analog circuitry. AnaIn: Auxiliary analog input to the device for recording or feed-through. MIC+: Non-inverting input of the differential microphone signal. MIC-: Inverting input of the differential microphone signal. Ground: Ground path for negative PWM speaker drive.

SP-: The negative Class D PWM speaker output. Power Supply for PWM Speaker Driver: Power for PWM speaker drive.

SP+: The positive Class D PWM speaker output. Ground: Ground path for positive PWM speaker drive.

Auxiliary Output: Either an AUD (current) or AUX (voltage) output. Automatic Gain Control (AGC): The AGC adjusts the gain of the

microphone preamplifier circuitry.

Volume: This control has 8 levels of volume adjustment. Oscillator Resistor: A resistor determines the sample frequency of the

device, which sets the duration.

Analog Power Supply. Power supply for analog circuitry. Feed-through: Enable the feed-through path for AnaIn signal to the

outputs.

Playback: Plays the recorded message individually, or plays messages

sequential in a looping mode.

Record: When active, starts recording message. Erase: When active, can erase individual message or do global erase. Forward: Advances to the next message from the current location.

An open drain output. Can review ready or interrupt status.

V

SSD

Digital Ground: Ground path for digital circuitry

Publication Release Date: January 23, 2007

- 7 - Revision 1.3-S2

ISD1700 SERIES

Y

6 MODES OF OPERATIONS

The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode.

6.1 STANDALONE (PUSH-BUTTON) MODE

One can utilize the

REC, PLA

, FT,

FWD

,

ERASE

,

VOL

or

RESET

control to initiate a

desired operation. As completed, the device automatically enters into the power-down state.

6.2 SPI MODE

In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI commands.

For technical details, please refer to the design guide.

7 TIMING DIAGRAMS

The following estimated timing diagrams are not in proper scale.

ASIC OPERATION

7.1 B

REC

RDY

T

r

T

Deb

T

f

LED

Mic+/-,

AnaIn

T

Sc1

RU

T

ER

T

Set1

RD

Figure 12.1: Record Operation with No Sound Effect

- 8 -

ISD1700 SERIES

T

> T

r

Deb

T

f

PLAY

T

Deb

RDY

T

Sc1

T

Sc2TRUTLH

T

Cyc

LED

Sp+, Sp-

Figure 12.2: Start and Stop Playback Operation

T

r

> T

Deb

T

Deb

T

Set1

RD

f

ERASE

T

Deb

T

RD

RDY

T

Sc2TE

Sc1

T

LS2

T

Sc2

LED

Figure 12.3: Single Erase Operation with No Sound Effect

Publication Release Date: January 23, 2007

- 9 - Revision 1.3-S2

ISD1700 SERIES

T

r

> T

Deb

T

f

FWD

T

Deb

RDY

T

Sc2

Sc1

T

LED

Figure 12.4: Forward Operation with No Sound Effect

T

r

ERASE

T

Deb

RDY

LS1

or T

LS2

T

RD

T

f

T

RD

T

Sc1

Sc2

T

or

(TE + T

GE1

LS2

3x(T

or

T

)

SE2

LS1

T

or

T

)

SE1

LED

Sp+, Sp-

Note: If SEs are recorded, then Sp+/- w ill have output.

Figure 12.5: Global Erase Operation with or without Sound Effects

- 10 -

GE2

or

T

LS4

SE4

ISD1700 SERIES

T

r

T

f

RESET

T

Reset

RDY

LED

Figure 12.6: Reset Operation

T

r

PLAY

T

Deb

RDY

> T

T

Set2

Deb

Device returns to Power Down state

T

f

T

RD

T

Sc1

T

Sc2TRUTLH

T

Cyc

LED

T

RU

T

RD

AUD

Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output

Publication Release Date: January 23, 2007

- 11 - Revision 1.3-S2

ISD1700 SERIES

7.2 SPI

SS

SCLK

MOSI

MISO

OPERATION

T

SSS

(TRISTAT E)

T

SSH

T

SCKlow

T

PD

T

SCKhi

T

DISTDIH

LSB MSB

LSB

MSB

SSmin

T

DF

Figure 12.8: SPI Operation

PARAMETER SYMBOL MIN TYP MAX UNITS

T

500 nsec

Setup Time

SS

Hold Time

SS

Data in Setup Time T

Data in Hold Time T

SSS

T

500 nsec

SSH

200 nsec

DIS

200 nsec

DIH

Output Delay TPD 500 nsec

Output Delay to HighZ TDF 500 nsec

T

1 µsec

HIGH

SS

SCLK High Time T

SCLK Low Time T

SSmin

400 nsec

SCKhi

400 nsec

SCKlow

CLK Frequency F0 1,000 KHz

Power-Up Delay

Notes:

[1]

T

[1]

The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for

50 msec

PUD

slower sampling frequency.

