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DS1342
User Manual
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Rainbow Electronics DS1342 User Manual

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19-4998; Rev 0; 10/09
Typical Operating Circuit
Low-Current I2C RTCs for High-ESR Crystals
General Description
12.5pF crystal. These devices are accessed through an I2C serial interface. Other features include two time-of-day alarms, two interrupt outputs, a programmable square­wave output, and a serial bus timeout mechanism.
The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either 24hr or 12hr format with an AM/PM indicator.
The DS1341/DS1342 also include an input for synchroni­zation. When a reference clock (e.g., 60Hz power line or GPS 1PPS) is present at the CLKIN pin and the enable external clock input bit (ECLK) is set to 1, the DS1341/ DS1342 RTCs are frequency-locked to the external clock and the clock accuracy is determined by the external source. In case of external clock failure, the clock is switched to the crystal oscillator.
The devices are available in a lead(Pb)-free/RoHS­compliant, 8-pin FSOP package. The devices support a
-40NC to +85NC extended temperature range.
Applications
Medical
Point of Sale (POS)
Telematics
Portable Instruments
Portable Audio
Automotive
Features
S Low Timekeeping Current of 250nA (typ)
S Compatible with Crystal ESR Up to 80kI
S Use Crystals with C
= 6pF (DS1341) or
L
CL = 12.5pF (DS1342)
S +1.8V to +5.5V Operating Voltage Range
S Maintain Time Down to +1.15V (typ)
S Fast (400kHz) I
S Bus Timeout for Lockup-Free Operation
S RTC Counts Seconds, Minutes, Hours, Day, Date,
2
C Interface
Month, and Year with Leap Year Compensation Valid Through 2099
S External Clock Source for Synchronization Clock
Reference (e.g., 32kHz, 50Hz/60Hz Power Line, GPS 1PPS)
S Two Time-of-Day Alarms with Two Interrupt
Outputs
S Programmable Square-Wave Output
S Industrial Temperature Range
S Small, 8-Pin µSOP Package
Ordering Information
PART TEMP RANGE
DS1341U+
DS1341U+T&R DS1342U+* DS1342U+T&R*
+Denotes a lead(Pb)-free/RoHS-compliant package.
T&R = Tape and reel.
*Future product—contact factory for availability.
-40NC to +85NC 8 FSOP
-40NC to +85NC 8 FSOP
-40NC to +85NC 8 FSOP
-40NC to +85NC 8 FSOP
PIN­PACKAGE
OSC
CL (pF)
6 6
12.5
12.5
DS1341/DS1342
V
CC
R
R
R
PU
CPU
_______________________________________________________________ Maxim Integrated Products 1
PU
PU
V
CC
V
CC
SCL
SDA
CLKIN/INTA
SQW/INTBX1X2
DS1341/DS1342
GND
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Pin Configuration
TOP VIEW
+
1 8 V
X1
2 7 SQW/INTBX2
DS1341 DS1342
µSOP
CC
SCLCLKIN/INTA 3 6
SDAGND 4 5
Low-Current I2C RTCs for High-ESR Crystals
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground ....-0.3V to +6.0V
Operating Temperature Range .......................... -40NC to +85NC
Junction-to-Ambient Thermal
Resistance (BJA) (Note 1) ........................................ +221NC/W
Junction-to-Case Thermal
Resistance (BJC) (Note 1) ......................................... +39NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Junction Temperature Maximum .....................................+150NC
Storage Temperature Range ............................ -55NC to +125NC
Soldering Temperature .........................Refer to the IPC/JEDEC
J-STD-020 Specification.
