Rainbow Electronics HT93LC56 User Manual

Features

·
Operating voltage V
-
Read: 2.0V~5.5V
-
Write: 2.4V~5.5V
·
Low power consumption
-
Operating: 5mA max.
-
Standby: 10mA max.
·
User selectable internal organization
-
2K(HT93LC56): 256´8or128´16
·
3-wire Serial Interface
·
Write cycle time: 5ms max.

General Description

The HT93LC56 is a 2K-bit low voltage nonvolatile, serial electrically erasable programmable read only memory de vice using the CMOS floating gate process. Its 2048 bits of memory are organized into 128 words of 16 bits each when the ORG pin is connected to VCC or organized into 256 words of 8 bits each when it is tied to VSS. The device
HT93LC56
CMOS 2K 3-Wire Serial EEPROM
·
Automatic erase-before-write operation
·
Word/chip erase and write operation
·
Write operation with built-in timer
·
Software controlled write protection
·
10-year data retention after 100K rewrite cycles
·
106rewrite cycles per word
·
Commercial temperature range (0°Cto+70°C)
·
8-pin DIP/SOP package
is optimized for use in many industrial and commercial ap plications where low power and low voltage operation are
­essential. By popular microcontroller, the versatile serial interface including chip select (CS), serial clock (SK), data input (DI) and data output (DO) can be easily controlled.
-

Block Diagram

C S
S K
O R G
D I
C o n t r o l
G e n e r a t o r
R e g i s t e r

Pin Assignment

C S
1
S K
2
D I
3
4
D O
H T 9 3 L C 5 6
8 D I P - A / S O P - A
L o g i c
a n d
C l o c k
D a t a
A d d r e s s R e g i s t e r
V C C
A d d r e s s D e c o d e r
V S S
M e m o r y C e l l
A r r a y
2 K : ( 2 5 6
V C C
8
N C
7
O R G
6
5
V S S
N C
V C C
C S
S K
8 o r 1 2 8 ´ 1 6 )
´
O u t p u t B u f f e r
1
2
3
4
H T 9 3 L C 5 6
8 S O P - B
D O
O R G
8
V S S
7
D O
6
5
D I
C S
1
S K
2
D I
3
4
D O
V C C
8
N C
7
N C
6
5
V S S
H T 9 3 L C 5 6
8 S O P - C
Rev. 1.20 1 October 26, 2001
HT93LC56

Pin Description

Pin Name I/O Description
CS I Chip select input
SK I Serial clock input
DI I Serial data input
DO O Serial data output
VSS
ORG I
NC
VCC

Absolute Maximum Ratings

Operation Temperature (Commercial)..........................................................................................................0°Cto70°C
Applied V
Applied Voltage on any Pin with Respect to VSS
Supply READ Voltage ....................................................................................................................................2V to 5.5V
Voltage with Respect to VSS..................................................................................................-0.3V to 6.0V
Negative power supply, ground
¾
Internal Organization When ORG is connected to VDD or ORG is floated, the (´16) memory organization is se lected. When ORG is tied to VSS, the (´8) memory organization is selected. There is an in ternal pull-up resistor on the ORG pin. (HT93LC56-A)
No connection
¾
Positive power supply
¾
..................................................................................................VSS
-0.3V toVCC+0.3V
-
-
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil­ity.

D.C. Characteristics

Symbol Parameter
V
I
I
I
I
I
V
V
V
V
C
C
CC1
CC2
STB
LI
LO
Operating Voltage
Operating Current (TTL) 5V DO unload, SK=1MHz
Operating Current (CMOS)
Standby Current (CMOS) 5V CS=SK=DI=0V
Input Leakage Current 5V
Output Leakage Current 5V
Input Low Voltage
IL
IH
OL
OH
IN
OUT
Input High Voltage
Output Low Voltage
Output High Voltage
Input Capacitance
Output Capacitance
2~5.5V DO unload, SK=250kHz
2~5.5V
2~5.5V
2~5.5V
2~5.5V
Test Conditions
V
¾
Conditions
Read 2.0
Write 2.4
5V DO unload, SK=1MHz
V
IN=VSS~VCC
, CS=0V
¾
5V
V
OUT=VSS~VCC
¾
5V
¾
¾
=2.1mA
I
5V
OL
I
=10mA ¾¾
OL
5V
¾
¾
=-400mA
I
OH
I
=-10mAV
OH
=0V, f=250kHz
V
IN
=0V, f=250kHz
V
OUT
Min. Typ. Max. Unit
¾
¾
¾¾
¾¾
¾¾
¾¾
0
0
0
0
2
0.9V
¾
¾
¾
¾
¾
¾
¾¾
5.5 V
5.5 V
5mA
5mA
5mA
10
1
1
0.8 V
0.1V
V
CC
V
CC
0.4 V
0.2 V
2.4
-0.2 ¾¾
¾¾
¾¾
¾¾
5pF
5pF
mA
mA
mA
V
V
V
V
V
Rev. 1.20 2 October 26, 2001