- 12 -

ISD1700 SERIES

8 ABSOLUTE MAXIMUM RATINGS

ABSOLUTE MAXIMUM RATINGS (DIE)

CONDITIONS VALUES

Junction temperature 1500C Storage temperature range -650C to +1500C Voltage Applied to any pads (VSS - 0.3V) to (VCC + 0.3V) Power supply voltage to ground potential -0.3V to +7.0V

ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)

CONDITIONS VALUES

Junction temperature 1500C Storage temperature range -650C to +1500C Voltage Applied to any pins (VSS - 0.3V) to (VCC + 0.3V) Voltage applied to any pin (Input current limited to +/-20 mA) (VSS – 1.0V) to (VCC + 1.0V) Power supply voltage to ground potential -0.3V to +7.0V

[1]

Stresses above those listed may cause permanent damage to the device. Exposure to the absolute

maximum ratings may affect device reliability. Functional operation is not implied at these conditions.

[1]

8.1 OPERATING CONDITIONS

OPERATING CONDITIONS (DIE)

CONDITIONS VALUES

Operating temperature range 0°C to +50°C Supply voltage (VCC) Ground voltage (VSS) Input voltage (VCC) Voltage applied to any pins (VSS –0.3 V) to (VCC +0.3 V)

Operating temperature range (Case temperature) -40°C to +85°C Supply voltage (VDD) Ground voltage (VSS) Input voltage (VDD) Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

[1]

VCC = V

[2]

VSS = V

CCA

SSA

= V

[1]

+2.4 V to +5.5 V

[2]

0 V

[1]

0 V to 5.5 V

OPERATING CONDITIONS (PACKAGED PARTS)

CONDITIONS VALUES

[1]

+2.4V to +5.5V

[2]

0V

[1]

0V to 5.5V

= V

CCP

= V

SSP1 VSSP2

CCD

SSD

Publication Release Date: January 23, 2007

- 13 - Revision 1.3-S2

ISD1700 SERIES

Y

9 ELECTRICAL CHARACTERISTICS

9.1 DC PARAMETERS

PARAMETER SYMBOL MIN TYP

Supply Voltage VDD 2.4 5.5 V Input Low Voltage VIL V Input High Voltage VIH 0.7xV Output Low Voltage VOL V Output High Voltage VOH 0.7xV Record Current I Playback Current I Erase Current I

DD_Record

DD_Playback

DD_Erase

20 mA

-0.3 0.3xV

SS

DD

-0.3 0.3xV

SS

DD

Standby Current ISB 1 10 µA Input Leakage Current I Input Current Low I Preamp Input Impedance R AnaIn Input Impedance R MIC Differential Input V AnaIn Input Voltage V Gain from MIC to SP+/- A

Speaker Output Load R AUX Output Load R Speaker Output Power Pout

ILPD1

-3 -10 µA Force V

ILPD2

MIC+,RMIC-

AnaIn

IN1

IN2

MSP

SPK

Aux

7 k Power-up AGC

42 k When active

15 300 mV Peak-to-Peak 1 V Peak-to-Peak

6 40 dB VIN = 15~300 mV, AGC =

8  Across both Speaker pins

5 k When active

670 mW V 313 mW V 117 mW VDD= 3 V 49 mW V

Speaker Output Voltage V

AUX Output Swing V AUX Output DC Level V AUD I Volume Output A

V

OUT1

1 V Peak-to-Peak

OUT2

1.2 V When active

OUT3

-3.0 mA V

AUD

0 to -28 dB 8 steps of 4dB each

Vol

Total Harmonic Distortion THD 1 % 15 mV p-p 1 kHz sine

Notes:

[1]

Conditions: VCC = 4.5V, 8 kHz sampling frequency and TA = 25°C, unless otherwise stated.

[2]

LED output during Record operation.

[3]

V

, V

CCD

and V

CCA

[4]

REC, PLA

[5]

Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or

MIC- input is recommended no more than 150 mV p-p.

are connected together. V

CCP

, FT,

, ERASE , VOL and RESET must be at V

FWD

SSA

, V

[1]

MAX UNITS CONDITIONS

DD

V

DD

V I

DD

±1

V R

DD

SSP1, VSSP2

and V

are connected together.