DS1341/DS1342
DC ELECTRICAL CHARACTERISTICS
(VCC = +1.8V to +5.5V, TA = -40NC to +85NC, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range
Minimum Timekeeping Voltage V
Timekeeping Current: DS1341 CLKIN = GND or CLKIN = VCC (Note 4)
Logic 1 Input V
Logic 0 Input V
Input Leakage (SCL, CLKIN/INTA)
Output Leakage (CLKIN/INTA, SQW/INTB)
Output Logic 1 VOH = +1.0V (SQW /INTB)
Output Logic 0 VOL = +0.4V (SDA, CLKIN/INTA, SQW/INTB)
V
CCTMIN
I
V
CCT
CCT
I
I
I
OH
I
OL
CC
LI
O
Full operation (Note 3) 1.8 5.5 Timekeeping (Notes 3, 4) 1.3 5.5 TA = +25NC (Notes 3, 4) VCC = +3.0V, EGFIL = 0, DOSF = 1 220 500 VCC = +5.5V 250 600 VCC = +3.0V, EGFIL = 1, DOSF = 0 280 560 VCC = +5.5V 320 700
(Note 2)
IH
(Note 2) -0.3
IL
ECLK = 1, VIN = 0V to V
ECLK = A1IE = A2IE = 0 -1.0 +1.0
VCC R 1.8V, INTCN = 0 VCC R 1.3V, INTCN = 0
VCC R 1.8V
VCC R 1.3V (Note 5)
CC
0.7 x V
CC
-0.1 +0.1
-3.0 mA
-250
3.0 mA
250
1.15 1.3 V
VCC +
0.3
0.3 x V
CC
V
nA
V
V
FA
FA
FA
FA
2
Low-Current I2C RTCs for High-ESR Crystals
AC ELECTRICAL CHARACTERISTICS
(VCC = +1.8V to +5.5V, TA = -40NC to +85NC, unless otherwise noted.) (Note 2, Figure 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SCL Clock Frequency f
Bus Free Time Between a STOP and START Condition
Hold Time (Repeated) START Condition
Low Period of SCL Clock t High Period of SCL Clock t Data Hold Time t Data Setup Time t
Setup Time for a Repeated START Condition
Rise Time of Both SDA and SCL Signals
Fall Time for Both SDA and SCL Signals
Setup Time for STOP Condition t
Capacitive Load for Each Bus Line
I/O Capacitance C SCL Spike Suppression t Oscillator Stop Flag (OSF) Delay t Timeout Interval t
t
HD:STA
HD:DAT
SU:DAT
t
SU:STA
SU:STO
TIMEOUT
SCL
t
BUF
LOW
HIGH
t
t
C
I/O
SP
OSF
(Note 6) 400 kHz
(Note 7) 0.6
(Notes 8, 9) 0 0.9 (Note 10) 100 ns
(Note 11)
R
(Note 11)
F
(Note 11) 400 pF
B
(Note 12) 25 100 ms (Note 13) 25 35 ms
1.3
1.3
0.6
0.6
20 +
0.1C
20 +
0.1C
0.6
B
B
10 pF 30 ns
DS1341/DS1342
Fs
Fs
Fs Fs Fs
Fs
300 ns
300 ns
Fs
CRYSTAL PARAMETERS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Nominal Frequency f Series Resistance ESR 35 80
Load Capacitance C
Note 2: Limits at -40NC are guaranteed by design and not production tested. Note 3: Voltage referenced to ground. Note 4: Specified with I2C bus inactive. Oscillator operational, INTCN = 1, ECLK = 0. Note 5: Applies to CLKIN/INTA and SQW/INTB only. Note 6: The minimum SCL clock frequency is limited by the bus timeout feature, which resets the serial bus interface if SCL is
held low for t
Note 7: After this period, the first clock pulse is generated. Note 8: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V
nal) to bridge the undefined region of the falling edge of SCL.
Note 9: The maximum t Note 10: A fast-mode device can be used in a standard-mode system, but the requirement t
met. This is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line t 1250ns before the SCL line is released.
TIMEOUT
.
need only be met if the device does not stretch the low period (t
HD:DAT
O
DS1341 6
L
DS1342 12.5
SU:DAT
32.768 kHz
of the SCL sig-
IHMIN
) of the SCL signal.
LOW
R to 250ns must then be
RMAX
+ t
= 1000 + 250 =
SU:DAT
kI
pF
3
Low-Current I2C RTCs for High-ESR Crystals
Note 11: CB is the total capacitance of one bus line, including all connected devices, in pF. Note 12: The parameter t
range of 2.4V P VCC P V
Note 13: The DS1341/DS1342 can detect any single SCL clock held low longer than t
in reset state and can receive a new START condition when SCL is held low for at least t detects this condition, the SDA output is released. The oscillator must be running for this function to work.
SDA
t
DS1341/DS1342
SCL
NOTE: TIMING IS REFERENCED TO V
BUF
t
HD:STA
STOP START REPEATED
is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage
OSF
CCMAX
.
TIMEOUTMIN
. The devices’ I2C interface is
TIMEOUTMAX
ILMAX
t
LOW
AND V
IHMIN
t
F
t
t
R
t
HD:DAT
.
HIGH
t
SU:DAT
START
t
SU:STA
t
HD:STA
t
SP
. Once the device
t
SU:STO
Figure 1. Data Transfer on I2C Serial Bus
4
Low-Current I2C RTCs for High-ESR Crystals
Functional Diagram
V
CC
DS1341/DS1342
32.768kHz
8.192kHz
4.096kHz
/4 /32 EXTSYNC
CONTROL LOGIC
/2
128Hz OSC-1Hz
OSC-1Hz
EXT-1Hz
ALARM AND
CONTROL REGISTERS
CLOCK AND
CALENDAR REGISTERS
DIVIDER
MUX/
BUFFER
P
SQW/INTB
N
CLKIN/INTA
N
SCL
SDA
DS1341/DS1342
X1
X2
SERIAL BUS
INTERFACE AND
ADDRESS
N
REGISTER
Pin Description
PIN NAME FUNCTION
1 X1
2 X2
3
CLKIN/INTA
4 GND Ground
5 SDA
6 SCL Serial-Clock Input. SCL is used to synchronize data movement on the serial interface.
7
8 V
SQW/INTB
CC
Connections for a Standard 32.768kHz Quartz Crystal. The internal oscillator circuitry is designed for operation with a crystal having a specified load capacitance (CL) of 6pF (DS1341) or 12.5pF (DS1342).
