Rainbow Electronics HT24LC02 User Manual

CMOS 2K 2-Wire Serial EEPROM

Features

·
Operating voltage: 2.2V~5.5V
·
Low power consumption
-
Operation: 5mA max.
-
Standby: 5mA max.
·
Internal organization: 256´8
·
2-wire serial interface
·
Write cycle time: 5ms max.
·
Automatic erase-before-write operation

General Description

The HT24LC02 is a 2K-bit serial read/write non-volatile memory device using the CMOS floating gate process. Its 2048 bits of memory are organized into 256 words and each word is 8 bits. The device is optimized for use in many industrial and commercial applications where

Block Diagram Pin Assignment

·
Partial page write allowed
·
8-byte Page write modes
·
Write operation with built-in timer
·
Hardware controlled write protection
·
40-year data retention
·
106erase/write cycles per word
·
Commerical temperature range (0°Cto+70°C)
·
8-pin DIP/SOP/TSSOP package
low power and low voltage operation are essential. Up to eight HT24LC02 devices may be connected to the same 2-wire bus. The HT24LC02 is guaranteed for 1M erase/write cycles and 40-year data retention.
HT24LC02
S C L
S D A
W P
A 0 ~ A 2
V C C
V S S
I / O
C o n t r o l
L o g i c
M e m o r y
C o n t r o l
L o g i c
A d d r e s s C o u n t e r
H V P u m p
X
D
E E P R O M
E
A r r a y
C
P a g e B u f
Y D E C
S e n s e A M P
R / W C o n t r o l

Pin Description

Pin Name I/O Description
A0~A2 I Address inputs
SDA I/O Serial data inputs/output
SCL I Serial clock data input
VSS
VCC
Negative power supply, ground
¾
Positive power supply
¾
V S S
A 0
1
A 1
2
A 2
3
4
V C C
8
W P
7
S C L
6
S D A
5
H T 2 4 L C 0 2
8 D I P - A / S O P - A / T S S O P - A
Rev. 1.10 1 November 5, 2002
HT24LC02

Absolute Maximum Ratings

Operating Temperature (Commercial)..........................................................................................................0°Cto70°C
Storage Temperature.............................................................................................................................-50°Cto125°C
Applied VCC Voltage with Respect toVSS ................................................................................................-0.3V to 6.0V
Applied Voltage on any Pin withRespect to VSS ..............................................................................-0.3V to V
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil ity.
CC
+0.3V
-

D.C. Characteristics

Symbol Parameter
V
I
CC1
I
CC2
V
V
V
I
LI
I
LO
I
STB1
I
STB2
C
C
CC
IL
IH
OL
IN
OUT
Operating Voltage
Operating Current 5V Read at 100kHz
Operating Current 5V Write at 100kHz
Input Low Voltage
Input High Voltage
Output Low Voltage 2.4V
Input Leakage Current 5V
Output Leakage Current 5V
Standby Current 5V
Standby Current 2.4V
Input Capacitance (See Note)
Output Capacitance (See Note)
Note: These parameters are periodically sampled but not 100% tested
Test Conditions
V
CC
Conditions
¾¾
¾¾ -1 ¾
¾¾
=2.1mA
I
OL
=0 or V
V
IN
V
OUT
V
IN
V
IN
=0 or V
=0 or V
=0 or V
CC
CC
CC
CC
¾ f=1MHz 25°C ¾¾
¾ f=1MHz 25°C ¾¾
Ta=0°Cto70°C
Min. Typ. Max. Unit
2.2
¾
¾¾
¾¾
0.7V
CC
¾
¾¾
¾¾
¾¾
¾¾
¾¾
5.5 V
2mA
5mA
0.3V
CC
V
+0.5
CC
0.4 V
1
1
5
4
6pF
8pF
V
V
mA
mA
mA
mA
Rev. 1.10 2 November 5, 2002
HT24LC02

A.C. Characteristics

Symbol Parameter Remark
f
SK
t
HIGH
t
LOW
t
r
t
f
Clock Frequency
Clock High Time
Clock Low Time
SDA and SCL Rise Time Note
SDA and SCL Fall Time Note
¾¾
¾
¾
After this period the
t
HD:STA
START Condition Hold Time
first clock pulse is generated
Only relevant for
t
SU:STA
START Condition Setup Time
repeated START condition
t
HD:DAT
t
SU:DAT
t
SU:STO
t
AA
Data Input Hold Time
Data Input Setup Time
STOP Condition Setup Time
Output Valid from Clock
¾
¾
¾
¾¾
Time in which the bus
t
BUF
Bus Free Time
must be free before a new transmission can start
t
SP
t
WR
Input Filter Time Constant (SDA and SCL Pins)
Write Cycle Time
Noise suppression time
¾¾5¾
Note: These parameters are periodically sampled but not 100% tested
* The standard mode means V
=2.2V to 5.5V
CC
For relative timing, refer to timing diagrams
Standard Mode*
Ta=0°Cto70°C
V
=5V±10%
CC
Min. Max. Min. Max.
4000
4700
¾
¾
4000
4000
0
200
4000
4700
¾
100
¾
¾
1000
300
¾
¾
¾
¾
¾
3500
¾
100
¾
600
1200
¾
¾
600
600
100
600
¾
1200
¾
0
400 kHz
¾
¾
300 ns
300 ns
¾
¾
¾
¾
¾
900 ns
¾
50 ns
5ms
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Rev. 1.10 3 November 5, 2002

Functional Description

HT24LC02
·
Serial clock (SCL) The SCL input is used for positive edge clock data into each EEPROM device and negative edge clock data out of each device.
·
Serial data (SDA) The SDA pin is bidirectional for serial data transfer. The pin is open-drain driven and may be wired-OR with any number of other open-drain or open collector devices.
·
A0, A1, A2 The A2, A1 and A0 pins are device address inputs that are hard wired for the HT24LC02. As many as eight 2K devices may be addressed on a single bus system (the device addressing is discussed in detail under the Device Addressing section).
·
Write protect (WP) The HT24LC02 has a write protect pin that provides hardware data protection. The write protect pin allows normal read/write operations when connected to the V
. When the write protect pin is connected to Vcc,
SS
the write protection feature is enabled and operates as shown in the following table.
WP Pin
Status
At V
CC
At V
SS
Full Array (2K)
Normal Read/Write Operations
Protect Array
Memory organization
·
HT24LC02, 2K Serial EEPROM Internally organized with 256 8-bit words, the 2K re­quires an 8-bit data word address for random word ad dressing.
Device operations
·
Clock and data transition Data transfer may be initiated only when the bus is not busy. During data transfer, the data line must remain stable whenever the clock line is high. Changes in data line while the clock line is high will be interpreted as a START or STOP condition.
·
Start condition A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (refer to Start and Stop Definition Timing diagram).
·
Stop condition A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (re fer to Start and Stop Definition Timing Diagram).
·
Acknowledge All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has re ceived each word. This happens during the ninth clock cycle.
D a t a a l l o w e d t o c h a n g e
S D A
S C L
S t a r t
c o n d i t i o n
A d d r e s s o r a c k n o w l e d g e v a l i d
Device addressing
The 2K EEPROM devices all require an 8-bit device ad dress word following a start condition to enable the chip for a read or write operation. The device address word consist of a mandatory one, zero sequence for the first four most significant bits (refer to the diagram showing the Device Address). This is common to all the EEPROM device.
The next three bits are the A2, A1 and A0 device ad­dress bits for the 2K EEPROM. These three bits must compare to their corresponding hard-wired input pins.
The 8th bit of device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low.
If the comparison of the device address succeed the EEPROM will output a zero at ACK bit. If not, the chip will return to a standby state.
-
1 0
D e v i c e A d d r e s s
Write operations
·
Byte write A write operation requires an 8-bit data word address following the device address word and acknowledg ment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. After receiving the 8-bit data word, the EEPROM will output a zero and the addressing de vice, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle to the non-volatile memory. All inputs are disabled during
-
this write cycle and EEPROM will not respond until the write is completed (refer to Byte write timing).
S t o p
c o n d i t i o n
R / W1 0 A 2 A 1 A 0
-
-
-
-
Rev. 1.10 4 November 5, 2002
·
Page write
The 2K EEPROM is capable of an 8-byte page write. A page write is initiated the same as byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges the receipt of the first data word, the microcontroller can transmit up to seven more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write se quence with a stop condition. The data word address lower three (2K) bits are inter nally incremented following the receipt of each data word. The higher data word address bits are not incre mented, retaining the memory page row location (re fer to Page write timing).
·
Acknowledge polling Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the stop condition for a write com mand has been issued from the master, the device ini tiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a start condition followed by the control byte for a write command (R/W=0). If the device is still busy with the write cycle, then no ACK will be returned. If the cycle is completed, then the device will return the ACK and the master can then proceed with the next read or write command.
·
Write protect
The HT24LC02 can be used as a serial ROM when the WP pin is connected to VCC. Programming will be inhibited and the entire memory will be write-protected.
B y t e w r i t e t i m i n g
HT24LC02
S e n d W r i t e C o m m a n d
S e n d S t o p C o n d i t i o n
t o I n i t i a t e W r i t e C y c l e
S e n d S t a r t
S e n d C o t r o l l B y t e
-
-
-
-
·
Read operations Read operations are initiated the same way as write
-
-
operations with the exception that the read/write se lect bit in the device address word is set to one. There are three read operations: current address read, ran dom address read and sequential read.
·
Current address read The internal data word address counter maintains the last address accessed during the last read or write op­eration, incremented by one. This address stays valid between operationsas long as the chip power is main­tained. The address roll over during read from the last byte of the last memory page to the first byte of the first page. The address roll over during write from the last byte of the current page to the first byte of the same page. Once the device address with the read/write se­lect bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is seri
w i t h R / W = 0
( A C K = 0 ) ?
N e x t O p e r a t i o n
N o
Y e s
Acknowledge polling flow
-
-
-
D e v i c e a d d r e s s W o r d a d d r e s s D A T A
S D A
S t a r t
A 1 A 0S P
A 2
R / W
A C K
A C K A C K
S t o p
P a g e w r i t e t i m i n g
D e v i c e a d d r e s s W o r d a d d r e s s D A T A n
S
S D A
S t a r t
A C K
A C K
D A T A n + 1 D A T A n + x
A C K
P
A C K
S t o p
C u r r e n t r e a d t i m i n g
D e v i c e a d d r e s s D A T A
S D A
S t a r t
A 1 A 0S P
A 2
A C K
Rev. 1.10 5 November 5, 2002
S t o p
N o A C K
ally clocked out. The microcontroller does not respond with an input zero but generates a following stop con dition (refer to Current read timing).
·
Random read A randomread requires a dummy byte write sequence to load in the data word address which is then clocked in and acknowledged by the EEPROM. The microcontroller must then generate another start con dition. The microcontroller now initiates a current ad dress read by sending a device address with the read/write select bit high. The EEPROM acknowl edges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generates a following stop condition (refer to Random read timing).
R a n d o m r e a d t i m i n g
HT24LC02
·
Sequential read
-
-
-
-
Sequential reads are initiated by either a current ad dress read or a random address read. After the microcontroller receives a data word, it responds with an acknowledgment. As long as the EEPROM receives an acknowledgment, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will roll over and the sequential read continues. The sequential read operation is terminated when the microcontroller does not respond with a zero but generates a following stop condition.
-
D e v i c e a d d r e s s W o r d a d d r e s s
S D A
S
S t a r t
A 2 A 1 A 0
S e q u e n t i a l r e a d t i m i n g
D e v i c e a d d r e s s D A T A n
S
S D A
S t a r t