A.C. Characteristics

Symbol Parameter
f
SK
t
SKH
t
SKL
t
CSS
t
CSH
t
CDS
t
DIS
t
DIH
t
PD1
t
PD0
t
SV
t
HV
t
PR
* For Read Operating Only
Clock Frequency 0 2000 0 500 0 250 kHz
SK High Time 250
SK Low Time 250
CS Setup Time 50
CS Hold Time 0
CS Deselect Time 250
DI Setup Time 100
DI Hold Time 100
DO Delay to ²1²¾
DO Delay to ²0²¾
Status Valid Time
DO Disable Time 100
Write Cycle Time
VCC=5V±10% VCC=3V±10%
VCC=2V*
Min. Max. Min. Max. Min. Max.
¾
¾
¾
¾
¾
¾
¾
250
250
¾
250
¾
¾
5
1000
1000
200
0
250
200
200
¾
¾
¾
400
¾
¾
¾
¾
¾
¾
¾
¾
1000
1000
250
¾
5
2000
2000
200
0
1000
400
400
¾
¾
¾
¾
¾
¾
¾
¾
¾
2000 ns
2000 ns
¾¾
400
¾
¾¾
HT93LC56
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
A.C. test conditions
Input rise and fall time: 5ns (1V to 2V)
Input and output timing reference levels: 1.5V
Output load circuit: See Figure below.
V C C = 1 . 9 5 2 V
8 0 0
W
D O
1 0 0 p F *
* Including scope and jig
t
C S
S K
D I
D O
C S S
t
D I S
H i - Z
t
t
D I H
V a l i d D a t a
S K H
t
P D 0
t
C D S
t
S K L
V a l i d D a t a
t
P D 1
t
C S H
Rev. 1.20 3 October 26, 2001

Functional Description

The HT93LC56 is accessed via a three-wire serial com munication interface. The device is arranged into 128 words by 16 bits or 256 words by 8 bits depending whether the ORG pin is connected to VCC or VSS. The HT93LC56 contains seven instructions: READ, ERASE, WRITE, EWEN, EWDS, ERAL and WRAL. When the user selectable internal organization is arranged into
128´16 (256´8), these instructions are all made up of 11(12) bits data: 1 start bit, 2 op code bits and 8(9) address bits.
By using the control signal CS, SK and data input signal DI, these instructions can be given to the HT93LC56. These serial instruction data presented at the DI input will be written into the device at the rising edge of SK. During the READ cycle, DO pin acts as the data output and during the WRITE or ERASE cycle, DO pin indi cates the BUSY/READY status. When the DO pin is ac tive for read data or as a BUSY/READY indicator the CS pin must be high; otherwise DO pin will be in a high-impedance state. For successful instructions, CS must be low once after the instruction is sent. After power on, the device is by default in the EWDS state. And, an EWEN instruction must be performed before any ERASE or WRITE instruction can be executed. The following are the functional descriptions and timing dia­grams of all seven instructions.
READ
The READ instruction will stream out data at a specified address on the DO pin. The data on DO pin changes during the low-to-high edge of SK signal. The 8 bits or
16 bits data stream is preceded by a logical ²0² dummy bit. Irrespective of the condition of the EWEN or EWDS instruction, the READ command is always valid and in dependent of these two instructions. After the data word has been read the internal address will be automatically incremented by 1 allowing the next consecutive data word to be read out without entering further address data. The address will wrap around with CS High until CS returns to LOW.
HT93LC56
ERASE
-
The ERASE instruction erases data at the specified ad dresses in the programming enable mode. After the ERASE op-code and the specified address have been issued, the data erase is activated by the falling edge of CS. Since the internal auto-timing generator provides all timing signals for the internal erase, so the SK clock is not required. During the internal erase, we can verify the busy/ready status if CS is high. The DO pin will remain low butwhen the operation is over, the DO pin will return to high and further instructions can be executed.
WRITE
The WRITE instruction writes data into the device at the specified addresses in the programming enable mode. After the WRITE op-code and the specified address and
­data have been issued, the data writing is activated by
­the falling edge of CS. Since the internal auto-timing generator provides all timing signal for the internal writ ing, so the SK clock is not required. The auto-timing write cycle includes an automatic erase-before-write ca pability. So, it is not necessary to erase data before the WRITE instruction. During the internal writing, we can verify the busy/ready status if CS is high. The DO pin will remain low but when the operation is over, the DO pin will return to high and further instructions can be exe­cuted.
ERAL
The ERAL instruction erases the entire 128´16 or
256´8 memory cells to logical ²1² state in the program­ming enable mode. After the erase-all instruction set has been issued, the data erase feature is activated by the falling edge of CS. Since the internal auto-timing
­generator provides all timing signal for the erase-all op eration, so the SK clock is not required. During the inter nal erase-all operation, we can verify the busy/ready status if CS is high. The DO pin will remain low but when the operation is over, the DO pin will return to high and further instruction can be executed.
-
-
-
-
-
EWEN/EWDS
The EWEN/EWDS instruction will enable or disable the programming capabilities. At both the power on and power off state the device automatically entered the dis able mode. Before a WRITE, ERASE, WRAL or ERAL in struction is given, the programming enable instruction EWEN must be issued, otherwise the ERASE/WRITE in struction is invalid. After the EWEN instruction is issued, the programming enable condition remains until power is turned off or a EWDS instruction is given. No data can be written into the device in the programming disabled state. By so doing, the internal memory data can be protected.
Rev. 1.20 4 October 26, 2001
WRAL
The WRAL instruction writes data into the entire 128´16
or 256´8 memory cells in the programming enable
-
mode. After the write-all instruction set has been issued,
-
the data writing is activated by the falling edge of CS. Since the internal auto-timing generator provides all tim
-
ing signals for the write-all operation, so the SK clock is not required. During the internal write-all operation, we can verify the busy/ready status if CS is high. The DO pin will remain low but when the operation is over the DO pin will return to high and further instruction can be executed.
-

Timing Diagrams

READ
C S
S K
D I
D O
* A d d r e s s p o i n t e r a u t o m a t i c a l l y c y c l e s t o t h e n e x t w o r d
EWEN/EWDS
( 1 )
S t a r t b i t
t
C D S
0
1
H i g h Z H i g h - Z
A N
A 0
t
0
D X
D 0
D X
H Z
*
M o d e
( X 1 6 )
A N
D X
A 6
D 1 5
HT93LC56
( X 8 )
A 7
D 7
WRITE
C S
S t a n d b y
S K
D I
( 1 )
S t a r t b i t
1 1 = E W E N
0
0
0 0 = E W D S
t
C D S
C S
v e r i f y
S t a n d b y
S K
A N - 1
D I
D O
( 1 )
S t a r t b i t
H i g h - Z
A N - 2
A N
1
0
A 1
A 0 D X
D 0
t
S V
r e a d y
b u s y
t
P R
t
H Z
Rev. 1.20 5 October 26, 2001
ERASE
ERAL
HT93LC56
t
C D S
C S
S K
A N - 1
D I
D O
( 1 )
S t a r t b i t
H i g h - Z
A N - 2
A N
1
1
C S
A 1
A 0
t
S K
v e r i f y
b u s y
t
P R
C D S
v e r i f y
S t a n d b y
t
S V
r e a d y
t
H Z
S t a n d b y
D I
( 1 )
S t a r t b i t
D O
1000
H i g h - Z
t
S V
r e a d y
b u s y
t
P R
t
H Z
WRAL
t
C D S
C S
S K
0
00
D I
D O
( 1 )
S t a r t b i t
1
H i g h - Z
D X
D 0
v e r i f y
b u s y
t
P R
S t a n d b y
t
S V
r e a d y
t
H Z

Instruction Set Summary

HT93LC56
Instruction Comments
Start
bitOpCode
READ Read data 1 10 XA7~A0 XA6~A0 D7~D0 D15~D0
ERASE Erase data 1 11 XA7~A0 XA6~A0
WRITE Write data 1 01 XA7~A0 XA6~A0 D7~D0 D15~D0
EWEN Erase/Write Enable 1 00 11XXXXXXX 11XXXXXX
EWDS Erase/Write Disable 1 00 00XXXXXXX 00XXXXXX
ERAL Erase All 1 00 10XXXXXXX 10XXXXXX
WRAL Write All 1 00 01XXXXXXX 01XXXXXX D7~D0 D15~D0
Note: ²X² stands for ²don¢t care²
Address Data
ORG=0
X8
ORG=1
X16
ORG=0X8ORG=1
¾¾
¾¾
¾¾
¾¾
X16
Rev. 1.20 6 October 26, 2001
HT93LC56
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science-based Industrial Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw
Holtek Semiconductor Inc. (Sales Office)
11F, No.576, Sec.7 Chung Hsiao E. Rd., Taipei, Taiwan Tel: 886-2-2782-9635 Fax: 886-2-2782-9636 Fax: 886-2-2782-7128 (International sales hotline)
Holtek Semiconductor (Shanghai) Inc.
7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn
Holtek Semiconductor (Hong Kong) Ltd.
RM.711, Tower 2, Cheung Sha Wan Plaza, 833 Cheung Sha Wan Rd., Kowloon, Hong Kong Tel: 852-2-745-8288 Fax: 852-2-742-8657
Holmate Semiconductor, Inc.
48531 Warm Springs Boulevard, Suite 413, Fremont, CA 94539 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com
Copyright Ó 2001 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
-
Rev. 1.20 7 October 26, 2001
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