Clock Input/Active-Low Interrupt Output. This I/O pin is used to output an alarm interrupt or accept an external clock input to drive the RTC counter. In the output mode, this is an open drain and requires an external pullup resistor. If not used, connect this pin to ground.
Serial-Data Input/Output. SDA is the input/output pin for the I2C serial interface. The SDA pin is open drain and requires an external pullup resistor.
Square-Wave/Active-Low Interrupt Output. This pin is used to output a programmable square wave or an alarm interrupt signal. This is a CMOS push-pull output and does not require an external pullup resistor. If not used, this pin can be left unconnected.
DC Power Input. This pin should be decoupled using a 0.01FF or 0.1FF capacitor.
5
Low-Current I2C RTCs for High-ESR Crystals
Detailed Description
The DS1341/DS1342 low-current RTCs are timekeeping devices that consume an extremely low timekeeping cur­rent, which permits longer life from a power supply. The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year through
The DS1341/DS1342 use an external 32.768kHz crys­tal. The oscillator circuit does not require any external resistors or capacitors to operate. The devices support
DS1341/DS1342
a high-ESR crystal, which broadens the pool of usable crystals for the device. The DS1342 uses a 12.5pF crys­tal. The DS1341 uses a 6pF crystal, which decreases oscillator current draw, but is less commonly available than the 12.5pF crystals.
When the external clock is lost or when the frequency differs more than Q0.8% from the crystal frequency, the signal derived from the crystal oscillator drives the RTC counter.
When ECLK is set to 0, the RTC counter is always driven with the signal derived from the crystal oscillator. When the EOSC bit is a 1 and the external clock source is selected, the RTC counter is always clocked by the sig­nal from the CLKIN pin.
Address and data are transferred serially through an I2C serial interface. Other features include two time-of-day alarms, two interrupts, a programmable square-wave output, and a bus timeout mechanism that resets the I2C bus if it remains inactive for a minimum of t
TIMEOUT
The DS1341/DS1342 are available in a lead(Pb)-free/ RoHS-compliant, 8-pin FSOP package. Both devices support a -40NC to +85NC extended temperature range.
Oscillator Circuit
The DS1341/DS1342 use an external 32.768kHz crys­tal. The oscillator circuit does not require any external resistors or capacitors to operate. The DS1341 includes integrated capacitive loading for a 6pF CL crystal, and the DS1342 includes integrated capacitive loading for a
12.5pF CL crystal. See the Crystal Parameters table for the external crystal parameters. The Functional Diagram shows a simplified schematic of the oscillator circuit. The startup time is usually less than 1 second when using a crystal with the specified characteristics.
Clock Accuracy
When running from the internal oscillator, the accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match between the capacitive load of the oscillator circuit and the capacitive load for which the crystal was trimmed. Additional error is added by crystal frequency drift caused by temperature shifts. External circuit noise coupled into the oscillator circuit can result in the clock running fast. Figure 2 shows a typical PCB layout for isolation of the crystal and oscil­lator from noise. Refer to Application Note 58: Crystal Considerations with Dallas Real-Time Clocks for detailed information.
LOCAL GROUND PLANE (LAYER 2)
X1
CRYSTAL
X2
GND
.
NOTE: AVOID ROUTING SIGNALS IN THE CROSSHATCHED AREA (UPPER LEFT-HAND QUADRANT) OF THE PACKAGE UNLESS THERE IS A GROUND PLANE BETWEEN THE SIGNAL LINE AND THE PACKAGE.
Figure 2. Layout Example
6
Low-Current I2C RTCs for High-ESR Crystals
External Synchronization
As shown in the Functional Diagram, the three high­est frequencies driving the SQW/INTB pin are derived from the uncorrected oscillator, while the 1Hz output is derived from the adjusted Osc-1Hz signal.
Conceptually, the circuit can be thought of as two 1Hz signals, one derived from the internal oscillator and the other derived from the external reference clock, with the oscillator-derived 1Hz signal being locked to the 1Hz signal derived from the external reference clock. The edges of the 1Hz signals do not need to be aligned with
OSC-1Hz
FROM OSCILLATOR
DS1341/DS1342
and within tolerance, the Ext-1Hz and Osc-1Hz maintain their existing lock, regardless of their edge alignment, with periodic correction of the Osc-1Hz signal. If the external signal is lost and then regained sometime later, the signals relock with whatever new alignment exists (see Figure 3).