Timing Diagrams

S C L
t
S U:S T A
t
S D A
S D A
O U T
S P
A C K
D A T A
t
S U:S T O
t
B U F
S t o p
P
N o A C K
P
A C K
S t o p
D e v i c e a d d r e s s
S
A C K
A C K
t
f
t
L O W
t
H D:S T A
t
A A
t
t
r
A C K
S t a r t
D A T A n + 1 D A T A n + x
A C K
H I G H
t
t
H D:D A T
V a l i d V a l i d
S U:D A T
S C L
S D A
Note:
8 t h b i t
W o r d n
A C K
The write cycle time t
t
W R
S t o p
C o n d i t i o n
is the time from a valid stop condition of a write sequence to the end of the valid start
WR
S t a r t
C o n d i t i o n
condition of sequential command.
Rev. 1.10 6 November 5, 2002

Package Information

8-pin DIP (300mil) outline dimensions
B
C
D
HT24LC02
A
8
5
4
1
H
G
E
F
=
I
Symbol
Min. Nom. Max.
A 355
B 240
C 125
D 125
E16
F50
G
¾
H 295
I 335
Dimensions in mil
¾
¾
¾
¾
¾
¾
100
¾
¾
a 0°¾15°
375
260
135
145
20
70
¾
315
375
Rev. 1.10 7 November 5, 2002
8-pin SOP (150mil) outline dimensions
5
8
A
1
B
4
C
HT24LC02
C '
D
E
F
Symbol
Min. Nom. Max.
A 228
B 149
C14
C¢
189
D53
E
¾
F4
G22
H4
G
H
=
Dimensions in mil
¾
¾
¾
¾
¾
50
¾
¾
¾
a 0°¾10°
244
157
20
197
69
¾
10
28
12
Rev. 1.10 8 November 5, 2002
8-pin TSSOP outline dimensions
HT24LC02
58
E 1
1 4
E
L 1
Dimensions in mm
¾
¾
¾
0.25
¾
¾
¾
¾
0.65
¾
¾
G
A
e
R 0 . 1 0
( 4 C O R N E R S )
Symbol
A 1.05
A1 0.05
A2 0.95
B
C 0.11
D 2.90
E 6.20
E1 4.30
e
L 0.50
L1 0.90
y
D
A 2
A 1
B
y
L
C
Min. Nom. Max.
¾
¾
¾¾
q 0°¾8°
1.20
0.15
1.05
¾
0.15
3.10
6.60
4.50
¾
0.70
1.10
0.10
Rev. 1.10 9 November 5, 2002

Product Tape and Reel Specifications

Reel dimensions
HT24LC02
T 2
A
B
T 1
D
SOP 8N
Symbol Description Dimensions in mm
A Reel Outer Diameter
B Reel Inner Diameter
C Spindle Hole Diameter
D Key Slit Width
T1 Space Between Flange
T2 Reel Thickness
330±1.0
62±1.5
13.0+0.5
2.0±0.15
12.8+0.3
18.2±0.2
C
-0.2
-0.2
TSSOP 8L
Symbol Description Dimensions in mm
A Reel Outer Diameter
B Reel Inner Diameter
C Spindle Hole Diameter
D Key Slit Width
T1 Space Between Flange
T2 Reel Thickness
330±1.0
62±1.5
13.0+0.5
-0.2
2.0±0.5
12.8+0.3
-0.2
18.2±0.2
Rev. 1.10 10 November 5, 2002
Carrier tape dimensions
HT24LC02
D
E
F
PD 1
P 1P 0
W
A 0
B 0
C
SOP 8N
Symbol Description Dimensions in mm
W Carrier Tape Width
P Cavity Pitch
E Perforation Position
F Cavity to Perforation (Width Direction)
D Perforation Diameter
12.0+0.3
8.0±0.1
1.75±0.1
5.5±0.1
1.55±0.1
D1 Cavity Hole Diameter 1.5+0.25
P0 Perforation Pitch
P1 Cavity to Perforation (Length Direction)
A0 Cavity Length
B0 Cavity Width
K0 Cavity Depth
t Carrier Tape Thickness
4.0±0.1
2.0±0.1
6.4±0.1
5.20±0.1
2.1±0.1
0.3±0.05
C Cover Tape Width 9.3
t
K 0
-0.1
TSSOP 8L
Symbol Description Dimensions in mm
W Carrier Tape Width
P Cavity Pitch
E Perforation Position
F Cavity to Perforation (Width Direction)
12.0+0.3
-0.1
8.0±0.1
1.75±0.1
5.5±0.5
D Perforation Diameter 1.5+0.1
D1 Cavity Hole Diameter 1.5+0.1
P0 Perforation Pitch
P1 Cavity to Perforation (Length Direction)
A0 Cavity Length
B0 Cavity Width
K0 Cavity Depth
t Carrier Tape Thickness
4.0±0.1
2.0±0.1
7.0±0.1
3.6±0.1
1.6±0.1
0.3±0.013
C Cover Tape Width 9.3
Rev. 1.10 11 November 5, 2002
HT24LC02
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science-based Industrial Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw
Holtek Semiconductor Inc. (Sales Office)
11F, No.576, Sec.7 Chung Hsiao E. Rd., Taipei, Taiwan Tel: 886-2-2782-9635 Fax: 886-2-2782-9636 Fax: 886-2-2782-7128 (International sales hotline)
Holtek Semiconductor (Shanghai) Inc.
7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn
Holtek Semiconductor (Hong Kong) Ltd.
RM.711, Tower 2, Cheung Sha Wan Plaza, 833 Cheung Sha Wan Rd., Kowloon, Hong Kong Tel: 852-2-745-8288 Fax: 852-2-742-8657
Holmate Semiconductor, Inc.
48531 Warm Springs Boulevard, Suite 413, Fremont, CA 94539 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com
Copyright Ó 2002 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
-
Rev. 1.10 12 November 5, 2002
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