SSD

V

V I

OL

OH

V Sampling freq = 12 kHz

[3] [4]

µA Force V

4.7 µF, V

Typical buzzer

reference to output

wave, Cmessage weighted

.

CCD

= 4.0 mA

= -1.6 mA

= 5.5 V, No load,

DD

[2]

DD

, others at Vcc

SS

[5]

= 2.4V~5.5V

CC

= 5.5 V

DD

= 4.4 V

DD

= 2.4 V

DD

= 8 (Speaker),

SPK

=4.5 V, R

DD

1Vp-p, 1 kHz sine wave at AnaIn. R = 8 .

EXT

= 390 

SPK

- 14 -

ISD1700 SERIES

L

9.2

AC PARAMETERS

CHARACTERISTIC SYMBO

Sampling Frequency Duration

[3]

T

[2]

FS 4 12 kHz

Dur

MIN TYP

Rising Time Tr 100 nsec Falling Time Tf 100 nsec Debounce Time T

192/FS msec

Deb

Ramp Up Time TRU 128/FS msec Ramp Down Time TRD 128/FS msec Initial Scan Time after

T

DRN/8/F

Sc1

power is applied Initial Scan Time from PD

T

DRN/16/FSmsec After a PB operation

Sc2

state End Recording Time TER 32/FS msec LED High Time TLH 0.5K/FS msec LED Flash Time for SE1 T LED Flash Time for SE2 T LED Flash Time for SE3 T LED Flash Time for SE4 T SE1 Recorded Duration T SE2 Recorded Duration T SE3 Recorded Duration T SE4 Recorded Duration T

3.5K/FS sec SE1 not recorded

LS1

7.5K/F

LS2

11.5K/F

LS3

15.5K/F

LS4

4K/FS sec

SE1

4K/FS sec

SE2

4K/FS sec

SE3

4K/FS sec

SE4

Erase Time TE 10MRN/F Global Erase Wait Time T Global Erase Time T RESET Pulse T

Settle Time T Settle Time after Reset T LED Error Time T LED Cycle frequency T

[1]

Notes:

Typical values: VCC = 4.5 V, FS = 8 kHz and @ TA = 25°C, unless otherwise stated.

[2]

Characterization data shows that sampling frequency resolution is ±5 percent across temperature and voltage

ranges.

[3]

Characterization data shows that duration resolution is ±5 percent across temperature and voltage ranges.

[4]

Vcc=2.4 V~5.5V

[5]

K = 1024

20K/FS sec

GE1

34/FS sec

GE2

1

Reset

128/FS msec

Set1

64/FS msec

Set2

27.5K/FS msec

LErr

1 4 Hz Pending upon FS

Cyc

[1]

MAX UNITS CONDITIONS

Refer to

sec

[2] [4]

[3]

duration

table

[4]

msec DRN= device row#

S

is run

[4]

S

sec SE2 not recorded sec SE3 not recorded sec SE4 not recorded

[4] [5]

sec MRN=message row #

[4] [5]

μsec

All Fs

[4]

[4] [5]

[4]

[5]

[4]

Publication Release Date: January 23, 2007

- 15 - Revision 1.3-S2

ISD1700 SERIES

10 TYPICAL APPLICATION CIRCUITS

The following typical applications examples on ISD1700 Series are for references only. They make no representation or warranty that such applications shall be suitable for the use specified. Each design has to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc.

The below notes apply to the following applications examples:

* These capacitors may be needed in order to optimize for the best voice quality, which is also dependent

upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values. Please refer to the applications notes or consult Winbond for layout advice.

** It is important to have a separate path for each ground and power back to the related terminals to minimize

the noise. Also, the power supplies should be decoupled as close to the device as possible

Example #1: Recording using microphone input via push-button controls

.