The Ext-1Hz is used by the device as long as it is within tolerance, which is about 0.8% of Osc-1Hz. While Ext­1Hz is within tolerance, the skew between the two sig­nals could shift until a change of approximately 7.8ms accumulates, after which the Osc-1Hz signal is adjusted (see Figure 4). The adjustment is accomplished by digi­tally adjusting the 32kHz oscillator divider chain.
SKEW SKEW
FROM EXTERNAL REFERENCE
Figure 3. Loss and Reacquisition of External Reference Clock
FROM EXTERNAL REFERENCE
EXT-1Hz
BREAK IN EXTERNAL REFERENCE SIGNAL
OSC-1Hz
FROM OSCILLATOR
CURRENT LOCK SHIFTED BACK TO CURRENT LOCKDRIFT AFTER N CYCLES
EXT-1Hz
Figure 4. Drift and Adjustment of Internal 1Hz to External Reference Clock
7
Low-Current I2C RTCs for High-ESR Crystals
Register Map
Table 1 shows the map for the DS1341/DS1342 regis­ters. During a multibyte access, if the address pointer reaches the end of the register space (0Fh), it wraps around to location 00h. On either an I2C START or address pointer incrementing to location 00h, the current time is transferred to a second set of registers. The time information is read from these secondary registers while the clock continues to run. This eliminates the need to reread the registers in case the main registers update during a read.
Table 1. Register Map
DS1341/DS1342
ADDRESS BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 FUNCTION RANGE
00h 0 10 Seconds Seconds Seconds 00–59 01h 0 10 Minutes Minutes Minutes 00–59
02h 0
03h 0 0 0 0 0 Day Day 1–7 04h 0 0 10 Date Date Date 01–31
05h CENT 0 0 10 MO Month
06h 10 Year Year Year 00–99
07h A1M1 10 Seconds Seconds
08h A1M2 10 Minutes Minutes
09h A1M3
0Ah A1M4
0Bh A2M2 10 Minutes Minutes
0Ch A2M3
0Dh A2M4
0Eh
0Fh OSF DOSF LOS CLKSEL2 CLKSEL1 ECLK A2F A1F
Note: Bits listed as 0 always read back as 0 and cannot be written to a 1.
EOSC
12/24
12/24
DY/DT
12/24
DY/DT
AM/PM
10hr
AM/PM
10hr
AM/PM
10hr
0 EGFIL RS2 RS1 INTCN A2IE A1IE Control —
10hr Hour Hours
10hr Hour
10 Date
10hr Hour
10 Date
The I2C interface is guaranteed to operate when VCC is between 1.8V and 5.5V and the EOSC bit is 0. The I2C interface is accessible whenever VCC is at a valid level. To prevent invalid device operation, the I2C interface should not be accessed when VCC is below +1.8V.
If a microcontroller connected to the DS1341/DS1342 resets during I2C communications, it is possible that the microcontroller and the DS1341/DS1342 could become unsynchronized. When the microcontroller resets, the DS1341/DS1342 I2C interface can be placed into a
Month/
Century
Alarm 1
Seconds
Alarm 1 Minutes
Alarm 1
Hours
Day, Date
Day, Date
Alarm 1 Day, Alarm 1 Date
Alarm 2 Minutes
Alarm 2
Hours
Alarm 2 Day, Alarm 2 Date
Control/
Status
I2C Interface
1–12+AM/PM
01–12 + Century
1–12 + AM/PM
1–12 + AM/PM
00–23
00–59
00–59
00–23
1–7
1–31
00–59
00–23
1–7
1–31
—
8
Low-Current I2C RTCs for High-ESR Crystals
known state by holding SCL low for t limits the minimum frequency at which the I2C interface can be operated. If data is being written to the device when the interface timeout is exceeded, prior to the acknowledge, the incomplete byte of data is not written.
TIMEOUT
. Doing so
Clock and Calendar (00h–06h)
The time and calendar information is obtained by read­ing the appropriate register bytes. The RTC registers are illustrated in Table 1. The time and calendar are set or initialized by writing the appropriate register bytes. The contents of the time and calendar registers are in the binary-coded decimal (BCD) format. The Day register increments at midnight and rolls over from 7 to 1. Values that correspond to the day-of-week are user-defined but must be sequential (i.e., if 1 equals Sunday, then 2 equals Monday, and so on). The CENT bit in the Month register toggles when the Years register rolls over from 99 to 00. Illogical time and date entries result in an unde­fined operation.
second bit of the 10hr field. The century bit (bit 7 of the
DS1341/DS1342
Month register) is toggled when the Years register incre­ments from 99 to 00. On a power-on reset (POR), the time and date are set to 00:00:00 00/01/01 and the Day register is set to 01.
Alarms (07h–0Dh)
The DS1341/DS1342 contain two time-of-day/date alarms. Alarm 1 can be set by writing to registers 07h– 0Ah. Alarm 2 can be set by writing to registers 0Bh–0Dh. The alarms can be programmed to activate the CLKIN/ INTA or SQW/INTB outputs (see Table 5) on an alarm match condition. Bit 7 of each of the time of day/date alarm registers are mask bits. When all the mask bits for each alarm are 0, an alarm only occurs when the values in the timekeeping registers 00h–06h match the values stored in the time of day/date alarm registers. The alarms can also be programmed to repeat every second, min­ute, hour, day, or date. Tables 2 and 3 show the possible alarm settings. Configurations not listed in the tables result in illogical operation. POR values are undefined.
The DY/DT bits (bit 6 of the alarm day/date registers) control whether the alarm value stored in bits 0 to 5 of that register reflects the day of the week or the date of the month. If DY/DT is written to 0, the alarm is the result
Table 2. Alarm 1 Mask Bits
DY/DT
X 1 1 1 1 Alarm once per second. X 1 1 1 0 Alarm when seconds match. X 1 1 0 0 Alarm when minutes and seconds match. X 1 0 0 0 Alarm when hours, minutes, and seconds match. 0 0 0 0 0 Alarm when date, hours, minutes, and seconds match. 1 0 0 0 0 Alarm when day, hours, minutes, and seconds match.
X = Don’t care.
ALARM 1 MASK BITS (BIT 7)
A1M4 A1M3 A1M2 A1M1
ALARM RATE
Table 3. Alarm 2 Mask Bits
DY/DT
X 1 1 1 Alarm once per minute (00 second of every minute). X 1 1 0 Alarm when minutes match. X 1 0 0 Alarm when hours and minutes match. 0 0 0 0 Alarm when date, hours, and minutes match. 1 0 0 0 Alarm when day, hours, and minutes match.
X = Don’t care.
ALARM 2 MASK BITS (BIT 7)
A2M4 A2M3 A2M2
ALARM RATE
9
Low-Current I2C RTCs for High-ESR Crystals
of a match with date of the month. If DY/DT is written to 1, the alarm is the result of a match with day of the week.
When the RTC register values match alarm register set­tings, the corresponding alarm flag bit (A1F or A2F) is set to 1 in the Control/Status register. If the correspond­ing alarm interrupt enable bit (A1IE or A2IE) is also set to 1 in the Control register, the alarm condition activates the output(s) defined by the ECLK and INTCN bits (see Table 5).
Control Register (0Eh)
Bit 7: Enable Oscillator (EOSC). When the EOSC bit is 0, the oscillator is enabled. When this bit is a 1, the oscillator is disabled. This bit is cleared (0) when power
DS1341/DS1342
is first applied.
Bit 6: No Function
Bit 5: Enable Glitch Filter (EGFIL). When the EGFIL bit
is 1, the 5Fs glitch filter at the output of the crystal oscil­lator is enabled. The glitch filter is disabled when this bit is 0. Disabling the glitch filter is useful in reducing power consumption. This bit is cleared (0) when power is first applied.
Bits 4 and 3: Rate Select (RS[2:1]). These bits con­trol the frequency of the square-wave output when the square wave has been enabled. Table 4 shows the square-wave frequencies that can be selected with the RS bits. These bits are both set to 1 (32.768kHz) when power is first applied.
The 32.768kHz oscillator is the source of all square-wave output frequencies. Frequencies above 1Hz are not con­ditioned by CLKIN. The 1Hz output is the 32.768kHz oscil­lator frequency, divided down to 1Hz and conditioned by CLKIN, provided that the CLKIN frequency differs by no more than Q0.8% from the crystal frequency. Cycle-to­cycle jitter of the 1Hz square wave can be up to 2ms.
Bit 2: Interrupt Control (INTCN). This bit controls the relationship between the two alarms and the interrupt output pins. When the INTCN bit is 0, a square wave is output on the SQW/INTB pin, and the state of the ECLK bit determines the function of the CLKIN/INTA pin (see Table 5). When the INTCN bit is 1 and the ECLK bit is a 0, a match between the timekeeping registers and the alarm 1 registers activates the CLKIN/INTA pin (provided that the alarm is enabled) and a match between the timekeeping registers and the alarm 2 registers activates the SQW/INTB pin (provided that the alarm is enabled). When the INTCN bit is 1 and the ECLK bit is a 1, a match between the timekeeping registers and the alarm 1 registers or a match between the timekeeping registers and the alarm 2 registers activates the SQW/INTB pin (provided that the alarm is enabled). This bit is cleared (0) when power is first applied.
Bit 1: Alarm 2 Interrupt Enable (A2IE). When the A2IE bit is 0, the alarm 2 interrupt function is disabled. When the A2IE bit is 1, the alarm 2 interrupt function is enabled and is routed to an output, based upon the steering defined by the INTCN and ECLK bits, as noted in Table
5. Regardless of the state of A2IE, a match between the timekeeping registers and the alarm 2 registers (0Bh–0Dh) sets the alarm 2 flag bit (A2F). This bit is cleared (0) when power is first applied.
Bit 0: Alarm 1 Interrupt Enable (A1IE). When the A1IE bit is 0, the alarm 1 interrupt function is disabled. When the A1IE bit is 1, the alarm 1 interrupt function is enabled and is routed to an output, based upon the steering defined by the INTCN and ECLK bits, as noted in Table
5. Regardless of the state of A1IE, a match between the timekeeping registers and the alarm 1 registers (07h– 0Ah) sets the alarm 1 flag bit (A1F). This bit is cleared (0) when power is first applied.
Control Register Bitmap (0Eh)
BIT 7
EOSC
0 0 0 1 1 0 0 0
BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
0 EGFIL RS2 RS1 INTCN A2IE A1IE
Table 4. SQW/INTB Output Settings Table 5. Interrupt Output Routing
RS2 RS1
0 0 1Hz 0 1 4.098kHz 1 0 8.192kHz 1 1 32.768kHz
10
SQW/INTB
INTCN ECLK
0 0 A1F + A2F SQW 0 1 CLKIN Input SQW 1 0 A1F A2F 1 1 CLKIN Input A1F + A2F
CLKIN/INTA SQW/INTB
Low-Current I2C RTCs for High-ESR Crystals
Control/Status Register Bitmap (0Fh)
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
OSF DOSF LOS CLKSEL2 CLKSEL1 ECLK A2F A1F
1 0 1 0 0 0 X X
Control/Status Register (0Fh)
Bit 7: Oscillator Stop Flag (OSF). If the OSF bit is a 1, that indicates the oscillator has stopped or was stopped for some period of time, and could be used to judge the validity of the clock and calendar data. This bit is edge triggered and is set to 1 when the internal circuitry senses the oscillator has transitioned from a normal run state to a STOP condition. The following are examples of conditions that can cause the OSF bit to be set:
1) Power is applied for the first time.
2) The voltage present on VCC is insufficient to support oscillation.
3) The EOSC bit is turned off.
4) There are external influences on the crystal (e.g., noise, leakage, etc.).
This bit remains at 1 until written to 0. Attempting to write OSF to 1 leaves the value unchanged.
Bit 6: Disable Oscillator Stop Flag (DOSF). This bit, when set to 1, disables the sensing of the oscillator conditions that would set the OSF bit. OSF remains at 0 regardless of what happens to the oscillator. This bit is cleared (0) when power is first applied. Disabling the oscillator sensing is useful in reducing power consumption.
Bit 5: Loss of Signal (LOS). This status bit indicates the state of the CLKIN pin. The bit is set to 1 when the RTC counter is no longer conditioned by the external clock. This happens when ECLK = 0, or when the clock signal at CLKIN stops toggling, or when the CLKIN frequency differs more than Q0.8% from the selected input fre­quency. This bit remains at 1 until written to 0. Attempting to write LOS to 1 leaves the value unchanged. Clearing the LOS flag when the CLKIN frequency is invalid inhibits subsequent detections of the input frequency deviation.
Bits 4 and 3: Select Clock Source (CLKSEL[2:1]). These two register bits select the clock source to drive the RTC counter. Table 6 lists the input frequencies that can be selected. Upon power-up, the bits are cleared to 0 and the 1Hz rate is selected.
Table 6. Input Frequency Options
CLKSEL2 CLKSEL1
0 0 1Hz Input 0 1 50Hz Input 1 0 60Hz Input 1 1 32.768kHz Input
Bit 2: Enable External Clock Input (ECLK). This bit controls the direction of the CLKIN/INTA pin (see Table
5). When the ECLK bit is 1, the CLKIN/INTA pin is an input, with the expected input rate defined by the state of CLKSEL2 and CLKSEL1 (see Table 6).
When the ECLK bit is 0, the CLKIN/INTA pin is an interrupt output (see Table 5). If the INTCN bit is 0, CLKIN/INTA contains the status of A1F (provided that the A1IE bit is 1) or A2F (provided that the A2IE bit is 1). If the INTCN bit is 1, CLKIN/INTA contains the status of A1F (provided that the A1IE bit is 1).
This bit is set to 0 when power is first applied.
Bit 1: Alarm 2 Flag (A2F). A 1 in the alarm 2 flag bit indicates that the time matched the alarm 2 registers. This flag can be used to generate an interrupt on either CLKIN/INTA or SQW/INTB depending on the status of the INTCN bit in the Control register. If the INTCN bit is set to 0 and A2F bit is a 1 (and A2IE bit is also 1), the CLKIN/INTA pin goes low. If the INTCN bit is set to 1 and A2F bit is 1 (and A2IE bit is also 1), the SQW/INTB pin goes low. The A2F bit is cleared when written to 0. This bit can only be written to 0. Attempting to write this bit to 1 leaves the value unchanged.
Bit 0: Alarm 1 Flag (A1F). A 1 in the alarm 1 flag bit indicates that the time matched the alarm 1 registers. If the A1IE bit is also 1, the CLKIN/INTA pin goes low. A1F is cleared when written to 0. This bit can only be written to 0. Attempting to write this bit to 1 leaves the value unchanged.
DS1341/DS1342
CLKIN/INTA
11
Low-Current I2C RTCs for High-ESR Crystals
I2C Serial Port Operation
I2C Slave Address
The DS1341/DS1342s’ slave address byte is D0h. The first byte sent to the device includes the device identifier, device address, and the R/W bit (Figure 5). The device address sent by the I2C master must match the address assigned to the device.
I2C Definitions
The following terminology is commonly used to describe I2C data transfers.
Master Device: The master device controls the slave devices on the bus. The master device generates
DS1341/DS1342
SCL clock pulses and START and STOP conditions.
Slave Devices: Slave devices send and receive data at the master’s request.
Bus Idle or Not Busy: Time between STOP and START conditions when both SDA and SCL are inactive and in their logic-high states. When the bus is idle, it often initiates a low-power mode for slave devices.
START Condition: A START condition is generated by the master to initiate a new data transfer with a slave. Transitioning SDA from high to low while SCL remains high generates a START condition. See Figure 1 for applicable timing.
STOP Condition: A STOP condition is generated by the master to end a data transfer with a slave. Transitioning SDA from low to high while SCL remains high generates a STOP condition. See Figure 1 for applicable timing.
Repeated START Condition: The master can use a repeated START condition at the end of one data transfer to indicate that it immediately initiates a new data transfer following the current one. Repeated STARTs are commonly used during read operations to identify a specific memory address to begin a data transfer. A repeated START condition is issued iden­tically to a normal START condition. See Figure 1 for applicable timing.
MSB
1 1 10 R/W000
DEVICE
IDENTIFIER
Figure 5. Slave Address Byte
DEVICE
ADDRESS
LSB
READ/
WRITE BIT
Bit Write: Transitions of SDA must occur during the low state of SCL. The data on SDA must remain valid and unchanged during the entire high pulse of SCL plus the setup and hold time requirements (see Figure 1). Data is shifted into the device during the rising edge of the SCL.
Bit Read: At the end of a write operation, the master must release the SDA bus line for the proper amount of setup time (see Figure 1) before the next rising edge of SCL during a bit read. The device shifts out each bit of data on SDA at the falling edge of the previous SCL pulse and the data bit is valid at the rising edge of the current SCL pulse. Remember that the master generates all SCL clock pulses including when it is reading bits from the slave.
Acknowledge (ACK and NACK): An acknowledge (ACK) or not acknowledge (NACK) is always the ninth bit transmitted during a byte transfer. The device receiving data (the master during a read or the slave during a write operation) performs an ACK by transmitting a 0 during the ninth bit. A device per­forms a NACK by transmitting a 1 during the ninth bit. Timing for the ACK and NACK is identical to all other bit writes. An ACK is the acknowledgment that the device is properly receiving data. A NACK is used to terminate a read sequence or as an indication that the device is not receiving data.
Byte Write: A byte write consists of 8 bits of informa­tion transferred from the master to the slave (most significant bit first) plus a 1-bit acknowledgment from the slave to the master. The 8 bits transmitted by the master are done according to the bit write definition and the acknowledgment is read using the bit read definition.
Byte Read: A byte read is an 8-bit information transfer from the slave to the master plus a 1-bit ACK or NACK from the master to the slave. The 8 bits of information that are transferred (most significant bit first) from the slave to the master are read by the master using the bit read definition, and the master transmits an ACK using the bit write definition to receive additional data bytes. The master must NACK the last byte read to terminate communication so the slave returns control of SDA to the master.
Slave Address Byte: Each slave on the I2C bus responds to a slave address byte sent immediately following a START condition. The slave address byte contains the slave address in the most significant 7 bits and the R/W bit in the least significant bit. The
12
Low-Current I2C RTCs for High-ESR Crystals
2
C WRITE TRANSACTION
TYPICAL I
MSB LSB MSB LSB MSB LSB
START
1 1 0 1 0 0 0
R/W
SLAVE
b7 b6 b5 b4 b3 b2 b1 b0
ACK
SLAVE
b7 b6 b5 b4 b3 b2 b1 b0
ACK
SLAVE
ACK
DS1341/DS1342
STOP
READ/ WRITE
D0h 0Eh
1 1 0 1 0 0 0 0 0 0 0 0 1 1 1 0
SLAVE
ACK
D0h
SLAVE
ACK
D0h 04h
SLAVE
ACK
D0h 0Ch
SLAVE
ACK
0Eh
2
EXAMPLE I
C TRANSACTIONS
A)
SINGLE BYTE WRITE
-WRITE CONTROL REGISTER TO 18h
B)
SINGLE BYTE READ
-READ CONTROL REGISTER
C)
MULTIBYTE WRITE
-WRITE DATE REGISTER TO "02" AND MONTH REGISTER TO "11"
D)
MULTIBYTE READ
-READ ALARM 2 HOURS AND DATE VALUES
SLAVE
ADDRESS
START
START
START 1 1 0 1 0 0 0 0 0 0 0 0 0 1 0 0
START 1 1 0 1 0 0 0 0 0 0 0 0 1 1 0 0
Figure 6. I2C Transactions
DS1341/DS1342s’ slave address is D0h and cannot be modified by the user. When the R/W bit is 0 (such as in D0h), the master is indicating it writes data to the slave. If R/W = 1 (D1h in this case), the master is indi­cating it wants to read from the slave. If an incorrect slave address is written, the DS1341/DS1342 assume the master is communicating with another I2C device and ignore the communication until the next START condition is sent.
Memory Address: During an I2C write operation, the master must transmit a memory address to identify the memory location where the slave is to store the data. The memory address is always the second byte transmitted during a write operation following the slave address byte.
I2C Communication
See Figure 6 for an I2C communication example.
Writing a Single Byte to a Slave: The master must generate a START condition, write the slave address byte (R/W = 0), write the memory address, write the byte of data, and generate a STOP condition. Remember the master must read the slave’s acknowl­edgment during all byte write operations.
REGISTER ADDRESS
SLAVE
0 0 0 1 1 0 0 0
ACK
SLAVE
ACK
SLAVE
0 0 0 0 0 0 1 0
ACK
SLAVE
ACK
DATA
18h
SLAVE
STOP
ACK
REPEATED
START
02h
REPEATED
START
D1h
D1h
SLAVE
ACK
11h
0 0 0 1 0 0 0 1
SLAVE
ACK
1 1 0 1 0 0 0 1
SLAVE
ACK
1 1 0 1 0 0 0 1 VALUE
DATA
VALUE
SLAVE
ACK
DATA
MASTER
NACK
STOP
MASTER
STOP1 1 0 1 0 0 0 0 0 0 0 0 1 1 1 0
DATA
ACK
Writing Multiple Bytes to a Slave: To write multiple bytes to a slave, the master generates a START con­dition, writes the slave address byte (R/W = 0), writes the starting memory address, writes multiple data bytes, and generates a STOP condition.
Reading a Single Byte from a Slave: Unlike the write operation that uses the specified memory address byte to define where the data is to be written, the read operation occurs at the present value of the memory address counter. To read a single byte from the slave, the master generates a START condition, writes the slave address byte with R/W = 1, reads the data byte with a NACK to indicate the end of the transfer, and generates a STOP condition. However, since requir­ing the master to keep track of the memory address counter is impractical, use the method for manipulat­ing the address counter for reads.
Manipulating the Address Counter for Reads: A dummy write cycle can be used to force the address counter to a particular value. To do this the mas­ter generates a START condition, writes the slave address byte (R/W = 0), writes the memory address where it desires to read, generates a repeated START condition, writes the slave address byte (R/W = 1),
MASTER
NACK
STOPVALUE
13
Low-Current I2C RTCs for High-ESR Crystals
reads data with ACK or NACK as applicable, and generates a STOP condition. See Figure 6 for a read example using the repeated START condition to specify the starting memory location.
Reading Multiple Bytes from a Slave: The read operation can be used to read multiple bytes with a single transfer. When reading bytes from the slave, the master simply ACKs the data byte if it desires to read another byte before terminating the transaction. After the master reads the last byte it must NACK to indicate the end of the transfer and then it generates a STOP condition.
Bus Timeout
DS1341/DS1342
To avoid an unintended I2C interface timeout, SCL should not be held low longer than t I2C interface is in the reset state and can receive a new START condition when SCL is held low for at least t
TIMEOUTMAX
SDA is released and allowed to be pulled high by the external pullup resistor. For the timeout function to work, the oscillator must be enabled and running.
. When the device detects this condition,
TIMEOUTMIN
. The
Applications Information
Power-Supply Decoupling
To achieve the best results when using the DS1341/ DS1342, decouple the VCC power supply with a 0.01FF and/or 0.1FF capacitor. Use a high-quality, ceramic, sur­face-mount capacitor if possible. Surface-mount compo-
nents minimize lead inductance, which improves perfor­mance, and ceramic capacitors tend to have adequate high-frequency response for decoupling applications.
Using Open-Drain Outputs
The CLKIN/INTA output is open drain and, therefore, requires an external pullup resistor to realize a logic-high output level.
SDA and SCL Pullup Resistors
SDA is an open-drain output and requires an external pullup resistor to realize a logic-high level.
Because the DS1341/DS1342 do not use clock cycle stretching, a master using either an open-drain output with a pullup resistor or CMOS output driver (push-pull) could be used for SCL.
Chip Information
SUBSTRATE CONNECTED TO GROUND
Package Information
For the latest package outline information and land pat­terns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suf­fix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
8 FSOP
U8+1
21-0036
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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©
2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
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