Rainbow Electronics DS1342 User Manual

19-4998; Rev 0; 10/09
Typical Operating Circuit
Low-Current I2C RTCs for High-ESR Crystals
General Description
12.5pF crystal. These devices are accessed through an I2C serial interface. Other features include two time-of-day alarms, two interrupt outputs, a programmable square­wave output, and a serial bus timeout mechanism.
The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either 24hr or 12hr format with an AM/PM indicator.
The DS1341/DS1342 also include an input for synchroni­zation. When a reference clock (e.g., 60Hz power line or GPS 1PPS) is present at the CLKIN pin and the enable external clock input bit (ECLK) is set to 1, the DS1341/ DS1342 RTCs are frequency-locked to the external clock and the clock accuracy is determined by the external source. In case of external clock failure, the clock is switched to the crystal oscillator.
The devices are available in a lead(Pb)-free/RoHS­compliant, 8-pin FSOP package. The devices support a
-40NC to +85NC extended temperature range.
Applications
Medical
Point of Sale (POS)
Telematics
Portable Instruments
Portable Audio
Automotive
Features
S Low Timekeeping Current of 250nA (typ)
S Compatible with Crystal ESR Up to 80kI
S Use Crystals with C
= 6pF (DS1341) or
L
CL = 12.5pF (DS1342)
S +1.8V to +5.5V Operating Voltage Range
S Maintain Time Down to +1.15V (typ)
S Fast (400kHz) I
S Bus Timeout for Lockup-Free Operation
S RTC Counts Seconds, Minutes, Hours, Day, Date,
2
C Interface
Month, and Year with Leap Year Compensation Valid Through 2099
S External Clock Source for Synchronization Clock
Reference (e.g., 32kHz, 50Hz/60Hz Power Line, GPS 1PPS)
S Two Time-of-Day Alarms with Two Interrupt
Outputs
S Programmable Square-Wave Output
S Industrial Temperature Range
S Small, 8-Pin µSOP Package
Ordering Information
PART TEMP RANGE
DS1341U+
DS1341U+T&R DS1342U+* DS1342U+T&R*
+Denotes a lead(Pb)-free/RoHS-compliant package.
T&R = Tape and reel.
*Future product—contact factory for availability.
-40NC to +85NC 8 FSOP
-40NC to +85NC 8 FSOP
-40NC to +85NC 8 FSOP
-40NC to +85NC 8 FSOP
PIN­PACKAGE
OSC
CL (pF)
6 6
12.5
12.5
DS1341/DS1342
V
CC
R
R
R
PU
CPU
_______________________________________________________________ Maxim Integrated Products 1
PU
PU
V
CC
V
CC
SCL
SDA
CLKIN/INTA
SQW/INTBX1X2
DS1341/DS1342
GND
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Pin Configuration
TOP VIEW
+
1 8 V
X1
2 7 SQW/INTBX2
DS1341 DS1342
µSOP
CC
SCLCLKIN/INTA 3 6
SDAGND 4 5
Low-Current I2C RTCs for High-ESR Crystals
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground ....-0.3V to +6.0V
Operating Temperature Range .......................... -40NC to +85NC
Junction-to-Ambient Thermal
Resistance (BJA) (Note 1) ........................................ +221NC/W
Junction-to-Case Thermal
Resistance (BJC) (Note 1) ......................................... +39NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Junction Temperature Maximum .....................................+150NC
Storage Temperature Range ............................ -55NC to +125NC
Soldering Temperature .........................Refer to the IPC/JEDEC
J-STD-020 Specification.
DS1341/DS1342
DC ELECTRICAL CHARACTERISTICS
(VCC = +1.8V to +5.5V, TA = -40NC to +85NC, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range
Minimum Timekeeping Voltage V
Timekeeping Current: DS1341 CLKIN = GND or CLKIN = VCC (Note 4)
Logic 1 Input V
Logic 0 Input V
Input Leakage (SCL, CLKIN/INTA)
Output Leakage (CLKIN/INTA, SQW/INTB)
Output Logic 1 VOH = +1.0V (SQW /INTB)
Output Logic 0 VOL = +0.4V (SDA, CLKIN/INTA, SQW/INTB)
V
CCTMIN
I
V
CCT
CCT
I
I
I
OH
I
OL
CC
LI
O
Full operation (Note 3) 1.8 5.5 Timekeeping (Notes 3, 4) 1.3 5.5 TA = +25NC (Notes 3, 4) VCC = +3.0V, EGFIL = 0, DOSF = 1 220 500 VCC = +5.5V 250 600 VCC = +3.0V, EGFIL = 1, DOSF = 0 280 560 VCC = +5.5V 320 700
(Note 2)
IH
(Note 2) -0.3
IL
ECLK = 1, VIN = 0V to V
ECLK = A1IE = A2IE = 0 -1.0 +1.0
VCC R 1.8V, INTCN = 0 VCC R 1.3V, INTCN = 0
VCC R 1.8V
VCC R 1.3V (Note 5)
CC
0.7 x V
CC
-0.1 +0.1
-3.0 mA
-250
3.0 mA
250
1.15 1.3 V
VCC +
0.3
0.3 x V
CC
V
nA
V
V
FA
FA
FA
FA
2
Low-Current I2C RTCs for High-ESR Crystals
AC ELECTRICAL CHARACTERISTICS
(VCC = +1.8V to +5.5V, TA = -40NC to +85NC, unless otherwise noted.) (Note 2, Figure 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SCL Clock Frequency f