*** At 8kHz sampling freq, Rosc = 80 K

Reset

0.1 F

μ

**

V

0.1 F

Gnd

CC

8050C

μ

Vcc

**

V

CCA

V

CCD

V

CCP

*

Speaker

390

Ω

24

REC

23

PLAY

25

ERASE

26

FWD

19

VOL

22

FT

V

CC

4.7 K

Ω

4.7 F

Ω4.7 K

0.1 F

Ω

Rosc ***

7

SS

6

SCLK

5

MOSI

4

μ

4.7 F

MISO

10

11

MIC -

9

AnaIn

20

R

18

AGC

ISD1700

MIC+

AUD/AUX

OSC

: Digital ground; : Analog ground; : Ground for SP+; : Ground for SP-

INT/RDY

RESET

LED

V

CCA

V

SSP1

V

SSP2

SP+

SP-

CCD

SSA

CCP

SSD

3

D1

V

CCP

Speaker

or Buzzer

Ω

vAlert

CCD

*

V

CCA

μ

0.1 F

*

μ

0.1 F

AUD

AUX

Optional: based upon the applications

1 KΩ

2

1

μ

0.1 F

28

21

8

V

14

16

μ

0.1 F

12

15

13

17

V

CCD

100 K

27

Optional

- 16 -

Example #2: Recording using AnaIn input via push-button controls

ISD1700 SERIES

*** At 8kHz sampling freq, Rosc = 80 K

0.1 F

Rosc ***

μ

4.7 F

24

REC

23

PLAY

25

ERASE

26

FWD

19

VOL

22

FT

7

SS

6

SCLK

5

MOSI

4

MISO

10

MIC+

11

MIC -

9

AnaIn

20

R

18

AGC

μ

ISD1700

AUD/AUX

OSC

INT/RDY

: Digital ground; : Analog ground; : Ground for SP+; : Ground for SP-

RESET

LED

V

SSP1

V

SSP2

SP+

SP-

CCD

CCA

SSA

CCP

SSD

3

vAlert

D1

1 KΩ

2

V

μ

0.1 F

V

μ

V

CCD

Optional

CCP

Speaker

or Buzzer

Ω1 00 K

CCD

*

V

CCA

μ

0.1 F

*

μ

0.1 F

AUD

AUX

Optional: based upon the ap plications

1

28

21

8

14

16

0.1 F

12

15

13

17

27

0.1 F

**

V

CCA

V

CCD

V

CCP

*

390

Reset

μ

Vcc Gnd

**

V

CC

Speaker

8050C

Ω

μ

0.1 F

Publication Release Date: January 23, 2007

- 17 - Revision 1.3-S2

Example #3: Connecting the SPI Interface to a microcontroller

ISD1700 SERIES

To uC

SPI

*** At 8kHz sampling freq, Rosc = 80 K

μ

0.1 F

Rosc ***

4.7 F

Reset

μ

0.1 F

Vcc Gnd

**

V

CCA

V

CCD

V

CCP

*

Speaker

390

Ω

**

V

0.1 F

CC

8050C

μ

24

REC

23

PLAY

25

ERASE

26

FWD

19

VOL

22

FT

7

SS

6

SCLK

5

MOSI

4

MISO

10

11

MIC -

9

AnaIn

20

R

18

AGC

μ

ISD1700

MIC+

AUD/AUX

OSC

: Digital ground; : Analog ground; : Ground for SP+; : Ground for SP-

INT/RDY

RESET

LED

V

SSP1

V

SSP2

SP+

SP-

CCA

SSA

CCP

CCD

SSD

3

vAlert

D1

1 KΩ

2

V

0.1 F

μ

V

CCD

Optional

μ

V

CCP

CCD

*

V

CCA

μ

0.1 F

*

0.1 F

Speaker

or Buzzer

*

μ

AUD

Ω100 K

AUX

Optional: based upon the appl ications

1

28

21

8

14

16

0.1 F

12

15

13

17

27

10.1 GOOD AUDIO DESIGN PRACTICES

To ensure the highest quality of voice reproduction, it is important to follow good audio design practices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites.

Design Considerations for ISD1700 Family AN-CC1002 Design Considerations for ISD1700 Family.pdf

Good Audio Design Practices

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf

- 18 -

ISD1700 SERIES

11 PACKAGING

11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC

H

D

c

e

E

b

θ

L

1

L

Symbol

A

1

A

2

A b

c D E

D

H e L

1

L

Y

θ

Dimension in Inches

Min.

Nom. Max. Min. Nom.

0.002

0.040

0.035

0.007 0.008 0.011

0.004

0.006

0.465 0.469

0.461

0.311 0.315 0.319

0.520 0.528 0.536

0.022

0.020

0.024

0.031

0.000

035

Dimension in mm

0.047

0.006

0.05

0.95

0.041

0.17

0.10

0.008

11.70

7.90

13.20

0.50

0.028

0.00

0.004

11.80

13.40

0

A

Max.