Bus Free Time Between a STOP and START Condition
Hold Time (Repeated) START Condition
Low Period of SCL Clock t High Period of SCL Clock t Data Hold Time t Data Setup Time t
Setup Time for a Repeated START Condition
Rise Time of Both SDA and SCL Signals
Fall Time for Both SDA and SCL Signals
Setup Time for STOP Condition t
Capacitive Load for Each Bus Line
I/O Capacitance C SCL Spike Suppression t Oscillator Stop Flag (OSF) Delay t Timeout Interval t
t
HD:STA
HD:DAT
SU:DAT
t
SU:STA
SU:STO
TIMEOUT
SCL
t
BUF
LOW
HIGH
t
t
C
I/O
SP
OSF
(Note 6) 400 kHz
(Note 7) 0.6
(Notes 8, 9) 0 0.9 (Note 10) 100 ns
(Note 11)
R
(Note 11)
F
(Note 11) 400 pF
B
(Note 12) 25 100 ms (Note 13) 25 35 ms
1.3
1.3
0.6
0.6
20 +
0.1C
20 +
0.1C
0.6
B
B
10 pF 30 ns
DS1341/DS1342
Fs
Fs
Fs Fs Fs
Fs
300 ns
300 ns
Fs
CRYSTAL PARAMETERS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Nominal Frequency f Series Resistance ESR 35 80
Load Capacitance C
Note 2: Limits at -40NC are guaranteed by design and not production tested. Note 3: Voltage referenced to ground. Note 4: Specified with I2C bus inactive. Oscillator operational, INTCN = 1, ECLK = 0. Note 5: Applies to CLKIN/INTA and SQW/INTB only. Note 6: The minimum SCL clock frequency is limited by the bus timeout feature, which resets the serial bus interface if SCL is
held low for t
Note 7: After this period, the first clock pulse is generated. Note 8: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V
nal) to bridge the undefined region of the falling edge of SCL.
Note 9: The maximum t Note 10: A fast-mode device can be used in a standard-mode system, but the requirement t
met. This is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line t 1250ns before the SCL line is released.
TIMEOUT
.
need only be met if the device does not stretch the low period (t
HD:DAT
O
DS1341 6
L
DS1342 12.5
SU:DAT
32.768 kHz
of the SCL sig-
IHMIN
) of the SCL signal.
LOW
R to 250ns must then be
RMAX
+ t
= 1000 + 250 =
SU:DAT
kI
pF
3
Low-Current I2C RTCs for High-ESR Crystals
Note 11: CB is the total capacitance of one bus line, including all connected devices, in pF. Note 12: The parameter t
range of 2.4V P VCC P V
Note 13: The DS1341/DS1342 can detect any single SCL clock held low longer than t
in reset state and can receive a new START condition when SCL is held low for at least t detects this condition, the SDA output is released. The oscillator must be running for this function to work.
SDA
t
DS1341/DS1342
SCL
NOTE: TIMING IS REFERENCED TO V
BUF
t
HD:STA
STOP START REPEATED
is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage
OSF
CCMAX
.
TIMEOUTMIN
. The devices’ I2C interface is
TIMEOUTMAX
ILMAX
t
LOW
AND V
IHMIN
t
F
t
t
R
t
HD:DAT
.
HIGH
t
SU:DAT
START
t
SU:STA
t
HD:STA
t
SP
. Once the device
t
SU:STO
Figure 1. Data Transfer on I2C Serial Bus
4
Low-Current I2C RTCs for High-ESR Crystals
Functional Diagram
V
CC
DS1341/DS1342
32.768kHz
8.192kHz
4.096kHz
/4 /32 EXTSYNC
CONTROL LOGIC
/2
128Hz OSC-1Hz
OSC-1Hz
EXT-1Hz
ALARM AND
CONTROL REGISTERS
CLOCK AND
CALENDAR REGISTERS
DIVIDER
MUX/
BUFFER
P
SQW/INTB
N
CLKIN/INTA
N
SCL
SDA
DS1341/DS1342
X1
X2
SERIAL BUS
INTERFACE AND
ADDRESS
N
REGISTER
Pin Description
PIN NAME FUNCTION
1 X1
2 X2
3
CLKIN/INTA
4 GND Ground
5 SDA
6 SCL Serial-Clock Input. SCL is used to synchronize data movement on the serial interface.
7
8 V
SQW/INTB
CC
Connections for a Standard 32.768kHz Quartz Crystal. The internal oscillator circuitry is designed for operation with a crystal having a specified load capacitance (CL) of 6pF (DS1341) or 12.5pF (DS1342).
Clock Input/Active-Low Interrupt Output. This I/O pin is used to output an alarm interrupt or accept an external clock input to drive the RTC counter. In the output mode, this is an open drain and requires an external pullup resistor. If not used, connect this pin to ground.
Serial-Data Input/Output. SDA is the input/output pin for the I2C serial interface. The SDA pin is open drain and requires an external pullup resistor.
Square-Wave/Active-Low Interrupt Output. This pin is used to output a programmable square wave or an alarm interrupt signal. This is a CMOS push-pull output and does not require an external pullup resistor. If not used, this pin can be left unconnected.
DC Power Input. This pin should be decoupled using a 0.01FF or 0.1FF capacitor.
5
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