1.20

0.15

1.00

1.05

0.20 0.27

0.15 0.21

11.90

8.10

8.00

13.60

0.55

0.70

0.60

0.80

0.10

35

1

A

Y

2

Publication Release Date: January 23, 2007

- 19 - Revision 1.3-S2

ISD1700 SERIES

11.2 28-L

EAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)

27

26

2

25

24

4567

3

232221 20 19 18 171615

9101112 13

8

14

28

1

A

B

D

E

F

H

G C

Plastic Small Outline Integrated Circuit (SOIC) Dimensions

INCHES MILLIMETERS

Min Nom Max Min Nom Max A B C D E F

G H

Lead coplanarity to be within 0.004 inches.

Note:

0.701 0.706 0.711 17.81 17.93 18.06

0.097 0.101 0.104 2.46 2.56 2.64

0.292 0.296 0.299 7.42 7.52 7.59

0.005 0.009 0.0115 0.127 0.22 0.29

0.014 0.016 0.019 0.35 0.41 0.48

0.050 1.27

0.400 0.406 0.410 10.16 10.31 10.41

0.024 0.032 0.040 0.61 0.81 1.02

- 20 -

ISD1700 SERIES

11.3 28-L

EAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)

Plastic Dual Inline Package (PDIP) (P) Dimensions

Min Nom Max Min Nom Max

A 1.445 1.450 1.455 36.70 36.83 36.96 B1 0.150 3.81 B2 0.065 0.070 0.075 1.65 1.78 1.91 C1 0.600 0.625 15.24 15.88 C2 0.530 0.540 0.550 13.46 13.72 13.97

D 0.19 4.83 D1 0.015 0.38

E 0.125 0.135 3.18 3.43

F 0.015 0.018 0.022 0.38 0.46 0.56

G 0.055 0.060 0.065 1.40 1.52 1.65 H 0.100 2.54

J 0.008 0.010 0.012 0.20 0.25 0.30

S 0.070 0.075 0.080 1.78 1.91 2.03

0 0° 15° 0° 15°

INCHES

MILLIMETERS

11.4 D

For die info, please contact the local Winbond Sales Representatives.

Publication Release Date: January 23, 2007

- 21 - Revision 1.3-S2

IE INFORMATION

12 ORDERING INFORMATION

Product Number Descriptor Key

ISD1700 SERIES

Product Name:

I = ISD

Product Series:

17 = 1700

Duration:

: 20 – 60 secs

30

: 26 – 80 secs

40

: 33 – 100 secs

50

: 40 – 120 secs

60 90

: 60 – 180 secs

120

: 80 – 240 secs : 100 – 300 secs

150 180

: 120 – 360 secs

210

: 140 – 420 secs : 160 – 480 secs

240

I17xxxxxxxxx

Package Type:

X = Die

E = Thin Small Outline Package (TSOP)

S = Small Outline Integrated Circuit

(SOIC) Package

P = Plastic Dual Inline Package (PDIP)

Special Features Field:

Blank = None

= vAlert

01

Tape & Reel:

Blank = None

R = Tape & Reel

Temperature:

I = Industrial (-40°C to +85°C)

Blank

= Commercial

• Die (0°C to +50°C)

• Package (0°C to +70°C)

Lead-Free:

Y = Lead-Free

When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond Sales Representatives for any questions and the availability.

For the latest product information, please contact the Winbond Sales/Rep or access Winbond’s worldwide web site at http://www.winbond-usa.com

- 22 -

ISD1700 SERIES

13 VERSION HISTORY

VERSION DATE DESCRIPTION

1.3-S

1.3-S1

1.3-S2

Sep 2006

Nov 2006

Jan 2007

Initial version

Revise Pinout Configuration & Pin Description sections

Revise Rosc resistor value Revise Selectable Message Duration section Update standby current, sampling frequency & duration parameters

Publication Release Date: January 23, 2007

- 23 - Revision 1.3-S2

ISD1700 SERIES

prop

Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.

Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property.

The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if Winbond has been advised of the possibility of such damages.

Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.

The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates SuperFlash

This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is subject to change without notice.

Copyright Winbond Electronics Corporation. SuperFlash are

®

.

®

ChipCorder®

©

erties of their respective owners.

®

is the trademark of Silicon Storage Technology, Inc. All other trademarks

- 24 -

Rainbow Electronics ISD1700 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual